25th week of 2014 patent applcation highlights part 21 |
Patent application number | Title | Published |
20140167254 | BUMP STRUCTURES FOR SEMICONDUCTOR PACKAGE - A package structure includes a first substrate bonded to a second substrate by connecting metal pillars on the first substrate to connectors on the second substrate. A first metal pillar is formed overlying and electrically connected to a metal pad on a first region of the first substrate, and a second metal pillar is formed overlying a passivation layer in a second region of the first substrate. A first solder joint region is formed between metal pillar and the first connector, and a second solder joint region is formed between the second metal pillar and the second connector. The lateral dimension of the first metal pillar is greater than the lateral dimension of the second metal pillar. | 2014-06-19 |
20140167255 | PACKAGE STRUCTURE AND PACKAGE METHOD - Disclosed are a package structure and a package method. The package structure comprises an IC bare die, having bare die pads formed on a surface; a flexible packaging substrate, having first pads formed on a first surface and second pads formed on a second surface; and a plurality of bumps, previously formed on the first surface of the flexible packaging substrate. The bumps have different heights, and correspond to the first pads and contact the bare die pads respectively. Pressing or heating is implemented to package the IC bare die. The package structure further comprises a printed circuit board, having a plurality of contact pads. The second pads of the flexible packaging substrate respectively contact with the contact pads via solders. Connection is implemented by pressing or heating. Extremely low stress is generated to the packaging substrate and the printed circuit board. | 2014-06-19 |
20140167256 | FLIP CHIP PACKAGE STRUCTURE AND FABRICATION PROCESS THEREOF - Disclosed herein are various chip packaging structures and methods of fabrication. In one embodiment, a flip chip package structure can include: (i) a pad on a chip; (ii) an isolation layer on the chip and the pad, where the isolation layer includes a through hole that exposes a portion of an upper surface of the pad; (iii) a metal layer on the pad, where the metal layer fully covers the exposed upper surface portion of the pad; and (iv) a bump on the metal layer, where side edges of the bump do not make contact with the isolation layer. | 2014-06-19 |
20140167257 | FABRICATION OF THREE-DIMENSIONAL HIGH SURFACE AREA ELECTRODES - A method for fabricating three dimensional high surface electrodes is described. The methods including the steps: designing the pillars; selecting a material for the formation of the pillars; patterning the material; transferring the pattern to form the pillars; insulating the pillars and providing a metal layer for increased conductivity. Alternative methods for fabrication of the electrodes and fabrication of the electrodes using CMOS are also described. | 2014-06-19 |
20140167258 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substantially rectangular semiconductor chip having an obverse surface, a first long side, a second long side opposite the first long side, a first short side and a second short side, and a plurality of bump electrodes. A wiring substrate has a main surface, a first side disposed outside of the semiconductor chip and extending substantially parallel with the first long side, a second side disposed outside of the semiconductor chip and extending substantially parallel with the second long side, and a plurality of wiring groups, each including a plurality of wirings. A semiconductor chip is mounted on the wiring substrate such that the obverse surface of the semiconductor chip is faced to the main surface of the wiring substrate and the first long side is located between the first side of the wiring substrate and the second long side, in a plan view. | 2014-06-19 |
20140167259 | PILLAR ON PAD INTERCONNECT STRUCTURES, SEMICONDUCTOR DEVICES INCLUDING SAME AND RELATED METHODS - Methods of fabricating interconnect structures for semiconductor dice comprise forming conductive elements in contact with bond pads on an active surface over a full pillar diameter of the conductive elements, followed by application of a photodefinable material comprising a photoresist to the active surface and over the conductive elements. The polyimide material is selectively exposed and developed to remove photodefinable material covering at least tops of the conductive elements. Semiconductor dice and semiconductor die assemblies are also disclosed. | 2014-06-19 |
20140167260 | SEMICONDUCTOR PACKAGES INCLUDING A PLURALITY OF UPPER SEMICONDUCTOR DEVICES ON A LOWER SEMICONDUCTOR DEVICE - Semiconductor packages are provided. The semiconductor packages may include an upper package including a plurality of upper semiconductor devices connected to an upper package substrate. The semiconductor packages may also include a lower package including a lower semiconductor device connected to a lower package substrate. The upper and lower packages may be connected to each other. | 2014-06-19 |
20140167261 | ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE - A routing layer for a semiconductor die is disclosed. The routing layer includes traces interconnecting integrated circuit bond-pads to UBMs. The routing layer is formed on a layer of dielectric material. The routing layer includes conductive traces arranged underneath the UBMs as to absorb stress from solder bumps attached to the UMBs. Traces beneath the UBMs protect parts of the underlying dielectric material proximate the solder bumps, from the stress. | 2014-06-19 |
20140167262 | SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS - A mechanism is provided by which signal travel distance within and between semiconductor device packages is reduced and substrate size and complexity can be reduced. This capacity is provided by virtue of a conductive via that intersects a wire bond molded within a package substrate. The via provides a direct electrical connection between an external signal transmitter or receiver and the points connected by the wire bond, and thereby avoiding the need for the signal to transit built up interconnects in the semiconductor device package. Conductive vias can provide connectivity through or to a package substrate, and can be through vias or blind vias. The conductive via is formed by either mechanical or laser drilling, and is filled using standard fill techniques, and is therefore readily incorporated into a package production flow. | 2014-06-19 |
20140167263 | Methods and Apparatus for Package with Interposers - Methods and apparatus for an interposer with dams used in packaging dies are disclosed. An interposer may comprise a metal layer above a substrate. A plurality of dams may be formed above the metal layer around each corner of the metal layer. Dams may be formed on both sides of the interposer substrate. A dam surrounds an area where connectors such as solder balls may be located to connect to other packages. A non-conductive dam may be formed above the dam. An underfill may be formed under the package connected to the connector, above the metal layer, and contained within the area surrounded by the dams at the corner, so that the connectors are well protected by the underfill. Such dams may be further formed on a printed circuit board as well. | 2014-06-19 |
20140167264 | INTEGRATED CIRCUITS AND METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH SILICIDE CONTACTS ON NON-PLANAR STRUCTURES - Integrated circuits and methods for fabricating integrated circuits are provided. In an embodiment, a method for fabricating an integrated circuit includes providing a semiconductor substrate and forming fins over the semiconductor substrate. Each fin is formed with sidewalls. The method further includes conformally depositing a metal film stack on the sidewalls of each fin. In the method, the metal film stack is annealed to form a metal silicide film over the sidewalls of each fin. | 2014-06-19 |
20140167265 | METHODS OF FORMING A BI-LAYER CAP LAYER ON COPPER-BASED CONDUCTIVE STRUCTURES AND DEVICES WITH SUCH A CAP LAYER - One illustrative device disclosed herein includes a layer of insulating material, a copper-based conductive structure positioned in the layer of insulating material and a bi-layer cap layer comprised of a first layer of material positioned on the copper-based conductive structure and a second layer of material positioned on the first layer of material. One method disclosed herein includes forming a copper-based conductive structure in a first layer of insulating material, forming a first layer of a bi-layer cap layer on the copper-based conductive structure, the first layer being comprised of silicon carbon nitride, forming a second layer of the bi-layer cap layer on the first layer, the second layer being comprised of silicon nitride, and forming a second layer of insulating material above the second layer. | 2014-06-19 |
20140167266 | SEMICONDUCTOR DEVICE HAVING PERIPHERAL POLYMER STRUCTURES - A semiconductor device includes a semiconductor chip including a first main face and a second main face wherein the second main face is the backside of the semiconductor chip. Further, the semiconductor device includes an electrically conductive layer, in particular an electrically conductive layer, arranged on a first region of the second main face of the semiconductor chip. Further, the semiconductor device includes a polymer structure arranged on a second region of the second main face of the semiconductor chip, wherein the second region is a peripheral region of the second main face of the semiconductor chip and the first region is adjacent to the second region. | 2014-06-19 |
20140167267 | METHOD AND STRUCTURES FOR HEAT DISSIPATING INTERPOSERS - A method for making an interconnect element includes depositing a thermally conductive layer on an in-process unit. The in-process unit includes a semiconductor material layer defining a surface and edges surrounding the surface, a plurality of conductive elements, each conductive element having a first portion extending through the semiconductor material layer and a second portion extending from the surface of the semiconductor material layer. Dielectric coatings extend over at least the second portion of each conductive element. The thermally conductive layer is deposited on the in-process unit at a thickness of at least 10 microns so as to overlie a portion of the surface of the semiconductor material layer between the second portions of the conductive elements with the dielectric coatings positioned between the conductive elements and the thermally conductive layer. | 2014-06-19 |
20140167268 | GRAPHENE AND METAL INTERCONNECTS - A graphene and metal interconnect structure and methods of making the same are disclosed. The graphene is a multiple layer graphene structure that is grown using a graphene catalyst. The graphene forms an electrical connection between two or more VIAs or components, or a combination of VIAs and components. A VIA includes a fill metal, with at least a portion of the fill metal being surrounded by a barrier metal. A component may be a routing track, a clock signal source, a power source, an electromagnetic signal source, a ground terminal, a transistor, a macrocell, or a combination thereof. The graphene is grown, using a graphene catalyst, from both solid and liquid carbon sources using chemical vapor deposition (CVD) at a temperature between 300° C.-400° C. The graphene catalyst can be an elemental form of, or alloy including, nickel, palladium, ruthenium, iridium or copper. | 2014-06-19 |
20140167269 | Methods and Apparatus of Packaging with Interposers - Methods and apparatus for forming a semiconductor device package on an interposer using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, where a micro-bump is used as a vertical connection between a die and the interposer, and a micro-bump line is used as a horizontal connection for signal transmission between different dies above the interposer. The micro-bump lines may be formed at the same time as the formation of the micro-bumps with little or no additional cost. | 2014-06-19 |
20140167270 | Method of Fabricating a Layer Stack - In one embodiment method, a first Ti based layer is deposited on the substrate. An intermediate Al based layer is deposited on the first layer, a second NiV based layer is deposited on the intermediate layer, and a third Ag based layer is deposited on the second layer. The layer stack is tempered in such a way that at least one inter-metallic phase is formed between at least two metals of the group containing Ti, Al, Ni and V. | 2014-06-19 |
20140167271 | INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF - An interconnect structure and a forming method thereof are provided. The method includes: providing a semiconductor substrate which has semiconductor devices formed therein; forming a conductive layer on the semiconductor substrate; forming a mask layer on the conductive layer; forming a groove in the mask layer and the conductive layer, the groove having a depth-to-width ratio greater than 0.8; and depositing an intermetallic dielectric layer to cover the mask layer and fill the groove, wherein an air gap is formed in a portion of the intermetallic dielectric layer in the groove. The mask layer is formed on the conductive layer, so that the depth-to-width ratio of the groove between adjacent interconnects is increased. Besides, the air gap with a relatively large size is formed between two adjacent interconnects. Therefore, a dielectric constant and parasitic capacitance between adjacent interconnects are reduced evidently, and the performance of the semiconductor devices is improved. | 2014-06-19 |
20140167272 | Semiconductor Device Having an Identification Mark - A semiconductor device includes a chip, a contact pad arranged over the front side of the chip and an identification mark arranged over the contact pad. The identification mark includes an information about a property of the chip. | 2014-06-19 |
20140167273 | LOW PARASITIC PACKAGE SUBSTRATE HAVING EMBEDDED PASSIVE SUBSTRATE DISCRETE COMPONENTS AND METHOD FOR MAKING SAME - One feature pertains to a multi-layer package substrate of an integrated circuit package that comprises a discrete circuit component (DCC) having at least one electrode. The DCC is embedded within an insulator layer, and a via coupling component electrically couples to the electrode. A first portion of the via coupling component extends beyond a first edge of the electrode, and a plurality of vias each having a first end couple to the first via coupling component. At least a first via of the plurality of vias couples to the first portion of the via coupling component that extends beyond the first edge of the electrode. Moreover, the plurality of vias each have a second end that electrically couple to a first outer metal layer, and at least a second portion of the via coupling component is positioned within a first inner metal layer. | 2014-06-19 |
20140167274 | ARRAY SUBSTRATE AND DISPLAY DEVICE - The embodiments of the present invention disclose an array substrate and a display device. The array substrate comprises a substrate and a first transparent conductive layer, an insulating layer and a second transparent conductive layer sequentially formed on the substrate, wherein the second transparent conductive layer has a plurality of slit structures, the first transparent conductive layer has a plurality of protrusions corresponding to the plurality of slit structures, and a height of the plurality of protrusions is smaller than a distance between the first transparent conductive layer and the second transparent conductive layer. | 2014-06-19 |
20140167275 | EMBEDDED PACKAGE AND METHOD OF MANUFACTURING THE SAME - An embedded package in which active elements, such as semiconductor chips, are embedded within a package substrate. The semiconductor chips, embedded within a dielectric layer, are coupled with circuit wires to ensure electrical and signal continuity. | 2014-06-19 |
20140167276 | SUBSTRATE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE USING THE SUBSTRATE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - A semiconductor package includes a package substrate, semiconductor chips adhered over the package substrate and configured to include bonding pads, one or more dummy patterns disposed at specific intervals in peripheries of the semiconductor chips, an insulating layer formed over the package substrate including the semiconductor chips and the dummy patterns so that the bonding pads are exposed, and wire patterns formed over the insulating layer and coupled with the bonding pads. | 2014-06-19 |
20140167277 | SEMICONDUCTOR WIRING PATTERNS - A semiconductor device includes a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element includes, a plurality of first electrodes formed along a first edge of a surface thereof, a plurality of second electrodes formed along an edge opposite to the first edge of the surface, a plurality of third electrodes formed in the neighborhood of a functional block, and an internal wiring for connecting the first electrodes and the third electrodes. The substrate includes, a first wiring pattern for connecting the external input terminal and the first electrodes, a second wiring pattern for connecting the external output terminal and the second electrodes, and a third wiring pattern for connecting the first electrodes and the third electrodes. | 2014-06-19 |
20140167278 | STUB MINIMIZATION USING DUPLICATE SETS OF TERMINALS FOR WIREBOND ASSEMBLIES WITHOUT WINDOWS - A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the front face. First terminals provided in first and second parallel grids or in first and second individual columns can be configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid can have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid. | 2014-06-19 |
20140167279 | STUB MINIMIZATION USING DUPLICATE SETS OF SIGNAL TERMINALS IN ASSEMBLIES WITHOUT WIREBONDS TO PACKAGE SUBSTRATE - A microelectronic assembly can include a circuit panel having first and second panel contacts at respective first and second surfaces thereof, and first and second microelectronic packages each having terminals mounted to the respective panel contacts. Each package can include a microelectronic element having a face and contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The terminals can include first terminals at positions within first and second parallel grids. The first terminals can be configured to carry address information usable by circuitry within the package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic element. Signal assignments of the first terminals in the first grid can be a mirror image of signal assignments of the first terminals in the second grid. | 2014-06-19 |
20140167280 | SEMICONDUCTOR DEVICE - A semiconductor device including a chip stack structure having a plurality of semiconductor chips, the semiconductor chips being stacked such that they are electrically connected using through-electrodes, and a support frame attached to a side surface of the chip stack structure. | 2014-06-19 |
20140167281 | STACK TYPE SEMICONDUCTOR CIRCUIT WITH IMPEDANCE CALIBRATION - A stack type semiconductor circuit includes a plurality of semiconductor chips stacked therein, wherein the plurality of semiconductor chips are configured to share impedance calibration information. The plurality of semiconductor chips include at least one resistance value of an external resistor and an impedance calibration signal as the impedance calibration information. | 2014-06-19 |
20140167282 | SEMICONDUCTOR DEVICE - A semiconductor device includes a multilayer substrate, a semiconductor element secured to an upper surface of the multilayer substrate, a first metal pattern located on a portion of a lower surface of the multilayer substrate, a dielectric having a higher permittivity than the multilayer substrate and located on the lower surface of the multilayer substrate, and a bottom surface electrode located on a bottom surface of the semiconductor device. The bottom surface electrode, the dielectric, and the first metal pattern together form a bypass capacitor. | 2014-06-19 |
20140167283 | INTERCONNECT STRUCTURE AND FABRICATION METHOD - A carbon-containing dielectric layer can be formed on a substrate. A protective layer can be formed on the carbon-containing dielectric layer to prevent carbon loss from the carbon-containing dielectric layer by performing a surface treatment to the carbon-containing dielectric layer using a gas at least containing silicon and hydrogen. A hard mask layer can be formed on the protective layer. A through hole can be formed in the carbon-containing dielectric layer using the hard mask layer as a mask to expose a surface of the substrate for forming a contact plug in the through hole. | 2014-06-19 |
20140167284 | INTERCONNECT STRUCTURE AND FORMING METHOD THEREOF - An interconnect structure and a forming method thereof are provided. The method includes: providing a semiconductor substrate which has semiconductor devices formed therein; forming an interlayer dielectric layer on the semiconductor substrate; forming a conductive layer on the interlayer dielectric layer; forming a groove in the conductive layer and the interlayer dielectric layer, the groove having a depth smaller than a sum of a thickness of the conductive layer and a thickness of the interlayer dielectric layer and having a depth-to-width ratio greater than 0.8; and depositing an intermetallic dielectric layer to cover the conductive layer and fill the groove, and forming an air gap in the intermetallic dielectric layer in the groove. The depth-to-width ratio of the groove and a size of the air gap are increased. Therefore, parasitic capacitance between the adjacent interconnects is reduced, and the performance of the semiconductor devices is improved. | 2014-06-19 |
20140167285 | INTERCONNECT STRUCTURE AND FABRICATION METHOD - An interconnect structure and fabrication method are provided. A substrate can include a semiconductor device disposed in the substrate. At least two porous films can be formed over the substrate and can include a first porous film having a first pore size, and a second porous film having a second pore size formed on the first porous film. The first porous size and the second porous size are different. The interconnect can be formed through the plurality of porous films to provide electrical connection to the semiconductor device in the substrate. | 2014-06-19 |
20140167286 | SEMICONDUCTOR DEVICE - A semiconductor device includes a TSV that penetrates a silicon substrate. A seal ring is provided from a first low relative permittivity film that is closest to the silicon substrate to a second low relative permittivity film that is farthest from the silicon substrate. The seal ring is formed to surround the TSV in bird's eye view on the silicon substrate from a wafer front surface. This achieves suppression of generation or progress of a crack in a low relative permittivity film in a semiconductor device including the low relative permittivity film and a TSV. | 2014-06-19 |
20140167287 | MICROELECTRONIC PACKAGE WITH TERMINALS ON DIELECTRIC MASS - A package for a microelectronic element, such as a semiconductor chip, has a dielectric mass overlying the package substrate and microelectronic element and has top terminals exposed at the top surface of the dielectric mass. Traces extending along edge surfaces of the dielectric mass desirably connect the top terminals to bottom terminals on the package substrate. The dielectric mass can be formed, for example, by molding or by application of a conformal layer. | 2014-06-19 |
20140167288 | SEMICONDUCTOR DEVICE INCLUDING CONTACT PLUG AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a substrate having a conductive area, a first pattern formed on the substrate and having a contact hole through which the conductive area is exposed, and a contact plug in the contact hole. The contact plug includes first and second silicon layers. The first silicon layer, formed from a first compound including at least two silicon atoms, is formed in the contact hole to contact a top surface of the conductive area and a side wall of the first pattern. The second silicon layer, formed from a second compound including a number of silicon atoms less than the number of the silicon atoms of the first compound, is formed on the first silicon layer and fills a remaining space of the contact hole, the second silicon layer being spaced apart from the first pattern at an entrance of the contact hole. | 2014-06-19 |
20140167289 | SEMICONDUCTOR DEVICE HAVING THROUGH ELECTRODE AND METHOD OF FABRICATING THE SAME - A semiconductor device includes a substrate, and a through electrode passing through the substrate. The semiconductor device has a pad region and a through electrode region. A pad covers the pad region, extends into the through electrode region, and delimits an opening in the through electrode region. A through electrode extends through the semiconductor substrate below the hole in the pad in the through region. | 2014-06-19 |
20140167290 | METHODS OF FORMING FINE PATTERNS IN THE FABRICATION OF SEMICONDUCTOR DEVICES - In a method of forming a semiconductor device, a feature layer is provided on a substrate and a mask layer is provided on the feature layer. A portion of the mask layer is removed in a first region of the semiconductor device where fine features of the feature layer are to be located, the mask layer remaining in a second region of the semiconductor device where broad features of the feature layer are to be located. A mold mask pattern is provided on the feature layer in the first region and on the mask layer in the second region. A spacer layer is provided on the mold mask pattern in the first region and in the second region. An etching process is performed to etch the spacer layer so that spacers remain at sidewalls of pattern features of the mold mask pattern, and to etch the mask layer in the second region to provide mask layer patterns in the second region. The feature layer is etched using the mask layer patterns as an etch mask in the second region and using the spacers as an etch mask in the first region to provide a feature layer pattern having fine features in the first region and broad features in the second region. | 2014-06-19 |
20140167291 | SEMICONDUCTOR PACKAGE HAVING SUPPORTING PLATE AND METHOD OF FORMING THE SAME - A semiconductor package may include a packaging substrate, a first semiconductor chip on the packaging substrate, and a support plate on the packaging substrate. The support plate may be spaced apart from the first semiconductor chip in a direction parallel with respect to a surface of the packaging substrate. A second semiconductor chip may be provided on the first semiconductor chip and on the support plate so that the first semiconductor chip is between the second semiconductor chip and the packaging substrate and so that the support plate is between the second semiconductor chip and the packaging substrate. An adhesion layer may bond the second semiconductor chip to the first semiconductor chip and may bond the second semiconductor chip to the support plate. In addition, an electrical coupling may be provided between the first semiconductor chip and the packaging substrate. | 2014-06-19 |
20140167292 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - The present invention provides a multichip package in which a first semiconductor chip having an RF analog circuit area and a digital circuit area, and a second semiconductor chip having a digital circuit area are plane-arranged over an organic multilayer wiring board and coupled to each other by bonding wires. In the multichip package, the first semiconductor chip is made thinner than the second semiconductor chip. | 2014-06-19 |
20140167293 | INTEGRATED CIRCUIT WITH BUMP CONNECTION SCHEME - An integrated circuit includes first and second bump pads spaced from each other with a first space, configured to receive differential signals for a normal operation, and at least one redundant bump pad spaced from the first bump pad with a second space smaller than the first space, configured to receive a signal for a repair to the differential signals. | 2014-06-19 |
20140167294 | FUNCTIONAL FILM, ENVIRONMENTALLY SENSITIVE ELECTRONIC DEVICE PACKAGE, AND MANUFACTURING METHODS THEREOF - An environmentally sensitive electronic device package including a first adhesive, at least one first side wall barrier, a first substrate, and a second substrate is provided. The first adhesive has a first surface and a second surface opposite to the first surface. The first side wall barrier is distributed in the first adhesive. The first substrate is bonded with the first surface. The first substrate has an environmentally sensitive electronic device formed thereon and the environmentally sensitive electronic device is surrounded by the first side wall barrier. The second substrate is bonded with the second surface. A manufacturing method of the environmentally sensitive electronic device package is also provided. | 2014-06-19 |
20140167295 | COATINGS FOR RELATIVELY MOVABLE SURFACES - A device comprises a MEMS component comprising at least one surface and a coating disposed on at least a portion of the surface. The coating comprises a compound of the formula M(C | 2014-06-19 |
20140167296 | METHODS OF FORMING CONFIGURABLE MICROCHANNELS IN PACKAGE STRUCTURES - Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods and structures may include forming a sacrificial microchannel material on a device, forming an overmold material on the sacrificial microchannel material, and vaporizing the sacrificial microchannel material to form microchannel structures in the overmold that are conformal to the surfaces of the device. | 2014-06-19 |
20140167297 | ALIGNMENT MARK DESIGN FOR SEMICONDUCTOR DEVICE - Better alignment mark designs for semiconductor devices may substantially lessen the frequency of layer misalignment scanner alignment problems. Exemplary alignment mark designs substantially avoid or minimize damage during the fill-in and etching and chemical mechanical processing processes. Thus, additional processing steps to even out various layers or to address the misalignment problems may also be avoided. | 2014-06-19 |
20140167298 | ALIGNMENT APPARATUS, EXPOSING APPRATUS INCLUDING THE SAME, AND MANUFACTURING METHOD OF LIQUID CRYSTAL DISPLAY DEVICE - Exemplary embodiments of the invention relate to an alignment apparatus including a source unit providing an electromagnetic signal, a receiving unit detecting the provided electromagnetic signal, and a polarization element positioned between the source unit and the receiving unit and having a transmissive axis fixed in a predetermined direction. A substrate may be positioned between the source unit and the receiving unit, and may be formed with a polarizer including a plurality of metal lines with a minute linear pattern. The luminance or intensity of the electromagnetic signal may be detected by the receiving unit while rotating the substrate. | 2014-06-19 |
20140167299 | Process for Producing Dispersible Powders - A process for producing dispersible powders by spray-drying aqueous polymer dispersions and adding antiblocking agent, wherein antiblocking agents present in agglomerated form and having a particle size from 10 μm to 250 μm, or having a particle size from 5 mm to 5 cm in the case of agglomerates in the form of extrudates, are fed in whole or in part by a transport gas into the spray-drying device and are comminuted to a particle size from 0.01 μm to 5 μm, or, in the case of extrudates, to a particle size from 2 μm to 60 μm. | 2014-06-19 |
20140167300 | PHOTO-CURABLE RESIN COMPOSITIONS AND METHOD OF USING THE SAME IN THREE-DIMENSIONAL PRINTING FOR MANUFACTURING ARTIFICIAL TEETH AND DENTURE BASE - Photo-curable compositions for artificial teeth and denture base and a method for manufacturing denture by a three-dimensional printing system are provided. The compositions include photo-curable organic compounds, surface modified nano-sized inorganic filler, photo-initiator, colorant, and stabilizer. The composition is in a viscous liquid state having 1500-5000 cps at ambient temperature and has a low viscosity of 50-500 cps at jetting temperature or dispensing temperature. The composition also has an excellent curing rate for three-dimensional printing. Using the compositions, denture having a distinctive denture base and a set of artificial teeth can be manufactured via an inkjet type or digital light process type three-dimensional printing according to Computer Aided Design (CAD) data. | 2014-06-19 |
20140167301 | APPARATUS FOR HEATING PLASTIC PREFORMS WITH SAFETY DEVICE - An Apparatus for heating plastic preforms, with a transport device which transports the plastic preforms along a predefined transport path, wherein the transport device has a plurality of holding elements for holding the plastic preforms, with at least one heating device which heats the plastic preforms transported by the transport device. The heating device has a movable wall element which is arranged for at least part of the time below the transport path of the plastic performs. The apparatus also includes a detection device which detects an incorrect position and/or a falling of at least one plastic preform in relation to the holding element holding this, as well as a control device which initiates a movement of the wall element on the basis of an incorrect position and/or falling of the at least one plastic preform detected by the detection device. | 2014-06-19 |
20140167302 | PULP MOLDED BIODEGRADABLE REMOVE-ABLY CONNECTABLE LID - By creating a slurry of biodegradable material, forming it in a mold under a vacuum, a channel may be created in the lid which can be release-ably connected to a traditional rolled lip coffee cup, among other common liquid holding vessels but be made out of biodegradable material. The resulting lid may be elastic enough such that the lid will give to allow a complementary cup to fit into the channel to create a seal between the cup and the lids. It also will be firm enough to withstand the weight and pressure of the liquid inside the container and from pressure from consumers while using the container. The lid also may be sufficiently heat resistant to withstand desired temperatures and liquid exposure for a time long enough for a consumer to enjoy the contents of the container but also be biodegradable. | 2014-06-19 |
20140167303 | PRESSING TOOL AND METHOD FOR PRODUCING A SILICONE ELEMENT - A pressing tool for pressing a silicone element may include: an upper pressing tool half and a lower pressing tool half, which in the closed state of the pressing tool form a cavity for pressing a silicone element, and a carrier foil, which bears on one of the pressing tool halves, for the silicone element to be pressed, wherein at least the upper pressing tool half or the lower pressing tool half has at least one clamping element for aligning the two pressing tool halves with respect to one another, and wherein the clamping element is arranged between the pressing tool halves and outside the region covered by the carrier foil. | 2014-06-19 |
20140167304 | HONEYCOMB STRUCTURE, MANUFACTURING METHOD THEREOF, AND CATALYST CARRYING HONEYCOMB STRUCTURE - There is disclosed a honeycomb structure onto which a large amount of catalyst can be carried while suppressing an increase in pressure drop. In a honeycomb structure comprising porous partition walls by which a plurality of cells that become through channels of a fluid are partitioned and in which a plurality of pores are formed. In each of the partition walls, pores having pore diameters larger than a thickness of the partition wall in a section thereof which is perpendicular to an extending direction of the cells are formed so as to occupy 4 to 11% of the total volume of the pores formed in the partition walls. | 2014-06-19 |
20140167305 | POLISHING PAD WITH MULTI-MODAL DISTRIBUTION OF PORE DIAMETERS - Polishing pads with multi-modal distributions of pore diameters are described. Methods of fabricating polishing pads with multi-modal distributions of pore diameters are also described. | 2014-06-19 |
20140167306 | SEALING APPARATUS AND METHOD OF FOAM INJECTION MOLD - A sealing apparatus of a foam injection mold that includes an upper mold that is disposed on an upper side as a movable mold to inject a core and a vacuum forming mold to form a skin. The upper mold and the vacuum forming mold are operated integrally and a lower mold is used during injection-molding and foaming of the core. A resilient sealing unit is integrally formed with the core when the core is injection-molded between the upper mold and the lower mold, to attach the core and the skin while the lower mold in which the core is formed and the vacuum forming mold in which the skin is formed are combined using a resilient restoring force. The resilient sealing unit seals a foaming space between the core and the skin. | 2014-06-19 |
20140167307 | CHEMICAL COMPOSITIONS FOR DELIVERY OF PHARMACEUTICAL AGENTS - One or more of hydrolysed wheat flour, soluble dietary fibre, prebiotic dietary fibre, polydextrose and soluble corn fibre are used as basic matrix-forming ingredients in an expanded food product. The matrix-forming ingredients are mixed together with water, plus a whey protein isolate or whey protein concentrate, to increase the protein content of the food. A dough is formed which is then formed into pieces which are temperature conditioned before being expanded under a vacuum caused by evaporation of moisture in the dough. All steps of the process of making the expanded food products, including any subsequent drying, is carried out at a temperature not exceeding 75° C., which advantageously allows mixing in of temperature sensitive ingredients, e.g. vitamins, pharmaceuticals, at the dough forming stage. The products have a honeycomb structure and there is no significant change in flavour or nutritional value of the ingredients caused by the process of manufacture. Advantageously, acrylamide formation is also avoided. | 2014-06-19 |
20140167308 | DIPPING MANDREL WITH A GAP - A mandrel ( | 2014-06-19 |
20140167309 | INTEGRATION OF DEVICES AND ELECTRICAL CONNECTIONS IN COMPONENTS OR STRUCTURAL PARTS OF POLYMERIC MATERIAL INSTALLED ON A VEHICLE - The invention relates to a method for the manufacturing of a component or a structural part made of polymeric material, adapted to integrate electrical devices and connections, and a system for carrying out the method. The method includes injection moulding of a composite material including: a non-conductive polymeric matrix; a dispersed phase including at least one carbonization promoter to form carbonaceous conductive structures; and a reinforcing-fibre filler to direct the distribution and orientation of the dispersed phase in the polymeric matrix, wherein injection of the composite material into a mould for forming the component or the structural part includes supplying the material in a spatially more-concentrated way at pre-established regions of the component or of the structural part designed for the incorporation of electrical devices or connections, and supplying the material in a spatially more spread-out way elsewhere. | 2014-06-19 |
20140167310 | PROCESS FOR FORMING CONTAINER BLANK - A blank is used to form at least a portion of a container. A process for forming the blank includes several steps such as providing a sheet of material and cutting the sheet of material to establish the blank and scrap. | 2014-06-19 |
20140167311 | CONTAINER FORMING PROCESS - A container includes a body formed to include an interior region and a floor coupled to a lower portion of the body to form a boundary of the interior region. A thermoforming process is provided for making the container using a polymeric material. | 2014-06-19 |
20140167312 | METHOD OF CURING THERMOPLASTIC POLYMER FOR SHAPE MEMORY MATERIAL - A method of preparing a cured thermoplastic material includes curing a thermoplastic polymer having a thermal decomposition temperature greater than or equal to about 200° C., at a temperature of about 200° C. to about 400° C., for a total time of less than or equal to 200 hours. A method of making a shape memory material also includes curing a thermoplastic polymer to prepare a cured thermoplastic material. | 2014-06-19 |
20140167313 | A PELLET MILL WITH AN IMPROVED FEED SYSTEM AND A METHOD OF FORMING PELLETED MATERIAL - The invention pertains to a pellet mill | 2014-06-19 |
20140167314 | CELLULAR POLYMERIC MATERIAL - A formulation includes a polymeric material and can be used to form an insulated container. | 2014-06-19 |
20140167315 | Continuous Fiber Reinforced Biocomposites and Polymers - A device for introducing continuous fiber into a product material is provided. The continuous fiber is provided from at least one continuous fiber supply. The device comprises a housing having a first opening and a second opening. A channel is formed through the housing from the first opening to the second opening. At least one fin member extends from the housing into the channel with the at least one fin member having a conduit formed therethrough. Upon the product material travelling through the channel of the housing, the continuous fiber travels from the continuous fiber supply, through the conduit, and into the product material. The continuous fiber increases strength and stiffness of the product material while decreasing time-dependent creep deformation of the product material. | 2014-06-19 |
20140167316 | METHOD AND DEVICE FOR THE PRODUCTION OF FORM PARTS - The invention relates to a method for the production of form parts from multi-component reactive plastic material, especially from polyurethane, wherein a plurality of moulds are moved by means of mould carriages ( | 2014-06-19 |
20140167317 | METHODS OF MANUFACTURING A CONTACT ARRAY ASSEMBLY AND LEADS AND SYSTEMS CONTAINING THE ASSEMBLY - A method of making an electrical stimulation lead includes disposing conductive contacts in a spaced-apart longitudinal arrangement within a mold. A portion of a stylet tube is disposed within the mold, and the stylet tube extends through the conductive contacts. Conductive wires are positioned external to the stylet tube and each contact is coupled to at least one of the wires. A non-conductive material is molded between adjacent pairs of the contacts, around the wires, and over the stylet tube, to form a portion of the lead. This portion includes the contacts, the stylet tube, the wires, and one or more non-conductive spacers formed from the non-conductive material. Finally, the portion of the lead is removed from the mold. Another method includes placing a temporary tube around the conductive contacts and forming spacers by introducing flowable, curable, non-conductive material within the tube and between the conductive contacts. | 2014-06-19 |
20140167318 | Apparatus and method for producing plastics material pre-forms from a thermoplastic plastics material - The invention relates to an apparatus for producing plastics material pre-forms from a thermoplastic plastics material ( | 2014-06-19 |
20140167319 | COLLAPSIBLE MANDREL FOR MANUFACTURING THREE-DIMENSIONAL STRUCTURES - A mandrel for manufacturing a three-dimensional structure from a composite material. The external surface of the mandrel can at least partially correspond to the inner surface of the three-dimensional structure. The mandrel can include a plurality of expandable particles configured to increase responsive to a threshold condition. The mandrel can be configured to crack responsive to a triggering condition. | 2014-06-19 |
20140167320 | THREAD FORMING DEVICE FOR COMPRESSION MOLDING AND APPARATUS INCORPORATING SAME - A thread forming device for compression molding comprises a base positioned adjacent a compression molding device, a plurality of posts extending from the base, a carrier moveable along the posts and supporting at least one rotatable threaded shaft, each shaft being configured for forming a threaded bore during compression molding of a part, an assembly for rotatably driving the at least one threaded shaft for unthreading the at least one threaded shaft from the part, and one or more biasing members configured to push the carrier away from the base once the at least one threaded shaft is unthreaded from the part. | 2014-06-19 |
20140167321 | METHOD TO WARM PLASTIC SIDE OF MOLD - An ice producing mold has a first mold portion having a top surface and a second mold portion having a bottom surface. When the mold is in a closed position, a bottom surface of the first mold portion abuts a top surface of the second mold portion and when the mold is in an open position, the bottom surface of the first mold portion is separated from the top surface of the second mold portion. Each mold portion also includes a concave depression such that when the mold is in the closed position, the concave depression on the bottom surface of the first mold portion and the concave depression on the top surface of the second mold portion form a cavity adapted to form an ice structure. The depression is warmed by flowing warm water into a cavity located adjacent to the concave depression and the ice is released. | 2014-06-19 |
20140167322 | SYSTEM AND METHOD FOR MOLDING ELASTOMER PARTS USING A TEMPERATURE-ACTIVATED PRESSURE APPLICATOR - This invention provides a method and system for manufacturing rubber parts that utilize a high temperature and high pressure molding process. In this method and system, uncured rubber in sheet form is contained within a metallic or other type of rigid mold cavity along with a pressure applicator which expands due to the heating and pressurizes the mold cavity. The pressure applicator may be made from silicone rubber, or other types of rubber exhibiting high coefficient of thermal expansion, and resistance to high temperatures. The assembly of the uncured rubber sheet, the pressure applicator, and the mold is heated to a specified temperature, and the thermal expansion of the pressure applicator consolidates the rubber sheet into the desired form as the rubber cures. | 2014-06-19 |
20140167323 | Safety and Clamping Device for an Apparatus for Fabricating Parts - An apparatus of the present invention presents a housing for engaging a mold device that includes a top plate having a top mold and a bottom plate having a bottom mold. The top plate presents side edges presenting a plurality of male elements extending therefrom. A top portion of the housing presents a safety and locking device (the device) to secure the top plate. The device presents several plates movable relative one another to secure the top plate. In case of a power outage, an actuator cooperably connected with the device prevents a shaft, connected to one of the plates, to move back to its idle position thereby locking the top plate within the device to prevent disengagement of the top plate from the device. | 2014-06-19 |
20140167324 | POLYMERIC STENT POLISHING METHOD AND APPARATUS - A method and apparatus for simultaneously polishing the inner and outer surfaces of an unpolished polymeric stent using a heat process. The unpolished stent can be mounted, for example, on a “spiral-mandrel,” a tubular helical structure with gaps in between a series of coils of the structure. Heat from a heat source can then applied to the spiral-mandrel at a range between the glass transition temperature and melting temperature of the polymer of the stent. | 2014-06-19 |
20140167325 | MOLDING METHOD AND MOLDING APPARATUS - A molding method includes drawing cross-section elements of a three-dimensional object as a molding target on a drawing surface of a drawing stand with a liquid whose curing is precipitated by receiving activation energy as cross-section patterns; applying the activation energy to the liquid configuring the cross-section patterns in a state in which the cross-section patterns is pinched between the drawing stand and a molding stand; and detaching the cross-section patterns after being applied with the activation energy from the drawing stand and transferring the cross-section patterns to the molding stand side, wherein the drawing surface has a liquid repellent area that is an area representing liquid repellency for the liquid and a lyophilic area that is independently formed in an island shape within the liquid repellent area and is an area representing lyophillicity stronger than that of the liquid repellent area for the liquid. | 2014-06-19 |
20140167326 | ADDITIVE BUILDING - An additive building method for building a plurality of layers to form a build stack is provided. The method includes creating a variable potential difference between a conducting element at a first voltage potential and an ion source at a second voltage potential, and creating an electric field between the conducting element and the ion source. The electric field passes through the build stack to a nearest surface of the build stack which is nearest a transfer medium. The method further includes accumulating electric charge from the ion source on the nearest surface of the build stack, and transferring deposition material from a transfer medium onto the nearest surface. The strength of the field at the nearest surface of the build stack is controlled in order to cause a homogenous transfer of the deposition material on to the nearest surface. | 2014-06-19 |
20140167327 | SURFACE ANNEALING OF COMPONENTS FOR SUBSTRATE PROCESSING CHAMBERS - A method of fabricating a processing chamber component comprises forming a processing chamber component having a structural body with surface regions having microcracks, and directing a laser beam onto the microcracks of the surface regions of the structural body for a sufficient time to heal and close off the microcracks by themselves. | 2014-06-19 |
20140167328 | METHOD OF TREATING A FIBER CUSHION BODY - A fiber cushion body, which is formed from cross-linked fiber material and which is resiliently deformable when load is applied along a main load direction, is treated using ultrasonic energy. A portion of the fiber cushion body is displaced, for example using a sonotrode, and ultrasonic vibrations are applied to the fiber cushion body to re-shape the fiber cushion body from a first shape to a second shape different from the first shape. | 2014-06-19 |
20140167329 | HIGH TEMPERATURE MELT INTEGRITY BATTERY SEPARATORS VIA SPINNING - A method for preparing a high temperature melt integrity separator, the method comprising spinning a polymer by one or more of a mechanical spinning process and an electro-spinning process to produce fine fibers. | 2014-06-19 |
20140167330 | METHOD FOR THE PRODUCTION OF A COMPONENT OR A STRUCTUAL PART ON-BOARD A VEHICLE ADAPTED TO INTEGRATE ELECTRICAL DEVICES AND CONNECTIONS, AND COMPOSITE MATERIAL FOR THE REALIZATION OF SAID COMPONENT OR STRUCTURAL PART - A composite material for the realization of a component or a structural part, in particular for installation on-board a vehicle, adapted to integrate electrical devices and connections, includes a non-conductive polymeric matrix; a dispersed phase including at least one promoter of carbonization adapted to form carbonaceous conductive structures; and a reinforcing-fibre filler adapted to direct the distribution and orientation of the dispersed phase in the polymeric matrix. | 2014-06-19 |
20140167331 | METHOD FOR PRODUCING A CERAMIC FILTER ELEMENT - In a method for manufacturing a ceramic filter element for an exhaust gas filter of internal combustion engines, a combustible non-ceramic filter medium is shaped to a coil and impregnated with a ceramic slurry having a powder size distribution selected such that the ceramic filter element in the finished state has a desired porosity distribution that varies across the coil cross-section of the ceramic filter element. | 2014-06-19 |
20140167332 | FINGERPRINT-ERASING CURED FILM, METHOD FOR MANUFACTURING SAME, DISPLAY AND TOUCH PANEL USING SAME, AND ELECTRONIC DEVICE USING THESE - Fingerprint-erasing cured films for rendering fingerprint depositions on various surfaces quickly less visible, or invisible; a manufacturing method therefor; a display or touch panel using the same; and electronic devices using these are provided. A liquid coating film including a solvent and a polymerizable resin composition curable by an activating energy beam is formed. In a state of the solvent being included within the film, the film is cured to form a cured film containing the solvent, preferably using a release material whose surface has undergone matte processing; and the solvent is evaporated in a subsequent drying step, whereby a cured film with a multitude of micropores on the surface is formed. Fingerprint soiling is rendered not readily visible or invisible. By using the cured film, there are obtained displays, touch panels, and electronic devices having fingerprint-erasability. To improve fingerprint-erasability, adding a water-absorbent compound to the film composition is preferable. | 2014-06-19 |
20140167333 | RADIATION CURABLE RESIN SYSTEMS FOR COMPOSITE MATERIALS AND METHODS FOR USE THEREOF - Methods of forming a curable pre-impregnated composite precursor material with radiation (e.g., actinic or electron-beam) curable resin composition systems are provided, as are the curable pre-impregnated composite precursor materials themselves. The resin systems have reversible temperature-viscosity control, which are advantageously used to form curable pre-impregnated composite precursor materials (pre-preg) that can be cured to form a composite article. The uncured resin composition comprises: (a) an acrylate or a methacrylate monomer; (b) an oligomer species selected from the group consisting of: polyethers, polyesters, epoxies, and combinations thereof; and (c) a photoinitiator. The uncured resin has a first viscosity at 21° C. (70° F.) of ≧about 200,000 centipoise (cP) and a second viscosity of ≦about 5,000 cP at 65° C. (149° F.) or above. | 2014-06-19 |
20140167334 | Optimized Preform Feed - A device for transporting plastic preforms to a stretch blow molding machine comprising a feeder device, which transports the plastic preforms to a separating device, which is arranged in transport direction upstream of the stretch blow molding machine, wherein the feeder device comprises a pneumatically actuable blocking device, which in a first position deblocks the path of transport for the preforms and in a second position blocks the path of transport for the plastic preforms, and wherein the blocking device is actuable by means of a cylinder. According to the invention, the valve for controlling the cylinder is arranged in the immediate vicinity of the cylinder. | 2014-06-19 |
20140167335 | METHOD OF MANUFACTURING COIL - Disclosed herein is a method of manufacturing a coil, including: preparing a mold having vertically movable fixing pins disposed therein and slidable left and right sidewalls; seating a magnetic plate on an inner bottom of the mold; loading the coil on the magnetic plate so that lead parts of the coil are disposed between the fixing pins and the sidewalls of the mold; sliding the left and right sidewalls of the mold into the mold to closely adhere the lead parts of the coil to the fixing pins; filling a magnetic slurry in the mold and primarily pressing the magnetic slurry; and lowering the fixing pins to perform secondary pressing, in order to prevent deformation or position deviation of the coil at the time of molding the coil. | 2014-06-19 |
20140167336 | INTEGRATION OF OXYGEN TRANSPORT MEMBRANE WITH COAL BASED DRI PROCESS - A process for the integration of oxygen transport membrane with a coal based DRI process is provided. The process includes introducing a heated, compressed air stream into an oxygen transport membrane separator, thereby producing a permeate stream and a retentate stream, introducing at least a portion of the retentate stream into a fired heater along with a combustion air stream, and introducing at least a portion of the permeate stream into a DRI shaft furnace. | 2014-06-19 |
20140167337 | AIR SPRING PISTON FOR A HEAVY-DUTY VEHICLE - An air spring piston for a heavy-duty vehicle includes a top portion and a bottom portion. The top portion includes a bumper and a connecting means for an air spring bellows. The bottom portion is mounted on a structure of the vehicle. The top portion and bottom portion are connected to each other to form a piston chamber and include a bearing means for reacting bumper forces from the bumper to the bottom portion and to the structure of the vehicle on which the bottom portion is mounted. The piston chamber is in fluid communication with a bellows chamber of the air spring via an opening, wherein the geometry of the opening is such that during dynamic spring movements, the pressure in the piston chamber and the pressure in the bellows chamber are not equalized. | 2014-06-19 |
20140167338 | DEVICE FOR THE DAMPING OF IMPACTS - The present invention relates to a device for reducing the effect of impacts and oscillations, in particular vibrations, in particular for the damping thereof, and to the use of the device for reducing the effect of impacts and oscillations, in particular vibrations, in particular for the damping thereof. | 2014-06-19 |
20140167339 | HOLDER FOR A SPRING | 2014-06-19 |
20140167340 | BUMP STOPPER - Disclosed herein is a bump stopper that includes a connecting portion formed on a bottom of a vehicle frame. The connecting portion includes an empty space formed therein and a fitting guide that is partially cut on the bottom. The bump stopper additionally includes an elastic member that includes a plurality of protrusions fitted in the fitting guide and extending at the top in the longitudinal direction of the frame to be fixed in the fitting guide. | 2014-06-19 |
20140167341 | CLAMPING DEVICE - A clamping device comprises a driving cylinder, a buffering assembly, a first clamping member, and a second clamping member. The first clamping member and the second clamping member are mounted to the driving cylinder. The buffering assembly comprises a fixing member, a guiding rail, a guiding rod, and an elastic member. The fixing member comprises a first mounting portion and a second mounting portion. The first mounting portion defines a through hole. The guiding rail is mounted to the fixing member and located between the first mounting portion and the second mounting portion. The driving cylinder is mounted to the guiding rail. A first end of the guiding rod is movably received through the through hole, and a second end of the guiding rod is fixed to the driving cylinder. Opposite ends of the elastic member resist against the first mounting portion and the driving cylinder, respectively. | 2014-06-19 |
20140167342 | JIG FOR ALIGNING DOOR HINGE OF AUTOMATIC SYSTEM FOR MOUNTING DOOR HINGE TO VEHICLE - A jig for aligning door hinges into a position at a predetermined mounting angle in an automatic system that automatically mounts door hinges to upper and lower seats on pillars of a vehicle body conveyed by a conveying unit. The jig may include a support frame, a first support part fixed to the support frame and supporting a hinge bracket of the door hinge, a pair of second support parts movably disposed at both sides of the first support part and respectively supporting both sides of a door bracket of the door hinge, and an actuating cylinder fixed to the support frame and connected with the second support parts. | 2014-06-19 |
20140167343 | SYSTEM FOR POSITIONING A WORKPIECE IN A DESIRED POSITION - A positioning system for positioning a workpiece in a desired position is provided. The system includes a first driving device and a second driving device. The first driving device and the second driving device are used to drive the workpiece to move. The system further includes a third driving device and a fourth driving device for driving a first block and a second block to move. The moving direction and moving distance of the workpiece is determined according to a difference between a standard value and a distance that the first block and the second block have travelled. | 2014-06-19 |
20140167344 | PAPER WIDTH DETECTION METHOD FOR A LABEL PRINTER, PRINTING CONTROL METHOD FOR A LABEL PRINTER, AND A LABEL PRINTER - When a label printer detects the paper width, the paper width detection operation scans the transportation path in the paper width direction by the paper width detector not once but twice, and conveys the recording medium transportation distance L, which is longer than the gap length of the gap between labels and is shorter than the label length of each label, between the first and second paper width detection operations. Of the two positions detected as the left edge of the recording medium in the first and second detection operations, the position that is farthest left is used. Likewise, of the two positions detected as the right edge of the recording medium in the first and second detection operations, the position that is farthest right is used. | 2014-06-19 |
20140167345 | PRINTING SYSTEM, CONTROL METHOD, AND STORAGE MEDIUM STORING PROGRAM - When a printing apparatus receives error information from a sheet processing apparatus while executing a print job, execution of the print job is stopped. After the execution of the print job is stopped, it is determined in accordance with the type of sheet processing apparatus whether to discharge a printing sheet on a conveyance path in the printing system. | 2014-06-19 |
20140167346 | IMAGE RECORDING APPARATUS - There is provided an image recording apparatus including: a main body with first and second transporting paths, a transporting roller pair, a recording portion, a reversal roller pair, a re-transporting roller pair, a transporting motor, first and second transmission mechanisms, and a controller. The second transmission mechanism has: a sun gear, an arm, a pendulum gear, and a gear row. The second transmission mechanism is configured to change a posture between a first posture and a second posture. The controller is configured to determine a position of the sheet, determine a size of the sheet, switch the rotation of the transporting motor under certain conditions, and increase the rotation amount of the transporting motor more for the case that the size of the sheet is determined to be not less than a transport distance than for the case that it is determined to be less than the transport distance. | 2014-06-19 |
20140167347 | Sheet Transport Device - A sheet transport device includes a sheet supporting surface which receives a plurality of sheets set thereon, a separation roller which separates the sheets set on the sheet supporting surface sheet by sheet to transport a separated sheet in a predetermined transport direction, and a first detection unit which is disposed to the supporting surface and detects whether a sheet is set on the sheet supporting surface. The separation roller and the first detection unit are disposed to be separated at least in a sheet width direction orthogonal to the predetermined transport direction, and a distance between the first detection unit and an end edge of the separation roller at a side of the first detection unit is longer than a short side of a non-allowable sheet which is smaller than a minimum sheet size within an allowable transport range set in the sheet transport device. | 2014-06-19 |
20140167348 | IMAGE RECORDING APPARATUS WITH IMPROVED OUTER APPEARANCE - An image recording apparatus including: a sheet tray; a drawing portion; and a first stop portion. The sheet tray is inserted into and pulled out from an accommodating portion along an inserting direction. A main tray of the sheet tray is positioned at a first position and at a second position located downstream of the first position in the inserting direction as a result of movement of the main tray in the inserting direction. An extension tray of the sheet tray is movable relative to the main tray. The drawing portion draws the main tray from the first position into the second position. The first stop portion is disposed in the accommodating portion and abuttable against the extension tray when the main tray is located downstream of the first position in the inserting direction to restrict movement of the extension tray in the inserting direction. | 2014-06-19 |
20140167349 | SHEET STACKING DEVICE AND IMAGE FORMING APPARATUS - A sheet stacking device including a stacking tray, an auxiliary tray, and pivot limiting means. The stacking tray is disposed to be pivotable relative to an apparatus main body. The stacking tray has a stacking surface on which sheets discharged from discharging means are stacked. The auxiliary tray is pivotable between a storage position at which the auxiliary tray is stored in the stacking tray and a pivot position to which the auxiliary tray pivots from the stacking tray. Pivot limiting means limits pivoting of the auxiliary tray from the pivot position when the stacking tray is caused to pivot | 2014-06-19 |
20140167350 | POST-PROCESSING DEVICE AND IMAGE FORMING SYSTEM - A post-processing device includes: a stacking section that stacks a sheet; an output section that outputs the sheet stacked on the stacking section; a facing section that is arranged to face an end portion of the stacked sheet on an upstream side in an output direction; a movable support section that is provided to be movable from the stacking section toward a downstream side in the output direction of the stacked sheet, and when the stacked sheet is outputted from the stacking section, supports the stacked sheet with the stacking section; and a pressing section that is provided in the movable support section to face an end portion of the stacked sheet on the downstream side in the output direction, and presses the stacked sheet against the facing section with movement of the movable support section. | 2014-06-19 |
20140167351 | CONVEYER APPARATUS - A conveyance apparatus includes a pair of registration rollers configured to convey a print medium to a printing unit of a printing machine in a conveyance direction, a motor configured to rotate the registration rollers, and a controller configured to control the motor such that after the print medium strikes the registration rollers and thereby forms a predetermined amount of slack in the print medium, the motor starts rotating the registration rollers to convey the print medium, and the motor stops rotating the registration rollers once the print medium exits the registration rollers. In stopping rotating the registration rollers, the controller is configured to drive the motor to generate torque in a reverse rotational direction opposite from a rotational direction in which the motor generates torque to convey the print medium in the conveyance direction. | 2014-06-19 |
20140167352 | Sheet Transport Device - A sheet transport device includes a transport roller which transports a sheet, a cover which covers the transport roller, a pinch roller attached to the cover via a shaft facing the transport roller, and a regulation member projecting from a facing surface, facing the transport roller, of the cover and configured to regulate a movement of the shaft in an extending direction of the shaft. The regulation member includes a surface which extends along the extending direction of the shaft, a first end portion fixed to the cover, and a second end portion which faces an end face of the shaft, and is located closer to the end face of the shaft than the first end portion in the extending direction of the shaft. | 2014-06-19 |
20140167353 | Image Reading Device - An image reading device, including: a casing having a document placement surface on which a document is to be placed; a cover provided on the casing and configured to be pivotable relative to the casing about an axis between a covering position at which the cover covers the document support surface and an exposure position at which the 5document support surface is exposed; two hinges provided so as to be spaced apart from each other in an axis direction in which the axis extends, one end portion of each of the two hinges being inserted into the casing movably in a movement direction perpendicular to the document placement surface while the other end portion is connected to the cover; and a contact member configured to be capable of coming into contact with one of the two hinges in the axis direction. | 2014-06-19 |