23rd week of 2014 patent applcation highlights part 48 |
Patent application number | Title | Published |
20140154858 | AREA-EFFICIENT CAPACITOR USING CARBON NANOTUBES - An on-chip decoupling capacitor is disclosed. One or more carbon nanotubes are coupled to a first electrode of the capacitor. A dielectric skin is formed on the one or more carbon nanotubes. A metal coating is formed on the dielectric skin. The dielectric skin is configured to electrically isolate the one or more carbon nanotubes from the metal coating. | 2014-06-05 |
20140154859 | Methods and Vehicles for High Productivity Combinatorial Testing of Materials for Resistive Random Access Memory Cells - Provided are methods for processing different materials on the same substrate for high throughput screening of multiple ReRAM materials. A substrate may be divided into multiple site isolated regions, each region including one or more base structures operable as bottom electrodes of ReRAM cells. Different test samples may be formed over these base structures in a combinatorial manner. Specifically, each site isolated region may receive a test sample that has a different characteristic than at least one other sample provided in another region. The test samples may have different compositions and/or thicknesses or be deposited using different techniques. These different samples are then etched in the same operation to form portions of the samples. Each portion is substantially larger than the corresponding base structure and fully covers this base structure to protect the interface between the base structure and the portion during etching. | 2014-06-05 |
20140154860 | Memory Cells, Methods of Forming Memory Cells, and Methods of Programming Memory Cells - Some embodiments include methods in which a memory cell is formed to have programmable material between first and second access lines, with the programmable material having two compositionally different regions. A concentration of ions and/or ion-vacancies may be altered in at least one of the regions to change a memory state of the memory cell and to simultaneously form a pn diode. Some embodiments include memory cells having programmable material with two compositionally different regions, and having ions and/or ion-vacancies diffusible into at least one of the regions. The memory cell has a memory state in which the first and second regions are of opposite conductivity type relative to one another. | 2014-06-05 |
20140154861 | Semiconductor Constructions, Memory Arrays, Methods of Forming Semiconductor Constructions and Methods of Forming Memory Arrays - Some embodiments include methods of forming semiconductor constructions. Carbon-containing material is formed over oxygen-sensitive material. The carbon-containing material and oxygen-sensitive material together form a structure having a sidewall that extends along both the carbon-containing material and the oxygen-sensitive material. First protective material is formed along the sidewall. The first protective material extends across an interface of the carbon-containing material and the oxygen-sensitive material, and does not extend to a top region of the carbon-containing material. Second protective material is formed across the top of the carbon-containing material, with the second protective material having a common composition to the first protective material. The second protective material is etched to expose an upper surface of the carbon-containing material. Some embodiments include semiconductor constructions, memory arrays and methods of forming memory arrays. | 2014-06-05 |
20140154862 | UNIFORM CRITICAL DIMENSION SIZE PORE FOR PCRAM APPLICATION - A memory cell and a method of making the same, that includes insulating material deposited on a substrate, a bottom electrode formed within the insulating material, a plurality of insulating layers deposited above the bottom electrode and at least one of which acts as an intermediate insulating layer. A via is defined in the insulating layers above the intermediate insulating layer. A channel is created for etch with a sacrificial spacer. A pore is defined in the intermediate insulating layer. All insulating layers above the intermediate insulating layer are removed, and the entirety of the remaining pore is filled with phase change material. An upper electrode is formed above the phase change material. | 2014-06-05 |
20140154863 | METHOD OF FORMING SEMICONDUCTOR DEVICE - A method of forming semiconductor device includes forming a landing pad, forming a stopping insulating layer on the landing pad, forming a lower molding layer including a first material on the stopping insulating layer, forming an upper molding layer including a second material different from the first material on the lower molding layer, forming a hole vertically passing through the upper molding layer and the lower molding layer and exposing the landing pad, forming a first electrode in the hole, removing the upper molding layer to expose a part of a surface of the first electrode, removing the lower molding layer to expose another part of the surface of the first electrode, forming a capacitor dielectric layer on the exposed parts of the surface of the first electrode, and forming a second electrode on the dielectric layer. | 2014-06-05 |
20140154864 | CRACK STOP STRUCTURE AND METHOD FOR FORMING THE SAME - The present invention in a first aspect proposes a semiconductor structure with a crack stop structure. The semiconductor structure includes a matrix, an integrated circuit and a scribe line. The matrix includes a scribe line region and a circuit region. The integrated circuit is disposed within the circuit region. The scribe line is disposed within the scribe line region and includes a crack stop trench which is disposed in the matrix and adjacent to the circuit region. The crack stop trench is parallel with one side of the circuit region and filled with a composite material in the form of a grid to form a crack stop structure. | 2014-06-05 |
20140154865 | SHALLOW TRENCH ISOLATION STRUCTURES - Shallow trench isolation structures are provided for use with UTBB (ultra-thin body and buried oxide) semiconductor substrates, which prevent defect mechanisms from occurring, such as the formation of electrical shorts between exposed portions of silicon layers on the sidewalls of shallow trench of a UTBB substrate, in instances when trench fill material of the shallow trench is subsequently etched away and recessed below an upper surface of the UTBB substrate. | 2014-06-05 |
20140154866 | Method of Forming a Semiconductor Memory Device - A semiconductor memory device includes a semiconductor substrate defining active regions partitioned by an isolation region, conductive lines spaced apart from each other and crossing the active regions over the semiconductor substrate, a thin film pattern formed on a top portion of the conductive lines having opening portions exposing part of the conductive lines in a width wider than a width of the conductive lines, an insulating layer filling the opening portions and formed over the thin film pattern, and an air gap formed between the conductive lines below the insulating layer and the thin film pattern. | 2014-06-05 |
20140154867 | METHOD FOR PERMANENTLY BONDING WAFERS BY A CONNECTING LAYER BY MEANS OF SOLID STATE DIFFUSION OR PHASE TRANSFORMATION - A method for bonding of a first solid substrate to a second solid substrate which contains a first material with the following steps, especially the following sequence: formation or application of a function layer which contains a second material to the second solid substrate, making contact of the first solid substrate with the second solid substrate on the function layer, pressing together the solid substrates for forming a permanent bond between the first and second solid substrate, at least partially reinforced by solid diffusion and/or phase transformation of the first material with the second material, an increase of volume on the function layer being caused. | 2014-06-05 |
20140154868 | WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY ADHERING MATERIAL FOR PROCESSING WAFER, AND MANUFACTURING METHOD OF THIN WAFER - A wafer processing laminate, a wafer processing member, a temporary adhering material for processing a wafer, and a method for manufacturing a thin wafer, which facilitates to establish a temporary adhering the wafer and the support, enables to form a layer of uniform thickness on a heavily stepped substrate, and is compatible with the TSV formation and wafer back surface interconnect forming steps, and the wafer processing laminate includes a support, a temporary adhesive material layer formed thereon and a wafer laminated on the temporary adhesive material layer, where the wafer has a circuit-forming front surface and a back surface to be processed, wherein the temporary adhesive material layer includes a three-layered structure composite temporary adhesive material layer. | 2014-06-05 |
20140154869 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma processing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing a cover ring above the work piece, the cover ring having at least one perforated region, and at least one non-perforated region; generating a plasma using the plasma source; and processing the work piece using the generated plasma. | 2014-06-05 |
20140154870 | METHOD OF MANUFACTURING SEMICONDUCTOR WAFERS - A method of manufacturing semiconductor wafers is provided which facilitates formation of orientation flat lines and allows beveling work without problems. | 2014-06-05 |
20140154871 | METHOD AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is provided. The method contains steps of providing the semiconductor device including a working area; directing a medium flow onto the working area; configuring a lens in contact with the medium flow; and directing a laser beam to the working area through the lens and the medium flow. A laser processing for manufacturing a semiconductor device is also provided. | 2014-06-05 |
20140154872 | DISLOCATION ENGINEERING USING A SCANNED LASER - A method for generating patterned strained regions in a semiconductor device is provided. The method includes directing a light-emitting beam locally onto a surface portion of a semiconductor body; and manipulating a plurality of dislocations located proximate to the surface portion of the semiconductor body utilizing the light-emitting beam, the light-emitting beam being characterized as having a scan speed, so as to produce the patterned strained regions. | 2014-06-05 |
20140154873 | DISLOCATION ENGINEERING USING A SCANNED LASER - A system for manipulating dislocations on semiconductor devices, includes a moveable laser configured to generate a laser beam locally on a surface portion of the semiconductor body having a plurality of dislocations, the moveable laser being characterized as having a scan speed, the moveable laser manipulates the plurality of dislocations on the surface portion of the semiconductor body by adjusting the temperature and the scan speed of the laser beam. | 2014-06-05 |
20140154874 | METHOD OF MAKING SEMICONDUCTOR MATERIALS AND DEVICES ON SILICON SUBSTRATE - A crystalline structure comprising a substrate, which has a surface. The surface has one or more wells formed therein defining one or more growing area and at least one layer of dissimilar crystalline material epitaxially grown on the growing area. A method of making a crystalline structure having a low threading dislocation density comprising the steps of (a) patterning a surface of a substrate material such that one or more wells defining a growing area is formed therein; and (b) epitaxially growing at least one strained layer of dissimilar crystalline material on the growing area of the surface of the substrate material, such that the threading dislocation density of the at least one strained layer is reduced by the one or more wells. | 2014-06-05 |
20140154875 | METHOD OF EPITAXIAL GERMANIUM TIN ALLOY SURFACE PREPARATION - Methods of preparing a clean surface of germanium tin or silicon germanium tin layers for subsequent deposition are provided. An overlayer of Ge, doped Ge, another GeSn or SiGeSn layer, a doped GeSn or SiGeSn layer, an insulator, or a metal can be deposited on a prepared GeSn or SiGeSn layer by positioning a substrate with an exposed germanium tin or silicon germanium tin layer in a processing chamber, heating the processing chamber and flowing a halide gas into the processing chamber to etch the surface of the substrate using either thermal or plasma assisted etching followed by depositing an overlayer on the substantially oxide free and contaminant free surface. Methods can also include the placement and etching of a sacrificial layer, a thermal clean using rapid thermal annealing, or a process in a plasma of nitrogen trifluoride and ammonia gas. | 2014-06-05 |
20140154876 | MECHANISMS FOR FORMING STRESSOR REGIONS IN A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes performing a pre-amorphous implantation (PAI) process to form an amorphized region on a substrate. The method also includes forming a stress film over the substrate, and performing an annealing process to recrystallize the amorphized region after the stress film is formed. The method further includes forming a recess region on the substrate. The recess region overlies the recrystallized region. The method additionally includes forming an epitaxial stress-inducing material in the recess region. | 2014-06-05 |
20140154877 | METHODS FOR FABRICATING INTEGRATED CIRCUITS HAVING LOW RESISTANCE METAL GATE STRUCTURES - Methods for fabricating integrated circuits having low resistance metal gate structures are provided. One method includes forming a metal gate stack in a FET trench formed in a FET region. The metal gate stack is etched to form a recessed metal gate stack and a recess. The recess is defined by sidewalls in the FET region and is disposed above the recessed metal gate stack. A liner is formed overlying the sidewalls and the recessed metal gate stack and defines an inner cavity in the recess. A copper layer is formed overlying the liner and at least partially fills the inner cavity. The copper layer is etched to expose an upper portion of the liner while leaving a copper portion disposed in a bottom portion of the inner cavity. Copper is electrolessly deposited on the copper portion to fill a remaining portion of the inner cavity. | 2014-06-05 |
20140154878 | NOR FLASH DEVICE MANUFACTURING METHOD - An embodiment of a NOR Flash device manufacturing method is disclosed, which includes: providing a substrate having a first polycrystalline silicon layer disposed thereon; forming a first hard mask layer on the first polycrystalline silicon layer; etching the first hard mask layer to form a first opening, and cleaning a gas pipeline connected to an etching cavity before etching the first hard mask layer; forming a second hard mask layer on the first hard mask layer, and the second hard mask layer covers the bottom and side wall of the first opening; etching the second hard mask layer to form a second opening, the width of the second opening is smaller than the width of the first opening; etching the first polycrystalline silicon, forming a floating gate. The NOR Flash device manufacturing method of the present invention improves the yield of the NOR Flash device. | 2014-06-05 |
20140154879 | METHODS OF FORMING INTERCONNECTS AND SEMICONDUCTOR STRUCTURES - A method of activating a metal structure on an intermediate semiconductor device structure toward metal plating. The method comprises providing an intermediate semiconductor device structure comprising at least one first metal structure and at least one second metal structure on a semiconductor substrate. The at least one first metal structure comprises at least one aluminum structure, at least one copper structure, or at least one structure comprising a mixture of aluminum and copper and the at least one second metal structure comprises at least one tungsten structure. One of the at least one first metal structure and the at least one second metal structure is activated toward metal plating without activating the other of the at least one first metal structure and the at least one second metal structure. An intermediate semiconductor device structure is also disclosed. | 2014-06-05 |
20140154880 | Post-Polymer Revealing of Through-Substrate Via Tips - A method of forming semiconductor die includes forming a layer of polymer or a precursor of the polymer on a bottomside of a substrate having a topside including active circuitry and a bottomside, and a plurality of through-substrate-vias (TSVs). The TSVs have a liner including at least a dielectric liner and an inner metal core that extends to TSV tips that protrude from the bottomside. The layer of polymer or precursor and liner cover the plurality of TSV tips, and the layer of polymer or precursor is between the TSV tips on the bottomside. The polymer or precursor and the liner are removed from over a top of the TSV tips to reveal the inner metal core. | 2014-06-05 |
20140154881 | METHOD OF MANUFACTURING METAL SILICIDE AND SEMICONDUCTOR STRUCTURE USING THE SAME - A method of manufacturing a metal silicide is disclosed below. A substrate having a first region and a second region is provided. A silicon layer is formed on the substrate. A planarization process is performed to make the silicon layer having a planar surface. A part of the silicon layer is removed to form a plurality of first gates on the first region and to form a plurality of second gates on the second region. The height of the first gates is greater than the height of the second gates, and top surfaces of the first gates and the second gates have the same height level. A dielectric layer covering the first gates and the second gates is formed and exposes the top surfaces of the first gates and the second gates. A metal silicide is formed on the top surfaces of the first gates and the second gates. | 2014-06-05 |
20140154882 | METHODS FOR FABRICATING A SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device includes forming a device isolation layer pattern on a substrate to form an active region, the active region including a first contact forming region at a center p of the active region and second and third contact forming regions at edges of the active region, forming an insulating layer and a first conductive layer on the substrate, forming a mask pattern having an isolated shape on the first conductive layer, etching the first conductive layer and the insulating layer to expose the active region of the first contact forming region by using the mask pattern, to form an opening portion between pillar structures, forming a second conductive layer in the opening, and patterning the second conductive layer and the first preliminary conductive layer pattern to form a wiring structure contacting the first contact forming region and having an extended line shape. | 2014-06-05 |
20140154883 | TUNGSTEN NUCLEATION PROCESS TO ENABLE LOW RESISTIVITY TUNGSTEN FEATURE FILL - Methods for depositing low resistivity tungsten in features of substrates in semiconductor processing are disclosed herein. Methods involve using a germanium-containing reducing agent during tungsten nucleation layer deposition to achieve thin, low resistivity nucleation layers. | 2014-06-05 |
20140154884 | EROSION INHIBITOR FOR CHEMICAL MECHANICAL POLISHING, SLURRY FOR CHEMICAL MECHANICAL POLISHING, AND CHEMICAL MECHANICAL POLISHING METHOD - The present invention provides an erosion inhibitor for chemical mechanical polishing, which contains compound (a) having a molecular weight of not more than 100,000 and not less than 4 hydroxyl groups, and compound (b) having not less than 4 amino groups, and which has a mass ratio of the compound (a) and the compound (b) (the compound (a)/the compound (b)) of 0.10-500. | 2014-06-05 |
20140154885 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING DOUBLE PATTERNING TECHNOLOGY - Methods of fabricating semiconductor devices and semiconductor devices fabricated thereby are provided. Two photolithography processes and two spacer processes are performed to provide final patterns that have a pitch that is smaller than a limitation of photolithography process. Furthermore, since initial patterns are formed to have line and pad portions simultaneously by performing a first photolithography process, there is no necessity to perform an additional photolithography process for forming the pad portion. | 2014-06-05 |
20140154886 | Methods of Processing Semiconductor Substrates In Forming Scribe Line Alignment Marks - A method of processing a semiconductor substrate in forming scribe line alignment marks includes forming pitch multiplied non-circuitry features within scribe line area of a semiconductor substrate. Individual of the features, in cross-section, have a maximum width which is less than a minimum photolithographic feature dimension used in lithographically patterning the substrate. Photoresist is deposited over the features. Such is patterned to form photoresist blocks that are individually received between a respective pair of the features in the cross-section. Individual of the features of the respective pairs have a laterally innermost sidewall in the cross-section. Individual of the photoresist blocks have an opposing pair of first pattern edges in the cross-section that are spaced laterally inward of the laterally innermost sidewalls of the respective pair of the features. Individual of the photoresist blocks have an opposing pair of second pattern edges in the cross-section that self-align laterally outward of the first pattern edges to the laterally innermost sidewalls of the features during the patterning. | 2014-06-05 |
20140154887 | SEMICONDUCTOR DEVICE PROCESSING TOOLS AND METHODS FOR PATTERNING SUBSTRATES - In some embodiments, an electronic device processing system is provided that includes a processing tool having a first subsystem configured to carry out a first subset of processes on a substrate having pattern features, the first subsystem including a first conformal deposition chamber and a first etch chamber. The processing tool includes a second subsystem coupled to the first subsystem and configured to carry out a second subset of processes on the substrate, the second subsystem including a second conformal deposition chamber and a second etch chamber. The processing tool is configured to employ the first and second subsystems to perform pitch division on the substrate within the processing tool so as to form a reduced-pitch pattern on the substrate. Numerous other embodiments are provided. | 2014-06-05 |
20140154888 | SHOWERHEAD ELECTRODE ASSEMBLIES FOR PLASMA PROCESSING APPARATUSES - Showerhead electrode assemblies are disclosed, which include a showerhead electrode adapted to be mounted in an interior of a vacuum chamber; an optional backing plate attached to the showerhead electrode; a thermal control plate attached to the backing plate or to the showerhead electrode at multiple contact regions across the backing plate; and at least one interface member separating the backing plate and the thermal control plate, or the thermal control plate and showerhead electrode, at the contact regions, the interface member having a thermally and electrically conductive gasket portion and a particle mitigating seal portion. Methods of processing semiconductor substrates using the showerhead electrode assemblies are also disclosed. | 2014-06-05 |
20140154889 | DRY-ETCH FOR SELECTIVE TUNGSTEN REMOVAL - Methods of selectively etching tungsten relative to silicon-containing films (e.g. silicon oxide, silicon carbon nitride and (poly)silicon) as well as tungsten oxide are described. The methods include a remote plasma etch formed from a fluorine-containing precursor and/or hydrogen (H | 2014-06-05 |
20140154890 | PERIPHERY COATING APPARATUS, PERIPHERY COATING METHOD AND STORAGE MEDIUM THEREFOR - A periphery coating unit performs a scan-in process of moving a resist liquid nozzle | 2014-06-05 |
20140154891 | Beam Delivery Systems for Laser Processing Materials and Associated Methods - Devices, systems, and methods for laser processing semiconductor materials are provided. In one aspect, a system for uniformly laser irradiating at least one wafer can include a wafer platter operable to receive and support a one or more wafers, a rotational movement system coupled to the wafer platter, the rotational movement system being operable to rotate the wafer platter in at least one of a clockwise or a counter clockwise direction, and a linear movement system coupled to the wafer platter and operable to move the wafer platter along one or more linear axes. The system can also include a laser source oriented to deliver laser radiation onto a wafer supported by the wafer platter at a fixed angle relative to the surface of the wafer, where the rotational movement system and the linear movement system are operable to maintain the fixed angle across the entirety of the wafer surface. | 2014-06-05 |
20140154892 | ELECTRICAL CONNECTORS FOR USE WITH PRINTED CIRCUIT BOARDS - A connector for electrically connecting a conductor to a first printed circuit board (PCB) or for electrically connecting a first and second PCB together. A housing is adapted to be slidably moveable relative to a mounting structure to allow the mounting of the PCB to the surface and moveable over the PCB to contact pads located on the top side of the PCB. In another example, a bridging connector for electrically connecting a first PCB with a second PCB includes a resilient holding element, such as for example a spring clip, engageable with at least one of the PCBs and/or a surface supporting the PCB(s) to releasably retain the housing and the terminals in the correct location. | 2014-06-05 |
20140154893 | ELECTRICAL CONNECTOR AND METHOD OF MAKING IT - The present invention is an electrical connector in which a substrate (such as a printed circuit board or PCB) includes a plurality of apertures (or vias) and some of those apertures are filled with two materials to improve the characteristics of the electrical interconnection. The preferred process of crating the filled vias includes the steps of plating the vias with an electrically-conductive material to create an electrically-conductive path between portions of the substrate and components associated with the substrate and partially filling the apertures, then filling at least a portion of the apertures or vias with a second or different filling material to seal at least apart of the electrically conductive path through the plating. The second filling material may be chosen to provide thermal compensation for the connection. | 2014-06-05 |
20140154894 | Method and Device for Producing an Electric Contact Sensor Plate - A method for producing an electric contact sensor plate and for populating an electric or electronic module with the contact sensor plate in an automated manner is provided. An end piece of a metal foil strip is fed in a feeding step, in which the contact sensor plate is positioned on the electric or electronic module in a positioning step, and in which the contact sensor plate is fastened on the electric or electronic module in a fastening step. The method is characterized in that the contact sensor plate is produced by being severed from the foil strip in a severing step that follows the feeding step and precedes the positioning step. | 2014-06-05 |
20140154895 | HIGH DENSITY HIGH SPEED DATA COMMUNICATIONS CONNECTOR - An outlet that includes first and second substrates, and a plurality of electrical contacts. The first substrate includes an electrical circuit adjacent to and spaced apart from a first ground plane. Each of the electrical contacts is connected to the circuit. The second substrate includes a second ground plane electrically connected to the first ground plane. The circuit is spaced apart from the second ground plane. The electrical contacts are positioned adjacent to the first and second substrates. Together the first and second ground planes may form a localized, electrically floating, isolated ground plane. The outlet may be connected to a cable and/or configured to be mounted to a panel for use with a rack. The outlet may be implemented as a Category 7A and/or Next Generation type outlet having an overall height that allows two rows of twenty-four like outlets to be mounted within one rack unit (“1RU”). | 2014-06-05 |
20140154896 | ELECTRICAL JUNCTION BOX - There is provided an electrical junction box which can prevent water from entering from an insertion portion for the long term and which can be assembled easily. The electrical junction box includes a frame, a lower cover and an insertion portion through which a bundle of electric wires is passed. The insertion portion includes an insertion portion first divided piece having a semicircular cross-section and integrally formed with the frame and an insertion portion second divided piece having a semicircular cross-section and integrally formed with the lower cover via a hinge portion. In an unloaded condition, the insertion portion second divided piece is positioned at a location farthest from the insertion portion first divided piece. The divided pieces are provided with binding band insertion portions through which a binding band is passed. | 2014-06-05 |
20140154897 | ELECTRICAL JUNCTION BOX - An electrical junction box includes: a case main body to which a bolt is attached; a terminal of which one end is provided with a bolt insertion portion, of which the other end is provided with a wire connection portion, and of which the center is provided with a bent portion bent at right angle; two electric wires connected to the wire connection portion; and a side cover to which the terminal is attached. When the side cover is mounted on one side surface of the case main body, the bolt is inserted into the bolt insertion portion. The side cover is provided with a wire fixing piece having an arc-like sectional shape and extended along the one electric wire. The two electric wires are wound together with the wire fixing piece by a tape, and fixed to the wire fixing piece. | 2014-06-05 |
20140154898 | ELECTRICAL CENTER AND CONNECTOR ASSEMBLY SYSTEM - An electrical junction box has a connector retainer assembly with a first contact surface, as well as a connector housing assembly with a pivotal lever arm. The lever arm has a first engagement surface. The connector retainer assembly and the connector housing assembly configured so that when the lever arm is moved in a single direction relative to the connector housing assembly, the first engagement surface engages the first contact surface and the connector housing assembly moves relative to the connector retainer assembly from a pre-staged position to an assembled position. | 2014-06-05 |
20140154899 | FLEXIBLE DIRECT OR USB PLUG-IN PLATFORM FOR FOLDABLE OR FLEXIBLE ELECTRONICS - An apparatus comprises a flexible circuit substrate that includes a body portion and at least one connector portion formed monolithically with the body portion. The connector portion is shaped by at least one of one or more bends of the flexible circuit substrate or one or more folds of the flexible circuit substrate, and the connector portion is configured to be received in a receptacle of a connector device. The apparatus also includes at least one electrode formed on the connector portion and configured to make electrical contact with an electrical conductor of the receptacle of the connector device, at least one electronic component on the flexible circuit substrate, and interconnect to provide electrical continuity from the electrode to the electronic component. | 2014-06-05 |
20140154900 | CIRCUIT BOARD ASSEMBLY - A circuit board assembly comprises a first circuit board and a second circuit board. A connector socket is mounted on the first circuit board, and a connector plug is mounted on the second circuit board. A handle assembly is attached to either the first circuit board or the second circuit board. The handle assembly comprises a base member attached to either the first circuit board or the second circuit board and first and second rotating members pivotably attached to opposite ends of the base member. When the first rotating member and the second rotating member are rotated away from the base member, the connector plug is disengaged from the connector socket. When the first rotating member and the second rotating member are rotated towards the base member, the connector plug is inserted into the connector socket. | 2014-06-05 |
20140154901 | SPARK PLUG CONNECTOR - A spark plug connector ( | 2014-06-05 |
20140154902 | CONNECTOR PORT WITH PORT COVER AND ELECTRONIC DEVICE USING SAME - A connector port for mounting in a housing of an electronic device is illustrated. The connector port includes a shell defining an accessing hole having an opening, a port cover movably retained in the accessing hole, and a resilient element. The shell includes a plurality of spaced contact pins exposed in the accessing hole. One end of the resilient element is arranged adjacent to the port cover for maintaining the port cover at the opening of the accessing hole when the resilient element is in a natural state. | 2014-06-05 |
20140154903 | SIM CARD SEAT AND MOBILE TERMINAL - The present disclosure provides a SIM card seat and a mobile terminal, which belongs to the electronic technical field. The SIM card seat is used for receiving a SIM card, which comprises a housing, a signal conducting terminal, a card holder and a ejector. The signal conducting terminal is disposed on the motherboard. A receiving space is formed between an area of the motherboard where the signal conducting terminal is located and the housing, which is used for receiving the card holder and ejector. The card holder is used for receiving the SIM card and matching different types of SIM cards. The ejector is used for ejecting the card holder out of the receiving space. The mobile terminal comprises the SIM card seat. The SIM card seat according to the present disclosure can match different types of SIM cards by changing the card holder, thus the mobile terminal having the SIM card can match various SIM cards accordingly. Therefore, it is not required for the user to change the SIM card to match various mobile phones, which is convenient for the user, and reduces waste of resources. | 2014-06-05 |
20140154904 | MECHATRONIC PLUG-IN CONNECTOR SYSTEM - A mechatronic plug-in connector system having a main contact and an auxiliary contact which lags during an unplugging operation and with a semiconductor electronic which is series-connected to the auxiliary contact and is parallel-connected to the main contact for extinguishing an arc produced during the unplugging operation, wherein the semiconductor electronic has two series-connected semiconductor switches and an energy accumulator which is connected to the semiconductor switches and which for charging taps the arc voltage produced between the semiconductor switches during the unplugging operation. The invention further relates to a multiple plug system having at least two plug-in connectors each having a main contact and a lagging auxiliary contact and with a semiconductor electronic which is common to the plug-in connectors and is series-connected to each of the auxiliary contacts via a diode. | 2014-06-05 |
20140154905 | MULTI-CONNECTOR POWER OR POWER AND SIGNAL TRANSMISSION CABLE - A multi-connector power or power and signal transmission cable includes a connection cable, a first connection head connected to one end of the connection cable and at least one connector to mate with the first connection head. The first connection head includes a first plug at a front end thereof. The connector includes a second plug and a socket at front and rear ends thereof. The first plug is detachably connected to the socket of the connector. The connector includes a connection arm thereon. The connection arm has a protruding block at a distal end thereof. The first connection head has a pivot hole for connection of a rotation disc. The rotation disc includes a rotation axle and a receiving hole on the top end of the rotation axle. The connection arm of the connector is detachably connected to the receiving hole of the first connection head. | 2014-06-05 |
20140154906 | Connector for Preventing Unlocking - Disclosed is a connector for preventing unlocking which includes a signal pin transferring a signal; a body into which the signal pin is inserted and which is electrically isolated from the signal pin; a first housing having a hollow portion into which one end of the body is inserted, a thread groove and at least one protruding portion or a plurality of fixing grooves formed at an inner circumferential surface of the other end thereof; and a second housing having a hollow portion into which the other body end is inserted and through which the second housing is moved along an outer circumferential surface of the body in an axial direction. | 2014-06-05 |
20140154907 | CONNECTOR PRODUCING A BIASING FORCE - A connector includes, in one embodiment, a post, a coupling element configured to engage the post, and a connector body configured to engage the post. The connector body, in one embodiment, is configured to produce a biasing force. | 2014-06-05 |
20140154908 | MODULE EDGE GROUNDING CABLE CLIPS - A clip assembly includes a first clip comprising two opposing contact surfaces connected by a U-shaped hinge, where each of the two opposing contact surfaces has protruding flanges with teeth for engaging a surface inserted between the flanges. The clip assembly further includes a second clip comprising two opposing contact surfaces connected by a U-shaped hinge, wherein each of the two opposing contact surfaces has protruding flanges with teeth for engaging a surface inserted between the flanges. The clip assembly also includes a wire connected to the first clip at one end of the wire and to the second clip at another end of the wire. | 2014-06-05 |
20140154909 | CABLE CONNECTOR SYSTEM - A cable connector system that comprises a first contact assembly that includes a housing and a first contact received in the housing, where the first contact has a cable termination portion and an interface portion that includes a first contact surface and a cap that has a first locking surface. A second contact assembly mates with the first contact assembly and includes a housing and a second contact that has a second contact surface configured to engage the first contact surface and the second contact being rotatable with respect to the first contact. A locking member that includes a second locking surface is configured to engage the first locking surface, wherein when the second locking surface engages the first locking surface, the first contact assembly is prevented from moving axially with respect to the second contact assembly while the first contact remains rotatable with the second contact. | 2014-06-05 |
20140154910 | ELECTRICAL CONNECTOR ASSEMBLY - An electrical connector assembly for mating with a mating connector includes a housing having spaced apart sidewalls and first and second slides slide slideably supported in the housing. The first and second slides each include at least one mating slot adapted to receive a mating portion of the mating connector and slideable with respect to the housing between a pre-staged position where the electrical connector is removable from the mating connector and an engaged position where said electrical connector assembly is locked to said mating connector. A slide assist lever is pivotally interconnected with the housing and each of the slides to move the slides between the pre-staged position and the engaged position such that recesses are formed in the housing with the slides when said slides are in the engaged position. The electrical connector assembly also includes an environmental cover positionable to substantially prevent debris from entering the recesses. | 2014-06-05 |
20140154911 | ELECTRICAL CONNECTOR AND SQUIB CONNECTION DEVICE - An electrical connector of the present invention is configured such that when abutting portions of leg portions of a support member are abutted against receiving faces of jutting portions of a retainer, and a connector housing at a first position is pressed toward the mating side, an elastic member undergoes elastic deformation. If the connector housing does not reach a second position, the connector housing returns to the first position by elastic restoring force of the elastic member. If the connector housing reaches the second position, the abutting portions move away from the receiving faces due to being pressed by pressing portions, the support member is pressed toward the mating side due to being subjected to the elastic restoring force of the elastic member, and the connector housing becomes relatively positioned at the first position. Also, a squib connection device of the present invention includes this electrical connector. | 2014-06-05 |
20140154912 | ADAPTER FRAME WITH INTEGRATED EMI AND ENGAGEMENT ASPECTS - A receptacle assembly with improved EMI leakage reduction and construction is described. The assembly includes a housing in the form of a guide frame that has a hollow interior which accommodates the insertion of an electronic module therein. A heat sink is provided to dissipate heat generated during operation of a module and the heat sink has a base portion that defines a ceiling of the hollow interior. An opening in the top of the guide frame provides an attachment location for the heat sink. A separately formed base plate is inserted into the housing and it defines a bottom of the interior of the housing. | 2014-06-05 |
20140154913 | RECEPTACLE CONNECTOR AND CONNECTOR ASSEMBLY - A receptacle connector comprises an insulative housing, a plurality of conductive terminals arranged in the insulative housing, a metal shell and a slide mechanism. The metal shell is engaged with the insulative housing to form a first mating space and an entrance for entering into the first mating space. The slide mechanism is provided in the metal shell and comprises a slide block and a reset resilient element connected to the slide block. The slide block can move between a front position close to the entrance and a rear position away from the entrance. When the slide block is positioned at the front position, an inner side face of the slide block and the metal shell together form a second mating space, and the slide block is capable of being pushed to move to the rear position to move out of the first mating space. | 2014-06-05 |
20140154914 | ENCLOSURE ASSEMBLY FOR A CONNECTOR, STRAIN RELIEF ELEMENT, AND METHOD - The invention relates to a mating enclosure having a flange, wherein the flange has a forward face, a rearward face, and a first outer perimeter, a central opening, wherein the central opening has a second outer perimeter contained within the first outer perimeter, at least one protrusion protruding substantially perpendicularly from the forward face of the flange, wherein the protrusion has an inner surface facing the central opening, an outer surface facing away from the central opening, and a forward surface facing in the same direction as the forward face of the flange, and at least one locking element positioned on the outer surface of the protrusion, wherein the locking element is at rest such that a distance between the outer perimeter of the flange and the locking element is less than a distance between the outer perimeter of the flange and the outer surface of the protrusion. | 2014-06-05 |
20140154915 | COMPRESSION METHOD FOR ELECTRIC WIRE AND ELECTRIC WIRE WITH TERMINAL OBTAINED THEREBY - An electric wire with terminal is provided to include: an inner terminal including a crimp part that is crimped to compress a conductor part of a covered electric wire; an outer terminal that is compressed to the inner terminal by a front part thereof and is compressed to the covered electric wire by a rear part thereof; and a waterproof seal sleeve that is attached to a tip of the conductor part of the covered electric wire, wherein the seal sleeve is crimped by the crimp part of the inner terminal. | 2014-06-05 |
20140154916 | WATERPROOF CONNECTOR - A waterproof connector includes a flat cable having an insulating sheath part in which a conductive wire is coated with an insulating film, a terminal connected to the conductive wire, and a connector housing fitted to a mating connector so as to connect the terminal to a mating terminal of the mating connector. The connector housing includes a mold part which is integrally formed with an end part in an extending direction of the flat cable and which covers a connecting part of the conductive wire and the terminal. The insulating sheath part has a pair of cut-out parts. The pair of cut-put parts are formed at positions which are covered with the connector housing and located at side end parts of the insulating sheath part opposed to each other in a transverse direction of the insulating sheath part. | 2014-06-05 |
20140154917 | ELECTRICAL CONNECTOR - An electrical connector includes a main housing, an inner housing assembled in the main housing, and a plurality of conductive terminals of which each has a fastening arm molded in the inner housing, a contact arm and a touching arm perpendicular to the contact arm. The contact arms are apart arranged along a transverse direction in front of the inner housing. The touching arms are apart arranged along a longitudinal direction at one side of the inner housing. In use, the touching arms of the conductive terminals are elastically against and further pressed downward by a circuit board to realize electrical connection with the circuit board. It is rather short-time and convenient for mounting the circuit board to the electrical connector. Moreover, the touching arms of the conductive terminals are easily removed from the circuit board for the convenience of replacing the electrical connector when it doesn't work. | 2014-06-05 |
20140154918 | ELECTRICAL CONNECTOR HAVING A PLURALITY OF ABSORBING MATERIAL BLOCKS - An electrical connector electrically connecting a chip module to a printed circuit board includes an insulative housing including a number of receiving slots and a number of passageways spaced with the receiving slot and located beside the receiving slot and a number of terminals each received in the receiving slot of the insulative housing, the electrical connector further includes a number of absorbing material blocks received in the passageways, the passageway has an inner surface coated with an metal layer and the absorbing material block is located inside the metal layer. | 2014-06-05 |
20140154919 | METHOD AND SYSTEM FOR IMPROVING CROSSTALK ATTENUATION WITHIN A PLUG/JACK CONNECTION AND BETWEEN NEARBY PLUG/JACK COMBINATIONS - This application describes a jack for improving crosstalk attenuation. The jack has a housing, a foil at least partially surrounding the housing, a printed circuit board, and at least one pair of insulation displacement contacts and vias. Each pair of insulation contacts and vias are associated with a differential signal. A conductive trace stub is routed on the printed circuit board near the edge of the board proximate to the foil in order to at least partially balance the coupling from one of the insulation displacement contacts and vias of a pair to the foil with the other insulation displacement contact and via of the pair by electrically connecting the trace stub to the via that is further from the foil. | 2014-06-05 |
20140154920 | CHOKE COIL DEVICES AND METHODS OF MAKING AND USING THE SAME - A chip choke assembly which reduces the loss of magnetic flux from the underlying core portions. In one embodiment, this reduction is achieved by producing a chip choke assembly comprised of two or more chip choke portions that collectively form a closed magnetic path. Additionally, the chip choke assembly disclosed herein also allows for adequate clearance between adjacent pads so as to avoid arcing during high potential voltage conditions. Methods for manufacturing and using the aforementioned chip choke assembly are also disclosed. | 2014-06-05 |
20140154921 | ACTIVE ELECTRICAL COMMUNICATION CABLE ASSEMBLY - An active electric cable assembly suitable for high speed communication (e.g., 10 Gbit/sec) between electronic devices, such as but not limited to a peripheral device (e.g., storage device, docking station, etc.) and a computing platform expansion bus. (e.g., supporting the standards and specifications associated with the trade name Thunderbolt®). In embodiments, through holes, embossments, mechanical stops, micro-coaxial single wires, thermal pads, and dielectric film sheets are utilized in a robust cable assembly. | 2014-06-05 |
20140154922 | F-Connector with Integrated Surge Protection - A connector ( | 2014-06-05 |
20140154923 | ELECTRICAL CONNECTOR AND METHOD OF MANUFACTURE - An electrical connector, including a shell, a housing and a plurality of metal terminals, configures a chamber that several ribs allocate the chamber with terminal recesses, a ramped portion being formed at the bottom of chamber, the terminals pass through terminal recesses in which the terminals are assembled amid housing, among the sections of the terminals, a contact section forming a engagement in front of the ramped portion of chamber. | 2014-06-05 |
20140154924 | CONDUCTIVE PLATE AND AN ELECTRONIC DEVICE HAVING THE SAME - An electronic device includes a casing that is formed with a battery slot, positive and negative power output terminals that are disposed in a wall of the battery slot, first and second batteries that are disposed in the battery slot, and a conductive plate that is clamped removably by electrode ends of the first and second batteries. The conductive plate includes a conductive body that has at least one contact for contact with one of the first and second batteries. | 2014-06-05 |
20140154925 | SOCKET AND ELECTRONIC COMPONENT MOUNTING STRUCTURE - A socket includes a plurality of coupling members that each include a first end portion and a second end portion, the coupling members being made of electrically conductive material, wherein a terminal of an electronic component and a terminal of a board are electrically coupled with the first end portion and the second end portion, respectively, so to electrically connect the terminal of the electronic component and the terminal of the board, a holding member that holds the plurality of coupling members in such a manner that the plurality of coupling members are not in contact with each other, the holding member being made form an electrical insulating material, and a sheet member that is in contact with the electronic component and the board in parts between the plurality of coupling members, the sheet member being made from a material which is electrical insulating and thermal diffusive. | 2014-06-05 |
20140154926 | ELECTRONIC CARD CONNECTOR AND ELECTRONIC DEVICE USING THE SAME - An electronic card connector for adapting an electronic card is provided. The electronic card connector includes a locking member having a block. The block can be received in a notch of a tray accommodating an electronic card, thereby holding the electronic card in position. The electronic card connector further includes a elastic ejection member to eject the tray out when the block disengages from the notch of the tray. The tray moves in a first direction, and the block moves in a second direction that is substantially perpendicular to the first direction. | 2014-06-05 |
20140154927 | CABLE CONNECTOR AND CABLE ASSEMBLY, AND METHOD OF MANUFACTURING CABLE ASSEMBLY - A cable connector and a cable assembly in which electrical characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which are easily connectable by reducing the number of parts, and a method of manufacturing the cable assembly are provided. Respective ground contacts and respective signal line contacts positioned between the respective ground contacts through a space are provided in a connector main body. Front-side arm portions and rear-side arm portions mutually extending toward the respective signal line contacts are integrally provided with end portions of the respective ground contacts protruded from a side wall portion of the connector main body. And, under a state that respective signal line conductors are arranged in the respective signal line contacts, an outer conductor is held by the front-side arm portions and the rear-side arm portions. | 2014-06-05 |
20140154928 | CABLE CONNECTOR AND CABLE ASSEMBLY, AND METHOD OF MANUFACTURING CABLE ASSEMBLY - Provided is a cable connector, a cable assembly, and a method of manufacturing the cable assembly, in which electric characteristics are stabilized by suppressing elastic deformation of a cable for differential signal transmission, and besides, which is easily connectable by reducing the number of parts. In a ground contact, an outer-conductor adhering portion which is protruded from a side wall portion of a connector main body and which is adhered with an outer conductor by a conductive adhesive is provided. In this manner, elastic deformation of a cable for differential signal transmission is suppressed, so that electric characteristics can be stabilized. Also, connecting work between the outer conductor and the ground contact can be simplified as reducing the number of parts. Further, the cable for differential signal transmission is not exposed to a high temperature of soldering or others, and therefore, thermal deformation thereof does not occur, either. | 2014-06-05 |
20140154929 | ELECTRICAL CONNECTOR - The present application relates to an electrical connector, the electrical connector is formed with a receiving space having an opening opened upwardly, the electrical connector comprises an insulative body, a plurality of terminals and a metal shell. The terminals are fixed to the insulative body. The metal shell is mounted to the insulative body. The metal shell comprises a resilient piece, the resilient piece protrudedly extends toward the receiving space, a distal end of the resilient piece comprises a first tab and a second tab, the first tab and the second tab extend downwardly respectively, the first tab is offset toward inside of the receiving space relative to the second tab, and an end edge of the second tab is lower than an end edge of the first tab. | 2014-06-05 |
20140154930 | APPARATUSES AND METHODS FOR A PLUG CONNECTOR - A plug connector has a housing and a plurality of metallic plug connections in the housing together with a plurality of contact feet which project from the bottom face of the housing in order to make electrical contact and be mechanically fixed to a support of a heating apparatus which is electrically connected to the plug connector. A contact foot has a U-shaped foot end with two limbs and with a cutout in-between, an upper limb merging with the contact foot, and a lower limb being provided on that side which faces away from the housing. | 2014-06-05 |
20140154931 | Electrical Connector - An electrical connector includes a housing, a first terminal, and a first lock. The housing includes a first receiving chamber and first recess positioned adjacent to the first receiving chamber. The first terminal is insertable into the first receiving chamber. The lock is securable to the housing and includes a horizontal base plate, a first pressing rod extending downward from the horizontal base plate and insertable into the first receiving chamber to press against the first terminal, and a first rotation prevention member extending downward from the horizontal base plate and insertable into the first recess to mate with the recess in a substantially gapless manner. | 2014-06-05 |
20140154932 | SOCKET - A socket includes a tubular frame body into which a base part of an electric lamp bulb is to be inserted, the frame body in which a terminal metal fitting to be electrically connected with the base part is to be provided, the frame body having a side wall formed with two slits and formed with an arm piece between the slits, the arm piece which has a first face to be opposed to the terminal metal fitting and a second face opposite to the first face, the side wall formed with a butting face, when the arm piece is deformed outward of the frame body, a part of the second face of the arm piece is in contact with the butting face. | 2014-06-05 |
20140154933 | POWER LINE CONNECTING STRUCTURE OF STATOR - A simple structure which improves reliability of connection and secures creeping and spatial distances for electrical insulation without increasing manufacturing cost is provided. Feed-through terminals whose diameters can be reduced are bonded to lands of a wiring substrate, and insertion terminals are bonded to core wires of lead wires. The insertion terminals of the lead wires are arranged in the feed-through terminals bonded to the lands. In a state where the feed-through terminals are swaged and the insertion terminals of the lead wires are pressure-bonded, the insertion terminals of the lead wires are bonded to the feed-through terminals. | 2014-06-05 |
20140154934 | AMPHIBIOUS OR MARINE APPARATUS, AND METHODS OF MAKING AND USING SAME - Apparatus to convert an all terrain vehicle into an amphibious off-road vehicle. The apparatus can thus be used with an all terrain vehicle, or alternatively with a snap in seat to form a self-contained independent boat. The apparatus is fitted to the all terrain vehicle with releasable fasteners. The apparatus includes two floatation compartments, and a hollow floatation compartment that accommodate the legs and feet of a user. | 2014-06-05 |
20140154935 | Man-powered water ski with the maximum portability and the maximum lateral balance - The present invention provides the maximum convenient portability with a 3 foldable method of the water ski hull, one half dividable shaft method of ski pole and a separable propulsion plate method from the ski pole, a push-pull method of rudder, and a separable method of the lateral balancing board from the hull, and also provides the maximum lateral balance effect of a skier by means of the lateral balancing board at the mid section, two side wings at the stern section, and a foot skid pad on each side of the mid section and a Velcro belt on each side holding each side instep of a skier over each side foot skid pad of the mid section of the ski hull. | 2014-06-05 |
20140154936 | Aquatic Lifesaving Device - This device comprises an iron casing closed with a glass door to be broken in the case of an emergency, within which is located, above a bench a motor that drives a shaft in rotation, on which is mounted a reel winding a rope attached to a life jacket that fits on the rescuer body, provided with a whistle. The end of the reel shaft bearings rests on a supporting tripod at the end of the bench and, on the outer side, has a coupling in order to mount a crank for winding by hand in the case of engine failure. A pole is anchored along the beach, the end thereof having a snap hook of the quick opening type, through which the rescuer passes the rope before entering the water. | 2014-06-05 |
20140154937 | PROCESS FOR THE PRODUCTION OF A FIBER-REINFORCED COMPOSITE MATERIAL - The present invention relates to a process for the production of a fiber-reinforced composite material with a polyamide matrix. | 2014-06-05 |
20140154938 | WATER-BASED COATING FOR COLOR SAMPLING - A color sampling display product is provided that includes a radiation-curable water-based coating composition applied to a substrate, and shows mechanical integrity and aesthetic appeal. | 2014-06-05 |
20140154939 | HALOGEN-FREE LOW-DIELECTRIC RESIN COMPOSITION, AND PREPREG AND COPPER FOIL LAMINATE MADE BY USING SAME - A halogen-free low-dielectric resin composition, and a prepreg and a copper foil laminate made by using same. The halogen-free low-dielectric resin composition, based on parts by weight of the organic solid content, comprises: 5 to 90 parts by weight of epoxidized polybutadiene resin; 10 to 90 parts by weight of benzoxazine resin; 10 to 90 parts by weight of epoxy resin; 1 to 50 parts by weight of curing agent; 10 to 50 parts by weight of organic fire retardant; 0.01 to 1 part by weight of curing catalyst; 0.1 to 10 parts by weight of initiator; and 10 to 100 parts by weight of packing. The halogen-free low-dielectric resin composition of the present invention uses the epoxidized polybutadiene resin, so as to not only solve the defect of the polybutadiene but also maintain the advantages on the dielectric property and flexibility, thereby improving the adhesive force thereof with the copper foil. The prepreg and the copper foil laminate that are used for the printed circuit board and made by using the resin composition have the desirable dielectric property, desirable heat resistance, and a high glass-transition temperature, and can satisfy the requirements of high-frequency electronic signal transmission and high-speed information processing in the industry of printed circuit board copper foil plate. | 2014-06-05 |
20140154940 | CONTROLLED RELEASE BIOCIDAL SALTS - A controlled release biocidal salt of a first component comprises a cation of a N | 2014-06-05 |
20140154941 | Unitary graphene matrix composites containing carbon or graphite fillers - A unitary graphene matrix composite comprising: (a) a unitary graphene matrix containing an oxygen content of 0.001% to 10% by weight, obtained from heat-treating a graphene oxide gel at a temperature higher than 100° C. and contains no discrete graphene platelets derived from the graphene oxide gel; (b) a carbon or graphite filler phase selected from carbon or graphite fiber, carbon or graphite nano-fiber, carbon nano-tube, carbon nano-rod, meso-phase carbon particle, meso-carbon micro-bead, exfoliated graphite flake with a thickness greater than 100 nm, exfoliated graphite or graphite worm, coke particle, needle coke, carbon black or acetylene black particle, activated carbon particle, or a combination thereof. The carbon or graphite filler phase is preferably in a particulate, filamentary, or rod-like form dispersed in and bonded by the unitary graphene matrix. This composite exhibits a combination of exceptional thermal conductivity, electrical conductivity, mechanical strength, surface hardness, and scratch resistance. | 2014-06-05 |
20140154942 | ARTICLE OF MANUFACTURE FOR WARMING THE HUMAN BODY AND EXTREMITIES VIA GRADUATED THERMAL INSULATION - An article of manufacture for warming human extremities via graduated thermal insulation with a blanket comprised of concentrations of and transitions to and from concentrations of various types of woven thread fabric or non-woven fabric, having various properties of thermal insulation. | 2014-06-05 |
20140154943 | POLYESTER NONWOVEN FABRIC AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a polyester nonwoven fabric which can be used as an useful primary backing substrate for a carpet since it exhibits good physical properties even after tufting process, and a method for manufacturing the same. The polyester nonwoven fabric of the present invention comprises an one-component filament and a sheath-core type filament both of which have a fineness of 4 to 10 denier. The one-component filament comprises a first polyester polymer having a melting point of 250° C. or higher, the sheath-core type filament comprises the first polyester polymer of 70 to 95 wt % as a core component and a second polyester polymer of 5 to 30 wt % as a sheath component, and a melting point of the second polyester polymer is lower than the melting point of the first polyester polymer by 20° C. or more. | 2014-06-05 |
20140154944 | ADHESIVE TAPE, PREFERABLY SELF-ADHESIVE TAPE, COMPRISING OF AT LEAST TWO LAYERS A AND B LAMINATED DIRECTLY ON ONE ANOTHER, WITH AT LEAST ONE OR BOTH LAYERS A OR B BEING AN ADHESIVE - Adhesive tape having at least two layers A and B laminated directly on one another, with at least one or both layers A or B being an adhesive, and the interfaces of the layers A and B laminated on one another being subjected to a physical method, the physical method being selected from the group consisting of corona discharge, dielectric barrier discharge, flame pretreatment and plasma treatment, before the layers are laminated to one another, with the two methods differing from one another. | 2014-06-05 |
20140154945 | DUAL PURPOSE YO-YO SYSTEM - The customizable yo-yo system of the present invention makes available a transformable Yo-yo character to transform a Yo-yo to a character toy. | 2014-06-05 |
20140154946 | WATER TOY WITH BELLOWS - A squirting toy is comprised of a cylindrical housing and a bellows that compresses in response to an outside force in order to expel water therefrom. The ends of the squirting toy may provide buoyancy sufficient for the toy to float in water. | 2014-06-05 |
20140154947 | BRASSIERE - A brassiere includes a first wing and a second wing, a closure including a first closure portion on a first end of the first wing, and a second closure portion on a first end of the second wing; a pair of cups including a first cup connected to the second end of the first wing, and a second cup connected to the second end of the second wing; each cup including an inner contour shaped with an inner apex matching a breast to receive the breast in a natural bust point position, and an outer contour having a size larger than the inner contour and shaped with an outer apex spaced medially from the inner apex, and filling material between the inner contour and the outer contour; a gore connected between the first cup and the second cup; and a pair of straps including a first strap connected to the first cup and the first wing, and a second strap connected to the second cup and the second wing. | 2014-06-05 |
20140154948 | LADY'S GARMENT WITH CUP PARTS - Provided is a women's garment with cup parts which make bust top positions look higher, while enabling breasts to appear larger in volume. A women's garment with cup parts has a pair of cup parts, each cup part having a first shaping region for covering a nipple and pressing a breast at the time of putting the cup part on the breast and a second shaping region, located lower than the first shaping region, for pressing the breast, the second shaping region having a volume larger than that of the first shaping region, the cup part having a top on a front face side residing within the first shaping region when seen from the front face side. While the second shaping region pushes the breast up, the first shaping region further presses the pushed-up breast, so the bust top positions look higher, while the breasts appear larger in volume. | 2014-06-05 |
20140154949 | Bra - A brassiere includes an elastic band, a pair of cups (and a pair of elongated flexible support elements configured to come at least partly into contact with the shoulders of the user. Each of the cups includes an outer surface and an inner surface made of a first textile material which includes a plurality of first inserts in a first flexible polymeric material having a coefficient of friction with the skin greater than the first textile material. | 2014-06-05 |
20140154950 | BACKLESS, STRAPLESS BRA AND ATTACHABLE BREAST FORM ENHANCEMENT SYSTEM - A bra cup or breast form including an interior surface facing toward a user's breast and having at least one thin ridge of pressure sensitive adhesive, for securing the bra cup or breast form to the user's breast, and at least one ventilation pathway on the interior surface. The bra cup or breast form may be used in a backless, strapless bra or breast form system. | 2014-06-05 |
20140154951 | COMMON GROUND FOR ELECTRONIC LAPPING GUIDES - Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller such that the number of wire bonds from the controller to a row of read heads is minimized. When lapping the air bearing surface of the read heads, the electrical resistances of the ELGs are monitored to adjust the lapping process and set the stripe height for read sensors in the read heads. Once the resistance corresponds to the desired stripe height, the lapping process is stopped. To measure the resistance, each ELG may be electrically coupled to the same substrate—i.e., share the same common ground. The lapping controller applies a voltage potential across the ELGs using a wire bonded to a pad in the respective read head and one or more connections to the grounded substrate. This configuration avoids having to bond two wires onto each read head. | 2014-06-05 |
20140154952 | WAFER GROUNDING DESIGN FOR SINGLE PAD LAPPING - Embodiments described herein generally relate to connecting Electronic Lapping Guides (ELG) to a lapping controller to reduce resistance from current crowding while reducing connections to the ELG. A device and a system can include a wafer with peripheral grounding vias having a radius of at least 10 μm, a plurality of sliders with a magnetoresistive (MR) elements; a plurality of ELG electrically coupled to the lapping controller through a combination of the wafer and grounding pads and a bonding pad electrically coupled to the ELG. The ELG or the bonding pad can be positioned in the kerf or the device region of a row. If the ELG and the bonding pad are positioned in separate regions, a noble metal should be used to connect. Further, the number of grounding pads can be reduced by using grounding vias at specific intervals and specific sizes. | 2014-06-05 |
20140154953 | CORRECTING CURRENT CROWDING IN ROW BAR AND VIAS FOR SINGLE PAD BONDING - Embodiments described herein generally relate to connecting electronic lapping guides (ELGs) to a lapping controller to prevent the effects of current crowding while reducing connections to the ELGs in single pad lapping. Devices and systems can include a row of sliders including a magnetoresistive (MR) element, a plurality of high resistance ELGs connected to both the wafer and to at least one bonding pad and at least two peripheral grounding vias connected to the wafer. Methods and systems include a wafer comprising a plurality of sliders wherein each slider is connected to a lapping controller and the delivery of current to the ELGs is sequential to groups of sliders such that only one group of ELGs is being measured at any time. | 2014-06-05 |
20140154954 | AUTOMATED POLISHING SYSTEMS AND METHODS - Automated polishing systems include a polisher for polishing the coating on the article and a robotic positioner for moving the polisher relative to the article on an automated path, wherein the polisher polishes at least a part of the coating during movement, a force feedback sensor for determining a force of the polisher against the article during polishing, and a controller for maintaining the polisher within a predetermined force range against the article based at least in part on the force determined by the force feedback sensor. | 2014-06-05 |
20140154955 | Systems and Methods for Stripping and/or Finishing Wood Surfaces - Apparatuses, systems and methods strip and/or finish wood surfaces. Specifically, the present invention relates to using systems and methods utilizing rotary apparatuses having metal embedded or bonded industrial diamonds to cut, grind, and polish wood surfaces. | 2014-06-05 |
20140154956 | Pad Conditioning and Wafer Retaining Ring and Manufacturing Method Thereof - The present invention relates to a wafer retaining ring used in a chemical mechanical polishing process (CMP) for semiconductor device manufacturing, and in particular, to a pad conditioning and wafer retaining ring designed to prevent a wafer from slipping during the CMP process and, simultaneously condition a pad uniformly, and to a manufacturing method thereof. | 2014-06-05 |
20140154957 | BLADE SHARPENING SYSTEM FOR MULTIPLE BLADE SHAPES - A blade sharpening system using the interior surface of a grinding wheel against which a blade is drawn along its entire length for sharpening. The sharpening system includes a blade holding configuration having multiple hinged arms. A cam operating between two of the hinged arms serves to alter the angle of incidence between the blade and the grinding wheel as the blade is drawn across the grinding wheel. The result is that a wide variety of different blade configurations can be easily accommodated by the sharpening system. | 2014-06-05 |