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22nd week of 2018 patent applcation highlights part 49
Patent application number
Title
Published
20180151421
Semiconductor Device and Method
2018-05-31
20180151422
Method of Forming Interconnect Structures
2018-05-31
20180151423
THE USE OF NOBLE METALS IN THE FORMATION OF CONDUCTIVE CONNECTORS
2018-05-31
20180151424
METHODS TO FILL HIGH ASPECT RATIO FEATURES ON SEMICONDUCTOR SUBSTRATES WITH MOCVD COBALT FILM
2018-05-31
20180151425
Contact Openings and Methods Forming Same
2018-05-31
20180151426
METHOD OF FLAT CU FORMING WITH PARTIAL CU PLATING
2018-05-31
20180151427
Method of Cleaning Wafer After CMP
2018-05-31
20180151428
CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING CONDUCTIVE STRUCTURE
2018-05-31
20180151429
Methods for Forming Metal Layers in Openings and Apparatus for Forming Same
2018-05-31
20180151430
METHOD OF FORMING SUPERCONDUCTOR STRUCTURES
2018-05-31
20180151431
MEMORY DEVICE AND OPERATION METHOD THEREOF
2018-05-31
20180151432
Self Aligned Via and Method for Fabricating the Same
2018-05-31
20180151433
GATE TIE-DOWN ENABLEMENT WITH INNER SPACER
2018-05-31
20180151434
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A DUMMY SECTION
2018-05-31
20180151435
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
2018-05-31
20180151436
DIRECT BONDING METHOD
2018-05-31
20180151437
SEMICONDUCTOR DEVICE
2018-05-31
20180151438
THRESHOLD VOLTAGE ADJUSTMENT FOR A GATE-ALL-AROUND SEMICONDUCTOR STRUCTURE
2018-05-31
20180151439
Asymmetric Source/Drain Epitaxy
2018-05-31
20180151440
FinFET Device and Method of Forming Same
2018-05-31
20180151441
Semiconductor Device and Method
2018-05-31
20180151442
Semiconductor Device and Method of Manufacture
2018-05-31
20180151443
METHODS FOR FORMING THE ISOLATION STRUCTURE OF THE SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICES
2018-05-31
20180151444
ARRAY SUBSTRATE AND MANUFACTURING METHOD FOR THE SAME
2018-05-31
20180151445
FORMING A PROTECTIVE LAYER TO PREVENT FORMATION OF LEAKAGE PATHS
2018-05-31
20180151446
FINFET DEVICES AND METHODS OF FORMING THE SAME
2018-05-31
20180151447
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
2018-05-31
20180151448
BREAKDOWN RESISTANT SEMICONDUCTOR APPARATUS AND METHOD OF MAKING SAME
2018-05-31
20180151449
SEMICONDUCTOR STRUCTURE INCLUDING TWO-DIMENSIONAL AND THREE-DIMENSIONAL BONDING MATERIALS
2018-05-31
20180151450
Multi-Gate Device and Method of Fabrication Thereof
2018-05-31
20180151451
SRAM DEVICES AND FABRICATION METHODS THEREOF
2018-05-31
20180151452
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2018-05-31
20180151453
Semiconductor Device and Method
2018-05-31
20180151454
METHOD FOR ADJUSTING ETCHING PARAMETERS
2018-05-31
20180151455
THERMAL PROCESSING METHOD AND THERMAL PROCESSING APPARATUS THROUGH LIGHT IRRADIATION
2018-05-31
20180151456
METHOD AND SYSTEM FOR WET CHEMICAL BATH PROCESS
2018-05-31
20180151457
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING APPARATUS
2018-05-31
20180151458
SEMICONDUCTOR STRUCTURE, TESTING AND FABRICATING METHODS THEREOF
2018-05-31
20180151459
SEMICONDUCTOR STRUCTURE, TESTING AND FABRICATING METHOD THEREOF
2018-05-31
20180151460
SEMICONDUCTOR DEVICE
2018-05-31
20180151461
STIFFENER FOR FAN-OUT WAFER LEVEL PACKAGING AND METHOD OF MANUFACTURING
2018-05-31
20180151462
INTEGRATED CIRCUIT SUBSTRATE AND METHOD OF PRODUCING THEREOF
2018-05-31
20180151463
INTEGRATED CIRCUIT NANOPARTICLE THERMAL ROUTING STRUCTURE OVER INTERCONNECT REGION
2018-05-31
20180151464
THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
2018-05-31
20180151465
SEMICONDUCTOR PACKAGE AND A METHOD OF MANUFACTURING THE SAME
2018-05-31
20180151466
HEAT TRANSFER STRUCTURES AND METHODS FOR IC PACKAGES
2018-05-31
20180151467
SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT
2018-05-31
20180151468
DEVICE INTEGRATION OF ACTIVE COOLING SYSTEMS
2018-05-31
20180151469
SOLID-STATE DRIVE DEVICE
2018-05-31
20180151470
INTEGRATED CIRCUIT NANOPARTICLE THERMAL ROUTING STRUCTURE IN INTERCONNECT REGION
2018-05-31
20180151471
HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING
2018-05-31
20180151472
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-05-31
20180151473
LIGHTWEIGHT LIQUID-COOLING-PLATE ASSEMBLY HAVING PLASTIC FRAME AND HEAT DISSIPATION SYSTEM USING SAME
2018-05-31
20180151474
ON-CHIP THROUGH-BODY-VIA CAPACITORS AND TECHNIQUES FOR FORMING SAME
2018-05-31
20180151475
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2018-05-31
20180151476
SEMICONDUCTOR DEVICE
2018-05-31
20180151477
CHIP PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
2018-05-31
20180151478
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
2018-05-31
20180151479
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
2018-05-31
20180151480
SEMICONDUCTOR DEVICE
2018-05-31
20180151481
Semiconductor Device Including a Bidirectional Switch
2018-05-31
20180151482
ELECTRONIC DEVICE, MANUFACTURING METHOD AND LEAD FRAME FOR SAME
2018-05-31
20180151483
WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
2018-05-31
20180151484
Pad Design for Reliability Enhancement in Packages
2018-05-31
20180151485
SEMICONDUCTOR DEVICE PACKAGE INCLUDING FILLING MOLD VIA
2018-05-31
20180151486
METHOD OF MANUFACTURING WIRING SUBSTRATE
2018-05-31
20180151487
INTERCONNECT VIA WITH GROWN GRAPHITIC MATERIAL
2018-05-31
20180151488
INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-05-31
20180151489
METALLIC BLOCKING LAYER FOR RELIABLE INTERCONNECTS AND CONTACTS
2018-05-31
20180151490
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
2018-05-31
20180151491
AIRGAP PROTECTION LAYER FOR VIA ALIGNMENT
2018-05-31
20180151492
Device-Manufacturing Scheme for Increasing the Density of Metal Patterns in Inter-Layer Dielectrics
2018-05-31
20180151493
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
2018-05-31
20180151494
SEMICONDUCTOR DEVICE HAVING BURIED METAL LINE AND FABRICATION METHOD OF THE SAME
2018-05-31
20180151495
SEMICONDCUTOR DEVICE
2018-05-31
20180151496
POWER GRID STRUCTURES AND METHOD OF FORMING THE SAME
2018-05-31
20180151497
THREE-DIMENSIONAL ARRAY DEVICE HAVING A METAL CONTAINING BARRIER AND METHOD OF MAKING THEREOF
2018-05-31
20180151498
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
2018-05-31
20180151499
SEMICONDUCTOR PACKAGE STRUCTURE
2018-05-31
20180151500
PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME
2018-05-31
20180151501
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
2018-05-31
20180151502
Fan-Out Package Having a Dummy Die and Method of Forming
2018-05-31
20180151503
Interlevel Conductor Pre-Fill Utilizing Selective Barrier Deposition
2018-05-31
20180151504
SELF ALIGNED INTERCONNECT STRUCTURES
2018-05-31
20180151505
INTERCONNECTION STRUCTURES AND FABRICATION METHODS THEREOF
2018-05-31
20180151506
METAL LAYER INDEPENDENT VERSION IDENTIFIER
2018-05-31
20180151507
Alignment Pattern for Package Singulation
2018-05-31
20180151508
WAFER PROCESSING METHOD
2018-05-31
20180151509
SEMICONDUCTOR APPARATUS AND MEMORY SYSTEM
2018-05-31
20180151510
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
2018-05-31
20180151511
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF
2018-05-31
20180151512
STACKED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2018-05-31
20180151513
INTEGRATED CIRCUIT (IC) DEVICES WITH VARYING DIAMETER VIA LAYER
2018-05-31
20180151514
SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRIC POWER CONVERSION DEVICE
2018-05-31
20180151515
SYSTEM AND METHOD FOR STRIPLINE ELECTRODES FOR THIN-FILM CHARACTERIZATION
2018-05-31
20180151516
LIGHT-EMITTING DEVICE
2018-05-31
20180151517
SEMICONDUCTOR ELEMENT MOUNTING BOARD
2018-05-31
20180151518
SEMICONDUCTOR PACKAGE WITH ANTENNA
2018-05-31
20180151519
METHOD FOR MANUFACTURING REDISTRIBUTION LAYER
2018-05-31
20180151520
POST PASSIVATION INTERCONNECT AND FABRICATION METHOD THEREFOR
2018-05-31