17th week of 2021 patent applcation highlights part 52 |
Patent application number | Title | Published |
20210125834 | METHOD FOR MANUFACTURING A GATE TERMINAL OF A HEMT DEVICE, AND HEMT DEVICE | 2021-04-29 |
20210125835 | METHOD FOR REAL TIME MONITORING SEMICONDUCTOR FABRICATION PROCESS | 2021-04-29 |
20210125836 | SELF-ALIGNED DOUBLE PATTERNING | 2021-04-29 |
20210125837 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM | 2021-04-29 |
20210125838 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2021-04-29 |
20210125839 | FLUID SUPPLY DEVICE AND FLUID SUPPLY METHOD | 2021-04-29 |
20210125840 | FLUID SUPPLY DEVICE AND FLUID SUPPLY METHOD | 2021-04-29 |
20210125841 | SUBSTRATE TREATMENT APPARATUS | 2021-04-29 |
20210125842 | Conversion Joint, Integrated Fluid Supply Device Having Said Conversion Joint, and Method for Mounting a Fluid Part | 2021-04-29 |
20210125843 | AIR CONTROL CABINET MODULE AND CLEAN ROOM SYSTEM HAVING THE SAME | 2021-04-29 |
20210125844 | SEMICONDUCTOR PROCESSING APPARATUS AND SEALING DEVICE | 2021-04-29 |
20210125845 | FIXING DEVICE AND METHOD OF MANUFACTURING DISPLAY PANEL | 2021-04-29 |
20210125846 | GAS FLOW GUIDING DEVICE FOR SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF USING THE SAME | 2021-04-29 |
20210125847 | Transfer Head for Transferring Micro Element and Transferring Method of Micro Element | 2021-04-29 |
20210125848 | METHODS AND SYSTEM FOR CLEANING SEMICONDUCTOR WAFERS | 2021-04-29 |
20210125849 | SYSTEMS AND METHODS OF PLACING SUBSTRATES IN SEMICONDUCTOR MANUFACTURING EQUIPMENT | 2021-04-29 |
20210125850 | SYSTEM AND METHOD FOR AUTOMATED WAFER CARRIER HANDLING | 2021-04-29 |
20210125851 | SENSOR-BASED POSITION AND ORIENTATION FEEDBACK OF ROBOT END EFFECTOR WITH RESPECT TO DESTINATION CHAMBER | 2021-04-29 |
20210125852 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE | 2021-04-29 |
20210125853 | SUSCEPTOR FOR SEMICONDUCTOR SUBSTRATE PROCESSING | 2021-04-29 |
20210125854 | SUBSTRATE PROCESSING APPARATUS | 2021-04-29 |
20210125855 | SUPERSTRATE CHUCK, METHOD OF USE, AND METHOD OF MANUFACTURING AN ARTICLE | 2021-04-29 |
20210125856 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-04-29 |
20210125857 | METHOD FOR TRANSFERRING A THIN LAYER USING A FILLED PRECERAMIC POLYMER | 2021-04-29 |
20210125858 | AIR-REPLACED SPACER FOR SELF-ALIGNED CONTACT SCHEME | 2021-04-29 |
20210125859 | Methods for Forming Stacked Layers and Devices Formed Thereof | 2021-04-29 |
20210125860 | SEMICONDUCTOR DEVICE WITH CONTACT PAD AND METHOD OF MAKING | 2021-04-29 |
20210125861 | METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, AND ELECTRONIC SYSTEMS | 2021-04-29 |
20210125862 | SUPER VIA INTEGRATION IN INTEGRATED CIRCUITS | 2021-04-29 |
20210125863 | PLATFORM AND METHOD OF OPERATING FOR INTEGRATED END-TO-END FULLY SELF-ALIGNED INTERCONNECT PROCESS | 2021-04-29 |
20210125864 | METHOD OF FORMING INTERCONNECT FOR SEMICONDUCTOR DEVICE | 2021-04-29 |
20210125865 | Self-Aligned Top Via Formation at Line Ends | 2021-04-29 |
20210125866 | GATE ALIGNED CONTACT AND METHOD TO FABRICATE SAME | 2021-04-29 |
20210125867 | PRODUCTION OF VERY SMALL OR THIN DIES | 2021-04-29 |
20210125868 | CHIP PRODUCTION METHOD, AND, SILICON CHIP | 2021-04-29 |
20210125869 | SINGULATED SUBSTRATES FOR ELECTRONIC PACKAGING AND OTHER APPLICATIONS IN A ROLL FORMAT | 2021-04-29 |
20210125870 | WAFER PROCESSING METHOD | 2021-04-29 |
20210125871 | SYSTEMS AND METHODS FOR PRECISION FABRICATION OF AN ORIFICE WITHIN AN INTEGRATED CIRCUIT | 2021-04-29 |
20210125872 | REDUCING CROSS-WAFER VARIABILITY FOR MINIMUM WIDTH RESISTORS | 2021-04-29 |
20210125873 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2021-04-29 |
20210125874 | Forming Nitrogen-Containing Low-K Gate Spacer | 2021-04-29 |
20210125875 | SEMICONDUCTOR DEVICE AND METHOD | 2021-04-29 |
20210125876 | SEMICONDUCTOR DEVICE | 2021-04-29 |
20210125877 | Semiconductor Device and Method of Manufacture | 2021-04-29 |
20210125878 | SPLIT WELL IMPLANTATION FOR CMOS AND PERIPHERAL DEVICES | 2021-04-29 |
20210125879 | SPLIT WELL IMPLANTATION PROCESSES FOR CMOS AND PERIPHERAL DEVICES | 2021-04-29 |
20210125880 | METHOD OF MONITORING SEMICONDUCTOR PROCESS | 2021-04-29 |
20210125881 | THICKNESS SENSOR FOR CONDUCTIVE FEATURES | 2021-04-29 |
20210125882 | SEMICONDUCTOR PACKAGE | 2021-04-29 |
20210125883 | SEMICONDUCTOR DEVICE | 2021-04-29 |
20210125884 | INTEGRATED CIRCUIT DEVICES AND MANUFACTURING METHODS FOR THE SAME | 2021-04-29 |
20210125885 | PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME | 2021-04-29 |
20210125886 | SEMICONDUCTOR PACKAGE | 2021-04-29 |
20210125887 | SEMICONDUCTOR APPARATUS | 2021-04-29 |
20210125888 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | 2021-04-29 |
20210125889 | SEMICONDUCTOR DEVICE | 2021-04-29 |
20210125890 | DEVICES AND METHODS FOR HEAT DISSIPATION OF SEMICONDUCTOR INTEGRATED CIRCUITS | 2021-04-29 |
20210125891 | SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE INCLUDING THE SEMICONDUCTOR DEVICE | 2021-04-29 |
20210125892 | HEAT SINK AND ASSEMBLY METHOD FOR HEAT SINK | 2021-04-29 |
20210125893 | SEMICONDUCTOR STRUCTURES HAVING REDUCED THERMALLY INDUCED BOW | 2021-04-29 |
20210125894 | TWO-PHASE HEAT TRANSFER DEVICE FOR HEAT DISSIPATION | 2021-04-29 |
20210125895 | METAL-CERAMIC SUBSTRATE COMPRISING A FOIL AS A BOTTOM SUBSTRATE FACE, SAID FOIL BEING SHAPED FOR DIRECT COOLING | 2021-04-29 |
20210125896 | FILLED LIQUID METAL THERMAL INTERFACE MATERIALS | 2021-04-29 |
20210125897 | SOLID STATE THERMOELECTRIC COOLER IN SILICON BACKEND LAYERS FOR FAST COOLING IN TURBO SCENARIOS | 2021-04-29 |
20210125898 | VAPOR CHAMBER | 2021-04-29 |
20210125899 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-MOLD COOLING CHANNEL FORMED IN ENCAPSULANT | 2021-04-29 |
20210125900 | Through-Substrate Vias with Improved Connections | 2021-04-29 |
20210125901 | SEMICONDUCTOR DEVICE WITH EMBEDDED FLEXIBLE CIRCUIT | 2021-04-29 |
20210125902 | SEMICONDUCTOR DEVICE WITH METAL DIE ATTACH TO SUBSTRATE WITH MULTI-SIZE CAVITY | 2021-04-29 |
20210125903 | SEMICONDUCTOR POWER MODULE | 2021-04-29 |
20210125904 | SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS | 2021-04-29 |
20210125905 | WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-04-29 |
20210125906 | METAL ON MOLD COMPOUND IN FAN-OUT WAFER-LEVEL PACKAGING OF INTEGRATED CIRCUITS | 2021-04-29 |
20210125907 | SEMICONDUCTOR DEVICE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | 2021-04-29 |
20210125908 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-04-29 |
20210125909 | SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME | 2021-04-29 |
20210125910 | SEMICONDUCTOR STRUCTURE | 2021-04-29 |
20210125911 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-04-29 |
20210125912 | MINIMIZING PACKAGE IMPEDANCE DISCONTINUITY THROUGH DIELECTRIC STRUCTURE OPTIMIZATIONS | 2021-04-29 |
20210125913 | FLEXIBLE CIRCUIT FILM AND DISPLAY APPARATUS HAVING SAME | 2021-04-29 |
20210125914 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2021-04-29 |
20210125915 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2021-04-29 |
20210125916 | SEMICONDUCTOR MODULE | 2021-04-29 |
20210125917 | INTEGRATED CIRCUIT WITH CELLS HAVING METAL LAYER CONFIGURED BASED ON DIRECTIONS FROM WHICH INTERCELL METAL INTERCONNECTS CONNECTS TO THE METAL LAYER | 2021-04-29 |
20210125918 | WAFER LEVEL STACKED STRUCTURES HAVING INTEGRATED PASSIVE FEATURES | 2021-04-29 |
20210125919 | Memory Arrays And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells | 2021-04-29 |
20210125920 | Memory Arrays And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells | 2021-04-29 |
20210125921 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2021-04-29 |
20210125922 | DUMMY FILL STRUCTURES | 2021-04-29 |
20210125923 | Passive Devices in Package-on-Package Structures and Methods for Forming the Same | 2021-04-29 |
20210125924 | GRADUAL BREAKDOWN MEMORY CELL HAVING MULTIPLE DIFFERENT DIELECTRICS | 2021-04-29 |
20210125925 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2021-04-29 |
20210125926 | INTEGRATED CIRCUIT WITH CIRCUIT CELLS HAVING LOWER INTERCELL ROUTING METAL LAYERS | 2021-04-29 |
20210125927 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUG CONNECTED TO GATE STRUCTURE ON PMOS REGION | 2021-04-29 |
20210125928 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE INCLUDING A THROUGH-VIA STRUCTURE HAVING A VIA LINER HAVING PROTRUDING PORTIONS | 2021-04-29 |
20210125929 | INTERCONNECT STRUCTURE AND ELECTRONIC APPARATUS INCLUDING THE SAME | 2021-04-29 |
20210125930 | SEMICONDUCTOR MEMORY DEVICE AND APPARATUS INCLUDING THE SAME | 2021-04-29 |
20210125931 | MICROELECTRONIC PACKAGE WITH MOLD-INTEGRATED COMPONENTS | 2021-04-29 |
20210125932 | HYBRID CORE SUBSTRATE ARCHITECTURE FOR HIGH SPEED SIGNALING AND FLI/SLI RELIABILITY AND ITS MAKING | 2021-04-29 |
20210125933 | Semiconductor Packages and Method of Manufacture | 2021-04-29 |