22nd week of 2019 patent applcation highlights part 55 |
Patent application number | Title | Published |
20190164807 | ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS | 2019-05-30 |
20190164808 | TRENCH ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2019-05-30 |
20190164809 | CONTINUOUS GATE AND FIN SPACER FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2019-05-30 |
20190164810 | SEMICONDUCTOR STRUCTURE INCLUDING INTER-LAYER DIELECTRIC | 2019-05-30 |
20190164811 | METHOD OF MANUFACTURING A SEMICONDUCTOR ON INSULATOR STRUCTURE BY A PRESSURIZED BOND TREATMENT | 2019-05-30 |
20190164812 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE HAVING LAYER WITH RE-ENTRANT PROFILE | 2019-05-30 |
20190164813 | CONTACT FORMATION METHOD AND RELATED STRUCTURE | 2019-05-30 |
20190164814 | PLUGS FOR INTERCONNECT LINES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2019-05-30 |
20190164815 | DAMASCENE PLUG AND TAB PATTERNING WITH PHOTOBUCKETS FOR BACK END OF LINE (BEOL) SPACER-BASED INTERCONNECTS | 2019-05-30 |
20190164816 | METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE | 2019-05-30 |
20190164817 | Contact Plugs for Semiconductor Device and Method of Forming Same | 2019-05-30 |
20190164818 | ETCH-STOP LAYER TOPOGRAPHY FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2019-05-30 |
20190164819 | LINER STRUCTURE IN INTERLAYER DIELECTRIC STRUCTURE FOR SEMICONDUCTOR DEVICES | 2019-05-30 |
20190164820 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2019-05-30 |
20190164821 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURE HAVING METAL OXIDE ADHESIVE LAYER | 2019-05-30 |
20190164822 | Semiconductor Device With TiN Adhesion Layer For Forming A Contact Plug | 2019-05-30 |
20190164823 | CONDUCTIVE FEATURE FORMATION AND STRUCTURE | 2019-05-30 |
20190164824 | Conductive Feature Formation and Structure | 2019-05-30 |
20190164825 | PHYSICAL VAPOR DEPOSITION PROCESS FOR SEMICONDUCTOR INTERCONNECTION STRUCTURES | 2019-05-30 |
20190164826 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND PRE-CLEAN APPARATUS FOR SEMICONDUCTOR DEVICE | 2019-05-30 |
20190164827 | Physical Vapor Deposition Process for Semiconductor Interconnection Structures | 2019-05-30 |
20190164828 | SEMICONDUCTOR DEVICE, INTERCONNECTION STRUCTURE AND METHOD FOR FORMING THE SAME | 2019-05-30 |
20190164829 | Semiconductor Device and Method of Manufacture | 2019-05-30 |
20190164830 | SELF-ALIGNED CONTACT AND METHOD FOR FORMING THE SAME | 2019-05-30 |
20190164831 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2019-05-30 |
20190164832 | WAFER PROCESSING METHOD | 2019-05-30 |
20190164833 | LASER PROCESSING METHOD FOR WAFER | 2019-05-30 |
20190164834 | METHODS TO PRODUCE A 3D SEMICONDUCTOR MEMORY DEVICE AND SYSTEM | 2019-05-30 |
20190164835 | SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME | 2019-05-30 |
20190164836 | FIN CUT AND FIN TRIM ISOLATION FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2019-05-30 |
20190164837 | SEMICONDUCTOR STRUCTURE WITH CUTTING DEPTH CONTROL AND METHOD FOR FABRICATING THE SAME | 2019-05-30 |
20190164838 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | 2019-05-30 |
20190164839 | Residue-Free Metal Gate Cutting For Fin-Like Field Effect Transistor | 2019-05-30 |
20190164840 | ETCH PROFILE CONTROL OF POLYSILICON STRUCTURES OF SEMICONDUCTOR DEVICES | 2019-05-30 |
20190164841 | TRENCH PLUG HARDMASK FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2019-05-30 |
20190164842 | Prevention of Contact Bottom Void in Semiconductor Fabrication | 2019-05-30 |
20190164843 | HOMOGENEOUS DENSIFICATION OF FILL LAYERS FOR CONTROLLED REVEAL OF VERTICAL FINS | 2019-05-30 |
20190164844 | SEMICONDUCTOR STRUCTURE CUTTING PROCESS AND STRUCTURES FORMED THEREBY | 2019-05-30 |
20190164845 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR | 2019-05-30 |
20190164846 | DUAL METAL SILICIDE STRUCTURES FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2019-05-30 |
20190164847 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-05-30 |
20190164848 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE WITH HIGH ASPECT RATIO | 2019-05-30 |
20190164849 | ELECTRONIC DEVICE AND ELECTRICAL TESTING METHOD THEREOF | 2019-05-30 |
20190164850 | SEMICONDUCTOR STRUCTURE AND TESTING METHOD THEREOF | 2019-05-30 |
20190164851 | TEST INTERFACE BOARD AND SYSTEM INCLUDING THE SAME | 2019-05-30 |
20190164852 | SYSTEM AND METHOD FOR IN-LINE PROCESSING CONTROL | 2019-05-30 |
20190164853 | METHOD FOR INSPECTING SENSOR PACKAGE STRUCTURE, INSPECTION APPARATUS, AND FOCUS ASSISTANT LOADER OF INSPECTION APPARATUS | 2019-05-30 |
20190164854 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE DISPLAY DEVICE | 2019-05-30 |
20190164855 | ARRAY SUBSTRATE AND REPAIRING METHOD THEREOF | 2019-05-30 |
20190164856 | SEMICONDUCTOR DEVICE AND REPAIR OPERATION METHOD THEREOF | 2019-05-30 |
20190164857 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | 2019-05-30 |
20190164858 | SEMICONDUCTOR APPARATUS AND ELECTRIC POWER CONVERSION APPARATUS | 2019-05-30 |
20190164859 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2019-05-30 |
20190164860 | Package Structure and Method | 2019-05-30 |
20190164861 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | 2019-05-30 |
20190164862 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-05-30 |
20190164863 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-05-30 |
20190164864 | MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS | 2019-05-30 |
20190164865 | Semiconductor Package | 2019-05-30 |
20190164866 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-05-30 |
20190164867 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | 2019-05-30 |
20190164868 | BIPOLAR TRANSISTOR, SEMICONDUCTOR DEVICE, AND BIPOLAR TRANSISTOR MANUFACTURING METHOD | 2019-05-30 |
20190164869 | Strain-Tolerant Die Attach with Improved Thermal Conductivity, and Method of Fabrication | 2019-05-30 |
20190164870 | SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR MODULE INCLUDING THE SAME | 2019-05-30 |
20190164871 | SEMICONDUCTOR PACKAGE STRUCTURE HAVING A HEAT DISSIPATION STRUCTURE | 2019-05-30 |
20190164872 | ELECTRONIC DEVICE | 2019-05-30 |
20190164873 | Multi-Phase Half Bridge Driver Package and Methods of Manufacture | 2019-05-30 |
20190164874 | CHIP-ON-FILM SEMICONDUCTOR DEVICE | 2019-05-30 |
20190164875 | PREMOLDED SUBSTRATE FOR MOUNTING A SEMICONDUCTOR DIE AND A METHOD OF FABRICATION THEREOF | 2019-05-30 |
20190164876 | CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | 2019-05-30 |
20190164877 | CHIP ON FILE DISPLAY DEVICE INCLUDING THE SAME | 2019-05-30 |
20190164878 | CIRCUIT ASSEMBLY | 2019-05-30 |
20190164879 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE | 2019-05-30 |
20190164880 | SEMICONDUCTOR MODULE, METHOD FOR MANUFACTURING THE SAME AND POWER CONVERSION APPARATUS | 2019-05-30 |
20190164881 | INTEGRATED CIRCUIT PACKAGE SUBSTRATE | 2019-05-30 |
20190164882 | SEMICONDUCTOR DEVICE INTEGRATING BACKSIDE POWER GRID AND RELATED INTEGRATED CIRCUIT AND FABRICATION METHOD | 2019-05-30 |
20190164883 | MIDDLE-END-OF-LINE STRAP FOR STANDARD CELL | 2019-05-30 |
20190164884 | ELECTRONIC COMPONENT AND THREE-TERMINAL CAPACITOR | 2019-05-30 |
20190164885 | BEOL INTEGRATION WITH ADVANCED INTERCONNECTS | 2019-05-30 |
20190164886 | SEMICONDUCTOR DEVICE WITH POLYGONAL INDUCTIVE DEVICE | 2019-05-30 |
20190164887 | Interconnect Structures and Methods of Forming the Same | 2019-05-30 |
20190164888 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-05-30 |
20190164889 | VIA SIZING FOR IR DROP REDUCTION | 2019-05-30 |
20190164890 | PITCH-DIVIDED INTERCONNECTS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2019-05-30 |
20190164891 | TUNABLE DIFFERENTIAL VIA CIRCUIT | 2019-05-30 |
20190164892 | MODULE AND METHOD FOR PRODUCING A PLURALITY OF MODULES | 2019-05-30 |
20190164893 | SEMICONDUCTOR PACKAGE | 2019-05-30 |
20190164894 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-05-30 |
20190164895 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-05-30 |
20190164896 | SEMICONDUCTOR DEVICES INCLUDING COBALT ALLOYS AND FABRICATION METHODS THEREOF | 2019-05-30 |
20190164897 | HETEROGENEOUS METAL LINE COMPOSITIONS FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION | 2019-05-30 |
20190164898 | FINFET WITH ETCH-SELECTIVE SPACER AND SELF-ALIGNED CONTACT CAPPING LAYER | 2019-05-30 |
20190164899 | System and Method for Aligned Stitching | 2019-05-30 |
20190164900 | MARK, METHOD FOR FORMING SAME, AND EXPOSURE APPARATUS | 2019-05-30 |
20190164901 | ARRAY SUBSTRATE, CHIP ON FILM, AND ALIGNMENT METHOD | 2019-05-30 |
20190164902 | PACKAGE ASSEMBLY FOR DIVIDED ELECTROMAGNETIC SHIELDING AND METHOD OF MANUFACTURING SAME | 2019-05-30 |
20190164903 | SHIELDED MOM CAPACITOR | 2019-05-30 |
20190164904 | MULTILAYER CIRCUIT BOARD | 2019-05-30 |
20190164905 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING THE SAME | 2019-05-30 |
20190164906 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-05-30 |