15th week of 2012 patent applcation highlights part 13 |
Patent application number | Title | Published |
20120086098 | IONIC ISOLATION RING - There has been very little (if any) attention to address contamination diffusion within an integrated circuit (IC) because there are very few applications where a protective overcoat will be penetrated as part of the manufacturing process. Here, a sealing ring is provided that address this problem. Preferably, the sealing ring uses the combination of electrically conductive barrier rings and the tortuous migration path to allow an electronic device (i.e., thermopile), where a protective overcoat is penetrated during manufacture, to communicate with external devices while being isolated to prevent contamination. | 2012-04-12 |
20120086099 | SCHOTTKY DIODE - An integrated circuit device and method for fabricating the integrated circuit device is disclosed. The integrated circuit device includes a substrate, a diffusion source, and a lightly doped diffusion region in contact with a conductive layer. A junction of the lightly doped diffusion region with the conductive layer forms a Schottky region. An annealing process is performed to form the lightly doped diffusion region. The annealing process causes dopants from the diffusion source (for example, an n-well disposed in the substrate) of the integrated circuit device to diffuse into a region of the substrate, thereby forming the lightly doped diffusion region. | 2012-04-12 |
20120086100 | CMOS STRUCTURE AND METHOD OF MANUFACTURE - CMOS structures with a replacement substrate and methods of manufacture are disclosed herein. The method includes forming a device on a temporary substrate. The method further includes removing the temporary substrate. The method further includes bonding a permanent electrically insulative substrate to the device with a bonding structure. | 2012-04-12 |
20120086101 | INTEGRATED CIRCUIT AND INTERCONNECT, AND METHOD OF FABRICATING SAME - The disclosure relates generally to integrated circuits (IC), IC interconnects, and methods of fabricating the same, and more particularly, high performance inductors. The IC includes at least one trench within a dielectric layer disposed on a substrate. The trench is conformally coated with a liner and seed layer, and includes an interconnect within. The interconnect includes a hard mask on the sidewalls of the interconnect. | 2012-04-12 |
20120086102 | Integrated Circuits with Magnetic Core Inductors and Methods of Fabrications Thereof - In one embodiment, a method of forming a semiconductor device includes forming a first inductor coil within and/or over a substrate. The first inductor coil is formed adjacent a top side of the substrate. First trenches are formed within the substrate adjacent the first inductor coil. The first trenches are filled at least partially with a magnetic fill material. At least a first portion of the substrate underlying the first inductor coil is thinned. A backside magnetic layer is formed under the first portion of the substrate. The backside magnetic layer and the magnetic fill material form at least a part of a magnetic core region of the first inductor coil. | 2012-04-12 |
20120086103 | TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCESS MEMORY DEVICE - A method for forming a trench structure is provided for a semiconductor and/or memory device, such as an DRAM device. In one embodiment, the method for forming a trench structure includes forming a trench in a semiconductor substrate, and exposing the sidewalls of the trench to an arsenic-containing gas to adsorb an arsenic containing layer on the sidewalls of the trench. A material layer is then deposited on the sidewalls of the trench to encapsulate the arsenic-containing layer between the material layer and sidewalls of the trench. | 2012-04-12 |
20120086104 | ATOMIC LAYER DEPOSITION OF CRYSTALLINE PrCaMnO (PCMO) AND RELATED STRUCTURES AND METHODS - Methods of forming a PrCaMnO (PCMO) material by atomic layer deposition. The methods include separately exposing a surface of a substrate to a manganese-containing precursor, an oxygen-containing precursor, a praseodymium-containing precursor and a calcium-containing precursor. The resulting PCMO material is crystalline. A semiconductor device structure including the PCMO material, and related methods, are also disclosed. | 2012-04-12 |
20120086105 | SEMICONDUCTOR DEVICE HAVING CAPACITOR CAPABLE OF REDUCING ADDITIONAL PROCESSES AND ITS MANUFACTURE METHOD - A first capacitor recess and a wiring trench are formed through an interlayer insulating film. A lower electrode fills the first capacitor recess, and a first wiring fills the wiring trench. An etching stopper film and a via layer insulating film are disposed over the interlayer insulating film. A first via hole extends through the via layer insulating film and etching stopper film and reaches the first wiring, and a first plug fills the first via hole. A second capacitor recess is formed through the via layer insulating film, the second capacitor recess at least partially overlapping the lower electrode, as viewed in plan. The upper electrode covers the bottom and side surfaces of the second capacitor recess. A capacitor is constituted of the upper electrode, etching stopper film and lower electrode. A second wring connected to the first plug is formed over the via layer insulating film. | 2012-04-12 |
20120086106 | METHOD FOR INCREASING THE AREA OF NON-POLAR AND SEMI-POLAR NITRIDE SUBSTRATES - A method for fabricating a high quality freestanding nonpolar and semipolar nitride substrate with increased surface area, comprising stacking multiple films by growing the films one on top of each other with different and non-orthogonal growth directions. | 2012-04-12 |
20120086107 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR DEVICE - A semiconductor device manufacturing method includes loading a substrate, on which a high-k film is formed, into a processing chamber, performing a reforming process by heating the high-k film through irradiation of a microwave on the substrate, and unloading the substrate from the processing chamber. | 2012-04-12 |
20120086108 | CHIP LEVEL EMI SHIELDING STRUCTURE AND MANUFACTURE METHOD THEREOF - A chip level EMI shielding structure and manufacture method thereof are provided. The chip level EMI shielding structure includes a semiconductor substrate, at least one ground conductor line, a ground layer, and a connection structure. The ground conductor line is disposed on a first surface of the semiconductor substrate, and the ground layer is disposed on a second surface of the semiconductor substrate. The connection structure is formed on a lateral wall of the semiconductor substrate for connecting the ground conductor lines with the ground layer to form a shielding. With such arrangement, the chip level EMI shielding structure can reduce the chip size and the manufacturing cost. | 2012-04-12 |
20120086109 | Semiconductor Device Including Shielding Layer And Fabrication Method Thereof - Example embodiments relate to a semiconductor device. The semiconductor device may include a first semiconductor chip including a semiconductor substrate, a first through via that penetrates the semiconductor substrate, a second semiconductor chip stacked on one plane of the first semiconductor chip, and a shielding layer covering at least one portion of the first and/or second semiconductor chip and electrically connected to the first through via. | 2012-04-12 |
20120086110 | IC PACKAGE - An IC package which can avoid electromagnetic waves leaked from a side surface of the IC package includes: an electric circuit board on which an IC chip is mounted; a first conductive board arranged at a position facing the electric circuit board while the IC chip on the electric circuit board is sandwiched therebetween; and a magnetic body which is arranged on a surface of the first conductive board on a side facing the IC chip and which is arranged at least partially on end portions of the first conductive board. | 2012-04-12 |
20120086111 | SEMICONDUCTOR DEVICE - The present invention reduces the occurrence of fracture in external terminal connecting sections and improves the reliability of secondary packaging of a semiconductor device. Specifically, the present invention provides a semiconductor device including a wiring board, a semiconductor chip mounted on one surface of the wiring board via a bonding member, and external electrodes formed on the other surface of the wiring board and electrically connected to the semiconductor chip. In the semiconductor device, a peripheral end of the bonding member is arranged in a position where the peripheral end does not overlap the external electrodes. | 2012-04-12 |
20120086112 | Multi-Component Electronic System Having Leadframe with Support-Free Cantilever Leads | 2012-04-12 |
20120086113 | FLEXIBLE CIRCUITS AND METHODS FOR MAKING THE SAME - Embodiments of the invention relate to a method for creating a flexible circuit, including defining a cavity in a top surface of a substrate before disposing a semiconductor chip within the cavity, such that a backside of the chip is disposed beneath the top surface of the substrate and above a bottom surface of the cavity. The method also includes forming a flexible connecting layer on the top surface of the substrate and extending over the chip. Other embodiments relate to a flexible circuit including a substrate defining a cavity in a top surface thereof. The cavity has encapsulant and a chip disposed therein, wherein a frontside of the chip is substantially coplanar with the top surface of the substrate. A flexible connecting layer is disposed on the top surface of the substrate and is partially supported by the substrate. | 2012-04-12 |
20120086114 | MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT - An integrated circuit (IC) device arrangement includes a substrate, an IC die coupled to the substrate, an antenna coupled to the IC die, and a first wirelessly enabled functional block coupled to the IC die. The wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block coupled to the substrate. The antenna is configured to communicate with another antenna coupled to another device. | 2012-04-12 |
20120086115 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER INTERCONNECTIONS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing an integrated circuit; mounting a routing structure having a functional side above the integrated circuit; mounting a vertical interconnect to the functional side of the routing structure and the vertical interconnect extending vertically away from the routing structure; forming an encapsulation covering the integrated circuit, the routing structure, and sides of the vertical interconnect above the routing structure, and leaves a surface of the routing structure exposed from the encapsulation, and a portion of the vertical interconnect exposed from the encapsulation above the surface of the routing structure; mounting a first-external-package-component to the routing structure; and forming a first-external-package-encapsulation covering the first-external-package-component. | 2012-04-12 |
20120086116 | ELECTRONIC COMPONENT DEVICE, METHOD OF MANUFACTURING THE SAME AND WIRING SUBSTRATE - An electronic component device includes a substrate, an electrode post made of a metal material, provide to stand on the substrate, and an electronic component whose connection electrode is connected to the electrode post, wherein the connection electrode of the electronic component and the electrode post are joined by an alloy layer including a metal which is different from the metal material of the electrode post. | 2012-04-12 |
20120086117 | PACKAGE WITH EMBEDDED CHIP AND METHOD OF FABRICATING THE SAME - A package embedded with a chip and a method of fabricating the package of embedded chip. The package of embedded chip includes a dielectric layer having a first surface and a second surface opposing the first surface; a plurality of conductive pillars formed in the dielectric layer and exposed from the second surface of the dielectric layer; a chip embedded in the dielectric layer; a circuit layer formed on the first surface of the dielectric layer; a plurality of conductive blind vias formed in the dielectric layer, allowing the circuit layer to be electrically connected via the conductive blind vias to the chip and each of the conductive pillars; and a first solder mask layer formed on the first surface of the dielectric layer and the circuit layer, thereby using conductive pillars to externally connect with other electronic devices as required to form a stacked structure. Therefore, the manufacturing process can be effectively simplified. | 2012-04-12 |
20120086118 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME - Provided is a semiconductor package and a method of fabricating the same. The semiconductor package includes: a package body including a plurality of sheets; semiconductor chips mounted in the package body; and an external connection terminal provided on a first side of the package body, wherein the sheets are stacked in a parallel direction to the first side. | 2012-04-12 |
20120086119 | CHIP STACKED STRUCTURE - A chip stacked structure is provided. The chip stacked structure includes a first die and a second die stacked on the first die. The first die has a plurality of connection structures each which has a through hole, a connection pad and a solder bump. The connection pad has a terminal connected to the through hole. The solder bump is disposed on the connection pad and located around the through hole. The second die has a plurality of through holes which are aligned and bonded to the solder bump respectively. The chip stacked structure may simplify the process and improve the process yield rate. | 2012-04-12 |
20120086120 | STACKED SEMICONDUCTOR PACKAGE HAVING CONDUCTIVE VIAS AND METHOD FOR MAKING THE SAME - The present invention relates to a stacked semiconductor package and a method for making the same. The method includes the steps of: forming and curing a first protective layer to cover a plurality of first bumps of a first wafer; cutting the first wafer to form a plurality of first dice; forming a third protective layer to cover a plurality of second bumps of a second wafer; picking up the first dice through the first protective layer, and bonding the first dice to the second wafer; removing part of the first protective layer; cutting the second wafer to form a plurality of second dice; and bonding the first dice and the second dice to a substrate. Whereby, the first protective layer can protect the first bumps, and the first protective layer can increase the total thickness and the flatness. | 2012-04-12 |
20120086121 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - A semiconductor device includes an insulating film base member and a wiring pattern that is formed on the insulating film base member. The wiring pattern has a surface, with at least a peripheral section of the surface being a peeled surface of the wiring pattern peeled from the insulating film base member. The semiconductor device further includes a plating layer that covers the surface of the wiring pattern, and an IC chip that has an active surface with a bump bonded to the wiring pattern. The peeled surface of the wiring pattern is peeled from the insulating film base member around a bonding position of the wiring pattern bonded with the bump. | 2012-04-12 |
20120086122 | Semiconductor Device And Semiconductor Package Having The Same - The present invention relates to a semiconductor device and a semiconductor package having the same. The semiconductor device includes a conductive element. The conductive element is disposed on a protruded conductive via and liner, and covers a sidewall of the liner. Whereby, the conductive element can protect the protruded conductive via and liner from being damaged. Further, the size of the conductive element is large, thus it is easy to perform a probe test process. | 2012-04-12 |
20120086123 | SEMICONDUCTOR ASSEMBLY AND SEMICONDUCTOR PACKAGE INCLUDING A SOLDER CHANNEL - Semiconductor packages connecting a semiconductor chip to an external device by bumps are provided. The semiconductor packages may include a connection pad on a semiconductor chip, a connecting bump on and configured to be electrically connected to the connection pad and a supporting bump on the semiconductor chip and configured to be electrically isolated from the connection pad. The connection bump may include a first pillar and a first solder ball and the supporting bump may include a second pillar and a second solder ball. The semiconductor packages may further include a solder channel in the second pillar configured to allow a portion of the second solder ball to extend into the solder channel along a predetermined direction. | 2012-04-12 |
20120086124 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device according to this embodiment has an electrode (electrode pad) and an insulative film (protective resin film) formed on the electrode and having an opening for exposing the electrode. The semiconductor device further has an under bump metal (UBM layer) formed over the insulative film and connected with the electrode through the opening, and a solder ball formed over the under bump metal, and the contour line at the lower end of the solder ball is situated inside the contour line of the under bump metal, whereby generation of fracture in the insulative film caused by the stress upon mounting the semiconductor device is suppressed even when the solder ball is formed of a lead-free solder. | 2012-04-12 |
20120086125 | Semiconductor Having Chip Stack, Semiconductor System, and Method of Fabricating the Semiconductor Apparatus - In one embodiment, a semiconductor device includes a plurality of semiconductor chip stacks mounted on a substrate. Bonding terminals disposed on the substrate correspond to the chip stacks, such that at least one chip in each chip stack may be directly connected to a bonding terminal on the substrate and at least one chip in the chip stack is not directly connected to the bonding terminal. The semiconductor chip stacks may each act as one semiconductor device to the outside. | 2012-04-12 |
20120086126 | PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF - A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening. | 2012-04-12 |
20120086127 | PACKAGE SYSTEMS AND MANUFACTURING METHODS THEREOF - A package system includes a first substrate. A second substrate is electrically coupled with the first substrate. At least one electrical bonding material is disposed between the first substrate and the second substrate. The at least one electrical bonding material includes a eutectic bonding material. The eutectic bonding material includes a metallic material and a semiconductor material. The metallic material is disposed adjacent to a surface of the first substrate. The metallic material includes a first pad and at least one first guard ring around the first pad. | 2012-04-12 |
20120086128 | BORDERLESS INTERCONNECT LINE STRUCTURE SELF-ALIGNED TO UPPER AND LOWER LEVEL CONTACT VIAS - A metal layer is deposited on a planar surface on which top surfaces of underlying metal vias are exposed. The metal layer is patterned to form at least one metal block, which has a horizontal cross-sectional area of a metal line to be formed and at least one overlying metal via to be formed. Each upper portion of underlying metal vias is recessed outside of the area of a metal block located directly above. The upper portion of the at least one metal block is lithographically patterned to form an integrated line and via structure including a metal line having a substantially constant width and at least one overlying metal via having the same substantially constant width and borderlessly aligned to the metal line. An overlying-level dielectric material layer is deposited and planarized so that top surface(s) of the at least one overlying metal via is/are exposed. | 2012-04-12 |
20120086129 | Manufacturing of a Device Including a Semiconductor Chip - A method includes providing a semiconductor chip having a first main surface and a second main surface opposite to the first main surface. An electrically insulating material is deposited on the first main surface of the semiconductor chip using a plasma deposition method. A first electrically conductive material is deposited on the second main surface of the semiconductor chip using a plasma deposition method. | 2012-04-12 |
20120086130 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body. The main body includes a main part, and further includes first terminals and second terminals disposed on the top and bottom surfaces of the main part, respectively. The main part includes first and second layer portions, and through electrodes penetrating them. The through electrodes are electrically connected to the first and second terminals. Each of the layer portions includes a semiconductor chip having a first surface and a second surface opposite thereto, and further includes surface electrodes. The surface electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the surface electrodes of the first layer portion. The second terminals are formed by using the surface electrodes of the second layer portion. | 2012-04-12 |
20120086131 | SEMICONDUCTOR ELEMENT HAVING CONDUCTIVE VIAS AND SEMICONDUCTOR PACKAGE HAVING A SEMICONDUCTOR ELEMENT WITH CONDUCTIVE VIAS AND METHOD FOR MAKING THE SAME - The present invention relates to a semiconductor element having conductive vias and a semiconductor package having a semiconductor element with conductive vias and a method for making the same. The semiconductor element having conductive vias includes a silicon substrate and at least one conductive via. The thickness of the silicon substrate is substantially in a range from 75 to 150 μm. The conductive via includes a first insulation layer and a conductive metal, and the thickness of the first insulation layer is substantially in a range from 5 to 19 μm. Using the semiconductor element and the semiconductor package of the present invention, the electrical connection between the conductive via and the other element can be ensured, and the electrical connection between the silicon substrate and the other semiconductor element can be ensured, so as to raise the yield rate of a product. Moreover, by employing the method of the present invention, warpage and shift of the silicon substrate can be avoided during the reflow process, so as to conduct the reflow process only a single time in the method of the present invention, thereby simplifying the subsequent process and reducing cost. | 2012-04-12 |
20120086132 | METHOD OF MANUFACTURING VIA ELECTRODE - Provided is a method of manufacturing a via electrode by which productivity and production yield can be augmented or maximized. The method of the present invention includes: forming a via hole at a substrate; forming a catalyst layer at a sidewall and a bottom of the via hole; and forming a graphene layer in the via hole by exposing the catalyst layer to a solution mixed with graphene particles. | 2012-04-12 |
20120086133 | Semiconductor Device And Semiconductor Device Manufacturing Method - A semiconductor device includes: a semiconductor chip with a plurality of electrode pads disposed at a top surface thereof; a plurality of thin film terminals set apart from one another via respective separator portions, which are located below a bottom surface of the semiconductor chip; an insulating layer disposed between the semiconductor chip and the thin-film terminals; connecting members that connect the electrode pads at the semiconductor chip with the thin-film terminals respectively and a resin layer disposed so as to cover the semiconductor chip, the plurality of thin-film terminals exposed at the semiconductor chip, the separator portions and the connecting members. | 2012-04-12 |
20120086134 | Method of Forming Patterns of Semiconductor Device - A method of forming patterns of a semiconductor device comprises forming a number of first insulating patterns that define sidewalls by patterning a first insulating layer formed over a semiconductor substrate, forming second insulating patterns, each second insulating pattern comprising a horizontal portion having two ends and being parallel to the semiconductor substrate and spaced protruding portions protruding from both ends of the horizontal portion parallel to the sidewalls of the first insulating patterns, forming third insulating patterns each filling a space between the protruding portions, removing the protruding portions to form trenches, and forming conductive patterns within the respective trenches. | 2012-04-12 |
20120086135 | INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME - In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity. | 2012-04-12 |
20120086136 | AERATION APPARATUS AND SEAWATER FLUE GAS DESULPHURIZATION APPARATUS INCLUDING THE SAME - An aeration apparatus is immersed in diluted used seawater which is water to be treated and generates fine air bubbles in the diluted used seawater. The aeration apparatus includes: an air supply line L | 2012-04-12 |
20120086137 | METHOD AND APPARATUS FOR GENERATING NANO-BUBBLES IN LIQUID - A method for generating and dissolving nano-bubbles in a liquid comprises the steps of preparing a bamboo filter by partially or entirely removing an enamel layer of a bamboo and using a bamboo fibrous layer therein as a component of a filter; applying a gas to an inside of the bamboo filter with a pressure over atmospheric pressure in a state where the bamboo filter is submerged in water; and making the gas permeate from an inside of the bamboo fibrous layer to an outside thereof, thereby forming nano-bubbles and at the same time dissolving the gas in the liquid. The present invention advantageously allows the generation of nano-sized fine bubbles by a filter member made of naturally occurring material so that the nano-bubbles are dissolved in a liquid, without applying external mechanical force to the water. | 2012-04-12 |
20120086138 | MANUFACTURING METHOD AND MANUFACTURING DEVICE OF FORMED ARTICLE, AND MANUFACTURING METHOD OF EYEGLASS LENS - An aspect of the present invention relates to a method of manufacturing a formed article forming an upper surface of a forming material comprised of a thermosoftening substance into a desired shape by heating the forming material in a state where the forming material is positioned on a forming surface of a forming mold to a temperature permitting deformation of the forming material to bring a lower surface of the forming material into tight contact with the forming surface. The heating is conducted by positioning the forming mold, on which the forming material has been positioned, beneath heat source(s) radiating radiant heat in a state where a plate-shaped member the outermost surface of which is comprised of a metal material is positioned above the upper surface of the forming material. Another aspect of the present invention relates to a method of manufacturing a formed article forming an upper surface of a forming material comprised of a thermosoftening substance into a desired shape by heating the forming material within a heating furnace in a state where the forming material is positioned on a forming surface of a forming mold to a temperature permitting deformation of the forming material to bring a lower surface of the forming material into tight contact with the forming surface. The forming is conducted while an exposed portion on the forming surface side of the forming mold on which the forming material has been positioned is covered with a covering member, and at least a portion of the covering member comprises a metal material layer. | 2012-04-12 |
20120086139 | POROUS MATERIAL HAVING CONTROLLED VOIDS AND METHOD OF MAKING THE SAME - A porous material having controlled void dimensions and method of forming the same includes forming an aerogel precursor, the aerogel precursor including a matrix material and a liquid dispersion medium for dispersing the matrix material. A plurality of particles having preselected dimensions is dispersed in the aerogel precursor. The aerogel precursor with the particles dispersed therein is frozen so that the liquid dispersion is solidified. The aerogel precursor is freeze dried to sublime the dispersion medium and form the porous material. | 2012-04-12 |
20120086140 | MANUFACTURING METHOD FOR A TAMPON, AND A MANUFACTURING APPARATUS FOR A TAMPON - A manufacturing method for a tampon having an absorbent body that absorbs liquid includes obtaining the absorbent body by compressing and shaping an absorbent-body material, and applying a melted agent to an outer surface of the absorbent body, the outer surface having a temperature lower than or equal to a freezing point of a main ingredient of the agent. | 2012-04-12 |
20120086141 | APPARATUS AND METHOD FOR MANUFACTURING MULTI COMPONENT PLASTIC MOLDED PARTS - In a method of making multi-component plastic molded parts, using an apparatus which includes two outer platens with first half-molds, and a middle platen with second half-molds interacting with the first half-molds such as to define cavities in two parting planes for injection of a plastic melt and/or a PUR mixture, one of the first and second half-molds can move in increments relative to the other one of the first and second half-molds, thereby forming different cavities in the parting planes from cycle to cycle. In a first cycle preforms are produced in respective cavities and then held in one of the first and second half-molds as the other one of the first and second half-molds moves in increments. Further components can then be injected into cavities formed in the parting planes from cycle to cycle, while another process step can be executed from cycle to cycle in free half-molds. | 2012-04-12 |
20120086142 | IMPRINT SYSTEM, IMPRINT METHOD, AND NON-TRANSITORY COMPUTER STORAGE MEDIUM - The present invention is a system including: an imprint unit transferring a transfer pattern to a coating film on a substrate using a template to form a predetermined pattern in the coating film; a treatment station connected to the imprint unit and performing a predetermined treatment on the template; a template carry-in/out station connected to the treatment station, capable of keeping templates, and carrying the template in/out from/to the treatment station; a carry line provided through the imprint unit and carrying the template between the imprint unit and the treatment station; and a substrate carry-in/out station connected to the imprint unit, capable of keeping substrates, and carrying the substrate in/out from/to the imprint unit. | 2012-04-12 |
20120086143 | OPTICAL THREAD POSITION DETECTION DEVICE - The invention relates to an optical thread position detection device ( | 2012-04-12 |
20120086144 | APPARATUS AND METHOD FOR MANUFACTURING A LOAD BEARING FABRIC SURFACE - An apparatus for forming molded edges on opposite sides of a load bearing surface including a stretching assembly integrated into a molding assembly. The stretching assembly may include localized fabric clamps that leave the center region of the fabric free (e.g. not clamped) through the process. The clamps may be arranged so that once extended to stretch the fabric, the fabric is held by the clamps in the appropriate position for molding. The fabric may be held so that opposed edges terminate in the mold cavities. The mold parts may cooperatively define two spaced apart mold cavities, and may include a mold pocket to provide space to store excess fabric. The fabric may be held against the surface of the mold cavity during the molding process, for example, using hold-down pins and special gate configurations. The molding apparatus may include an alternative stretching assembly configured to provide different amounts of stretch to different portions of the fabric blank. The alternative stretching assembly may include additional intermediate clamps. | 2012-04-12 |
20120086145 | METHOD OF MANUFACTURING SHEET, METHOD OF MANUFACTURING MATERIAL OF ABSORBENT ARTICLE, AND APPARATUS TO MANUFACTURE SHEET - A method of manufacturing a sheet includes: rotating in a circumferential direction, a first roll having a protruding portion group, and a second roll opposing the first roll and having a region with the different flexibility property; and sandwiching the sheet with the protruding portion group and the outer circumferential face of the second roll. The protruding portion group has a plurality of rows of protruding portion rows with intervals therebetween in the circumferential direction. Each of the protruding portion rows includes a plurality of protruding portions aligned along a rotational axis direction of the first roll. A position of a downstream end in the circumferential direction of at least one protruding portion of the protruding portions positioned most downstream of the protruding portion group in the circumferential direction is arranged shifted from a position of a downstream end of another protruding portion configuring the protruding portion row. | 2012-04-12 |
20120086146 | Extremely Thin-Walled ePTFE - An extrusion device is described herein, including an inventive die and mandrel that enable the production, using a conventional ram extruder, of strong coherent extremely thin-walled tubes having a wall thickness in the range of about 0.020 mm and about 0.080 mm. | 2012-04-12 |
20120086147 | METHOD FOR PRODUCING POLYGLYCOLIC ACID FIBER - A method for producing a polyglycolic acid fiber, including: obtaining undrawn yarns by melt spinning a polyglycolic acid resin; keeping the undrawn yarns under a temperature condition of 1 to 20° C.; obtaining drawn yarns by drawing the kept undrawn yarns; and, if necessary obtaining a staple fiber by cutting the drawn yarns. | 2012-04-12 |
20120086148 | PROCESS FOR MOLDING A PLASTIC PART WITH AN INSERT HELD IN POSITION BY SUCTION, MOLDING DEVICE AND USE - A process for molding a beading particularly on the periphery of a window or for molding a plastic window, in which a constituent plastic of said beading, or of said plastic window, respectively, is introduced into a molding cavity in which at least one insert, such as a trim, has been positioned beforehand, wherein said insert is held in position in said molding cavity, while said plastic is being introduced, by suction through a plurality of fine holes emerging on the internal surface of said molding cavity. | 2012-04-12 |
20120086149 | IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD - The imprint apparatus of the present invention molds an imprint material on a substrate using a mold and cures the imprint material to form a pattern on the substrate. The apparatus includes a holder configured to attract the mold to hold the mold; and a pressure reduction device configured to reduce a back pressure of the mold held by the holder, wherein the apparatus is configured to reduce the back pressure by the pressure reduction device in parallel with release of the mold from the imprint material. | 2012-04-12 |
20120086150 | PROCESS FOR MANUFACTURING A STIFFENER OF COMPOSITE MATERIAL - A process for manufacturing a stiffener made of composite material with an inside surface of a concave shape, includes producing a flat strip ( | 2012-04-12 |
20120086151 | MOLD INSERT ASSEMBLY AND METHOD OF USE - Embodiments of a mold insert assembly and methods of use are disclosed herein. A mold insert assembly includes, but is not limited to a driving member that moves between a retracting position and an extending position, a plurality of first-segment members engaging the driving member and moving between a first retracted position and a first extended position and a plurality of second-segment members proximate the plurality of first-segment members and configured to move between a second retracted position and a second extended position as the driving member moves to the extending position. The plurality of first-segment members and second-segment members cooperate to form a substantially liquid-tight periphery when the driving member is in the extending position. The plurality of first-segment members second-segment members are configured to move towards the first and second retracted positions, respectively when the driving member moves towards the retracting position. | 2012-04-12 |
20120086152 | METHODS AND APPARATUS FOR FORMING A COMPOSITE COMPONENT - A mould for a composite component having a fillet joint, the mould including a mould body having a cavity within which the component is formed, and an insert mating with the mould body and including a forming surface against which, in use, the fillet of the component fillet joint is formed. The insert may be thermally insulating and highly rigid. A method of forming a composite component having a fillet joint using a mould, the method including forcing a surface of the fillet region of the component to adopt a non constant radius of curvature while the component is inside the mould during the cure process is also provided. Additionally, a method of forming a composite component having a fillet joint that is defined between first and second legs the method including placing the legs of the component in bending during cure of the component is described. | 2012-04-12 |
20120086153 | MANUFACTURING METHODS OF CERAMIC FIRED BODY, HONEYCOMB STRUCTURE, AND EXHAUST GAS CONVERTING DEVICE, AND DRYING APPARATUS - A manufacturing method of a ceramic fired body includes forming a composition of ceramic raw material containing water to make a ceramic molded body. The ceramic molded body is irradiated with a microwave under a depressurized atmosphere of about 1 KPa or more and about 50 kPa or less to dry the ceramic molded body. The ceramic molded body is fired to make the ceramic fired body. | 2012-04-12 |
20120086154 | Near Field Electrospinning of Continuous, Aligned Fiber Tows - A near field electrospinning system includes a spinneret that provides a plurality of fibers and a collector positioned relative to the plurality of spinnerets. The electrospinning system also includes a coagulant flowing along the collector. The coagulant is configured to receive a plurality of fibers from the spinneret(s) and move the plurality of fibers away from the spinneret(s). The electrospinning system also includes a roller configured to collect the plurality of fibers from the coagulant as a substantially untwisted bundle of continuous fibers. | 2012-04-12 |
20120086155 | METHOD FOR PRODUCING ALIPHATIC POLYESTER FILM - An aliphatic polyester film is obtained by melt-extruding an aliphatic polyester as a film, controlling the entrained air stream between a casting drum and the film while inhibiting the variations of the film edge portion landing points on the casting drum, and subsequently bringing the film into contact with the casting drum over the entire width of the film. | 2012-04-12 |
20120086156 | BLOW MOLDING APPARATUS - The invention is directed a rotary molding machine having a wheel mounted for rotation on a pair of shafts positioned along the rotational axis of the wheel. A first shaft cooperates with a first turntable of the wheel and a second shaft cooperates with a second turntable. The first and second turntables extend transversely to the rotational axis. A plurality of modular mold clamp assemblies are positioned on the wheel, with each modular mold clamp assembly being moveable between an open and a closed position. Each modular mold clamp assembly has mounting areas which are mounted with respective mounting locations each turntable. The modular mold clamp assemblies provide the structure and rigidity between the turntables to help maintain the turntables in position relative to each other. | 2012-04-12 |
20120086157 | Apparatus for Removing Material from Surfaces of a Metals Processing Chamber - Methods and apparatus for removing condensed metal from the surfaces of metal processing chambers, such as, a vacuum induction metal (VIM) furnaces having, for example, condensed Mg or Ti, are disclosed. The methods and apparatus provide a robotic arm end positioned in the furnace having a nozzle operatively connected to a source of dry ice. The robotic arm end directs a stream of dry ice particles against the surface of the furnace to displace condensed metal. The displaced metal is collected for reuse or disposal. Aspects of the invention provide a safe and automated process for cleaning process chambers and recovering metal that can typically be dangerous when performed by conventional methods. | 2012-04-12 |
20120086158 | SEALING PLUG FOR AN OUTLET OPENING OF A CONTAINER AND CONTAINER HAVING A SEALING PLUG - The invention relates to a sealing plug for an outlet opening of a container which accommodates a liquid melt. The sealing plug has a sealing region disposed on the outer surface thereof that is configured to come into contact with a section of the delimiting wall delimiting the outlet opening in order to close the outlet opening. The sealing plug narrows from the sealing region towards a front end along the longitudinal axis of the sealing plug. The front end is configured for insertion into the outlet opening, wherein a section between the sealing region and the front end is designed to have a concave shape. | 2012-04-12 |
20120086159 | Sprung Multipoint Mounting for Vehicle Seat with Elastomer Spring Element - The invention concerns a vehicle oscillation device ( | 2012-04-12 |
20120086160 | DECK LEVERAGE ANCHOR WITH SPACED-APART BODY PORTIONS - A deck anchor assembly for anchoring a frame loading member to a frame deck according to the principles of the present disclosure includes a deck leverage anchor and a coupler. The deck leverage anchor is configured to engage the frame deck, the deck leverage anchor including a locking mechanism configured to lock the deck leverage anchor relative to the frame deck. The coupler is configured to couple the frame loading member to the deck leverage anchor and is independently moveable relative to the locking mechanism. | 2012-04-12 |
20120086161 | CREASING APPARATUS AND IMAGE FORMING SYSTEM - A creasing apparatus that performs a creasing process on a sheet, the creasing apparatus including a first conveying path on which a creasing unit is located, the creasing unit performing a creasing process on a sheet conveyed therein; a second conveying path that conveys a sheet conveyed therein to a downstream side without any process being performed on the sheet; and a control unit that, while the first conveying path conveys a sheet so that the creasing unit performs the creasing process on the sheet, causes a subsequent sheet to be conveyed to the downstream side from the second conveying path. | 2012-04-12 |
20120086162 | METHOD FOR COMMONLY USING SCANNING/PRINTING PATH OF A MULTIFUNCTION OFFICE MACHINE AND A DEVICE THEREOF - A method for commonly using scanning/printing path of a multifunction office machine and a device thereof. The device has a first and a second feeder slots adjacent to each other, whereby documents to be scanned and sheets to be printed can be respectively placed into the first and second feeder slots. A first restricting member is arranged on one side of the output end of the first feeder slot. A second restricting member is arranged on one side of the output end of the second feeder slot. A common pivotal member is disposed between the first and second restricting members. The common pivotal member is able to selectively drivingly abut against the first or the second restricting member. A power source serves to drive the first and second restricting members or the common pivotal member to respectively transfer the documents and the sheets for scanning and printing. | 2012-04-12 |
20120086163 | STACK FEEDING AERATION DEVICE AND METHOD - An aeration device adapted to aerate one or more sheets of a stack of sheets includes a side blower configured to selectively provide an air stream at an outlet thereof along an airstream direction so as to impinge against at least a portion of the stack. A height detecting device is configured to detect a height of an uppermost sheet of the stack. A side blower adjustment device is configured to adjust a height of the side blower and/or an angle of the airstream direction so as to track, by the air stream, the uppermost sheet of the stack based on an input from the height detecting device. | 2012-04-12 |
20120086164 | Recording Apparatus - A recording apparatus of the disclosure includes a recording unit that performs a recording process on a subject recording medium, a cassette body that accommodates the subject recording medium, a subject recording medium cassette opening that is provided in the cassette body and supplies the subject recording medium therefrom, a movable portion that switches to a closed state in which the subject recording medium cassette opening is closed or an opened state in which the subject recording medium is able to be supplied from the subject recording medium cassette opening, a lock portion that locks the movable portion in the closed state, and an insertion portion that is provided in the movable portion so that a feeding roller is able to be inserted therethrough. | 2012-04-12 |
20120086165 | Exit Path Assembly for an Imaging Device - An exit path assembly for an imaging device according to one embodiment includes a first exit nip formed by a first roller and a second roller and a second exit nip formed by the second roller and a third roller. The rotational direction of the second roller is opposite the rotational direction of the first and third rollers. The exit path assembly further includes a common drive linkage for driving the rotation of the first, second and third rollers. The common drive linkage has a one-way clutch coupled to the third roller for limiting the drive of the third roller to one direction. | 2012-04-12 |
20120086166 | IMAGE FORMING APPARATUS WITH PLURAL DISCHARGE PATHS - An image forming apparatus including a main body, a first guide member coupled to the main body so as to be rotated from a first position to a second position, and a second guide member rotatably coupled to the first guide member. The first guide position defines a first paper discharge path to discharge paper, a printed surface of which is inverted, when it is in the first position. The first guide member defines a second paper discharge path, along which the printed surface of the paper is directly discharged, when it is pivotally rotated from the first position to the second position. The second guide member guides the paper on the first paper discharge path and does not interfere with the paper on the second paper discharge path. | 2012-04-12 |
20120086167 | EDUCATIONAL GAME - A customizable educational game having a plurality of quiz cards, a plurality of different modes the complexity under which the game is to be played, and at least two rule cards designating rules for at least two different modes of play. | 2012-04-12 |
20120086168 | METHOD OF PLAYING A CARD GAME - Embodiments of the present invention comprise a method of playing a card game, comprising; providing at least one playing card to each of at least two participants to begin a hand; performing at least one round of betting, wherein each of the at least one round of betting comprises each of the at least two participants successively choosing between placing a bet, not placing a bet or surrendering the at least one playing card; and determining at least one winning participant, wherein if a participant choosing to surrender the at least one playing card causes action in the hand to end, then a value of a remaining amount of a predetermined number of at least one community playing card is revealed to the at least two participants. | 2012-04-12 |
20120086170 | Card Game - The method for playing cards provides a high scoring option and a low scoring option during each hand. Players take turns drawing a card from a master stack or a discard stack, and discarding a card in return. The cards have point designations. A High Game tally adds points to the winner's tally and a Low Game tally subtracts points from the winner's initial pool of points. The deck of card embodiments for use with the card game method can include indicia that can indicate point values for the card. A score card for use with the card game method includes a High Game tally column and a Low Game tally column. The deck of cards includes new designs. | 2012-04-12 |
20120086171 | Fluidic Processor and Method of Use - A fluidic processor includes a first sealing member having a first sealing face, a first compressive face and at least one first sealing member fluid conduit; a second sealing member having a second sealing face, a second compressive face and at least one second sealing member fluid conduit; the second sealing face of the second sealing member being sealingly and slidingly engaged in a substantially fluid tight manner with the first sealing face of the first sealing member; and at least one actuator mechanically engaging at least one of the first sealing member and the second sealing member, or an XY stage, or mechanism that provides motion in two axes on one sealing member only | 2012-04-12 |
20120086172 | BRUSH SEAL - A brush seal and brush seal segment for use in a rotary device are provided. In one embodiment, the invention provides a brush seal comprising: a plurality of brush seal segments, each segment including: an arcuate fence; an arcuate backplate substantially circumferentially coextensive with the arcuate fence, the arcuate backplate including a first end and a second end; and a plurality of brush seal bristles between the arcuate backplate and the arcuate fence, the plurality of brush seal bristles being angled with respect to a radial axis of the arcuate backplate and at least one of the first end and the second end of the arcuate backplate; and a static member to which at least one of the plurality of brush seal segments is affixed. | 2012-04-12 |
20120086173 | Oil seal - To improve durability of a seal lip ( | 2012-04-12 |
20120086174 | SYSTEM FOR SEALING A PIPELINE SYSTEM - A system is provided that includes a fluid-tight tube, which for insertion can be introduced into the area of a gap to be sealed between two pipes of the pipeline system to be sealed. The tube is provided with a feed element for introducing a fluid, with whose aid the tube is filled and thereby increased in its volume. The feed element contains a valve, which facilitates the introduction of the fluid and at the same time prevents the outward flow via the feed element. | 2012-04-12 |
20120086175 | METHOD AND APPARATUS FOR PISTON-ACTUATED ELASTOMER PROBE SEAL IN A HYDRAULIC COUPLING MEMBER - A female hydraulic coupling member has an elastomer probe seal molded to or abutting a ring-shaped metal base which is adapted to exert a compressive force on the probe seal when exposed to hydraulic fluid pressure. The compressive force causes the seal to expand in a radial direction thereby increasing its sealing effectiveness. A retainer nut for holding the seal in the receiving chamber may have an angled surface which acts to urge the seal in an inward, radial direction when an axial, compressive force is applied to the seal. | 2012-04-12 |
20120086176 | SEAL STRUCTURE USING GASKET - A gasket arranged between two sealed subject surfaces includes a plurality of segments. A recess is arranged in one of the two sealed subject surfaces at a portion corresponding to a clearance between adjacent segments. A seal is filled in the recess and deformed in accordance with the shape of the clearance between the segments. | 2012-04-12 |
20120086177 | POWER TOOL HAVING A CLAMPING DEVICE FOR A WORKING ELEMENT - The present disclosure provides a power tool having a clamping device for a working element. The power tool includes an output shaft, a fastening piece having a flange portion for clamping the working element and a protruding shaft substantially perpendicular to the flange portion. A locking assembly comprising a locking member having a first position in which the protruding shaft is locked and a second position in which the protruding shaft is loosened is provided, wherein a pressing member can press the working element between the pressing member and the flange portion when the locking member is in the first position. The power tool can fasten the working element to the output shaft in a simple and reliable manner without the necessary use of such auxiliary tools as a spanner etc. and can achieve a stronger clamping force even under impact conditions. | 2012-04-12 |
20120086178 | HEIGHT CONTROL MODULE, GAS SPRING ASSEMBLY AND METHOD - A gas spring assembly includes a gas spring and a height control module. The gas spring includes a first end member, a second end member and a flexible wall secured therebetween. The height control module includes a height control system that is operatively associated with the gas spring. The height control system includes a sensor, a valve arrangement and a fixed-logic control circuit. A suspension system and a method are also included. | 2012-04-12 |
20120086179 | Rideable Snow Sled with Replaceable Nose Section - A replaceable nose section is provided for use on a rideable snow sled wherein the nose section comprises a support structure which can be easily fitted to a snow sled, and a flexible, resilient nose section shell which is adapted to be fitted to the support structure. The support structure can be easily removed and replaced on the snow sled by the use of hooks and spring-loaded clasps, or the like, which attach to the handlebars and/or handlebar or steering assemblies of the snow sled. As such, the nose section can be easily removed from the support structure and/or the support structure can be easily removed from the snow sled. This facilitates replacement of the nose section on the snow sled. | 2012-04-12 |
20120086180 | INVISIBLE DOLLY - A dolly for transporting and moving baskets or other commercial and industrial loads. The dolly body or platform is rectangular in shape with a flat, smooth top. It may be attached, latched or fastened to the underside of the basket, tray or load being transported or moved, fitting within a space or pocket on the underside of the basket or tray. The two longitudinal sides are thicker than the center, providing strength and support, while the thinner center allows the weight of the dolly to be reduced. The dolly has no edges, rim, wall or protrusions around its perimeter. | 2012-04-12 |
20120086181 | THREE-WHEELED SKATEBOARD - Three wheeled skateboards having direct connection between the front and back skate wheels where there is improved maneuverability and turning capability is provided. A steering plate is added to the axle of a conventional front skateboard truck and is made specifically for this application. Both ends of the single cable are fixably attached to the steering plate and are connected to the single rear wheel truck to supply the direct mechanical linkage. The single wheel truck at the rear has the wheel mounted in such a way as to allow it to be turned by the mechanical linkage that carries turn motion from the two wheel truck at the front of the skateboard. The single wheel mounted to the rear of the centerline of the truck rather than in front of or on the centerline of the truck increases the quickness of the action of the skateboard. | 2012-04-12 |
20120086182 | Lever enhanced pedaling system with wrap around chain propulsion system - A propulsion system of a lever propelled bicycle that utilizes a right and left side assembly consisting of two sets of linear chain links with an offset connection to one another by a spacer means, wherein each assembly is able by said spacer connection means to wrap around separate radial drive members at least 1¾ revolutions without wrapping around itself, therefore providing the rotational pulling means of it's connected radial drive member with a propulsion that is consistent in range and torque. The propulsion system also provides means of rewrapping each chain assembly around its radial drive member for reciprocal rotational pulling action by alternate levers when a rider applies force to each pedal. | 2012-04-12 |
20120086183 | GREEN BIKE - A green bike comprises a frame, two wheels, a first internal-gear module and a second internal-gear module and a transmission element. The frame has a pedal, a front supporting unit, a rear supporting unit, and a seat unit. The two wheels are attached to the front supporting unit and the rear supporting unit, respectively. The transmission element is disposed in the frame or a tube shield linking to the frame. The first internal-gear module and the second internal-gear module are coupled with the pedal and at least one of the wheels. The transmission element links the first and the second internal-gear modules for delivering power to the at least one of the wheels. | 2012-04-12 |
20120086184 | Sliding Arm Mechanism for Wheelchairs - A sliding arm mechanism for attaching to an arm of a wheelchair is provided herein. One concept is directed to a sliding arm mechanism that includes a main portion and an inner cavity. The sliding arm mechanism also includes a slide rail, which is adapted to be housed within the inner cavity of the main portion. The slide rail and the main portion are slidably coupled to allow the main portion to move laterally over the slide rail in a direction parallel to the top part of the arm of the wheelchair, thus allowing the main portion to move between a first position and a second position. In some embodiments, the first position corresponds to a full-length position and the second position corresponds to a desk-length position, such that a user can adjust the sliding arm mechanism to access a desk or table. | 2012-04-12 |
20120086185 | END DUMP TRAILER - A trailer frame assembly for a fifth wheel trailer frame in which at least a portion of the frame is torsionally stiffened with a rectangular closed section in a transverse cross section. The rectangular closed section is formed by longitudinal, parallel spaced vertical side plates, a top pan extending between top portions of the side plates, and a bottom pan between bottom portions of the side plates. Overlap joints between the side plates and the top and bottom pans allow for connection with threaded or rivet fasteners. An end dump semi trailer is also provided with a double acting lift cylinder on each side of the trailer. Also provided is a latch lift assembly for a dump gate using a linkage assembly to impart vertical upward movement to dump gate to unlatch the dump gate from a cradle catch. | 2012-04-12 |
20120086186 | ROTATIONAL INTERFACE FOR SNOWBOARD BINDINGS - A snowboard binding interface and methods of making the same are disclosed herein. The snowboard binding interface can be used to provide a quick and simple way of changing the orientation of a snowboarder's feet relative to the snowboard. In one embodiment, an interface includes a single rotational unit in a front binding interface and a non-rotational unit in a back binding interface that matches the height of the rotational unit. The rotational unit can move 360° so that a snowboarder can change position of one foot relative to the snowboard. The binding interface reduces boot heel and toe drag during edging on snow because the binding is elevated above the surface of the board, and the force to the edges of the snowboard is increased due to the leverage generated by the additional distance between the snowboard and the binding. | 2012-04-12 |
20120086187 | User Interface for a Power Folding Stroller - A user interface for a power folding stroller includes: a rotational mechanical joint positioned on the handlebars of the stroller. The rotational mechanical joint is coupled to electrical sensors that must be activated by the user rotating a ring combined with a second step of pressing a button to activate the folding or unfolding process. Once the ring has been rotated the required distance and returned to a home position, an indication, such as an LED light, may be provided to the user that the second action of pushing the button can be undertaken. | 2012-04-12 |
20120086188 | STROLLER WITH A RECEIVING FRAME AND SUPPORT STRAPS FOR RECEIVING A CAR SEAT - A baby stroller for receiving a car seat is disclosed. The stroller has a frame structure including a car seat receiving frame and a push handle. The car seat receiving frame has four sides including a front bar and a back bar. One or more support straps are attached to the car seat receiving frame and located below the car seat receiving frame, where each support strap has one end attached to the front bar and another end attached to the back bar of the car seat receiving frame. The support straps are adjustable in length. When a car seat is rested on the car seat receiving frame, the bottom of the car seat is supported by the support straps. A safety strap is provided to secure the car seat to the frame structure. The stroller does not have a seat for seating a child. | 2012-04-12 |
20120086189 | COLLAPSIBLE STRUCTURE FOR GOLF BAG CART - A collapsible structure for golf bag cart, which comprises a coupling seat for connecting with a golf bag cart; a turning seat pivoted on one flank of the coupling seat; a wheel pivotally mounted on bottom end of the turning seat; a fixer provided on bottom end of the other flank of the coupling seat. The middle segment of the fixer is pivoted on the coupling seat and having an elastic element put thereon and the top end thereof being rested on the coupling seat so that the fixer after turning can recover to its original position. Several positioning portion and a positioning block are respectively provided on the coupling seat and the fixer, whereby the turning seat can be positioned and stops its turning. The turning seat can be rotated to dispose the wheel on its top end so that handy transportation of golf bag cart can be achieved. | 2012-04-12 |
20120086190 | METHOD AND SYSTEM FOR MULTI-STAGE INFLATION OF A CURTAIN AIRBAG FOR EJECTION MITIGATION - The present invention can include an automobile having a multi-stage inflation system. The multi-stage inflation system can include an engine control unit, a multi-stage inflation unit, a curtain airbag, a curtain airbag pressure indicator, and/or a rollover side impact detection unit. The rollover side impact detection unit can detect when a side impact or a rollover occurs to the automobile. When the rollover or the side impact is detected, the engine control unit can instruct the multi-stage inflation unit to deploy and inflate the curtain airbag in multiple stages. The multi-stage inflation unit can include a pyrotechnic inflation unit with multiple compartments. At each of the stages, a different one of the multiple compartments can be activated to substantially inflate the curtain airbag. The multi-stage inflation unit can also optionally include a cold gas inflation unit to supplement the pyrotechnic inflation unit. | 2012-04-12 |
20120086191 | GAS GENERATOR - Gas generator devices and related assemblies are provided that include adjacently disposed ignition and gas generant chambers. Within the gas generant chamber, a quantity of gas generant material is contained within one or more containers having a perforated side wall and oppositely disposed first and second end walls. The first end wall is perforated and disposed adjacent the ignition chamber to allow communication of at least a portion of the ignition products therethrough and into contact with gas generant material therein contained to ignite the gas generant material to produce a product gas. The second end wall is perforated to allow gas flow communication of the product gas therethrough for discharge from the gas generator. | 2012-04-12 |
20120086192 | TRAILER STABILIZER - A method of operating a freight trailer stabilizer comprising: (a) positioning a trailer stabilizer underneath a parked freight trailer at a loading dock so the trailer stabilizer is between the parked freight trailer and the ground, the trailer stabilizer including a first powered jack; and, (b) utilizing power from a portable vehicle to reposition the first powered jack between a raised position and a lowered position, wherein the raised position does not have the first powered jack in direct contact with the ground and wherein the lowered position does have the first powered jack in direct contact with the ground. | 2012-04-12 |
20120086193 | Wheel Assembly for an Infant Carrier Apparatus - A wheel assembly for an infant carrier apparatus can include a shock absorber, and at least a wheel pivotally coupled with the shock absorber. Examples of the infant carrier apparatus can include an infant stroller apparatus. In some embodiments, the shock absorber can be directly connected with a support frame of the infant carrier apparatus. In other embodiments, the wheel assembly can include a mount base through which the shock absorber is connected with the support frame. | 2012-04-12 |
20120086194 | SADDLE FRAME FOR PNEUMATIC BULK TRAILER - A saddle frame for a pneumatic bulk trailer includes first and second longitudinal saddle plates and at least one transverse support plate. Each of the saddle plates includes a front end, a rear end, an inner side, a generally arcuate upper edge, and a lower edge having at least three portions. Inwardly-directed edge flanges are formed at each portion of the lower edges. The transverse support plate extends between the inner sides of the saddle plates and is supported on an edge flange of each saddle plate. The upper edges of the saddle plates define support surfaces for engaging a pneumatic vessel of the pneumatic bulk trailer. The saddle plates are configured to be coupled to a front chassis frame and a rear chassis frame of the pneumatic bulk trailer. | 2012-04-12 |
20120086195 | Advertising method on sport clothing - A officially recognized fan organization from all relevant organizations is advertised on the sport team clothes/apparel, where the fan advertise them self and as a return receive great discounts from the sport team supporters, creating healthy relation between sport fan, sport teams and sport supporters/sponsors. | 2012-04-12 |
20120086196 | CONDUIT COUPLING WITH REMOVABLE STOP - A coupling for coupling ends of a rigid conduit together having a removable stop. A cylindrical sleeve has a removable stop that permits positioning of the cylindrical sleeve entirely on one end of a conduit having limited axial movement that is being repaired. The cylindrical sleeve is then axially or longitudinally positioned over a gap between the ends of the conduit being repaired and the retractable stop is lowered and positioned within the gap. A window within the cylindrical sleeve facilitates positioning of the retractable stop within the gap. Set screws secure the ends of the conduit within the cylindrical sleeve. Rigid conduit may be repaired without having to disconnect the distant or remote ends of the rigid conduit. | 2012-04-12 |
20120086197 | CONNECTING ELEMENT FOR A FLUID CONNECTION - A connecting element for a fluid connection having a housing that includes an insert region structured and arranged to axially receive a plug connector and a latching element, structured and arranged to latch the plug connector, being moveable in relation to the housing via an axial pulling movement between a first position and a second position. The connecting element also includes a safety element. In the second position, the latching element unblocks at least one space that is fillable by the safety element. | 2012-04-12 |
20120086198 | CONNECTING DEVICE FOR TWO PIPES OVERLAPPING IN SECTIONS - The invention relates to a connecting device for two pipes overlapping each other in sections, particularly for a molded hose overlapping a charge-air tube, including two wedge elements cooperating by wedge engagement in such a manner that an inner circumference of the connecting device is adjustable by relative motion of the two wedge elements. The wedge members can be arranged in axial direction in an overlapping manner so as to lock the wedge members in at least one relative position. | 2012-04-12 |