19th week of 2013 patent applcation highlights part 15 |
Patent application number | Title | Published |
20130113068 | LOW-K DIELECTRIC PROTECTION SPACER FOR PATTERNING THROUGH SUBSTRATE VIAS THROUGH A LOW-K WIRING LAYER - A low-K value dielectric protection spacer for patterning through substrate vias (TSVs) through a low-K value wiring layer. A method for forming a low-K value dielectric protection spacer includes etching a via opening through a low-K value dielectric interconnect layer. A protective layer is deposited in the via opening and on the low-K value dielectric interconnect layer. At least a portion of the protective layer is etched from the bottom of the via opening and from a horizontal surface of the low-K value dielectric interconnect layer. The etching leaving a protective sidewall spacer on a sidewall of the via opening. A through substrate via is etched through the bottom of the via opening and through the semiconductor substrate. The through substrate via is filled with a conductive material. | 2013-05-09 |
20130113069 | SELF-ALIGNED SEMICONDUCTOR TRENCH STRUCTURES - Methods for forming a semiconductor device include forming self-aligned trenches, in which a first set of trenches is used to align a second set of trenches. Methods taught herein can be used as a pitch doubling technique, and may therefore enhance device integration. Further, employing a very thin CMP stop layer, and recessing surrounding materials by about an equal amount to the thickness of the CMP stop layer, provides improved planarity at the surface of the device. | 2013-05-09 |
20130113070 | Interposers for Semiconductor Devices and Methods of Manufacture Thereof - Interposers for semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, an interposer includes a substrate, a contact pad disposed on the substrate, and a first through-via in the substrate coupled to the contact pad. A first fuse is coupled to the first through-via. A second through-via in the substrate is coupled to the contact pad, and a second fuse is coupled to the second through-via. | 2013-05-09 |
20130113071 | SEMICONDUCTOR DEVICE WITH FUSE - A semiconductor device includes a fuse configured to be programmed in response to a laser, a protective layer formed under the fuse and overlapping with a portion of the fuse, and a heat emission portion coupled with the protective layer. | 2013-05-09 |
20130113072 | 3D Capacitor and Method of Manufacturing Same - A 3D capacitor and method for fabricating a 3D capacitor is disclosed. An exemplary 3D capacitor includes a substrate including a fin structure, the fin structure including a plurality of fins. The 3D capacitor further includes an insulation material disposed on the substrate and between each of the plurality of fins. The 3D capacitor further includes a dielectric layer disposed on each of the plurality of fins. The 3D capacitor further includes a first electrode disposed on a first portion of the fin structure. The first electrode being in direct contact with a surface of the fin structure. The 3D capacitor further includes a second electrode disposed on a second portion of the fin structure. The second electrode being disposed directly on the dielectric layer and the first and second portions of the fin structure being different. | 2013-05-09 |
20130113073 | Integrated Circuit having a MOM Capacitor and Method of Making Same - An integrated circuit can include a MOM capacitor formed simultaneously with other devices, such as finFETs. A dielectric layer formed on a substrate has a first semiconductor fin therein and a second semiconductor fin therein. Respective top portions of the fins are removed to form respective recesses in the dielectric layer. First and second electrodes are formed in the recesses. The first and second electrodes and the interjacent dielectric layer form a MOM capacitor. | 2013-05-09 |
20130113074 | Capacitor system and method for producing a capacitor system - A capacitor system and a method for producing a capacitor system. The capacitor system may be used in a power semiconductor module. In one embodiment, the capacitor system comprises a metal shaped body having a depression; a capacitor arranged at least partly in the depression; a spacer composed of electrically insulating material, the spacer being arranged at least partly between the capacitor and the metal shaped body in the depression; and an electrically insulating potting material provided in the depression, wherein the potting material fixes the capacitor in the depression so that the capacitor does not touch the metal shaped body. | 2013-05-09 |
20130113075 | METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A metal-insulator-metal (MIM) capacitor structure includes a first dielectric layer, a first damascene electrode layer, an insulating barrier layer, a second dielectric layer and a second damascene electrode layer. The first damascene electrode layer is formed in the first dielectric layer. The insulating barrier layer covers the first dielectric layer and the first damascene electrode layer, and is a single layer structure. The second dielectric layer is formed on the insulating barrier layer. The second damascene electrode layer is formed in the second dielectric layer and is contacted with the insulating barrier layer. The MIM capacitor structure can includes a dual damascene structure formed in the second dielectric layer and the insulating barrier layer and electrically connected to the first damascene electrode layer. A method for manufacturing the MIM capacitor structure is also provided. | 2013-05-09 |
20130113076 | METAL-SEMICONDUCTOR WAFER BONDING FOR HIGH-Q DEVICES - Methods and apparatus for metal semiconductor wafer bonding for high-Q devices are provided. An exemplary capacitor includes a first plate formed on a glass substrate, a second plate, and a dielectric layer. No organic bonding agent is used between the first plate and the glass substrate, and the dielectric layer can be an intrinsic semiconductor. A extrinsic semiconductor layer that is heavily doped contacts the dielectric layer. The dielectric and extrinsic semiconductor layers are sandwiched between the first and second plates. An intermetallic layer is formed between the first plate and the dielectric layer. The intermetallic layer is thermo compression bonded to the first plate and the dielectric layer. The capacitor can be coupled in a circuit as a high-Q capacitor and/or a varactor, and can be integrated with a mobile device. | 2013-05-09 |
20130113077 | Metal Finger Capacitor for High-K Metal Gate Processes - Embodiments described herein provide a structure for finger capacitors, and more specifically metal-oxide-metal (“MOM”) finger capacitors and arrays of finger capacitors. A plurality of Shallow Trench Isolation (STI) formations is associated with every other column of capacitor fingers, with poly fill formations covering the STI formations to provide a more robust and efficient structure. | 2013-05-09 |
20130113078 | POLYSILICON-INSULATOR-SILICON CAPACITOR IN A SIGE HBT PROCESS AND MANUFACTURING METHOD THEREOF - A PIS capacitor in a SiGe HBT process is disclosed, wherein the PIS capacitor includes: a silicon substrate; a P-well and shallow trench isolations formed in the silicon substrate; a P-type heavily doped region formed in an upper portion of the P-well; an oxide layer and a SiGe epitaxial layer formed above the P-type heavily doped region; spacers formed on sidewalls of the oxide layer and the SiGe epitaxial layer; and contact holes for picking up the P-well and the SiGe epitaxial layer and connecting each of the P-well and the SiGe epitaxial layer to a metal wire. A method of manufacturing the PIS capacitor is also disclosed. The PIS capacitor of the present invention is manufactured by using SiGe HBT process, thus providing one more device option for the SiGe HBT process. | 2013-05-09 |
20130113079 | Blocking Layers for Leakage Current Reduction in DRAM Devices - A method for forming a DRAM MIM capacitor stack having low leakage current involves the use of a first electrode that serves as a template for promoting the high k phase of a subsequently deposited dielectric layer. The high k dielectric layer comprises a doped material that can be crystallized after a subsequent annealing treatment. An amorphous blocking is formed on the dielectric layer. The thickness of the blocking layer is chosen such that the blocking layer remains amorphous after a subsequent annealing treatment. A second electrode layer compatible with the blocking layer is formed on the blocking layer. | 2013-05-09 |
20130113080 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - A non-volatile semiconductor storage device contains a memory cell region, a first electrode, and a second electrode. The memory cell region is formed on a substrate and comprises multiple memory cells stacked on the substrate as part of memory strings. Multiple first conductive layers are laminated on the substrate. The first electrode functions as an electrode at one side of a capacitive component and comprises multiple conductive layers stacked on the substrate and separated horizontally from stacked conductive layers of the second electrode which is disposed at a side of the capacitive component opposite the first electrode. | 2013-05-09 |
20130113081 | QUANTUM CAPACITANCE GRAPHENE VARACTORS AND FABRICATION METHODS - A plate varactor includes a dielectric substrate and a first electrode embedded in a surface of the substrate. A capacitor dielectric layer is disposed over the first electrode, and a layer of graphene is formed over the dielectric layer to contribute a quantum capacitance component to the dielectric layer. An upper electrode is formed on the layer of graphene. Other embodiments and methods for fabrication are also included. | 2013-05-09 |
20130113082 | METHOD OF FORMING PATTERN AND DEVELOPER FOR USE IN THE METHOD - Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, (c) developing the exposed film with a developer containing an organic solvent, and (d) rinsing the developed film with a rinse liquid containing an organic solvent, which rinse liquid has a specific gravity larger than that of the developer. | 2013-05-09 |
20130113083 | RESIN COMPOSITION, RESIN FILM, SEMICONDUCTOR DEVICE, AND PRODUCTION METHOD THEREOF - A resin composition which can be formed into a film for use in molding a large diameter thin film wafer is provided. The composition comprises components (A) a silicone resin containing repeating units represented by the following formulae (1-1), (1-2), and (1-3) and having a weight average molecular weight as measured by GPC in terms of polystyrene of 3,000 to 500,000, | 2013-05-09 |
20130113084 | SEMICONDUCTOR SUBSTRATE WITH MOLDED SUPPORT LAYER - Various semiconductor substrates and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes mounting a first semiconductor chip on a side of a first substrate. The first substrate has at least one thru-silicon-via. An insulating layer is molded on the side of the first substrate. The insulating layer provides a support structure to enable handling of the first substrate. | 2013-05-09 |
20130113085 | Atomic Layer Deposition Of Films Using Precursors Containing Hafnium Or Zirconium - Provided are low temperature methods of depositing hafnium or zirconium containing films using a Hf(BH | 2013-05-09 |
20130113086 | SELF-LEVELING PLANARIZATION MATERIALS FOR MICROELECTRONIC TOPOGRAPHY - Planarization methods and microelectronic structures formed therefrom are disclosed. The methods and structures use planarization materials comprising fluorinated compounds or acetoacetylated compounds. The materials are self-leveling and achieve planarization over topography without the use of etching, contact planarization, chemical mechanical polishing, or other conventional planarization techniques. | 2013-05-09 |
20130113087 | SEMICONDUCTOR COMPONENT - A semiconductor component is disclosed. One embodiment provides a semiconductor body having a cell region with at least one zone of a first conduction type and at least one zone of a second conduction type in a rear side. A drift zone of the first conduction type in the cell region is provided. The drift zone contains at least one region through which charge carriers flow in an operating mode of the semiconductor component in one polarity and charge carriers do not flow in an operating mode of the semiconductor component in an opposite polarity. | 2013-05-09 |
20130113088 | CHIP PACKAGING STRUCTURE, CHIP PACKAGING METHOD, AND ELECTRONIC DEVICE - The present invention relates to the field of chip packaging and discloses a chip packaging structure, a chip packaging method, and an electronic device, which are used to solve a problem that in the chip packaging structure, a shielding film formed by a conductive coating easily drops off. The chip packaging structure includes: a printed circuit board PCB; a shielding can, where the shielding can is fixedly set on a component side of the PCB; and a chip to be shielded, where the chip to be shielded is set on the component side of the PCB and is located inside the shielding can, and pins of the chip to be shielded are connected to a first pad on the PCB and the chip to be shielded does not touch the shielding can. The solution provided in the present invention can be applied to chip packaging. | 2013-05-09 |
20130113089 | MODULE IC PACKAGE STRUCTURE HAVING A METAL SHIELDING FUNCTION FOR PREVENTING ELECTRICAL MALFUNCTION INDUCED BY SHORT-CIRCUIT - A module IC package structure having a metal shielding function includes a substrate unit, an electronic unit, a shielding unit, and an insulative unit. The substrate unit includes a substrate body and at least one grounding pad disposed on the substrate body. The electronic unit includes at least one electronic module disposed on the circuit substrate and electrically connected to the circuit substrate. The shielding unit includes a metal shielding layer formed on an external surface of the at least one electronic module, and the metal shielding layer contacts the at least one grounding pad. The insulative unit includes an insulative layer formed on an external surface of the metal shielding layer. Hence, the module IC package structure can be used to prevent electrical malfunction induced by short-circuit due to the design of forming the insulative layer formed on the external surface of the metal shielding layer. | 2013-05-09 |
20130113090 | POWER MODULE, ELECTRICAL POWER CONVERTER, AND ELECTRIC VEHICLE - In order to prevent an increase in temperature of a discharge resistance discharging an electric charge accumulated in a smoothing capacitor, the present description discloses a power module. The power module has a first lead frame, a second lead frame, first and second semiconductor switches connected in series between the first lead frame and the second lead frame, a resistor connected between the first lead frame and the second lead frame, and a resin package that encapsulates the first lead frame, the second lead frame, the first semiconductor switch, the second semiconductor switch, and the resistor. In this power module, a radiator portion for radiating heat from the first lead frame and/or the second lead frame is formed in at least a part of the package. | 2013-05-09 |
20130113091 | METHOD OF PACKAGING SEMICONDUCTOR DIE - A method of packaging a semiconductor die includes the use of an embedded ground plane or drop-in embedded unit. The embedded unit is a single, stand-alone unit with at least one cavity. The embedded unit is placed on and within an encapsulation area of a process mounting surface. The embedded unit may have different sizes and shapes and a number of different cavities that can be placed in a predetermined position on a substrate, panel or tape during processing of semiconductor dies that are embedded into redistributed chip package (RCP) or wafer level package (WFL) panels. The embedded unit provides the functionality and design flexibility to run a number of embedded units and semiconductor dies or components having different sizes and dimensions in a single processing panel or batch and reduces die drift, movement or skew during encapsulation and post-encapsulation cure. | 2013-05-09 |
20130113092 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING INSULATING LAYER DISPOSED OVER THE SEMICONDUCTOR DIE FOR STRESS RELIEF - A semiconductor device has a semiconductor die and conductive layer formed over a surface of the semiconductor die. A first channel can be formed in the semiconductor die. An encapsulant is deposited over the semiconductor die. A second channel can be formed in the encapsulant. A first insulating layer is formed over the semiconductor die and first conductive layer and into the first channel. The first insulating layer extends into the second channel. The first insulating layer has characteristics of tensile strength greater than 150 MPa, elongation between 35-150%, and thickness of 2-30 micrometers. A second insulating layer can be formed over the semiconductor die prior to forming the first insulating layer. An interconnect structure is formed over the semiconductor die and encapsulant. The interconnect structure is electrically connected to the first conductive layer. The first insulating layer provides stress relief during formation of the interconnect structure. | 2013-05-09 |
20130113093 | Semiconductor Device and Method of Forming a Metallurgical Interconnection Between a Chip and a Substrate in a Flip Chip Package - A method for forming metallurgical interconnections and polymer adhesion of a flip chip to a substrate includes providing a chip having a set of bumps formed on a bump side thereof and a substrate having a set of interconnect points on a metallization thereon, providing a measured quantity of a polymer adhesive in a middle region of the chip on the bump side, aligning the chip with the substrate so that the set of bumps aligns with the set of interconnect points, pressing the chip and the substrate toward one another so that a portion of the polymer adhesive contacts the substrate and the bumps contact the interconnect points, and heating the bumps to a temperature sufficiently high to form a metallurgical connection between the bumps and the interconnect points. | 2013-05-09 |
20130113094 | POST-PASSIVATION INTERCONNECT STRUCTURE AND METHOD OF FORMING THE SAME - A semiconductor device includes a conductive layer formed on the surface of a post-passivation interconnect (PPI) structure by an immersion tin process. A polymer layer is formed on the conductive layer and patterned with an opening to expose a portion of the conductive layer. A solder bump is then formed in the opening of the polymer layer to electrically connect to the PPI structure. | 2013-05-09 |
20130113095 | PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A packaging substrate includes a base body having at least a conductive pad on a surface thereof, a dielectric layer formed on the surface of the base body and having at least a first opening for exposing the conductive pad and at least a second opening formed at a periphery of the first opening, and a metal layer formed on the conductive pad and the dielectric layer and extending to a sidewall of the second opening, thereby effectively eliminating side-etching of the metal layer under a solder bump. | 2013-05-09 |
20130113096 | SEMICONDUCTOR DEVICE - A semiconductor device suitable for preventing malfunction is provided. | 2013-05-09 |
20130113097 | METHODS OF AND SEMICONDUCTOR DEVICES WITH BALL STRENGTH IMPROVEMENT - In a method of improving ball strength of a semiconductor device, a ball pattern of a plurality of connection balls to be formed as electrical connections for the semiconductor device is received. The pattern includes a number of columns and rows crossing each other. The balls are arranged at intersections of the columns and rows. An arrangement of balls in a region of the ball pattern is modified so that the region includes no isolated balls. | 2013-05-09 |
20130113098 | THROUGH VIA PACKAGE - An integrated circuit package includes an integrated circuit die in a reconstituted substrate. The active side is processed then covered in molding compound while the inactive side is processed. The molding compound on the active side is then partially removed and solder balls are placed on the active side. | 2013-05-09 |
20130113099 | PACKAGE CARRIER, PACKAGE CARRIER MANUFACTURING METHOD, PACKAGE STRUCTURE FOR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A package substrate including a dielectric layer, a first conductive layer, a second conductive layer and a bonding pad is provided. The dielectric layer has a top surface and a bottom surface. The first conductive layer is embedded into the dielectric layer, and a first surface of the first conductive layer is exposed from the top surface and has the same plane with the top surface. The second conductive layer is embedded into the dielectric layer and contacts the first conductive layer, and a second surface of the second conductive layer is exposed from the bottom surface and has the same plane with the bottom surface. The bonding pad is partially or completely embedded into the first conductive layer and the dielectric layer, so that the periphery of the bonding pad is confined within a cavity by the sidewalls of both the first conductive layer and the dielectric layer. | 2013-05-09 |
20130113100 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF - A semiconductor structure and a manufacturing method thereof are provided. The method includes the following steps. Firstly, a semiconductor substrate having an active surface and a back surface is provided. The active surface is opposite to the back surface, and the semiconductor substrate includes at least one grounding pad disposed on the active surface. Secondly, at least one through silicon via is formed through the semiconductor substrate from the back surface to the active surface thus exposing the grounding pad. Then, a conductive layer is formed on the back surface of the semiconductor substrate and filled into the through silicon via to electrically connect to the grounding pad and the semiconductor substrate. | 2013-05-09 |
20130113101 | Use of Gas Cluster Ion Beam To Reduce Metal Void Formation In Interconnect Structures - A gas cluster ion beam process is used to reduce and/or even eliminate metal void formation in an interconnect structure. In one embodiment, gas cluster ion beam etching forms a chamfer opening in an interconnect dielectric material. In another embodiment, gas cluster ion beam etching reduces the overhang profile of a diffusion barrier or a multilayered stack of a diffusion barrier and a plating seed layer that is formed within an opening located in an interconnect dielectric material. In yet another embodiment, a gas cluster ion beam process deactivates a surface of an interconnect dielectric material that is located at upper corners of an opening that is formed therein. In this embodiment, the gas cluster ion beam process deposits a material that deactivates the upper corners of each opening that is formed into an interconnect dielectric material. | 2013-05-09 |
20130113103 | DEVICE HAVING TSVs WITH GETTERING LAYER LATERAL TO TSV TIPS - An integrated circuit (IC) includes a substrate having a topside semiconductor surface including active circuitry configured to provide functionality and a bottomside surface. A plurality of through substrate vias (TSVs) extend from the topside semiconductor surface to beyond the bottomside surface to provide protruding TSV tips. The TSVs include an outer dielectric liner, a metal comprising diffusion barrier layer on the dielectric liner, and a metal filler on the metal comprising barrier layer. A dielectric metal gettering layer (MGL) is on the bottomside surface lateral to and on sidewalls of the protruding TSV tips. The MGL includes at least one metal gettering agent selected from a halogen or a Group 15 element in an average concentration from 0.1 to 10 atomic %. | 2013-05-09 |
20130113104 | STRUCTURE FOR PICKING UP A BURIED LAYER AND METHOD THEREOF - A structure for picking up a buried layer is disclosed. The buried layer is formed in a substrate and has an epitaxial layer formed thereon. One or more isolation regions are formed in the epitaxial layer. The structure for picking up the buried layer includes a contact-hole electrode formed in each of the isolation regions. A bottom of the contact-hole electrode is in contact with the buried layer. As the structure of the present invention is formed in the isolation region without occupying any portion of the active region, its size is much smaller than that of a sinker region of the prior art. Therefore, device area is tremendously reduced. Moreover, as the contact-hole electrode picks up the buried layer by a metal contact, the series resistance of the device can be greatly reduced. A method of forming the above structure is also disclosed. | 2013-05-09 |
20130113105 | Barrier For Through-Silicon Via - A system and a method for protecting vias is disclosed. An embodiment comprises forming an opening in a substrate. A barrier layer disposed in the opening including along the sidewalls of the opening. The barrier layer may include a metal component and an alloying material. A conductive material is formed on the barrier layer and fills the opening. The conductive material to form a via (e.g., TSV). | 2013-05-09 |
20130113106 | THREE-DIMENSIONAL (3D) INTEGRATED CIRCUIT WITH ENHANCED COPPER-TO-COPPER BONDING - At least one metal adhesion layer is formed on at least a Cu surface of a first device wafer. A second device wafer having another Cu surface is positioned atop the Cu surface of the first device wafer and on the at least one metal adhesion layer. The first and second device wafers are then bonded together. The bonding includes heating the devices wafers to a temperature of less than 400° C., with or without, application of an external applied pressure. During the heating, the two Cu surfaces are bonded together and the at least one metal adhesion layer gets oxygen atoms from the two Cu surfaces and forms at least one metal oxide bonding layer between the Cu surfaces. | 2013-05-09 |
20130113107 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a substrate comprised by gallium arsenide; an active layer provided on the substrate; a first nickel-plated layer provided on a lower face of the substrate facing the active layer; a copper-plated layer provided on a lower face of the first nickel-plated layer; and a second nickel-plated layer provided on a lower face of the copper-plated layer. | 2013-05-09 |
20130113108 | SYSTEM IN PACKAGE PROCESS FLOW - A method comprises connecting a substrate having a plurality of integrated circuit (IC) dies to a package substrate, so that the package substrate extends beyond at least two edges of the substrate, leaving first and second edge portions of the package substrate having exposed contacts. The first and second edge portions meet at a first corner of the package substrate. At least a first upper die package is placed over the substrate, so that first and second edge portions of the first upper die package extend beyond the at least two edges of the substrate. Pads on the first and second edge portions of the first upper die package are connected to the contacts of the first and second edge portions of the package substrate. | 2013-05-09 |
20130113109 | WIRING STRUCTURE, THIN FILM TRANSISTOR ARRAY SUBSTRATE INCLUDING THE SAME, AND DISPLAY DEVICE - On a wiring conversion part connected to a first conductive film and a second conductive film each functioning as a wiring, a hollow portion is formed inside the second conductive film. A first transparent conductive film provided on the second conductive film is formed so as to cover an upper surface of the second conductive film and an end surface thereof exposed on the hollow portion, and so as not to cover an outer peripheral end surface of the second conductive film. A second transparent conductive film which is a layer above the first transparent conductive film is connected to the second conductive film and the first conductive film, so that the first conductive film and the second conductive film are electrically connected. | 2013-05-09 |
20130113110 | Semiconductor Structure Having Lateral Through Silicon Via And Manufacturing Method Thereof - The present invention provides a semiconductor structure having a lateral TSV and a manufacturing method thereof. The semiconductor structure includes a chip having an active side, a back side disposed opposite to the active side, and a lateral side disposed between the active side and the back side. The chip further includes a contact pad, a lateral TSV and a patterned conductive layer. The contact pad is disposed on the active side. The lateral TSV is disposed on the lateral side. The patterned conductive layer is disposed on the active side and is electrically connected to the lateral TSV and the contact pad. | 2013-05-09 |
20130113111 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME - A semiconductor device and methods directed toward preventing a leakage current between a contact plug and a line adjacent to the contact plug, and minimizing capacitance between adjacent lines. | 2013-05-09 |
20130113112 | SEMICONDUCTOR DEVICE - A local interconnect is formed in contact with an upper surface of an impurity diffusion region and extends to below a potential supply interconnect. A contact hole electrically couples the local interconnect to the potential supply interconnect. The local interconnect, which is formed in contact with the upper surface of the impurity diffusion region, is used for electrically coupling the impurity diffusion region to the potential supply interconnect. | 2013-05-09 |
20130113113 | WIRING STRUCTURE IN A SEMICONDUCTOR DEVICE, METHOD OF FORMING THE WIRING STRUCTURE, SEMICONDUCTOR DEVICE INCLUDING THE WIRING STRUCTURE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - A wiring structure in a semiconductor device may include a first insulation layer formed on a substrate, a first contact plug, a capping layer pattern, a second insulation layer and a second contact plug. The first insulation layer has a first opening that exposes a contact region of the substrate. The first contact plug is formed on the contact region to partially fill up the first opening. The capping layer pattern is formed on the first contact plug to fill up the first opening. The second insulation layer is formed on the capping layer pattern and the first insulation layer. The second insulation layer has a second opening passing through the capping layer pattern to expose the first contact plug. The second contact plug is formed on the first contact plug in the second opening. Since the wiring structure includes the capping layer pattern, the wiring structure may prevent a contact failure by preventing chemicals from permeating into the first contact plug. | 2013-05-09 |
20130113114 | Device Including Two Power Semiconductor Chips and Manufacturing Thereof - A device includes a first power semiconductor chip having a first face and a second face opposite to the first face with a first contact pad arranged on the first face. The first contact pad is an external contact pad. The device further includes a first contact clip attached to the second face of the first power semiconductor chip. A second power semiconductor chip is attached to the first contact clip, and a second contact clip is attached to the second power semiconductor chip. | 2013-05-09 |
20130113115 | SYSTEM IN PACKAGE PROCESS FLOW - A method comprises connecting a substrate having a plurality of integrated circuit (IC) dies to a package substrate, so that the package substrate extends beyond at least two edges of the substrate, leaving first and second edge portions of the package substrate having exposed contacts. The first and second edge portions meet at a first corner of the package substrate. At least a first upper die package is placed over the substrate, so that first and second edge portions of the first upper die package extend beyond the at least two edges of the substrate. Pads on the first and second edge portions of the first upper die package are connected to the contacts of the first and second edge portions of the package substrate. | 2013-05-09 |
20130113116 | Contact and Method of Formation - A system and method for forming contacts is provided. An embodiment comprises forming the contacts on a substrate and then coining the contacts by physically shaping them using, e.g., a molding chamber. The physical shaping of the contacts may be performed using a patterned portion of the molding chamber or else by placing a patterned stencil around the contacts prior before a force is applied to physically reshape the contacts. The contacts may be reshaped into a cylindrical, oval, cuboid, or rectangular shape, for example. | 2013-05-09 |
20130113117 | Wireless Communication Devices With In-Package Integrated Passive Components - Embodiments of the present disclosure can be used to both reduce the size and cost and improve the performance and power consumption of next generation wireless communication devices. In particular, embodiments enable board and semiconductor substrate area savings by using the fabrication package (which encapsulates the semiconductor substrate) as a design element in the design of next generation wireless communication devices. Specifically, embodiments use the substrate of the fabrication package to integrate into it components of the wireless radio transceiver (which are conventionally integrated into the semiconductor substrate) and other discrete components of the communication device (which are conventionally placed on the board of the device). As such, reduced board and semiconductor area can be realized. | 2013-05-09 |
20130113118 | Semiconductor Device and Method of Forming Sloped Surface in Patterning Layer to Separate Bumps of Semiconductor Die from Patterning Layer - A semiconductor device has a semiconductor die with bumps formed over a surface of the semiconductor die. A conductive layer is formed over a substrate. A patterning layer is formed over the substrate and conductive layer. A masking layer having an opaque portion and linear gradient contrast portion is formed over the patterning layer. The linear gradient contrast portion transitions from near transparent to near opaque. The patterning layer is exposed to ultraviolet light through the masking layer. The masking layer is removed and a portion of the patterning layer is removed to form an opening having a sloped surface to expose the conductive layer. The sloped surface in patterning layer can be formed by laser direct ablation. The semiconductor die is mounted to the substrate with the bumps electrically connected to the conductive layer and physically separated from the patterning layer. | 2013-05-09 |
20130113119 | SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM - A semiconductor device bonded by an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition having a solid content ratio between a polymer binder system and a curing system of about 40:60 to about 60:40, and a coefficient of thermal expansion of about 150 ppm/° C. or less at about 100° C. or less. | 2013-05-09 |
20130113120 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device includes a metal substrate; a semiconductor element placed on the metal substrate; a flexible circuit substrate that has one end placed on the metal substrate and is electrically connected to the semiconductor element, the flexible circuit substrate extending over an edge of the metal substrate to outside the metal substrate; a resin wall portion placed, in an outer periphery of the metal substrate, at least at the edge of the metal substrate over which the flexible circuit substrate extends, the resin wall portion being provided on the flexible circuit substrate at the edge; and a resin seal portion provided inside the resin wall portion so as to cover the metal substrate. | 2013-05-09 |
20130113121 | RESIN PASTE COMPOSITION - The present invention relates to a resin paste composition including an organic compound, and a granular aluminum powder having an average particle diameter of from 2 to 10 μm and a flake-shaped silver powder having an average particle diameter of from 1 to 5 μm which are uniformly dispersed in the organic compound, and a semiconductor device manufactured by bonding a semiconductor element onto a supporting member through the resin paste composition and then encapsulating the resulting bonded product. According to the present invention, it is possible to provide a resin paste composition used for bonding an element such as semiconductor chips onto a lead frame which is excellent in not only electrical conductivity and bonding property but also working efficiency without using a large amount of rare and expensive silver, and a semiconductor device having a high productivity and a high reliability. | 2013-05-09 |
20130113122 | EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE - An epoxy resin composition for encapsulating a semiconductor chip according to this invention comprises (A) a crystalline epoxy resin, (B) a phenol resin represented by general formula (1): | 2013-05-09 |
20130113123 | EVAPORATIVE HUMIDIFIER - An evaporative humidifier includes a humidifying element having water pockets drawing water up from a tub and then supplying the water to the upper portion of the humidifying element. The water pockets are formed between first and second covers. A first water pocket formation unit is provided on the first cover, a second water pocket formation unit is provided on the second cover, and the first and second water pocket formation units form the water pockets when the first and second covers are coupled. Therefore, the water pockets are formed through molds having a simple structure, as compared to the conventional water pocket, and thus manufacturing costs of the humidifying element assembly are reduced. Further, each water pocket includes plural sub water pockets formed at both sides of an inflow hole formed at the center of each water pocket, and thus carries a large amount of water. | 2013-05-09 |
20130113124 | Carbonated Water Manufacturing Device - A carbonated water manufacturing device, including a sleeve and a bottle cap which are mutually independent, wherein the sleeve includes a sleeve body and a plug body inside the sleeve; the sleeve body and the plug body are provided with a first through-hole and a second through-hole at their side surfaces, respectively; the bottle cap is provided with a perforated through-hole whose bottom is connected with an injection tube; the upper part of the bottle cap is fittingly connected with the lower part of the plug part; the opening at the lower part of the sleeve body is fittingly connected with the lower part of the outer edge of the bottle cap, and the top of the sleeve body acts on the carbon dioxide housing body in the sleeve body; the connection of the lower part of the bottle cap and the injection tube is provided with a check valve. | 2013-05-09 |
20130113125 | ROTATING UNIT-BASED MICRO-SIZED BUBBLE GENERATOR - The present invention relates to a micro-sized bubble generator. A micro-sized bubble generator using a highly-dissoved solution based on a rotating unit according to an exemplary embodiment of the present includes: a rotating unit receiving a mixture of water and gas and discharging a solution while making the water and gas collide with each other and rotating the same; a dissolving tank storing the solution discharged from the rotating unit; and a nozzle unit receiving the solution and generating micro-sized bubbles in the water. Accordingly, a massive amount of micro-sized bubbles less than 100 nm in size can be generated. | 2013-05-09 |
20130113126 | AIR-TO-AIR ATMOSPHERIC EXCHANGER - A sheet for use in a heat exchange apparatus. The sheet includes a first vertical rib that extends generally parallel to the vertical axis of the heat exchange apparatus. The sheet also includes a second vertical rib that extends, substantially all the way between the first and second edges of the sheet generally parallel to the first vertical rib. The sheet further includes a first horizontal rib that extends substantially all the way between the third and fourth edges of the sheet. The sheet additionally includes a second horizontal rib that extends substantially all the way between the third and fourth edges of the sheet generally parallel to the first horizontal rib. | 2013-05-09 |
20130113127 | AIR-TO-AIR ATMOSPHERIC EXCHANGER - A sheet for use in a heat exchange apparatus. The sheet includes a first vertical rib that extends in a first direction and protrudes in a second direction out of the plane. The sheet also includes a second vertical rib that extends in the first direction along the sheet, between the first and second edges of the sheet. The second vertical rib also protrudes in the second direction out of the plane. The sheet further includes a first horizontal rib that extends in a third direction along the sheet between the third and fourth edges of the sheet, and protrudes in a fourth direction opposite said second direction. The sheet additionally includes a second horizontal rib that extends in the third direction along the sheet between the third and fourth edges of the sheet. The second horizontal rib protrudes in a fourth direction and intersects said second vertical rib. | 2013-05-09 |
20130113128 | DEVICE FOR BRINGING ABOUT A PHASE CONTACT BETWEEN A LIQUID PHASE AND A GASEOUS PHASE, IN PARTICLUAR A HEAT AND MASS TRANSFER COLUMN - The invention relates to a device (column) for bringing about a phase contact between a liquid phase and a gaseous phase, in particular a material exchange column, comprising: a shell, which extends along a longitudinal axis and bounds a shell space, at least a first circular tray, arranged in the shell space, for taking up the liquid phase, which extends crosswise to the longitudinal axis, whereby the at least one first tray has through openings for passage of a gaseous phase, so that the gaseous phase can come into phase contact with the liquid phase that is located on the at least one first tray. According to the invention, a large number of sealing weirs projecting from the first tray along the longitudinal axis are provided, which extend in each case along a radial direction of the at least one first tray, so that the first tray is divided into a corresponding plurality of sectors. In addition, the invention relates to an apparatus comprising such a device and a floatable carrier. | 2013-05-09 |
20130113129 | Enzyme Delivery Systems and Methods of Preparation and Use - This invention relates to coated digestive enzyme preparations and enzyme delivery systems and pharmaceutical compositions comprising the preparations. This invention further relates to methods of preparation and use of the systems, pharmaceutical compositions and preparations to treat persons having ADD, ADHD, autism, cystic fibrosis and other behavioral and neurological disorders. | 2013-05-09 |
20130113130 | METHOD FOR PREPARING CARBON FIBER AND PRECURSOR FIBER FOR CARBON FIBER - The method for preparing a carbon fiber of the present invention includes the steps of: preparing a polyacrylonitrile-based polymer solution; spinning the polyacrylonitrile-based polymer solution to prepare a precursor fiber for a carbon fiber, the precursor fiber having a water content of 20-50%; converting the precursor fiber for a carbon fiber into a preliminary flame-retarded fiber while stretching the precursor fiber for a carbon fiber at an elongation rate of −10˜−0.1% or 0.1˜5% at 180˜220° C. in air; converting the preliminary flame-retarded fiber into a flame-retardant fiber while stretching the preliminary flame-retarded fiber at an elongation rate of −5˜5% at 200˜300° C. in air; and heating the flame-retardant fiber under an inert atmosphere to carbonize the flame-retardant fiber. | 2013-05-09 |
20130113131 | Method and Apparatus for Substantially Constant Pressure Injection Molding of Thinwall Parts - A substantially constant pressure injection molding method and machine that forms molded parts by injecting molten thermoplastic material into a mold cavity at a substantially constant pressure. As a result, the mold cavity is filled with molten thermoplastic material by advancing a continuous flow front of thermoplastic material from a gate to an end of the mold cavity. | 2013-05-09 |
20130113132 | PELLETIZING DEVICE AND METHOD - Pelletizing device and method for pelletizing pelletizing materials having a pelletizing disk inclined to the horizontal and provided rotatable wherein the pelletizing disk is driven via a motor device. The pelletizing disk comprises a bottom and a side wall, the effective height of the side wall being variable. The side wall comprises an inner side wall device and an outer side wall device, the inner side wall device being disposed height-adjustable relative to the outer side wall device. | 2013-05-09 |
20130113133 | Impregnation Assembly and Method for Manufacturing a Composite Structure Reinforced with Long Fibers - The present invention provides an impregnation system suitable for impregnating filaments continuously with an impregnating substance, said system may comprise an impregnation assembly comprising (a) at least one axial passageway for the filaments having an entrance end and an exit end and (b) at least one passageway for the impregnating substance having at least one inlet for the impregnating substance and at least two outlets for the impregnating substance leading into the passageway for the filaments via the outlets for the impregnating substance, wherein the passageway for the filaments has an oblong cross-section at the outlet point for the impregnating substance, and the at least two outlets for the impregnating substance have an oblong cross-section, and are disposed essentially opposite to each other, at the opposite widths of the passageway for the filaments. Thus, the present invention proposes an in-line system for manufacturing continuous fiber reinforced thermoplastic structure which comprises a simple device to provide strands in spread filaments form without using high friction or tension on the strand or filaments so as to ease the impregnation step and to allow higher line speeds and lower cycle times. | 2013-05-09 |
20130113134 | APPARATUS AND PROCESS FOR PRODUCING PRODUCTS FROM PIGMENT-CONTAINING POLYMER MIXTURES - The invention relates to an apparatus and a process for producing pigment-containing, in particular carbon-black-containing, polymer mixtures comprising polycarbonates and optionally elastomers, and/or other components, where the mouldings produced therefrom have, after the shaping process via injection moulding or via extrusion, improved surface properties and improved mechanical properties. | 2013-05-09 |
20130113135 | Process for Producing Exfoliated and/or Dispersed Polymer Composites and/or Nanocomposites via Solid-State/Melt Extrusion (SSME) - A method for solid-state/melt extrusion, as can be accomplished using a unitary extruder apparatus comprising a solid-state shearing zone and a melt-state extrusion zone. | 2013-05-09 |
20130113136 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - The present invention provides an imprint apparatus which performs an imprint process, the apparatus including a holding unit configured to hold a mold, a stage configured to hold a substrate, and a control unit configured to control the imprint process, wherein in the imprint process for an outer peripheral shot region among shot regions on the substrate, the control unit controls at least one of the holding unit and the stage to relatively rotate the mold and the substrate so that an outermost portion, in a radial direction of the substrate, of the imprint material supplied to the outer peripheral shot region at least partially separates from the mold last. | 2013-05-09 |
20130113137 | THERMOFORMING PRESS AND THERMOFORMING PROCESS - A press for thermoforming a thermoformable sheet material for obtaining at least one thermomolded object, which has a support base; a pair of female molds supported for rotation around a rotation axis on the support base, diametrically opposite with respect to the rotation axis, drive means for the pair of female molds, comprising a rotary motion source designed to drive a power drive shaft and transmission means designed to transmit the motion from the power drive shaft to the pair of female molds, whereby between power drive shaft and female mold pair there is an angular displacement ratio of an angle greater than 360°, preferably 405°/180°, in order to make the female mold pair complete a sequence of 180° angular travels, thereby angularly and sequentially move each female mold into a molding position, and into a discharge position. | 2013-05-09 |
20130113138 | WHEAT GLUTEN BASED COMPOSITIONS AND ARTICLES MADE THEREFROM - Disclosed herein are wheat gluten based compositions having improved mechanical properties as well as articles formed therefrom, and methods of making the same. More particularly, the compositions also include fibrous reinforcing material and may be formed into a variety of products, including but not limited to particle board. | 2013-05-09 |
20130113139 | APPARATUS FOR PROCESSING PLASTICS MATERIAL - Disclosed is a device and a method for processing plastic material with at least one receiving container, wherein at least one mixing and/or comminution tool, rotatable about a rotation axis, is arranged, for mixing and warming the plastic material, and with at least one conveyor for discharging the plastic material from the receiving container, with at least one screw rotating in a housing, where the conveyor is connected, at its material inlet side via an opening which is formed in a side wall of the receiving container, with the interior of the receiving container. An imaginary extension of the central longitudinal axis of the conveyor extends, against the conveyance direction of the conveyor, past the rotation axis of the receiving container, without intersecting this axis, where the longitudinal axis of the conveyor is offset by a separation relative to the radial ray of the receiving container on the discharge side. | 2013-05-09 |
20130113140 | CELL PORATION - A method for porating one or more cells comprising positioning a particle near each cell; and causing laser-induced breakdown of the particle to create one or more cavitations, wherein the cavitation(s) causes poration of the cell. | 2013-05-09 |
20130113141 | HEATED MOULD AND A METHOD FOR FORMING FIBRE REINFORCED COMPOSITES - A method for forming fibre reinforced composites, such as rotor blades for wind turbines, and a heated mould. The mould includes an active surface intended to be in contact with the composite and a core member comprising a cell structure. One or more conduit(s) is/are embedded in the core member forming a path through the cell structure, and one or more heating wire(s) is/are arranged in said conduit(s). The core member is preferably made from a material with a high thermal conductivity and may include openings in at least some cell walls of the cell structure to allow fluids to pass there through. The mould may include two or more heating zones. | 2013-05-09 |
20130113142 | High Flow Edge Breather and Method - A breather for vacuum bag processing of a part comprises a sleeve of resilient material placed around the part. | 2013-05-09 |
20130113143 | METHOD OF FORMING A CONTAINER BY BLOWING AND FILLING - A method of forming a container ( | 2013-05-09 |
20130113144 | BLOW-MOULDING MACHINE WITH AUTOMATIC OPTIMIZATION OF THE PROCESS ANGLE - A method of shaping plastics material pre-forms into plastics material containers with the steps:
| 2013-05-09 |
20130113145 | MOUNT STRUCTURE FOR VEHICLE DAMPER - A mount structure for a vehicle damper, configured in such a manner that an end of the piston rod ( | 2013-05-09 |
20130113146 | CLAMP DEVICE - A grip member is inserted into an insertion hole of a cylindrical clamp body and is capable of extending outwards to grip the inner circumferential surface of an aperture of an article. A clamp rod is engaged with the grip member; a driving mechanism capable of driving the clamp rod forwards and backwards; a seating surface formed at the top end of the cylindrical clamp body; a case member supporting the cylindrical clamp body movably forwards and backwards; a driving mechanism capable of raising an lowering the cylindrical clamp body; and a lock mechanism having a cylindrical member into which the cylindrical clamp body is inserted so as to slide freely and capable of locking the outer circumferential surface of the cylindrical clamp body by elastically deforming the cylindrical member so as to reduce its diameter. | 2013-05-09 |
20130113147 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD - A substrate processing apparatus including a transfer unit for transferring, under reduced pressure, a laminate including a wafer and a support plate which are bonded to each other and supported by use of support pins that supports an inner periphery of a first surface of the wafer, the first surface being opposite to a second surface of the wafer onto which a second surface the support plate is bonded. | 2013-05-09 |
20130113148 | COMMON CRP CART FOR MULTI VEHICLE MODEL - A common CRP cart for multiple vehicle models is disclosed. The common CRP cart may clamp a cowl panel, a roof rail and a package tray for assembling a vehicle body, and may move upwardly and downwardly at a working room for a build-up process. The common CRP cart may include a frame; a first aligning unit connected to one portion of the frame for clamping a cowl panel of various vehicle models having different specifications; a second aligning unit connected to another portion of the frame for clamping a roof rail of various vehicle models having different specifications; and a third aligning unit connected to the other portion of the frame for clamping a package tray of various vehicle models having different specifications. | 2013-05-09 |
20130113149 | APPARATUS FOR CLAMPING PANEL FOR VEHICLE - Disclosed is an apparatus for clamping a panel comprising: a base frame; first movable units mounted on left and right portions of the base frame and adapted to reciprocate first sliding plates between the left and right; second movable units mounted on front and rear portions of the base frame between the first movable units and adapted to reciprocate second sliding plates between the front and rear; first clamping units movable between the left and right through the first sliding plates, and movable upward and downward through first vertically-movable means; a second clamping unit movable between the front and rear through the second sliding plate and movable upward and downward through second vertically-movable means; and a third clamping unit movable between the front and rear through the second sliding plate and movable upward and downward through third vertically-movable means. | 2013-05-09 |
20130113150 | CLAMP ASSEMBLY - A clamp assembly including a header assembly with first and second ends and a plunger having an aperture with a portion of the aperture being threaded, the aperture forming a portion of a bore extending through the header assembly. First and second arms, in opposing spaced relationship, are connected to the first and second ends, respectively, of the header assembly. A ram assembly having first and second ends, each end having a passageway through which at least a portion of one of the first and second arms extend. A stem assembly including an upper stem end coupled to a handle, a lower stem end rotatably connected to the ram assembly, and a threaded stem portion designed to engage the aperture threaded portion. The plunger has engaged and disengaged positions in which the aperture threaded portion and the threaded stem portion are threadedly engaged and disengaged, respectively, with each other. | 2013-05-09 |
20130113151 | Crushing Bags and Methods for Use and Manufacture - A pill crusher pouch is constructed of a flexible sheet material having an open top and an open bottom, wherein the open bottom is dimensionally smaller than the open top, forming a funnel-like internal pouch cavity, and a crease near the bottom of the pouch that allows a user to easily fold the pouch to form a temporary seal that prevents crushed pill product from dispensing through the open bottom until the user unfolds the pouch. | 2013-05-09 |
20130113152 | Adaptive Registration/Binding Apparatus For Preparing Collations - An apparatus for preparing a collation of sheets for folding operations. The system includes a registration device including multiple registration stations and a conveyance device for transporting the collation to one of the registration stations. Each registration station is adapted to register the edges of the collation based upon a desired edge geometry. A processor determines the fold configuration of the collation and determines the edge geometry thereof based upon the fold configuration of the collation. The processor selects one of the registration stations based upon the fold configuration and then controls the conveyance device to transport the collation to the selected registration station. The registration station selected may also be based upon the thickness of the collation and a desired location for binding the collation. | 2013-05-09 |
20130113153 | SYSTEM AND METHOD FOR PREPARING COLLATIONS - A system for preparing a collation of sheets for a subsequent folding operation wherein edges of the collation are aligned to eliminate the need for additional trimming operations. The system comprises: a cutting device operative to cut each sheet of the collation based upon a length dimension of each of the inner and outer sheets, an accumulating device operative to stack the sheets to form the collation, a registration device operative to register at least one edge of the collation, a conveyance device for transporting the sheet material along a feed path to the cutting, accumulating and registration devices, and a processor operatively coupled to, and controlling, the cutting, accumulating, registration and conveyance devices. | 2013-05-09 |
20130113154 | Sheet Processing Apparatus, Image Forming System, And Sheet Processing Method - A sheet processing apparatus including front and back trailing-end reference fences that are movable along a sheet trailing-end and on which the sheet trailing-end abuts to align the sheet trailing-end, a side-stitching stapler that moves along the sheet trailing-end and binds a bundle of sheets aligned, a length-direction moving mechanism that moves the trailing-end reference fences in a sheet conveying direction, and a position changing unit that drives the length-direction moving mechanism to change the position of one of the trailing-end reference fences in the sheet conveying direction relative to the position of the other one. The front and back trailing-end reference fences are moved by the position changing unit in the sheet conveying direction to change binding positions such that the distances from the sheet trailing-end to staple positions are made equal in front-side binding and in back-side binding. | 2013-05-09 |
20130113155 | PRINTING APPARATUS, METHOD FOR CONTROLLING SAME, AND STORAGE MEDIUM - A printing apparatus has a first storage unit, a second storage unit, a reception unit that receives a job, a switching unit that switches the storage unit that is used, from the storage unit currently in use to another storage unit holding the same type of sheets as the storage unit currently in use, when the remaining amount of sheets in the storage unit currently in use reaches a predetermined amount during the execution of the job, and a control unit that controls the timing at which blowing of air into the sheets held in the other storage unit is started, to vary this timing depending on whether the type of sheets held in the storage unit currently in use or in the other storage unit is the first type of sheets or the second type of sheets. | 2013-05-09 |
20130113156 | FEEDER MECHANISM WITH ADJUSTABLE PICKUP HEADS - In a sheet feeder apparatus, a feeder mechanism for picking up sheets from a stack of sheets of a material includes a support bar, at least one pickup head, and an adjuster. The support bar includes cylindrical ends and an intermediate portion between the cylindrical ends. The cylindrical ends are configured to pivotally couple to control arms of the sheet feeder apparatus. The pickup heads are coupled to the intermediate portion of the support bar and an adjuster is coupled to the support bar at one of the cylindrical ends. The adjuster includes a bracket coupled to the intermediate portion of the support bar, a pivot arm selectively pivotable about the cylindrical end of the support bar, and an adjustment mechanism coupled between the bracket and the pivot arm. The adjustment mechanism pivots the support bar relative to the pivot arm to thereby tilt the pickup heads. | 2013-05-09 |
20130113157 | SHEET FEEDER AND IMAGE FORMING APPARATUS INCLUDING SAME - A sheet feeder mountable to a body of an apparatus includes a bottom plate on which the sheets are placed and a bottom plate lift unit including a bottom plate pusher disposed beneath the bottom plate, a rack member to rotate the bottom plate pusher vertically by moving horizontally, a pinion gear to move the rack member horizontally, a biasing member to pull the bottom plate pusher toward the rack member, attached therebetween, and a position detector to detect positions of the rack member and the pinion gear. The pinion gear is coupled using projection-and-recess engagement to a rotation transmission device provided to the body, and a quantity of tooth Z | 2013-05-09 |
20130113158 | IMAGE FORMING APPARATUS - A reference member which regulates a position of one side end of a sheet along the sheet conveying direction is provided at one side of a sheet conveying path in the width direction so as to follow the sheet conveying direction and to be rotatable about its downstream end portion in the sheet conveying direction. Then, one side end of the sheet is skew-conveyed toward the reference member by a plurality of pair of skew-conveying rollers which is arranged in the sheet conveying path along the sheet conveying direction. Then, when forming an image on both faces of the sheet, a control portion rotates the reference member so that the sheet is displaced to the center side in the sheet conveying path compared to the case of forming an image on one face of the sheet. | 2013-05-09 |
20130113159 | Paper Money Processing Apparatus Having Structure for Easily Preventing Paper Money Jams - The present invention relates to a paper money processing apparatus. In the paper money processing apparatus for sorting and counting paper money, the apparatus is divided into three parts in order for sections of a transfer path to open the whole transfer path. When jammed paper money is removed, portions separated from a fixed main body are linked with each other through links to remove the jammed paper money through only one operation. | 2013-05-09 |
20130113160 | PRINT CONTROL APPARATUS AND PRINT CONTROL METHOD - An apparatus includes a print control unit, a determining unit, and a control unit. The print control unit causes a printing unit to print an image on a sheet and causes one of a plurality of discharge units to discharge at least one sheet on which the image is printed by the printing unit facing downward. The determining unit determines whether some of the discharge units are to be used for discharging sheets for an input print job. In response to determining that the some of the discharge units are to be used for the input print job, the print control unit discharges the sheets to the some of the discharge units such that a former page of the sheets is discharged to a lower-level discharge unit and a latter page of the sheets is discharged to an upper-level discharge unit. | 2013-05-09 |
20130113161 | PINBALL MACHINE AND REDEMPTION SYSTEM - In one embodiment there is provided a pinball game comprising a play field having a plurality of different achievable objects, a plurality of different reward cards, each reward card associated with one of the achievable objects and capable of being dispensed by a card dispenser in response to the achieving of its associated achievable object, and wherein at least one reward card is dispensed by the card dispenser during or after game play upon at least one of the achievable objects being achieved, and wherein a different reward card is dispensed depending on the achievable object that is achieved. In one embodiment, a networked redemption system is associated with the game and the game further enables connectivity with social media and/or other publishing avenues for communicating information about the player and/or game play. | 2013-05-09 |
20130113162 | Low and Reverse Pressure Application Hydrodynamic Pressurizing Seals - The present invention relates to circumferential seal ring segments positioned around a rotating shaft so as to prevent fluids from leaking from a lubricant sump during both low and high pressure conditions. The circumferential seal is comprised of a plurality of adjoining annular ring segments facing the rotating shaft. Each sealing ring segment includes a dead end circumferential groove on a shaft-side face of each sealing ring such that, when the segments are joined, the circumferential dead end groove of each segment extends arcuately in the direction of shaft rotation. At least one additional groove is contained on the shaft-side face of each sealing ring segment. The additional groove(s) directs and creates pressurized air within the dead end circumferential groove, either directly or indirectly maintaining a seal between the ring segments and the shaft. A bleed hole may also be provided to create a seal between each sealing segment. | 2013-05-09 |
20130113163 | Maintenance and Emergency Run Secondary Seal - A maintenance and emergency run secondary seal mountable to a rotatable shaft is described. The seal includes a housing; a sealing ring having a double-tapered receiving channel located between two exterior surfaces and an interior wear surface; a lantern ring having a double-tapered profile for enabling engagement within the receiving channel of the sealing ring to form an air chamber between the sealing ring and the lantern ring; and an arrangement for directing and controlling pressurized air to the air chamber. The operating positions for the sealing ring are: where the sealing ring is spaced from the shaft, where a portion of the interior wear surface of the sealing ring is closed-in on the shaft to enable an emergency run secondary seal to permit shaft rotation and where the sealing ring is in full contact with the shaft to enable a static seal. | 2013-05-09 |
20130113164 | PISTON RING WITH A WEAR-RESISTANT COBALT COATING - A piston ring is provided having a bottom surface, a top surface, an inner diameter surface and at least one running surface. A wear protection coating substantially entirely of cobalt is applied to the at least one running surface to protect the base material of the piston ring. Specifically, during operation of an engine, the more durable cobalt wear resistant coating, not the base material which may be steel or cast iron, is in sliding contact with a cylinder wall. The cobalt coating may be applied through, for example, electrodeposition or plasma spraying. | 2013-05-09 |
20130113165 | PISTON BEARING STRUCTURE FOR FLUID PRESSURE CYLINDER - A piston bearing structure for a fluid pressure cylinder includes one seal ring which is housed in a housing groove of a piston and is held in sliding contact with a cylinder tube and two backup wear rings which is housed in a housing groove of a piston, is held in sliding contact with a cylinder tube and sandwiches the seal ring. The backup wear ring includes a pressure relief groove which faces the housing groove and extends over the backup ring portion and the wear ring portion, and the pressure relief groove allows opposite sides of the backup wear ring to communicate between the piston and the cylinder tube. | 2013-05-09 |
20130113166 | Sealing module for sealing around an elongated conduit - A sealing module comprising two module halves ( | 2013-05-09 |
20130113167 | HYGIENE-COMPLIANT DISPLAY AND CONTROL DEVICE - Machines and systems for chemical, foodstuffs and pharmaceuticals industry are subject to particularly demanding requirements for hygiene. In particular, equipment used in such machines, must avoid any gaps, in which dirt, bacteria or germs could settle. To avoid this, a hygiene-compliant display and control device having a front plate is proposed, having a peripheral groove, which is open on the outer peripheral surface of the front plate, on the outer edge of the front plate, and a sealing element fitted in the peripheral groove. The outer peripheral surface of the sealing element is arranged flush with the outer peripheral surface of the front plate, and a number of clamping arrangements with a pressing element are provided on the display and control device distributed around the periphery. One axial end of the pressing element engages with a fixing frame, which rests on the mounting plate, or with the mounting plate. | 2013-05-09 |
20130113168 | METAL GASKET FOR A GAS TURBINE ENGINE - A gasket assembly for a gas turbine engine includes a seal portion defining outer surfaces for providing sealing contact and a bias portion defining inner structures that are spaced apart from the seal portion for biasing the outer surfaces into sealing contact. The gasket further includes end portions disposed at ends of the seal portion that including a material thickness greater than a thickness of the bias portion. | 2013-05-09 |