25th week of 2018 patent applcation highlights part 69 |
Patent application number | Title | Published |
20180174912 | SEMICONDUCTOR DEVICE HAVING MERGED EPITAXIAL FEATURES WITH ARC-LIKE BOTTOM SURFACE AND METHOD OF MAKING THE SAME | 2018-06-21 |
20180174913 | Semiconductor Device and Method | 2018-06-21 |
20180174914 | MULTI-DEPTH ETCHING IN SEMICONDUCTOR ARRANGEMENT | 2018-06-21 |
20180174915 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE WITH METAL GATE ETCH SELECTIVITY CONTROL | 2018-06-21 |
20180174916 | Gate Structures with Various Widths and Method for Forming the Same | 2018-06-21 |
20180174917 | FinFET Structures and Methods of Forming the Same | 2018-06-21 |
20180174918 | FINFET DEVICES AND METHODS OF FORMING | 2018-06-21 |
20180174919 | Dual Epitaxial Growth Process for Semiconductor Device | 2018-06-21 |
20180174920 | SEMICONDUCTOR DEVICES | 2018-06-21 |
20180174921 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | 2018-06-21 |
20180174922 | FinFET Structures and Methods of Forming the Same | 2018-06-21 |
20180174923 | METHODS FOR FABRICATING METAL GATE STRUCTURES | 2018-06-21 |
20180174924 | FABRICATION TECHNOLOGY FOR METAL GATE | 2018-06-21 |
20180174925 | Structure and Formation Method of Semiconductor Device Structure | 2018-06-21 |
20180174926 | Semiconductor Devices Comprising Nitrogen-Doped Gate Dielectric, and Methods of Forming Semiconductor Devices | 2018-06-21 |
20180174927 | Contacts in Semiconductor Devices | 2018-06-21 |
20180174928 | MOUNTING APPARATUS | 2018-06-21 |
20180174929 | SEMICONDUCTOR MANUFACTURING DEVICE, SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174930 | METHOD FOR TESTING BRIDGING IN ADJACENT SEMICONDUCTOR DEVICES AND TEST STRUCTURE | 2018-06-21 |
20180174931 | LIGHT EMITTING DIODE (LED) TEST APPARATUS AND METHOD OF MANUFACTURE | 2018-06-21 |
20180174932 | TRANSFER PRINTED DEVICE REPAIR | 2018-06-21 |
20180174933 | SCRIBE LANE STRUCTURE IN WHICH PAD INCLUDING VIA HOLE IS ARRANGED ON SAWING LINE | 2018-06-21 |
20180174934 | POWER CONVERTING DEVICE | 2018-06-21 |
20180174935 | Semiconductor package and method for fabricating a semiconductor package | 2018-06-21 |
20180174936 | Power Semiconductor Modules with Protective Coating | 2018-06-21 |
20180174937 | Info Structure with Copper Pillar Having Reversed Profile | 2018-06-21 |
20180174938 | SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174939 | SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174940 | FINE-FEATURED TRACES FOR INTEGRATED CIRCUIT PACKAGE SUPPORT STRUCTURES | 2018-06-21 |
20180174941 | SEMICONDUCTOR MEMORY DEVICE AND A CHIP STACK PACKAGE HAVING THE SAME | 2018-06-21 |
20180174942 | Power Module of Square Flat Pin-Free Packaging Structure | 2018-06-21 |
20180174943 | SEMICONDUCTOR DIE ASSEMBLY HAVING HEAT SPREADER THAT EXTENDS THROUGH UNDERLYING INTERPOSER AND RELATED TECHNOLOGY | 2018-06-21 |
20180174944 | HEAT TRANSFER STRUCTURE AND MANUFACTURING METHOD THEREFORE | 2018-06-21 |
20180174945 | POWER MODULE HAVING DUAL-SIDED COOLING | 2018-06-21 |
20180174946 | Power Semiconductor Packages Having a Substrate with Two or More Metal Layers and One or More Polymer-Based Insulating Layers for Separating the Metal Layers | 2018-06-21 |
20180174947 | POWER ELECTRONICS ASSEMBLY INCLUDING A CIRCUIT CARRIER | 2018-06-21 |
20180174948 | INTEGRATED CIRCUIT CHIP WITH MOLDING COMPOUND HANDLER SUBSTRATE AND METHOD | 2018-06-21 |
20180174949 | METAL CORED SOLDER DECAL STRUCTURE AND PROCESS | 2018-06-21 |
20180174950 | Method Of Making A Wire Support Leadframe For A Semiconductor Device | 2018-06-21 |
20180174951 | SEMICONDUCTOR DEVICE AND METHOD WITH CLIP ARRANGEMENT IN IC PACKAGE | 2018-06-21 |
20180174952 | SUBSTRATE, ELECTRONIC DEVICE AND DISPLAY DEVICE HAVING THE SAME | 2018-06-21 |
20180174953 | METHOD OF DESIGNING A LAYOUT OF A SEMICONDUCTOR DEVICE, AND A SEMICONDUCTOR DEVICE INCLUDING A FIN | 2018-06-21 |
20180174954 | WIRING STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS | 2018-06-21 |
20180174955 | MULTI-LAYER STRUCTURE AND A METHOD FOR MANUFACTURING THE SAME AND A CORRESPONDING CONTACT STRUCTURE | 2018-06-21 |
20180174956 | METHOD FOR MANUFACTURING INTERCONNECTION | 2018-06-21 |
20180174957 | METHOD OF FORMING INTERCONNECTION STRUCTURE | 2018-06-21 |
20180174958 | SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174959 | MEMORY DEVICE AND METHOD OF DISPOSING CONDUCTION LINES OF THE SAME | 2018-06-21 |
20180174960 | MEMORY DEVICES, SEMICONDUCTOR DEVICES AND RELATED METHODS | 2018-06-21 |
20180174961 | Air Gap Structure and Method | 2018-06-21 |
20180174962 | INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF | 2018-06-21 |
20180174963 | Conductive Structure and Method of Forming the Same | 2018-06-21 |
20180174964 | INDUCTIVE CONNECTION STRUCTURE FOR USE IN AN INTEGRATED CIRCUIT | 2018-06-21 |
20180174965 | DEVICES AND METHODS OF COBALT FILL METALLIZATION | 2018-06-21 |
20180174966 | SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174967 | POWER STRAP STRUCTURE FOR HIGH PERFORMANCE AND LOW CURRENT DENSITY | 2018-06-21 |
20180174968 | Source-Gate Region Architecture in a Vertical Power Semiconductor Device | 2018-06-21 |
20180174969 | SELF-ALIGNED VERTICAL TRANSISTOR WITH LOCAL INTERCONNECT | 2018-06-21 |
20180174970 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174971 | SEMICONDUCTOR MEMORY DEVICE | 2018-06-21 |
20180174972 | CONDUCTIVE COATING FOR A MICROELECTRONICS PACKAGE | 2018-06-21 |
20180174973 | MOUNTING SUBSTRATE AND ELECTRONIC APPARATUS | 2018-06-21 |
20180174974 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-06-21 |
20180174975 | SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING SAME | 2018-06-21 |
20180174976 | TRANSIENT ELECTRONICS USING THERMORESPONSIVE MATERIALS | 2018-06-21 |
20180174977 | PLANARIZED INTERLAYER DIELECTRIC WITH AIR GAP ISOLATION | 2018-06-21 |
20180174978 | SEMICONDUCTOR DEVICE, METHOD OF POSITIONING SEMICONDUCTOR DEVICE, AND POSITIONING APPARATUS FOR SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174979 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 2018-06-21 |
20180174980 | Thin Film Transistor and Manufacturing Method Thereof, Array Substrate, and Display Panel | 2018-06-21 |
20180174981 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PROCESS FOR MANUFACTURING THE SAME | 2018-06-21 |
20180174982 | INTEGRATED CIRCUIT STRUCTURE WITH CONTINUOUS METAL CRACK STOP | 2018-06-21 |
20180174983 | SEMICONDUCTOR DEVICE INCLUDING CORNER RECESS | 2018-06-21 |
20180174984 | Packaging Devices and Methods for Semiconductor Devices | 2018-06-21 |
20180174985 | SEMICONDUCTOR CHIP | 2018-06-21 |
20180174986 | POWER DEVICE | 2018-06-21 |
20180174987 | SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174988 | CORROSION RESISTANT ALUMINUM BOND PAD STRUCTURE | 2018-06-21 |
20180174989 | METHOD FOR PRODUCING SOLDERED ELECTRODE AND USE THEREOF | 2018-06-21 |
20180174990 | METHOD FOR FORMING BUMP OF SEMICONDUCTOR PACKAGE | 2018-06-21 |
20180174991 | Core Material, Semiconductor Package, and Forming Method of Bump Electrode | 2018-06-21 |
20180174992 | SEMICONDUCTOR DEVICE WITH COPPER MIGRATION STOPPING OF A REDISTRIBUTION LAYER | 2018-06-21 |
20180174993 | UNIFORM ELECTROCHEMICAL PLATING OF METAL ONTO ARRAYS OF PILLARS HAVING DIFFERENT LATERAL DENSITIES AND RELATED TECHNOLOGY | 2018-06-21 |
20180174994 | FAN-OUT SEMICONDUCTOR PACKAGE | 2018-06-21 |
20180174995 | BONDED STRUCTURES | 2018-06-21 |
20180174996 | WIRE BONDED WIDE I/O SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174997 | BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, METHODS OF OPERATING BONDING MACHINES, AND TECHNIQUES FOR IMPROVING UPH ON SUCH BONDING MACHINES | 2018-06-21 |
20180174998 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2018-06-21 |
20180174999 | DIE SIDEWALL INTERCONNECTS FOR 3D CHIP ASSEMBLIES | 2018-06-21 |
20180175000 | HYBRID DIE STACKING | 2018-06-21 |
20180175001 | SEMICONDUCTOR PACKAGE | 2018-06-21 |
20180175002 | PACKAGE-BOTTOM INTERPOSERS FOR LAND-SIDE CONFIGURED DEVICES FOR SYSTEM-IN-PACKAGE APPARATUS | 2018-06-21 |
20180175003 | PACKAGE ON PACKAGE CONFIGURATION | 2018-06-21 |
20180175004 | THREE DIMENSIONAL INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MANUFACTURING THEREOF | 2018-06-21 |
20180175005 | THERMAL DISSIPATION USING ANISOTROPIC CONDUCTIVE MATERIAL | 2018-06-21 |
20180175006 | SEMICONDUCTOR DEVICE INCLUDING DIE BOND PADS AT A DIE EDGE | 2018-06-21 |
20180175007 | PRESSURE CONTACT-TYPE SEMICONDUCTOR MODULE | 2018-06-21 |
20180175008 | THREE DIMENSIONAL INTEGRATED CIRCUIT | 2018-06-21 |
20180175009 | LIGHT EMITTING DEVICE AND DISPLAY DEVICE INCLUDING THE SAME | 2018-06-21 |
20180175010 | HYBRID-TYPE POWER MODULE HAVING DUAL-SIDED COOLING | 2018-06-21 |
20180175011 | SEMICONDUCTOR PACKAGES INCLUDING HEAT TRANSFERRING BLOCKS AND METHODS OF MANUFACTURING THE SAME | 2018-06-21 |