20th week of 2020 patent applcation highlights part 84 |
Patent application number | Title | Published |
20200154530 | INDUCTION HEATING DEVICE HAVING IMPROVED INSULATION STRUCTURE - An induction heating device includes: a base plate; a working coil disposed vertically above the base plate, the working coil including a conducting wire that is annularly wound; a ferrite core that is disposed on an upper surface of the base plate, that is disposed vertically below the working coil, and that is configured to direct upward an alternating magnetic field generated by the working coil; and an insulating member attached to an outer portion of the ferrite core and configured to electrically insulate the working coil from the base plate. | 2020-05-14 |
20200154531 | INDUCTION HEATING DEVICE HAVING NEGATIVE VOLTAGE PROTECTION CIRCUIT - An induction heating device includes a working coil, an inverter including a first switching element and a second switching element; a gate driver including a first sub-gate driver and a second sub-gate driver; and a protection circuit disposed between the inverter and the gate driver. The protection circuit includes a first resistor disposed between a gate terminal of the first switching element and an output terminal of the first sub-gate driver, a second resistor connected electrically in parallel to the first resistor, a protection circuit resistor disposed between a reference voltage terminal of the first sub-gate driver and a first node between the first switching element and the second switching element, a protection circuit diode disposed between a ground and a second node between the protection circuit resistance and the reference voltage terminal, and a bootstrap circuit disposed between the second node and the external power supply. | 2020-05-14 |
20200154532 | INDUCTION HEATING DEVICE HAVING IMPROVED FERRITE CORE SHAPE - An induction heating device includes: a working coil including a conducting wire that is wound in an annular shape and that is connected to a plurality of electric terminals; a ferrite core disposed vertically below the working coil and configured to direct upward an alternating magnetic field generated by the working coil, the ferrite core defining a stepped portion at each corner of the ferrite core; a base plate that supports the ferrite core on an upper surface of the base plate and that defines a connection hole having a shape corresponding to the corner of the ferrite core; and an indicator substrate disposed vertically below the base plate. The indicator substrate includes a connector that is disposed on an upper surface of the indicator substrate, that is coupled to one or more of the plurality of electric terminals, and that protrudes upward through the connection hole. | 2020-05-14 |
20200154533 | RADIO FREQUENCY DETECTION DEVICE AND DETECTION METHOD, AND MICROWAVE OVEN - The present disclosure provides a radio frequency detecting device, a detecting method, and a microwave oven, and the radio frequency detecting device comprises: a signal transmitting device configured to generate and transmit multiple forward frequency detecting signals of different frequencies; a signal receiver configured to receive multiple reverse frequency detecting signals reflected by the load; a first detection device configured to detect each first parameter corresponding to each of the forward frequency detecting signals; a second detection device configured to detect each second parameter of each of the reverse frequency detecting signals; and a microcontroller configured to determine a state parameter of the load based on the multiple frequencies and the first parameter and the second parameter corresponding to each of the frequencies. | 2020-05-14 |
20200154534 | SYSTEM AND METHOD FOR PROTECTING MICROWAVE MAGNETRONS - An exemplary method for protecting a microwave magnetron is disclosed provided by the steps of positioning one or more containers on a conveyer belt which passes through the microwave oven, where each container is holding a liquid. Further comprising the steps of ramping up the magnetron while a container is passing through the microwave oven, positioning product for microwaving on the conveyer belt, and applying microwave energy to the product. A system for protecting a magnetron is also disclosed comprising a plurality of containers, each container holding a liquid and positioned atop the conveyer belt before placing a product for microwaving on the conveyer. | 2020-05-14 |
20200154535 | METHOD FOR DETECTING THE STATUS OF POPCORN IN A MICROWAVE - A method of popping popcorn in a microwave includes operating an energy source to provide energy to a cooking chamber and detecting, by a microphone sensor, sound waves in the cooking chamber and providing an output signal indicative of the detected sound waves to a control unit. The control unit can determine that the output signal is indicative of a popping sound generated by popcorn kernels popping and control the energy source to stop providing energy to the cooking chamber based on the detected popping sounds. | 2020-05-14 |
20200154536 | RIPPLE SUPPRESSOR - A ripple suppressor includes a constant current generation circuit and a voltage regulation circuit. The constant current generation circuit is coupled to a light-emitting diode chain, wherein the constant current generation circuit is used for generating a detection voltage, and generating a constant current to the light-emitting diode chain. The voltage regulation circuit is coupled to the light-emitting diode chain and the voltage regulation circuit, wherein the voltage regulation circuit makes the constant current generation circuit generate the constant current according to the detection voltage and a compensation value, or makes the constant current generation circuit generate the constant current according to the detection voltage, wherein the compensation value is changed with an average voltage generated by the voltage regulation circuit, and the average voltage corresponds to a voltage of an end of the light-emitting diode chain. | 2020-05-14 |
20200154537 | DIMMING CIRCUIT AND DIMMING CONTROL METHOD - A dimming circuit includes a DC/DC conversion unit and a control module. The control module provides a switching period reference, and samples an input voltage and an output voltage. The control module calculates a turn-on time according to the input voltage, the output voltage and a reference current signal. The control module generates a variation period signal which is cyclically-changed. The variation period signal is combined with the switching period reference or the turn-on time. Consequently, a pulse width modulation signal cyclically changed is generated by the switching period reference, the turn-on time and the variation period signal. Since the switching periods is cyclically changed, the average of the output current is close to the ideal value. | 2020-05-14 |
20200154538 | LED LIGHT SOURCE PANEL - Systems and methods for compensating, controlling, mixing and saturating/desaturating colors produced by or emitted from LED artificial light sources through use of multiple channel, LED controllers to control the proportion of constituent colors each to the other, to control the intensity level of the total light output of the mixed, desaturated light during and after color mixing and/or saturation/desaturation by simultaneously increasing and decreasing power to the constituent color LEDs at the same rate, and once a desired color has been produced, changing the intensity/brightness and/or degree of saturation of the produced color without changing the hue of the produced color. | 2020-05-14 |
20200154539 | Load Control Device Having an Overcurrent Protection Circuit - A load control device for controlling power delivered from an alternating-current power source to an electrical load may comprise a controllably conductive device, a control circuit, and an overcurrent protection circuit that is configured to be disabled when the controllably conductive device is non-conductive. The control circuit may be configured to control the controllably conductive device to be non-conductive at the beginning of each half-cycle of the AC power source and to render the controllably conductive device conductive at a firing time during each half-cycle (e.g., using a forward phase-control dimming technique). The overcurrent protection circuit may be configured to render the controllably conductive device non-conductive in the event of an overcurrent condition in the controllably conductive device. The overcurrent protection circuit may be disabled when the controllably conductive device is non-conductive and enabled after the firing time when the controllably conductive device is rendered conductive during each half-cycle. | 2020-05-14 |
20200154540 | INTEGRATED PROGRAMMABLE EFFECT AND FUNCTIONAL LIGHTING MODULE - Embodiments of the present invention include a lighting fixture(s), a computer program product and a computer-implemented method that include program code executed by a processor(s) that obtains a request to implement a specified lighting pattern in the lighting fixture(s). Each lighting fixture includes effect lighting communicatively coupled to the processor(s) and functional lighting (oriented to illuminate a surface below the lighting fixture) communicatively coupled to the processor(s). The program code identifies the specified lighting pattern in a memory communicatively coupled to the processor(s), which includes a sequence for illuminating a portion of the effect lighting elements. The processor(s) executes the specified lighting pattern in the lighting fixture(s). | 2020-05-14 |
20200154541 | DIMMABLE LED DRIVE CIRCUIT AND CONTROL METHOD THEREOF - A dimmable LED drive circuit and a control method is provided in the present disclosure. The dimmable LED drive circuit may include a thyristor dimmer, a bleeder current circuit, and an LED circuit. The bleeder current circuit may provide a current required by the thyristor dimmer when an input voltage does not reach a forward voltage of the LED circuit. The dimmable LED drive circuit may further include a thyristor chopping angle detection circuit and a bleeder current control circuit. The thyristor chopping angle detection circuit may obtain a first electrical parameter signal characterizing a thyristor chopping angle when the thyristor dimmer is in a conducting state. The bleeder current control circuit may compare the first electrical parameter signal with a first threshold, and control the bleeder current circuit according to a comparison result. Moreover, an output current compensation circuit may also be included, which may be configured to compare the first electrical parameter signal with a second threshold to control a current flowing through the LED circuit. | 2020-05-14 |
20200154542 | Multi-Channel Lighting Fixture Having Multiple Light-Emitting Diode Drivers - A lighting control system for controlling a cumulative light emitted by a lighting fixture having a plurality of LED light sources may comprise a plurality of LED drivers adapted to be coupled to a respective one of the LED light sources and configured to control an intensity of the respective LED light source, and a controller configured to transmit a single digital message for controlling the cumulative light emitted by the lighting fixture. Each of the plurality of LED drivers is configured to adjust the intensity of the respective LED light source to a preset intensity in response to the single digital message transmitted by the controller. | 2020-05-14 |
20200154543 | LED BULB - The first set of light emitting diode modules include multiple first type light emitting diode units. The first type fluorescent powder covers on the surface of multiple first type light emitting diode units. The second set of light emitting diode modules include multiple second type light emitting diode units and accessary electronic units. The second type fluorescent powder covers on the surface of multiple second type light emitting diode units. The driver circuit transfers the electricity to the first light emitting diode modules and the second light emitting diode modules to make the first light emitting diode unit and the second light emitting diode unit lighting. Moreover, the accessary electronic unit may affect the relative proportion current between the first set of light emitting diode modules and the second set of light emitting diode modules when the driver circuit supplies the different total current value. | 2020-05-14 |
20200154544 | LIGHT EMITTING SEMICONDUCTOR DEVICE FOR GENERATION OF SHORT LIGHT PULSES - The device comprises a bipolar transistor with emitter, base, collector, base-collector junction and base-emitter junction, a collector-to-base breakdown voltage, a quenching component electrically connected with the base or the collector, and a switching circuitry configured to apply a forward bias to the base-emitter junction. The bipolar transistor is configured for operation at a reverse collector-to-base voltage above the breakdown voltage. | 2020-05-14 |
20200154545 | LED LAMP WITH CURRENT-REGULATED WARM DIMMING - In one embodiment, a filament for LED filament lamp is presented, that includes a light-transmissive substrate; at least one LED die mounted on the light-transmissive substrate; and at least one current regulator mounted on the light-transmissive substrate, wherein the current regulator is connected in series with the at least one LED. In another embodiment, an LED filament lamp is presented, that includes a dimmable LED driver circuit; a first channel LED array with at least two LED die and a first forward voltage drop; and a second channel LED array with at least one LED dies and at least one current regulator to cause a second forward voltage drop of the second channel LED array to increase as current through the second channel LED array increases, wherein the second channel LED array is connected in parallel with the first channel LED array. | 2020-05-14 |
20200154546 | AC LIGHT EMITTING DIODE AND AC LED DRIVE METHODS AND APPARATUS - An LED device for use with an AC voltage power source configured such that at least one LED emits light during a positive phase of power provided from an AC power supply and at least one LED emits light during the negative phase of power provided from an AC power supply. The LED device includes a first power connection lead and a second power connection lead, both leads capable of being connected to and receiving power from an AC power supply. | 2020-05-14 |
20200154547 | LED TUBE LAMP - An LED tube lamp includes a tube having two ends, two end caps respectively at the ends of the tube, a power supply in one or both of the end caps, an LED light strip in the tube; and a plurality of LED light sources on the LED light strip. Each of the end caps comprises a lateral wall substantially coaxial with the tube, an end wall substantially perpendicular to an axial direction of the lateral wall, and at least one opening penetrating through the end wall. An axial direction of the at least one opening is substantially parallel with an axial direction of the lateral wall. The LED light sources electrically connected to the power supply via the LED light strip. | 2020-05-14 |
20200154548 | MEDICAL LIGHT SOURCE SYSTEM, MEDICAL LIGHT SOURCE DEVICE, AND METHOD OF ADJUSTING LIGHT AMOUNT OF MEDICAL LIGHT SOURCE DEVICE - To more easily inhibit a change in chromaticity that occurs at the time of light amount fluctuation of semiconductor light-emitting devices without providing a feedback system. A medical light source device according to the present disclosure includes: a light source part including two or more semiconductor light-emitting devices having wavelengths of emitted light different from each other, the light source part being configured to generate light of predetermined chromaticity by mixing the light emitted from each of the semiconductor light-emitting devices and emitting outward the generated light of the chromaticity as illumination light; and a control unit configured to control a mixing rate of the light emitted from each of the semiconductor light-emitting devices in accordance with a light amount setting value of the illumination light emitted from the light source part, the control unit being configured to keep the chromaticity constant regardless of a light amount of the illumination light. | 2020-05-14 |
20200154549 | MODULAR LUMINAIRE, RELATED MODULE, SYSTEM AND LIGHTING APPARATUS - A luminaire incorporating a plurality of lighting module units, each module comprising a plurality of preferably independently controllable light sources, optionally LEDs and/or laser lamps, each light source having preferably dedicated lens structure associated therewith, wherein the modules are individually configurable and further wherein the light output characteristics of each module of said plurality are individually controllable to yield a target overall distribution of output light from the luminaire. Yet, it is presented a lighting apparatus comprising a single point-like light source, preferably a LED, and a transmissive lens structure optically connected to said light source defining a plurality of optically functional, mutually different segments dedicated for controlling the light, e.g. distribution and direction, originally emitted by said single light source. A corresponding transmissive element such as a lens is presented. | 2020-05-14 |
20200154550 | COLOR SENSING USING PULSED LIGHT - Systems and methods for detecting a color of a color changing indicator in the presence of ambient light. A system includes a light source, a photodetector, and a processor. The processor obtains a first measurement of ambient light received from the photodetector while the light source is off. The processor causes the light source to transmit light. The processor obtains a second measurement from the photodetector during the transmission, the second measurement including the ambient light and the pulsed light reflected from an object. The processor determines a color of the color changing indicator by removing an ambient light signal from the second measurement based on the first measurement and therefrom determines a volume of bodily exudate present. | 2020-05-14 |
20200154551 | LIGHT BULB, INTELLIGENT LIGHTING DEVICE AND METHOD AND SYSTEM FOR USE IN CONFIGURING SAME - An intelligent light bulb is provided as well as a method, devices and computer program product of configuring such an intelligent light bulb. The intelligent light bulb comprises an LED lighting element and a programmable controller. The programmable controller comprises a memory module having stored therein firmware including instructions for controlling operations of the LED lighting element, where the memory module including a passive memory on which at least a portion of the firmware is stored. The passive memory component of the memory module is responsive to a signal carrying firmware update information received over a wireless communication link from a device external to the intelligent light bulb for causing a firmware update process to be performed to modify the instructions of the firmware based on the update information carried by the signal. The programmable controller also includes a processing unit in communication with the memory module for operating the LED lighting element at least in part in accordance with the instructions of the firmware. Advantageously, the proposed intelligent light bulb can be configured using the signal carrying the firmware update information. In some embodiments, this may allow modifications of certain operating characteristic of the intelligent light bulb to be performed after manufacturing, including modifications pertaining to light color emitted and/or manner of operating the light bulb. | 2020-05-14 |
20200154552 | X-RAY GENERATION DEVICE - An X-ray generation device includes an X-ray tube including an electron gun that generates an electron beam and a target that generates an X-ray by incidence of the electron beam; a power supply portion including a booster that boosts an input voltage from outside to generate a high voltage and an insulating block that seals the booster with an insulating material; and a control unit that performs control to generate the X-ray. The control unit includes a first information processing element that performs at least part of the control using a digital signal at a high potential based on the high voltage. The first information processing element is sealed with the insulating material in the insulating block. | 2020-05-14 |
20200154553 | APPARATUS FOR GENERATING X-RAYS - The present invention relates to an apparatus ( | 2020-05-14 |
20200154554 | POLARIZER - A polarizer arrangement for polarizing a laser beam includes: multiple plate-shaped optical elements which are arranged in a beam path of the laser beam and each of which includes a beam entry surface for the laser beam and a beam exit surface for the laser beam, in which the beam entry surface of a respective plate-shaped optical element is oriented at the Brewster angle relative to the laser beam. The beam entry surfaces and the beam exit surfaces of the plate-shaped optical elements are in each case oriented at least at one wedge angle relative to one another. An EUV radiation generating device may include such a polarizer arrangement. | 2020-05-14 |
20200154555 | FLOW FIELD VISUALIZATION DEVICE, FLOW FIELD OBSERVATION METHOD, AND PLASMA GENERATOR - A flow field visualization device includes a chamber, a power supply, at least one pair of electrodes, and at least two high-speed cameras. The power supply outputs a voltage for plasma generation, and the pair of electrodes is disposed in the chamber. The pair of electrodes includes a first electrode and a second electrode. The first electrode has a plurality of first tips, the second electrode has a plurality of second tips, and the first tips and the second tips are aligned with each other. The pair of electrodes generates a periodically densely distributed plasma by exciting a gas in the chamber through the voltage from the power supply. The high-speed cameras are disposed outside the chamber and are positioned in different directions corresponding to the pair of electrodes in order to capture images of different dimensions. | 2020-05-14 |
20200154556 | METHOD OF CONTROLLING ION ENERGY DISTRIBUTION USING A PULSE GENERATOR WITH A CURRENT-RETURN OUTPUT STAGE - Embodiments of this disclosure describe an electrode biasing scheme that enables maintaining a nearly constant sheath voltage and thus creating a mono-energetic IEDF at the surface of the substrate that consequently enables a precise control over the shape of IEDF and the profile of the features formed in the surface of the substrate. | 2020-05-14 |
20200154557 | CIRCUIT BOARD STRUCTURE - Provided is a circuit board structure that can enhance heat dissipation performance of heat generated by a semiconductor element and effectively perform heat dissipation. A circuit board structure includes a circuit board portion having a mounting face on which semiconductor elements are mounted, an opposing plate portion that is opposed to the mounting face and that dissipates heat from the circuit board portion, a plurality of semiconductor elements mounted on the mounting face in a row, and a recessed portion formed at a position corresponding to the plurality of semiconductor elements in the opposing plate portion. | 2020-05-14 |
20200154558 | Component Carrier With Improved Bending Performance - A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion. | 2020-05-14 |
20200154559 | RIGID-FLEX CIRCUIT BOARD AND METHOD FOR MAKING SAME - Manufacturing a rigid-flex circuit board includes providing an inner flexible circuit board and a first flexible metal clad laminate, laminating the first flexible metal clad laminate on a surface of the inner flexible circuit board through a first adhesive film, causing the first copper layer to form a third conductive circuit layer, partially covering the metal protective layer exposed by the third conductive circuit layer, removing the metal protective layer exposed by the third conductive circuit layer and the covered area, providing a second copper foil, laminating the second copper foil on a surface of the third conductive circuit layer through a second adhesive film, removing the metal protective layer at the opening area, and causing the second copper foil to form a fifth conductive circuit layer. The first flexible metal clad laminate includes a second base material layer, a metal protective layer, and a first copper layer. | 2020-05-14 |
20200154560 | THREE LAYER FORCE PAD - A force pad sensor includes a face sheet including a force sensing resister, and a printed circuit board assembly. The printed circuit board assembly includes a proximity sensor layer including a proximity receiver electrode and a proximity transmitter electrode, and a force sensor layer including a force receiver electrode and a force transmitter electrode. The force receiver electrode and the FSR intersect a same vertical plane, the vertical plane being perpendicular to the face sheet. | 2020-05-14 |
20200154561 | MULTI-LAYER THIN-FILM COATINGS FOR SYSTEM-IN-PACKAGE ASSEMBLIES IN PORTABLE ELECTRONIC DEVICES - A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and depositing one or more layers of a multi-layer thin film stack on the insulating layer and filling the trenches. In some examples, the multi-layer thin film stack can include an adhesion layer, a shielding layer, a protection layer, and a cosmetic layer. In some examples, the multi-layer thin film stack can include multi-functional layers such as a protection and cosmetic layer. | 2020-05-14 |
20200154562 | AIR CONDITIONER - An air conditioner includes an indoor equipment, a wiring connected to the indoor equipment at one end, and a communication interface connected to another end of the wiring and electrically connected to the indoor equipment via the wiring. The communication interface includes a housing made of resin, an insertion hole formed in the housing and into which a communication module of a cartridge type is inserted, and a control board provided inside the housing. The communication interface includes a first connector provided on a board surface of the control board and electrically connected to the communication module. The communication interface includes a pattern wiring provided on the board surface and discharging static electricity from the communication module before the communication module is electrically connected to the first connector. | 2020-05-14 |
20200154563 | STRETCHABLE MEMBER WITH METAL FOIL - Disclosed is a stretchable member with a metal foil including a stretchable resin base material, and a conductive metal foil provided on the stretchable resin base material. A surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 μm to 3 μm. | 2020-05-14 |
20200154564 | LIGHT-EMITTING MODULE - A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another. | 2020-05-14 |
20200154565 | Composite with Hollow Nano-Structures and Application Thereof - A composite with hollow nano-structures comprises multiple one dimensional hollow nanowires being dispersed into a polymer film; the polymer film is flexible; a dielectric constant of the one dimensional hollow nanowire is lower than a dielectric constant of the polymer film; and a dielectric constant of the composite is between the dielectric constant of the one dimensional hollow nanowire and the dielectric constant of the polymer film. | 2020-05-14 |
20200154566 | WIRING SUBSTRATE AND ELECTRONIC DEVICE - A wiring substrate includes: a first plate member including a first surface and a second surface opposite to the first surface; a first through wiring configured to extend in a tubular shape from the first surface to the second surface along an inner peripheral surface of a first through hole; a conductive member provided at an end of the first through wiring on a first surface side of the first plate member; a second plate member including a third surface and a fourth surface opposite to the third surface, the fourth surface facing the first surface of the first plate member; and a second through wiring configured to extend from the third surface to the fourth surface along an inner peripheral surface of a second through hole and be in contact with the conductive member. | 2020-05-14 |
20200154567 | ELECTRICAL COMPONENT AND METHOD OF FORMING SAME - Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and an opening disposed in the substrate. The opening extends between the first major surface and the second major surface. Tantalum material is disposed within the opening. Further, the tantalum material includes tantalum particles. The electrical component also includes an anode electrode disposed on the first major surface of the substrate and over the opening and a cathode electrode disposed on the second major surface of the substrate and over the opening. | 2020-05-14 |
20200154568 | PRINTED CIRCUIT BOARD - A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole. | 2020-05-14 |
20200154569 | POSITIONING STRUCTURE - The present invention discloses a positioning structure, including: a first substrate, a bonding member, a positioning member, and a first fixing member. The first substrate includes a first through hole. The bonding member is disposed between the first substrate and the positioning member to bond the first substrate and the positioning member, a position of the bonding member being corresponding to the first through hole. The first fixing member is fixed in the positioning member via the first through hole of the first substrate, to fix the positioning member on the first substrate. | 2020-05-14 |
20200154570 | PRINTED CIRCUIT BOARD - A printed circuit board, comprising a flexible insulating layer, a rigid insulating layer laminated on a portion of the flexible insulating layer, and a coverlay disposed on an upper surface of the rigid insulating layer, an upper surface of the flexible insulating layer, and a side surface of the rigid insulating layer positioned between the upper surface of the rigid insulating layer and the upper surface of the flexible insulating layer. | 2020-05-14 |
20200154571 | ELECTRONIC COMPONENT - An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers. | 2020-05-14 |
20200154572 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS - An organic light emitting display apparatus is provided that includes a display panel, a first source printed circuit board connected to the display panel in a first direction, and including a first memory disposed in an area of first source printed circuit board, a second source printed circuit board connected to the display panel in the first direction, and a control printed circuit board disposed between the first source printed circuit board and the second source printed circuit board, and connected to each of the first source printed circuit board and the second source printed circuit board. Here, a direction in which the control printed circuit board and the first source printed circuit board are connected and a direction in which the control printed circuit board and the second source printed circuit board are connected are a second direction different from the first direction. | 2020-05-14 |
20200154573 | SYSTEM FOR MANUFACTURING AN ELECTROMECHANICAL STRUCTURE - A system for manufacturing an electromechanical structure includes first, second, and third entities. The first entity produces conductors on a planar, flat film. The second entity attaches electronic elements at locations on the film in relation to a three-dimensional shape of the film. The electronic elements include a number of surface mount technology components. The locations of the electronic elements are selected to omit substantial deformation during subsequent forming of the film into the three-dimensional shape. The third entity forms the film into the three-dimensional shape when the electronic elements are supported on the film. The third entity includes one or more machines that are continuously roll-fed, automatically in-precut-pieces-fed, computer numerical control, thermoforming, vacuum former, pressure forming, or blow molding. The first, second, and third entities are arranged relative to one another to manufacture the electromechanical structure. | 2020-05-14 |
20200154574 | PRINTED CIRCUIT BOARD - A printed circuit board includes an insulating material and a circuit, formed on a surface of the insulating material. The circuit comprises a seed layer formed on the surface of the insulating material, an anti-reflection layer formed on the seed layer, and an electroplating layer formed on the anti-reflection layer. | 2020-05-14 |
20200154575 | Barrier Layer - A barrier layer is disposed on a copper surface, the barrier layer including an organic molecule. The organic molecule may be a nitrogen-containing molecule. The nitrogen-containing organic molecule includes 1 to 6 carbon atoms. The barrier layer may be deposited on an exposed copper surface before deposition of a surface finish. | 2020-05-14 |
20200154576 | THERMAL INTERFACE ADHESION FOR TRANSFER MOLDED ELECTRONIC COMPONENTS - An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material. | 2020-05-14 |
20200154577 | CIRCUIT BOARD MANUFACTURING METHOD AND CIRCUIT BOARD - A manufacturing method for a circuit board in which a pin inserted in a through-hole of a land is welded to the land is disclosed. The land is covered with a white layer, and an irradiation angle of a laser beam with respect to the circuit board is adjusted so that reflected light of the laser beam emitted to the pin reaches the white layer on the land. As the reflected light of the laser beam is allowed to reach a white region provided on the land, the reflected light is scattered on the white region. A rate of absorption of the laser beam by the land is decreased, and a temperature increase of the land is restrained. As a result, a damage of an insulating part around the land is restrained. | 2020-05-14 |
20200154578 | CIRCUIT SUBSTRATE - A circuit substrate includes a substrate, a wire build-up layer structure, and an insulating layer. The substrate has a first surface and a second surface opposites to the first surface. The substrate includes a plurality of patterned pads. The patterned pads are disposed on the first surface of the substrate, and having contact openings. The wire build-up layer structure is disposed on the first surface of the substrate. The wire build-up layer structure includes an interconnect build-up layer and a plurality of conductive pillars. The conductive pillars electrically connect to the interconnect build-up layer and the patterned pads. The insulating layer is disposed between the substrate and the wire build-up layer structure. | 2020-05-14 |
20200154579 | Television Enclosures and Related Systems and Methods - A television enclosure system includes a housing including a rear bezel and a front bezel coupled to the rear bezel, a gasket on the front wall of the front bezel, a panel held within the front bezel with the gasket between a front wall of the front bezel and the panel, at least one retaining bracket connected to a side wall of the front bezel, and at least one bezel clip coupled to the at least one retaining bracket and configured to engage the panel to compress the gasket. | 2020-05-14 |
20200154580 | DISPLAY DEVICE - A disclosed display apparatus may include a display panel configured to display an image, and a first back cover at a rear surface of the display panel and supporting the display panel. The display apparatus may additionally include a roller configured to wind or unwind the display panel, and an adhesive part between the display panel and the first back cover and fixed to the roller. | 2020-05-14 |
20200154581 | DISPLAY PANELS AND DISPLAY DEVICES - A display panel and a display device are provided. The display panel includes a flexible screen body having a first region and a second region. The second region has a bending transitional region coplanar with the first region, a bending region, and an extending region connected in sequence. The first region is connected to the bending region through the bending transitional region and is at least a part of an active region. The bending region and the extending region are at least a part of a non-active region and not coplanar with the first region. The bending transitional region is another part of the active region or another part of the non-active region. The display panel further includes a buffer layer disposed on surfaces of the bending transitional region and the bending region at a stress concentration side thereof. At least two sections of the buffer layer have different hardnesses. | 2020-05-14 |
20200154582 | Electrical Component Support Bracket - An electrical component support bracket is disclosed. In embodiments, the electrical component support bracket includes a base member, a component support surface, and a component support member. The component support surface extends from the base member with an angled transition between the base member and the component support surface. The component support member is configured to surround at least a portion of an electrical component. The component support member includes a first tab and a second tab disposed at opposite ends of the component support member. The first tab and the second tab are configured to be coupled to the component support surface so that the electrical component is held against the component support surface by the component support member. | 2020-05-14 |
20200154583 | METHOD FOR MEASURING ELECTROMAGNETIC SIGNAL RADIATED FROM DEVICE AND ELECTRONIC DEVICE THEREOF - A method for measuring an electromagnetic (EM) signal radiated from an external electronic device and an electronic device thereof are provided. The electronic device includes a housing, a display, a first conducting unit, a second conducting unit, at least one EM sensing circuit, at least one wireless communication circuit, a processor, and a memory. The memory stores instructions of when being executed, enabling the processor to receive, by using the first conducting unit, a first signal sensed by the EM sensing circuit, and receive, by using the second conducting unit, a second signal sensed by the EM sensing circuit, and provide a signal pattern on the basis of the first signal and the second signal, and identify an external electronic device, at least partially on the basis of the signal pattern. | 2020-05-14 |
20200154584 | Glass edging waste residue cleaning equipment - A multifunctional hub according to the present invention includes a box body, and the box body is provided with a sliding cavity with an upward opening therein, and an annular slider is slidably slid in the sliding cavity. The multifunctional hub of the present invention has simple and clear operation, sensitive response, saving time and labor; at the same time, the device of the present invention is rich in functions, fixed and reliable, and highly practical. | 2020-05-14 |
20200154585 | WATERPROOF CARD HOLDER AND METAL CASING - A waterproof card holder includes a card holder frame, a cover plate, a sleeve integrated with and extending from an inside of the cover plate, and a waterproof mechanism in the sleeve. A through-hole of the sleeve penetrates through the sleeve and cover plate. The waterproof mechanism includes a first end portion limited inside the sleeve, a second end portion having an outer diameter smaller than that of the first end portion, and a waterproof ring sleeved on a periphery of the first end portion and forming a sliding sealing structure with the sleeve. The sleeve includes first and second openings respectively disposed at two ends of a sleeve body. The first end portion is limited to be only movable within a stroke between the first and second openings. The second end portion being capable of passing through a first opening to be in contact with a card retracting mechanism. | 2020-05-14 |
20200154586 | INSERT MOLDING AROUND GLASS MEMBERS FOR PORTABLE ELECTRONIC DEVICES - An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure. | 2020-05-14 |
20200154587 | ELECTRONIC DEVICES COMPRISING BUTYL RUBBER - This invention relates to elastomeric coatings for electronics. Disclosed is a electronic device comprising a substrate layer, a conductive layer and an encapsulant layer. The encapsulant layer comprises at least a butyl rubber material. The butyl rubber encapsulant prevents a change in resistivity of the conductive layer following exposure to nitric acid vapour for 12 hours or hydrochloric acid vapour for 10 hours. | 2020-05-14 |
20200154588 | METHOD AND STRUCTURE FOR LIMITING COVER DEFLECTION IN AN ECU WITH LEAKAGE TESTING FEATURE - An engine control unit (ECU) includes a housing; a cover sealingly engaged with the housing so as to define an interior space; a circuit board disposed in the interior space; and a fastener coupling together the circuit board, the housing and the cover, the fastener serving to limit an amount of deflection of the housing relative to the housing. The circuit board and the cover are constructed and arranged to define an airflow path from an outer surface of the cover to the interior space. The airflow path allows for a leak test to be performed on the ECU, wherein upon an affirmative determination that results of the leak test shows no leaks in the ECU, sealant seals the airflow path. | 2020-05-14 |
20200154589 | SOLDERING FASTENING ELEMENT AND METHOD FOR MOUNTING THE SAME - A soldering fastening element and a method for mounting the soldering fastening element are introduced. The soldering fastening element is soldered to a first circuit board so as for a second board to be coupled thereto. The soldering fastening element includes a body soldered to the first circuit board, a head for fastening the second board in place, and a neck which connects the body and the head. When in use, the soldering fastening element is contained in a carrier, taken out of the carrier with an automated tool, transferred to the first circuit board, and heated through a solder layer on the first circuit board such that the body gets soldered to the first circuit board to form a module member. Therefore, the second board gets coupled to the first circuit board through the head and neck. | 2020-05-14 |
20200154590 | IMD HAVING A CORE CIRCUITRY SUPPORT STRUCTURE - A medical device includes a hybrid circuitry assembly and a core circuitry support structure. The core circuitry support structure includes a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly. An outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure. | 2020-05-14 |
20200154591 | ADAPTOR FOR STORAGE DEVICE - An adaptor for incorporating a function of an Open Compute Project (OCP) mezzanine card into a storage device includes a framework, a baseboard mounted to the framework and arranged to have the Open Compute Project (OCP) mezzanine card mounted thereon, an adapting part on the baseboard, the adapting part including an insertion slot for receiving a first interface of the OCP mezzanine card, and a connector on the baseboard, the connector configured to connect with the storage device, the baseboard including interconnections between the connector and the adapting part to provide for data exchange between the OCP mezzanine card and the storage device. | 2020-05-14 |
20200154592 | DUAL SERVER CHASSIS - In another aspect, a server chassis is configured to mount to a server rack. The server chassis includes a first housing that includes a first sidewall, where the first housing is configured to mount to the server rack and house a first electronic component, and a second housing that includes a second sidewall, the second housing configured to mount to the server rack and house a second electronic component. The first housing includes a first bracket mounted to the first sidewall of the first housing, and the second housing includes a second bracket mounted to the second sidewall of the second housing. The second bracket of the second housing is engagable to the first bracket of the first housing to secure the first housing and the second housing to each other. | 2020-05-14 |
20200154593 | Cabling A Set of Enclosures - Mechanisms are provided for cabling a set of enclosures. Using a set of cables that comprises eight physical layers (PHYs), the set of enclosures are coupled together such that: for a first enclosure and each intermediate enclosure in the set of enclosures, at least four PHYs of the eight PHYs terminate within a Serial Attached Small Computer System Interface (SCSI) (SAS) expander of the first enclosure and a SAS expander of each intermediate enclosure white passing through a remaining four PHYs of the eight PHYs without connecting to the respective SAS expander; and, for a last enclosure in the set of enclosures, all of the eight PHYs terminate in the SAS expander of the last enclosure. | 2020-05-14 |
20200154594 | MODULAR SYSTEM AND METHOD FOR MONITORING AND DISTRIBUTING POWER - The present invention discloses a plurality of modular containers. The modular containers can comprise a first container that includes a first top surface, a first bottom surface and at least one first side surface oriented between the first top and the first bottom surface. The first container can define a first internal cavity. The modular containers can also include a container system that is located in the first internal cavity. The modular containers can include a power distribution system and a data distribution system. In addition, the modular containers can include a second container. The second container can comprise a second top surface, a second bottom surface and at least one second side surface oriented between the second top and the second bottom surface. The second container can also define second internal cavity. Further, the modular containers can include a container subsystem located in the second internal cavity. The container system can also be in communication with the container subsystem. | 2020-05-14 |
20200154595 | DISTRIBUTABLE MODULAR CHASSIS - A power distribution system for providing power, data and/or signals including a chassis with an open channel formed on one side. At least one line buss is mounted on the inside of at least one sidewall and configured to be connected to a power source for providing AC power. A plurality of power modules are configured to removably mount to the chassis and receive power/data/signals from the chassis. Each module includes a housing with walls. A front wall includes openings with one outlet port accessible through the openings. Electrical circuitry in the housing coverts or transmits power, data or communication signals to the outlet port. One or more line connections protrude out from at least one of the walls and are located so as to come into contact with one of the associated busses in the chassis when the module is attached to the chassis. | 2020-05-14 |
20200154596 | AIR TRANSPORTABLE MODULAR SHIPPING CONTAINER FOR EDGE DATA CENTERS - This invention describes the use of pre-packaged air shipping containers for delivery of edge data center equipment. The containers are capable of rapid deployment and positioning at the edge data center delivery site to minimize time between the order of equipment and deployment of a functioning edge data center. The containers allow for easy access, and rapid repair/replacement of modular edge data center equipment. | 2020-05-14 |
20200154597 | ELECTRONIC DISPLAY WITH COOLING - An electronic image assembly cooling system includes an enclosure having an electronic image assembly mounting space located therein. A closed loop gas circulation path and an open loop air flow path are provided to effectuate cooling. A common heat exchanger is located in gaseous communication with both the closed loop gas circulation path and the open loop air flow path. The closed loop gas circulation path encircles the electronic image assembly mounting space within the enclosure, while the open loop ambient air flow path facilitates removal of heat from gas circulating within the closed loop gas circulation path. A second open loop air flow path may pass through the enclosure and through a gap located rearward of the electronic image assembly mounting space to assist with heat removal when an electronic image assembly is mounted in the enclosure. | 2020-05-14 |
20200154598 | INDUCTION HEATING DEVICE HAVING IMPROVED COOLING STRUCTURE - An induction heating device includes a case having a lower plate that defines an inlet and an exhaust slit; a cover plate coupled to the case; a working coil disposed inside the case; an indicator substrate support coupled to the lower plate and disposed below the working coil; an inverter substrate disposed on a lower surface of the indicator substrate support and including an inverter and a first heat sink configured to dissipate heat generated from the inverter; and a first blowing fan disposed at the lower plate and configured to draw air from an outside of the case through the inlet and discharge the air to the inverter substrate. The exhaust slit is configured to discharge, to an area below the lower plate, at least a portion of air discharged from the first blowing fan to the inverter substrate. | 2020-05-14 |
20200154599 | HEAT DISSIPATION MODULE, DISPLAY DEVICE AND ASSEMBLY METHOD - The disclosure relates to a heat dissipation module, a display device having the same, and an assembly method thereof. Place the heat dissipation structure in between the chip of the COF (chip-on-film) and the thermal-conductive supporting component, heat generated by the chip of the COF can be absorbed by the heat dissipation structure and then be transferred to the thermal-conductive supporting component through the heat dissipation structure. As a result, the temperature of the chip is decreased, and the chip is avoided from operating at high temperature to deteriorate its performance and to result in thermal deformation or any other negative effects on the nearby components. | 2020-05-14 |
20200154600 | ELECTRONIC COOLING FAN WITH AIRFLOW RECIRCULATION PREVENTION DURING FAN FAILURE - In one embodiment, an apparatus includes a fan for cooling electronics within a chassis, the fan comprising a rotor with a plurality of fan blades connected thereto for generating an axial airflow during operation of the fan, a sensor for detecting failure of the fan, and an airflow blocking device positioned at an exhaust side of the fan and configured to prevent airflow through the fan upon detection of the fan failure, wherein the airflow blocking device is stowed in a position removed from a path of the axial airflow generated by the fan during operation of the fan. A method for preventing airflow recirculation at a failed fan is also disclosed herein. | 2020-05-14 |
20200154601 | STORAGE DEVICE AND METHOD FOR CONTROLLING ROTATION SPEED OF FAN OF STORAGE DEVICE - The present disclosure relates to a storage device and a method of controlling a rotation speed of a fan of the storage device. The storage device comprises: a housing comprising an opening; a fan arranged at an end of the housing opposed to the opening; a tray comprising a plurality of partitions arranged in rows and being operable to be drawn out of or inserted into the housing via the opening in a longitudinal direction of the housing; a plurality of tray position detectors respectively arranged on the plurality of partitions and configured to detect a relative position of the tray with respect to the housing; and a controller adapted to adjust a rotation speed of the fan according to the relative position detected by the tray position detector. The storage device according to the present disclosure can effectively reduce the negative pressure formed in the housing, avoid or reduce the recesses of the housing, and enable the tray to be smoothly inserted into the housing, thereby avoiding damage to the disks therein. | 2020-05-14 |
20200154602 | TANK AND COOLING SYSTEM - A tank includes: a first housing configured to include a first inner surface and a first peripheral edge projecting from the first inner surface; a second housing configured to include a second inner surface and a second peripheral edge, the second inner surface facing the first inner surface, the second peripheral edge projecting from the second inner surface and facing the first peripheral edge; and a sticky elastic body inside the first and second peripheral edge, wherein the first peripheral edge has a first inclined surface inclined from inside to outside from the first inner surface toward a first projecting end of the first peripheral edge, the second peripheral edge has a second inclined surface inclined from inside to outside from the second inner surface toward a second projecting end of the second peripheral edge, and the elastic body is stuck to the first and second inclined surface. | 2020-05-14 |
20200154603 | HEAT SINK - A heat sink includes a pipe through which cooled fluid flows and a cooling block having a first face on which the pipe is placed and a second face to which a heat emitting element is attached. The cooling block has a contact region and a noncontact region at positions where the cooling block faces the pipe. In the contact region, the first face contacts the pipe. In the noncontact region, the first face faces the pipe with a gap therebetween. The contact region is included in a projection region defined by projecting a region of attachment of the heat emitting element onto the first face. | 2020-05-14 |
20200154604 | APPARATUS AND METHODS FOR COOLING OF AN INTEGRATED CIRCUIT - Systems and methods for cooling an Integrated Circuit (IC) are provided. In one embodiment, the system includes a vessel for holding a coolant in a liquid phase, where the IC is at least in part thermally coupled to the coolant to transfer heat generated by the IC to the coolant. The system also includes a controller for periodically increasing a heat flux supplied by the IC to the coolant followed by a reduction of the heat flux supplied by the IC to the coolant. Methods for controlling the operational parameters of the IC to periodically increasing and then decreasing the heat flux supplied by the IC to the coolant are also provided. A sensor may be used to sense a state of phase change of the coolant and which generates a signal that the controller uses to adjust the heat flux supplied by the IC. | 2020-05-14 |
20200154605 | TITANIUM THERMAL MODULE - The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module. | 2020-05-14 |
20200154606 | SOLID STATE DRIVE DEVICE AND COMPUTER SERVER SYSTEM INCLUDING THE SAME - A solid-state drive device includes a first module including a first region containing a volatile main memory device and a controller device and a second region containing a first nonvolatile memory device, a second module disposed on the first module and having a third region containing a second nonvolatile memory device, the second module being connected to the first module, and a heat dissipating member disposed on the second module as vertically juxtaposed with the first and second modules. The heat dissipating member has a protruding portion protruding toward the first module and in direct thermal contact with the first region, and a plate-shaped portion having a main surface in direct thermal contact with the third region. | 2020-05-14 |
20200154607 | HEAT SINK ASSEMBLY - A heat sink assembly, includes: a first heat sink; an adhesive thermal interface material applied to the first heat sink to mate the first heat sink to a first heat-generating component; a second heat sink; one or more support members connecting the first heat sink and the second heat sink; and a non-adhesive thermal interface material applied to the second heat sink to mate the second heat sink to a second heat-generating component. | 2020-05-14 |
20200154608 | INSULATING HEAT DISSIPATION COATING COMPOSITION AND INSULATING HEAT DISSIPATION UNIT FORMED USING THE SAME - An insulating heat dissipation coating composition including a coating layer-forming component including a subject resin, and an insulating heat dissipation filler. Therefore, the coating composition may have excellent thermal conductivity and excellent thermal emissivity, and therefore an insulating heat dissipation coating layer which exhibits excellent heat dissipation performance and has insulating property may be formed. In addition, the heat dissipation coating layer formed thereby has a very excellent adhesive strength to a surface to be coated so as to significantly prevent peeling of the coating layer during use, and to maintain durability of the coating layer even against a physical or chemical stimulus such as external heat, organic solvent, moisture or shock, which is generated after the coating layer is formed. | 2020-05-14 |
20200154609 | AIR CURTAIN CANISTER FOR ENVIRONMENTAL CONTROL IN AUTOMATED DATA STORAGE LIBRARIES - An air curtain canister for creating an air curtain includes a housing having a form factor approximating an exterior of a data storage drive. The air curtain canister also includes a fan for creating an airflow in the housing and a nozzle for directing the airflow exiting the housing in a predefined trajectory for creating an air curtain. A data storage library includes an array of drive slots each configured to receive a data storage drive therein. The data storage library also includes a plurality of air curtain canisters positioned laterally in the array of drive slots for creating an air curtain across a front of the remaining drive slots in the array. A method includes selectively instructing air curtain canisters in a data storage library to create an air curtain across a front of an array of drive slots in the data storage library. | 2020-05-14 |
20200154610 | METHOD OF COOLING AN ELECTRONICS CABINET - A method of cooling an electronics cabinet includes inducing a flow of cooling air to enter into the electronics cabinet, passing the flow of cooling air over electronic modules arranged within the electronics cabinet to convectively transfer heat to the flow of cooling air from the electronic modules, and directing the flow of cooling air through a door heat exchanger at an end of the electronics cabinet to exhaust the flow of cooling air from the cabinet. A first coolant flow is directed through the door heat exchanger, and heat is transferred from the flow of cooling air to the first coolant flow as they pass through the door heat exchanger. A second coolant flow is circulated through a coolant loop that is arranged within the electronics cabinet, and passes though cold plates that are joined to at least some of the electronic modules to transfer heat from those modules to the second coolant flow. Heat from the second coolant flow is transferred to the first coolant flow in a coolant-to-coolant heat exchanger arranged within the electronics cabinet. Heat is subsequently rejected from the first coolant flow at a location remote from the electronics cabinet. | 2020-05-14 |
20200154611 | SKYLIGHT OPERATING SYSTEM OF MODULAR DATA CENTER - The present invention discloses a skylight operating system of a modular data center, so as to timely respond to a firefighting requirement of the modular data center to reduce occurrence of firefighting-related accidents. The skylight operating system comprises: an electric skylight; a firefighting environment index monitoring device arranged inside the modular data center; a monitoring and interacting device arranged in a monitoring room outside the modular data center, and connected with the electric skylight and the firefighting environment index monitoring device, the monitoring and interacting device adapted for receiving monitoring information of the firefighting environment index monitoring device, and opening the electric skylight upon determination that a firefighting-related issue occurs inside the modular data center. | 2020-05-14 |
20200154612 | CONDUCTIVE FILM AND DISPLAY APPARATUS PROVIDED WITH SAME - The present invention discloses a conductive film and a display apparatus provided with the conductive film. A conductive film is disposed on a display panel of a display apparatus, and has a base body, and a conductive section formed on one of the main surfaces of the base body. The conductive section has a mesh pattern composed of fine metal lines, and the fine metal lines have a tilt of 30-44° with respect to the alignment direction of pixels of the display apparatus. | 2020-05-14 |
20200154613 | ANTI EMF RADIATION PROTECTIVE HOUSING - A protective housing for shielding an individual against electro-magnetic field (EMF) radiation includes a conductive mesh configured to be suspended from an elevated position, a conductive plane at a base of the protective housing and configured to be a grounding plane for the protective housing, the conductive plane and conductive mesh being configured to shield an interior space, defined by the conductive plane and conductive mesh when suspended, against EMF radiation, and a cable coupled to a circumference of the conductive mesh and configured to weigh down the conductive mesh and to electrically couple the conductive mesh to the conductive plane. | 2020-05-14 |
20200154614 | SUBSTATION ELECTROMAGNETIC MITIGATION MODULE - An electric power substation includes a circuit breaker that receives electrical power from a power plant, and a control house communicably coupled to the circuit breaker via a primary communication line, wherein one or more primary relay panels are housed within the control house. An electromagnetic pulse mitigation module is communicably coupled to the circuit breaker via a fiber optic line and comprises a continuous conductive enclosure that is impervious to radiated and coupled electromagnetic energy. One or more backup relay panels are housed within the electromagnetic pulse mitigation module and capable of assuming operation of the one or more primary relay panels. | 2020-05-14 |
20200154615 | ELECTRONIC DEVICE AND ELECTROMAGNETIC SHIELDING ASSEMBLY THEREOF - An electromagnetic shielding assembly configured to be disposed on a circuit board with at least one electronic component includes a plurality of shielding housings. The shielding housings form a gap therebetween. Each of the shielding housings has a first opening adjoining the gap. The shielding housings are configured to accommodate part of the electronic component. The electronic component is configured to pass through the first openings of the shielding housings and the gap. | 2020-05-14 |
20200154616 | EMI PROTECTIVE SLEEVE AND METHOD OF CONSTRUCTION THEREOF - A wrappable textile sleeve for protecting a conductive elongate member against at least one of EMI, RFI or ESD and method of construction thereof is provided. The sleeve includes a plurality of warp filaments and at least one weft filament woven with one another to form a woven substrate. The woven substrate has opposite sides extending lengthwise between opposite ends. The opposite sides are wrappable about a central longitudinal axis into overlapping relation with one another to circumferentially enclose the elongate member within a cavity of the sleeve. At least some of the warp filaments are provided as generally flat, thin conductive filaments shield the conductive elongate member against the effects of EMI, RFI and/or ESD. | 2020-05-14 |
20200154617 | Additive Manufacturing For Shielding Neutron And Photon Radiation - The present invention relates to the use of additive manufacturing as applied to radiation shielding. In particular, additive manufacturing formulations are described which provide shielding for neutron and photon radiation and which can extend the useful operation life of remote sensing devices utilized to conduct surveillance and inspection work where such radiation fields are present. | 2020-05-14 |
20200154618 | MOTOR AND MOTOR MANUFACTURING METHOD - A motor includes: a rotating shaft; a motor portion; a circuit board; a case having a circuit housing recess portion for housing the circuit board; and a cover made of a synthetic resin and sealing the opening portion of the circuit housing recess portion. The cover has an outer circumference rib and an inside rib. The outer circumference rib is located on the outer circumferential side from the opening end surface of the circuit housing recess portion and projects from the outer circumferential edge of the cover toward the front surface side of the cover and the rear surface side of the cover. The inside rib is located inside from the opening end surface and projects at least either on the front surface side of the cover or on the rear surface side of the cover. | 2020-05-14 |
20200154619 | CHANGEOVER OPERATION CONFIGURATION DEVICE, AND CHANGEOVER OPERATION CONFIGURATION METHOD - A changeover operation configuration device for use in a component mounting line including a registration section configured to register information of at least one of line layout information related to an arrangement of the component mounting line, work area layout information related to an arrangement of a work area at which the changeover operation is to be performed, and personnel quantity information of a quantity of operators who are to perform the changeover operation; an aggregation section configured to select the component type for which to perform changeover operation from the multiple component types, aggregate the component types to a restricted quantity of the component supply devices and designate the component supply devices as work targets; and a setting section configured to set an arrangement position of the component supply devices that are the work targets based on the at least one of the registered information. | 2020-05-14 |
20200154620 | MEASUREMENT POSITION DETERMINATION DEVICE - The measurement position determination device of the present disclosure is a measurement position determination device for determining a measurement position on a board, the measurement position being for measuring height of the board on which on which a component is mounted, and includes a measurement position determination section for acquiring one or more scheduled mounting positions of the component on the board at the time of measuring the board height and determining at least one of the acquired scheduled mounting positions as the measurement position of the board height. | 2020-05-14 |
20200154621 | Miniature rose plant named 'KORaroma08' - A new and distinct variety of miniature rose plant, herein referred to by its cultivar name, ‘KORaroma08’, is provided which forms in abundance on a substantially continuous basis attractive, white colored blossoms. The vegetation is vigorous and the growth habit is compact. Attractive ornamental foliage is formed and good disease resistance is displayed. The new variety is particularly well suited for providing distinctive ornamentation in the landscape. | 2020-05-14 |
20200154622 | STRAWBERRY PLANT NAMED 'DRISSTRAWSIXTYSIX' - A new and distinct variety of strawberry plant named ‘DrisStrawSixtySix’, selected for its high yield, firm fruit, and compact plant type, is disclosed. | 2020-05-14 |
20200154623 | Cannabis plant named 'MR2018003' - A new cultivar of Cannabis named ‘MR2019003’ that is characterized by 16% THC and 0% CBD by dry weight, resistance to microbial growth, high yield and low intra-flower leaves. | 2020-05-14 |
20200154624 | Pachyveria Plant Named 'TSAECH1821' - A new and distinct x | 2020-05-14 |