21st week of 2014 patent applcation highlights part 16 |
Patent application number | Title | Published |
20140138806 | POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS - A power overlay (POL) packaging structure that incorporates a leadframe connection is disclosed. The a POL structure includes a POL sub-module having a dielectric layer, at least one semiconductor device attached to the dielectric layer and that includes a substrate composed of a semiconductor material and a plurality of connection pads formed on the substrate, and a metal interconnect structure electrically coupled to the plurality of connection pads of the at least one semiconductor device, with the metal interconnect structure extending through vias formed through the dielectric layer so as to be connected to the plurality of connection pads. The POL structure also includes a leadframe electrically coupled to the POL sub-module, with the leadframe comprising leads configured to make an interconnection to an external circuit structure. | 2014-05-22 |
20140138807 | POWER OVERLAY STRUCTURE WITH LEADFRAME CONNECTIONS - A power overlay (POL) packaging structure that incorporates a leadframe connection is disclosed. The a POL structure includes a POL sub-module having a dielectric layer, at least one semiconductor device attached to the dielectric layer and that includes a substrate composed of a semiconductor material and a plurality of connection pads formed on the substrate, and a metal interconnect structure electrically coupled to the plurality of connection pads of the at least one semiconductor device, with the metal interconnect structure extending through vias formed through the dielectric layer so as to be connected to the plurality of connection pads. The POL structure also includes a leadframe electrically coupled to the POL sub-module, with the leadframe comprising leads configured to make an interconnection to an external circuit structure. | 2014-05-22 |
20140138808 | LEADFRAME AREA ARRAY PACKAGING TECHNOLOGY - Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material substrate, an interconnect layer positioned on top of the polymer material substrate, a die coupled to the interconnect layer via wire bonds or conductive pillars, and a molding compound encapsulating the die, the interconnect layer and the wire bonds or conductive pillars. The polymer material is typically formed on a carrier before assembly and is not removed to act as the substrate of the manufactured package. The polymer material substrate has a plurality of through holes that exposes the interconnect layer at predetermined locations and enables solder ball mounting or solder printing directly to the interconnect layer. In some embodiments, the semiconductor package includes a relief channel in the polymer material substrate to improve the reliability performance of the manufactured package. | 2014-05-22 |
20140138809 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A package structure and a manufacturing method thereof are disclosed. The package structure includes an outer lead, a driver chip, a soft material, and a solidified material. There is a distance between the driver chip and the outer lead. The soft material is used to fill the space in the package structure except the driver chip and the outer lead. The solidified material is formed in at least one region on the soft material between the driver chip and the outer lead. The hardness of the solidified material is higher than the hardness of the soft material. | 2014-05-22 |
20140138810 | SEMICONDUCTOR DEVICE - A semiconductor device of the present invention includes a resin package, a semiconductor chip sealed in the resin package, and having first and second pads on a front surface, a lead integrated island sealed in the resin package, to one surface of which a back surface of the semiconductor chip is bonded, and the other surface of an opposite side to the one surface of which is partially exposed from a bottom surface of the resin package as a first pad connecting terminal for electrical connection between the first pad and outside and a back connecting terminal for electrical connection between the back surface of the semiconductor chip and outside separately from each other, and a lead formed separately from the lead integrated island, sealed in the resin package, one surface of which is connected with the second pad by a wire, and the other surface of an opposite side to the one surface of which is exposed from a bottom surface of the resin package as a second pad connecting terminal for electrical connection between the second pad and outside, and the semiconductor chip is, on the one surface of the lead integrated island, disposed at a position one-sided to the first pad connecting terminal side, and the first pad and the one surface of the lead integrated island are connected by a wire. | 2014-05-22 |
20140138811 | A SEMICONDUCTOR DEVICE INCLUDING A HEAT-SPREADING LID - One aspect provides a semiconductor device. The semiconductor device, in this embodiment, includes a semiconductor substrate having a lower surface and an upper surface, as well as a heat-spreading lid configured to attach to the upper surface of the semiconductor substrate. In this embodiment, at least one of the semiconductor substrate or the heat-spreading lid has a plurality of openings extending entirely there through. The semiconductor device, in accordance with this aspect, further includes a plurality of fasteners operable to extend through the plurality of openings and engage the other of the semiconductor substrate or the heat-spreading lid to attach the semiconductor substrate and the heat-spreading lid. | 2014-05-22 |
20140138812 | PHOTOELECTRIC MODULE - A photoelectric module includes a lower substrate, an upper substrate, a photoelectric module, and a hermetical structure. The lower substrate includes a reflecting surface and defines a receiving hole facing the reflecting surface. The photoelectric module is mounted on the upper substrate and faces the reflecting surface. The hermetical structure includes a first hermetical part and a second hermetical part, the first hermetical part is positioned on the lower substrate, and the second hermetical part is positioned on the upper substrate. The photoelectric module is surrounded by the hermetical structure. | 2014-05-22 |
20140138813 | Method for Manufacturing an Electronic Component - A semiconductor wafer includes a first main face and a second main face opposite to the first main face and a number of semiconductor chip regions. The wafer is diced along dicing streets to separate the semiconductor chip regions from each other. At least one metal layer is formed on the first main face of each one of the semiconductor chip regions. | 2014-05-22 |
20140138814 | Method for Producing an Integrated Circuit Pointed Element, and Corresponding Integrated Circuit - A method for producing an integrated circuit pointed element is disclosed. An element has a projection with a concave part directing its concavity towards the element. The element includes a first etchable material. A zone is formed around the concave part of the element. The zone includes a second material that is less rapidly etchable than the first material for a particular etchant. The first material and the second material are etched with the particular etchant to form an open crater in the concave part and thus to form a pointed region of the element. | 2014-05-22 |
20140138815 | SERVER PROCESSING MODULE - One embodiment of the present invention sets forth a processing module including an interposer and a plurality of processing nodes. The interposer includes a plurality of through substrate vias. Each processing node includes a processing unit die coupled directly to a top surface of the interposer with a first plurality of solder bump structures, a memory die coupled directly to the top surface of the interposer with a second plurality of solder bump structures, and a plurality of circuit elements electrically coupling the processing unit die and the memory die. The processing module further includes a plurality of electrical connections formed on a bottom surface of the interposer and electrically coupled to the plurality of processing nodes through the plurality of through substrate vias. The processing module further comprises a plurality of interconnecting circuit elements electrically interconnecting the plurality of processing nodes. | 2014-05-22 |
20140138816 | Method for Forming Package-on-Package Structure - A method comprises attaching a semiconductor die on a first side of a wafer, attaching a first top package on the first side of the wafer and attaching a second top package on the first side of the wafer. The method further comprises depositing an encapsulation layer over the first side of the wafer, wherein the first top package and the second top package are embedded in the encapsulation layer, applying a thinning process to a second side of the wafer, sawing the wafer into a plurality of chip packages and attaching the chip package to a substrate. | 2014-05-22 |
20140138817 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device including a relatively thin interposer excluding a through silicon hole and a manufacturing method thereof are provided. The method includes forming an interposer on a dummy substrate. The forming of the interposer includes, forming a dielectric layer on the dummy substrate, forming a pattern and a via on the dielectric layer, and forming a seed layer at the pattern and the via of the dielectric layer and forming a redistribution layer and a conductive via on the seed layer. A semiconductor die is connected with the conductive via facing an upper portion of the interposer, and the semiconductor die is encapsulated with an encapsulant. The dummy substrate is removed from the interposer. A bump is connected with the conductive via facing a lower portion of the interposer. | 2014-05-22 |
20140138818 | ORGANIC THIN FILM PASSIVATION OF METAL INTERCONNECTIONS - Electronic assemblies and their manufacture are described. One embodiment relates to a method including depositing an organic thin film layer on metal bumps on a semiconductor wafer, the organic thin film layer also being formed on a surface adjacent to the metal bumps on the wafer. The wafer is diced into a plurality of semiconductor die structures, the die structures including the organic thin film layer. The semiconductor die structures are attached to substrates, wherein the attaching includes forming a solder bond between the metal bumps on a die structure and bonding pads on a substrate, and wherein the solder bond extends through the organic thin film layer. The organic thin film layer is then exposed to a plasma. Other embodiments are described and claimed. | 2014-05-22 |
20140138819 | SEMICONDUCTOR DEVICE INCLUDING TSV AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME - Provided are a semiconductor device, a method of manufacturing the same, and a semiconductor package including the same. The semiconductor device includes: a substrate having a recess region in a predetermined portion of a back side of the substrate; a wiring part disposed on a front side of the substrate and including at least one wiring layer; an insulating layer disposed on the back side of the substrate and including a first portion filling in the recess region and a second portion covering the back side of the substrate of a non-recess region other than the recess region; and a through silicon via (TSV) provided in plurality of and penetrating the first portion to be electrically connected to the at least one wiring layer. | 2014-05-22 |
20140138820 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME - A semiconductor device, having an electrode pad as a part of wirings on the uppermost layer thereof, includes a passivation film and a bump electrode for external connection. The passivation film is formed on the electrode pad, and the bump electrode is formed on the passivation film and electrically connected to the electrode pad. The electrode pad is formed so as to be smaller in size than the bump electrode, and parts of the wiring on the uppermost layer are formed under the bump electrode. In this manner, it is possible to utilize the area under the bump electrode effectively without sacrificing flatness of the passivation film. As a result, the semiconductor device and the semiconductor package can be made smaller. | 2014-05-22 |
20140138821 | SUBSTRATE FOR FLIP CHIP BONDING AND METHOD OF FABRICATING THE SAME - Disclosed herein is substrate for flip chip bonding, in which a base solder layer is formed between a pad and a metal post, thereby increasing impact resistance and mounting reliability. A method of fabricating the substrate for flip chip bonding is also provided. | 2014-05-22 |
20140138822 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE - An integrated circuit (IC) package, device, including a substrate having a top surface with an IC die mounting area and a peripheral area surrounding the mounting area, a plurality of parallel conductor layers, a plurality of insulating layers and a plurality of plated through holes (PTHs) extending through the conductor layers and insulating layers. Various substrate structures in which certain of the PTHs and/or conductor layers and/or insulating layers have different CTE's than the others is disclosed. The various structures may reduce circuit failures due to substrate warpage and/or solder joint damage associated with a CTE mismatch between the substrate and the IC die. | 2014-05-22 |
20140138823 | VARIABLE-SIZE SOLDER BUMP STRUCTURES FOR INTEGRATED CIRCUIT PACKAGING - One embodiment of the present invention sets forth an integrated circuit package including a substrate, an integrated circuit die, a first plurality of solder bump structures, and a first plurality of variable-size solder bump structures. The first plurality of solder bump structures electrically couple the integrated circuit die to the substrate. The first plurality of variable-size solder bump structures are disposed on a bottom surface of the substrate. The first plurality of variable-size solder bump structures are sized to be substantially coplanar with a seating plane of the integrated circuit package. | 2014-05-22 |
20140138824 | OFFSET INTEGRATED CIRCUIT PACKAGING INTERCONNECTS - One embodiment of the present invention sets forth an integrated circuit package including a substrate, an integrated circuit die, and a plurality of solder bump structures. The substrate includes a first plurality of interconnects disposed on a first surface of the substrate. The integrated circuit die includes a second plurality of interconnects disposed on a first surface of the integrated circuit die. The plurality of solder bump structures couple the first plurality of interconnects to the second plurality of interconnects. The first plurality of interconnects are configured to be substantially aligned with the second plurality of interconnects when the integrated circuit package is at a first temperature within a range of about 0° C. to about −100° C. The first plurality of interconnects are configured to be offset from the second plurality of interconnects when the integrated circuit package is at a temperature above the first temperature. | 2014-05-22 |
20140138825 | MOLDED INSULATOR IN PACKAGE ASSEMBLY - Embodiments of the present disclosure describe techniques and configurations for package assembly including an embedded element and a molded insulator material. In some embodiments, an apparatus includes an electrical element (such as a die or a bridge interconnect structure) positioned on a surface of an insulator layer, a conductive pad positioned on the surface of the insulator layer and spaced apart from the electrical element, and a molded insulator material disposed on the surface of the insulator layer adjacent to the electrical element and on the conductive pad. Other embodiments may be described and/or claimed. | 2014-05-22 |
20140138826 | High-Density Package-on-Package Structure - A bare-die first package includes a patterned insulating layer that exposes first package balls in vias. The vias enable a second package to be positioned on the first package in a proper ball-to-ball alignment without the need for flattening or coining. | 2014-05-22 |
20140138827 | ENHANCED FLIP CHIP PACKAGE - According to various embodiments, a flip chip package structure is provided in which a redistribution layer (RDL) is disposed on a surface of both a semiconductor chip and one or more lateral extensions of the semiconductor chip surface. The lateral extensions may be made using, e.g., a reconstituted wafer to implement a fanout region lateral to one or more sides of the semiconductor chip. One or more electrical connectors such as solder bumps or copper cylinders may be applied to the RDL, and an interposer such as a PCB interposer may be connected to the electrical connectors. In this way, a relatively tight semiconductor pad pitch may be accommodated and translated to an appropriate circuit board pitch without necessarily requiring a silicon or glass interposer. | 2014-05-22 |
20140138828 | SEMICONDUCTOR DEVICE BONDED BY ANISOTROPIC CONDUCTIVE FILM - A semiconductor device including a first connecting member including a first electrode; a second connecting member including a second electrode; and an anisotropic conductive film between the first connecting member and the second connecting member, the anisotropic conductive film bonding the first electrode to the second electrode, wherein the anisotropic conductive film exhibits linear indentations in an inter-terminal space of the second connecting member after pre-compression and primary compression of the anisotropic conductive film onto the first and second connecting members. | 2014-05-22 |
20140138829 | INTERCONNECTION STRUCTURE AND METHOD FOR FABRICATING THE SAME - The present invention relates to an interconnection structure and a method for fabricating the same. According to the present invention, cavities are formed between the interconnection dielectric by using a sacrificial layer, carbon nanotubes are used as the interconnection material for local interconnection between via holes, graphene nanoribbons are used as the interconnection material for metal lines, and cavities are included in the interconnection dielectric. In addition, the conventional CMOS BEOL Cu interconnection technique is applied to the intermediate interconnection level and the global interconnection level. In this way, the high parasitic resistance and parasitic capacitance in the Cu interconnection technique, which may occur when the local interconnection is relatively small in size, can be effectively overcome. | 2014-05-22 |
20140138830 | METAL INTERCONNECTION STRUCTURE - A metal interconnection structure includes a substrate and a protective laver. The substrate includes at least a first conductive layer. The protective layer is a single-layered structure disposed on the substrate, and a quantity of oxygen (O) in an upper part of the protective layer is more than a quantity of oxygen (O) in a lower part of the protective layer. A material of the upper part of the protective layer includes silicon oxycarbide (SiCO) or silicon oxycarbonitride (SiCNO), and a material of the lower part of the protective layer includes silicon carbide (SiC) or silicon carbonitride (SiCN). | 2014-05-22 |
20140138831 | SURFACE FINISH ON TRACE FOR A THERMAL COMPRESSION FLIP CHIP (TCFC) - Some implementations provide a semiconductor device that includes a substrate coupled to a die through a thermal compression bonding process. The semiconductor device also includes a trace coupled to the substrate. The trace includes a first conductive material having a first oxidation property. The trace also includes a first surface layer including a second conductive material having a second oxidation property. The second oxidation property is less susceptible to oxidation than the first oxidation property. The first and second conductive materials are configured to provide an electrical path between the die and the substrate. The first surface layer has a thickness that is | 2014-05-22 |
20140138832 | COPPER SEED LAYER FOR AN INTERCONNECT STRUCTURE HAVING A DOPING CONCENTRATION LEVEL GRADIENT - A trench is opened in a dielectric layer. The trench is then lined with a barrier layer and a metal seed layer. The metal seed layer is non-uniformly doped and exhibits a vertical doping gradient varying as a function of trench depth. The lined trench is then filled with a metal fill material. A dielectric cap layer is then deposited over the metal filled trench. Dopant from the non-uniformly doped metal seed layer is then migrated to an interface between the metal filled trench and the dielectric cap layer to form a self-aligned metal cap. | 2014-05-22 |
20140138833 | Semiconductor Device Assembly Including a Chip Carrier, Semiconductor Wafer and Method of Manufacturing a Semiconductor Device - A semiconductor device includes a chip carrier and a semiconductor die with a semiconductor portion and a conductive structure. A soldered layer mechanically and electrically connects the chip carrier and the conductive structure at a soldering side of the semiconductor die. At the soldering side an outermost surface portion along an edge of the semiconductor die has a greater distance to the chip carrier than a central surface portion. The conductive structure covers the central surface portion and at least a section of an intermediate surface portion tilted to the central surface portion. Solder material is effectively prevented from coating such semiconductor surfaces that are prone to damages and solder-induced contamination is significantly reduced. | 2014-05-22 |
20140138834 | PREVENTING SHORTING DENDRITIC MIGRATION BETWEEN ELECTRODES - In a general aspect, an integrated circuit package includes a first electrode and a second electrode on a support substrate. The first electrode and the second electrode are configured to be electrically coupled to a voltage differential. A dendritic migration of a migratory species can develop under the voltage differential and a non-hermetic environment. The dendritic migration is interrupted by a floating electrical barrier mounted onto the support substrate between the first electrode and the second electrode. The electrical barrier includes a dam for preventing the metal migration. The dam has a height approximately equal to or greater than the largest dimension of a single atom of the migratory species. The first electrode and the second electrode can be mounted on the same side of the support substrate, or on two opposite sides of the support substrate. | 2014-05-22 |
20140138835 | COPPER INTERCONNECT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A method is disclosed for manufacturing a semiconductor device with a copper interconnect structure. The method includes providing a substrate, forming a first interconnect dielectric layer on the substrate, and forming a second interconnect dielectric layer on a surface of the first interconnect dielectric layer. The method also includes forming a plurality of conduits extending through the first interconnect dielectric layer and the second interconnect dielectric layer, and depositing copper in the plurality of conduits to form a copper interconnect layer of the copper interconnect structure. Further, the first interconnect dielectric layer, between neighboring conduits, contains cavities such that dielectric constant of the first interconnect dielectric layer is reduced. The second interconnect dielectric layer seals the top of the cavities, the substrate is the bottom of the cavities, and a width of the top of the cavities is less than a width of the bottom of the cavities. | 2014-05-22 |
20140138836 | SEMICONDUCTOR DEVICE - In a semiconductor device, a conductor pattern is disposed in a position overlapped by a semiconductor chip in a thickness direction over the mounting surface (lower surface) of a wiring board. A solder resist film (insulating layer) covering the lower surface of the wiring board has apertures formed such that multiple portions of the conductor pattern are exposed. The conductor pattern has conductor apertures. The outlines of the apertures and the conductor apertures overlap with each other, in a plan view, respectively. | 2014-05-22 |
20140138837 | SANDWICHED DIFFUSION BARRIER AND METAL LINER FOR AN INTERCONNECT STRUCTURE - A trench is opened in a dielectric layer. The trench is then lined with a sandwiched diffusion barrier and metal liner structure and a metal seed layer. The sandwiched diffusion barrier and metal liner structure includes a conformal metal liner layer sandwiched between a first diffusion barrier layer and a second diffusion barrier layer. The metal seed layer is at least lightly doped. The lined trench is then filled by electroplating with a metal fill material. A dielectric cap layer is then deposited over the metal filled trench. Dopant from the doped metal seed layer is then migrated to an interface between the metal filled trench and the dielectric cap layer to form a self-aligned metal cap. | 2014-05-22 |
20140138838 | Method of Semiconducotr integrated Circuit Fabrication - A method of fabricating a semiconductor integrated circuit (IC) is disclosed. The method includes providing a substrate. A first dielectric layer is deposited on the substrate. A patterned photoresist layer is formed on the first dielectric layer. The patterned photoresist layer is trimmed. The first dielectric layer is etched through the trimmed patterned photoresist layer to form a dielectric feature. A sacrificing energy decomposable layer (SEDL) is deposited on the dielectric feature and etched to form a SEDL spacer on sides of the dielectric feature. A second dielectric layer is deposited on the SEDL spacer and etched to form a dielectric spacer. The SEDL spacer is decomposed to form a trench. | 2014-05-22 |
20140138839 | POWER SEMICONDUCTOR MODULE - Disclosed herein is a power semiconductor module including a substrate having a first metal conductive track formed on one surface thereof, and a base plate made of a metal and solder-joined to the substrate in the first metal conductive track region, wherein a first uneven pattern is formed in the solder junction region formed between the substrate and the base plate. | 2014-05-22 |
20140138840 | STAIR STEP FORMATION USING AT LEAST TWO MASKS - Apparatuses and methods for stair step formation using at least two masks, such as in a memory device, are provided. One example method can include forming a first mask over a conductive material to define a first exposed area, and forming a second mask over a portion of the first exposed area to define a second exposed area, the second exposed area is less than the first exposed area. Conductive material is removed from the second exposed area. An initial first dimension of the second mask is less than a first dimension of the first exposed area and an initial second dimension of the second mask is at least a second dimension of the first exposed area plus a distance equal to a difference between the initial first dimension of the second mask and a final first dimension of the second mask after a stair step structure is formed. | 2014-05-22 |
20140138841 | INTEGRATED CIRCUIT, A SEMICONDUCTOR DIE ARRANGEMENT AND A METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT - An integrated circuit is provided, the integrated circuit including: a chip having a first chip side and a second chip side opposite to the first chip side, the chip having at least one contact area on the second chip side; encapsulation material at least partially covering the chip; and at least one contact via comprising electrical conductive material contacting the at least one contact area and extending through the encapsulation material and through the chip between the first chip side and the second chip side. | 2014-05-22 |
20140138842 | CONTINUOUS VIA FOR POWER GRID - A power grid of a Very Large Scale Integration (VLSI) circuit includes a sandwich structure in a cell. The sandwich structure includes a first metal layer configured to carry current along a lateral axis, and a second metal layer, parallel to the first metal layer with a gap therebetween. The second metal layer carries current along a second lateral axis which is parallel to the lateral axis of the first metal layer. The sandwich structure also includes interconnect material disposed as a continuous via throughout the gap, the continuous via interconnecting the first metal layer and the second metal layer throughout the gap. | 2014-05-22 |
20140138843 | Method for Fabricating an Electronic Component - A carrier and a semiconductor chip are provided. A connection layer is applied to a first main face of the semiconductor chip. The connection layer includes a plurality of depressions. A filler is applied to the connection layer or to the carrier. The semiconductor chip is attached to the carrier so that the connection layer is disposed between the semiconductor chip and the carrier. The semiconductor chip is affixed to the carrier. | 2014-05-22 |
20140138844 | PATTERNED BACKSIDE METAL GROUND PLANE FOR IMPROVED METAL ADHESION - A patterned backside metal ground plane for improved metal adhesion and methods of manufacture are disclosed herein. The method includes forming at least one die on a substrate. The at least one die is formed adjacent to a dicing channel and includes through silicon vias (TSVs). The method further includes forming a metalized ground plane on a backside of the substrate in contact with the TSVs and which is located in such areas on the backside of the substrate that it does not interfere with dicing operations performed within the dicing channel. | 2014-05-22 |
20140138845 | LOGIC DIE AND OTHER COMPONENTS EMBEDDED IN BUILD-UP LAYERS - Embodiments of the present disclosure are directed towards package assemblies, as well as methods for forming package assemblies and systems incorporating package assemblies. A package assembly may include a substrate comprising a plurality of build-up layers, such as BBUL. In various embodiments, electrical routing features may be disposed on an outer surface of the substrate. In various embodiments, a primary logic die and a second die or capacitor may be embedded in the plurality of build-up layers. In various embodiments, an electrical path may be defined in the plurality of build-up layers to route electrical power or a ground signal between the second die or capacitor and the electrical routing features, bypassing the primary logic die. | 2014-05-22 |
20140138846 | CONDUCTIVE INK FOR FILLING VIAS - Vias (holes) are formed in a wafer or a dielectric layer. A low viscosity conductive ink, containing microscopic metal particles, is deposited over the top surface of the wafer to cover the vias. An external force is applied to urge the ink into the vias, including an electrical force, a magnetic force, a centrifugal force, a vacuum, or a suction force for outgassing the air in the vias. Any remaining ink on the surface is removed by a squeegee, spinning, an air knife, or removal of an underlying photoresist layer. The ink in the vias is heated to evaporate the liquid and sinter the remaining metal particles to form a conductive path in the vias. The resulting wafer may be bonded to one or more other wafers and singulated to form a 3-D module. | 2014-05-22 |
20140138847 | METHOD FOR ELECTRICALLY CONNECTING WAFERS USING BUTTING CONTACT STRUCTURE AND SEMICONDUCTOR DEVICE FABRICATED THROUGH THE SAME - The present invention relates to a method for electrically connecting wafers, which physically bonds two wafers through an oxide-to-oxide bonding method and then electrically connects the two wafers through a butting contact structure. The wafers are physically bonded to each other through a relatively simple method, and then electrically connected to through TSVs or butting contact holes. Therefore, since the fabrication process may be simplified, a process error may be reduced, and the product yield may be improved. | 2014-05-22 |
20140138848 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device with a through via penetrating a semiconductor substrate, in which shorting between a wiring and a semiconductor element is prevented to improve the reliability of the semiconductor device. A liner insulating film as a low-k film, which has a function to insulate the semiconductor substrate and a through-silicon via from each other and is thick enough to reduce capacitance between the semiconductor substrate and the through-silicon via, is used as an interlayer insulating film for a first wiring layer over a contact layer. This prevents a decrease in the thickness of an interlayer insulating film in the contact layer. | 2014-05-22 |
20140138849 | METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYMER SOLDER MASK LAMINATED TO AN INTERCONNECT LAYER STACK AND RELATED DEVICES - A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder. | 2014-05-22 |
20140138850 | SEMICONDUCTOR POWER MODULE, PRODUCTION METHOD OF SEMICONDUCTOR POWER MODULE AND CIRCUIT BOARD - A semiconductor power module ( | 2014-05-22 |
20140138851 | SEMICONDUCTOR MEMORY CHIPS AND STACK-TYPE SEMICONDUCTOR PACKAGES INCLUDING THE SAME - Provided are semiconductor memory chips and semiconductor packages with the same. The semiconductor package may include a memory chip including first data pads and first command/address pads arranged adjacent to a first side region thereof and second data pads and second command/address pads arranged adjacent to a second side region thereof arranged opposite to the first side region, and a package substrate including first CA connection pads and second CA connection pads. The memory chip may be mounted on a top surface of the package substrate, the first CA connection pads may be connected to the first command/address pads, and the second CA connection pads may be provide to be opposite to the first CA connection pads and be connected to the second command/address pads. | 2014-05-22 |
20140138852 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - A semiconductor device includes a rectangular lower semiconductor element; a plurality of external electrodes located in a pattern on the lower semiconductor element along sides thereof; a plurality of internal electrodes electrically connected to the plurality of external electrodes via a plurality of line patterns respectively and located on the lower semiconductor element in a pattern; dams provided in such a pattern that each of the dams encloses one or at least two external electrodes among the plurality of external electrodes; an upper semiconductor element mounted on the lower semiconductor element such that a plurality of terminals on the upper semiconductor element are electrically connected to the plurality of internal electrodes respectively; and a resin potted to flow to a space between the lower semiconductor element and the upper semiconductor element. | 2014-05-22 |
20140138853 | WAFER LEVEL PACKAGING BOND - A device is described in one embodiment that includes a micro-electro-mechanical systems (MEMS) device disposed on a first substrate and a semiconductor device disposed on a second substrate. A bond electrically connects the MEMS device and the semiconductor device. The bond includes an interface between a first bonding layer including silicon on the first substrate and a second bonding layer including aluminum on the second substrate. The physical interface between the aluminum and silicon (e.g., amorphous silicon) can provide an electrical connection. | 2014-05-22 |
20140138854 | THERMAL INTERFACE MATERIAL FOR INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS - Embodiments of the present disclosure are directed towards a thermal interface material for integrated circuit package assembly and associated techniques and configurations. In one embodiment, an apparatus includes a die and a layer of thermal interface material (TIM) thermally coupled with the die, the TIM including a polymer matrix and carbon filler having anisotropic thermal conductivity disposed in the polymer matrix, the polymer matrix being configured for deposition on the die in liquid form. Other embodiments may be described and/or claimed. | 2014-05-22 |
20140138855 | PROTECTION OF A WAFER-LEVEL CHIP SCALE PACKAGE (WLCSP) - Consistent with an example embodiment, there is a method for assembling a wafer level chip scale processed (WLCSP) wafer; The wafer has a topside surface and an back-side surface, and a plurality of device die having electrical contacts on the topside surface. The method comprises back-grinding, to a thickness, the back-side surface the wafer. A protective layer of a thickness is molded onto the backside of the wafer. The wafer is mounted onto a sawing foil; along saw lanes of the plurality of device die, the wafer is sawed, the sawing occurring with a blade of a first kerf and to a depth of the thickness of the back-ground wafer. Again, the wafer is sawed along the saw lanes of the plurality of device die, the sawing occurring with a blade of a second kerf, the second kerf narrower than the first kerf, and sawing to a depth of the thickness of the protective layer. The plurality of device die are separated into individual device die. Each individual device die has a protective layer on the back-side, the protective layer having a stand-off distance from a vertical edge of the individual device die. | 2014-05-22 |
20140138856 | FIBER-CONTAINING RESIN SUBSTRATE, DEVICE-MOUNTING SUBSTRATE AND DEVICE-FORMING WAFER, SEMICONDUCTOR APPARATUS, AND METHOD FOR PRODUCING SEMICONDUCTOR APPARATUS - A fiber-containing resin substrate for collectively encapsulating a semiconductor-device-mounting surface of a substrate on which semiconductor devices are mounted or a semiconductor-device-forming surface of a wafer on which a semiconductor device is formed, including a resin-impregnated fibrous base material which is obtained by impregnating a fibrous base material with a thermosetting resin and semi-curing or curing the thermosetting resin and has a linear expansion coefficient (ppm/° C.) in an X-Y direction of less than 3 ppm, and an uncured resin layer formed of an uncured thermosetting resin on one side of the resin-impregnated fibrous base material. | 2014-05-22 |
20140138857 | ENCAPSULANT EQUIPPED WITH SUPPORTING SUBSTRATE, ENCAPSULATED SUBSTRATE HAVING SEMICONDUCTOR DEVICES MOUNTING THEREON, ENCAPSULATED WAFER HAVING SEMICONDUCTOR DEVICES FORMING THEREON, SEMICONDUCTOR APPARATUS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - The invention provides an encapsulant equipped with the supporting substrate which is an encapsulant for collectively encapsulating a semiconductor devices mounting surface of a substrate having semiconductor devices mounting thereon or a semiconductor devices forming surface of a wafer having semiconductor devices forming thereon, and the encapsulant equipped with the supporting substrate comprises a supporting substrate having a difference of a linear expansion coefficient from that of the substrate or the wafer of 5 ppm or less and a thermosetting resin layer being laminated, wherein the thermosetting resin layer has a shape having a height difference to a thickness direction. | 2014-05-22 |
20140138858 | HIGH PRESSURE STEAM INJECTION HEATER ASSEMBLY - The claimed invention teaches direct contact steam injection heater capable of handling steam pressure in excess of 300 psi. Specifically, the invention provides: a fixed upper seal assembly situated between the diffuser base and the diffuser which is designed to prevent the flow of steam around the regulating member into the diffuser. | 2014-05-22 |
20140138859 | HOT WATER DISTRIBUTION SYSTEM AND METHOD FOR A COOLING TOWER - A cooling tower with a hot water distribution system includes a distribution lateral disposed above a hot water basin. The distribution lateral discharges fluid into the hot water basin, which in turn, releases the fluid through a plurality of orifices. As the fluid is released, it falls on heat-exchanging fill material that assists in increasing the cooling rate of the fluid. The distribution lateral is configured structurally to discharge the fluid through a plurality of outlets at one or more angles (as compared to the horizontal) into the hot water basins. In one embodiment, the outlets are arranged into one or more rows that extend along a substantial length of the distribution lateral. Discharging the fluid in this manner enhances and promotes a more even fluid flow within the hot water basin, which results in a more even fluid flow over and onto the fill material, thereby increasing thermal efficiency. | 2014-05-22 |
20140138860 | FLUID DIFFUSING NOZZLE DESIGN - A nozzle design for diffusing high pressure steam into by flowing process fluid of substantially lower pressure while reducing the noise intensity generated. The injection nozzles include an opening having a first diameter to receive steam and a second diameter to inject the steam into a flow of liquid. The diameters of the first and second openings can vary relative to each other to enhance the flow characteristics of the steam or other gas being injected into a flow of liquid. The outer surface of a diffuser tube is coated with an insulating material, such as plastic. In alternate embodiments, the orientation of the injection holes can be angled either upstream or downstream to further enhance mixing characteristics of the steam. | 2014-05-22 |
20140138861 | INTERNAL LIQUID SEPARATING HOOD-TYPE CONDENSATION HEAT EXCHANGE TUBE - An internal liquid separating hood-type condensation head exchange tube, comprising an external heat exchange tube and an internal liquid separating hood disposed in the cavity of the external heat exchange tube and coaxial with the external heat exchange tube. The internal liquid separating hood is a hollow tube with a plurality of micropores or gaps distributed on a wall surface. The condensate formed during the heat exchange is pumped to the internal liquid separating hood in time under the effect of surface tension of the liquid via the micropores or gaps, and then is discharged from the heat exchange tube by the internal liquid separating hood. Vapor is retained to flow in the annular region between the external heat exchange tube and the internal liquid separating hood, so the inner wall of the external heat exchange tube comes into contact with the vapor to the greatest extent. | 2014-05-22 |
20140138862 | Process and Apparatus for Making Proppants - A highly efficient process is disclosed for making proppants from generally non-spherical or discretized raw material, such as naturally occurring sand or pelletized refractory material. In one embodiment of the process, the discretized material is heated by a counter-current flow of hot gas in a first Moving Bed Gas-Solids Direct Contact Heat Exchanger (MBGSDCHX). The heated discretized material is then further heated to a transformative temperature by a raw material transformation means to a partially or fully melted state in which the discretized raw material assumes generally spherical shapes. The spheres are then cooled by a counter-current flow of cold gas in a second MBGSDCHX. The cooled spheres are then size-classified for use as proppants. In an alternate embodiment, refractory raw material is melted and then discretized into molten drops. The molten drops are cooled and frozen into generally spherical shapes. The cooled spheres are used as proppants. | 2014-05-22 |
20140138863 | METHODS OF FORMING NANOPARTICLES USING SEMICONDUCTOR MANUFACTURING INFRASTRUCTURE - A method of preparing particles comprises forming by optical lithography a topographic template layer disposed on a surface of a substrate, which is suitable for spin casting. The template layer comprises a non-crosslinked template polymer having a pattern of independent wells therein for molding independent particles. Spin casting a particle-forming composition onto the template layer forms a composite layer comprising the template polymer and the particles disposed in the wells. The composite layer is removed from the substrate using a stripping agent that dissolves the template polymer without dissolving the particles. The particles are then isolated. | 2014-05-22 |
20140138864 | KIT AND METHOD FOR INDIRECT CHAIRSIDE PRODUCTION OF COMPOSITE INLAYS - The present invention relates to a kit for indirect production of composite inlays, comprising a polymerizable material for production of a dental model, a polymerizable material for production of an inlay, a polymerizable material for luting of a crosslinked and non-sand-blasted, non-silanized, non-etched, non-primed and non-roughened composite inlay, the surfaces of which have been fully polymerized, in the cavity. Also disclosed is a polymerizable material for increasing the bond strength between the polymerizable material for luting of a crosslinked non-sand-blasted, non-silanized, non-etched, non-primed and non-roughened composite inlay, the surfaces of which have been fully polymerized, in the cavity, and the hard substance of the tooth, and an acid solution for surface etching of the hard substance of the tooth. The invention further relates to methods for producing a composite inlay. | 2014-05-22 |
20140138865 | Method of Controlling a Pellet Mill - It is the object of the present invention to provide a method of controlling a pellet mill, said pellet mill comprising—a number of rollers ( | 2014-05-22 |
20140138866 | METHOD FOR PRODUCING PLASTICS CONTAINERS - The invention relates to a method for producing plastics containers ( | 2014-05-22 |
20140138867 | SELF-ADHERED SINGLE-SIDED SLIP-RESISTANT MATERIAL - A single-sided, slip resistant, self-adhesive material is produced using a blown film process which produces a film having an interior layer capable of being treated or coated to accept a pressure sensitive adhesive, a middle layer of flexible polyolefin and an exterior polyolefin elastomer layer in combination with a blowing agent to produce a single-sided slip resistant material. A number of in-line rollers are optionally provided after a pair of nip rollers, which form part of a machine direction orienter (MDO) that is used in line in the manufacturing process to heat, and then cool and condition (anneal and relieve any stresses and/or thickness inconsistencies) the film prior to the film being coated on one side with a pressure sensitive adhesive. | 2014-05-22 |
20140138868 | ANTISTATIC NON-CROSSLINKED FOAMED POLYETHYLENE RESIN PARTICLES AND MOLDED NON-CROSSLINKED FOAMED POLYETHYLENE RESIN BODY - Provided are non-crosslinked foamed polyethylene resin particles that have a bulk density BD of 10 g/L or more and 100 g/L or less and are obtained by foaming polyethylene resin particles containing an antistatic agent in an amount of 0.1 part by weight or more and 3 parts by weight or less with respect to 100 parts by weight of a polyethylene resin and having a density of 0.920 g/cm | 2014-05-22 |
20140138869 | PELLET MILL HAVING IMPROVED CONSTRUCTION - The present invention provides a pellet mill ( | 2014-05-22 |
20140138870 | Polyethylene Useful For Producing Film and Molded Articles In A Process Which Uses Solid State Stretching - Applicants have discovered that certain polyethylene (PE) homopolymers or copolymers of ethylene and C | 2014-05-22 |
20140138871 | SUPPORTING METHOD OF HONEYCOMB BODY - There is disclosed a method capable of effectively suppressing deformation when a honeycomb formed body formed by horizontal extrusion is supported by a cradle, and supporting even a large honeycomb formed body so that cell wall buckling hardly occur and a high shape accuracy is kept, wherein the lowermost end of a supporting surface of the cradle is located below the lowermost end of the honeycomb formed body immediately after extruded through the die during the horizontal movement, and a distance in a vertical direction between the lowermost end of the honeycomb formed body immediately after extruded through the die and the lowermost end of the supporting surface of the cradle is from 5 to 15 mm during the horizontal movement when a honeycomb formed body extruded through a die in a horizontal direction by extrusion is supported by a cradle. | 2014-05-22 |
20140138872 | METHOD AND DEVICE CONFIGURED TO PRODUCE AT LEAST TWO PRODUCTS INCLUDING FIBER REINFORCED RESIN - A production method and a production device are capable, in producing at least two products including a fiber reinforced resin, of easily impregnating a resin material into a fiber base material even if a volume of the product to be produced is large, by using a molding tool having a simple structure, and of easily performing control and management of a temperature and time for curing the resin material, and which enable easy cleaning of the molding tool. In order to produce a plurality of flat-shaped products including a fiber reinforced resin at the same time, first, a molding tool is prepared, which is formed so that a plurality of cavity portions having the flat shape of the plurality of products is overlaid with each other via a foundry core. | 2014-05-22 |
20140138873 | Method for Manufacturing a Reinforced Panel of Composite Material - A method for manufacturing rigid panels made of a composite material requires a caul sheet having a smooth surface that is formed with a plurality of grooves. A first layer of the composite material is laid on the caul sheet, and is cut to create flaps that extend into the respective grooves. Strips of composite material are then placed along the edges of the groove to extend and overlap each other in the groove. Next, a unidirectional ply is placed along the length of the groove, and this combination is then covered with a second layer of the composite material. Together, the combination of the first and second layers, the strips and the unidirectional ply are co-cured to create a rigid panel with integral stiffening members. | 2014-05-22 |
20140138874 | METHOD AND TIRE FOR IMPROVED UNIFORMITY AND ENDURANCE OF AGGRESSIVE TREAD DESIGNS - A tire having aggressive tread features with improvements in uniformity that can also improve endurance is provided along with a method and apparatus for manufacturing such a tire. The tire and its manner of manufacture can achieve a reduction or elimination of certain non-uniformities that can occur during the molding of large tread blocks. The reduction or removal of these non-uniformities can improve temperature performance to provide increased tire endurance. | 2014-05-22 |
20140138875 | IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD - An imprint apparatus molds and cures an imprint material on a substrate using a mold to thereby form a pattern on the substrate. The apparatus includes a first drive mechanism configured to apply a force in a planar direction of the mold and change the planar shape of the pattern portion formed in the mold, and a second drive mechanism configured to deform the mold about an axis (for example, the Y axis) that is orthogonal to the pressing direction of the mold and the uncured resin (for example, the Z axis) and a direction of the force applied by the first drive mechanism (for example, the X axis). | 2014-05-22 |
20140138876 | CONCRETE BLOCK PRODUCING DEVICE AND METHOD FOR PRODUCING AT LEAST TWO-COLOURED CONCRETE BLOCKS - The invention relates to a concrete block producing device and to a method for producing colored concrete blocks using a concrete block producing device including a block molding machine with a block mold that can be supplied with fresh concrete from a concrete hopper. The concrete hopper can be supplied with portions of at least two differently colored fresh concretes in a controlled manner by a dosing device. The dosing device includes at least two dosing chambers and a transport device for transporting the differently colored fresh concrete portions to the concrete hopper. The transport device includes at least one positioning unit for guiding the colored fresh concrete from the dosing chambers to the concrete hopper. The positioning unit is designed to supply defined positions in the concrete hopper with differently colored fresh concrete portions. | 2014-05-22 |
20140138877 | FORMLINER MANUFACTURING PROCESS - A process of manufacturing a formliner is disclosed. The process includes applying a formliner material to a mold, the mold having pocket molds for producing formliner pockets and a lattice of ridge molds for producing formliner ridges, then forming the formliner, and then demolding the formliner from the mold to produce the formliner having the formliner pockets and the formliner ridges. The lattice of the ridge molds have texture for producing texture in the formliner ridges and/or the mold includes a rigid high-density urethane closed cell foam or a rigid polyisocyanurate foam. | 2014-05-22 |
20140138878 | OVERLAPPING FORMLINER MANUFACTURING PROCESS - A process of manufacturing an overlapping formliner is disclosed. The process includes applying a formliner material to a mold, the mold having pocket molds for producing formliner pockets and a lattice of ridge molds for producing formliner ridges, then forming the overlapping formliner, the overlapping formliner having a varied ridge width being configured to be positioned to overlap an adjacent formliner, and then demolding the formliner from the mold to produce the formliner having the formliner pockets and the formliner ridges. | 2014-05-22 |
20140138879 | CUFF FOR USE WITH MEDICAL TUBING AND METHOD AND APPARATUS FOR MAKING THE SAME - A method of manufacturing more than one inflatable cuff per blow molding operation is provided. The method includes using two or more molds arranged in series and/or in parallel to simultaneously form two or more cuffs. The two or more cuffs may then be used in the manufacture of two or more respective endotracheal tubes. Apparatuses and systems for simultaneously forming the two or more cuffs are also provided. | 2014-05-22 |
20140138880 | METHOD FOR PRODUCING A TOOTHBRUSH HAVING AN INNER CAVITY - Methods of producing toothbrush handles having an inner cavity are provided. | 2014-05-22 |
20140138881 | GAS ASSISTED IMPRINT SYSTEM AND THE MANUFACTURING PROCESS THEREOF - The present invention discloses a gas assisted imprint system and the manufacturing method thereof. More specifically, instead of utilizing a rigid platform to, the gas assisted imprint system and the manufacturing method of the present invention utilizes a film to support the work-piece so as to evenly apply a force to the surface by the deformation caused by pressurized gas. More specifically, one of the main features of the present invention is that the present invention utilizes two films to cover the surfaces of a work-piece and applies a force evenly thereto by deforming the films by high pressure fluid. Accordingly, the present invention is capable of pressing the irregular surface of the work-piece evenly, solving the long lasted problem of the prior art. | 2014-05-22 |
20140138882 | METHOD OF FIRING CORDIERITE BODIES - Methods of firing a cordierite green body to form a fired cordierite body. The green body comprises cordierite-forming raw materials and organic material, the body having a core portion and a skin portion. The green body is pre-heated to a pre-heat temperature that is less than a thermal decomposition temperature of the organic material. The green body is maintained at the pre-heat temperature for a period of time sufficient to minimize a temperature differential between the core portion and the skin portion. The green body is heated to a low firing temperature in a firing atmosphere sufficient to reduce a content of the organic material and to substantially remove chemically bound water from hydrous alumina. The green body is heated to a high firing temperature in a firing atmosphere sufficient to reduce the content of the organic material prior to a substantial removal of chemically bound water from clay. | 2014-05-22 |
20140138883 | MELTING REDUCTION ASSEMBLY AND METHOD FOR OPERATING A MELTING REDUCTION ASSEMBLY - A melting reduction assembly ( | 2014-05-22 |
20140138884 | DEVICE FOR THE CLOSED-LOOP CONTROL OF PROCESS GASES IN A PLANT FOR PRODUCING DIRECTLY REDUCED METAL ORES - A device for closed-loop control of process gases ( | 2014-05-22 |
20140138885 | PNEUMATIC SPRING DEVICE - A pneumatic spring device with a housing ( | 2014-05-22 |
20140138886 | MEASURING RANGE SHIFT FOR SMART AIR SPRINGS - An air spring height sensor ( | 2014-05-22 |
20140138887 | GAS SPRING WITH DAMPENING - This invention concerns a gas spring having a working cylinder and therein a slidably arranged piston, whereas the working gas is, in order to provide for springing and dampening, optionally transferable between the working cylinder and the reservoir, characterized in that the reservoir is arranged in the piston rod. The gas or air spring according to this invention is self-dampening in both directions, i.e. at compression as well as at the extension. At compression it behaves as an air spring with dampening and at the extension it also behaves as an air spring with dampening, whereas both these damping effects can be, as regards the magnitude of the dampening, controlled independently from each other. | 2014-05-22 |
20140138888 | PEDAL SIMULATOR - Disclosed herein is a pedal simulator. The pedal simulator includes a main housing, a piston provided within the main housing so as to be reciprocally movable in upward and downward directions, an elastic support portion disposed within the main housing to provide elastic force in the upward direction against one piston, and a damper including a first deformation portion and a second deformation portion having a volume greater than the first deformation portion which are vertically disposed within the main housing, the damper being made of an elastic material such that the first and second deformation portions are sequentially compressed and deformed while being pressed by the piston according to downward movement of the piston. | 2014-05-22 |
20140138889 | PROGRESSIVE-ACTING SUSPENSION DEVICE / DAMPER FOR VEHICLES - A suspension device/damper for vehicles is provided, which includes a hydraulic damping unit ( | 2014-05-22 |
20140138890 | FLUID PRESSURE CYLINDER AND CLAMP DEVICE - A fluid pressure cylinder and a clamp device that, when an output member arrives at a prescribed position such as, in particular, an advance limit position or a retraction limit position, are capable of detecting the position of the output member on the basis of change of air pressure as, due to an opening/closing valve mechanism, the communication state of an air passage within the clamp main body is changed over together with the operation of the output member. | 2014-05-22 |
20140138891 | FENCE RAIL COMBINATION TOOL - A Fence Rail Combination Tool having an elongated main body | 2014-05-22 |
20140138892 | FLY FISHING DEVICE - A fly fishing vice is provided. A fly vice for creating custom flies includes a cylindrical member that attaches to a vertical member, and the vertical member attaches to a base member. The members can be disassembled for transport. The cylindrical member includes integrated jaw members for holding flies. Moreover, the cylindrical member can be custom adjusted to a desired point in three-dimensional space. | 2014-05-22 |
20140138893 | CUTTING BOARD - A cutting board having a removable resilient band is provided. The cutting board includes a planar body defining a top surface, a parallel bottom surface and a uniform width peripheral side. The cutting board also includes a removable resilient band that is configured to engage the periphery of the body. The removable band has a width complementary to the width of the body and defines footings that each has a width greater than the width of the body. The periphery of the body may have a continuous groove and the removable band may have a continuous tongue that fits the groove. | 2014-05-22 |
20140138894 | POSITIONING BLOCK FOR POSITIONING OBJECT ON WORK BENCH - A positioning block for positioning an object on a work bench includes a body having a positioning hole defined therethrough and a first bolt extends through the positioning hole. A support portion is formed on one side of the body and has a horizontal surface and an upright surface. A flange extends from the body and the board is pressed on the flange. The horizontal surface is parallel to the bottom face of the body. An angle is defined between the horizontal surface and the upright surface. | 2014-05-22 |
20140138895 | APPARATUS FOR OPENING AND TRANSPORTING A PRODUCT WITH A NON-SYMMETRICAL FOLD - An inserting machine and method for transporting newspapers is provided. The inserting machine includes a pocket conveyor having a plurality of interconnected pockets, each pocket having a fixed pocket wall, a movable pocket wall, a first side gripper, a second side gripper, a center gripper located between the first and second side grippers, at least one first suction opening on the fixed pocket wall and at least one second suction opening on the movable pocket wall. The at least one first and second suction openings coupled to a vacuum source. Hoppers are located above the pocket conveyor to feed inserts to the pockets in the pocket conveyor. The machine also includes a set of actuators for separately controlling movement of the movable pocket wall, the first side gripper, the second side gripper, and the center gripper, and for separately controlling application of a vacuum to the at least one first and second suction openings. | 2014-05-22 |
20140138896 | SHEET PROCESSING APPARATUS AND IMAGE FORMING SYSTEM - According to an aspect of an embodiment, a sheet processing apparatus includes: a conveying unit configured to convey sheets; a stacking unit configured to stack the conveyed sheets to form a sheet stack; and a binding unit configured to include a pair of toothed jaw and bind the sheet stack by pressing the sheet stack between the pair of toothed jaw, wherein at least one portion of edges of the toothed jaw is rounded. | 2014-05-22 |
20140138897 | IMAGE READING APPARATUS HAVING CONVEYANCE ROLLERS CONVEYING ORIGINAL SHEET - In an image reading apparatus, it is judged whether an original sheet is a first sheet type, whose sheet length is longer than or equal to a first conveyance distance and shorter than a second conveyance distance, and a second sheet type, whose sheet length is longer than or equal to the second conveyance path, the first conveyance distance being a distance between a first conveyance roller and a second conveyance roller, the second conveyance distance being a distance between a supply roller and the second conveyance roller. At least one of a leading-edge arriving timing; a trailing-edge arriving timing; and a sub-scanning magnification is set dependently on the judged result. An image is read from the original sheet by using an image reading unit and a conveyance unit based on the set at least one of the leading-edge arriving timing; trailing-edge arriving timing; and sub-scanning magnification. | 2014-05-22 |
20140138898 | IMAGE READING APPARATUS THAT READS ORIGINAL SHEET WHILE CONVEYING THE SAME - In an image reading apparatus, it is judged whether an original sheet is either one of a first sheet type, whose sheet length is longer than or equal to a first conveyance distance and shorter than a second conveyance distance, and a second sheet type, whose sheet length is longer than or equal to the second conveyance path, the first conveyance distance being distance between a first conveyance roller and a second conveyance roller, the second conveyance distance being distance between a supply roller and the second conveyance roller. The original sheet is conveyed at a separation timing, when the original sheet separates away from the supply roller, at a speed that is smaller for a case where the original sheet is of the first sheet type than for a case where the original sheet is of the second sheet type. An image is read from the conveyed original sheet. | 2014-05-22 |
20140138899 | PAPER FEED APPARATUS AND IMAGE FORMING SYSTEM - A paper feed apparatus is capable of correcting the skew of a sheet irrespective of a differential conveyance distance. The paper feed apparatus is provided with a first Large volume paper feed apparatus 100A having a control unit 130 which performs first correction control to correct the skew of a sheet by controlling a first conveyance unit 110 and forming a loop of the sheet P before a paper stop rollers 110 | 2014-05-22 |
20140138900 | Image Reading Apparatus - An image reading apparatus having a sheet path, which includes two ejection paths, is provided. The sheet path is switchable between the two ejection paths by a switchable member. An outlet cover arranged on a casing of the image reading apparatus is movable between a closed position and an open position to open and close an outlet of the second ejection path. When the outlet cover moves from the closed position to the open position, and before the switchable member switches the sheet path from the first ejection path to the second ejection path, switching of the sheet path from the first ejection path to the second ejection path is detectable. | 2014-05-22 |
20140138901 | Image Reading Apparatus - An image reading apparatus capable of reading an image from a sheet is provided. A sheet path to eject the sheet after being read may be selectively switched between a first ejection path to eject the sheet to an ejection unit and a second ejection path to eject the sheet on an outlet cover, which is openable/closable to a casing of the image reading apparatus. When the outlet cover is moved to open, a flapper arranged in a branch point between the first ejection path and the second ejection path moved in conjunction with the opening motion of the outlet cover, and the sheet path is switched from the first ejection path to the second ejection path. Further, a plurality of arms in a cover motion detector having a linkage mechanism rotate, and the rotating motions are detectable by a detector switch arranged at a terminal of the linkage mechanism. | 2014-05-22 |
20140138902 | Image Reading Apparatus - An image reading apparatus has a separation section configured to supply a sheet one by one, at least three driving rollers arranged on a downstream, in a sheet conveying direction, of the separation section and configured to convey the sheet, at least three driven rollers configured to be urged by the driving rollers and driven to rotate by rotation of the driving rollers, respectively, and an image reader unit configured to read an image of the sheet conveyed in the conveying direction. Sheet conveying forces by one of at least three driven rollers and one of at least three driving rollers arranged at the central portions in the sheet width direction is greater than sheet conveying forces by others of the at least three driven rollers and others of the at least three driving rollers arranged at both side portions in the sheet width direction. | 2014-05-22 |
20140138903 | SHEET FEED APPARATUS, AND DOCUMENT CONVEYING APPARATUS AND IMAGE FORMING APPARATUS HAVING THE SAME - Sheet conveying path extends from sheet stacking portion. Sheet feed roller is disposed, in sheet conveying path, facing sheet stacking portion. Sheet feed pad is disposed facing circumferential surface of sheet feed roller, and has pad surface that forms, between pad surface and circumferential surface, nip portion into which sheet is conveyed. Support member has support surface to which sheet feed pad is fixed and contact surface located upstream of support surface in sheet conveying direction so as to be higher than pad surface, and configured to make contact with leading end of sheet fed from sheet stacking portion. Rib portions are disposed in support member. Rib portions are disposed on both side portions, in sheet width direction intersecting sheet conveying direction, of support surface, and have inclined surfaces that extend so as to lower front end portions thereof, respectively, from contact surface toward downstream side in sheet conveying direction. | 2014-05-22 |
20140138904 | SHEET FEEDING DEVICE, AND IMAGE READING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SHEET FEEDING DEVICE - A sheet feeding device includes a grounding member arranged to a housing and electrically grounded, a sheet loading part arranged to the housing and loading a sheet, a sheet conveying path extending from the sheet loading part and conveying the sheet in a conveying direction, a sheet feeding part and a swinging member. The sheet feeding part is arranged facing to the sheet loading part and conveys the sheet on the sheet loading part in the conveying direction. The electro-conductive swinging member is swingably supported to the housing and swung in a first direction by bring the sheet from the sheet loading part into contact with the swinging member. The swinging member includes a first contact part receiving the contact of the sheet and a second contact part coming into contact with the grounding member accompanying to the swing in the first direction of the swinging member. | 2014-05-22 |
20140138905 | MEDIUM STACKING DEVICE AND IMAGE FORMING APPARATUS - A medium stacking device includes a medium stacking part stacking a medium, and a first movement part movably provided with respect to the medium stacking part. The first movement part has a first medium restriction part restricting a position of the medium, and a first movement restriction parts including a plurality of restriction members, each of which engaging with the medium stacking part and restricting a direction of the movement of the first movement part. | 2014-05-22 |