22nd week of 2020 patent applcation highlights part 53 |
Patent application number | Title | Published |
20200168480 | WET ETCH APPARATUS AND METHOD FOR USING THE SAME | 2020-05-28 |
20200168481 | WAFER INSPECTION APPARATUS | 2020-05-28 |
20200168482 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | 2020-05-28 |
20200168483 | WAFER CLEANING APPARATUS AND METHOD OF CLEANING WAFER | 2020-05-28 |
20200168484 | SPACE FILLING DEVICE FOR WET BENCH | 2020-05-28 |
20200168485 | SUBSTRATE PROCESSING APPARATUS FOR PROCESSING SUBSTRATES | 2020-05-28 |
20200168486 | HEAT TREATMENT APPARATUS AND HEAT TREATMENT METHOD | 2020-05-28 |
20200168487 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND STORAGE MEDIUM | 2020-05-28 |
20200168488 | LOAD PORT MODULE | 2020-05-28 |
20200168489 | HYBRIDIZATION FOR CHARACTERIZATION AND METROLOGY | 2020-05-28 |
20200168490 | SCANNING ALIGNMENT DEVICE AND SCANNING METHOD THEREFOR | 2020-05-28 |
20200168491 | Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium | 2020-05-28 |
20200168492 | Substrate Cushion Brace Retainer | 2020-05-28 |
20200168493 | LOAD PORT MODULE | 2020-05-28 |
20200168494 | SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR PROCESSING SYSTEM | 2020-05-28 |
20200168495 | DOOR OPENING/CLOSING SYSTEM, AND LOAD PORT EQUIPPED WITH DOOR OPENING/CLOSING SYSTEM | 2020-05-28 |
20200168496 | SUBSTRATE TREATMENT APPARATUS | 2020-05-28 |
20200168497 | MICROELECTRONIC DEVICES INCLUDING REDISTRIBUTION LAYERS | 2020-05-28 |
20200168498 | PARALLEL ASSEMBLY OF DISCRETE COMPONENTS ONTO A SUBSTRATE | 2020-05-28 |
20200168499 | HOLDING JIG | 2020-05-28 |
20200168500 | METHOD FOR FORMING AN INTERCONNECTION STRUCTURE | 2020-05-28 |
20200168501 | METHOD FOR PLANARIZING WAFER SURFACE | 2020-05-28 |
20200168502 | Electrical Connection for Semiconductor Devices | 2020-05-28 |
20200168503 | Selective Deposition Of Carbon Films And Uses Thereof | 2020-05-28 |
20200168504 | METHODS, APPARATUS, AND SYSTEM FOR PROTECTING COBALT FORMATIONS FROM OXIDATION DURING SEMICONDUCTOR DEVICE FORMATION | 2020-05-28 |
20200168505 | Semiconductor Chip, Method of Producing a Semiconductor Chip and Apparatus Having a Plurality of Semiconductor Chips | 2020-05-28 |
20200168506 | METHODS OF FABRICATING SEMICONDUCTOR PACKAGE | 2020-05-28 |
20200168507 | SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME | 2020-05-28 |
20200168508 | METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE USING DEHYDRATING CHEMICAL, AND METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE | 2020-05-28 |
20200168509 | LATE GATE CUT USING SELECTIVE DIELECTRIC DEPOSITION | 2020-05-28 |
20200168510 | FABRICATION OF A PAIR OF VERTICAL FIN FIELD EFFECT TRANSISTORS HAVING A MERGED TOP SOURCE/DRAIN | 2020-05-28 |
20200168511 | FABRICATION OF A PAIR OF VERTICAL FIN FIELD EFFECT TRANSISTORS HAVING A MERGED TOP SOURCE/DRAIN | 2020-05-28 |
20200168512 | FABRICATION OF A PAIR OF VERTICAL FIN FIELD EFFECT TRANSISTORS HAVING A MERGED TOP SOURCE/DRAIN | 2020-05-28 |
20200168513 | METHOD AND APPARATUS FOR NANOSCALE-DIMENSION MEASUREMENT USING A DIFFRACTION PATTERN FILTER | 2020-05-28 |
20200168514 | METHOD AND SYSTEM FOR MANUFACTURING SOLAR CELLS AND SHINGLED SOLAR CELL MODULES | 2020-05-28 |
20200168515 | TEST CIRCUIT LAYOUT STRUCTURE FOR DISPLAY PANEL | 2020-05-28 |
20200168516 | DISPLAY DEVICE AND METHOD FOR REPAIRING AND DETECTING THIN FILM TRANSISTOR OF DISPLAY DEVICE | 2020-05-28 |
20200168517 | SEMICONDUCTOR DEVICE WITH A PROTECTION MECHANISM AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | 2020-05-28 |
20200168518 | SEMICONDUCTOR PACKAGE | 2020-05-28 |
20200168519 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE | 2020-05-28 |
20200168520 | ELECTRONIC COMPONENT MODULE, AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT MODULE | 2020-05-28 |
20200168521 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE | 2020-05-28 |
20200168522 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2020-05-28 |
20200168523 | ELECTRONIC PACKAGE, METHOD FOR FABRICATING THE SAME, AND HEAT DISSIPATOR | 2020-05-28 |
20200168524 | INTEGRATED CIRCUIT CHIP PACKAGING | 2020-05-28 |
20200168525 | INTEGRATED CIRCUIT CHIP PACKAGING | 2020-05-28 |
20200168526 | Thermal Management Of RF Devices Using Embedded Microjet Arrays | 2020-05-28 |
20200168527 | SOIC CHIP ARCHITECTURE | 2020-05-28 |
20200168528 | STACKED-DEVICE THROUGH-SILICON VIAS FOR SEMICONDUCTOR PACKAGES | 2020-05-28 |
20200168529 | PACKAGING STRUCTURE FOR GALLIUM NITRIDE DEVICES | 2020-05-28 |
20200168530 | SEMICONDUCTOR PACKAGE WITH TOP CIRCUIT AND AN IC WITH A GAP OVER THE IC | 2020-05-28 |
20200168531 | INTEGRATED CIRCUIT PACKAGE INCLUDING INWARD BENT LEADS | 2020-05-28 |
20200168532 | CIRCUIT DEVICE | 2020-05-28 |
20200168533 | MULTI-DIE PACKAGE WITH MULTIPLE HEAT CHANNELS | 2020-05-28 |
20200168534 | MULTI-CHIP MODULE INCLUDING STANDALONE CAPACITORS | 2020-05-28 |
20200168535 | DIRECT CURRENT BLOCKING CAPACITORS | 2020-05-28 |
20200168536 | ASYMMETRIC CORED INTEGRATED CIRCUIT PACKAGE SUPPORTS | 2020-05-28 |
20200168537 | FAN-OUT SEMICONDUCTOR PACKAGE | 2020-05-28 |
20200168538 | MULTIPLE-SURFACE CONNECTED EMBEDDED INTERCONNECT BRIDGE FOR SEMICONDUCTOR PACKAGE SUBSTRATES | 2020-05-28 |
20200168539 | INTEGRATED CIRCUIT AND ELECTRONIC CIRCUIT COMPRISING THE SAME | 2020-05-28 |
20200168540 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | 2020-05-28 |
20200168541 | WIRING SUBSTRATE | 2020-05-28 |
20200168542 | INTEGRATED CIRCUIT HAVING HETEROGENEOUS CONTACTS AND SEMICONDUCTOR DEVICE INCLUDING THE INTEGRATED CIRCUIT | 2020-05-28 |
20200168543 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-05-28 |
20200168544 | SEMICONDUCTOR PACKAGE | 2020-05-28 |
20200168545 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-05-28 |
20200168546 | MANUFACTURING METHOD OF STACKED MULTILAYER STRUCTURE | 2020-05-28 |
20200168547 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE | 2020-05-28 |
20200168548 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | 2020-05-28 |
20200168549 | MOLDED DIE LAST CHIP COMBINATION | 2020-05-28 |
20200168550 | SEMICONDUCTOR PACKAGE | 2020-05-28 |
20200168551 | STRUCTURE, METHOD FOR MANUFACTURING STRUCTURE, LAMINATE, AND SEMICONDUCTOR PACKAGE | 2020-05-28 |
20200168552 | HYBRID INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 2020-05-28 |
20200168553 | HIGH DENSITY INTERCONNECT STRUCTURES CONFIGURED FOR MANUFACTURING AND PERFORMANCE | 2020-05-28 |
20200168554 | INTERPOSERS FOR MICROELECTRONIC DEVICES | 2020-05-28 |
20200168555 | Semiconductor Device with Multi-Layer Dielectric and Methods of Forming the Same | 2020-05-28 |
20200168556 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP AND METHOD OF DICING A SEMICONDUCTOR SUBSTRATE | 2020-05-28 |
20200168557 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF | 2020-05-28 |
20200168558 | SEMICONDUCTOR PACKAGE | 2020-05-28 |
20200168559 | EMBEDDED REFERENCE LAYERS FOR SEMICONDUCTOR PACKAGE SUBSTRATES | 2020-05-28 |
20200168560 | SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND FABRICATION METHOD THEREOF | 2020-05-28 |
20200168561 | SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND ACTIVE ELECTRO-MAGNETIC COMPATIBILITY SHIELDING | 2020-05-28 |
20200168562 | SEMICONDUCTOR PACKAGE | 2020-05-28 |
20200168563 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | 2020-05-28 |
20200168564 | RADIO-FREQUENCY ISOLATION USING BACKSIDE CAVITIES | 2020-05-28 |
20200168565 | SEMICONDUCTOR PACKAGE | 2020-05-28 |
20200168566 | SEMICONDUCTOR PACKAGE WITH IN-PACKAGE COMPARTMENTAL SHIELDING AND FABRICATION METHOD THEREOF | 2020-05-28 |
20200168567 | TRANSITION CIRCUITRY FOR INTEGRATED CIRCUIT DIE | 2020-05-28 |
20200168568 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2020-05-28 |
20200168569 | SEMICONDUCTOR PACKAGE HAVING A COAXIAL FIRST LAYER INTERCONNECT | 2020-05-28 |
20200168570 | BIOLOGICAL INFORMATION DETECTING APPARATUS | 2020-05-28 |
20200168571 | RF Power Amplifier Pallet | 2020-05-28 |
20200168572 | SEMICONDUCTOR PACKAGE ASSEMBLY HAVING A CONDUCTIVE ELECTROMAGNETIC SHIELD LAYER | 2020-05-28 |
20200168573 | BONDING PAD, SEMICONDUCTOR STRUCTURE, AND METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | 2020-05-28 |
20200168574 | Shielding Structures | 2020-05-28 |
20200168575 | Semiconductor Device and Method for Fabricating a Semiconductor Device | 2020-05-28 |
20200168576 | COMPOSITE CLIP STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME | 2020-05-28 |
20200168577 | MULTI-PIECE WIRING SUBSTRATE, ELECTRONIC COMPONENT HOUSING PACKAGE, AND ELECTRONIC DEVICE | 2020-05-28 |
20200168578 | Cu ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICE | 2020-05-28 |
20200168579 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE | 2020-05-28 |