22nd week of 2021 patent applcation highlights part 60 |
Patent application number | Title | Published |
20210166979 | ELECTRON BEAM PROBING TECHNIQUES AND RELATED STRUCTURES | 2021-06-03 |
20210166980 | IMAGER SYSTEM COMPRISING LENS COMPOSED OF A PLURALITY OF MATERIAL LAYERS | 2021-06-03 |
20210166981 | METHOD AND DEVICE FOR REPAIRING AN INTERNAL CIRCUIT BREAK DEFECT IN A CHIP | 2021-06-03 |
20210166982 | WAFER STRUCTURE, DIE FABRICATION METHOD AND CHIP | 2021-06-03 |
20210166983 | MONITORING STRUCTURE FOR CRITICAL DIMENSION OF LITHOGRAPHY PROCESS | 2021-06-03 |
20210166984 | SEMICONDUCTOR DEVICE AND POWER CONVERTER | 2021-06-03 |
20210166985 | PACKAGE STRUCTURE, SEMICONDUCTOR DEVICE, AND FORMATION METHOD FOR PACKAGE STRUCTURE | 2021-06-03 |
20210166986 | PACKAGE WITH ENCAPSULANT UNDER COMPRESSIVE STRESS | 2021-06-03 |
20210166987 | SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR MANUFACTURING PROCESS | 2021-06-03 |
20210166988 | Semiconductor Package with Expanded Heat Spreader | 2021-06-03 |
20210166989 | STRUCTURE AND BONDED BODY | 2021-06-03 |
20210166990 | A FLUIDIC PUMP | 2021-06-03 |
20210166991 | Chip-Carrier Socket for Microfluidic-Cooled Three-Dimensional Electronic/Photonic Integrated Circuits | 2021-06-03 |
20210166992 | METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES | 2021-06-03 |
20210166993 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-06-03 |
20210166994 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR DEVICE | 2021-06-03 |
20210166995 | Hard IP Blocks With Physically Bidirectional Passageways | 2021-06-03 |
20210166996 | PILLAR-LAST METHODS FOR FORMING SEMICONDUCTOR DEVICES | 2021-06-03 |
20210166997 | SEMICONDUCTOR PACKAGE USING CONDUCTIVE METAL STRUCTURE | 2021-06-03 |
20210166998 | SEMICONDUCTOR PACKAGE HAVING A LEAD FRAME AND A CLIP FRAME | 2021-06-03 |
20210166999 | Chip Package Assembly And Method For Manufacturing The Same | 2021-06-03 |
20210167000 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE | 2021-06-03 |
20210167001 | INTERPOSER AND SEMICONDUCTOR PACKAGE HAVING THE SAME | 2021-06-03 |
20210167002 | THROUGH-SUBSTRATE VIA STRUCTURE AND METHOD OF MANUFACTURE | 2021-06-03 |
20210167003 | SEMICONDUCTOR MODULE | 2021-06-03 |
20210167004 | SEMICONDUCTOR DEVICE | 2021-06-03 |
20210167005 | SEMICONDUCTOR MODULE | 2021-06-03 |
20210167006 | HYBRID LOW RESISTANCE METAL LINES | 2021-06-03 |
20210167007 | REDISTRIBUTION STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 2021-06-03 |
20210167008 | WIRE INTERCONNECT STRUCTURE OF INTEGRATED CIRCUIT | 2021-06-03 |
20210167009 | INTEGRATED FILLER CAPACITOR CELL DEVICE AND CORRESPONDING MANUFACTURING METHOD | 2021-06-03 |
20210167010 | SEMICONDUCTOR DEVICES INCLUDING CONTACTS AND CONDUCTIVE LINE INTERFACES WITH CONTACTING SIDEWALLS | 2021-06-03 |
20210167011 | Integrated Fan-Out Package with 3D Magnetic Core Inductor | 2021-06-03 |
20210167012 | SEMICONDUCTOR DEVICE | 2021-06-03 |
20210167013 | Power Distribution | 2021-06-03 |
20210167014 | APPARATUS AND METHOD TO INCREASE EFFECTIVE CAPACITANCE WITH LAYOUT STAPLES | 2021-06-03 |
20210167015 | DIE INTERCONNECT STRUCTURES AND METHODS | 2021-06-03 |
20210167016 | ELECTRONIC DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2021-06-03 |
20210167017 | SEMICONDUCTOR PACKAGE INCLUDING AN INTERPOSER | 2021-06-03 |
20210167018 | 3DIC Architecture with Interposer or Bonding Dies | 2021-06-03 |
20210167019 | METAL INTERCONNECTS, DEVICES, AND METHODS | 2021-06-03 |
20210167020 | APPARATUS INCLUDING A DIELECTRIC MATERIAL IN A CENTRAL PORTION OF A CONTACT VIA, AND RELATED METHODS, MEMORY DEVICES AND ELECTRONIC SYSTEMS | 2021-06-03 |
20210167021 | Graphene Diffusion Barrier | 2021-06-03 |
20210167022 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES, CORRESPONDING APPARATUS AND SEMICONDUCTOR DEVICE | 2021-06-03 |
20210167023 | INTEGRATED CIRCUIT PACKAGES WITH CONDUCTIVE ELEMENT HAVING CAVITIES HOUSING ELECTRICALLY CONNECTED EMBEDDED COMPONENTS | 2021-06-03 |
20210167024 | PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME | 2021-06-03 |
20210167025 | SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, METHOD OF MANUFACTURING MOTHERBOARD, MASK AND EVAPORATION DEVICE | 2021-06-03 |
20210167026 | SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | 2021-06-03 |
20210167027 | Semiconductor Package | 2021-06-03 |
20210167028 | ARRANGEMENT OF BOND PADS ON AN INTEGRATED CIRCUIT CHIP | 2021-06-03 |
20210167029 | ASSORTMENT OF SUBSTRATES FOR SEMICONDUCTOR CIRCUITS, CORRESPONDING ASSORTMENT OF DEVICES AND METHOD | 2021-06-03 |
20210167030 | SEMICONDUCTOR DEVICE ASSEMBLY WITH DIE SUPPORT STRUCTURES | 2021-06-03 |
20210167031 | RF DEVICES WITH ENHANCED PERFORMANCE AND METHODS OF FORMING THE SAME | 2021-06-03 |
20210167032 | Method for Manufacturing Semiconductor Package with Connection Structures Including Via Groups | 2021-06-03 |
20210167033 | SEMICONDUCTOR DIES HAVING ULTRA-THIN WAFER BACKMETAL SYSTEMS, MICROELECTRONIC DEVICES CONTAINING THE SAME, AND ASSOCIATED FABRICATION METHODS | 2021-06-03 |
20210167034 | CHIP ARRANGEMENTS | 2021-06-03 |
20210167035 | METHOD AND APPARATUS FOR CREATING A BOND BETWEEN OBJECTS BASED ON FORMATION OF INTER-DIFFUSION LAYERS | 2021-06-03 |
20210167036 | SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL LAYER ARRANGED THEREON | 2021-06-03 |
20210167037 | SYSTEMS AND METHODS FOR HIERARCHICAL EXPOSURE OF AN INTEGRATED CIRCUIT HAVING MULTIPLE INTERCONNECTED DIE | 2021-06-03 |
20210167038 | DUAL IN-LINE MEMORY MODULE | 2021-06-03 |
20210167039 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-06-03 |
20210167040 | SEMICONDUCTOR PACKAGE | 2021-06-03 |
20210167041 | SEMICONDUCTOR MEMORY DEVICE | 2021-06-03 |
20210167042 | SEMICONDUCTOR DEVICE SUB-ASSEMBLY | 2021-06-03 |
20210167043 | METHOD OF MANUFACTURING DISPLAY DEVICE | 2021-06-03 |
20210167044 | DISPLAY UNIT, DISPLAY APPARATUS, AND DISPLAY UNIT MANUFACTURING METHOD | 2021-06-03 |
20210167045 | DRIVING SUBSTRATE AND MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE | 2021-06-03 |
20210167046 | SURFACE-EMITTING LIGHT SOURCE AND METHOD OF MANUFACTURING THE SAME | 2021-06-03 |
20210167047 | DISPLAY APPARATUS | 2021-06-03 |
20210167048 | LIGHT-EMITTING MODULE | 2021-06-03 |
20210167049 | LIGHT EMITTING DIODE PACKAGE STRUCTURE | 2021-06-03 |
20210167050 | LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE LIGHT EMITTING ELEMENT | 2021-06-03 |
20210167051 | Electronics Card Including Multi-Chip Module | 2021-06-03 |
20210167052 | LIGHT EMITTING DEVICE | 2021-06-03 |
20210167053 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-06-03 |
20210167054 | SEMICONDUCTOR PACKAGE | 2021-06-03 |
20210167055 | MICRO LED DISPLAY WITH PRINTED CIRCUIT BOARD ASSEMBLY | 2021-06-03 |
20210167056 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE | 2021-06-03 |
20210167057 | LOGIC DRIVE BASED ON STANDARDIZED COMMODITY PROGRAMMABLE LOGIC SEMICONDUCTOR IC CHIPS | 2021-06-03 |
20210167058 | SEMICONDUCTOR DIE ASSEMBLIES HAVING MOLDED UNDERFILL STRUCTURES AND RELATED TECHNOLOGY | 2021-06-03 |
20210167059 | INTEGRATED CIRCUIT DEVICE | 2021-06-03 |
20210167060 | PROTECTION CIRCUIT | 2021-06-03 |
20210167061 | NITRIDE SEMICONDUCTOR DEVICE | 2021-06-03 |
20210167062 | MICROELECTRONIC DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE | 2021-06-03 |
20210167063 | SEMICONDUCTOR DEVICES | 2021-06-03 |
20210167064 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING THE SAME | 2021-06-03 |
20210167065 | SEMICONDUCTOR STRUCTURE HAVING GATE-ALL-AROUND DEVICES | 2021-06-03 |
20210167066 | METAL SPACE CENTERED STANDARD CELL ARCHITECTURE TO ENABLE HIGHER CELL DENSITY | 2021-06-03 |
20210167067 | MEMORY DEVICE AND SEMICONDUCTOR DEVICE | 2021-06-03 |
20210167068 | MEMORY DEVICE | 2021-06-03 |
20210167069 | NON-VOLATILE MEMORY ELEMENTS WITH ONE-TIME OR MULTIPLE-TIME PROGRAMMABILITY | 2021-06-03 |
20210167070 | MEMORY CELL STRUCTURE | 2021-06-03 |
20210167071 | SEMICONDUCTOR DEVICE | 2021-06-03 |
20210167072 | 3D MEMORY DEVICE COMPRISING SRAM TYPE MEMORY CELLS WITH ADJUSTABLE BACK-BIAS | 2021-06-03 |
20210167073 | FEFET WITH EMBEDDED CONDUCTIVE SIDEWALL SPACERS AND PROCESS FOR FORMING THE SAME | 2021-06-03 |
20210167074 | OPERATING METHOD OF AN ELECTRICALLY ERASABLE PROGRAMMABLE READ ONLY MEMORY (EEPROM) CELL | 2021-06-03 |
20210167075 | STACKED NEURAL DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-06-03 |
20210167076 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | 2021-06-03 |
20210167077 | STACKED NEURAL DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-06-03 |
20210167078 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2021-06-03 |