20th week of 2019 patent applcation highlights part 65 |
Patent application number | Title | Published |
20190148296 | LOW ASPECT RATIO INTERCONNECT | 2019-05-16 |
20190148297 | SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME | 2019-05-16 |
20190148298 | INTEGRATED CIRCUIT INCLUDING FIELD EFFECT TRANSISTORS HAVING A CONTACT ON ACTIVE GATE COMPATIBLE WITH A SMALL CELL AREA HAVING A SMALL CONTACTED POLY PITCH | 2019-05-16 |
20190148299 | CONTACT FORMATION IN SEMICONDUCTOR DEVICES | 2019-05-16 |
20190148300 | CIRCUIT SUBSTRATE | 2019-05-16 |
20190148301 | Semiconductor Package and Method | 2019-05-16 |
20190148302 | Semiconductor Package and Method | 2019-05-16 |
20190148303 | Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition | 2019-05-16 |
20190148304 | Embedding Known-Good Component in Known-Good Cavity of Known-Good Component Carrier Material With Pre-formed Electric Connection Structure | 2019-05-16 |
20190148305 | Fan-Out Package Having a Main Die and a Dummy Die, and Method of Forming | 2019-05-16 |
20190148306 | SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND RELATED METHODS | 2019-05-16 |
20190148307 | CAPPING LAYER FOR IMPROVED DEPOSITION SELECTIVITY | 2019-05-16 |
20190148308 | ELECTRO-MIGRATION BARRIER FOR CU INTERCONNECT | 2019-05-16 |
20190148309 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2019-05-16 |
20190148310 | SEMICONDUCTOR PACKAGE SUBSTRATE SUPPORT STRUCTURES FOR BALL-GRID ARRAY CAVITIES, AND METHODS OF ASSEMBLING SAME | 2019-05-16 |
20190148311 | MICROELECTRONIC BOND PADS HAVING INTEGRATED SPRING STRUCTURES | 2019-05-16 |
20190148312 | METHOD AND SYSTEM FOR PROVIDING A REVERSE-ENGINEERING RESISTANT HARDWARE EMBEDDED SECURITY MODULE | 2019-05-16 |
20190148313 | INTEGRATED CIRCUIT DEVICE | 2019-05-16 |
20190148314 | SEMICONDUCTOR DEVICES WITH POST-PROBE CONFIGURABILITY | 2019-05-16 |
20190148315 | AMPLIFIER | 2019-05-16 |
20190148316 | HIGH-FREQUENCY CERAMIC BOARD AND HIGH-FREQUENCY SEMICONDUCTOR ELEMENT PACKAGE | 2019-05-16 |
20190148317 | PACKAGE STRUCTURE WITH PROTRUSION STRUCTURE | 2019-05-16 |
20190148318 | Power Semiconductor Chip, Method for Producing a Power Semiconductor Chip, and Power Semiconductor Device | 2019-05-16 |
20190148319 | CHIP, FLEXIBLE DISPLAY PANEL AND DISPLAY DEVICE | 2019-05-16 |
20190148320 | Electronic element and electronic device comprising the same | 2019-05-16 |
20190148321 | INTEGRATION AND BONDING OF MICRO-DEVICES INTO SYSTEM SUBSTRATE | 2019-05-16 |
20190148322 | SEMICONDUCTOR DEVICE WITH POST PASSIVATION STRUCTURE | 2019-05-16 |
20190148323 | SEMICONDUCTOR PACKAGE HAVING REDUCED INTERNAL POWER PAD PITCH | 2019-05-16 |
20190148324 | 3D-Interconnect | 2019-05-16 |
20190148325 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-05-16 |
20190148326 | SEMICONDUCTOR DEVICES AND SEMICONDUCTOR PACKAGES | 2019-05-16 |
20190148327 | DRIVING CHIP, DISPLAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE | 2019-05-16 |
20190148328 | CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE | 2019-05-16 |
20190148329 | Interconnect Chips | 2019-05-16 |
20190148330 | MULTI-CHIP INTEGRATED FAN-OUT PACKAGE | 2019-05-16 |
20190148331 | THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE | 2019-05-16 |
20190148332 | REINFORCEMENT FOR ELECTRICAL CONNECTORS | 2019-05-16 |
20190148333 | METHOD FOR BONDING WAFERS AND BONDING TOOL | 2019-05-16 |
20190148334 | METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC CHIP AND A CARRIER SUBSTRATE AND ELECTRONIC DEVICE | 2019-05-16 |
20190148335 | SYSTEMS ENABLING LOWER-STRESS PROCESSING OF SEMICONDUCTOR DEVICE STRUCTURES AND RELATED STRUCTURES | 2019-05-16 |
20190148336 | Forming Metal Bonds with Recesses | 2019-05-16 |
20190148337 | ELECTRONIC DEVICE INCLUDING SEMICONDUCTOR DEVICE PACKAGE | 2019-05-16 |
20190148338 | SEMICONDUCTOR DEVICE ASSEMBLIES WITH MOLDED SUPPORT SUBSTRATES | 2019-05-16 |
20190148339 | MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONSTITUTE WAFER | 2019-05-16 |
20190148340 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2019-05-16 |
20190148341 | SEMICONDCUTOR PACKAGES | 2019-05-16 |
20190148342 | Integrating Passive Devices in Package Structures | 2019-05-16 |
20190148343 | Structure and Formation Method for Chip Package | 2019-05-16 |
20190148344 | MULTIPLE PLATED VIA ARRAYS OF DIFFERENT WIRE HEIGHTS ON SAME SUBSTRATE | 2019-05-16 |
20190148345 | DUMMY TSV TO IMPROVE PROCESS UNIFORMITY AND HEAT DISSIPATION | 2019-05-16 |
20190148346 | MULTI-LED SYSTEM | 2019-05-16 |
20190148347 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-05-16 |
20190148348 | ELASTOMERIC LAYER FABRICATION FOR LIGHT EMITTING DIODES | 2019-05-16 |
20190148349 | SEMICONDUCTOR PACKAGE | 2019-05-16 |
20190148350 | OPTICAL MODULE | 2019-05-16 |
20190148351 | Process Control for Package Formation | 2019-05-16 |
20190148352 | INTEGRATED CIRCUIT AND METHOD OF GENERATING INTEGRATED CIRCUIT LAYOUT | 2019-05-16 |
20190148353 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC APPARATUS | 2019-05-16 |
20190148354 | SEMICONDUCTOR DEVICE | 2019-05-16 |
20190148355 | Intelligent Diode Structures | 2019-05-16 |
20190148356 | PROTECTION DEVICE AND METHOD FOR FABRICATING THE PROTECTION DEVICE | 2019-05-16 |
20190148357 | FinFET-Based ESD Devices and Methods for Forming the Same | 2019-05-16 |
20190148358 | SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY | 2019-05-16 |
20190148359 | SEMICONDUCTOR DEVICES WITH PACKAGE-LEVEL CONFIGURABILITY | 2019-05-16 |
20190148360 | METHOD AND APPARATUS OF FORMING HIGH VOLTAGE VARACTOR AND VERTICAL TRANSISTOR ON A SUBSTRATE | 2019-05-16 |
20190148361 | NOVEL THIN FILM RESISTOR | 2019-05-16 |
20190148362 | METHOD AND APPARATUS OF FORMING HIGH VOLTAGE VARACTOR AND VERTICAL TRANSISTOR ON A SUBSTRATE | 2019-05-16 |
20190148363 | SEMICONDUCTOR DEVICE WITH SCHOTTKY DIODE AND MANUFACTURING METHOD THEREOF | 2019-05-16 |
20190148364 | SEMICONDUCTOR DEVICE | 2019-05-16 |
20190148365 | SEMICONDUCTOR DEVICE | 2019-05-16 |
20190148366 | SEMICONDUCTOR DEVICE INCLUDING VERTICAL ROUTING STRUCTURE AND METHOD FOR MANUFACURING THE SAME | 2019-05-16 |
20190148367 | 3D CIRCUIT WITH N AND P JUNCTIONLESS TRANSISTORS | 2019-05-16 |
20190148368 | ISOLATION STRUCTURE FOR SEMICONDUCTOR DEVICE HAVING SELF-BIASING BURIED LAYER AND METHOD THEREFOR | 2019-05-16 |
20190148369 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2019-05-16 |
20190148370 | DEVICE INCLUDING MIM CAPACITOR AND RESISTOR | 2019-05-16 |
20190148371 | Heterojunction Field Effect Transistor Device with Serially Connected Enhancement Mode and Depletion Mode Gate Regions | 2019-05-16 |
20190148372 | Vertical Transistors with Different Gate Lengths | 2019-05-16 |
20190148373 | INTEGRATED CIRCUIT STRUCTURE INCLUDING SINGLE DIFFUSION BREAK ABUTTING END ISOLATION REGION, AND METHODS OF FORMING SAME | 2019-05-16 |
20190148374 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING SAME | 2019-05-16 |
20190148375 | METAL GATE MODULATION TO IMPROVE KINK EFFECT | 2019-05-16 |
20190148376 | INTEGRATED CIRCUIT STRUCTURE INCORPORATING STACKED FIELD EFFECT TRANSISTORS AND METHOD | 2019-05-16 |
20190148377 | CONTACT FORMATION THROUGH LOW-TEMPEARATURE EPITAXIAL DEPOSITION IN SEMICONDUCTOR DEVICES | 2019-05-16 |
20190148378 | HIGH-MOBILITY SEMICONDUCTOR SOURCE/DRAIN SPACER | 2019-05-16 |
20190148379 | SEMICONDUCTOR DEVICE HAVING CONTACT PLUGS | 2019-05-16 |
20190148380 | SEMICONDUCTOR DEVICE COMPRISING A STANDARD CELL | 2019-05-16 |
20190148381 | Memory Device Having Electrically Floating Body Transistor | 2019-05-16 |
20190148382 | MEMORY DEVICES AND METHOD OF MANUFACTURING THE SAME | 2019-05-16 |
20190148383 | Methods of Fabricating Semiconductor Devices | 2019-05-16 |
20190148384 | SEMICONDUCTOR DEVICES | 2019-05-16 |
20190148385 | INTEGRATED CIRCUIT FOR LOW POWER SRAM | 2019-05-16 |
20190148386 | SRAM CELL WITH T-SHAPED CONTACT | 2019-05-16 |
20190148387 | PILLAR-SHAPED SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME | 2019-05-16 |
20190148388 | NAND FLASH MEMORY DEVICE HAVING FACING BAR AND METHOD OF FABRICATING THE SAME | 2019-05-16 |
20190148389 | SEMICONDUCTOR STRUCUTRE AND METHOD OF FABRICATING THE SAME | 2019-05-16 |
20190148390 | HAFNIUM OXIDE AND ZIRCONIUM OXIDE BASED FERROELECTRIC DEVICES WITH TEXTURED IRIDIUM BOTTOM ELECTRODES | 2019-05-16 |
20190148391 | Embedded Flash Memory Device with Floating Gate Embedded in a Substrate | 2019-05-16 |
20190148392 | THREE-DIMENSIONAL MEMORY DEVICE WITH THICKENED WORD LINES IN TERRACE REGION AND METHOD OF MAKING THEREOF | 2019-05-16 |
20190148393 | 3D ARRAY ARRANGED FOR MEMORY AND IN-MEMORY SUM-OF-PRODUCTS OPERATIONS | 2019-05-16 |
20190148394 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-05-16 |
20190148395 | COST-EFFECTIVE METHOD TO FORM A RELIABLE MEMORY DEVICE WITH SELECTIVE SILICIDATION AND RESULTING DEVICE | 2019-05-16 |