18th week of 2015 patent applcation highlights part 33 |
Patent application number | Title | Published |
20150116895 | CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE, MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME, AND MANUFACTURING METHOD THEREOF - There are provided a conductive paste composition for an external electrode, a multilayer ceramic electronic component using the same, and a manufacturing method thereof, and more specifically, a conductive paste composition for an external electrode, allowing for decreased blister and glass beading defects by improving a removal of residual carbon at low temperature before necking between metal particles is generated and the metal particles are densified during a firing process of the external electrode, a multilayer ceramic electronic component using the same, and a manufacturing method thereof. | 2015-04-30 |
20150116896 | MONOLITHIC CERAMIC CAPACITOR - A monolithic ceramic capacitor includes an element body including a multilayer portion including a plural conductor layers and plural ceramic dielectric layers alternately stacked in a thickness direction. The element body is divided in the thickness direction into thickness-direction first and outer layer portions made of the ceramic dielectric layers, and a thickness-direction inner layer portion including the multilayer portion. The element body bulges to the outer side at a center portion in a length direction, and center portions in the length direction of the plural conductor layers are curved to the outer side. The thickness of a portion of the first outer layer portion adjacent to a first extension portion is larger than the thickness of a center portion thereof, and the thickness of a portion of the second outer layer portion adjacent to a second extension portion is larger than the thickness of a center portion thereof. | 2015-04-30 |
20150116897 | ELECTRONIC COMPONENT - In an electronic component, a first terminal electrode is disposed on a first side surface and extends to a second principal surface. A second terminal electrode is disposed on a second side surface and extends to the second principal surface. A third terminal electrode is disposed on a third side surface and extends to the second principal surface. A fourth terminal electrode is disposed on a fourth side surface and extends to the second principal surface. Maximum values of thicknesses of portions located on the second principal surface of the third and fourth terminal electrodes are smaller than maximum values of thicknesses of portions located on the second principal surface of the first and second terminal electrodes. | 2015-04-30 |
20150116898 | MONOLITHIC CERAMIC CAPACITOR - A monolithic ceramic capacitor includes an element body having therein a multilayer portion formed of a plurality of conductor layers and a plurality of ceramic dielectric layers alternately stacked in a thickness direction; and a first outer electrode and a second outer electrode provided on an outer portion of the element body. The element body is divided in the thickness direction into a thickness-direction first outer layer portion, a thickness-direction second outer layer portion, and a thickness-direction inner layer portion located between the thickness-direction first outer layer portion and the thickness-direction second outer layer portion and including the multilayer portion. A first conductor layer and a second conductor layer, which are outermost layers among the plurality of conductor layers, have lower conductor densities than any of conductor densities of the other conductor layers. | 2015-04-30 |
20150116899 | ELECTRONIC COMPONENT - An electronic component has dimensions (length×width×thickness) of about 0.6 mm to about 1.0 mm×about 0.3 mm to about 0.5 mm×about 0.07 mm to about 0.15 mm. An area of a triangle defined by a first hypothetical straight line being in contact with the top of a portion of an outer electrode positioned on a first main surface at a center in the width direction and extending in the length direction, a second hypothetical straight line being in contact with the top of a portion of the outer electrode positioned on the first end surface at the center in the width direction and extending in the thickness direction, and a third hypothetical straight line being in contact with the outer electrode at the center in the width direction and being inclined at about 45° with respect to the first and second hypothetical straight lines is about 450 μm | 2015-04-30 |
20150116900 | LAMINATED ELECTRONIC COMPONENT MANUFACTURING METHOD, AND LAMINATED ELECTRONIC COMPONENT - In a method of manufacturing a laminated electronic component, a position of a second green sheet with respect to a first green sheet is determined such that an overall width of a first portion printed on the first green sheet and a second portion printed on the second green sheet becomes substantially equal to a width of the first portion or a width of the second portion. | 2015-04-30 |
20150116901 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a first fired electrode layer disposed on top of a ceramic body. The first fired electrode layer includes first to fifth portions that are separate from each other. The first portion is disposed on top of a first end surface. The second portion is disposed on top of a first principal surface. The third portion is disposed on top of a second principal surface. The fourth portion is disposed on top of a first side surface. The fifth portion is disposed on top of a second side surface. | 2015-04-30 |
20150116902 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOTHER CERAMIC MULTILAYER BODY - A multilayer ceramic electronic component includes a ceramic body, first and second outer electrodes, and a plurality of first and second inner electrodes opposing each other across ceramic layers in a lamination direction of the ceramic body. At least two inner electrodes among the plurality of first and second inner electrodes include bent portions on lead-out regions as portions on which the plurality of first inner electrodes and the plurality of second inner electrodes do not oppose each other across the ceramic layers in the lamination direction, and vertexes of the bent portions of the inner electrodes adjacent in the lamination direction are at different positions in a lead-out direction. | 2015-04-30 |
20150116903 | COMPOSITE SHEET, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING THE MULTILAYER CERAMIC ELECTRONIC COMPONENT - A composite sheet includes a ceramic green sheet having a lengthwise direction and a conductor film printed on the ceramic green sheet. The conductor film has a shape that has a longitudinal dimension extending in the lengthwise direction and a lateral dimension perpendicular or substantially perpendicular to the longitudinal direction. The conductor film includes a plurality of thickness-varied regions arranged in a row or a plurality of rows extending in the lengthwise direction while being dispersed in the lengthwise direction. The thickness-varied regions have a thickness that is different from a thickness of a portion of the conductor film excluding the thickness-varied regions. | 2015-04-30 |
20150116904 | FILM CAPACITOR - A film capacitor includes a first electrode layer, a second electrode layer, and a dielectric film disposed between the first and second electrode layers. The dielectric film mainly contains a styrene polymer having a syndiotactic structure. The first electrode layer includes first small electrode segments and a first fuse which interconnects the first small electrode segments. A value obtained by dividing an area of each of the plurality of first small electrode segments by the third power of a thickness of the dielectric film is not smaller than 0.4×10 | 2015-04-30 |
20150116905 | ULTRACAPACITOR WITH IMPROVED AGING PERFORMANCE - An energy storage device such as an electric double layer capacitor has positive and negative electrodes, each including a blend of respective first and second activated carbon materials having distinct pore size distributions. The blend (mixture) of first and second activated carbon materials may be equal in each electrode. | 2015-04-30 |
20150116906 | TWO-DIMENSIONAL TRANSITION METAL DICHALCOGENIDE SHEETS AND METHODS OF PREPARATION AND USE - Methods of forming two-dimensional transition metal dichalcogenide sheets are provided. The methods include adding a cross-linking agent to an activating agent to form a solution and mixing a two-dimensional transition metal dichalcogenide with the solution to form a mixture. The methods also include adding a cleaving agent to the mixture to form one or more contiguous sheets of transition metal dichalcogenide. | 2015-04-30 |
20150116907 | CAPACITOR - A capacitor includes a capacitor element and an electrolyte containing a lactone compound. At least one of a positive electrode and a negative electrode of the capacitor element contains activated carbon Entire surface functional group amount D (meq/g/nm | 2015-04-30 |
20150116908 | NANOFEATURED ELECTRODES AND ENERGY STORAGE COAXIAL CABLES THEREFROM - A method of fabricating electrodes having protruding nanofeatures includes growing metal oxide nanofeatures on a metal or metal alloy wire using a heat treatment in an oxidizing environment. An electrically conducting material is deposited on the nanofeatures to form coated nanofeatures. An electrochemically active material (active material) is deposited to form a coating onto the coated nanofeatures to form at least one nanofeatured electrode. An energy storage coaxial cable (ESCC) can be formed from a first nanofeatured electrode and a second nanofeatured electrode, wherein the first nanofeatured electrode is configured as a linear electrode and the second nanofeatured electrode is configured as a tubular electrode, and the ESCC includes an ion porous separator and an electrolyte between the first nanofeatured electrode as an inner electrode and the second nanofeatured electrode as an outer electrode. | 2015-04-30 |
20150116909 | TANTALUM CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a tantalum capacitor including: a capacitor body containing tantalum powder and having a tantalum wire exposed to one end thereof; a positive electrode lead frame including a positive electrode terminal part and a positive electrode connection part formed by upwardly bending a portion of the positive electrode terminal part from the outside toward the inside and connected to the tantalum wire; a negative electrode lead frame having the capacitor body mounted thereon; and a molded part formed to enclose the capacitor body while exposing a lower surface of the positive electrode terminal part of the positive electrode lead frame and a lower surface of the negative electrode lead frame. | 2015-04-30 |
20150116910 | TANTALUM CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A tantalum capacitor includes a capacitor body containing tantalum powder and having a tantalum wire extending downwardly; a molded part enclosing the capacitor body and exposing an end portion of the tantalum wire; a positive electrode lead frame disposed on a lower surface of the molded part and connected to the end portion of the tantalum wire; a negative electrode lead frame disposed on the lower surface of the molded part; and a conductive adhesive layer disposed between the capacitor body and the negative electrode lead frame. | 2015-04-30 |
20150116911 | ARC DEFLECTING AND VENTILATION ASSEMBLY FOR ELECTRICAL ENCLOSURES AND SYSTEMS FOR ARC DEFLECTING AND VENTILATION - The present invention relates to an arc deflecting and ventilation assembly ( | 2015-04-30 |
20150116912 | Circuit Breakers Having Enlarged Pressure Relief Valves and Related Electrical Distribution Panels and Systems - Circuit breakers are provided including a pressure release valve. The pressure release valve includes a vent portion and barrier portion. The barrier portion is configured to open when exposed to excessive heat generated by an arc and allow gases to escape from the circuit breaker. Related electrical distribution panels and systems are also provided. | 2015-04-30 |
20150116913 | SYSTEM FOR SHARING POWER OF RACK MOUNT SERVER AND OPERATING METHOD THEREOF - Disclosed herein are a system for sharing power of rack mount server and an operating method thereof. The system for sharing power of a rack mount server according to the present invention comprises: a plurality of servers installed inside a rack main frame and mounted with a power sharing backplane; a rack connected to the power sharing backplane of the plurality of servers in which a power bus bar, receiving power outputted from the connected power supply units, which are mounted in a part of or all of the plurality of servers, is mounted; and a rack power controller collecting power information of the power supply units through the power bus bar mounted inside the rack and controlling operation status of the power supply units based on the collected power information. | 2015-04-30 |
20150116914 | REMOTE CONTROL ATTACHABLE TO SURFACE OF METAL SHELL AND AN ELECTRIC APPLIANCE WITH SUCH REMOTE CONTROL - The present disclosure discloses a remote control attachable to a surface of a metal shell. The remote control comprises a shell, a remote panel provided on a front face of the shell, and a magnet built-in inside the shell. The remote control according to the present disclosure can avoid being lost easily due to no fixed position to be placed and can increase the user's convenience. | 2015-04-30 |
20150116915 | MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND LID BODY - A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on a surface which is welded with the base, and an opening area of the groove on the inner space side which is smaller than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed. | 2015-04-30 |
20150116916 | EXTENDABLE WIRELESS POWER DELIVERY FOR SMALL DEVICES - In various embodiments, an electronic device such as a portable computer has a structure that extends from the device to wirelessly transfer electrical power between itself and an external device. The structure may be placed in a non-extended position when not being used for such power transfer. In some embodiments power transfer may take place in either direction, and may be used for various purposes, such as to provide operational power and/or to charge a battery. The external device may be placed on or near the extended structure for power transfer to take place. | 2015-04-30 |
20150116917 | INFORMATION PROCESSING APPARATUS - An information processing apparatus includes a first case and a second case. A connection assembly connects the first case to the second case such that the cases are rotatable about a shaft member disposed in the connection assembly. The connection assembly includes a first link member attached at one end to the first case and at another end to a second link member included in the second case, and a spring assembly attached at one end to the second link member and at another end to the second case. A torque is generated by the connection assembly relative to the shaft member in a direction corresponding to one or more of a closed state and an open state. The torque is generated in the direction corresponding to the closed state when respective front surfaces of the cases are separated by less than a predetermined polar angle. | 2015-04-30 |
20150116918 | DUST-RESISTANT KEYBOARD ASSEMBLY - A dust-resistant keyboard assembly includes a keyboard body and a dust-resistant cover. The dust-resistant cover connects to the keyboard body and is moveable from a first state where the dust-resistant cover is positioned above the keyboard body to a second state where the dust-resistant cover abuts the keyboard body. | 2015-04-30 |
20150116919 | Techniques for Strengthening Glass Covers for Portable Electronic Devices - Apparatus, systems and methods for improving strength of a thin glass cover for an electronic device are disclosed. In one embodiment, the glass member can have improved strength by forming its edges with a predetermined geometry and/or by chemically strengthening the edges. Advantageously, the glass member can be not only thin but also adequately strong to limit susceptibility to damage. In one embodiment, the glass member can pertain to a glass cover for a housing for an electronic device. The glass cover can be provided over or integrated with a display, such as a Liquid Crystal Display (LCD) display. | 2015-04-30 |
20150116920 | Flexible Electronic Devices - Flexible electronic devices may be provided. A flexible electronic device may include a flexible display, a flexible housing and one or more flexible internal components configured to allow the flexible electronic device to be deformed. Flexible displays may include flexible display layers, flexible touch-sensitive layers, and flexible display cover layers. The flexible housing may be a multi-stable flexible housing having one or more stable positions. The flexible housing may include a configurable support structure that, when engaged, provides a rigid support structure for the flexible housing. The flexible internal components may include flexible batteries, flexible printed circuits or other flexible components. A flexible battery may include flexible and rigid portions or may include a lubricious separator layer that provides flexibility for the flexible battery. A flexible printed circuit may include flexible and rigid portions or openings that allow some rigid portions to flex with respect to other rigid portions. | 2015-04-30 |
20150116921 | ELECTRONIC DEVICE - An electronic device includes a first body, a second body, a first rotary shaft and a flexible display panel. The second body is movably connected to the first body and is adapted to lean against the first body or separate from the first body. The first rotary shaft is pivotally connected to the first body. The flexible display panel is connected between the first and second bodies. When the second body is at the first position, a first section of the flexible display panel is rolled around the first rotary shaft, and a second section of the flexible display panel is expanded between the first and second bodies. When the second body is at the second position, a part of the first section and the second section are expanded between the first and second bodies. | 2015-04-30 |
20150116922 | STRUCTURE OF SCREW-FREE ADAPTATION RACK - The present invention relates to a structure of a screw-free adaptation rack, which includes a main casing including a carrying section to define an upper portion of the main casing as a primary accommodation space and a lower potion as a secondary accommodation space. A partition plate is arranged in the primary accommodation space for division into a first receiving space and a second receiving space. A retention mechanism retains at least one 2.5-inch hard drive in the primary accommodation space. The secondary accommodation space has two sidewalls with a pair of bumps and a pair of through apertures formed therein so that with position adjustment of a retained object, the bumps are fit into and thus retain the retained object, allowing the present invention to readily receive and retain a hard drive and a 3.5-inch floppy disk drive in a screw-free manner for extensive applications to various specifications. | 2015-04-30 |
20150116923 | CABLE BACKPLANE ASSEMBLY AND METHOD - An electronic device includes a bulkhead assembly. The bulkhead assembly includes a bulkhead and one or more cable cassettes coupled to the bulkhead. The cable cassettes include floating connectors. The cable cassettes are modular assemblies that contain all the wiring and connectors. As the connectors float in the cable cassettes, the cable cassettes are blind mated to the bulkhead as standalone units. | 2015-04-30 |
20150116924 | MOUNTING DEVICE FOR HARD DISK DRIVE - A mounting device for mounting a hard disk drive (HDD) includes a frame and a fixing member. The frame includes two side boards and a connecting board connected between the side boards. Each side board defines a latching hole and a positioning hole. The fixing member includes two arms fixed to opposite sides of the HDD and a resilient handle connected between the arms. Two latching portions extend from opposite ends of the handle to be detachably engaged in the latching holes. A protrusion protrudes from each arm to be detachably inserted into a corresponding one of the positioning holes. The handle can be pulled away from the connecting board to disengage the latching portions from the corresponding latching holes. | 2015-04-30 |
20150116925 | DOCKING STATION AND ELECTRONIC APPARATUS - The disclosure discloses a docking station that includes a housing, a circuit board, a base end electrical connector, a screw, and a resilient member. The housing has a stud. The circuit board is supported on the stud and has a through hole. The through hole is aligned with and communicated with the stud. The base end electrical connector is disposed on the circuit board. The base end electrical connector and the stud are respectively located at two opposite sides of the circuit board. The screw is fastened to the stud via the through hole. The resilient member is sleeved onto the screw and located between the screw and the stud. The disclosure further discloses an electronic apparatus including the docking station. | 2015-04-30 |
20150116926 | PORTABLE ELECTRONIC DEVICE CASE, FOLIO, AND DOCK - A docking system for a portable electronic device includes a dock having a housing and a lock mechanism supported by the housing. The housing is configured to couple to the portable electronic device. The lock mechanism is operable to secure the portable electronic device to the housing. The docking system also includes a wireless key operable to communicate with the dock and an actuator coupled to the lock mechanism. The actuator is operable to disengage the lock mechanism to release the portable electronic device from the housing when the wireless key communicates with the dock. | 2015-04-30 |
20150116927 | PORTABLE ELECTRONIC DEVICE CASE, FOLIO, AND DOCK - A system for use with a portable electronic device includes a case having a body configured to receive the portable electronic device, a first attachment structure formed on the body, and a second attachment structure formed on the body. The system also includes a folio having a cover and an attachment member. The attachment member is engageable with the first attachment structure of the case to selectively attach the case to the folio. The system further includes a dock having a housing and a lock mechanism supported by the housing. The lock mechanism is engageable with the second attachment structure of the case to selectively attach the case to the dock. | 2015-04-30 |
20150116928 | Centrifugal Fan with Integrated Thermal Transfer Unit - Disclosed herein are computing devices, and methods of manufacturing computing devices, that have a cooling fan and integrated thermal transfer unit. A centrifugal fan unit includes a rotatable hub, a plurality of blades disposed on the rotatable hub, and a motor coupled to the rotatable hub. The motor causes the rotatable hub to rotate about an axis such that airflow proceeds outward from the centrifugal fan unit along trajectories that are perpendicular to the axis. One or more thermal transfer units have first portions that are coupled to the one or more heat sources and second portions that collectively at least partially surround the centrifugal fan unit. | 2015-04-30 |
20150116929 | BACKFLOW PREVENTION FOR COMPUTING DEVICES - Embodiments of the invention are directed to methods and systems for backflow prevention for computing devices. In an embodiment, a system of sensors, processors, and airflow stimulation devices, such as fans, are used to prevent backflow of high temperature gasses through a server housing. The backflow of high temperature gasses may be a result of a pressure differential between a region in which cooling gases are disposed and a region in which high temperature exhaust gasses are disposed. | 2015-04-30 |
20150116930 | COOLING APPARATUS AND COOLING METHOD - A cooling apparatus that cools an electronic apparatus accommodated in a cabinet, the cooling apparatus includes: a plurality of cooling fans attached to the cabinet; and a control unit that controls a rotation speed of the cooling fans that have been grouped into a plurality of groups, for each of the groups, depending on a group temperature that typifies each of the groups to which the cooling fans belong. | 2015-04-30 |
20150116931 | Mobile Computing Device with a Combined Housing and Connector Port - Mobile computing devices that include an exterior housing and a port. The housing is configured to form a guide portion of the port. More particularly, the port includes a cavity formed in the housing. The cavity includes interior walls that extend inward from an exterior wall of the housing. The port further includes a connector that is positioned in the cavity. The connector is positioned such that the walls of the cavity form the guide of the connector. The port is further constructed to prevent the ingress of water and/or debris into an interior of the housing. | 2015-04-30 |
20150116932 | COMPUTER DEVICE - A computer device includes a main casing, a computer body disposed in the main casing, a linkage mechanism including first and second sheets and a first shape-memory alloy, and a movable casing pivoted to the main casing. The main casing is for engaging with the movable casing to position the movable casing at an open position exposed from the main casing. A driving end of the first sheet is movably inserted into a slot of the movable casing. The second sheet is disposed on a recess structure of the main casing and pivoted to the first sheet. The first shape-memory alloy is pivoted to one of the second sheet and the recess structure and the driving end for moving the driving end along the slot when being heated to shorten or elongate to push the movable casing from a closed position contained in the recess structure to the open position. | 2015-04-30 |
20150116933 | CASE INCLUDING METAL FOR AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE HAVING THE SAME - A case including metal for an electronic device and an electronic device having the same are provided. The electronic device includes a case comprising an injection-molded part including a plurality of holes, and a metal part formed under the injection-molded part, and the metal part being partially exposed through the plurality of holes. The metal part is divided into a plurality of parts via a cut portion formed in a portion of the metal part not exposed through the plurality of holes, and at least one of the plurality of the divided metal parts is utilized as a component element related to a specific function of the electronic device. | 2015-04-30 |
20150116934 | POWER SYSTEM ENCLOSURE - A power system enclosure is provided. The power system enclosure includes a housing accommodating a power source. The power system enclosure further includes an enclosure inlet connected to the housing to allow entry of an intake fluid into the housing. An enclosure exhaust is connected to the housing to route fluid from the housing. Further, a relief damper is disposed in the enclosure exhaust. At least a portion of the relief damper is configured to open when a pressure within the housing exceeds a predetermined threshold value. | 2015-04-30 |
20150116935 | SLANT ANGLE VENT PLATE PATTERN AND METHOD - An electronic device includes a chassis base and a chassis cover which define an electronic enclosure. The chassis base includes a slant angle venting plate extending at an angle from a chassis base sidewall of the chassis base. The slant angle venting plate has a slant angle vent plate pattern formed therein. Further, the chassis cover includes a chassis cover venting pattern covering the slant angle vent plate pattern. As the slant angle venting plate is slanted, the available surface area in which to form the slant angle vent plate pattern is maximized thus maximizing air flow through the electronic enclosure. | 2015-04-30 |
20150116936 | Operating a Current Converter at a Path of Travel of Land Vehicles or at a Parking Space of a Land Vehicle - The invention relates to an arrangement for operating a current converter, in particular an inverter, wherein the converter is located at a path of travel of land vehicles or at a parking space of a land vehicle, the converter being adapted to support operation of at least one vehicle, the converter is combined with a cooling device adapted to cool the converter during operation, the cooling device is designed to use a heat transport medium in order to transport heat away from the converter, the arrangement comprises at least one pole and/or at least one supporting structure which is also located at the path of travel or at the parking space, the pole and/or the supporting structure extends upwards from ground, the arrangement comprises a conduct for conducting the heat transport medium and the conduct extends from the cooling device to the pole and/or to the supporting structure and also extends inside the pole and/or inside the supporting structure so that heat can be transferred from the heat transport medium inside the pole and/or inside the supporting structure to the ambiance. | 2015-04-30 |
20150116937 | ELECTRONIC DEVICE WITH WATERPROOF ENCLOSURE - An electronic device including a sealed enclosure, the electronic components arranged inside the sealed enclosure and including high-loss high-temperature components, a main heat sink including ribs, wherein the high-loss high-temperature components are attached to the main heat sink and the ribs of the main heat sink are arranged outside the enclosure, a cavity formed inside the enclosure and divided into a plurality of channel-like sections, the channel-like sections configured for providing air flow guidance inside the enclosure and being interconnected at their ends, wherein at least one channel-like section contains the electronic components and at least one other channel-like section contains an air-to-air heat exchanger extending from inside the sealed enclosure to outside of the sealed enclosure, wherein the electronic components inside the at least one channel like section are adapted to be cooled by air flow inside the sealed enclosure. | 2015-04-30 |
20150116938 | Heat Sink Device for Power Modules of Power Converter Assembly - A heat sink for power modules can be incorporated into a power module of a machine. In embodiments, an alloy is extruded to form a body with a plurality of divider webs integral thereto and defining a plurality of longitudinal passage segments inside the body. The body is machined to remove alternating end portions of the divider webs to define a fitting end turn area and a return end turn area disposed in opposing relationship with each other, thereby forming a serpentine fluid passage. A fitting end cap is welded to the body. A fluid inlet and a fluid outlet of the fitting end cap are respectively in fluid communication with a passage inlet and a passage outlet of the serpentine fluid passage. | 2015-04-30 |
20150116939 | Auto-Compensating Temperature Valve Controller for Electro-Rheological Fluid Micro-Channel Cooled Integrated Circuit - A structure and method of using the structure. The structure including an integrated circuit chip having a set of micro-channels; an electro-rheological coolant fluid filling the micro-channels; first and second parallel channel electrodes on opposite sides of at least one micro-channel, the first channel electrode connected to an output of an auto-compensating temperature control circuit, the second channel electrode connected to ground; the auto-compensating temperature control circuit comprising a temperature stable current source connected between a positive voltage rail and the output and having a temperature sensitive circuit connected between ground and the output, a leakage current of the temperature stable current source being essentially insensitive to temperature and a leakage current of the temperature sensitive circuit increasing with temperature. | 2015-04-30 |
20150116940 | CIRCUIT CARD ASSEMBLY AND METHOD OF FABRICATING THE SAME - A circuit card assembly is provided. The circuit card assembly includes a printed circuit board, at least one electronic component mounted on the printed circuit board, and a frame coupled to the printed circuit board such that the electronic component is disposed between the printed circuit board and the frame. The circuit card assembly also includes a heat transfer device coupled to the frame. The heat transfer device has a heat pipe disposed at least in part between the frame and the printed circuit board. The circuit card assembly further includes a pivotable brace biasing the heat pipe toward the electronic component to facilitate cooling the electronic component. | 2015-04-30 |
20150116941 | FABRICATING COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER - Methods are provided for facilitating cooling of an electronic component. The method includes providing a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate. | 2015-04-30 |
20150116942 | COOLING MEMBER - A cooling member includes a heat-transfer member, a refrigerant introducing pipe and a covering material. The heat-transfer member has a surface with a groove opened to the surface of the heat-transfer member. The refrigerant introducing pipe is pressed into the groove. The covering material coats the surface of the heat-transfer member and the refrigerant introducing pipe. | 2015-04-30 |
20150116943 | THERMOELECTRIC HEAT PUMP WITH A SURROUND AND SPACER (SAS) STRUCTURE - A heat pump includes a SAS structure with a wall defining a first open side and a second open side. The heat pump also includes an interconnect board, enclosed within the SAS structure including openings. Thermoelectric modules are mounted on the interconnect board at the locations defined by the openings. The heat pump additionally includes a hot-side heat spreader that is in thermal contact with the first side of each thermoelectric module and a cold-side heat spreader that is in thermal contact with the second side of each thermoelectric module. The periphery of the hot-side heat spreader mechanically contacts the wall of the SAS structure at the first open side, and the periphery of the cold-side heat spreader mechanically contacts the wall of the SAS structure at the second open side such that any compression force applied to the heat pump is absorbed by the SAS structure. | 2015-04-30 |
20150116944 | ELECTRICAL ASSEMBLY WITH A SOLDER SPHERE ATTACHED HEAT SPREADER - An electrical assembly that includes a circuit board, an electrical device, a heat spreader, and a solder sphere. The electrical device is a surface mount type package attached to the circuit board. The heat spreader overlies and extends beyond the outline of the device, and is in thermal contact the top side of the surface mount type package. A contact surface of the heat spreader is spaced apart from a mounting surface of the circuit board by a distance based on a height of the top side above the mounting surface. The solder sphere has a pre-reflow diameter sufficient to couple the contact surface to the mounting surface after the solder sphere is reflowed. | 2015-04-30 |
20150116945 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A semiconductor device includes: a block module which internally includes a power semiconductor element and a first heatsink, and from which a main circuit terminal and a control terminal are drawn; a control substrate connected to the control terminal; a package in which the block module and the control substrate are housed; and a second heatsink to which the package is fixed by a connection screw. The connection screw is inserted into the second heatsink so as to be inclined at an inclination angle θ relative to a normal to a surface of the second heatsink. | 2015-04-30 |
20150116946 | ELECTRONIC COMPONENT, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT - An electronic component includes an electronic device and a container containing the electronic device. The container includes a base having a first region to which the electronic device is secured and a second region around the first region, a cover facing the electronic device across a space, and a frame secured to the second region to surround the space. The frame includes a first member and a second member having a thermal conductivity lower than those of the first member and the base. The first member has first and second portions on inner and outer edge sides of the frame, respectively, on both sides of an outer edge of the base. The second member is located between the cover and the first member. A shortest distance between the first member and the base is smaller than that between the first member and the cover. | 2015-04-30 |
20150116947 | ADVANCED GROUNDING SCHEME - A laminate substrate may include a slug positioned within a cavity of a laminate core. The laminate substrate may have routing layers on either side of the laminate core, at least one of which is coplanar with an outer side of the slug. A capping layer may then be applied to the laminate substrate which is directly coupled with the slug and the routing layer. In embodiments, a dielectric layer may be coupled with the capping layer, and an additional routing layer may be coupled with the dielectric layer. Therefore, the routing layer may be an “inner” routing layer that is coplanar with, and coupled with, the slug. | 2015-04-30 |
20150116948 | ELECTRONIC DEVICE AND ELECTROMAGNETIC WAVE SHIELDING MODULE THEREOF - An electronic device including a circuit board, a heat generating component and an electromagnetic wave shielding module is provided. The circuit board has a ground plane. The heat generating component is disposed on the circuit board. The electromagnetic wave shielding module includes a plurality of conductive components and a heat dissipating component. The conductive components are disposed on the circuit and electrically connected to the ground plane, wherein the conductive components are arranged with intervals and surround the heat generating component. The heat dissipation component is disposed on the heat generating component and connected to the conductive components, wherein the heat dissipating component covers and contacts with the heat generating component to dissipate heat from the heat generating component and shield an electromagnetic wave generated by the heat generating component, and the electromagnetic wave is transmitted to the ground plane and drained through the conductive components. | 2015-04-30 |
20150116949 | ELECTRIC COMPONENT - The electric component includes first and second members | 2015-04-30 |
20150116950 | COIL COMPONENT, MANUFACTURING METHOD THEREOF, COIL COMPONENT-EMBEDDED SUBSTRATE, AND VOLTAGE ADJUSTMENT MODULE HAVING THE SAME - A coil component may be capable of being easily manufactured and significantly decreasing direct current (DC) resistance of its wiring. The coil component may include a coil assembly including a core substrate and coil patterns formed on the core substrate; and a magnetic material part embedding the coil assembly therein. | 2015-04-30 |
20150116951 | MANUFACTURING METHOD OF ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND LID BODY - A manufacturing method of an electronic device, that accommodates a gyro element as an electronic component in an inner space formed by a base and a lid as a lid body, includes: preparing the lid in which a groove is provided on the rear surface which is welded with the base, and an opening area of the groove on the inner space side which is greater than an opening area on the outer periphery side of the lid; welding, first, the base and the lid at a portion excluding an unwelded portion that includes at least apart of the groove, of a planned welding portion of the base and the lid; and welding, second, the base and the lid at the unwelded portion such that the groove is closed. | 2015-04-30 |
20150116952 | APPARATUS FOR PERFORMING COMMUNICATION CONTROL - An apparatus for performing communication control includes a control module implemented with at least one integrated circuit (IC) whose package includes a plurality of sets of terminals, each set of the plurality of sets of terminals corresponding to one of a plurality of sub-modules of the control module, and within the sets of terminals, a set of terminals corresponding to a specific sub-module of the sub-modules include a power-input terminal arranged to input power from outside the control module. For example, on a printed circuit board (PCB) of the apparatus, arrangement of some modules is similar to that of some contact pads associated to the sets of terminals. In another example, the control module includes a power distribution system including at least one power distribution wire. In another example, a PCB within the apparatus includes at least one signal transmission wire and at least one set of co-plane ground wires. | 2015-04-30 |
20150116953 | ELECTRONIC MEDIA PRODUCTION SYSTEM AND SYSTEM FOR USE THEREWITH - A system comprising modules. Each module includes: a presentation system including one or more of a speaker and a video screen; and a port. In use, if the presentation system includes the speaker, the system produces sounds derived from data obtained via the port. If the presentation system includes the screen, the system displays images derived from data obtained via the port. The module can also include connectors and the system can also include actuators. Each actuator, in use, can be coupled without soldering to a connector, and the presentation system of each module can operate in response to the actuator or actuators coupled to said each module. The system can also include data storage devices, each adapted to be releasably coupled to a respective port, and the port can be selected from: microchip socket and USB port. The system can be used as part of a method. | 2015-04-30 |
20150116954 | IMAGE SENSOR MODULE - An image sensor module is provided. The image sensor module includes a circuit board, a flat material, an image sensing chip, a holder and a covering plate. The flat material disposed on an assembling surface of the circuit board has a supporting surface and a bottom surface opposite thereto. The image sensing chip with its base surface facing to the supporting surface is configured on the supporting surface. The holder is disposed on the flat material, and the bottom plane of the holder faces to the supporting surface. The supporting surface is used to make the base surface parallel to the bottom plane. The covering plate is arranged on the holder to seal the image sensing chip. | 2015-04-30 |
20150116955 | ENGINE CONTROL UNIT - An engine control unit including a substantially rectangular printed circuit board in which a microcontroller is mounted. The printed circuit board includes a connector portion in which connection terminals are provided to be arranged in one side edge portion along the longitudinal direction thereof. The connection terminals of the connector portion include connection terminals for input on one side in the longitudinal direction and connection terminals for output on the other side with respect to a setting position. A microcontroller is disposed at substantially the center portion of the printed circuit board in the longitudinal direction thereof. An electronic component as an input interface circuit is disposed on the one side in the longitudinal direction, and an electronic component as an output interface circuit is disposed on the other side. | 2015-04-30 |
20150116956 | SEMICONDUCTOR DEVICE - It is an object of the present invention to provide an easily assemblable semiconductor device including a cover that covers a top of a case and is reliably fixed to the case defining an outline of the semiconductor device. A semiconductor device according to the present invention includes: a case defining an outline of the semiconductor device; a cover covering a top of the case; and a fastener mechanically fixing the cover to the case, a through-hole is formed in the cover, the case includes a projection inserted into the through-hole, and the fastener is attachable to the projection inserted into the through-hole of the cover from the outside of the cover and locks the projection upon the attachment to prevent the projection from falling off the through-hole. | 2015-04-30 |
20150116957 | ELECTRONIC ASSEMBLY AND ELECTRONIC APPARATUS - An electronic apparatus includes a rear casing, a front cover, and an electronic assembly that includes a display module, a host module, a battery module, and an expansion module. The rear casing has a front opening. The front cover is located on the front opening; the front cover and the rear casing together constitute an accommodation space. The display module is installed inside the accommodation space and stacked over the front cover. The host module is installed inside the accommodation space and stacked over the display module. The battery module is installed inside the accommodation space, stacked over the display module, and arranged side by side with the host module. The expansion module is installed inside the accommodation space and stacked over the battery module. The expansion module includes an expansion circuit board stacked over the battery module and a plurality of card connectors mounted on the expansion circuit board. | 2015-04-30 |
20150116958 | CIRCUIT BOARD MODULES HAVING MECHANICAL FEATURES - A modularized printed circuit board including mechanical features. The modularized printed circuit board may include a printed circuit board, at least one electronic component affixed to the printed circuit board, and an overmold material adjacent at least a portion of the printed circuit board and defining a region of overmold material. The modularized printed circuit board may also include a feature formed from the overmold material. | 2015-04-30 |
20150116959 | DISPLAY DEVICES AND METHODS OF MANUFACTURING DISPLAY DEVICES - A display device having a base film, a display structure, and a window, the base film including a first bending region having a wrinkled portion and a first region adjacent to the first bending region, a display structure disposed on a first face of the base film, and a window covering the display structure disposed on the first face of the base film, the first bending region having a material different from a material in the first region. | 2015-04-30 |
20150116960 | ELECTRONIC PACKAGE STRUCTURE - The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound. | 2015-04-30 |
20150116961 | METHOD AND STRUCTURE FOR INHIBITING DENDRITE FORMATION - A circuit includes a structure for inhibiting dendrite formation. The circuit includes a first electrode disposed within a first area of the circuit, wherein the first electrode is configured to be coupled to an ionic source that forms ions when a first electric potential is applied to the first electrode. The circuit also includes a second electrode disposed within a second area of the circuit. The second electrode is configured to receive a second electric potential that is less than the first electric potential and that causes the ions to migrate toward the second electrode to contribute to dendrite formation. The circuit further includes a structure disposed within a third area of the circuit. The structure is configured to receive a third electric potential to create a barrier that inhibits the migration of at least some of the ions from the first to the second electrode to inhibit dendrite formation. | 2015-04-30 |
20150116962 | CIRCUIT BOARD AND ELECTRONIC DEVICE - An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings. | 2015-04-30 |
20150116963 | COIL-INTEGRATED PRINTED CIRCUIT BOARD AND MAGNETIC DEVICE - A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and a first inner layer which includes an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside. Coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor. A first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer. | 2015-04-30 |
20150116964 | COMPONENT-EMBEDDED SUBSTRATE - A component-embedded substrate includes a substrate portion, an embedded electronic component, and a resin portion. The substrate portion has inner electrodes on an inner principal surface. The embedded electronic component has terminal electrodes and is mounted to the substrate portion via solder fillets adhering to the respective terminal electrodes and the respective inner electrodes. The resin portion is stacked on the substrate portion, with the embedded electronic component embedded therein. The resin portion includes a no-filler-added layer and a filler-added layer. The no-filler-added layer extends from the inner principal surface to a height which allows at least the solder fillets to be covered. The filler-added layer contains an inorganic filler and extends from an interface with the no-filler-added layer to a height which allows at least the embedded electronic component to be covered. | 2015-04-30 |
20150116965 | EMBEDDED BRIDGE STRUCTURE IN A SUBSTRATE - Some novel features pertain to a substrate that includes a first dielectric layer and a bridge structure. The bridge structure is embedded in the first dielectric layer. The bridge structure is configured to provide an electrical connection between a first die and a second die. The first and second dies are configured to be coupled to the substrate. The bridge structure includes a first set of interconnects and a second dielectric layer. The first set of interconnects is embedded in the first dielectric layer. In some implementations, the bridge structure further includes a second set of interconnects. In some implementations, the second dielectric layer is embedded in the first dielectric layer. The some implementations, the first dielectric layer includes the first set of interconnects of the bridge structure, a second set of interconnects in the bridge structure, and a set of pads in the bridge structure. | 2015-04-30 |
20150116966 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON - There is provided a composite electronic component including a composite body having a capacitor and an inductor coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part; a first input terminal; an output terminal; and a ground terminal. | 2015-04-30 |
20150116967 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - Provided is a wiring board including: an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof; a semiconductor element connection pad formed on the mounting portion; a conductor pillar formed on the semiconductor element connection pad; and a solder resist layer adhered on the insulating board. The solder resist layer has a first region with a thickness such that the semiconductor element connection pad and a lower end portion of the conductor pillar are embedded while an upper end portion of the conductor pillar protrudes, and a second region having a thickness larger than that of the first region and surrounding the first region. | 2015-04-30 |
20150116968 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit chip, in which multi-core processors are integrated, is usually mounted over an organic wiring board by FC bonding to form a BGA package by being integrated with the substrate. In such a structure, power consumption is increased, and hence the power supplied only from a peripheral portion of the chip is insufficient, so that a power supply pad is also provided in the chip central portion. However, because of an increase in the wiring associated with the integration of a plurality of CPU cores, etc., there occurs a portion between the peripheral portion and the central portion of the chip, where a power supply pad cannot be arranged. According to the outline of the present application, in a semiconductor integrated circuit device such as a BGA, etc., in which a semiconductor chip is mounted over an interposer, such as a multilayer organic wiring board, in a face-up manner, a first group of metal through electrodes, which are provided in the semiconductor chip to supply a power supply potential to a core circuit, etc., and a first metal land over the interposer are interconnected by a first conductive adhesive member film. | 2015-04-30 |
20150116969 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed; an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate; a lid which accommodates the electronic element and is bonded to the one surface of the base substrate; and an external electrode which covers a region ranging from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in a vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, a first electrolytic plating film which is formed on a surface of the conductive film by an electrolytic plating method, and a second electrolytic plating film which is formed on a surface of the first electrolytic plating film by an electrolytic plating method. The second electrolytic plating film is formed of tin or a tin alloy. | 2015-04-30 |
20150116970 | MOUNTING STRUCTURE AND METHOD FOR MANUFACTURING SAME - A mounting structure includes a bonding material ( | 2015-04-30 |
20150116971 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE - An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy. | 2015-04-30 |
20150116972 | DC-DC Converter Assembly with an Output Inductor Accommodating a Power Stage Attached to a Circuit Board - A DC-DC converter assembly includes a board having a first side and a second side opposite the first side, a power stage die of a DC-DC converter attached to the first side of the board, and an output inductor electrically connected to an output of the power stage die and disposed over the power stage die on the first side of the board. The output inductor includes a magnetic core and an electrical conductor having first and second terminals attached to the first side of the board. The output inductor accommodates the power stage die under the magnetic core so that the power stage die is interposed between the magnetic core and the board. A corresponding method of manufacturing the DC-DC converter assembly and method of manufacturing the output inductor are also disclosed. | 2015-04-30 |
20150116973 | ELECTRONIC PACKAGE STRUCTURE - The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound. | 2015-04-30 |
20150116974 | METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, ELECTRONIC APPARATUS, MOVING OBJECT, AND LID BODY - A method of manufacturing an electronic device in which a gyro element as an electronic component is accommodated in an internal space provided by a base and a lid as a lid body, includes: preparing the lid as the lid body in which a groove is provided in the surface which is a surface on the opposite side to the rear surface which is a surface on a side which is joined to the base; seam-welding the base and the lid at a site except for an unwelded site which includes a site corresponding to at least a portion of the groove, of a site planned to join the base and the lid; and welding the base and the lid at the unwelded site. | 2015-04-30 |
20150116975 | ELECTRONIC COMPONENT, ELECTRONIC DEVICE, METHOD OF MANUFACTURING MOUNTED MEMBER, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT - A frame member includes a first portion, a second portion, and a third portion located between the first portion and the second portion, and wherein the lengths of the first portion and the second portion in a circumferential direction are longer than the length of the third portion in the circumferential direction, and a Young's modulus of the third portion is lower than the Young's moduli of the first portion and the second portion. | 2015-04-30 |
20150116976 | CABLE ASSEMBLY FOR A CABLE BACKPLANE SYSTEM - A cable assembly for a cable backplane system includes a tray having a frame and spacer assemblies coupled to the frame that hold cable tray connectors in fixed positions relative to the frame. Each cable tray connector has a housing holding a plurality of contacts and cables extending rearward from the corresponding housing. The housings are configured to be received in corresponding openings in a backplane of the cable backplane system. A flexible cable harness extends from the tray. The flexible cable harness has a flexible shield electrically coupled to the frame and a harness connector electrically connected to at least one corresponding cable tray connector. At least some of the cables are routed from the tray through the flexible shield to the harness connector. The flexible shield provides electrical shielding for the cables. The harness connector is variably positionable relative to the tray. | 2015-04-30 |
20150116977 | TRANSPARENT ILLUMINATED DISPLAY SYSTEM FOR AUTOMOBILES - A transparent illuminated display system, typically for use in automobile race events, including a highly flexible and transparent PCB board with ultra-low profile LED's mounted to it. The flexible and transparent PCB boards can be in the shape of a single or multiple numeric or alphanumeric displays. The face of the display which would make contact with the face of a wind screen would include an adhesive element. The transparent illuminated display is mounted to a vehicle as a kind of sticker on the inside or outside of a racecar windscreen, back window and/or side windows. Each of the displays could be wired to power and data lines and illuminate the required numbers or text to show the position and other info of the car in the race. | 2015-04-30 |
20150116978 | LIGHT-EMITTING BUTTON KEY AND MANUFACTURING METHOD THEREOF - The present invention relates to a light-emitting button key and a manufacturing method thereof. The manufacturing method in which a symbol printed on the button key is lightened when light is emitted from a rear side thereof, includes a pressing step of pressing a metal plate and forming a button body which is opened in one direction; an adhesive coating step of coating an adhesive in the button body; an injection-molding step of injecting a synthetic resin formed of a transparent or semitransparent material into the button body in which an adhesive layer is formed by the adhesive so that a penetration part bonded to the button body through the adhesive layer is injection-molded; and a groove machining step of penetrating the button body and adhesive layer from an outside of the button body and thus forming a light transmission groove corresponding to a character, number or symbol, wherein the light transmission groove formed in the groove machining step is not passed through the penetration part, and the light emitted from the rear side of the button body is radiated to an outside through the penetration part and light transmission groove so as to lighten the character, number or symbol formed in the light transmission groove. | 2015-04-30 |
20150116979 | ILLUMINATED KNOB FOR A SHIFTER ASSEMBLY AND CORRESPONDING ILLUMINATION METHOD - A knob for a shifter assembly of a vehicle includes a housing having an interior surface defining a cavity and an opening. A body is at least partially disposed within the cavity, has first and second surfaces, extends to a periphery, and is formed of an at least partially transparent material. An illumination device is disposed within the cavity for emitting light rays. At least one reflective surface is disposed along the periphery for receiving the light rays. A first portion of the light rays is internally reflected within the body off of the first surface. At least one indicium is disposed along the body. The body defines at least one indicium cavity having a bottom substantially parallel to the first surface with the indicium disposed within the indicium cavity along the bottom for reflecting the first portion of the light rays toward the opening for illuminating the indicium. | 2015-04-30 |
20150116980 | ILLUMINATION SYSTEM - The invention is an illumination system comprising a semiconductor light source module. The illumination system comprises a reflector comprising a curved reflective surface, a holder coupled to the reflector, and a semiconductor light source module comprising a first light-emitting unit and a second light-emitting unit. The holder comprises a second holding section and a first holding section disposed between the reflector and the second holding section. The semiconductor light-source module is disposed on the second holding section to face the curved reflective surface. An angle between at least a light-emitting unit and at least a part of the first holding section is formed and ranges from 145 to 175 degrees. | 2015-04-30 |
20150116981 | PHSOPHOR WHEEL AND WHITE LIGHT ILLUMINATION DEVICE UTILIZING THE SAME - Disclosed is a phosphor wheel including a substrate, a first phosphor region on the substrate, and a second phosphor region on the substrate. The first phosphor region and the second phosphor region are concentric patterns without any space between their interface. Moreover, the second phosphor region is set to around the first phosphor region. | 2015-04-30 |
20150116982 | WAVELENGTH CONVERSION AND FILTERING MODULE AND LIGHT SOURCE SYSTEM - A wavelength conversion and filtering module that includes a plurality of optical regions is provided. The optical regions are adapted to move, and at least one of the optical regions includes a reflection unit, a wavelength conversion unit, a prism sheet, and a filter unit. The wavelength conversion unit is located between the reflection unit and the prism sheet. The prism sheet is located between the wavelength conversion unit and the filter unit. A light source system is also provided. | 2015-04-30 |
20150116983 | LIGHTING SOURCE USING SOLID STATE EMITTER AND PHOSPHOR MATERIALS - A light-emitting apparatus includes a substrate, a light source configured to emit light and arranged on the substrate, a phosphor layer being apart from the light source and configured to convert the light into forward transmitted light and backward transmitted light, and an optic device, being narrower than the substrate and having a transparent side wall, configured to direct at least a portion of the backward transmitted light through the transparent side wall and toward the substrate. In another aspect, a light-emitting apparatus includes a transparent base, a light source on the transparent base, a transparent material covering the light source, a phosphor layer on the transparent material, and a transparent wall on the phosphor layer. | 2015-04-30 |
20150116984 | LENS WITH LIGHT-DIFFUSION CAPPING LAYERS AND BACKLIGHT MODULE INCORPORATING THE SAME - A lens includes a main lens, a first light-diffusion capping layer and a second light-diffusion capping layer formed on the top of the main lens in sequence. The main lens includes a light incident surface and a light exit surface opposite to the light incident surface. The main lens defines a recess in the top thereof, and the recess is located at a central region of the light exit surface and recessed inwardly toward the light incident surface. The first and the second light-diffusion capping layers are received in the recess, and the second light-diffusion capping layer is located over the first light-diffusion capping layer. A refractive index of the first light-diffusion capping layer is smaller that that of the main lens but larger than that of the second light-diffusion capping layer. A backlight module source incorporating the lens and the LED light source is also provided. | 2015-04-30 |
20150116985 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICE - Discussed is a display device including a substrate having at least one of a first and a second electrode, a conductive adhesive layer configured to cover the wiring substrate, and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first and second electrode, wherein the conductive adhesive layer has a first conductive adhesive layer disposed in a first region and a second conductive adhesive layer disposed in a second region adjoining to the first region such that the conductive adhesive layer is partitioned into a plurality of regions on the wiring substrate. | 2015-04-30 |
20150116986 | HEAT CONDUCTIVE DEVICE, BACKLIGHT MODULE, AND LIQUID CRYSTAL DEVICE - A heat conductive device is disclosed. The heat conductive device includes at least one collecting frame and at least one conductive plate vertically connected to each other. The collecting frame is for surrounding LEDs and is tightly attached to a mounting surface of the circuit board, and the conductive plate is tightly attached to a back plate. The heat conductive device overcomes the defects that there is no effective heat conductive path between the circuit board and the back plate. The heat accumulated on the circuit board is greatly transmitted to the back plate, and thus the heat conductive efficiency and the heat dissipation efficiency are enhanced. | 2015-04-30 |
20150116987 | Illumination Apparatus - An illumination apparatus that includes a housing assembly made up of a housing, seat and top with optional attachment. A light source, power source, switch and controller are further included with the assembly. A light-altering device is also included in or proximate to the housing. The light source emits light through a light-altering surface. An optional motor is included to move the light alternating surface or light source, such as about a central axis. The switch and controller connected are programmable to control and vary the light source and motor among preselected and selectable patterns. | 2015-04-30 |
20150116988 | PERSONAL ILLUMINATION DEVICE WITH VARIABLE LIGHTING PATTERNS - A personal illumination device is described and taught. The personal illumination device is intended for use by motorcyclists, however, it may be used by any number of individuals looking to increase their visibility in environments where high visibility and safety is paramount. The illumination device has two illuminated strips that sit across the front and back of a user. The strips have LEDs positioned across capable of creating various illuminate patterns. Additionally, a user can choose to have either the front, back, or both strips illuminated at the same time. The personal illumination device further has straps that provide for adjustments to create a custom fit, as well as enhancement strips placed on the straps to further increase one's visibility. | 2015-04-30 |
20150116989 | Lighted Lacrosse Stick Handle - An illuminated handle for a lacrosse or other sport/recreational stick includes: (1) an elongated, cylindrical member, (2) an axial aligned bore located in one of the ends of this member, (3) a light source having an illumination surface which is configured to allow it to be mounted flush against the bore's bottom surface, (4) wherein this member is fabricated from a translucent plastic material, (5) wherein the bore's bottom surface is configured to maximize the amount of light that is transmitted between the member's ends, and (6) wherein the member's outer surface is configured to maximize the amount of light that is transmitted through it. | 2015-04-30 |
20150116990 | LINEAR LIGHT FIXTURE - A light fixture is provided that includes a plurality of light emitting sources, such as e.g., LEDs, that are arranged along a longitudinal direction. A heat sink provides a support structure for the lights while also assisting with the dissipation of heat. A diffuser covers the light emitting sources and is also supported by the heat sink. One or more optical elements such as e.g., a reflector or internally reflecting lens may be used to help direct light rays from the light emitting sources. Certain features may be added at the ends of the light fixture for mounting upon a surface and/or for further controlling the direction of light rays projecting from the light fixture. The light fixture is suitable for a variety of applications including e.g., the illumination of products displayed on shelving for consumer viewing. | 2015-04-30 |
20150116991 | Multi-function and portable device for forming separately an illuminator and a barrier and for forming in combination an illuminated barrier - A multi-function and portable device forming separately an illuminator and a barrier and forming in combination an illuminated barrier. The multi-function and portable device includes a traffic cone and a hand-held light wand. The hand-held light wand extends replaceably from the traffic cone without a need for cone adaptors so as to allow the hand-held light wand and the traffic cone to operate separately of each other and act as the illuminator and the barrier, respectively, and to act in combination with each other so as to form the illuminated barrier. | 2015-04-30 |
20150116992 | LED device for lighting a fishing line at the pole - A simple and affordable LED device for illuminating part of the rod and the fishing line. The device made of at least one LED; a manner for removably attaching the LED to the fishing pole; a power source for the LED; a way for electrically connecting the power source to the LED; and a method to control electric power to the LED so that the power source energizes the LED and the LED illuminates the line and tip of the fishing pole. | 2015-04-30 |
20150116993 | LED WORK LAMP - An LED work lamp comprises a hook, a cap, a lamp hood, a lamp plate, a transparent hood, a battery chamber, a battery, and a handle. The hook and the cap are disposed closely at one end of the lamp hood. One end of the hook is located in the cap. The lamp plate is located inside the lamp hood. The transparent hood is located at the upper part of the lamp hood. The battery is located at the other end of the lamp hood. The battery chamber is located below the lamp hood. The handle is disposed around the outer surface of the battery chamber. The present invention has the advantages of the simplicity and convenience in changing the transparent hood and fast heat dissipation. | 2015-04-30 |
20150116994 | Lighting Device - A portable, battery-operated flashlight having improved pivoting, switching and focusing features is disclosed. In one aspect of the invention, the flashlight takes the form of an attachment to a head gear for hands free use. In another aspect of the invention, the flashlight takes the form of a head lamp held in place on a user's head by an elastic band. The pivot connection between the body and the base, as well as the serrations on an exterior surface of the body, allows a user to adjust any angular direction of the light as desired. In another aspect of the invention, the flashlight takes the form of a long-handled flashlight having improved switching and focusing capabilities, such that axial movement of the switching assembly turns the flashlight “on” or “off,” as well as causing a position of the lamp to vary in order to focus or defocus the light. | 2015-04-30 |