20th week of 2014 patent applcation highlights part 29 |
Patent application number | Title | Published |
20140133027 | REFLECTIVE POLARIZING PLATE, DISPLAY DEVICE INCLUDING THE POLARIZING PLATE AND METHOD OF MANUFACTURING THE POLARIZING PLATE - A reflective polarizing plate is monolithically integrated on a surface of a base layer of a display device. The polarizing plate comprises a polarizing area portion and a reflective/blocking area portion, both having a multi-layered structure. The polarizing area portion is patterned to have a plurality of spaced apart reflective wire grid strips. The reflective/blocking area portion is configured to reflect all light incident thereon from a predetermined direction (where that light would not otherwise be used) and to direct the reflected light back to a light providing source where the light can be recycled for other use. Therefore, a brightness and efficiency of the display device is improved. | 2014-05-15 |
20140133028 | MIRROR FOR SOLAR LIGHT REFLECTION, REFLECTION DEVICE FOR SOLAR-HEAT POWER GENERATION, FUNCTIONAL FILM, AND ELECTROSTATIC CHARGE PREVENTING COMPOSITION FOR OUTDOOR USE - Provided is a solar reflective mirror ( | 2014-05-15 |
20140133029 | RETROREFLECTIVE SHEETING INCLUDING CUBE CORNER ELEMENTS - The present disclosure is directed to lamina(e) comprising cube corner elements, a tool comprising an assembly of laminae and replicas thereof. The disclosure further relates to retroreflective sheeting. | 2014-05-15 |
20140133030 | Attachment methods for daylighting films - Attachment methods for daylighting sheets and a resulting optical construction enable daylighting microstructures to be secured to a light incident surface, such as a glazing. Applying an adhesive to selected portions of the daylighting microstructures creates a transparent, optical adhesive surface that enables the daylighting microstructures to be oriented outward, facing the incident light, and effectively seals the microstructures against the glazing to prevent ingress of dust and contaminants that would degrade optical efficiency. | 2014-05-15 |
20140133031 | Anti-Reflective Coatings Comprising Ordered Layers of Nanowires and Methods of Making and Using the Same - The present invention is directed to anti-reflective coatings comprising ordered layers of nanowires, methods to prepare the coatings, and products prepared by the methods. | 2014-05-15 |
20140133032 | OPTICAL ELEMENT HAVING ANTIREFLECTIVE FILM, OPTICAL SYSTEM, AND OPTICAL APPARATUS - An optical element includes a substrate that is transparent, and an antireflective film laminated on the substrate. The antireflective film includes, in order from the substrate, a first layer, a second layer, and a third layer. The substrate has a refractive index of 1.80 to 2.05 for the d-line. The first layer is an inorganic oxide film having a refractive index of 1.43 to 1.47 for the d-line and a physical film thickness of 29.0 to 40.0 nm and containing silica as a main component. The second layer is an inorganic oxide film having a refractive index of 2.00 to 2.20 for the d-line and a physical film thickness of 12.0 to 41.0 nm. The third layer is a film having a refractive index of 1.23 to 1.26 for the d-line and a physical film thickness of 110.0 to 130.0 nm and containing silica nanoparticles. | 2014-05-15 |
20140133033 | ANTI-GLARE COATING COMPOSITION HAVING IMPROVED ANTI-FINGERPRINT FUNCTION AND ANTI-GLARE FILM PREPARED THEREFROM - The present invention relates to an anti-glare coating composition for preparation of anti-glare films having good anti-fingerprint properties as well as improved contrast ratio and image definition. More specifically, the coating composition comprises organic or inorganic particles, a photocurable resin, a photoinitiator, and a compound including an olefin oxide repeating unit. | 2014-05-15 |
20140133034 | OPTICAL IMAGING DEVICE - There is provided an optical imaging device for splitting an initial image into images with different optical characteristics, wherein the device comprises a plurality of beamsplitters and at least first and second reflectors arranged to create multiple images adjustably separable in two orthogonal directions, characterised in that the first reflector is rotatable about a first axis and the second reflector is rotatable about a second axis, the second axis orthogonal to the first axis. The beamsplitters are located in a first optical layer to create multiple optical pathways directed substantially orthogonally from the first optical layer to a second spaced apart optical layer. Each reflector can be moved translationally relative to its rotational axis. | 2014-05-15 |
20140133035 | LENS BARREL AND OPTICAL APPARATUS - A lens barrel includes an image-pickup optical system that includes a main optical system and an extender optical system, an extender barrel configured to hold the extender optical system, a housing configured to house the extender barrel, a rotator configured to hold the extender barrel to rotatably support the extender barrel in the housing, to insert the extender optical system into the main optical system, and to retreats the extender optical system from the main optical system, and a retreat restraint. When the retreat restraint is in the first state, the extender optical system is retreated to a position which is not associated with formation of the optical image, but the extender optical system is undetachable from the rotator, and when the retreat restraint is in the second state, the extender optical system is detachable from the rotator. | 2014-05-15 |
20140133036 | ZOOM LENS AND IMAGING APPARATUS - A zoom lens includes a first lens-group having positive refractive power, a second lens-group having negative refractive power, a third lens-group having positive refractive power, and a fourth lens-group having positive refractive power, in this order from an object side, and a stop located between a most image-side surface of the second lens-group and a most image-side surface of the third lens-group. Distances between the lens-groups change when magnification is changed from a wide-angle end to a telephoto end. The second lens-group consists of a negative lens, a biconcave lens and a positive lens in this order from the object side. The third lens-group consists of a positive lens, a cemented lens of a positive lens and a negative lens, a negative meniscus lens with its concave surface facing the object side, and a biconvex lens in this order from the object side. A predetermined conditional formula is satisfied. | 2014-05-15 |
20140133037 | LENS BARREL CAPABLE OF INCREASING SHOOTING MAGNIFICATION WHILE BEING MINIATURIZED, AND IMAGE PICKUP APPARATUS - Lens barrel capable of increasing shooting magnification while being miniaturized. A first lens group is caused to move in a direction of an optical axis by rotation of a second cam ring following rotation of a drive ring which has a focus cam groove on an inner periphery and is disposed on an outer periphery of a fixed cam ring having a cam groove and a rectilinear groove on an inner periphery. A second cam groove is disposed behind the first lens group in the direction of the optical axis. Rotation of the drive ring causes a follower of a focus group holding unit, which holds the second lens group, to follow the focus cam groove while being guided to move rectilinearly by the rectilinear groove. The follower following the focus cam groove causes the focus group holding unit to move in the direction of the optical axis. | 2014-05-15 |
20140133038 | Projection Lens - A projection lens includes a first lens group, a second lens group and a third lens group, all of which are arranged in sequence from an projection side to an image source side along an optical axis. The first lens group is with negative refractive power and includes four lenses. The second lens group is with positive refractive power and includes two lenses. The third lens group is with positive refractive power and includes a stop and six lenses. | 2014-05-15 |
20140133039 | LENS BARREL AND IMAGING APPARATUS - A lens barrel includes a first lens disposed on a first optical axis, a bending optical element configured to bend a light flux incident from a direction of the first optical axis toward a direction of a second optical axis extending in a direction different from the direction of the first optical axis, and a holding member configured to hold the bending optical element, wherein, when the lens barrel shifts from a photographing state to a retracted state, the holding member holding the bending optical element moves along the second optical axis while rotating around a rotational axis extending in a direction different from the directions of the first optical axis and the second optical axis. | 2014-05-15 |
20140133040 | Plastic lens barrel and method for manufacturing the same - A plastic lens barrel and method for manufacturing the plastic lens barrel are provided. The plastic lens barrel includes a front portion, a rear portion, a side portion, and at least three gate vestiges formed on at least one of the front portion, the rear portion, and the side portion. The front portion has a front opening. The rear portion has a rear opening. The side portion connects the front portion and the rear portion. An outermost diameter of the plastic lens barrel is Dmax and Dmax<10 mm. The method for manufacturing the plastic lens barrel by injection molding with a plurality of injection channels includes the steps of providing an injection mold of a plastic lens barrel structure having at least three injection channels and injecting a molding material into the injection mold through the injection channels to obtain the plastic lens barrel. | 2014-05-15 |
20140133041 | MODULAR OFF-AXIS FIBER OPTIC SOLAR CONCENTRATOR - A modular solar concentrator having an aspherical primary reflector that is a segment of a paraboloid parent shape. The peripheral shape of the segment is selected to allow arrangement of an array of concentrators in a closely-fitting pattern. The peripheral shape may be rectilinear or trapezoidal. The primary reflector may be an off-axis segment having an optical axis at or near a peripheral edge. In one embodiment, the modular solar concentrator includes a primary mirror and a secondary minor. In an alternative embodiment, the modular solar concentrator is monolithic having internal surfaces that reflect light into the optical fiber. The monolithic concentrator may include a first internal surface that functions in a manner analogous to a primary mirror and a second internal surface that functions in a manner analogous to a secondary mirror. The optical fiber may be secured in the monolith by an index matching adhesive. | 2014-05-15 |
20140133042 | WRISTBAND MIRROR - The present invention includes a convex mirrored surface encased in a housing, which is further attached to a slap band strap. The slap band strap is highly reflective. The mirrored can also display other information, lights or alarms, etc. All surfaces are capable of displaying emergency information, logos, messages, or advertising. | 2014-05-15 |
20140133043 | INTERIOR REARVIEW MIRROR ASSEMBLY - An interior rearview mirror assembly for a vehicle includes a mirror reflective element having at least one transparent or glass substrate and a mirror reflector established at a surface of the at least one transparent or glass substrate. A mirror backplate is disposed to the rear of the mirror reflective element. A mounting base is configured for attachment at an interior portion of a vehicle. The mounting base includes a ball member. A socket element is formed separate from the mirror backplate and the mounting base. The socket element is attachable at the mirror backplate and is configured to pivotally attach to the ball member of the mounting base. With the socket element attached at the mirror backplate, the socket element pivotally attaches to the ball member to pivotally mount the mirror backplate and the mirror reflective element at the mounting base. | 2014-05-15 |
20140133044 | EXTERIOR MIRROR ASSEMBLY WITH ACTUATOR - An exterior mirror assembly for a vehicle includes a mounting portion mountable at a side of a vehicle, a mirror head portion at the mounting portion, and an actuator. The mirror head portion includes a mirror casing and a reflective element at least partially housed at the mirror casing. The actuator is operable to impart pivotal movement of the reflective element mirror relative to the mirror casing to adjust a rearward field of view of a driver of the vehicle. The actuator includes a drive post that is pivotally attached at the reflective element. The actuator also includes a motor that rotatably drives a clutch device to adjust the drive post to adjust the reflective element relative to the mirror casing. The clutch device allows for manual adjustment of the reflective element and the drive post in a non-ratcheting manner. | 2014-05-15 |
20140133045 | NON-DICHROIC OMNIDIRECTIONAL STRUCTURAL COLOR - A non-dichroic omnidirectional structural color multilayer structure. The non-dichroic omnidirectional structural color multilayer structure has an absorbing layer, a first layer extending across the absorbing layer, and a second layer extending across the first layer. The multilayer structure can reflect a narrow band of electromagnetic radiation that has a width of less than 500 nanometers and a center wavelength shift of less than 200 nanometers when the multilayer structure is viewed from angles between 0 and 45 degrees. In addition, the absorbing layer can block electromagnetic radiation reflected off of a surface that is proximate to the multilayer structure and thereby afford for a “pure” color that is not contaminated by reflected light from surrounding surfaces. | 2014-05-15 |
20140133046 | DISPLAY DEVICE - A display device includes a substrate, a light shielding layer, at least one fading pattern and a display module. The display module is disposed on the substrate and has a display area. The light shielding layer is disposed on a periphery of the substrate and has a first side and a second side, wherein the first side is opposite to the second side. The at least one fading pattern is disposed on the substrate, is adjacent to at least one side of the first side and the second side of the light shielding layer, and does not overlap the display area of the display module. Each fading pattern includes N light transmissible areas, the N light transmissible areas are adjacent to each other, and transmittances of the N light transmissible areas are different from each other, wherein N is a positive integer larger than one. | 2014-05-15 |
20140133047 | SERVO INFORMATION RECORDING METHOD AND MAGNETIC STORAGE APPARATUS - A servo information recording method continuously records servo information in a radial direction of a magnetic disk on a plurality of concentric tracks or on a single spiral track of a first recording layer that forms a magnetic layer of the magnetic disk together with a second recording layer to which data are recorded and from which data are reproduced, wherein the first recording layer has a coercivity higher than that of the second recording layer, and partially overlaps two mutually adjacent tracks when continuously recording the servo information on an entire surface of the first recording layer. | 2014-05-15 |
20140133048 | HIGH SPIN-TORQUE EFFICIENCY SPIN-TORQUE OSCILLATOR (STO) WITH DUAL SPIN POLARIZATION LAYER - In one embodiment, a MAMR head includes a main magnetic pole, a STO positioned near the main magnetic pole, the STO including a first perpendicular magnetic layer positioned above the main magnetic pole, wherein the first perpendicular magnetic layer is a first spin polarization layer having an axis of magnetic anisotropy in a direction perpendicular to a film surface, a first non-magnetic transmission layer positioned above the first perpendicular magnetic layer, a magnetic layer effectively having a plane of easy magnetization in the film surface positioned above the first non-magnetic transmission layer, the magnetic layer being a FGL, a second non-magnetic transmission layer positioned above the magnetic layer, and a second perpendicular magnetic layer positioned above the second non-magnetic transmission layer, wherein the second perpendicular magnetic layer is a second spin polarization layer having magnetic anisotropy in the direction perpendicular to the film plane. | 2014-05-15 |
20140133049 | UNIVERSAL MAGNETIC RECORDING HEAD CHIP - A module according to one embodiment includes an array of N piggyback or merged first data transducers positioned towards a media facing surface of the module; and M second data transducers interleaved with the array of piggyback or merged data transducers, wherein the second data transducers are single data transducers, at least some of the data transducers being coupled to pads. A module according to another embodiment includes an array of N first data transducers positioned towards a media facing surface of the module, the first data transducers including at least one of data readers, data writers, and combinations thereof; and M second data transducers interleaved with the array of first data transducers, the second data transducers including at least one of data readers, data writers, and combinations thereof, wherein less than all of the first and/or second data transducers are coupled to pads. | 2014-05-15 |
20140133050 | HARD AMORPHOUS CARBON FILM CONTAINING ULTRATRACE HYDROGEN FOR MAGNETIC RECORDING MEDIA AND MAGNETIC HEADS - A magnetic recording medium according to one embodiment includes at least a ground layer above a non-magnetic substrate; a magnetic recording layer above the ground layer; and an overcoat above the magnetic recording layer, the overcoat characterized in that said overcoat is an amorphous carbon film, wherein a hydrogen content in the overcoat in a center layer thereof in a film thickness direction of said overcoat is from 0.1 atom % to 1.0 atom %. Additional products and methods are also presented. | 2014-05-15 |
20140133051 | CLAMP RING, SPINDLE MOTOR INCLUDING CLAMP RING AND HARD DISK DRIVE INCLUDING SPINDLE MOTOR - There are provided a clamp ring, a spindle motor including the clamp ring and a hard disk drive including the spindle motor. The spindle motor includes: a fixed member; a rotating member rotatably supported by the fixed member using fluid dynamic pressure; and a clamp ring inserted into an outer surface of the rotating member in a radial direction to fix a recording disk. | 2014-05-15 |
20140133052 | MAGNETORESISTIVE SENSOR HAVING REDUCED READ GAP AND STRONG PINNED LAYER STABILITY - A magnetic read head having a reduced read gap and a stable magnetic pinned layer structure. The sensor includes a seed layer that has a surface formed with an anisotropic texture. A magnetic pinned layer formed over the seed layer has a body centered cubic structure which causes the pinned layer structure to have a magnetic anisotropy with an easy axis oriented perpendicular to the air bearing surface when deposited over the textured seed layer. A magnetic free layer structure formed over the pinned layer structure and over a non-magnetic barrier layer has a face centered cubic structure which causes the magnetic free layer to have a magnetic anisotropy with an easy axis oriented parallel with the air bearing surface. | 2014-05-15 |
20140133053 | METHOD AND APPARATUS USED FOR DETERMINING FRICTION BETWEEN SLIDER AND ROTATING DATA STORAGE MEDIUM - A flexible member is coupled between an actuator arm and a slider. The flexible member facilitates relative motion in a tangential direction of a rotating medium. The relative motion is detected via a displacement sensor, and a friction between the slider and the rotating medium is determined based on the sensed relative motion. | 2014-05-15 |
20140133054 | SAFETY APPARATUS AND MONITORING METHOD FOR A POWER TRANSFORMER, AND RELATED POWER TRANSFORMER - A safety apparatus and method for monitoring a liquid-filled power transformer wherein there is provided a sensing device associated with an electronic unit. The sensing device is suitable to be at least partially immersed into liquid and includes at least one movable part displaceable by movements of the liquid. The electronic unit detects signals indicative of an actual position of the movable part and is arranged to provide, based on the detected signals, data related to actual conditions of the transformer and/or of its cooling liquid. | 2014-05-15 |
20140133055 | ACTIVE DETECTION AND PROTECTION OF SENSITIVE CIRCUITS AGAINST TRANSIENT ELECTRICAL STRESS EVENTS - Apparatus and methods for active detection, timing, and protection related to transient electrical events are disclosed. A detection circuit can generate a first activation signal in response to a transient electrical stress event across a first node and a second node. A blocking circuit is configured to bias the base of a first driver bipolar transistor to slow down discharge of accumulated base charge of a first driver bipolar transistor, which permits the first driver bipolar transistor to remain activated for a longer period of time than had the base of the first driver bipolar transistor been biased to the same voltage as the emitter of the first bipolar transistor. Shut-off circuitry can be included in some embodiments to prevent a discharge circuit from activating during normal operating conditions. | 2014-05-15 |
20140133056 | STRUCTURES AND TECHNIQUES FOR USING MESH-STRUCTURE DIODES FOR ELECTRO-STATIC DISCHARGE (ESD) PROTECTION - An Electro-Static Discharge (ESD) protection using at least one I/O pad with at least one mesh structure of diodes provided on a semiconductor body is disclosed. The mesh structure has a plurality of cells. At least one cell can have a first type of implant surrounded by at least one cell with a second type of implant in at least one side of the cell, and at least cell can have a second type of implant surrounded by at least one cell with a first type of implant in at least one side of the cell. The two types of implant regions can be separated with a gap. A silicide block layer (SBL) can cover the gap and overlap into the both implant regions to construct P/N junctions on the polysilicon or active-region body on an insulated substrate. Alternatively, the two types of implant regions can be isolated by LOCOS, STI, dummy gate, or SBL on silicon substrate. The regions with the first and the second type of implants can be coupled to serve as the first and second terminal of a diode, respectively. The mesh structure can have a first terminal coupled to the I/O pad and a first terminal coupled to a first supply voltage. | 2014-05-15 |
20140133057 | SURGE PROTECTION DEVICE - There is provided a surge protection device that includes (a) an input and an output, (b) a short-circuit-proof primary current path and a secondary current path between the input and the output, and (c) a fuse in a short-circuit-proof fuse box. The short-circuit-proof fuse box is arranged in the secondary current path, and (i) on one side of the secondary current path is contacted with the primary current path in a short-circuit-proof manner based on the primary current path, and (ii) on the other side of the secondary current path is contacted in a substantially short-circuit-proof manner based on the fuse. A help system for signalling and/or supply of devices for improving ignition behaviour is arranged in the secondary current path, and the short-circuit-proof fuse box is also contacted to a short-circuit-proof discharge path so that a current can be guided by the help system current path. | 2014-05-15 |
20140133058 | DRIVING CIRCUIT - A driving circuit includes several first electrostatic current limiting resistors and several digital to analog converter (DAC) units. First ends of these first electrostatic current limiting resistors common coupled to a global path to receive a reference voltage. These DAC units respectively coupled to second ends of the first electrostatic current limiting resistors one-on-one to receive the reference voltage through the first electrostatic current limiting resistors. | 2014-05-15 |
20140133059 | PROTECTIVE DEVICE AND PROTECTIVE MODULE - A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided. | 2014-05-15 |
20140133060 | SURGE ARRESTER - A surge arrester includes at least one resistor element and a cage in which the at least one resistor element is disposed. The cage includes an upper holder, a lower holder and at least three insulating rods, which are each held at one respective rod end thereof by the upper holder and at the other respective rod end thereof by the lower holder. The upper holder and the lower holder are configured in such a way that they each enable at least two different positions for at least one of the insulating rods, relative to the two holders, and the at least one insulating rod can be positioned differently relative to the two holders. | 2014-05-15 |
20140133061 | Systems and Methods for Delaying Actuation of a Relay - A system includes a relay, an actuation circuit, and an actuation delay circuit. The relay is coupled to a source of an input voltage or current waveform. The relay includes an actuation coil. The actuation circuit detects a peak or valley of a rectified voltage ripple waveform. The rectified voltage ripple waveform is generated from the input voltage or current waveform. The actuation circuit also causes an actuation voltage to be provided to the actuation coil. The actuation delay circuit delays the actuation circuit from providing the actuation voltage. The actuation delay circuit is configured based on the peak or valley of the rectified voltage ripple waveform. The actuation delay generated by the actuation delay circuit causes the relay to begin allowing current to flow to a load device at a time coincident with a zero-crossing time value of the input voltage or current waveform. | 2014-05-15 |
20140133062 | ADDITIONAL FORCE AUGMENTED ELECTROADHESION - An electrostatic device or system includes electrode(s) adapted to produce an electrostatic attraction force and a base surface adapted to facilitate the application of the electrostatic attraction force and also a physical attraction force separate therefrom. The electrostatic and physical attraction forces can maintain a position of the electrostatic device relative to a foreign object via electroadhesion and/or via an additional manner that is separate from the electroadhesion. The physical attraction force can be a vacuum, van der Waals, and/or adhesive force, can be applied at less than all locations across the base surface, and may involve a one-time permanent attachment. The base surface can include a deformable surface portion that moves closer to the foreign object when the electrostatic or physical attraction force is applied. The physical attraction force can be sufficient to adhere the device to the object when the electrostatic attraction force is removed. | 2014-05-15 |
20140133063 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a monolithic ceramic electronic component, given that an interval between outer-layer dummy conductors adjacent to each other in an outer layer portion is d1, and that an interval between first and second inner electrodes adjacent to each other in an inner layer portion is d2, 1.7d2≦d1 is satisfied. By reducing a density of the outer-layer dummy conductors in the outer layer portion on that condition, pressing of the inner electrodes through the outer-layer dummy conductors is relieved in a pressing step before firing. As a result, a distance between the inner electrodes can be prevented from being locally shortened. It is hence possible to effectively reduce and prevent degradation of reliability of the monolithic ceramic electronic component, e.g., a reduction of BDV. | 2014-05-15 |
20140133064 | MULTILAYERED CERAMIC CAPACITOR, MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING THEREON MULTILAYERED CERAMIC CAPACITOR, PACKING UNIT FOR MULTILAYERED CERAMIC CAPACITOR - There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063≦(B+C)/A≦1.745. | 2014-05-15 |
20140133065 | 3D CAPACITOR - A multi-layer ceramic capacitor (MLCC) device includes a ceramic chip having electrically conductive layers embedded within the chip that form one or more capacitors connected by one or more vias to one or more upwardly facing wire-bondable pads on the top side of the device. One embodiment includes electrically conductive layers that form at least two stacked capacitors connected by vias to multiple upwardly facing wire-bondable pads on the top side, whereby the MLCC device has a reduced footprint while avoiding solder fillets. The wire-bondable pads may lie in a common plane or be pyramidally stepped. Metallization on the PCB-facing bottom side and at least one of the ends of the ceramic chip of another embodiment forms a downwardly facing capacitor terminal. | 2014-05-15 |
20140133066 | ELECTROLYTIC SOLUTION FOR ALUMINUM ELECTROLYTIC CAPACITOR, AND ALUMINUM ELECTROLYTIC CAPACITOR - Disclosed are an aluminum electrolytic capacitor having low impedance properties and a long service life, and an electrolytic solution which enables to give such capacitor. The electrolytic solution contains a solvent containing water, a phosphorus oxoacid ion-generating compound which can generate a phosphorus oxoacid ion in an aqueous solution, and a chelating agent which can coordinate with aluminum to form an aqueous aluminum chelate complex. The electrolytic solution further contains a compound selected from the group consisting of azelaic acid and an azelaic acid salt, and a compound selected from the group consisting of formic acid, a formic acid salt, adipic acid, an adipic acid salt, glutaric acid and a glutaric acid salt. The content of azelaic acid and/or the azelaic acid salt is at least 0.03 moles per kg of the solvent. When the electrolytic solution is used in an electrolytic capacitor which utilizes an anode having an aluminum oxide film containing phosphorus in an amount of 30 to 150 mg per unit CV product in terms of phosphoric acid, the service life of the capacitor is remarkably prolonged. | 2014-05-15 |
20140133067 | COMPLIANT ENERGY STORING STRUCTURAL SHEET - Disclosed herein is a structural sheet includes an energy storage density that is greater than 10-mWh/ft2 and is capable of withstanding greater than 5-KPa stress under at least 5% strain. Further provided is an energy storing structural sheet comprising an electrically conducting current carrying layer that is print formed over a sub assembly that comprises a separator, a foundation, an electrode, and a current bus. | 2014-05-15 |
20140133068 | CAPACITOR - A capacitor comprising a capacitor element including a substrate having first and second faces, a porous first rough surface layer formed on the first face and having pores, a first inner conductive polymer layer formed in the pores, a first outer conductive polymer layer formed on the inner conductive polymer layer, a porous second rough surface layer formed on the second face and having pores, a second inner conductive polymer layer formed in the pores, a second outer conductive polymer layer formed on the second inner conductive polymer layer, and a dielectric layer formed on surfaces of the first and the second rough surface layer. A surface area of the second rough surface layer is smaller than that of the first rough surface layer. The second outer conductive polymer layer is thicker than the first outer conductive polymer layer. This structure enables to eliminate warpage of a capacitor element. | 2014-05-15 |
20140133069 | SOUND SHIELD CORNER JOINT - Some embodiments relate to a power generation system that includes an alternator and an engine that drives the alternator to generate power. The power generation system further includes a housing where the alternator and the engine are within the housing. The housing may provide improved sound attenuation when the power generation system is operating. The housing includes a first corner rail such that a bracket is connected to one end of the first corner rail and at least one side panel. The bracket is connected along an edge of the first corner rail. The first corner rail includes a channel that extends from the end of the first corner rail along a length of the first corner rail. The power generation system includes a first fastener that extends into the channel to connect the bracket to the first corner rail. | 2014-05-15 |
20140133070 | INVERTER DEVICE - An inverter device includes an inverter stack, and a switchboard to insert the inverter stack from a front side to store. The inverter stack, as an output relay unit, linking three phase output terminals and output relay terminals forming the switchboard, alternatively, selects a first output relay unit wherein three phase output relay bars for directly outputting three phases of outputs from the output terminals to the output relay terminals and a fixing plate to fix the three phase output relay bars to the inverter stack are unitized through an insulating member, or a second output relay unit wherein a single-phase output relay bar for outputting three phase outputs from the output terminals as a single phase to the output relay terminals and a fixing plate to fix the single-phase output relay bar to the inverter stack are unitized through an insulating member. | 2014-05-15 |
20140133071 | ARC-RESISTANT SWITCHGEAR ENCLOSURE WITH VENT PROP AND LATCH - An arc-resistant switchgear enclosure has interior compartments with outlet vent openings that are selectively closed by vent flaps. The vent flaps are propped in an open position by props that extend from the vent flaps and contact supports. The props have a latch portion that latches the vent flap when the vent flap is in the closed position. | 2014-05-15 |
20140133072 | PANEL PROTECTING DEVICE OF FLAT PANEL ELECTRONIC DEVICE AND FLAT PANEL ELECTRONIC DEVICE - The present invention provides a panel protecting device of a flat panel electronic device and a flat panel electronic device. The panel protecting device comprises: a sensor for detecting one or more of a falling speed, a falling time and a falling distance of the flat panel electronic device in a vertical direction when the flat panel electronic device is only under gravity; and a protecting means for being mounted around a panel of the flat panel electronic device. The protecting means has a rest position and a protruding position. The protecting means is accommodated in a recess of the flat panel electronic device when the protecting means is in the rest position and protrudes from the panel when the protecting means is in the protruding position. The protecting means moves to the protruding position from the rest position automatically when the one or more of the falling speed, the falling time and the falling distance is greater than or equal to a predetermined value. The panel protecting device of the flat panel electronic device provided by the present invention is able to protrude the protecting means automatically when the movement of the panel protecting device is determined to be the accidental falling, so as to prevent the panel from contacting with the ground and further avoid the damage of the panel. | 2014-05-15 |
20140133073 | CURVED DISPLAY APPARATUS - A curved display apparatus is provided. The curved display apparatus includes a fixing member which is curved; and a display panel which is attached to the fixing member and curved along the fixing member. | 2014-05-15 |
20140133074 | MOBILE ELECTRONIC DEVICE COMPRISING AN ULTRATHIN SAPPHIRE COVER PLATE - An electronic device comprising a cover plate is disclosed. The cover plate comprises one or more sapphire layers having a thickness of less than 50 microns. Also disclosed are methods for preparing these ultrathin sapphire layers using an ion implantation/exfoliation method. | 2014-05-15 |
20140133075 | MICROELECTRONIC SUBSTRATE FOR ALTERNATE PACKAGE FUNCTIONALITY - The present disclosure relates to microelectronic substrates, such as interposers, motherboards, test platforms, and the like, that are fabricated to have overlapping connection zones, such that different microelectronic devices, such as microprocessors, chipsets, graphics processing devices, wireless devices, memory devices, application specific integrated circuits, and the like, may be alternately attached to the microelectronic substrates to form functional microelectronic packages. | 2014-05-15 |
20140133076 | DISPLAY DEVICE WITH FLEXIBLE DISPLAY - A display device including a device body, a continuous flexible display and a support frame is disclosed. A support frame is movable with respect to the device body between a closed configuration for fixing the flexible display in a storage position and an open configuration for fixing the flexible display in an open position. In the open configuration at least one surface support part of the support frame and the surface support part of a lower body side of the device body are positioned in one plane, enabling a supporting of the surface support part of the support frame and of the device body on a surface. In the closed configuration, the device body is partially covered by a portion of the support frame, and the flexible display is sandwiched between the device body and the portion of the support frame. | 2014-05-15 |
20140133077 | ELECTRONIC DEVICE DESIGNED FOR HOLDING HIGH-DEFINITION MULTIMEDIA INTERFACE CONNECTOR - An electronic device designed for holding a High-Definition Multimedia Interface connector is disclosed. The electronic device has a receiving socket for receiving the connector that serves to convert audio/video signals of the electronic device into a format of HDMI, and output the converted signals to a terminal. Thereby, the connector not in use can be carried with the electronic device, and can be conveniently detached from the electronic device and connected to the terminal. | 2014-05-15 |
20140133078 | ELECTRONIC DEVICE HAVING FUNCTION OF FIXING A KEYBOARD MECHANISM - An electronic device having function of fixing a keyboard mechanism is disclosed in the present invention. The electronic device includes a casing for holding the keyboard mechanism, and an accommodating space is formed on a lateral inner wall of the casing. The electronic device further includes a hook mechanism disposed inside the accommodating space on the casing. The hook mechanism includes an arm base. An end of the arm base is connected to a surface of the accommodating space, and the other end of the arm base is connected to the other surface of the accommodating space. The hook mechanism further includes a hook portion disposed on the arm base and further located between the ends of the arm base for contacting against the keyboard mechanism, so as to constrain a movement of the keyboard mechanism relative to the casing. | 2014-05-15 |
20140133079 | DETACHABLE ELECTRONIC DEVICE WITH COVER PORTION - An embodiment provides an electronic device, including: a detachable display portion; a base body; the base body including an attachment portion to which the detachable display portion attaches; the attachment portion being located a depth from a rear edge of the base body; and a cover extending from a point of the base body behind the attachment portion and proximate to the rear edge of the base body. | 2014-05-15 |
20140133080 | DETACHABLE ELECTRONIC DEVICE AND CONNECTION APPARATUS USABLE WITH THE SAME - A detachable electronic device includes a connection apparatus disposed in one end of a peripheral apparatus to which a tablet computer is detachably mounted, the connection apparatus includes a base disposed in the peripheral apparatus, a mounting groove that is formed in the base and in which one end of the tablet computer is inserted, a hook disposed on a bottom surface of the mounting groove to move parallel to the mounting groove, and a pressure member to push the hook in a direction, and the tablet computer includes an inserting groove formed in the one end of the tablet computer and in which the hook can be inserted, a catch projection formed at a side surface of the inserting groove and which engages the hook, and a pushing projection disposed opposite to the catch projection inside the inserting groove. | 2014-05-15 |
20140133081 | MEMORY COMBINATION AND COMPUTER SYSTEM USING THE SAME - A memory combination includes a first riser board, a second riser board, a pivotal plate, a first engaging member, and a second engaging member. The first riser board has a first edge and a second edge parallel to each other. The second riser board has a third edge and a fourth edge parallel to each other. The pivotal plate are pivotally connected to the first riser board to be adjacent to the first edge and to the second riser board to be adjacent to the third edge. The first and second engaging members are respectively disposed on the first and second riser boards to be respectively adjacent to the second and fourth edges. When the first and second riser boards rotate to be perpendicular to the pivotal plate, the first engaging member is engaged with the second engaging member. | 2014-05-15 |
20140133082 | TURBOFAN AND GRAPHICS CARD WITH THE TURBOFAN - The present invention provides a turbofan and a graphics card with the turbofan. The turbofan comprises: a turbofan assembly which admits air in an axial direction and dispenses air in a radial direction; an inlet fan assembly disposed at an inlet of the turbofan assembly and disposed coaxially with the turbofan assembly: and a driving means for driving the turbofan assembly and the inlet fan assembly to rotate. The turbofan provided by the invention gathers the ambient air to the inlet through the inlet fan assembly disposed at the inlet of the turbofan assembly, so as to change a negative pressure state at the inlet. Consequently, the cooling efficiency of the turbofan is improved effectively and the noise of the turbofan is reduced. | 2014-05-15 |
20140133083 | GRAPHICS CARD AND BASE PLATE AND CORE BOARD FOR THE GRAPHICS CARD - The present invention discloses graphics card and base plate and core board for the graphics card. The graphics card includes a base plate and a core board, wherein the base plate includes a base plate PCB and a core board interface slot, a power module and a graphics output interface located on the base plate PCB; the core board includes a core board PCB and a base plate interface and a graphics processing module located on the core board PCB, and the core board is accommodated in the core board interface slot of the base plate and electrically connected with the base plate via the base plate interface; the graphics processing module receives a power signal from the power module and output graphic data for being displayed via the base plate interface; the graphics output interface is used to output the graphic data for being displayed. | 2014-05-15 |
20140133084 | PIVOTAL ASSEMBLY APPLIED TO BOARD - A pivotal assembly applied to a board includes a first board, a first pivotal member, and a pivotal plate. The first pivotal member is fixed to the first board and has a first retaining structure. The pivotal plate is pivotally connected to the first pivotal member and has a first protrusion. The first protrusion is retained in the first retaining structure, so as to make the first board limitedly rotate to be perpendicular or parallel to the pivotal plate. | 2014-05-15 |
20140133085 | MEMORY COMBINATION AND COMPUTER SYSTEM USING THE SAME - A memory combination is applied in a computer system. The computer system includes a motherboard. The motherboard includes a first riser slot and a second riser slot disposed side by side. The memory combination includes a first riser board and a second riser board. The first riser board is plugged into the first riser slot and includes a plurality of first memory sockets. The second riser board is plugged into the second riser slot and includes a plurality of second memory sockets. The first memory sockets face the second riser board, and the second memory sockets face the first riser board. The first memory sockets are unaligned with the second memory sockets. | 2014-05-15 |
20140133086 | ELECTRONIC DEVICE - An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules. | 2014-05-15 |
20140133087 | ELECTRONIC DEVICE - An electronic device includes a motherboard, a power module, a hard disk module, a fan module, a heating module and a power-supply wind scooper. The power module is arranged on a front side of the motherboard along a longitudinal direction, and has a power-supply opening. The hard disk module is stacked on the module. The fan module is located on a rear side of the motherboard along a transverse direction, and further provides airflows towards the power-supply opening of the power module. The heating module is arranged on the motherboard, and further located between the fan module and the power module. The power-supply wind scooper shields a part of the power-supply opening, so as to respectively guide parts of the airflow into the power module and the heating module. | 2014-05-15 |
20140133088 | COOLING COMPUTING ASSETS IN A DATA CENTER USING A HOT STACK - A data center includes a hot stack for exhausting heated air from the data center. As air flows across computing assets operating in the data center, the air absorbs heat generated by the computing assets. The temperature difference between the heated air and air outside the data center, the height of the hot stack, and the area of the hot stack causes the heated air to flow through the hot stack and outside of the data center. This air flow may be used to decrease the pressure of a portion of the data center, causing air to flow from a higher pressure portion of the data center to the depressurized portion of the data center. | 2014-05-15 |
20140133089 | COOLING COMPUTING ASSETS IN A DATA CENTER USING HOT AND COLD STACKS - A data center includes a hot stack for exhausting heated air from the data center and a cold stack that cools intake air relative to the environment surrounding the data center. The temperature difference between air in the cold stack and the environment creates an airflow through the cold stack and into a cold aisle. This pressurizes the cold aisle, causing air to flow from the cold aisle across computing assets to a lower-pressure hot aisle. While flowing across the computing assets, the air absorbs heat generated by the computing assets. The temperature difference between the heated air and air outside the data center causes the heated air to flow through the hot stack and outside of the data center. | 2014-05-15 |
20140133090 | ELECTRONIC DEVICE - An electronic device includes a motherboard, at least one heat dissipation module, a fan module and a wind scooper. The heat dissipation module is arranged on the motherboard and provided with a first positioning component. The fan module is arranged on one side of the motherboard and faces the heat dissipation module. The wind scooper has a second positioning component corresponding to the first positioning component. The wind scooper is fixed on the heat dissipation module through the cooperation between the first positioning component and the second positioning component. The wind scooper is connected between the fan module and the heat dissipation modules, so that the airflow provided by the fan module can flow through the heat dissipation module. | 2014-05-15 |
20140133091 | SYSTEM AND DESIGN OF COST EFFECTIVE CHASSIS DESIGN FOR NETWORKING PRODUCTS - An electrical equipment chassis includes a frame open to a first side and an opposite second side and a power board located near a mid-plane of the chassis coupling power supply modules to first networking modules and a second networking module. A first region open to the first side can receive first power supply modules. A second region open to the first side is adjacent to the first region and can receive the first networking modules and the second networking module oriented with a first orientation. A third region open to the second side can receive fan trays with fans and third networking modules. The third networking modules are oriented orthogonal to the first orientation. The power board at least partially separates the first and third regions and only partially separates the second and third regions. The chassis permits air flow from the first side to the second side. | 2014-05-15 |
20140133092 | MANUFACTURED DATA CENTER - A manufactured data center (MDC) uses construction systems and methods allowing the MDC unit to serve as a drop-in replacement for a traditional brick-and-mortar computer data center, while providing functional and operational advantages over known modular data centers. The MDC comprises “white space” housing supported equipment such as servers and other heat-producing computing equipment, plus a power center incorporating electrical equipment and infrastructure necessary for operation of the supported equipment, including an HVAC system which may comprise a purpose-built computer room air conditioning (CRAC) unit. | 2014-05-15 |
20140133093 | COOLING SYSTEM FOR ELECTRONICS - A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel. | 2014-05-15 |
20140133094 | ACTIVE ANTENNA ARRAY HEATSINK - An active array heat sink cooled by natural free convection is disclosed. A long extruded heat sink is partitioned into multiple, shorter zones separated by gaps having horizontal baffles. The gaps and baffles serve to act as air vents and air inlets for the convection currents. As such, the heat transfer for the overall heat sink is improved because hot convection currents are vented and replaced by cool ambient air along the length of the heat sink. | 2014-05-15 |
20140133095 | ELECTRONIC DEVICE - An electronic device includes a first body, a second body, a baffle, and a drive mechanism. The second body includes an opening on a bottom surface thereof, and the baffle is disposed on the bottom surface to cover the opening. The baffle is pivotally connected to the second body to rotate with respect to the second body. The drive mechanism includes a pivot, a linkage and a cam. The pivot connects the first body and the second body. The linkage is sleeved over the pivot. The cam is sleeved over the linkage and located corresponding to the baffle. While the first body rotates with respect to the second body, the pivot rotates with the first body and drives the linkage to make the cam rotate. Meanwhile, the cam pushes the baffle and makes the baffle rotate and expose part of the opening to enhance cooling effect of the electronic device. | 2014-05-15 |
20140133096 | AIR-COOLING AND VAPOR-CONDENSING DOOR ASSEMBLY - A cooling apparatus for an electronics rack is provided which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack. | 2014-05-15 |
20140133097 | COOLING SYSTEM, METHOD FOR DETECTING CLOGGING OF AIR FILTER AND SIGNAL TRANSMISSION APPARATUS - A cooling system includes: a cooling fan configured to take in air through an air filter and to send the air to one or more electronic components; one or more first temperature detectors configured to detect temperatures of the one or more electronic components; a revolution controller configured to control a number of revolutions of the cooling fan on basis of the temperatures detected by the one or more first temperature detectors; and a clogging detector configured to, when the number of revolutions of the cooling fan controlled by the revolution controller is greater than a reference number of revolutions of the cooling fan that makes the temperature of the one or more electronic components less than upper-limit temperatures of the one or more electronic components, detect a clogging condition for the air filter. | 2014-05-15 |
20140133098 | INLET-AIR-COOLING DOOR ASSEMBLY FOR AN ELECTRONICS RACK - A cooling apparatus for an electronics rack is provided which includes a door assembly configured to couple to an air inlet side of the electronics rack. The door assembly includes: one or more airflow openings facilitating passage of airflow through the door assembly and into the electronics rack; one or more air-to-coolant heat exchangers disposed so that airflow through the airflow opening(s) passes across the heat exchanger(s), which is configured to extract heat from airflow passing thereacross; and one or more airflow redistributors disposed in a direction of airflow through the airflow opening(s) downstream of, and at least partially aligned to, the heat exchanger(s). The airflow redistributor(s) facilitates redistribution of the airflow passing across the air-to-liquid heat exchanger(s) to a desired airflow pattern at the air inlet side of the electronics rack, such as a uniform airflow distribution across the air inlet side of the rack. | 2014-05-15 |
20140133099 | AIR-COOLING AND VAPOR-CONDENSING DOOR ASSEMBLY - A method is provided which includes providing a cooling apparatus which includes a door assembly coupled to the electronics rack at an inlet or air outlet side of the rack. The door assembly includes: an airflow opening configured to facilitate ingress or egress of airflow through the electronics rack with the door assembly mounted to the rack; an air-to-coolant heat exchanger disposed so that airflow through the airflow opening passes across the air-to-coolant heat exchanger, the air-to-coolant heat exchanger being configured to extract heat from the airflow passing thereacross; and a vapor condenser configured to facilitate condensing of dielectric fluid vapor egressing from at least one immersion-cooled electronic component section of the electronics rack. The cooling apparatus, including the door assembly, facilitates air-cooling and immersion-cooling of different electronic components of the electronics rack. | 2014-05-15 |
20140133100 | APPARATUS AND METHOD FOR TESTING SEMICONDUCTOR DEVICE - There are provided an apparatus for testing a semiconductor device and a method for testing a semiconductor device. The apparatus for testing a semiconductor device includes: a temperature detection unit detecting a temperature of a semiconductor device to generate a detected temperature; a controller comparing the detected temperature with a preset control temperature to generate a comparison result, and determining whether to cool the semiconductor device according to the comparison result; and a cooling unit cooling the semiconductor device according to a control of the controller, wherein the controller resets the control temperature, when the detected temperature is outside of a range of an operational temperature of the semiconductor device. | 2014-05-15 |
20140133101 | Signal Transmission Device - A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate. | 2014-05-15 |
20140133102 | HEAT DISSIPATING ASSEMBLY AND ELECTRONIC DEVICE ASSEMBLY WITH HEAT DISSIPATING ASSEMBLY - An electronic device assembly includes an electronic device, an internal heat dissipating mechanism, an external heat dissipating mechanism, and the heat dissipating mechanism. The electronic device includes a bottom base, and the internal heat dissipating mechanism is secured inside the bottom base, to dissipate heat generated by the electronic device. The external heat dissipating mechanism is secured outside the bottom base. The heat conduction block is secured to the internal heat dissipating mechanism and contacts with the external heat dissipating mechanism. The heat conduction block directs heat from the internal heat dissipating mechanism, and the external heat dissipating mechanism directs heat from the heat conduction block, to increase the heat dissipating efficiency of the internal heat dissipating mechanism, to make the electronic device work in a proper temperature. | 2014-05-15 |
20140133103 | HIGH FREQUENCY CIRCUIT MODULE - The high frequency circuit module includes an RFIC configured to transmit and receive a high frequency signal, a power amplifier IC configured to amplify a transmission signal outputted from the RFIC, and a duplexers configured to separate the transmission signal outputted from the power amplifier IC and inputted to an antenna and a reception signal from the antenna and inputted to the RFIC from each other, in which at least one of the RFIC and power amplifier IC is embedded in the circuit substrate, and the duplexers are disposed between the RFIC and the power amplifier IC. | 2014-05-15 |
20140133104 | LOW PROFILE SURFACE MOUNT PACKAGE WITH ISOLATED TAB - A surface mount package includes at least one semiconductor device and a POL packaging and interconnect system formed about the at least one semiconductor device that is configured enable mounting of the surface mount package to an external circuit. The POL system includes a dielectric layer overlying a first surface of the semiconductor device(s) and a metal interconnect structure extending through vias formed through the dielectric layer so as to be electrically coupled to connection pads on the semiconductor device(s). A metallization layer is formed over the metal interconnect structure that comprises a flat planar structure, and a double-sided ceramic substrate is positioned on a second surface of the semiconductor device(s), with the double-sided ceramic substrate being configured to electrically isolate a drain of the semiconductor device(s) from an external circuit when the surface mount package is joined thereto and to conduct heat away from the semiconductor device(s). | 2014-05-15 |
20140133105 | METHOD OF EMBEDDING CPU/GPU/LOGIC CHIP INTO A SUBSTRATE OF A PACKAGE-ON-PACKAGE STRUCTURE - Embodiments of the invention provide an IC system in which low-power chips can be positioned proximate high-power chips without suffering the effects of overheating. In one embodiment, the IC system may include a first substrate, a high-power chip embedded within the first substrate, a second substrate disposed on a first side of the first substrate, the first substrate and the second substrate are in electrical communication with each other, and a low-power chip disposed on the second substrate. In various embodiments, a heat distribution layer is disposed adjacent to the high-power chip such that the heat generated by the high-power chip can be effectively dissipated into an underlying printed circuit board attached to the first substrate, thereby preventing heat transfer from the high-power chip to the low-power chip. Therefore, the lifetime of the low-power chip is extended. | 2014-05-15 |
20140133106 | MULTIMEDIA DEVICE - A multimedia device includes a body, a first electronic module and a second electronic module. The first electronic module and the second electronic module are pivotally connected onto the body, respectively. The first electronic module and the second electronic module are configured to rotate relatively to the body and capture or display a multimedia information, respectively. | 2014-05-15 |
20140133107 | THIN FILM TYPE CHIP DEVICE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a thin film type chip device, including: a plurality of unit circuit structures laminated on a substrate; and an adhesive layer adhering the unit circuit structures to each other. | 2014-05-15 |
20140133108 | DIFFERENTIAL TRANSMISSION CIRCUIT, OPTICAL MODULE, AND INFORMATION PROCESSING SYSTEM - A differential transmission circuit includes a pair of transmission line conductors and a ground conductor layer, wherein the pair of transmission line conductors include a first straight line region where both the pair of transmission line conductors extend in parallel to each other in a first direction with a first width in a first layer, a first cross region where one of the pair of transmission line conductors is formed in the first layer, the other thereof is formed in a second layer, and the pair of transmission line conductors cross the each other in a three-dimensional manner, the first cross region being disposed on the front side of the first straight line region, and wherein each of the widths of the pair of transmission line conductors in the first cross region is smaller than the first width. | 2014-05-15 |
20140133109 | FIELD REPLACEABLE AUXILIARY SWITCH AND CONTROL CIRCUIT ASSEMBLY FOR AN ELECTRICAL CONTACTOR - A field replaceable auxiliary switch and control circuit assembly for an electrical contactor that comprises a frame member capable of being inserted into, and removable from, an opening and an interior of an electrical contactor housing. A circuit board is mounted to the frame member and has a control circuit formed thereon. The assembly may further comprise a first electrical connector disposed within the contactor housing and a second electrical connector attached to the circuit board having one or more electrical contacts capable of being positioned in mating relationship with the first electrical contactor, which is in electrical communication with an electromagnet and/or electromagnetic coil. | 2014-05-15 |
20140133110 | COMBINED WIRING BOARD - A combined wiring board has multiple piece components each including a wiring board, and a frame component having an accommodation opening portion and holding the multiple piece components in the accommodation opening portion such that each of the piece components is fixed to the frame component at an outer rim of each of the piece components. The frame component has a thermal expansion coefficient in a planar direction which is set higher than a thermal expansion coefficient of the multiple piece components in the planar direction. | 2014-05-15 |
20140133111 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING COMBINED WIRING BOARD - A method for manufacturing a combined wiring board includes providing a metal frame having an accommodation opening portion, positioning a wiring board in the accommodation opening portion of the metal frame, and subjecting the metal frame to plastic deformation such that a sidewall of the wiring board is connected to a sidewall of the metal frame inside the accommodation opening portion of the metal frame. | 2014-05-15 |
20140133112 | TOUCH PAD AND PORTABLE ELECTRONIC DEVICE THEREOF - A touch pad includes a support frame having an opening, a touch circuit board disposed on a support sheet and having a switch, a top cover connected to a first side of the support frame and covering the touch circuit board, a reinforcement rod disposed on the top cover corresponding to a second side of the support frame, and an elastic member. The support sheet extends inwardly from the opening and has a protruding point. The elastic member is disposed between the touch circuit board and the support sheet for providing an elastic force. When being pressed by an external force, the top cover rotates pivotally relative to the first side of the support frame and drives the touch circuit board to overcome the elastic force. Accordingly, the touch circuit board could move downward relative to the support sheet so that the switch could be triggered by the protruding point. | 2014-05-15 |
20140133113 | DISPLAY AND ELECTRONIC UNIT - A display capable of inhibiting deformation of a component during transport or the like and an electronic unit including the display are provided. A display includes: a main section; and a board-mounting plate disposed on one surface of the main section, and having a board-mounting region on a main surface on a side opposite to a side facing the main section, in which the board-mounting plate includes, at corners at both ends of a side of the mounting region, hook sections allowing corners of a board to be hooked thereto, and the hook sections each are fixed to the main surface on two sides of the corner of the mounting region. | 2014-05-15 |
20140133114 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first conductor layer in which first transmission lines and a second transmission line are formed; a second conductive layer facing the first conductive layer through an insulating layer; and a third conductive layer that faces the second conductive layer through an insulating layer and that has a bypass line formed therein. The bypass line is electrically connected to the second transmission line of the first conductive layer through via conductors and such that the second transmission line and the first transmission lines intersect with each other. In the second conductive layer, a ground conductor is formed at least in a position that faces the bypass line, and the first transmission lines are made narrower at the intersection with the second transmission line than other portions. | 2014-05-15 |
20140133115 | MULTILAYER WIRING BOARD - A multilayer wiring board includes a signal electrode, a first power supply electrode, and a ground electrode, which are connected to a first element that outputs a signal, an electrode connected to a second element that receives the signal, a ground layer that serves as a return path for a return current of the signal, a first power supply layer that is disposed adjacent to the ground layer with a dielectric layer interposed therebetween and supplies electric power to the first element, and a second power supply layer that is provided independently of the first power supply layer and supplies electric power to the second element. The first power supply layer causes the return current to return to the first element through the first power supply electrode as a displacement current between the ground layer and the first power supply layer. | 2014-05-15 |
20140133116 | GROUNDING GASKET AND ELECTRONIC APPARATUS - According to one embodiment, a grounding gasket includes a main body and a projecting part. The main body is configured to be interposed between a ground part and a substrate and contact the ground part and the substrate. The projecting part projects from the main body. The projecting part is configured to extend through a through-hole which is opened in the substrate, project to a side opposite to a side on which the ground part is located, and contact a conductive component mounted on the substrate. | 2014-05-15 |
20140133117 | HIGH FREQUENCY CIRCUIT MODULE - A multilayer circuit substrate has a high frequency switch embedded therein. In the multilayer circuit substrate, a first conductive layer that faces a main surface of the high frequency switch through an insulating layer has circuit patterns formed therein so as to be connected to input/output terminals through via conductors. The first conductive layer has an opening pattern in which a ground conductor is not present in a region that faces the main surface of the high frequency switch and that is outside of the circuit patterns. In a third conductive layer disposed outer side of the first conductive layer with respect to the high frequency switch, a ground conductor is formed at least in a region where the main surface of the high frequency switch is projected in the thickness direction. | 2014-05-15 |
20140133118 | COMPONENT-EMBEDDED BOARD AND METHOD OF MANUFACTURING SAME - Provided is a component-embedded board. The board includes: a first base including first substrate incorporating a first electric component and first electrode provided on a first face of the substrate and electrically connected to the electric component; a second electronic component fixed on the first face with a first adhesion portion therebetween; a second base including second substrate in which the second electronic component is embedded and second electrode exposed at a first face of the second substrate; a second adhesion portion arranged between the first and second bases; a third base including third substrate and third electrode exposed at a first face of the third substrate; and a third adhesion portion arranged between the second and third bases. The first, second and third electrodes are electrically connected to the second electronic component, and the second electronic component is surrounded, at least, by the first and third adhesion portions. | 2014-05-15 |
20140133119 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first substrate having a penetrating hole penetrating through the first substrate, a built-up layer formed on a surface of the first substrate and including interlayer resin insulation layers and wiring layers, the built-up layer having an opening portion communicated with the penetrating hole of the fist substrate and opened to the outermost surface of the built-up layer, an interposer accommodated in the opening portion of the built-up layer and including a second substrate and a wiring layer formed on the second substrate, the wiring layer of the interposer including conductive circuits for being connected to semiconductor elements, a filler filling the opening portion such that the interposer is held in the opening portion of the built-up layer, and mounting pads formed on the first substrate and positioned to mount the semiconductor elements. The mounting pads are positioned to form a matrix on the first substrate. | 2014-05-15 |
20140133120 | SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT - In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively. | 2014-05-15 |
20140133121 | MOUNTING APPARATUS FOR CIRCUIT BOARDS - A mounting apparatus for fixing circuit boards includes a position member configured to mount first circuit board, and a switch member configured to mount a second circuit board. The position member includes a first positioning hole. The switch member includes an enclosure and a rotating axle rotatably mounted in the enclosure. A spring is positioned on the rotating axle. A first engaging portion and a second engaging portion extend from the rotating axle. Two second supporting portions are located in the enclosure. The rotating axle resists against the spring and compresses the spring. The second engaging portion passes through the first positioning hole and resists against the position member. The second circuit board is attached to the first circuit board by the first engaging portion resisting against the two second supporting portions. | 2014-05-15 |
20140133122 | ELECTRONIC COMPONENT ASSEMBLY - According to embodiments of the invention, an electronic component assembly may be provided. The electronic component assembly may include an electronic component body. The electronic component assembly may also include a non-conductive force transfer plate affixed to the electronic component body to receive an assembly force. The electronic component assembly may also include a plurality of electrical connectors passing through the non-conductive force transfer plate, wherein first ends of the electrical connectors are located within the electronic component body and second ends are located outside the electronic component body, and the electrical connectors have a force transfer structure adapted to engage the non-conductive force transfer plate and transfer at least a portion of the assembly force from the force transfer plate to the electrical connectors. | 2014-05-15 |
20140133123 | IMPLANTABLE MEDICAL DEVICE HEADER - Techniques for forming a header for an implantable medical device via a two-shot molding process are described. The two-shot molding processes may include a first molding step that creates a first-shot assembly and a second molding step that creates a second-shot assembly. The first-shot assembly may be formed to include one or more protrusions configured to interact with a second-shot mold and/or molding material in the second molding step. The second molding step may be configured to overmold the first-shot assembly. The header may include an attachment plate at least partially embedded in molding material and configured to be mechanically coupled to a body of the implantable medical device. | 2014-05-15 |
20140133124 | Security Mechanism For Electrical Components - A telecommunication distribution box includes a housing and an electrical component mounted in the housing. A cover plate is movably connected to the housing and is movable between open and closed positions. A lip extends outwardly from the cover plate. The lip covers the electrical component when the cover plate is in the closed position to prevent accessing and removing the electrical component. | 2014-05-15 |
20140133125 | ARTIFICIAL LIGHTING SYSTEM FOR SIMULATING A NATURAL LIGHTING - An embodiment of a lighting system for illuminating an environment with a lighting that simulates natural lighting includes: a first light source which emits a beam of visible light; a diffused-light generator delimited by an inner surface, which receives the light beam, and an outer surface, the diffused-light generator being at least partially transparent to the light beam. The diffused-light generator transmits at least part of the light beam and emits, through the outer surface, visible diffused light, the correlated color temperature of the transmitted light being lower than the CCT of the visible diffused light. The lighting system includes a dark box which hosts the first light source, the dark box being optically coupled to the environment via the diffused-light generator. | 2014-05-15 |
20140133126 | ILLUMINANT KEYBOARD DEVICE - An illuminant device includes a lighting module, a bottom frame, and a keying unit. The lighting module includes a light guide plate and a light source. The light source has an optical axis. The bottom frame is located under the lighting module and includes a plurality of hook bodies. Each hook body includes a baffling portion and a flange. An extending direction of the baffling portion is substantially parallel to the optical axis, and an extending direction of the flange is substantially perpendicular to the optical axis. The keying unit is located above the lighting unit and includes a first lever and a second lever, the first lever intersects to the second lever, one end of the first lever and one end of the second lever are placed between the bottom frame and the flange and are in contact with a contacting surface of the baffling surface. | 2014-05-15 |