17th week of 2012 patent applcation highlights part 16 |
Patent application number | Title | Published |
20120098114 | Device with mold cap and method thereof - A device including a substrate; at least one semiconductor die on a first side of the substrate; and a mold cap molded on portions of the first side of the substrate and on lateral sides of the at least one semiconductor die. The mold cap is not molded onto a top side of the at least one semiconductor die. | 2012-04-26 |
20120098115 | Semiconductor device and method of manufacturing the same - A semiconductor device has a substrate, a semiconductor chip mounted on the substrate, an encapsulating body encapsulating the semiconductor chip on the substrate, and a plurality of heat sink plates embedded in the encapsulating body so as to have a surface that is exposed to an exterior of the encapsulating body and positioned on the same plane. The heat sink plates are spaced from each other. | 2012-04-26 |
20120098116 | MULTI-CHIP MODULE SYSTEM WITH REMOVABLE SOCKETED MODULES - A multi-chip module (MCM) includes chip sub-modules that are fabricated as self-contained testable entities. The chip sub-modules plug into respective sockets in a frame of the MCM. Each chip sub-module may be tested before being plugged into the MCM. A chip sub-module may include an IC chip, such as a processor, mounted to an sub-module organic substrate that provides interconnects to the chip. The frame into which each chip sub-module plugs sits on a mini-card organic substrate that interconnects the chip sub-modules together. The MCM may include a downstop between the mini-card organic substrate and a system board to limit or prevent solder creep of solder connections between the mini-card organic substrate and the system board. | 2012-04-26 |
20120098117 | POWER AND THERMAL DESIGN USING A COMMON HEAT SINK ON TOP OF HIGH THERMAL CONDUCTIVE RESIN PACKAGE - An apparatus and method of manufacture may be provided for a package that can be coupled to a common heat sink without external electrical isolation. The apparatus, for example, can include a semi-conductor die comprising at least one electronic device. The apparatus can also include a frame on which a bottom side of the die is mounted, a bottom side of the frame being configured to attach to a printed circuit board. The apparatus can further include a high thermal conductivity resin molded onto a top side of the die. | 2012-04-26 |
20120098118 | COMPLIANT HEAT SPREADER FOR FLIP CHIP PACKAGING - An integrated circuit chip package is described. The integrated circuit package comprises a substrate, a chip attached to the substrate, and a heat spreader mounted over the chip for sealing the chip therein. The heat spreader includes a thermally-conductive element having a side opposed to the top of the chip for transmitting heat away from the chip to the heat spreader, and a compliant element having a first portion attached to and positioned around the periphery of the thermally-conductive element and a second portion affixed to a surface of the substrate. | 2012-04-26 |
20120098119 | SEMICONDUCTOR CHIP DEVICE WITH LIQUID THERMAL INTERFACE MATERIAL - A method of manufacturing is provided that includes providing a semiconductor chip device that has a circuit board and a first semiconductor chip coupled thereto. A lid is placed on the circuit board. The lid includes an opening and an internal cavity. A liquid thermal interface material is placed in the internal cavity for thermal contact with the first semiconductor chip and the circuit board. | 2012-04-26 |
20120098120 | CENTRIPETAL LAYOUT FOR LOW STRESS CHIP PACKAGE - A low-stress chip package is disclosed. The package includes two substrates. The first substrate includes an array of first conductive structures in the corner area of the chip, and an array of second conductive structures in the peripheral edge area of the chip. The first and second conductive structures each has a conductive pillar having elongated cross section in the plane parallel to the first substrate and a solder bump over the pillar. The package also includes a second substrate having an array of metal traces. The elongated pillars each form a coaxial bump-on-trace interconnect with a metal trace respectively. The long axis of the elongated cross section of a pillar in the corner area of the chip points to chip's center area, and the long axis of the elongated cross section of a pillar in chip's peripheral edge area aligns perpendicular to the edge. | 2012-04-26 |
20120098121 | CONDUCTIVE FEATURE FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE - A conductive feature on a semiconductor component is disclosed. A first passivation layer is formed over a substrate. A bond pad is formed over the first passivation layer. A second passivation layer overlies the first passivation layer and the bond pad. The second passivation layer has a first opening overlying the bond pad and a plurality of second openings exposing a top surface of the first passivation layer. A buffer layer overlies the second passivation layer and fills the plurality of second openings. The buffer layer has a third opening overlapping the first opening and together exposes a portion the bond pad. The combined first opening and third opening has sidewalls. An under bump metallurgy (UBM) layer overlies the sidewalls of the combined first opening and third opening, and contacts the exposed portion of the bond pad. A conductive feature overlies the UBM layer. | 2012-04-26 |
20120098122 | WAFER LEVEL PACKAGING OF MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) AND COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) SUBSTRATES - The embodiments of methods and structures for forming through silicon vias a CMOS substrate bonded to a MEMS substrate and a capping substrate provide mechanisms for integrating CMOS and MEMS devices that use less real-estate and are more reliable. The through silicon vias electrically connect to metal-1 level of the CMOS devices. Copper metal may be plated on a barrier/Cu-seed layer to partially fill the through silicon vias, which saves time and cost. The formation method may involve using dual dielectric layers on the substrate surface as etching mask to eliminate a photolithographical process during the removal of oxide layer at the bottoms of through silicon vias. In some embodiments, the through silicon vias land on polysilicon gate structures to prevent notch formation during etching of the vias. | 2012-04-26 |
20120098123 | Molded Chip Interposer Structure and Methods - Apparatus and methods for providing a molded chip interposer structure and assembly. A molded chip structure having at least two integrated circuit dies disposed within a mold compound is provided having the die bond pads on the bottom surface; and solder bumps are formed in the openings of a dielectric layer on the bottom surface, the solder bumps forming connections to the bond pads. An interposer having a die side surface and a board side surface is provided having bump lands receiving the solder bumps of the molded chip structure on the die side of the interposer. An underfill layer is formed between the die side of the interposer and the bottom surface of the molded chip structure surrounding the solder bumps. Methods for forming the molded chip interposer structure are disclosed. | 2012-04-26 |
20120098124 | SEMICONDUCTOR DEVICE HAVING UNDER-BUMP METALLIZATION (UBM) STRUCTURE AND METHOD OF FORMING THE SAME - A semiconductor device has a UBM (under-bump metallization) structure underlying and electrically connected to a solder bump. The UBM structure has a first metallization layer with a first cross-sectional dimension d | 2012-04-26 |
20120098125 | INTEGRATED CIRCUIT PACKAGE AND PHYSICAL LAYER INTERFACE ARRANGEMENT - An integrated circuit (IC) package includes an IC chip and a package carrier. The IC chip includes a substrate and an IC layered structure configured on an active surface of the substrate. The IC layered structure includes a first physical layer interface and a second physical layer interface. The first physical layer interface includes a plurality of first bump pads and a plurality of first inner pads electrically connected to the first bump pads, respectively. The second physical layer interface includes a plurality of second bump pads and a plurality of second inner pads electrically connected to the second bump pads, respectively. The second bump pads are mirror images of the first bump pads with respect to a first geometric plane perpendicular to the active surface. The second inner pads are mirror images of the first inner pads with respect to the first geometric plane. | 2012-04-26 |
20120098126 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - The joint reliability in flip chip bonding of a semiconductor device is enhanced. Prior to flip chip bonding, flux | 2012-04-26 |
20120098127 | POWER/GROUND LAYOUT FOR CHIPS - Embodiments of the present disclosure provide a chip that comprises a base metal layer formed over a first semiconductor die and a first metal layer formed over the base metal layer. The first metal layer includes a plurality of islands configured to route at least one of (i) a ground signal or (ii) a power signal in the chip. The chip further comprises a second metal layer formed over the first metal layer. The second metal layer includes a plurality of islands configured to route at least one of (i) the ground signal or (ii) the power signal in the chip. | 2012-04-26 |
20120098128 | CHIP STRUCTURE AND PROCESS FOR FORMING THE SAME - A chip with a metallization structure and an insulating layer with first and second openings over first and second contact points of the metallization structure, a first circuit layer connecting the first and second contact points and comprising a first trace portion, first and second via portions between the first trace portion and the first and second contact points, the first circuit layer comprising a copper layer and a first conductive layer under the copper layer and at a sidewall of the first trace portion, and a second circuit layer comprising a second trace portion with a third via portion at a bottom thereof, wherein the second circuit layer comprises another copper layer and a second conductive layer under the other copper layer and at a sidewall of the second trace portion, and a second dielectric layer comprising a portion between the first and second circuit layers. | 2012-04-26 |
20120098129 | METHOD OF MAKING A MULTI-CHIP MODULE HAVING A REDUCED THICKNESS AND RELATED DEVICES - A method of making a multi-chip module may include forming an interconnect layer stack on a sacrificial substrate. The interconnect layer stack may include patterned electrical conductor layers and a dielectric layer between adjacent patterned electrical conductor layers. The method may further include electrically coupling a first integrated circuit (IC) die in a flip chip arrangement to an uppermost patterned electrical conductor layer, and forming a first underfill dielectric layer between the first IC die and adjacent portions of the interconnect layer stack. The method further may include removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at a second integrated circuit die in a flip chip arrangement to the lowermost patterned electrical conductor layer. Still further, the method may include forming a second underfill dielectric layer between the second IC die and adjacent portions of the interconnect layer stack. | 2012-04-26 |
20120098130 | LEAD-FREE STRUCTURES IN A SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor die and lead-free solder bumps disposed on a surface of the semiconductor die. A substrate includes metal layers and dielectric layers. One of the metal layers includes contact pads corresponding to lead-free solder bumps, and one of the dielectric layers is an exterior dielectric layer having respective openings for the contact pad. Respective copper posts are disposed on the contact pads. The respective copper post for each contact pad extends from the contact pad through the respective opening for the contact pad. The semiconductor die is mounted on the substrate with connections between the lead-free solder bumps and the copper posts. | 2012-04-26 |
20120098131 | Nickel Silicide Film - A nickel alloy sputtering target and a nickel silicide film formed with such a target are provided and enable the formation of a thermally stable silicide (NiSi) film, scarcely causing the aggregation of films or excessive formation of silicides, having low generation of particles upon forming the sputtered film, having favorable uniformity and superior plastic workability to the target, and which is particularly effective for the manufacture of a gate electrode material (thin film). The nickel alloy sputtering target contains 22 to 46 wt % of platinum and 5 to 100 wtppm of one or more components selected from iridium, palladium, and ruthenium, and remainder is nickel and inevitable impurities. | 2012-04-26 |
20120098132 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device with a stable structure having high capacitance by changing the pillar type storage node structure and a method of manufacturing the same are provided. The method includes forming a sacrificial layer on a semiconductor substrate including a storage node contact plug, etching the sacrificial layer to form a region exposing the storage node contact plug, forming a first conductive material within an inner side of the region, burying a second conductive material within the region in which the first conductive material is formed, and removing the sacrificial layer to form a pillar type storage node. | 2012-04-26 |
20120098133 | STRUCTURE AND METALLIZATION PROCESS FOR ADVANCED TECHNOLOGY NODES - The problem of poor adherence of a dielectric coating on a patterned metal structure can be solved by forming an adhesion layer on exposed surfaces of such metal structure prior to deposition of such dielectric. According to an embodiment, the invention provides a method to form a self-aligned adhesion layer on the surface of metal interconnect structure within an integrated circuit by exposing the metal structure to a controlled atmosphere and a flow of nitrogen-containing gas. | 2012-04-26 |
20120098134 | CONNECTING MATERIAL, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - When connecting with a conventional Zn/Al/Zn cladding material, thickness of a connecting part needs to be less than double an existing high-lead solder (about 100 μm) in order to make heat resistance in the connecting part at least equivalent to a level of the existing solder. Moreover, thickness of an Al layer needs to make as thick as possible in order to fully exhibit stress relaxation performance of the Al layer. | 2012-04-26 |
20120098135 | INTEGRATED CIRCUITS WITH BACKSIDE METALIZATION AND PRODUCTION METHOD THEREOF - An embodiment of an integrated device, including a chip of semiconductor material wherein an integrated circuit is integrated, is proposed; the integrated device includes a set of contact terminals for contacting the integrated circuit. At least one contact terminal of said set of contact terminals includes a contact layer of metal material being suitable to be directly coupled mechanically to an element external to the chip, and a coupling element for improving an electrical and/or mechanical coupling between the contact layer and the chip. The coupling element includes a coupling layer being formed by a combination between the metal material of the contact layer and the semiconductor material of the chip, with the coupling layer that is directly coupled to the chip and to the contact layer. | 2012-04-26 |
20120098136 | Hybrid MEMS RF Switch and Method of Fabricating Same - Structures having a hybrid MEMS RF switch and method of fabricating such structures using existing wiring layers of a device is provided. The method of manufacturing a MEMS switch includes forming a forcing electrode from a lower wiring layer of a device and forming a lower electrode from an upper wiring layer of the device. The method further includes forming a flexible cantilever arm over the forcing electrode and the lower electrode such that upon application of a voltage to the forcing electrode, the flexible cantilever arm will contact the lower electrode to close the MEMS switch. | 2012-04-26 |
20120098137 | ELEMENT MOUNTING SUBSTRATE AND SEMICONDUCTOR MODULE - Conventional printed circuit boards had a problem of being inferior in heat-radiation characteristic, and metal-core printed circuit boards adopted to improve the heat-radiation characteristic had problems in having low rigidity and a tendency to bend. The ductility of the metal can be obstructed, and the metal protected; by covering substantially the whole area of the front and back sides of the metal core, consisting of metal as the main material, with a first ceramic film and a second ceramic film that obstruct the ductility of the aforementioned metal-core; and covering each of the ceramic films with insulated resin films, to cover the fragility of these ceramics. | 2012-04-26 |
20120098138 | POWER SEMICONDUCTOR DEVICE - A power semiconductor device of the present invention has the power semiconductor elements having back surfaces bonded to the wiring patterns and surface electrodes on surfaces, the cylindrical communication parts having bottom surfaces bonded on the surface electrodes of the power semiconductor elements and/or on the wiring patterns, the transfer mold resin having concave parts which expose the upper surfaces of the communication parts and covering surfaces other than the upper surfaces of the communication parts, the insulating layer, the wiring patterns, and the power semiconductor elements, and the external terminals having one ends inserted in the upper surfaces of the communication parts and the other ends guided upward, and at least one external terminal has, between both end parts, the bent area which is bent in an L shape and the bent area is embedded in the concave part of the transfer mold resin. | 2012-04-26 |
20120098139 | Vertical Memory Devices And Methods Of Manufacturing The Same - A vertical memory device includes a channel, a ground selection line (GSL), word lines, a string selection line (SSL), and a contact. The channel includes a vertical portion and a horizontal portion. The vertical portion extends in a first direction substantially perpendicular to a top surface of a substrate, and the horizontal portion is connected to the vertical portion and parallel to the top surface of the substrate. The GSL, the word lines and the SSL are formed on a sidewall of the vertical portion of the channel sequentially in the first direction, and are spaced apart from each other. The contact is on the substrate and electrically connected to the horizontal portion of the channel. | 2012-04-26 |
20120098140 | HYBRID BONDING TECHNIQUES FOR MULTI-LAYER SEMICONDUCTOR STACKS - A circuit arrangement and method utilize hybrid bonding techniques that combine wafer-wafer bonding processes with chip-chip and/or chip-wafer bonding processes to form a multi-layer semiconductor stack, e.g., by bonding together one or more sub-assemblies formed by wafer-wafer bonding together with other sub-assemblies and/or chips using chip-chip and/or chip-wafer bonding processes. By doing so, the advantages of wafer-wafer bonding techniques, such as higher interconnect densities, may be leveraged with the advantages of chip-chip and chip-wafer bonding techniques, such as mixing and matching chips with different sizes, aspect ratios, and functions. | 2012-04-26 |
20120098141 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - A semiconductor device and a method for forming the same are disclosed. The semiconductor device includes a semiconductor substrate including an active region defined by a device isolation film, a bit line contact plug that is coupled to the active region and that includes a first ion implantation region buried in a first inner void, and a storage node contact plug that is coupled to the active region and includes a second ion implantation region buried in a second inner void. Although the semiconductor device is highly integrated, a contact plug is buried to prevent formation of a void, so that increase in contact plug resistance is prevented, resulting in improved semiconductor device characteristics. | 2012-04-26 |
20120098142 | ELECTRICAL CONTACT FOR A DEEP BURIED LAYER IN A SEMI-CONDUCTOR DEVICE - A semi-conductor device includes at least one deep buried layer with an electrical connection made thereto by an electrical contact. The electrical contact to the deep buried layer is made by formed an opening through the use of a first chemical attack and a second chemical attack after the first chemical attack. By making an opening, the electrical contact can be made with the deep buried layer without at the same time occupying excessively wide portions of the device. For example, it is possible to make electrical contacts having a width of less than 1.5 μm with deep layers having a depth of more than 5 μm. | 2012-04-26 |
20120098143 | METHOD FOR PACKAGING A SEMICONDUCTOR CHIP, AND SEMICONDUCTOR PACKAGE - A method for packaging a semiconductor chip includes: providing a semiconductor wafer that has an upper surface and includes a plurality of chip regions, each of the chip regions having a semiconductor unit that includes at least one electrical-connecting pad; forming over the upper surface a photoresist layer, followed by forming a plurality of pad-exposing holes in the photoresist layer; filling a first conductive material in the pad-exposing holes, followed by reflowing; removing the photoresist layer, and forming over the upper surface a protective layer; grinding the protective layer; coating an insulated protective layer on the ground protective layer, and forming a plurality of via holes in the insulated protective layer; filling a second conductive material in the via holes, followed by reflowing; and removing the insulated protective layer. | 2012-04-26 |
20120098144 | VERTICAL ELECTRODE STRUCTURE USING TRENCH AND METHOD FOR FABRICATING THE VERTICAL ELECTRODE STRUCTURE - Provided is a vertical electrode structure using a trench and a method of manufacturing the vertical electrode structure. The method of forming a vertical electrode structure using a trench includes steps of: forming the trench on a predetermined region of a semiconductor substrate; and forming electrode layers in predetermined regions of inner and outer portions of the trench. In this manner, the electrode deposition in the vertical direction is established by using the trench, so that it is possible to form a deposited electrode having a size of several hundred nm or less by a short processing time and a low processing cost. | 2012-04-26 |
20120098145 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME - A semiconductor device includes a chip stacked structure. The chip stacked structure may include, but is not limited to, first and second semiconductor chips. The first semiconductor chip has a first thickness. The second semiconductor chip has a second thickness that is thinner than the first thickness. | 2012-04-26 |
20120098146 | FORMATION OF BARRIER LAYER ON DEVICE USING ATOMIC LAYER DEPOSITION - The configuration of one or more barrier layers for encapsulating a device is controlled by setting parameters of atomic layer deposition (ALD). A substrate formed with the device is placed on a susceptor and exposed to multiple cycles of source precursor gas and reactant precursor gas injected by reactors of a deposition device. By adjusting one or more of (i) the relative speed between the susceptor and the reactors, (ii) configuration of the reactors, and (iii) flow rates of the gases injected by the reactors, the configuration of the layers deposited on the device can be controlled. By controlling the configuration of the deposited layers, defects in the deposited layers can be prevented or reduced. | 2012-04-26 |
20120098147 | PLASMA TREATMENT METHOD - A method for manufacturing a semiconductor device having fluorocarbon layers as insulating layers includes the steps of forming a first fluorocarbon (CFx | 2012-04-26 |
20120098148 | APPARATUS, SYSTEMS AND METHODS FOR CONTROLLING THE MASS TRANSFER OF GASES INTO LIQUIDS - According to one aspect, a system for controlling mass transfer of a gas into a liquid. The system includes a mass transfer apparatus configured to provide the mass transfer of the gas into the liquid, a temperature sensor configured to monitor the temperature of the liquid provided to the mass transfer apparatus, a pressure sensor configured to monitor the pressure within the mass transfer apparatus, and a control unit configured to communicate with the temperature sensor and the pressure sensor. In response, the control unit adjusts the pressure within the mass transfer apparatus to encourage reaching an equilibrium condition within the mass transfer apparatus and provide for consistent gas absorption into the liquid. | 2012-04-26 |
20120098149 | METHOD OF CONTROLLING SOLUBILITY OF ADDITIVES AT AND NEAR GRAIN BOUNDARIES, AND METHOD OF MANUFACTURING SINTERED NUCLEAR FUEL PELLET HAVING LARGE GRAIN SIZE USING THE SAME - Provided are a method of controlling the compositional gradient and solubility of doped-additives at grain boundaries during sintering of a uranium-based oxide green pellet including the additives, and a method of manufacturing a sintered nuclear fuel pellet having a large grain size using the same. The grain boundary solubility of the doped-additives is maintained at a certain level by stepwise varying of an oxygen partial pressure during isothermal sintering of a uranium-based oxide green pellet including the additives. The method of manufacturing a sintered nuclear fuel pellet having a large grain size includes preparing additive mixed uranium oxide powder, forming an additive mixed uranium oxide green pellet using the mixed powder, heating the green pellet to a sintering temperature in a gas atmosphere having a low oxygen partial pressure, and sintering while a sintering gas atmosphere is changed to stepwise increase an oxygen partial pressure at the isothermal sintering temperature. | 2012-04-26 |
20120098150 | NANOFIBER MANUFACTURING APPARATUS AND NANOFIBER MANUFACTURING METHOD - In a nanofiber manufacturing apparatus ( | 2012-04-26 |
20120098151 | METHOD FOR PELLETING SPHERICAL FINE PARTICLE OF SODIUM NITRATE - Provided is a method for pelleting spherical fine particle of sodium nitrate, which comprises the following steps: 1) melting industrial sodium nitrate in a salt melting furnace, introducing into a high-level insulation buffer tank, placing in an atomizer located on top of the pelleting tower, atomizing to obtain fog droplets with size of 30 μm-0.5 mm; 2) introducing freeze-dried high-pressure air into the pelleting tower in a tangent direction from the upper inlet pipe of the tower, so that the sodium nitrate fog droplets obtained in step 1) fall spirally along the wall in the pelleting tower, to obtain sodium nitrate particle; 3) collecting the cooled sodium nitrate particle at the bottom of the tower, and packaging. Sodium nitrate particle with lower water content, higher roundness, and smaller size can be obtained, and continuous production can be realized by the method. | 2012-04-26 |
20120098152 | POROUS MATERIAL HAVING ANISOTROPIC STRUCTURE AND METHOD OF MAKING THE SAME - A method of forming an anisotropic porous material includes forming an aerogel precursor, the aerogel precursor including a matrix material and a liquid dispersion medium for dispersing the matrix material. The aerogel precursor is frozen so that the dispersion is solidified while controlling the direction of crystal growth within the aerogel precursor. The aerogel precursor is freeze dried to sublime the dispersion medium and form the porous material. | 2012-04-26 |
20120098153 | PLANT AND METHOD FOR THE CONTINUOUS PRODUCTION OF PREFORMS - A plant for the continuous production of preforms for plastic containers using at least polyester recyclate for the filling of foodstuffs, having at least one melt-producing upstream plant section, at least one preform producing injection molding plant section, and a plant control system, where at least the melt-producing upstream plant section and the injection molding plant section are interlocked at an interface to form a plant block. For the derivation of process alteration strategies and/or preform qualifying strategies, an inline measurement station including an evaluating device is provided at the interface for at least one quality parameter of the melt measured in the process flow. | 2012-04-26 |
20120098154 | SEMI-CONTINUITY FIBER PREPREG MATERIAL, MANUFACTURING METHOD THEREOF, AND COMPOSITE MATERIAL MADE OF SEMI-CONTINUITY FIBER PREPREG MATERIAL - The invention provides a semi-continuity fiber prepreg material, a manufacturing method thereof, and a composite material made of the semi-continuity fiber prepreg material. The semi-continuity fiber prepreg material includes a plurality of intermittency notches and/or continuity notches formed on a fiber prepreg material along at least one direction to make the fiber prepreg material soft and suitable for molding. | 2012-04-26 |
20120098155 | CURVED STRUCTURAL PART MADE OF COMPOSITE MATERIAL AND A PROCESS FOR MANUFACTURING SUCH A PART - A process for manufacturing a curved structural part includes fabricating a mold of the curved structural part having at least two faces that form a male mold section between a minimum radius of curvature of the curved structural part and another radius of curvature belonging to one of the two faces, preparing a stack of multidirectional fibers of one or more fiber plies oriented ±α or 90° in relation to a longitudinal direction of the curved structural part, cutting a first multidirectional strip in the stack extending longitudinally and having a width at least equal to a maximum width of the curved structural part, applying the first multidirectional strip over the mold to gradually conform the first multidirectional strip to the mold, applying the first multidirectional strip on the face having the minimum radius of curvature, and pressing and tightening the first multidirectional strip over the other faces. | 2012-04-26 |
20120098156 | EXTRUSION DIE ELEMENT, EXTRUSION DIE AND METHOD FOR MAKING MULTIPLE STRIPE EXTRUDATE FROM MULTILAYER EXTRUDATE - An extrudate rotator die element, ( | 2012-04-26 |
20120098157 | METHOD AND COMPOSITION OF BINDER FOR MANUFACTURING SAND MOLDS AND/OR CORES FOR FOUNDRIES - A binder for the production of sand cores and/or molds for foundries that comprises mixing sand with an alkyl silicate, preferably tetraethyl silicate; an aqueous solution of an alkali metal silicate, preferably sodium silicate, which solution also contains an alkali metal hydroxide, preferably sodium hydroxide, is added to the mixture, and finally all of the above is mixed until the sand shows a homogeneous aspect and constitution. Another aspect of the invention comprises a method of manufacturing sand molds for foundries that comprises mixing foundry sand with the present invention binder, blowing the sand mixed with the binder, having still between 0.5% to 2.5% of water, into a cold box by means of air that is at room temperature, and once the cold box mold has been filled with the sand, passing a hot air current through the sand to dry and harden the binder thus obtaining the molds for foundry. | 2012-04-26 |
20120098158 | PROCESS FOR ENHANCING COMPRESSION SET RESISTANCE OF FOAMED COPOLYESTER COMPOSITIONS - Disclosed herein is a process for heat treating a foamed copolyester thermoplastic sheet structure in order to achieve a sheet structure having a compression set resistance (as determined according to ISO 1856, 22 hours, 70° C., 30% compression) of less than 11%. Heat treating involves annealing followed by at least two cycles of pre-compression at approximately the annealing temperature. | 2012-04-26 |
20120098159 | METHOD FOR PRODUCING PLASTIC CONTAINERS AND/OR PLASTIC PREFORMS - The invention comprises a method for producing plastic containers and/or plastic preforms by means of an injection moulding machine, comprising the steps of: providing plastic recyclate and new plastic material, heating the plastic recyclate, and heating the new plastic material using at least a part of the heat contained in the heated plastic recyclate. | 2012-04-26 |
20120098160 | PROCESS FOR PRODUCING RESIN MOLDED ARTICLE - A process for producing a resin molded article, comprising steps of (1) plasticizing a resin composition containing an organic fiber and a thermoplastic resin with an injection-molding machine, (2) injecting the plasticized resin composition into a mold cavity of the injection-molding machine, and (3) pressure-holding against the resin composition in the mold cavity for a pressure-holding time of 0.5 to 60 seconds under holding-pressure of 70 to 300 MPa. | 2012-04-26 |
20120098161 | FELT FOR FORMING FIBER CEMENT ARTICLES WITH BASE FABRIC WITH PARALLEL MD YARNS - A method of forming a fiber cement article includes the steps of: (a) providing a fiber cement felt, the fiber cement felt comprising a base fabric layer that includes a set of parallel machine direction (MD) yarns; (b) depositing a fiber cement slurry on the fiber cement felt; (c) removing moisture from the slurry; and (d) transferring slurry from the felt to a forming structure. | 2012-04-26 |
20120098162 | RAPID HOT PRESSING USING AN INDUCTIVE HEATER - A rapid hot press (RHP) method and system in which heat is supplied by RF induction to rapidly consolidate a material is described. Use of RF induction heating enables rapid heating and consolidation of powdered materials over a wide temperature range. Details of an exemplary system, instrumentation and performance using a thermoelectric material as an example are disclosed. The novel technique may be applied to any known sinterable materials. Notable applicable materials include thermoelectric materials, such as PbTe. An exemplary thermoelectric PbTe material may be pressed at an optimized temperature and time according to the technique to be consolidated under typical parameters and yield suitable properties of Seebeck coefficient, electrical resistivity, and thermal diffusivity. | 2012-04-26 |
20120098163 | CONTINUOUS PROCESS ASSISTED BY ULTRASOUND OF VARIABLE FREQUENCY AND AMPLITUDE FOR THE PREPARATION OF NANOCOMPOSITES BASED ON POLYMERS AND NANOPARTICLES - The invention relates to a continuous mixing/extrusion method, assisted by ultrasound waves with a variable amplitude and frequency, for the preparation of nanocompounds based on polymers, preferably thermoplastics and nanoparticles, at a concentration of up to 60 wt.-% of the total weight of the polymer/nanoparticle mixture. According to the invention, the polymer/nanoparticle mixture is subjected in the molten state to a discrete and continuous sweep with a variable amplitude and frequency, of between 15 kHz and 50 kHz. | 2012-04-26 |
20120098164 | TWO-PHOTON STEREOLITHOGRAPHY USING PHOTOCURABLE COMPOSITIONS - Two-photon stereolithography can be performed using a photocurable material comprising a poly(meth)acrylate having a (meth)acrylate functionality of at least 3 and a molecular weight (MW) of at least 650, a urethane(meth)acrylate having a (meth)acrylate functionality of 2 to 4 and a MW of 400 to 10,000, a di(meth)acrylate made from bisphenol A or bisphenol F; and a photoinitiator. A beam of light is focused to a focus region of the material to induce two-photon absorption in the focus region, and thus polymerization of the material in the focus region. The beam is scanned across said material according to a pre-selected pattern so that the beam is focused to different pre-selected regions, to induce polymerization of the material at the pre-selected regions. | 2012-04-26 |
20120098165 | METHOD AND DEVICE FOR BLOW-MOLDING CONTAINERS - The invention relates to a method and a device for blow-molding containers. Following thermal conditioning inside a blow-mold of a blow-molding machine, a preform ( | 2012-04-26 |
20120098166 | Mould Carrier and Stretching Carriage Valve - A stretch blow moulding machine may include a blow moulding unit, having at least a first and a second mould carrier for receiving at least one mould part, which can be moved relative to one another, connected to one another to form a first working space for receiving the containers, and detached from one another to release the containers. A second working space may be formed between at least one mould part and at least the first mould carrier. A fluid communication system can feed a working fluid to the first and second spaces. At least one valve device for intermittent complete disconnection of fluid communication between at least one of the working spaces and the fluid system is arranged such that pressure of the working fluid within the fluid system is independent of changes in the state of the second space when the fluid communication is disconnected. | 2012-04-26 |
20120098167 | METHOD OF TREATING A HOT FILLED PLASTIC THIN WALLED CONTAINER AND ASSOCIATED DEVICE - A process for treatment of a thin-walled plastic container, the container having residual stresses resulting from its manufacture from a preform, which has been hot-filled and stoppered with liquid contents and then cooled once filled and stoppered, and being designed to undergo stress relief by a heat treatment, characterized in that it includes a stage prior to that of the heat treatment that consists in exerting mechanical force on the external surface of the thin wall of the container that is deformed by the hot filling to generate an interior pressure so as to compensate for at least the underpressure to which it is subjected and to restore its initial shape to it. An associated device for the implementation of the process is also described. | 2012-04-26 |
20120098168 | METHOD OF MANUFACTURING SINTERED SILVER ALLOY BODY AND COPPER OXIDE-CONTAINING CLAY-LIKE COMPOSITION - A method of manufacturing a sintered silver alloy body of the present invention includes steps of adding copper oxide to a silver-containing clay-like composition that contains silver-containing metal powder containing silver, a binder, and water to manufacture a clay-like composition for forming a sintered silver alloy body; making an object by making the clay-like composition for forming a sintered silver alloy body into an arbitrary shape; and baking the object in a reduction atmosphere or a non-oxidizing atmosphere after the object is dried. | 2012-04-26 |
20120098169 | PROCESS FOR MANUFACTURING HIGH DENSITY SLIP-CAST FUSED SILICA BODIES - Fused silica ceramics plays demanding role in high velocity missile/aircraft'radome development. Slip casting is the most common and commercially viable process utilized for radome production. Unfortunately slip casting cannot afford high density due to its poor green packing density which in turn results in poor rain erosion resistance. Present invention discloses process for preparing high density fused silica bodies by adding boron oxide (B | 2012-04-26 |
20120098170 | PRODUCTION METHOD FOR A TRULY SPHERICAL CERAMIC BALL BY MEANS OF A ROTATIONAL METHOD, AND A DEVICE THEREFOR - The present invention relates to a production method for a truly spherical ceramic ball by means of a rotational method, and to a device therefor. More specifically, a method is disclosed which uses seeds to facilitate formation of ceramic balls into a spherical shape and repeats heating and cooling or grades ceramic balls according to size to form ceramic balls having a similar size during the formation process, thereby increasing strength of the ceramic balls while ensuring excellent particle size distribution. Also, an apparatus for producing ceramic balls using a rotation manner is disclosed. | 2012-04-26 |
20120098171 | COOLING TANK FOR RAILS - A cooling tank for the thermal treatment of the head of rails, whose frame allows obtaining a stable and on average uniform flow of the cooling fluid which touches the head of the immersed rail along the entire tank, with the continuous exchange of the fluid so as to optimize the cooling speed of the head of the rail. | 2012-04-26 |
20120098172 | GAS SPRING CONTROL SYSTEM AND METHOD - A vehicle suspension system includes a pump, a gas spring, and an accumulator. The suspension system also includes a controller for adjusting the suspension system. The controller has a processing circuit configured to receive a measure of gas in the spring. The processing circuit is further configured to calculate a difference between a target value and a current value based on the received measure of gas. The processing circuit is also configured to provide an output for adjusting the gas in the spring in response to the calculated difference. | 2012-04-26 |
20120098173 | Rebound Control Enhancement For Air Springs - An air spring including a piston, and a flexible sleeve connected to the piston. The flexible sleeve forms a compression chamber and includes a lobe that rolls along a surface of the piston during compression of the flexible sleeve. The flexible sleeve is connected to the piston by an inverted crimp connection. A crimp ring used providing the inverted crimp connection includes a rebound travel limiter around which the lobe is formed. | 2012-04-26 |
20120098174 | WEIGHT COMPENSATING SHOCK ISOLATOR ASSEMBLY - A weight compensating shock isolator assembly includes at least one spring with preload to return the isolator to an initial position, the at least one spring exerting a spring force that changes during the isolator stroke. The isolator includes a hydraulic cylinder containing hydraulic fluid and a piston that moves relative to the hydraulic cylinder, wherein hydraulic fluid is forced through or around a piston head during relative movement thereof with respect to the hydraulic cylinder to create a resisting force that is stroke and velocity dependent, with the damping constant C changing with stroke. | 2012-04-26 |
20120098175 | BICYCLE SEAT POST - A seat post is disclosed. The seat post includes a pneumatic cylinder, a hollow pneumatic piston, a gap, a seal, a hydraulic cylinder, a hollow hydraulic piston, and a valve. The gap exists between the pneumatic cylinder and the pneumatic piston and communicates with the inside of the pneumatic piston. The seal is disposed at the pneumatic cylinder for sealing the gap. The hydraulic cylinder is disposed in the pneumatic piston and communicates with the inside of the pneumatic piston. One end of the hydraulic piston passes through pneumatic piston and is inserted into the hydraulic cylinder. The other end is disposed in the pneumatic cylinder and communicates with the inside of the pneumatic cylinder. The valve connects the pneumatic piston and the hydraulic cylinder for opening or closing the communication between the pneumatic piston and the hydraulic cylinder. | 2012-04-26 |
20120098176 | FLUID-FILLED CYLINDRICAL VIBRATION-DAMPING DEVICE - A fluid-filled cylindrical vibration-damping device including: a main rubber elastic body elastically connecting an inner shaft member and an outer cylindrical member; a pair of first fluid chambers opposed to each other in a first diametric direction with the inner shaft member being interposed therebetween; and a pair of second fluid chambers opposed to each other in a second diametric direction orthogonal to the first diametric direction. Each partition wall that circumferentially partition the first fluid chambers and the second fluid chambers respectively extend between the inner shaft member and the outer cylindrical member in a direction in more proximity to the second diametric direction than to the first diametric direction. The main rubber elastic body is provided with a hollow portion so that at least a part of the wall of the second fluid chamber is defined by a thin-walled flexible film. | 2012-04-26 |
20120098177 | VIBRATION REDUCTION DEVICE - A vibration reduction device includes: a rod rigid body supported between an engine and a vehicle body via respective elastic bodies, a resonance frequency of which is set to be lower than an engine rigid body resonance frequency; an elastic component that is provided on the rod rigid body and caused to deform by a force acting in an axial direction of the rod rigid body; an inertial mass supported by the elastic component; and an actuator that causes the inertial mass to reciprocate in the axial direction of the rod rigid body by generating a force that is proportionate to an axial direction velocity of the rod rigid body. As a result, resonance itself can be suppressed without reducing a double vibration proofing effect. | 2012-04-26 |
20120098178 | MEMBER MOUNT AND ASSEMBLY STRUCTURE THEREOF - A member mount has an inner tubular member, an outer tubular member, and a rubber elastic body connecting the tubular members. An inner peripheral resin layer having an inner hole as a positional hole is layered on an internal peripheral surface of the inner tubular member and an outer peripheral resin layer is layered on an outer peripheral surface thereof. The resin layers are connected to each other in resin connection portions in connection holes passing through the inner tubular member in four positions in the circumferential direction at equal distances. | 2012-04-26 |
20120098179 | Multi-Canted Coils, Tubes, and Structures - Coil, tube, and other structures configured with a plurality of individual coils, internal structures, legs or extensions with each having multiple cants per coil, internal structure, leg or extension, and wherein the cants formed therein allow for a load-deflection force when each is compressed. In addition, any horizontal or moment forces are substantially reduced and/or eliminated when a downward vertical force is applied, as minimal or no torsion is created in the individual coils, legs or extensions. | 2012-04-26 |
20120098180 | CLAMP DEVICE - A clamp device has a gripping member which is expandable and contractible and is inserted into an aperture in a workpiece and grips the aperture, a clamp rod including a tapered shaft portion that fits into the gripping member, and a drive means for driving the clamp rod forwards and backwards. Provided is a support mechanism that supports the gripping member by fluid pressure when the gripping member is radially expanded, and a fluid pressure release means that releases the fluid pressure of the support mechanism after radial expansion of the gripping member when the clamp rod is driven by the drive means to perform clamping. The support mechanism has an annular pressure reception member that supports the gripping member, and a supporting fluid chamber that causes fluid pressure in the direction opposite to the clamping direction to be received on the annular pressure reception member. | 2012-04-26 |
20120098181 | LOADING CONTAINER FOR A WASHING MACHINE - A loading container ( | 2012-04-26 |
20120098182 | QUICK RELEASE STRUCTURE OF WOODWORKING CLAMP - A quick release structure of a woodworking clamp includes a clamp body, a transverse rod and a fixed chuck. The clamp body has a movable chuck and a trigger for activating the sliding of the clamp body along the transverse rod. A fixing rod passes through a fixing hole to thereby fix the fixed chuck to the transverse rod. One end of the fixing rod has two positioning portions. The fixed chuck has an accommodating portion. Both sides of the accommodating portion have a pivoting member respectively for pivotally connecting to a quick release element. The outer surface of the quick release element has a pressing portion having elongate holes on its two opposite side walls for allowing the positioning portions of the fixing rod to be engaged therein. By this structure, the fixed chuck can be detached from or assembled with the movable chuck easily. | 2012-04-26 |
20120098183 | UNIVERSAL FENCE ASSEMBLIES FOR POWER TOOL TABLES HAVING MULTI-POSITION STOP ASSEMBLIES - A fence assembly includes a fence body having front and rear faces that define a width and top and bottom faces that define a height of the fence body. The fence assembly includes at least one stop assembly, each stop assembly including a stop arm that is moveable from a first position in which the arm overlies one of the faces of the fence body and a second position in which the arm extends away from one of the faces. The fence body has a high-profile position in which the front and rear faces are perpendicular to a table and a low-profile position in which the front and rear faces are parallel with the table. The stop arm overlies one of the front and rear faces when the fence body is in the high-profile position and one of the top and bottom faces when the fence body is in the low-profile position. | 2012-04-26 |
20120098184 | SYSTEM AND METHOD FOR INLINE CUTTING AND STACKING OF SHEETS FOR FORMATION OF BOOKS - This invention provides a system and method for aligning, feeding, trimming, slitting, rotating, cross-slitting and stacking sheets, each containing one or more discrete page images thereon that allows for greater automation of the overall process so that reduced or no manual intervention is required to generate completed book stacks or “blocks” from a stream or stack of printed sheets. Sheets are fed to a first, upstream trimming station to remove margin edges and optionally separate the sheets relative to the discrete page images. The sheets are then rotated 90 degrees and fed to a second, downstream trimming station that trims the right-angle edges and optionally separates the sheets into a final group of full-bleed pages, removing margins and gutter strips. The sheets are fed to a stacking assembly to be tacked in page order and any rejected, defective sheets or stacks are removed from the order. | 2012-04-26 |
20120098185 | SHEET FEED DEVICE FEEDING PAPER AND IMAGE FORMING APPARATUS - A sheet feed device feeding paper including; a loading platen loaded with sheets; a ventilation section providing a first ventilation port for blowing air to float a first side of a sheet of one sheet of the sheets loaded on the loading platen, and a second ventilation port for blowing air to float a second side opposed to the first side; and a control section for controlling the ventilation section; wherein the first side is a side of a topmost of loaded envelopes, the side of which height is lower than other sides, and when envelopes are to be fed, the control section controls the ventilation section to change air volume of the first ventilation port and the second ventilation port so as to float the first side more greatly than in case when sheets other than envelopes are fed. | 2012-04-26 |
20120098186 | PAPER PICKUP STRUCTURE OF PAPER FEEDING DEVICE - A paper pickup structure of a paper feeding device is provided. The paper pickup structure includes: a rotating arm, including a connection portion, a base, and a combination member, in which the connection portion and the combination member are located on the base; a first gear, combined with the connection portion to be switched between a forward rotation state and a reverse rotation state, so as to drive the rotating arm to rotate; a limiting member, located on the rotating arm, in which one end of the limiting member is combined with the combination member of the rotating arm, or one end of the limiting member is separated from the combination member through the rotation of the rotating arm; a second gear, located on the base; and a third gear, driven by the second gear to rotate when the rotating arm rotates to a predetermined position. | 2012-04-26 |
20120098187 | Image reading apparatus and image forming apparatus - In an image reading apparatus, the linear coefficients of expansion of conveyance drive rollers and a linear coefficient of expansion of the holding unit are determined such that the amount of change in the outer diameter of each of the conveyance drive rollers due to a change in temperature environment is substantially the same as the amount of change in the interval between the first reading unit and the second reading unit due to a change in the temperature environment. The conveyance drive rollers are attached to a rotary shaft such that the positions of head portions of screws are alternately located along the axis direction of the rotary shaft on opposite sides of the outer circumference surface in a direction perpendicular to the axis direction of the rotary shaft. | 2012-04-26 |
20120098188 | PAPER DISCHARGE DEVICE OF IMAGE FORMING APPARATUS - According to one embodiment, a paper discharge device includes a discharged-sheet receiving part that can be opened and closed on a side surface of an apparatus body, is closed on the side surface and receives a recording medium dropped from above along the side surface after image formation. | 2012-04-26 |
20120098189 | APPARATUS FOR STRAPPING STACKS OF SHEET DOCUMENTS, APPARATUS FOR FORMING STACKS OF SHEET DOCUMENTS AND CORRESPONDING METHODS - A strapping apparatus ( | 2012-04-26 |
20120098190 | SHEET CONVEYANCE APPARATUS AND PRINTING APPARATUS - A sheet conveyance apparatus includes: a guide unit for guiding the side end of the sheet; a first roller pair arranged on the downstream side of the guide unit for conveying the sheet, including a driven roller held in contact with a whole sheet in a sheet width direction; and a second roller pair having a conveyance roller arranged on the downstream side of the roller and adapted to convey the sheet, and a plurality of pinch rollers pinching the sheet in cooperation with the conveyance roller, wherein each of the plurality of pinch rollers applies to the sheet a conveyance force inclined toward a conveyance path side end, which is nearer to the pinch roller, and wherein the smaller the distance between the pinch roller and the conveyance path side end, the greater the inclination of the conveyance force thereof. | 2012-04-26 |
20120098191 | MEDIUM PRESSURIZING DEVICE AND IMAGE FORMING APPARATUS - A medium pressurizing device includes: two rotating bodies that rotate and allow a recording medium held in a contact part to pass; a pressurizing member that applies, to one of the rotating bodies, a pressure of pressing the one toward the other; a drive roll disposed downstream from the contact part in a conveyance direction, and rotating thereby transmitting a conveyance driving force to the recording medium; and a following roll contacting the drive roll, and rotating by following rotation of the drive roll, thereby conveying the recording medium held therebetween. The device further includes: an axis member rotating by receiving a driving force; and a cam member fixed to the axis member, acting on the pressurizing member, and following rotation of the axis member, thereby changing the pressure. The following roll has a hollow, and the axis member is disposed to pass through a space in the hollow. | 2012-04-26 |
20120098192 | DISCHARGE MECHANISM AND IMAGE-FORMING DEVICE - A discharge mechanism includes: a rotation shaft; a pair of roll members disposed on the rotation shaft at different positions in an axial direction; and a protrusion that protrudes from a section of the rotation shaft sandwiched between the pair of roll members, wherein a distance from a center of the rotation shaft to a tip of the protrusion is smaller than a radius of each of the pair of roll members, and the protrusion includes a projecting part that projects in a direction of rotation of the rotation shaft. | 2012-04-26 |
20120098193 | PUZZLE WITH THREE DIMENSIONAL REPRESENTATION OF GEOGRAPHIC AREA - A puzzle kit for assembly into a three dimensional representation of a geographic region includes first pieces that form a first layer, second pieces that form a second layer on top of the first layer, and structure pieces mounted on the first and/or second layers. The first and second layers can include retaining elements for retaining the structure pieces. The retaining elements can take the form of voids. The first layer can include image elements visible through the voids of the second layer, and the image elements can include indicia to match the voids with the structure pieces. The first pieces can include anchoring pieces that are elevated and interlock with the second layer. The structure pieces can be sequentially assembled on the first and/or second layers according to an index. The assembled puzzle can represent a city, and the structure pieces can represent buildings within the city. | 2012-04-26 |
20120098194 | Methods and Devices for BandHead Fantasy Sports Games - A wristband fantasy sports game or wristband fantasy sports game played along with an optional board or and optional online score and league tracking system. The playing method comprises (a) selecting a wristband game piece which has one athlete on one side and another athlete on the opposite side or underside. In most versions of the game each wristband has an offensive and defensive player of the same team (b) the opposing player selects a wristband game piece of members comprised of the opposing live sports game or event with one athlete named on each side of the band (c) A live, or recorded sports game is played, on a television, mobile device or computer or any other viewing device and the fantasy game ensues | 2012-04-26 |
20120098196 | ADJUSTABLE THREE-DIMENSIONAL MULTI-LEVEL GAME PLAY AREA APPARATUS AND METHOD OF PLAY - A game apparatus having a generally horizontally disposed base unit used to support or contain a plurality of independently hand movable blocks of one or more colors and two or more heights, for use in the playing of board games, such as chess and checkers or any other game utilizing a user modifiable multiple height three dimensional playing area. The rules and or method of play of any such game may be modified with the use of this apparatus due to the independently mobile, multi height, and potentially multi-colored blocks that make up the playing area and create the topography of the board. | 2012-04-26 |
20120098197 | BLACKJACK VARIATION - A method of conducting a wagering game is practiced comprising:
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20120098198 | Blackjack Game with Associated Wagering Game - Providing and conducting a wagering game associated with a Blackjack game, configured for receiving a wager relating to the associated wagering game; generating player and dealer initial Blackjack hands; determining the value of the initial player hand; comparing the initial player hand value with a qualifying preset criteria unless the initial player hand includes a card having more than one possible value in the Blackjack game, wherein the qualifying preset criteria includes at least one specific value; providing a payout if the qualifying preset criteria is satisfied by an initial player hand composed of individual cards of the same value which combine to equal the at least one specific value or the qualifying preset criteria is satisfied by an initial player hand composed of individual cards of different values which combine to equal the at least one specific value and the final Blackjack outcome is a player win. | 2012-04-26 |
20120098199 | Spelling game - A word forming game for plural players, requiring formation of words from letters displayed on dice and cards. The cards may display plural letters, which may be color coded. Players forming a word may be restricted to using letters of one color coding scheme. The successful player must indicate manually such as by picking up a designated object that he or she is prepared to spell a word. Successful spelling results in a point award. A plurality of rounds of forming words is practiced. Cards utilized to spell a word in any one round are discarded and replaced, after which the next round is performed. The dice displaying letters are thrown to modify which letters are displayed for word forming purposes. After a number of rounds, that player having the highest cumulative point total is declared the winner. | 2012-04-26 |
20120098200 | DECK OF PLAYING CARDS AND METHODS OF PLAYING CARD GAMES - Described embodiments relate to a deck of playing cards comprising a plurality of individual playing cards, each of the individual playing cards having a front side and a back side, the front side having displayed thereon a card identifier for identifying an individual playing card, wherein at least two of the individual playing cards display on the front side a selected text portion, wherein the selected text portion of each of the least two cards comprises a different portion of a selected text taken from a literary work, such as song lyrics, poems, plays, nursery rhymes, stories, etc. Some embodiments relate to methods of playing card games using the deck of playing cards. | 2012-04-26 |
20120098201 | System and Method for Generating, Funding, and Distributing Multiple Jackpots - A method and system of generating, funding, and distributing multiple jackpots in a game such as poker, specifically such as Texas Hold 'Em. The jackpots may be separate, independent bad beat jackpots that pay out at different intervals due to having independent triggering conditions that have different odds of occurring. Preferably, the triggering condition for each jackpot may be a losing player's hand strength. The specific values for the triggering conditions may be chosen by random, may be generally evenly distributed over the number of jackpots, may be determined by an algorithm, e.g., one that relies on the odds of each hand occurring, or by another method. The jackpots may be funded from rakes collected from substantially every hand that is played—subject to certain prerequisites being established—such that each jackpot may be considered progressive in that it grows over time. | 2012-04-26 |
20120098202 | TELEVISION/INTERNET GAME SHOW - A method for creating and providing information used in a television game show, where initial user information is obtained from the Internet. Pairs of users register and answer a questionnaire over the Internet to create user profiles for each pair of possible contestants. Pairs of users are selected as contestants provided they match the criteria where one user from one pair is the former spouse of a user from a second pair. The selected contestant pairs compete against each other in a televised broadcast to answer questions of a personal nature related to former spouses, and the winning team is given prizes, such as travel to romantic and/or exotic locales. Sponsors will provide the prizes, and will be given a prominent advertisement that will be posted on the pertinent Internet web site at which the users register and other members of the public can monitor the results of the shows performance. | 2012-04-26 |
20120098203 | ENERGIZING RING NOSE PROFILE AND SEAL ENTRANCE - A wellhead seal assembly that forms a metal-to-metal seal between inner and outer wellhead members. A metal seal ring has inner and outer walls separated by a slot. An elastomeric seal is located below the seal ring and has a bottom portion that contacts an upward facing shoulder of a hanger. An energizing ring with a tapered nose is moved into the slot. The tapered nose has a compound angle that determines how much the nose travels into the slot when a force is applied to the energizing ring. Once the elastomeric seal is compressed to a desired level, the load on the energizing ring has increased to the point that the tapered nose of the energizing ring will further enters the slot and force the outer and inner walls of the metal seal into sealing engagement with the inner and outer wellhead members. | 2012-04-26 |
20120098204 | Seal Assemblies - A seal assembly for providing a seal between a pair of relatively rotatable components has; a first seal ring ( | 2012-04-26 |
20120098205 | SEALING ASSEMBLY FOR A ROLLING BEARING - A sealing assembly for a rolling bearing. The sealing assembly has at least one cover element for covering a bearing gap along a cover plane. The cover element has a securing section, a sealing collar, a base part connecting the securing section and the sealing collar, and at least one sealing surface provided on the sealing collar for non-contact sealing. At a starting section the sealing collar extends from the base part diagonally toward the inner side of the cover element facing the bearing interior and at an end section the sealing collar extends from the inside toward the outer side of the cover element facing away from the bearing interior. At the same time, the sealing collar forms a sealing surface substantially perpendicular to the cover plane and at the end of the end section at least one edge impeding the inflow of impurities into the bearing interior. | 2012-04-26 |
20120098206 | SEAL OIL FEEDING APPARATUS OF ROTATING ELECTRICAL MACHINE - According to one embodiment, a seal oil feeding apparatus includes a hydrogen detraining tank, a float trap tank, and an air detraining tank. The hydrogen detraining tank is configured to collect and reserve seal oil that has flowed out to the inside of a housing from a sealing unit. The float trap tank is provided integrated with the hydrogen detraining tank in horizontally, and is connected to the hydrogen detraining tank, so that the liquid level of the seal oil becomes substantially the same as the height of the hydrogen detraining tank. The float trap tank includes a float valve. The air detraining tank is placed at a position lower than the hydrogen detraining tank and float trap tank, and reserves seal oil that has flowed out from the float valve. | 2012-04-26 |
20120098207 | CROSSLINKABLE ULTRAVIOLET (UV) CURED COATING OVER FLOCK FIBERS FOR IMPROVED PERFORMANCE - A cross-linkable UV curable coating layer disposed over flocked fibers on an automotive component requiring improved squeak and itch resistance and freeze release is provided. The coating layer includes an elongated member having along a pre-determined portion of the member flocked fibers. The elongated member finds application as a weatherstrip or seal. | 2012-04-26 |
20120098208 | Sealign Structure for Fitting Portion - A sealing structure for a fitting portion where an annular member is concentrically fitted to a cylindrical member to be fitted at a cylindrical part of the annular member is disclosed. The sealing structure is characterized by an elastic annular seal layer integrally provided on the backward end part of the annular member or the cylindrical member in fitting direction, by applying elastomeric agent to the backward end part and hardening it, and the elastic annular seal layer is formed such that it has layer thickness of 5 μm to 1 mm and is interposed in a compressed state between the annular member and the cylindrical member when said annular member is fitted to said cylindrical member. | 2012-04-26 |
20120098209 | Sealing Arrangement for a Shaft - A sealing arrangement includes a housing component, a shaft at least partially accommodated by the housing component, and a plurality of sealing elements, which can be moved along the longitudinal axis of the shaft for sealing the intermediate space between the housing component and the shaft. The shaft includes a section that extends in the longitudinal direction of the shaft and has a shaft diameter that is tapered in steps. The sealing elements can be moved from a first position, in which a first sealing element lies against a first step, to further positions, in which additionally at least one further sealing element lies against one further step per sealing element. | 2012-04-26 |
20120098210 | FLAT SEAL HAVING A SOLID BEAD - A metallic flat gasket with a solid bead has at least one metallic layer ( | 2012-04-26 |
20120098211 | SEAL APPARATUS - A seal apparatus including at least first and second adjacent seal segments, each including an elongate body with ends defined at opposing elongate body ends, to be arranged such that an end of the first seal segment joins with a complementary end of the second seal segment, the end of the first seal segment including a first male component protruding from a plane of a first seal surface to define a first female mating section about the first male component, the end of the second seal segment including a second male component protruding from a plane of a second seal surface to define a second female mating section about the second male component, the first and second male components being receivable in the second and first female mating sections, respectively, to form first and second male component overlaps in at least two dimensions. | 2012-04-26 |
20120098212 | DEVICE FOR PREVENTING THE PASSAGE OF GASES AND/OR FLUIDS FROM A WINGBOX INTO A FUSELAGE OF AN AIRCRAFT - The invention relates to a device for preventing gases and/or fluids emanating from a wing box | 2012-04-26 |
20120098213 | EXTREME TEMPERATURE GASKET AND METHOD OF MAKING THE SAME - An extreme temperature gasket material capable of withstanding temperatures in excess of 850° F. is provided. The extreme temperature gasket generally includes an inorganic filler, an inorganic fiber, and an organic binder. In some embodiments, the inorganic filler is from 75 to 90 wt % of the gasket material and can include submicron-sized talc particles. The inorganic fiber can be from 5 to 20 wt % of the gasket material and can include silicic acid fiber. The binder can be a latex emulsion and can be present in the gasket material in the range of from 1 to 5 wt % of the gasket material. The gasket material also can include additives, such as flocculant and defoamer. In some embodiments, the amount of organic material present in the gasket material is limited to less than 5 wt % of the gasket material. | 2012-04-26 |
20120098214 | DEVICE FOR SECURING A TOOL TO A SPINDLE - A tool securing device capable of clamping a tool to a machine spindle as well as assisting in the removal of a tool from a machine spindle, all in a tool-less manner. The tool securing device includes distal means to be releasably gripped by a machine draw bar as well as means to releasably engage a tool. | 2012-04-26 |