24th week of 2011 patent applcation highlights part 51 |
Patent application number | Title | Published |
20110143517 | III-Nitride Monolithic IC - III-nitride materials are used to form isolation structures in high voltage ICs to isolate low voltage and high voltage functions on a monolithic power IC. Critical performance parameters are improved using III-nitride materials, due to the improved breakdown performance and thermal performance available in III-nitride semiconductor materials. An isolation structure may include a dielectric layer that is epitaxially grown using a III-nitride material to provide a simplified manufacturing process. The process permits the use of planar manufacturing technology to avoid additional manufacturing costs. High voltage power ICs have improved performance in a smaller package in comparison to corresponding silicon structures. | 2011-06-16 |
20110143518 | HETEROGENEOUS INTEGRATION OF LOW NOISE AMPLIFIERS WITH POWER AMPLIFIERS OR SWITCHES - A transistor heterogeneously integrating a power amplifier or switch with a low-noise amplifier having a substrate wafer selected from a group consisting of Gallium Arsenide (GaAs), Indium Phosphate (InP) and Gallium Antimonide (GaSb), the substrate having a first end and a second end, a conducting layer above the first end of the substrate, an isolation implant providing lateral isolation in the conducting layer, a first active layer deposited above the conducting layer and configured for the low-noise amplifier, and a buffer layer deposited above the conducting layer and configured for the low-noise amplifier. | 2011-06-16 |
20110143519 | PRODUCTION OF ISOLATION TRENCHES WITH DIFFERENT SIDEWALL DOPINGS - A description is given of a method for producing isolation trenches ( | 2011-06-16 |
20110143520 | TWO-CHAMBER SYSTEM AND METHOD FOR SERIAL BONDING AND EXFOLIATION OF MULTIPLE WORKPIECES - A system for treating distinct batches of workpieces to serial procedures comprises first and second multi-site structures. In each multi-site structure the sites are rotatable for alignment in turn with loading and unloading stations together constituting treatment or process stations. Workpieces of a batch are loaded onto all of the treatment sites and then simultaneously and identically treated by operation of treatment stations with which the process sites are aligned. After treatment in the first structure, workpieces of a batch are transferred from the unloading stations of the first structure to the loading stations of the second structure for further processing. | 2011-06-16 |
20110143521 | APPARATUS AND METHOD FOR SIMULTANEOUS TREATMENT OF MULTIPLE WORKPIECES - A system for simultaneously treating multiple workpieces is configured with treatment sites, configured to hold respective workpieces, fixed on a rotatable base. Treatment stations are equipped with respective active components operable simultaneously to treat respective workpieces identically on respective aligned treatment sites. For loading and unloading the treatment sites are rotated through distinct loading and unloading stations of the treatment stations which allow loading of a second batch while a first batch is being unloaded. | 2011-06-16 |
20110143522 | RELAXATION OF STRAINED LAYERS - The present invention relates to a method for relaxing a strained material layer by depositing a first low-viscosity layer on a first face of a strained-material layer; bonding a first substrate to the first low-viscosity layer to form a first composite structure; subjecting the composite structure to heat treatment sufficient to cause reflow of the first low-viscosity layer so as to at least partly relax the strained-material layer; and applying a mechanical pressure to a second face of the strained material layer which is opposite to the first face. The mechanical pressure is applied perpendicularly to the strained material layer during at least part of the heat treatment. | 2011-06-16 |
20110143523 | Semiconductor integrated device and manufacturing method for the same - A manufacturing method for a semiconductor integrated device including forming a second impurity layer of a second conductivity type that is higher in impurity concentration than a second well of the second conductivity type on a first impurity layer of a first conductivity type that is higher in impurity concentration than a first well of the first conductivity type, forming the first well of the first conductivity type on the second impurity layer of the second conductivity type on the first impurity layer of the first conductivity type, the first well being supplied with potential from the first impurity layer of the first conductivity type, and forming the second well of the second conductivity type on the second impurity layer of the second conductivity type on the first impurity layer of the first conductivity type, the second well being supplied with potential from the second impurity layer of the second conductivity type. | 2011-06-16 |
20110143524 | Methods of Manufacturing Rewriteable Three-Dimensional Semiconductor Memory Devices - Methods of forming nonvolatile memory devices include forming a vertical stack of nonvolatile memory cells on a substrate. This is done by forming a vertical stack of spaced-apart gate electrodes on a first sidewall of a vertical silicon active layer and treating a second sidewall of the vertical silicon active layer in order to reduce crystalline defects within the active layer and/or reduce interface trap densities therein. This treating can include exposing the second sidewall with an oxidizing species that converts a surface of the second sidewall into a silicon dioxide passivation layer. A buried insulating pattern may also be formed directly on the silicon dioxide passivation layer. | 2011-06-16 |
20110143525 | NITRIDE SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention relates to a nitride semiconductor substrate such as gallium nitride substrate and a method for manufacturing the same. The present invention forms a plurality of trenches on a lower surface of a base substrate that are configured to absorb or reduce stresses applied larger when growing a nitride semiconductor film on the base substrate from a central portion of the base substrate towards a peripheral portion. That is, the present invention forms the trenches on the lower surface of the base substrate such that pitches get smaller or widths or depths get larger from the central portion of the base substrate towards the peripheral portion. | 2011-06-16 |
20110143526 | METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER - A method of manufacturing a silicon wafer, an oxygen concentration in a surface layer to be maintained more than a predetermined value while promoting a defect-free layer. Strength of the surface layer can be made higher than that of an ordinary annealed sample as a COP free zone is secured. A method of manufacturing a silicon wafer doped with nitrogen and oxygen, includes growing a single crystal silicon doped with the nitrogen by Czochralski method, slicing the grown single crystal silicon to obtain a single crystal silicon wafer; heat treating the sliced single crystal silicon wafer in an ambient gas including a hydrogen gas and/or an inert gas; polishing the heat treated single crystal silicon wafer, after the heat treatment, such that an obtained surface layer from which COP defects have been removed by the heat treatment is polished away until an outermost surface has a predetermined oxygen concentration. | 2011-06-16 |
20110143527 | TECHNIQUES FOR GENERATING UNIFORM ION BEAM - Herein an improved technique for generating uniform ion beam is disclosed. In one particular exemplary embodiment, the technique may be realized as a method for processing a substrate with an ion implanter comprising an ion source. The method may comprise: introducing dopant into an ion source chamber of the ion source, the dopant may comprise molecules containing boron and hydrogen; introducing diluent into the ion source chamber, the diluent containing halogen; ionizing the dopant and the diluent into molecular ions and halogen containing ions, the molecular ions containing boron and hydrogen; extracting the molecular ions and the halogen containing ions from the ions source chamber; and directing the molecular ions toward the substrate, where the halogen containing ions may improve uniformity of the molecular ions extracted from the ion source and extend the lifetime of the ion source. | 2011-06-16 |
20110143528 | Devices with Cavity-Defined Gates and Methods of Making the Same - Disclosed are methods, systems and devices, including a method that includes the acts of forming a semiconductor fin, forming a sacrificial material adjacent the semiconductor fin, covering the sacrificial material with a dielectric material, forming a cavity by removing the sacrificial material from under the dielectric material, and forming a gate in the cavity. | 2011-06-16 |
20110143529 | METHOD OF FABRICATING HIGH-K/METAL GATE DEVICE - The present disclosure provides a method that includes providing a semiconductor substrate; forming a gate structure over the semiconductor substrate, first gate structure including a dummy dielectric and a dummy gate disposed over the dummy dielectric; removing the dummy gate and the dummy dielectric from the gate structure thereby forming a trench; forming a high-k dielectric layer partially filling the trench; forming a barrier layer over the high-k dielectric layer partially filling the trench; forming an capping layer over the barrier layer partially filling the trench; performing an annealing process; removing the capping layer; forming a metal layer over the barrier layer filling in a remainder of the trench; and performing a chemical mechanical polishing (CMP) to remove the various layers outside the trench. | 2011-06-16 |
20110143530 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor memory device according to the present invention includes: a first transistor formed on a semiconductor substrate | 2011-06-16 |
20110143531 | PACKAGING CONDUCTIVE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A packaging conductive structure for a semiconductor substrate and a method for manufacturing the structure are provided. The structure comprises an under bump metal (UBM) that overlays a pad of the semiconductor substrate. At least one auxiliary component is disposed on the UBM. Then, a bump conductive layer is disposed thereon and a bump is subsequently formed on the bump conductive layer. Thus, the bump can electrically connect to the pad of the semiconductor substrate through the UBM and the bump conductive layer and can provide better junction buffer capabilities and conductivity. | 2011-06-16 |
20110143532 | Method of forming semiconductor cell structure, method of forming semiconductor device including the semiconductor cell structure, and method of forming semiconductor module including the semiconductor device - In a method of forming a semiconductor cell structure, a first insulating layer may be formed on a semiconductor substrate. A connection pattern may be formed in the first insulating layer. Second and third insulating layers may be sequentially formed on the connection pattern. The third insulating layer may be etched at least twice and the second insulating layer may be etched at least once to form a through hole in the second and third insulating layers. The through hole may expose the connection pattern. | 2011-06-16 |
20110143533 | POISON-FREE AND LOW ULK DAMAGE INTEGRATION SCHEME FOR DAMASCENE INTERCONNECTS - A method of forming a dual damascene structure is disclosed. A lower dielectric hardmask layer and an upper dielectric hardmask layer are deposited on an ultra low-k film. A first via is formed in the upper hardmask layer. Next, a first trench is formed using a tri-layer resist scheme. Finally, a full via and a full trench are formed simultaneously. An optional etch-stop layer can be used in the ultra low-k layer to control trench depth. | 2011-06-16 |
20110143534 | METHOD FOR FORMING METALLIC MATERIALS COMPRISING SEMI-CONDUCTORS - The method for forming first and second metal-based materials comprises providing a substrate comprising an area made from a first semi-conductor material and an area made from a second semi-conductor material comprising germanium separated by a pattern made from dielectric material, depositing a metal layer and performing a first heat treatment in an atmosphere comprising a quantity of oxygen comprised between 0.01% and 5%. The metal layer reacts with the first semi-conductor material and the second semi-conductor material comprising germanium to respectively form the first metal-based material and the second metal-based material containing germanium. | 2011-06-16 |
20110143535 | PRODUCTION OF TSV INTERCONNECTION STRUCTURES MADE UP OF AN INSULATING CONTOUR AND A CONDUCTIVE ZONE SITUATED IN THE CONTOUR AND DISCONNECTED FROM THE CONTOUR - A method for producing an interconnection structure is disclosed. In one aspect, there is formation in a substrate of at least one trench forming a closed contour and at least one hole situated inside the closed contour, the trench and the hole being separated by a zone of the substrate. Furthermore, the trench is filled with a dielectric material and the hole is filled with a conducting material. | 2011-06-16 |
20110143536 | Method for Making an Aperture in a Carrier and Electrically Connecting Two Opposite Faces of the Carrier - Disclosed is a method for making an aperture in a carrier and electrically connecting two opposite faces of the carrier. At first, a carrier is provided. Secondly, a heater is provided for heating a portion of the carrier in an environment rich in oxygen, thus making an aperture in the carrier and forming an isolative layer on the wall of the aperture synchronously. Finally, the aperture is filled with a conductive material. | 2011-06-16 |
20110143537 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND SYNCHRONOUS PULSE PLASMA ETCHING EQUIPMENT FOR THE SAME - Provided are a method of fabricating a semiconductor device and synchronous pulse plasma etching equipment for the same. The method includes outputting a first radio frequency (RF) power and a control signal and outputting a second RF power. The first RF power is pulse-width modulated to have a first frequency and a first duty ratio, and is applied to a first electrode in a plasma etching chamber. The control signal includes information on a phase of the first RF power. The second RF power is pulse-width modulated to have the first frequency and a second duty ratio smaller than the first duty ratio, is applied to a corresponding second electrode among second electrodes in the plasma etching chamber, and is supplied for a time section in which the first RF power is supplied. | 2011-06-16 |
20110143538 | Semiconductor Processing Methods - Some embodiments include methods in which insulative material is simultaneously deposited across both a front side of a semiconductor substrate, and across a back side of the substrate. Subsequently, openings may be etched through the insulative material across the front side, and the substrate may then be dipped within a plating bath to grow conductive contact regions within the openings. The insulative material across the back side may protect the back side from being plated during the growth of the conductive contact regions over the front side. In some embodiments, plasma-enhanced atomic layer deposition may be utilized to for the deposition, and may be conducted at a temperature suitable to anneal passivation materials so that such annealing occurs simultaneously with the plasma-enhanced atomic layer deposition. | 2011-06-16 |
20110143539 | POLISHING PAD WITH ENDPOINT WINDOW AND SYSTEMS AND METHODS USING THE SAME - A polishing pad including a path therethrough to transmit a signal for in situ monitoring of an endpoint in a polishing operation. In one embodiment, the polishing pad includes a polishing composition distribution layer on a first side of a guide plate and a support layer on an opposed second side of a guide plate. The guide plate retains a plurality of polishing elements that extend along a first direction substantially normal to a plane including the polishing pad and through the polishing composition distribution layer. The polishing pad includes an optical path along the first direction and through a thickness of the pad. | 2011-06-16 |
20110143540 | Semiconductor Wafer Handler - A semiconductor wafer handler comprises a ring ( | 2011-06-16 |
20110143541 | APPARATUS AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE - In one embodiment, an apparatus of treating a surface of a semiconductor substrate comprises a substrate holding and rotating unit, first to fourth supplying units, and a removing unit. A substrate holding and rotating unit holds a semiconductor substrate, having a convex pattern formed on its surface, and rotates the semiconductor substrate. A first supplying unit supplies a chemical onto the surface of the semiconductor substrate in order to clean the semiconductor substrate. A second supplying unit supplies pure water to the surface of the semiconductor substrate in order to rinse the semiconductor substrate. A third supplying unit supplies a water repellent agent to the surface of the semiconductor substrate in order to form a water repellent protective film onto the surface of the convex pattern. A fourth supplying unit supplies alcohol, which is diluted with pure water, or acid water to the surface of the semiconductor substrate in order to rinse the semiconductor substrate. A removing unit removes the water repellent protective film with the convex pattern being left. | 2011-06-16 |
20110143542 | Method to remove capping layer of insulation dielectric in interconnect structures - A method for patterning an insulation layer and selectively removing a capping layer overlying the insulation layer is described. The method utilizes a dry non-plasma removal process. The dry non-plasma removal process may include a self-limiting process. | 2011-06-16 |
20110143543 | Method of Forming Capacitors, and Methods of Utilizing Silicon Dioxide-Containing Masking Structures - Some embodiments include methods of forming capacitors. Storage nodes are formed within a material. The storage nodes have sidewalls along the material. Some of the material is removed to expose portions of the sidewalls. The exposed portions of the sidewalls are coated with a substance that isn't wetted by water. Additional material is removed to expose uncoated regions of the sidewalls. The substance is removed, and then capacitor dielectric material is formed along the sidewalls of the storage nodes. Capacitor electrode material is then formed over the capacitor dielectric material. Some embodiments include methods of utilizing a silicon dioxide-containing masking structure in which the silicon dioxide of the masking structure is coated with a substance that isn't wetted by water. | 2011-06-16 |
20110143544 | METHOD OF FORMING MICROPATTERN, DIE FORMED BY THIS METHOD OF FORMING MICROPATTERN, TRANSFER METHOD AND MICROPATTERN FORMING METHOD USING THIS DIE - A micropattern is joined to a substrate (W | 2011-06-16 |
20110143545 | APPARATUS AND METHOD OF TREATING SURFACE OF SEMICONDUCTOR SUBSTRATE - In one embodiment, an apparatus of treating a surface of a semiconductor substrate comprises a substrate holding and rotating unit which holds a semiconductor substrate with a surface having a convex pattern formed thereon and rotates the semiconductor substrate, a first supply unit which supplies a chemical and/or pure water to the surface of the semiconductor substrate, and a second supply unit which supplies a diluted water repellent to the surface of the semiconductor substrate to form a water-repellent protective film on the surface of the convex pattern. The second supply unit comprises a buffer tank which stores the water repellent, a first supply line which supplies a purge gas to the buffer tank, a second supply line which supplies a diluent, a pump which sends off the water repellent within the buffer tank, a third supply line which supplies the water repellent sent off from the pump, and a mixing valve which mixes the diluent and the water repellent to produce the diluted water repellent. | 2011-06-16 |
20110143546 | ASHING METHOD AND ASHING DEVICE - An ashing device and ashing method that can positively remove resist from a wafer while preventing degradation of the film material properties of exposed porous Low-K film on the wafer. The ashing device of the present invention introduces a gas to a dielectric plasma generating chamber 14, excites said gas to generate a plasma, and performs plasma processing using said gas plasma on a processing work S in use of a Low-K film. The ashing gas introduced from a gas regulator 20 is an inert gas to which H | 2011-06-16 |
20110143547 | SOLUTION FOR REMOVAL OF RESIDUE AFTER SEMICONDUCTOR DRY PROCESS AND RESIDUE REMOVAL METHOD USING SAME - The present invention provides a chemical solution capable of completely removing the residues after a dry process in a short period of time, wherein the chemical solution causes less damage to low-k films than before, and prevents cracking and roughness of the Cu surface by inhibiting Cu corrosion so as to leave, rather than remove, a Cu thin film, which is formed on the Cu surface as a result of damage during a dry process. Specifically, the present invention relates to a residue-removing solution for removing residues after a dry process, comprising an amine salt of a monocarboxylic acid and/or a salt of a polycarboxylic acid that forms a 7- or more-membered ring chelate with copper, and water, the residue-removing solution comprising (A) or (B) described below:
| 2011-06-16 |
20110143548 | ULTRA LOW SILICON LOSS HIGH DOSE IMPLANT STRIP - Improved methods for stripping photoresist and removing ion implant related residues from a work piece surface are provided. According to various embodiments, plasma is generated using elemental hydrogen, a fluorine-containing gas and a protectant gas. The plasma-activated gases reacts with the high-dose implant resist, removing both the crust and bulk resist layers, while simultaneously protecting exposed portions of the work piece surface. The work piece surface is substantially residue free with low silicon loss. | 2011-06-16 |
20110143549 | ETCHING METHOD, METHOD FOR MANUFACTURING MICROSTRUCTURE, AND ETCHING APPARATUS - In one embodiment, an etching method is disclosed. The method can include producing an oxidizing substance by electrolyzing a sulfuric acid solution, and producing an etching solution having a prescribed oxidizing species concentration by controlling a produced amount of the produced oxidizing substance. The method can include supplying the produced etching solution to a surface of a workpiece. | 2011-06-16 |
20110143550 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, APPARATUS FOR PROCESSING SUBSTRATE, AND COMPUTER READABLE MEDIUM - A method for manufacturing a semiconductor device, including: partially removing a first layer formed on a wafer supported by a support member by supplying a first liquid at a temperature of | 2011-06-16 |
20110143551 | DEVICE AND PROCESS FOR CHEMICAL VAPOR PHASE TREATMENT - Device for treating substrates, comprising a changer having controlled pressure and temperature, a substrate support which is provided in the chamber, the chamber comprising a gas inlet for carrying out a vapor phase deposition, and an upper wall of the chamber provided with a plurality of first channels connected to a first inlet and a plurality of second channels connected to a second inlet, the first and second channels opening into the chamber and being regularly distributed in the upper wall, a heating element provided above the upper wall and a gas discharge ring provided between the upper wall and the substrate support, the upper wall begin electrically conductive and insulated relative to the substrate support so as to be able to apply a voltage between the upper wall and the substrate support. | 2011-06-16 |
20110143552 | HEAT-RESISTANT ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE FABRICATION, ADHESIVE USED FOR THE SHEET, AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SHEET - The present invention provides a heat-resistant adhesive sheet for semiconductor device fabrication that is attached to a substrateless semiconductor chip when the chip is encapsulated with resin. The adhesive sheet includes a base material layer and an adhesive layer. The adhesive layer contains a rubber component and an epoxy resin component. The proportion of the rubber component in an organic substance in the adhesive is in the range of 20 to 60 wt %. | 2011-06-16 |
20110143553 | INTEGRATED TOOL SETS AND PROCESS TO KEEP SUBSTRATE SURFACE WET DURING PLATING AND CLEAN IN FABRICATION OF ADVANCED NANO-ELECTRONIC DEVICES - Methods and systems for handling a substrate through processes including an integrated electroless deposition process includes processing a surface of the substrate in an electroless deposition module to deposit a layer over conductive features of the substrate using a deposition fluid. The surface of the substrate is then rinsed in the electroless deposition module with a rinsing fluid. The rinsing is controlled to prevent de-wetting of the surface so that a transfer film defined from the rinsing fluid remains coated over the surface of the substrate. The substrate is removed from the electroless deposition module while maintaining the transfer film over the surface of the substrate. The transfer film over the surface of the substrate prevents drying of the surface of the substrate so that the removing is wet. The substrate, once removed from the electroless deposition module, is moved into a post-deposition module while maintaining the transfer film over the surface of the substrate. | 2011-06-16 |
20110143554 | REDUCTION OF DEFECTS FORMED ON THE SURFACE OF A SILICON OXYNITRIDE FILM - Methods for reducing defects on the surface of a silicon oxynitride film are disclosed, in one embodiment, the methods include, forming a silicon oxynitride film on a semiconductor substrate and heating the silicon oxynitride film to increase a hydrophilicity of a surface of the silicon oxynitride film prior to treating the surface of the silicon oxynitride film with a hydrofluoric acid. | 2011-06-16 |
20110143555 | ELECTRICAL CONNECTOR HAVING DUST-PROOF SHUTTER DRIVEN BY MAGNETIC FORCE - An electrical connector includes an insulative housing ( | 2011-06-16 |
20110143556 | CONNECTING MECHANISM FOR CONNECTING POWER ADAPTER AND ELECTRONIC DEVICE - A connecting mechanism is provided for connecting a power adapter and an electronic device. The connecting mechanism includes a first connecting part and a second connecting part. The first connecting part is connected with the power adapter, and includes a first magnetic core, a first winding and a first magnetic element. The second connecting part is connected with the electronic device, and includes a second magnetic core, a second winding and a second magnetic element. The first magnetic element and the second magnetic element are aligned with and magnetically attracted by each other, so that the first connecting part is fixed onto the second connecting part and electromagnetic coupling between the first winding and the second winding is produced. | 2011-06-16 |
20110143557 | ELECTRICAL CONNECTOR ASSEMBLY WITH IMPROVED FASTENING DEVICE - An electrical connector includes a housing including a mating portion defining a mating direction and located on the front portion thereof and a supporting portion rearward extending from the mating portion, a plurality of contacts receiving in the housing, a cover assembled on the housing, a plurality of cables electrically connected to the contacts. The housing further includes a pair of wing portions extending from an rear wall of the mating portion and defining substantially a Z-like configuration in a top view. | 2011-06-16 |
20110143558 | ELECTRICAL CONNECTOR WITH IMPROVED CABLE FIXATION - An electrical connector includes a housing including a mating portion located in the front portion thereof, a plurality of contacts received in the housing and each including a tail extending out of the rear wall of the housing, a cover assembled on the housing, and a plurality of cables. The mating portion of the housing defines a mating direction and a rear wall. The cables each includes an inner conductor electrically connected to the tail of the contact, an inner insulation layer, an shielding braids and an outer insulation layer. The rear wall includes a plurality of ribs every two of which form a receiving slot therebetween and a plurality of protrusions every two of which form a fastening slot therebetween. The ribs and the protrusions respectively extend in two rows along a horizontal direction perpendicular to the mating direction and form a groove therebetween. The outer insulation layers of the cables are fastened in the receiving slots and the inner insulation layers are fastened in the fastening slots. | 2011-06-16 |
20110143559 | Socket and Contact Having Anchors - A socket apparatus comprises a base portion defining an array of contact cavities. A plurality of contacts are inserted into the array of contact cavities defined in the base portion. The base portion includes a top side and a bottom side and a plurality of ribs extending from the bottom side. Each rib defines at least one sidewall that engages with an anchor of a contact to securely mount the contact. Each contact includes a mounting portion having a first anchor and a second anchor extending from the mounting portion and operable to engage a mounting surface of the base portion to securely mount the contact. The first anchor provides a first anchor force for the contact to the base portion that is substantially greater than a second anchor force provided by the second anchor to the base portion. | 2011-06-16 |
20110143560 | SOCKET DEVICE COMPRISING GROUNDING STRUCTURE, APPLICATION OF SOCKET DEVICE AND MANUFACTURING METHOD THEREOF - The present invention relates to a socket device comprising grounding structure, application of the socket device and manufacturing method thereof. The socket device comprises a base, a socket structure and a grounding structure. The base comprises a substrate and a sidewall adjacent thereto, and the substrate comprises a first lateral and a second lateral corresponded to each other. The socket structure is disposed on the sidewall of the base. The grounding structure is disposed on the substrate of the base and comprises a grounding element, a fixing element, a grounding wire, and an insulating plate. The grounding element comprises first and second terminals, wherein the first terminal is protruded from the first lateral of the substrate. The fixing element is substantially disposed on the second lateral of the substrate and connected to the second terminal of the grounding element, so as to fix the grounding element to the substrate. The grounding wire is connected to the fixing element by a first conductive end thereof. The insulating plate is substantially disposed on the second lateral of the substrate and covers the second terminal of the grounding element, the fixing element and the first conductive end of the grounding wire, wherein the grounding wire is piercing through and protruded relative from the insulating plate for grounding. | 2011-06-16 |
20110143561 | SPARE MODULE FOR HANDHELD POWER TOOL - The invention is based on a spare handheld power tool module, having at least one interface that has at least one contact region and at least one electrical contact that is disposed at least partly in the contact region. It is proposed that the interface has at least one closure unit, which is provided for covering the contact region. | 2011-06-16 |
20110143562 | CONNECTOR AND BIOSENSING METER WITH THE CONNECTOR - The present invention related to a connector which is used in a biosensing meter and receives an insertion, comprising a body and a plurality of terminal components. The plurality of terminals arranged all around and face to face, thereby reducing the volume of the connector. Furthermore, the plurality of terminal respectively contact the insertion equally thereby increasing the transmissible accuracy and the determination accuracy. The connector can further comprise a sliding base connected with the body for ejecting the insertion, whereby the invented connector can achieve multi-functional goal. | 2011-06-16 |
20110143563 | CARD EDGE CONNECTOR HAVING A SPRING MEMBER FOR LOCKING WITH A MODULE - A card edge connector includes a longitudinal insulative housing having a receiving slot formed therein and extending in a longitudinal direction for insertion of a module; a set of contacts retained in the insulative housing and protruding into the receiving slot for mating with the module; an ejector rotatably attached to one longitudinal end of the insulative housing for latching with or ejecting the module; and a spring member retained in the other longitudinal end of the insulative housing and having a pair of resilient locking arms for locking with the module. | 2011-06-16 |
20110143564 | ELECTRICAL CONNECTOR ASSEMBLY - An electrical connector assembly includes a terminal holding member having a plurality of terminals, each having a distributing section; a distributing member for coupling the holding member, and formed with first and second rows of retention holes in parallel manner. Each retention hole has an insert hole section and a distributing hole section. Once the holding member is coupled to the distributing member, the terminals extend respectively through the insert hole sections and the distributing hole sections in the terminal distributing member, thereby forming and exposing two parallel rows of the distributing sections of the terminals from a flat end of the terminal distributing member. | 2011-06-16 |
20110143565 | Waterproof universal push-in wire connector - A push-in wire connector having at least two resilient members for generating a wire contacting force with one of the two resilient members exerting a greater contact force than the other to permit forming electrical connections to different size or types of wires by axially inserting wires into a sealant and into electrical contact engagement in the push-in wire connector to form a waterproof electrical connection in the presence of the sealant. | 2011-06-16 |
20110143566 | CONNECTOR - A connector has an inner housing with a cavity for housing a terminal fitting, an outer housing assembled displaceably to the inner housing and a rubber plug. The rubber plug has a sealing portion, a vibration reducing portion and a vibration absorbing portion. The sealing portion is mounted fixedly on a rear end portion of the terminal fitting and is brought into close contact with an inner peripheral surface of the cavity. The vibration reducing portion is fit in a holding hole formed in the outer housing and thus is displaced with the outer housing. The vibration absorbing portion has a smaller thickness than the vibration reducing portion and connects the sealing portion to the vibration reducing portion. The vibration absorbing portion is outside the holding hole and in front of the holding hole. | 2011-06-16 |
20110143567 | COAXIAL CABLE CONNECTOR HAVING ELECTRICAL CONTINUITY MEMBER - A coaxial cable connector comprising a connector body; a post engageable with connector body, wherein the post includes a flange; a nut, axially rotatable with respect to the post and the connector body, the nut having a first end and an opposing second end, wherein the nut includes an internal lip, and wherein a second end portion of the nut corresponds to the portion of the nut extending from the second end of the nut to the side of the lip of the nut facing the first end of the nut at a point nearest the second end of the nut, and a first end portion of the nut corresponds to the portion of the nut extending from the first end of the nut to the same point nearest the second end of the nut of the same side of the lip facing the first end of the nut; and a continuity member disposed within the second end portion of the nut and contacting the post and the nut, so that the continuity member extends electrical grounding continuity through the post and the nut is provided. | 2011-06-16 |
20110143568 | Tracer wire connector kits - A ready to use tracer wire connector kit comprising a pod and cover that can be mated together around a tracer wire connector that can be retained in the pod or removed from the pod as the tracer wires are joined therein with the pod and cover encapsulating and protecting the junction of tracer wires in the tracer wire connector and a method and system wherein underground difficult to detect devices and systems can be indirectly located. | 2011-06-16 |
20110143569 | Electrical Connector Assembly - An electrical connector assembly which has a plurality of male connectors and a female connector that mates with the plurality of male connectors. Each of the male connectors has a male-type housing and a female-type contact secured to this male-type housing. Each of the male-type housings has a lock arm that is provided on the upper surface or undersurface of the male-type housing with the free end of this lock arm being positioned at the rear end of the housing. A lock arm protection member that protrudes upward or downward from the rear end of the upper surface or undersurface of the male-type housing and protects the lock arm. The female connector has a female-type housing and a male-type contact secured to this female-type housing. The female-type housing has a plurality of male connector receiving parts that receive the male-type housings and lock members on which the lock arms respectively latch. The walls between adjacent male connector receiving parts in the female-type housing are such that the front ends thereof are positioned further toward the interior than the mating surface of the female-type housing. A recessed part that receives the lock arm protection member of each of the male connectors is formed in the mating surface in the upper wall or lower wall of each of the male connector receiving parts. | 2011-06-16 |
20110143570 | PLUG ELECTRICAL CONNECTOR - A plug electrical connector includes a housing having a front face section and a back face section, and the housing has an elastic arm. The elastic arm has a locking section for locking to a receptacle connector. A pressing section is formed on the back face section. The elastic arm further has a slanted section, and the slanted section has an operating section for receiving an operative force. The housing has a front face protrusion. The front face protrusion has a protruding top portion situated at a position the same as that of the slanted section or protruding further than the slanted section in a front-to-back direction. | 2011-06-16 |
20110143571 | LEVER CONNECTOR - A lever connector that exhibits excellent space efficiency is provided. The lever connector includes female and male housings that are engageable with each other. A lever is mounted displaceably on the male housing and can be moved between an initial position and a fitting position. A cam groove is formed on the lever, and a cam follower is formed on the female housing. An entrance of the cam groove is aligned in a direction that intersects the fitting direction of the housings when the lever is at the initial position, and the female housing is assembled into a hood along the same direction. | 2011-06-16 |
20110143572 | SOCKET ARRANGEMENT - A socket arrangement having a housing, in particular a built-in housing, bearing at least one socket, preferably a plurality of sockets, the socket having an electrically conductive flange inserted into a housing opening, and a contact carrier which is inserted into the flange and which has one or more electrically conductive contacts for connecting to countercontacts of a plug corresponding to the socket. In order to effectively divert high-voltage discharges from the flange, a conductive element situated in the housing and having an introduction portion which is connected in an electrically conductive manner to a portion of the flange inside the housing, has a diversion portion which is connected to a diverter. | 2011-06-16 |
20110143573 | RELEASABLY ENGAGING HIGH DEFINITION MULTIMEDIA INTERFACE PLUG - A high definition multimedia interface connector comprising a connector body having an extension configured to be inserted into a high definition multimedia interface receptacle, and at least one projection on an outer surface of the extension to facilitate releasable engagement of the plug with a standard high definition multimedia receptacle. A corresponding method of releasably securing a high definition multimedia interface plug to a standard high definition multimedia interface receptacle is also provided. | 2011-06-16 |
20110143574 | RELEASABLY ENGAGING HIGH DEFINITION MULTIMEDIA INTERFACE PLUG - A high definition multimedia interface connector comprising a connector body having an extension configured to be inserted into a high definition multimedia interface receptacle, and at least one projection on an outer surface of the extension to facilitate releasable engagement of the plug with a standard high definition multimedia receptacle. A corresponding method of releasably securing a high definition multimedia interface plug to a standard high definition multimedia interface receptacle is also provided. | 2011-06-16 |
20110143575 | CONNECTION ASSEMBLY - The present invention provides a device for connecting together first and second complementary connector elements, the device comprising first and second parts that are movable in rotation relative to each other, wherein the device comprises a spring having a first end connected to the first part and a second end connected to the second part; the spring, the first part, and the second part being such that turning the first part in a first direction of rotation, or turning the second part in a second direction of rotation opposite to the first direction of rotation increases the inside diameter of the spring; and the spring, the first part, and the second part being such that turning the first part in the second direction of rotation or turning the second part in the first direction of rotation decreases the inside diameter of the spring. | 2011-06-16 |
20110143576 | CABLE CONNECTOR ASSEMBLY WITH A FRONT SHELL - A cable connector assembly ( | 2011-06-16 |
20110143577 | CABLE CONNECTOR ASSEMBLY WITH A FRONT SHELL - A cable connector assembly ( | 2011-06-16 |
20110143578 | ELECTRICAL CONNECTOR ASSEMBLY, TEST LEAD ASSEMBLY THEREFOR, AND ASSOCIATED METHOD - A test lead assembly is provided for an electrical connector assembly, such as a terminal board. The terminal board includes a generally planar member and a number of fasteners, such as terminal screws, which are structured to fasten and electrically connect electrical conductors to the generally planar member. The test lead assembly includes an extension member having first and second opposing ends, and an intermediate portion extending therebetween. The first end is fastened to the enlarged head of a corresponding one of the terminal screws. A connection element is disposed at or about the second end of the extension member. In one embodiment the connection element is a thumb screw that electrically connects a test element to the extension member. The test lead assembly enables the terminal board to be tested, without loosening or otherwise disturbing the electrical connections of the terminal board. An associated method is also disclosed. | 2011-06-16 |
20110143579 | Active Dual in Line Memory Module Connector with Re-driven Propagated Signals - An Active edge connector for memory modules has a base including two PCB sides and a spacer separating the sides, with driver chips mounted on each side of each side, printed wiring electrically connecting a first set of electrical signals from each of the driver chips to a mother board on which the connector is mounted, and printed wiring for electrically connecting a second set of electrical signals from each of the driver chips to a memory module inserted in the edge connector. When a group of connectors are mounted on a mother board, electrical signals arriving at the first connector are routed to its driver chips, producing re-driven signals to the next connector, and so on. A decoder circuit provides addressing signals determining the last such connector to which the signals are intended, and which prevents the signals from going to any connectors containing memories not addressed. | 2011-06-16 |
20110143580 | SOCKET TERMINAL HEAT-DISSIPATING MECHANISM - A socket terminal heat-dissipating mechanism is provided for use in an electronic device. The electronic device includes a frame and a casing. The socket terminal heat-dissipating mechanism includes a socket and an insulating layer. The socket is mounted in the frame of the electronic device, and includes a contact terminal. The insulating layer is arranged between the contact terminal and the casing of the electronic device, wherein heat energy is conducted from the contact terminal of the socket to the casing through the insulating layer, and passively dissipated away. | 2011-06-16 |
20110143581 | INTELLIGENT ELECTRICAL CONNECTOR SYSTEM - An intelligent electrical connector system may include an electrical connector, and a transceiver carried by the electrical connector. The system may also include a second electrical connector, and a second transceiver carried by the second electrical connector. The second transceiver may relay interface information to the transceiver regarding the second electrical connector's parameters. | 2011-06-16 |
20110143582 | Display device having a board for a connector for inputting of video data and a board for mounting a display control circuit and manufacturing method thereof - In a display device forming a board for mounting a connector which allows inputting of video data thereon and a board for mounting a display control circuit to be connected to the connector thereon on a surface of a display module opposite to an observation side, the board for mounting the connector thereon and the board for mounting the display control circuit thereon are physically separated from each other and, further, an area of the board for mounting the display control circuit thereon is set smaller than an area of the board for mounting the connector thereon. | 2011-06-16 |
20110143583 | Mobile phone cradle with three-point retention of portable electronic device installed in the cradle - A cradle for receiving a portable electronic device installed in the cradle includes a housing, a top clamp slidably installed in the housing for permitting the top clamp to move up and down in the housing, the top clamp securing a top of the portable electronic device when the portable electronic device is installed in the cradle, and the portable electronic device making contact with the housing at two or more points for securing the portable electronic device within the cradle, and a height-adjust release button installed on the housing for permitting the top clamp to be raised when the height-adjust release button is actuated. | 2011-06-16 |
20110143584 | LIGHT GUIDING STRUCTURE FOR ELECTRIC CONNECTOR - A light guiding structure for electric connector includes an insertion base being provided at two opposite lateral sides with a recessed portion each; at least two light-guiding units being separately connected to the two lateral sides of the insertion base, and respectively having an end formed into two engaging sections for fitting in the recessed portions; and an enclosure for enclosing the insertion base and the light-guiding units therein. The light guiding structure for electric connector can be easily and firmly assembled through engagement of the engaging sections of the light-guiding units with the recessed portions on the insertion base, and the light-guiding units are prevented from light leakage. | 2011-06-16 |
20110143585 | HIGH SPEED DATA COMMUNICATIONS CONNECTOR WITH REDUCED MODAL CONVERSION - A plug including first, second, third, and fourth pairs of contacts connected to first, second, third, and fourth wire pairs, respectively. The first pair of contacts is positioned between first and second contacts of the third pair of contacts, the second pair of contacts is positioned alongside the first contact, and the fourth pair of contacts is positioned alongside the second contact. A first and second capacitive coupling member each including a sleeve and contact member are spaced from the plug contacts. The second wire pair extends through the sleeve of the first coupling member and the contact member of the first coupling member is electrically connected to the wire connected to the second contact. The fourth wire pair extends through the sleeve of the second coupling member and the contact member of the first coupling member is electrically connected to the wire connected to the first contact. | 2011-06-16 |
20110143586 | COAXIAL CABLE CONNECTOR SLEEVE - An adapter sleeve for a coaxial cable connector is provided to transmit torque to a nut member on the cable connector. The adapter sleeve includes a cylindrical body having a first end and a second end defining a bore along a longitudinal axis therethrough. The bore defines an interior surface; the interior surface has a torque transmission feature sized to slideably engage the nut member. The first end of the body has at least one radially inward defined retainer lip. The retainer lip is dimensioned and adapted to engage with a corresponding retaining structure on an external surface of the nut member. | 2011-06-16 |
20110143587 | WATERPROOF ELECTRICAL CONNECTOR AND SYSTEM - In one possible embodiment, a waterproof connector is provided having a unitary compressible housing comprised of a waterproof material encasing a finger board. The finger board is constructed to receive interconnect wires and corresponding electrical contact pins, which are secured to the finger board. The housing has a well portion within the housing, the electrical contact pins extend through the waterproof material from the finger board into the well. Partition portions within the well extend between the electrical contact pins. A sealing lip portion is around the well on a mating side. The housing also has a compressible backing portion behind the finger board. The unitary compressible housing may be constructed to be seated in a structural housing, which may be a recess or the like in a structural member or component of an apparatus. | 2011-06-16 |
20110143588 | CONNECTOR - A waterproof connector has a deformation space ( | 2011-06-16 |
20110143589 | CONNECTING APPARATUS - With a connecting apparatus for connecting a shielded line with a housing the line can be electrically contacted in the housing interior. The connecting apparatus comprises at least one crimp sleeve through the sleeve hollow of which at least one conductor of the line is guidably arrangeable up into the housing interior. A conductor shielding of the line can be fixed at a free end section by means of crimping relative to the crimp sleeve and is in a shielded contact with the housing. According to the invention the corresponding conductor shielding is connected with the housing in an easy manner so as to achieve a corresponding shielded contact between the housing and the conductor shielding. The conductor shielding and the housing as a whole may hence be regarded as a shielding. A good electrical and electronic freedom from interference is obtained for corresponding devices inside the housing as well as for the corresponding connecting apparatus with respect to the environment, see EMC. | 2011-06-16 |
20110143590 | CONNECTOR ASSEMBLY HAVING GROUNDING MEANS - A connector assembly ( | 2011-06-16 |
20110143591 | ELECTRICAL CONNECTOR HAVING CONTACT MODULES - A contact module is provided for an electrical connector. The contact module includes a housing having a mating edge, a mounting edge, and a side. An electrical lead is held by the housing. The electrical lead extends from a mating contact to a mounting contact. The mating contact extends outwardly from the mating edge of the housing. The mounting contact extends outwardly from the mounting edge of the housing. An inner ground shield is mounted on the housing. The inner ground shield includes a housing side segment that extends over at least a portion of the side of the housing between the mating and mounting edges thereof. An outer ground shield is mounted on the housing. The outer ground shield extends over at least a portion of the housing side segment of the inner ground shield. | 2011-06-16 |
20110143592 | ELECTRIC CONNECTION DEVICE - The invention relates to a connection device comprising a male connector ( | 2011-06-16 |
20110143593 | CONNECTOR ASSEMBLY HAVING GROUNDING MEANS - A connector assembly ( | 2011-06-16 |
20110143594 | MULTIPOLAR PLUG - When a multipolar plug and a counter connector are fitted to each other, there is a possibility that a seam joint of a shell of the multipolar plug may coincide with that of a shell the counter connector, and high-frequency noises may leak through gaps of the coincident seam joints. The invention has been conducted in view of the problem, and provides a multipolar plug which can improve the EMI characteristics of a multipolar connector. According to the invention, when the multipolar plug | 2011-06-16 |
20110143595 | Electrical Connection - The invention is an electrical connection ( | 2011-06-16 |
20110143596 | SMART CARD CONNECTOR - A smart card connector may include a connector housing connected to a cover. The connector housing and the cover may define a channel for receiving the smart card. The connector may receive the smart card in an insertion direction. When the smart card is inserted into the smart card connector, contacts secured within the connector housing may establish an electrically conductive connection with contact pads on the surface of the smart card. The connector housing may be narrower than the cover in a second direction that is perpendicular to the first direction. The connector housing may define a first centerline that extends along the insertion direction, and the cover may define a second centerline that extends along the insertion direction. The first centerline may be offset from the second centerline. | 2011-06-16 |
20110143597 | ELECTRICAL CONNECTOR ASSEMBLY WITH CLAMPING MEMBERS - A connector assembly for holding a memory card provided with two card holes, includes an insulated body, two fixing members projecting from two opposite ends of the insulated body, two supporting elements formed on a front side of the insulated body and two clamping members mounted respectively on the opposite ends of the insulated body. Once the memory card is inserted into the electrical connector assembly, the clamping members cooperatively clamp two opposite ends of the memory card therebetween with the supporting elements extend respectively through the card holes in the memory card. | 2011-06-16 |
20110143598 | Lamp tube coupler - A lamp tube coupler is that an insulation terminal seat is respectively disposed to two ends of an expansible outer cylinder. A pair of electrode coupling members is disposed to each insulation terminal seat. The electrode coupling members corresponding to each other at the two ends of the expansible outer cylinder form a conduction mode through respective springs. While using every lamp tube coupler, the coupler is disposed between the two lamp tubes. The electrode coupling members at two ends are respectively inserted into the electrode sockets of the two lamp tubes to achieve the goal of cascading at least two lamp tubes. | 2011-06-16 |
20110143599 | ELECTRICAL CONNECTOR - An electrical connector includes a main body, a tongue board located at the front end of the main body, a plurality of first pins and second pins which are located on the main body and extended into the tongue board. One side of the tongue board forms an operation surface. Each first pin has a first contact portion exposed outside of the operation surface. Each first contact portion defines a first contact area. At least one first contact portion defines a second contact area. The second contact area of the first contact portion is closer to the front end of the tongue board than the first contact area. Each second pin has a second contact portion exposed outside of the operation surface, and the second contact portions are respectively located at the rear end of the first contact portion. The electrical connector can be plugged by plugs with different formats. | 2011-06-16 |
20110143600 | ELECTRICAL CONNECTOR - An electrical connector, comprising an insulative housing defining a base portion and a mating portion extending from the front side of the base portion along a mating direction; a plurality of passageways disposed in the base portion and extending along the mating direction; a plurality of receiving spaces disposed in the mating portion and communicating with the complementary passageways; a plurality of contacts assembling to the insulative housing along the mating direction, and each contact defining a flat base part mounting to the base portion of the insulative housing and a mating part extending from the base part forwards from the base part and into said receiving space; wherein a spring tab extending downwards from the base part of the contact and locked to the insulative housing. | 2011-06-16 |
20110143601 | CONNECTOR - A connector which is to be mounted on a substrate includes a housing member having an opening portion in which an electrical device is to be inserted, and a contact member provided in the housing member to electrically connect the electrical device with the substrate. The contact member includes a first portion, a second portion facing the first portion with a gap and supported elastically with respect to the first portion, and a third portion supported by the second portion. The third portion comes into contact with a terminal of the electrical device electrically when the second portion is pushed by a pushing member which is to be inserted into the gap between the first portion and the second portion. | 2011-06-16 |
20110143602 | INPUT/OUTPUT CONNECTOR WITH CAPACITIVE COUPLING MATING INTERFACE - A plug connector ( | 2011-06-16 |
20110143603 | Connector structure - The present invention provides an improved connector structure, structured to include a covering case, a first base, a second base, a first conducting terminal, a second conducting terminal and a third conducting terminal, in which a plurality of first contact pins extend from the main body of the first conducting terminal, and is disposed in a holding space of the first base. A plurality of second contact pins extend from the main body of the second conducting terminal, and together with the third conducting terminal is disposed in a holding space of the second base, thereby enabling achieving supplying electric power requirements. Furthermore, an outer portion of the connector is covered with a covering case. | 2011-06-16 |
20110143604 | ELECTRICAL CONNECTOR - An electrical connector ( | 2011-06-16 |
20110143605 | ELECTRICAL CONNECTOR WITH CONTACT SPACING MEMBER - A contact sub-assembly is provided for an electrical connector. The contact sub-assembly includes a base having a base surface, and an array of contacts that extend along the base surface of the base. Each contact extends along a length from a terminating end to a tip end. Each contact has a mating interface located along the length of the contact between the terminating end and the tip end. The contact sub-assembly also includes a spacing member formed separately from the base. The spacing member engages at least some of the contacts for positioning the contacts relative to each other within the array. The spacing member includes first and second spacing segments that are discrete from each other and that are configured to move relative to each other. | 2011-06-16 |
20110143606 | AMPHIBIOUS VEHICLE - An amphibious vehicle includes: a hull ( | 2011-06-16 |
20110143607 | ADJUSTABLE ROWING SHOE DEVICE - A device is provided for attaching a rowing shoe to a foot stretcher of a rowing boat. The device has a shoe segment having a first surface for attachment to the rowing shoe and a first locking means. The device also has a stretcher segment having a second surface for attachment to the foot stretcher and a second locking means for releasably engaging with the first locking means. A rowing shoe is also taught, having a shoe segment on a bottom of the rowing shoe for releasable engagement with a corresponding stretcher segment of a foot stretcher of a rowing boat. | 2011-06-16 |
20110143608 | METHOD FOR CONTROLLING A SURFACE DRIVE FOR A WATERCRAFT - A surface drive for a watercraft ( | 2011-06-16 |
20110143609 | OUTBOARD MOTOR CONTROL APPARATUS - In an apparatus for controlling operation of an outboard motor having an internal combustion engine to power a propeller, and a transmission being selectively changeable in gear position to establish speeds including a first speed and a second speed and transmitting power of the engine to the propeller with a gear ratio determined by established speed, engine speed is detected, it is determined whether acceleration is instructed when the second speed is established, and operation of the transmission is controlled to change the gear position from the second speed to the first speed when the acceleration is determined to be instructed, and then change back the gear position from the first speed to the second speed based on the detected engine speed, thereby enabling to control the transmission optimally. | 2011-06-16 |
20110143610 | OUTBOARD MOTOR CONTROL APPARATUS - In an apparatus for controlling operation of an outboard motor having an internal combustion engine to power a propeller, and a transmission being selectively changeable in gear position to establish speeds including a first speed and a second speed and transmitting power of the engine to the propeller with a gear ratio determined by established speed, it is determined whether acceleration is instructed to the engine when the second speed is established and whether a preset condition is met, and operation of the transmission is controlled to change the gear position from the second speed to the first speed when the acceleration is determined to be instructed and the preset condition is met, thereby improving the acceleration performance of immediately after the acceleration is started. | 2011-06-16 |
20110143611 | OUTBOARD MOTOR CONTROL APPARATUS - In an apparatus for controlling operation of an outboard motor having an internal combustion engine to power a propeller and a transmission being selectively changeable in gear position to establish speeds including a first speed and a second speed and transmitting power of the engine to the propeller with a gear ratio determined by established speed, a change amount of throttle opening and a change amount of manifold absolute pressure of the engine are detected, and operation of the transmission is controlled to change the gear position from the second speed to the first speed based on the change amounts of the throttle opening and manifold absolute pressure, thereby enabling to appropriately control the operation of the transmission to suppress the decrease in boat speed even when the resistance of water flow acting on a boat during cruising is increased due to influence of a wave, etc. | 2011-06-16 |
20110143612 | OUTBOARD MOTOR CONTROL APPARATUS - In an apparatus for controlling operation of an outboard motor having an internal combustion engine and a transmission being selectively changeable in gear position to establish speeds including at least a first speed and a second speed and transmitting power of the engine to the propeller with a gear ratio determined by established speed, it is determined whether acceleration is instructed to the engine when the second speed is established and operation of the engine is controlled to increase a fuel amount to be supplied to the engine when detected engine speed is greater than a predetermined speed, thereby improving the performance immediately after acceleration is started. | 2011-06-16 |
20110143613 | SHARK REPELLING ARRANGEMENT - A watercraft in the form of a body board comprising a planar body and a display unit adapted to display at least one animated image. The image is disposed at a bottom side of a lenticular lens. Each of the frames comprise an image of a head of a shark having a mouth opened at a predetermined width, thereby forming an animated image of the shark moving mouth so as to repel sharks. The display unit comprises a digital display, a controller and a power supply unit wherein the controller comprises memory for storing images and controls the images for displaying on the digital screen. The digital display comprises LCD. The supply unit comprises a solar power panel disposed on the top surface of the watercraft. | 2011-06-16 |
20110143614 | PLASTIC SUBSTRATES AND METHODS OF FABRICATING THE SAME - Provided is a plastic substrate. The plastic substrate includes a carbon nanotube thin film having a matrix type mesh shape, and a plastic thin film support configured to at least fill spaces of the matrix type mesh shape and cover one side of the carbon nanotube thin film. The plastic substrate may have a low coefficient of thermal expansion and be flexible and conductive. | 2011-06-16 |
20110143615 | Foldable and flexible laminated mat - A chair pad or a roll up mat that can be manufactured from medium density fiberboard with a laminate surface decorative layer applied thereon. The laminate is treated with various protective coatings, to add resistance to natural deleterious factors including water and dirt. The chair mat includes a series of planks, held together by tape, with an under layer of a mesh, all applied by resin together, and having a bottom layer of a felt or rubber to provide cushioning when the mat is applied upon a floor or surface, and to function as a living hinge, when it is rolled up or folded for storage or shipment. | 2011-06-16 |
20110143616 | EXTERIOR FINISHING SYSTEM AND BUILDING WALL CONTAINING A CORROSION-RESISTANT ENHANCED THICKNESS FABRIC - A corrosion-resistant lath is provided for use in exterior finishing systems, such as stucco systems and exterior insulation and finish systems (“EIFS”). The lath includes in a first embodiment an open, woven fabric comprising weft and warp yarns containing non-metallic fibers, such as glass fibers. A portion of the weft yarns are undulated, resulting in an increased thickness for the fabric. The fabric is coated with a polymeric resin for substantially binding the weft yarns in the undulated condition. This invention also includes methods for making an exterior finish system and building wall including an exterior finish system using such a lath. | 2011-06-16 |