15th week of 2019 patent applcation highlights part 45 |
Patent application number | Title | Published |
20190109088 | LOGIC CELL, SEMICONDUCTOR DEVICE INCLUDING LOGIC CELL, AND METHOD OF MANUFACTURING THE LOGIC CELL AND SEMICONDUCTOR DEVICE | 2019-04-11 |
20190109089 | FUSE STRUCTURE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | 2019-04-11 |
20190109090 | INTERCONNECTION STRUCTURE LINED BY ISOLATION LAYER | 2019-04-11 |
20190109091 | COMPONENT-EMBEDDED SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND HIGH-FREQUENCY MODULE | 2019-04-11 |
20190109092 | POSITIONING STRUCTURE HAVING POSITIONING UNIT | 2019-04-11 |
20190109093 | INDUSTRIAL CHIP SCALE PACKAGE FOR MICROELECTRONIC DEVICE | 2019-04-11 |
20190109094 | PACKAGE SUBSTRATE PROCESSING METHOD AND PROTECTIVE TAPE | 2019-04-11 |
20190109095 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2019-04-11 |
20190109096 | Semiconductor Device With shield for Electromagnetic interference | 2019-04-11 |
20190109097 | SEMICONDUCTOR DEVICE WITH SUPERIOR CRACK RESISTIVITY IN THE METALLIZATION SYSTEM | 2019-04-11 |
20190109098 | Semiconductor Device Structure Comprising a Plurality of Metal Oxide Fibers and Method for Forming the Same | 2019-04-11 |
20190109099 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, INTEGRATED SUBSTRATE, AND ELECTRONIC DEVICE | 2019-04-11 |
20190109100 | METHOD FOR DETECTING A DIFFERENTIAL FAULT ANALYSIS ATTACK AND A THINNING OF THE SUBSTRATE IN AN INTEGRATED CIRCUIT, AND ASSOCIATED INTEGRATED CIRCUIT | 2019-04-11 |
20190109101 | Method and Apparatus for Heat Sinking High Frequency IC with Absorbing Material | 2019-04-11 |
20190109102 | TRANSISTOR OUTLINE HOUSING WITH HIGH RETURN LOSS | 2019-04-11 |
20190109103 | Method of Forming a Semiconductor Package and Semiconductor Package | 2019-04-11 |
20190109104 | ELECTRONIC DEVICE HAVING COATED CONTACT PADS | 2019-04-11 |
20190109105 | STRUCTURE AND METHOD FOR SEMICONDUCTOR PACKAGING | 2019-04-11 |
20190109106 | SEMICONDUCTOR COPPER METALLIZATION STRUCTURE AND RELATED METHODS | 2019-04-11 |
20190109107 | METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER | 2019-04-11 |
20190109108 | EXPANDED HEAD PILLAR FOR BUMP BONDS | 2019-04-11 |
20190109109 | MULTILAYERS OF NICKEL ALLOYS AS DIFFUSION BARRIER LAYERS | 2019-04-11 |
20190109110 | Shaped Interconnect Bumps in Semiconductor Devices | 2019-04-11 |
20190109111 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF | 2019-04-11 |
20190109112 | Semiconductor Die Attach System and Method | 2019-04-11 |
20190109113 | SEMICONDUCTOR APPARATUS AND METHOD FOR PREPARING THE SAME | 2019-04-11 |
20190109114 | MICROELECTRONIC PACKAGES WITH HIGH INTEGRATION MICROELECTRONIC DICE STACK | 2019-04-11 |
20190109115 | MICROELECTRONIC INTERPOSER FOR A MICROELECTRONIC PACKAGE | 2019-04-11 |
20190109117 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2019-04-11 |
20190109118 | Multi-Chip Fan Out Package and Methods of Forming the Same | 2019-04-11 |
20190109119 | Package Structures and Methods of Forming the Same | 2019-04-11 |
20190109120 | INTEGRATED CIRCUIT PACKAGE ASSEMBLIES INCLUDING A CHIP RECESS | 2019-04-11 |
20190109121 | SEAL-RING STRUCTURE FOR STACKING INTEGRATED CIRCUITS | 2019-04-11 |
20190109122 | ELECTRONIC PACKAGES WITH STACKED SITFFENERS AND METHODS OF ASSEMBLING SAME | 2019-04-11 |
20190109123 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2019-04-11 |
20190109124 | LIGHT EMITTING DEVICE AND METHOD OF FORMING THE SAME | 2019-04-11 |
20190109125 | SEAL RING STRUCTURES AND METHODS OF FORMING SAME | 2019-04-11 |
20190109126 | Metal Gate Structure Cutting Process | 2019-04-11 |
20190109127 | SELF-BIASED BIDIRECTIONAL ESD PROTECTION CIRCUIT | 2019-04-11 |
20190109128 | SERIES CONNECTED ESD PROTECTION CIRCUIT | 2019-04-11 |
20190109129 | ESD HARD BACKEND STRUCTURES IN NANOMETER DIMENSION | 2019-04-11 |
20190109130 | SEMICONDUCTOR CIRCUIT AND SEMICONDUCTOR DEVICE | 2019-04-11 |
20190109131 | SEMICONDUCTOR DEVICE | 2019-04-11 |
20190109132 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-04-11 |
20190109133 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A STANDARD CELL WHICH INCLUDES A FIN | 2019-04-11 |
20190109134 | Replacement Gate Process for FinFET | 2019-04-11 |
20190109135 | SEMICONDUCTOR DEVICES WITH NANOWIRES AND METHODS FOR FABRICATING THE SAME | 2019-04-11 |
20190109136 | Hybrid Scheme for Improved Performance for P-type and N-type FinFETs | 2019-04-11 |
20190109137 | INTEGRATED CIRCUIT DEVICES AND METHODS OF FABRICATING SUCH DEVICES | 2019-04-11 |
20190109138 | METHOD OF FORMING SEMICONDUCTOR DEVICE | 2019-04-11 |
20190109139 | METHOD OF FABRICATING DRAM | 2019-04-11 |
20190109142 | Using Three or More Masks to Define Contact-Line-Blocking Components in FinFET SRAM Fabrication | 2019-04-11 |
20190109143 | SRAM LAYOUT FOR DOUBLE PATTERNING | 2019-04-11 |
20190109144 | SRAM Cells with Vertical Gate-All-Round MOSFETS | 2019-04-11 |
20190109145 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE | 2019-04-11 |
20190109146 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING | 2019-04-11 |
20190109147 | METHOD OF FABRICATING SEMICONDUCTOR STRUCTURE | 2019-04-11 |
20190109148 | SEMICONDUCTOR DEVICE | 2019-04-11 |
20190109149 | VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING VERTICAL MEMORY DEVICES | 2019-04-11 |
20190109150 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-04-11 |
20190109151 | INTEGRATED CIRCUIT INCLUDING COMPLEX LOGIC CELL | 2019-04-11 |
20190109152 | BODY CURRENT BYPASS RESISTOR | 2019-04-11 |
20190109153 | ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, DISPLAY APPARATUS | 2019-04-11 |
20190109154 | PANEL DEVICE AND ELECTRONIC DEVICE | 2019-04-11 |
20190109155 | ARRAY SUBSTRATE, METHOD OF PRODUCING THE SAME, AND DISPLAY PANEL | 2019-04-11 |
20190109156 | DISPLAY APPARATUS | 2019-04-11 |
20190109157 | DISPLAY DEVICE | 2019-04-11 |
20190109158 | THIN FILM TRANSISTOR, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE | 2019-04-11 |
20190109159 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2019-04-11 |
20190109160 | ARRAY SUBSTRATE AND DISPLAY DEVICE AND METHOD FOR MAKING THE ARRAY SUBSTRATE | 2019-04-11 |
20190109161 | COLOR FILTER FOR IMAGE SENSOR, IMAGE SENSOR, AND METHOD OF MANUFACTURING COLOR FILTER FOR IMAGE SENSOR | 2019-04-11 |
20190109162 | IMAGE SENSOR DEVICE AND METHOD OF FABRICATING THE SAME | 2019-04-11 |
20190109163 | Image Sensors with Grounded or Otherwise Biased Channel-Stop Contacts | 2019-04-11 |
20190109164 | METHOD FOR MANUFACTURING IMAGE SENSOR | 2019-04-11 |
20190109165 | SOLID-STATE IMAGE SENSOR, ELECTRONIC APPARATUS, AND IMAGING METHOD | 2019-04-11 |
20190109166 | CAMERA | 2019-04-11 |
20190109167 | LIGHT DETECTION DEVICE | 2019-04-11 |
20190109168 | CIRCUIT BOARD, SEMICONDUCTOR DEVICE, IMAGING DEVICE, SOLID-STATE IMAGE SENSOR, METHOD FOR MANUFACTURING SOLID-STATE IMAGE SENSOR, AND ELECTRONIC APPARATUS | 2019-04-11 |
20190109169 | SOURCE FOLLOWER CONTACT | 2019-04-11 |
20190109170 | Complementary Metal-Oxide-Semiconductor Image Sensors | 2019-04-11 |
20190109171 | SOLID-STATE IMAGING ELEMENT AND ELECTRONIC DEVICE | 2019-04-11 |
20190109172 | DETECTING DEVICE | 2019-04-11 |
20190109173 | METHOD OF PROCESSING WAFER | 2019-04-11 |
20190109174 | MANUFACTURING METHOD OF LED DISPLAY DEVICE | 2019-04-11 |
20190109175 | Semiconductor Devices Including Data Storage Patterns | 2019-04-11 |
20190109176 | MEMORY CELL WITH INDEPENDENTLY-SIZED ELEMENTS | 2019-04-11 |
20190109177 | STEEP-SWITCH VERTICAL FIELD EFFECT TRANSISTOR | 2019-04-11 |
20190109178 | RRAM MEMORY CELL WITH MULTIPLE FILAMENTS | 2019-04-11 |
20190109179 | Solid State Tissue Equivalent Detector With Gate Electrodes | 2019-04-11 |
20190109180 | DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF, REPAIRING METHOD FOR DISPLAY APPARATUS | 2019-04-11 |
20190109181 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME | 2019-04-11 |
20190109182 | DISPLAY MODULE | 2019-04-11 |
20190109183 | DISPLAY DEVICE, METHOD FOR DRIVING THE SAME, AND ELECTRONIC APPARATUS | 2019-04-11 |
20190109184 | DISPLAY PANEL AND DISPLAY DEVICE | 2019-04-11 |
20190109185 | SEMICONDUCTOR STRUCTURE HAVING INTEGRATED INDUCTOR THEREIN | 2019-04-11 |
20190109186 | Damascene Thin-Film Resistor (TFR) In Poly-Metal Dielectric and Method of Fabrication | 2019-04-11 |
20190109187 | SEMICONDUCTOR SWITCHING ELEMENT | 2019-04-11 |
20190109188 | POWER SEMICONDUCTOR DEVICE HAVING FULLY DEPLETED CHANNEL REGIONS | 2019-04-11 |
20190109189 | HIGH VOLTAGE RESISTOR DEVICE | 2019-04-11 |
20190109190 | MEMORY DEVICE INCLUDING VOIDS BETWEEN CONTROL GATES | 2019-04-11 |