20th week of 2018 patent applcation highlights part 58 |
Patent application number | Title | Published |
20180138124 | INTERCONNECT STRUCTURE WITH AIR-GAPS | 2018-05-17 |
20180138125 | CONDUCTIVE STRUCTURE, LAYOUT STRUCTURE INCLUDING CONDUCTIVE STRUCTURE, AND METHOD FOR MANUFACTURING CONDUCTIVE STRUCTURE | 2018-05-17 |
20180138126 | PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF | 2018-05-17 |
20180138127 | ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2018-05-17 |
20180138128 | FORMATION OF COPPER LAYER STRUCTURE WITH SELF ANNEAL STRAIN IMPROVEMENT | 2018-05-17 |
20180138129 | MULTI-HEIGHT SEMICONDUCTOR STRUCTURES | 2018-05-17 |
20180138130 | CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | 2018-05-17 |
20180138131 | COMPOSITE MAGNETIC SEALING MATERIAL AND ELECTRONIC CIRCUIT PACKAGE USING THE SAME | 2018-05-17 |
20180138132 | SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138133 | PACKAGED INTEGRATED CIRCUIT DEVICE WITH CANTILEVER STRUCTURE | 2018-05-17 |
20180138134 | SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138135 | SEMICONDUCTOR ELEMENT AND PRODUCTION METHOD THEREOF | 2018-05-17 |
20180138136 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-05-17 |
20180138137 | SEMICONDUCTOR CHIP | 2018-05-17 |
20180138138 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | 2018-05-17 |
20180138139 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138140 | METHOD OF FABRICATING SUBSTRATE STRUCTURE | 2018-05-17 |
20180138141 | PROTECTIVE FILM FOR SEMICONDUCTORS, SEMICONDUCTOR DEVICE, AND COMPOSITE SHEET | 2018-05-17 |
20180138142 | Film for Semiconductor Device and Fabrication Method Thereof | 2018-05-17 |
20180138143 | WIRE BONDING METHODS AND SYSTEMS INCORPORATING METAL NANOPARTICLES | 2018-05-17 |
20180138144 | SEMICONDUCTOR PACKAGES AND RELATED METHODS | 2018-05-17 |
20180138145 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138146 | MICROELECTRONIC DEVICE PACKAGE HAVING ALTERNATELY STACKED DIE | 2018-05-17 |
20180138147 | Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices | 2018-05-17 |
20180138148 | COMPARTMENT SHIELDING FOR WARPAGE IMPROVEMENT | 2018-05-17 |
20180138149 | PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138150 | SEMICONDUCTOR PACKAGE HAVING A REDISTRIBUTION LINE STRUCTURE | 2018-05-17 |
20180138151 | PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME | 2018-05-17 |
20180138152 | VERTICALLY STACKED MULTICHIP MODULES | 2018-05-17 |
20180138153 | IMAGE PROCESSING DEVICE AND CONTROL METHOD THEREFOR | 2018-05-17 |
20180138154 | SEMICONDUCTOR MODULE | 2018-05-17 |
20180138155 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138156 | CLIPS DEFINING ELECTRICAL PATHWAY ON A FLEXIBLE SHEET | 2018-05-17 |
20180138157 | LIGHT EMITTING DEVICE AND FABRICATING METHOD THEREOF | 2018-05-17 |
20180138158 | FABRICATION METHOD OF PACKAGE ON PACKAGE STRUCTURE | 2018-05-17 |
20180138159 | SOLID STATE DEVICE MINIATURIZATION | 2018-05-17 |
20180138160 | LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138161 | Device with Light Emitting Diodes | 2018-05-17 |
20180138162 | DISPLAY APPARATUS AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138163 | FINGERPRINT RECOGNITION MODULE HAVING LIGHT-EMITTING FUNCTION AND MANUFACTURING METHOD THEREFOR | 2018-05-17 |
20180138164 | METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE FABRICATED BY USING THE METHOD | 2018-05-17 |
20180138165 | SEMICONDUCTOR DEVICE FOR PREVENTING FIELD INVERSION | 2018-05-17 |
20180138166 | Semiconductor Device for Electrostatic Discharge Protection | 2018-05-17 |
20180138167 | ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE AND METHOD FABRICATING THE ESD PROTECTION DEVICE | 2018-05-17 |
20180138168 | SEMICONDUCTOR FIELD EFFECT TRANSISTORS AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138169 | Semiconductor Devices and Methods for Operating Semiconductor Devices | 2018-05-17 |
20180138170 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138171 | Semiconductor Structures and Methods of Forming the Same | 2018-05-17 |
20180138172 | SEMICONDUCTOR COMPONENT AND FABRICATING METHOD THEREOF | 2018-05-17 |
20180138173 | Semiconductor Device and Method of Manufacture | 2018-05-17 |
20180138174 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2018-05-17 |
20180138175 | FORMING GATES WITH VARYING LENGTH USING SIDEWALL IMAGE TRANSFER | 2018-05-17 |
20180138176 | SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME | 2018-05-17 |
20180138177 | FORMATION OF BAND-EDGE CONTACTS | 2018-05-17 |
20180138178 | SEMICONDUCTOR DEVICE INCLUDING BARRIER LAYER AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138179 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-05-17 |
20180138180 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2018-05-17 |
20180138181 | MEMORY CELL | 2018-05-17 |
20180138182 | CONDUCTIVE STRUCTURES, WORDLINES AND TRANSISTORS | 2018-05-17 |
20180138183 | DYNAMIC RANDOM ACCESS MEMORY AND FABRICATION METHOD THEREOF | 2018-05-17 |
20180138184 | DYNAMIC RANDOM ACCESS MEMORY AND FABRICATION METHOD THEREOF | 2018-05-17 |
20180138185 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138186 | SRAM Circuits with Aligned Gate Electrodes | 2018-05-17 |
20180138187 | METHODS OF FORMING SEMICONDUCTOR DEVICES USING SEMI-BIDIRECTIONAL PATTERNING | 2018-05-17 |
20180138188 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-05-17 |
20180138189 | THREE-DIMENSIONAL MEMORY DEVICE WITH SELF-ALIGNED DRAIN SIDE SELECT GATE ELECTRODES AND METHOD OF MAKING THEREOF | 2018-05-17 |
20180138190 | SEMICONDUCTOR MEMORY DEVICE | 2018-05-17 |
20180138191 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE RELATING TO RESISTANCE CHARACTERISTICS | 2018-05-17 |
20180138192 | SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138193 | THREE-DIMENSIONAL MEMORY DEVICE HAVING A MULTILEVEL DRAIN SELECT GATE ELECTRODE AND METHOD OF MAKING THEREOF | 2018-05-17 |
20180138194 | THREE-DIMENSIONAL MEMORY DEVICE HAVING SELECT GATE ELECTRODE THAT IS THICKER THAN WORD LINES AND METHOD OF MAKING THEREOF | 2018-05-17 |
20180138195 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-05-17 |
20180138196 | APPARATUSES AND METHODS FOR FORMING MULTIPLE DECKS OF MEMORY CELLS | 2018-05-17 |
20180138197 | SEMICONDUCTOR DEVICE HAVING A MEMORY CELL ARRAY PROVIDED INSIDE A STACKED BODY | 2018-05-17 |
20180138198 | Trench structured vertical mosfet | 2018-05-17 |
20180138199 | SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138201 | LIGHT-EMITTING DEVICE AND INPUT/OUTPUT DEVICE | 2018-05-17 |
20180138202 | SEMICONDUCTOR STRUCTURES AND METHOD FOR FABRICATING THE SAME | 2018-05-17 |
20180138203 | SELF-ALIGNED BACK-PLANE AND WELL CONTACTS FOR FULLY DEPLETED SILICON ON INSULATOR DEVICE | 2018-05-17 |
20180138204 | SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138205 | ACTIVE-MATRIX SUBSTRATE | 2018-05-17 |
20180138206 | THIN FILM TRANSISTOR, THIN FILM TRANSISTOR SUBSTRATE, LIQUID CRYSTAL DISPLAY DEVICE, AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR | 2018-05-17 |
20180138207 | DISPLAY DEVICE | 2018-05-17 |
20180138209 | SEMICONDUCTOR SUBSTRATE WITH METALLIC DOPED BURIED OXIDE | 2018-05-17 |
20180138210 | THIN FILM TRANSISTOR, ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | 2018-05-17 |
20180138211 | METHOD FOR MANUFACTURING OXIDE SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138212 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-05-17 |
20180138213 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | 2018-05-17 |
20180138214 | DISPLAY DEVICE | 2018-05-17 |
20180138215 | DISPLAY DEVICE AND METHOD FOR DRIVING THE SAME | 2018-05-17 |
20180138216 | SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | 2018-05-17 |
20180138217 | SOLID-STATE IMAGING DEVICE | 2018-05-17 |
20180138218 | IMAGE SENSOR AND FABRICATION METHOD THEREOF | 2018-05-17 |
20180138219 | REDUCTION OF TFT INSTABILITY IN DIGITAL X-RAY DETECTORS | 2018-05-17 |
20180138220 | INFRARED IMAGE SENSOR COMPONENT AND MANUFACTURING METHOD THEREOF | 2018-05-17 |
20180138221 | WAFER LEVEL PACKAGING STRUCTURE OF HIGH-PIXEL IMAGE SENSOR CHIP | 2018-05-17 |
20180138222 | OPTICAL MODULES INCLUDING CUSTOMIZABLE SPACERS FOR FOCAL LENGTH ADJUSTMENT AND/OR REDUCTION OF TILT, AND FABRICATION OF THE OPTICAL MODULES | 2018-05-17 |
20180138223 | SEMICONDUCTOR DEVICE AND IMAGING DEVICE | 2018-05-17 |
20180138224 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD, SOLID STATE IMAGE SENSOR, AND ELECTRONIC EQUIPMENT | 2018-05-17 |
20180138225 | IMAGE SENSOR PACKAGE | 2018-05-17 |