26th week of 2015 patent applcation highlights part 85 |
Patent application number | Title | Published |
20150181699 | CIRCUIT BOARD - A circuit board includes a plate-shaped dielectric body with a first and a second main surface and including a first area not to be bent and a second area to be bent such that the first main surface becomes an outer side, a first reinforcing member located in the first area nearer the first main surface in relation to a center of the second area in a thickness direction and away from the second area, and a second reinforcing member located in the first area nearer the second main surface in relation to the center of the second area and contacting with a border between the first and the second areas. The first main surface curves from an edge of the first reinforcing member closest to the second area, and the second main surface curves from an edge of the second reinforcing member on the border. | 2015-06-25 |
20150181700 | Stretchable and Foldable Electronic Devices - Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device. | 2015-06-25 |
20150181701 | CHIP ON FILM MODULE, DISPLAY PANEL AND DISPLAY - The present disclosure disclosed a chip on film module of display panel, comprising: a flexible substrate, a chip arranged on the flexible substrate, and a first group of terminals, wherein, each of the first group of terminals comprises a metal bonding section with different area for contacting with a fan-out terminal of a corresponding fan-out wire of the display panel, so that the equivalent resistance on each fan-out wire is equal or approximate. The present disclosure also provides a display panel, comprising: a display unit; and a group of fan-out terminals connected with the display unit, wherein each of the fan-out terminals comprises metal bonding section with different area used for contacting with a corresponding one of the first group of terminals of a chip on film (COF) module. The present disclosure can effectively eliminate the color cast caused by the non-uniformity of the impedances on the fan-out wires. | 2015-06-25 |
20150181702 | MICRO-WIRE CONNECTION PAD - A connection-pad structure includes a substrate and a An electrical conductor including a plurality of micro-wires form an electrically continuous connection pad on or in the substrate. An electrical connector is electrically connected to the electrical conductor. | 2015-06-25 |
20150181703 | Wiring Substrate and Semiconductor Device - A wiring substrate includes first and second wiring structures. The first wiring structure includes a core substrate, first and second insulation layers formed from a thermosetting insulative resin respectively including first and second reinforcement materials, and a via wire formed in the first insulation layer. The second wiring structure includes a third insulation layer formed on an upper surface of the first insulation layer and an upper end surface of the via wire, and a wiring layer extended through the third insulation layer and electrically connected to the via wire. The outermost insulation layer, the main component of which is a photosensitive resin, is stacked on a lower surface of the second insulation layer. The second wiring structure has a higher wiring density than the first wiring structure. The first reinforcement material is partially exposed on the upper surface of the first insulation layer. | 2015-06-25 |
20150181704 | CIRCUIT BOARD INCLUDING ALIGNED NANOSTRUCTURES - Circuit boards having a polymer substrate, a first electrode and a second electrode disposed on a surface of the polymer substrate, and at least one nanostructure electrically connected to the first and second electrodes are generally disclosed. | 2015-06-25 |
20150181705 | BUILD-UP INSULATING FILM, PRINTED CIRCUIT BOARD INCLUDING EMBEDDED ELECTRONIC COMPONENT USING THE SAME AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a build-up insulating film, a printed circuit board including an embedded electronic component using the same and a method for manufacturing the same. | 2015-06-25 |
20150181706 | HIGH VOLTAGE POLYMER DIELECTRIC CAPACITOR ISOLATION DEVICE - An electronic isolation device is formed on a monolithic substrate and includes a plurality of passive isolation components. The isolation components are formed in three metal levels. The first metal level is separated from the monolithic substrate by an inorganic PMD layer. The second metal level is separated from the first metal level by a layer of silicon dioxide. The third metal level is separated from the second metal level by at least 20 microns of polyimide or PBO. The isolation components include bondpads on the third metal level for connections to other devices. A dielectric layer is formed over the third metal level, exposing the bondpads. The isolation device contains no transistors. | 2015-06-25 |
20150181707 | RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE AND PRINTED WIRING BOARD - A resin composition capable of achieving a printed wiring board or the like excellent in heat dissipation properties, water absorption properties, copper foil peel strength, and heat resistance after moisture absorption is provided. A prepreg, a laminate, a metal foil clad laminate, a printed wiring board and the like, which use the resin composition are also provided. The resin composition of the present invention having at least an epoxy resin, a cyanate ester compound, and an inorganic filler, wherein the inorganic filler includes at least a surface-treated silicon carbide of a silicon carbide powder having at least a part of the surface treated with an inorganic oxide. | 2015-06-25 |
20150181708 | SEMICONDUCTOR PACKAGE MODULE - There is provided a semiconductor package module including: a substrate having one or more connection terminals formed thereon; first electronic components mounted on a first surface of the substrate; second electronic components mounted on a second surface of the substrate; and third electronic components formed on the substrate and including connection electrodes connecting the one or more connection terminals and external terminals to each other. | 2015-06-25 |
20150181709 | ELECTRONIC MODULE SUBASSEMBLIES AND METHODS FOR FABRICATING THE SAME - An electronic module subassembly including a substrate. The substrate includes a bottom laminate, a middle laminate coupled to the bottom laminate, and a top laminate coupled to the middle laminate. The middle laminate has a plurality of web areas, each web area defining at least one hole. The defines a planar top surface and a plurality of open areas corresponding to and aligned with the plurality of web areas. First components have a first thickness. At least one first component is in each of the open areas. Second components have a second thickness relatively larger than the first thickness. At least one second component is in each of the open areas. The second components extend into the respective at least one hole of the web areas. Encapsulant fills in the open areas and the web areas. | 2015-06-25 |
20150181710 | HYBRID PRINTED CIRCUIT ASSEMBLY WITH LOW DENSITY MAIN CORE AND EMBEDDED HIGH DENSITY CIRCUIT REGIONS - A high density region for a low density circuit. At least a first liquid dielectric layer is deposited on the first surface of a first circuitry layer. The dielectric layer is imaged to create plurality of first recesses. Surfaces of the first recesses are plated electro-lessly with a conductive material to form first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. A plating resist is applied. A conductive material is electro-plated to the first conductive structure to substantially fill the first recesses, and the plating resist is removed. | 2015-06-25 |
20150181711 | WIRING SUBSTRATE AND LIGHT EMITTING DEVICE - Discoloration is suppressed in a wiring substrate including a conductive member including silver. A wiring substrate includes a ceramic layer and a conductive member including a conductive layer disposed on an upper surface of the ceramic layer. The conductive member includes silver and at least a portion of an upper surface of the conductive layer is covered with a covering layer. The covering layer includes an inorganic reflecting layer and a glass layer stacked on the inorganic reflecting layer. | 2015-06-25 |
20150181712 | Semiconductor component with chip for the high-frequency range - The invention relates to a semiconductor component with a chip, especially with a high-frequency switching circuit. The semiconductor component further comprises a metal body on the chip and a supplementary circuit board. The supplementary circuit board is provided on an underside facing away from the metal body for connection with a printed-circuit board by means of reflow soldering. | 2015-06-25 |
20150181713 | PANEL WITH RELEASABLE CORE - Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material. | 2015-06-25 |
20150181714 | SYSTEMS AND METHODS FOR CONTINUOUS FLASH LAMP SINTERING - A flash lamp system for providing at least one continuous flash lamp pulse including at least two stages for sintering. The pulse can include a first portion for a first time period to reach a first peak energy level, and a second portion for a second time period to reach a second peak energy level. The one or more pulses have sufficient energy to sinter the layer of particles such that the printed electronic circuit is conductive. | 2015-06-25 |
20150181715 | METHOD FOR MANUFACTURING TOUCH PANEL - A method for manufacturing a touch panel includes the following procedures. A first conductive layer and a shielding layer surrounding the first conductive layer are formed on a base plate. The first conductive layer is etched to form a plurality of first and second sensing pads alternatively arranged according to columns. The first sensing pads in a column along a first direction are electrically coupled to each other to form a first sensing electrode column. The second sensing pads in a column along a second direction are electrically coupled to each other to form a second sensing electrode column. A second conductive layer is formed on the shielding layer via an ink jet printing method, and is etched to form a plurality of first and second sensing lines to be respectively electrically coupled to the first and second sensing electrode columns. | 2015-06-25 |
20150181716 | METHOD FOR MANUFACTURING TOUCH PANEL - A method for manufacturing a touch panel includes the following procedures. A base plate is provided. An indium tin oxide film is formed on the base plate. The indium tin oxide film is etched to form a plurality of first and second electrodes which are alternatively arranged according to columns on the base plate and insulated from each other, and the first electrodes in a column along a first direction are electrically coupled to each other. A plurality of insulated layers is formed on the first and second electrodes. A plurality of conductive connectors are formed on the plurality of insulated layers via an ink jet printing method to electrically interconnect with the second electrodes in a column along the second direction intersecting the first direction. The widths of the conductive connectors are reduced below 10 μm via a laser processing method. | 2015-06-25 |
20150181717 | PANEL WITH RELEASABLE CORE - Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a substantially rectangular base, situating an outer conductive foil situated on the inner foil, or coupling, using a connective material, the inner foil and the outer conductive foil near edges of the outer conductive foil and the inner foil. | 2015-06-25 |
20150181718 | METHOD OF FORMING CONDUCTIVE TRACES ON INSULATED SUBSTRATE - A method of forming conductive traces on insulated substrate includes the steps of providing an insulated substrate; forming a coating layer on a surface of the insulated substrate, dividing the coating layer into traces-forming zones and non-traces-forming zones through laser engraving, and removing areas of the coating layer that are located in the traces-forming zones through laser-vaporizing to expose corresponding portions of the surface of the insulated substrate; forming a metallized layer of conductive traces by performing a metallizing treatment on the exposed portions of the insulated substrate and on the coating layer; and directly stripping off the residual coating layer from the non-traces-forming zones or removing it using an acid, an alkaline or a neutral solution. | 2015-06-25 |
20150181719 | PANEL-MOLDED ELECTRONIC ASSEMBLIES - A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. | 2015-06-25 |
20150181720 | FLEXIBLE ASSEMBLY MACHINE, SYSTEM AND METHOD - An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module. | 2015-06-25 |
20150181721 | COMPONENT MOUNTING METHOD AND MOUNTING COMPONENT - A component mounting method includes: placing a mounting component in contact with, and on top of, an electronic component on a substrate, pressing a spring member against the mounting component using a jig such that the mounting component is pushed against the electronic component by the spring member, and fixing the spring member to the substrate, and removing the jig in a direction heading away from a mounting face of the substrate after the spring member has been fixed to the substrate. | 2015-06-25 |
20150181722 | METHOD OF MANUFACTURING WIRING SUBSTRATE HAVING BUILT-IN COMPONENT - A method of manufacturing a component-built-in wiring substrate which exhibits excellent reliability, through improvement of adhesion between a resin filler and a core substrate, is provided. In some embodiments the method comprises a core substrate preparation step for preparing a core substrate, an accommodation-hole forming step for forming an accommodation hole in the core substrate, and a through-hole forming step for forming through-holes. In a plating-layer forming step, a plating layer is formed on an inner wall surface of the accommodation hole and plating layers are formed on the inner wall surfaces of the through-holes, which become through-hole conductors each having a hollow. In an accommodation step, a component is accommodated in the accommodation hole. In a resin charging step, a resin filler is filled into a gap between component side-surfaces and the inner wall surface of the accommodation hole and into the hollows. | 2015-06-25 |
20150181723 | Method of Producing an Electronic Circuit with Protection of the Conductive Layer - The invention concerns a method of producing a circuit including the step consisting of connecting, to a bottom wall of a cavity, an electronic component with or without an intermediate wired link, the method including a step prior to an etching step which consists of depositing a layer of protective material on a conductive layer in the bottom of the cavity, said material being a liquid material capable of hardening and, once hardened, resistant to the etching solution. | 2015-06-25 |
20150181724 | METHODS OF FORMING SEGMENTED VIAS FOR PRINTED CIRCUIT BOARDS - Novel methods for forming a printed circuit board (PCB) having one or more segmented vias are provided, including improved methods of removing the catalyst after the plating process when forming a segmented via in the PCB. After the electroless plating, excess catalyst on the surface of the plating resist is removed using a catalyst remover, such as an acidic solution that includes at least nitrite or nitrite ion and halogen ion, or the catalyst remover may be an etchant for plating resist, such as alkaline permanganate compound solution or plasma gas comprising at least one of oxygen, nitrogen, argon and tetrafluoromethane, or a mixture of at least two of these gasses. After removal of the excess catalyst, electrolytic plating is then applied to the through holes and the outer layer circuit or signal traces are formed. That is, the etching of paths on the conductive foils/layers of the core structure. | 2015-06-25 |
20150181725 | THICK FILM CIRCUITS WITH CONDUCTIVE COMPONENTS FORMED USING DIFFERENT CONDUCTIVE ELEMENTS AND RELATED METHODS - Disclosed herein are a variety of embodiments of thick film circuits with conductive components formed using different conductive elements and related methods for forming such circuits. One embodiment consistent with the present disclosure includes a multi-level thick film circuit formed on a substrate and having a first layer disposed on the substrate. The first layer may include a first conductive component formed using a first conductive element. The first conductive element may be a precious metal. The circuit may further include a second layer having a second conductive component. The second conductive component may be formed using a second conductive element. In one embodiment, the second conductive element may be a base metal. At least a portion of the first conductive element may directly contact at least a portion of the second conductive element such that the first layer is in electrical communication with the second layer. | 2015-06-25 |
20150181726 | MOUNTING APPARATUS AND SCREW ASSEMBLY FOR THE SAME - A screw assembly includes a bolt, a stopping member, and a nut fitted about the bolt. The bolt includes a screw. A side of the screw forms a stopping surface extending along a lengthwise direction of the screw. The stopping member is fitted about the screw. A tab protrudes out from an outer side of the stopping member to abut the stopping surface of the screw to prevent the screw from rotating. | 2015-06-25 |
20150181727 | PANEL-MOLDED ELECTRONIC ASSEMBLIES - A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects. Wide cuts may be made in the molds after encapsulation reducing thermal stresses and reducing the thickness of material to be cut during subsequent singulation. External mold features can include various fin configurations for heat sinks, flat surfaces for surface mounting or soldering, etc. Blank mold panels may be machined to provide some or all of the above features in an on-demand manufacturing system. Connection adapters may be provided to use the modules in vertical or horizontal mounting positions in connector, through-hole, surface-mount solder variations. The interconnects may be plated to provide a connectorized module that may be inserted into a mating connector. | 2015-06-25 |
20150181728 | PACKAGE FOR HOUSING SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE - A package for housing a semiconductor element includes a base body including a bottom plate section and a frame-shaped side wall section; and an input/output terminal provided so as to pass through the side wall section, the input/output terminal having a plate section on which line conductors are formed, and a vertical wall section which is fixed to the plate section so as to continue to the side wall section and so that the line conductors are sandwiched between the plate section and the vertical wall section and both ends of the line conductors are exposed from the vertical wall section. The vertical wall section has a thick section in a center portion of a side surface of the vertical wall section in a direction along the side wall section, the thick section having thick wall thickness, a lower end of the thick section being fixed to the plate section. | 2015-06-25 |
20150181729 | MOUNTING FIXTURE FOR A DIGITAL MENU BOARD - A mounting fixture comprising a support post configured to support the mounting fixture, a beam coupled to the support post, and at least one cabinet assembly coupled to and supported by the beam. Each audio/visual device is detachably coupled to a cabinet assembly. At least one sidekick is coupled to a side of the at least one cabinet assembly and extending laterally beyond an end of the beam. Each sidekick includes at least one hook configured to retain at least one graphic. | 2015-06-25 |
20150181730 | ELECTRONIC DEVICE, ASSEMBLING STRUCTURE AND ASSEMBLING METHOD - An electronic device including a main body, a cover and an assembling structure is provided. The main body has two first positioning structures. The assembling structure includes two sliding components, two second positioning components and two elastic components. Each sliding component is slidably disposed on the cover and has a pressing portion. The second positioning structures are connected to the sliding components respectively and aligned to the first positioning components respectively. The elastic components are connected to the cover and connected to the sliding components respectively. Each second positioning component is positioned at the corresponding first positioning component by elastic force of the corresponding elastic component, so as to stop the cover separating from the main body. When the pressing portions receive forces at the same time to drive the second positioning structures to move away from the first positioning structures respectively, the cover is separated from the main body. | 2015-06-25 |
20150181731 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A flexible display device includes at least one curable adhesive layer having a hollow structure. The curable adhesive layer with the hollow structure can alleviate a stress inside the display device. The method of manufacturing a display device includes preparing a flexible display panel for displaying an image; forming a first curable adhesive layer having a hollow structure by coating curable adhesive on the flexible display panel; preparing a first flexible panel, disposing the first flexible panel on the first curable adhesive layer and curing the first curable adhesive layer. With this method, a stress inside the display device can be alleviated and a display effect can be improved. | 2015-06-25 |
20150181732 | DISPLAY APPARATUS - A display apparatus includes: a display unit; a front cabinet including a frame portion in the form of a frame surrounding an outer edge of the display unit, a tab including a base portion connected to the frame portion and extending in a depth direction from the base portion, and a fixing portion provided in the tab; and a rear frame, and the fixing portion is fixed to the rear frame with a fastener in a direction crossing the depth direction. The fixing portion may be located deeper in the depth direction than the display unit or may be closer to the display unit than the base position is in the direction crossing the depth direction. | 2015-06-25 |
20150181733 | THREE-DIMENSIONAL PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF - The present invention discloses a three-dimensional package structure which can achieve a relatively high utilization of an internal space thereof, so that a size of electronic package structure can be reduced. The three-dimensional package structure comprises a first electronic component, a plurality of second electronic components and a plurality of conductive patterns. The first electronic component has a top surface and a bottom surface. The plurality of second electronic components are disposed over the top surface of the first electronic component. The plurality of conductive patterns are disposed over the plurality of second electronic components to electrically connect the plurality of second electronic components and the first electronic component. | 2015-06-25 |
20150181734 | CARD LOADING ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME - A card loading assembly is received in a casing for placing a digital card. The casing defines a sliding slot. The card loading assembly includes a tray and a limiting assembly. The tray can rotate with respect to the casing, and defines a positioning recess and a receiving groove. The receiving groove is configured to receive the digital card, and can be rotated out of the casing through the sliding slot. The limiting assembly includes a limiting member and an elastic member. When the tray is received in the casing, the limiting member can be inserted into the positioning recess under a force of the elastic member, thereby positioning the tray with respect to the casing. | 2015-06-25 |
20150181735 | ENCLOSURE FOR A GENERATOR - An enclosure is provided which is mountable to a base frame carrying a generator. The enclosure includes a lower portion connectable to the base frame. The lower portion includes a lower first sidewall, a lower second sidewall, and a lower first end wall and a lower second end wall. The enclosure further includes an upper portion having a roof, an upper first sidewall, an upper second sidewall, and an upper end wall depending downwardly from the roof. The lower portion and the upper portion are hingedly connected together such that the upper portion is pivotable relative to the lower portion between closed and open positions. | 2015-06-25 |
20150181736 | ELECTRONIC APPARATUS - A cover panel made of sapphire is provided on a surface of an electronic apparatus. The cover panel includes a first surface and a second surface opposite to the first surface. An operation button is positioned in a hole provided in the cover panel. A case supports the second surface of the cover panel. The case supports and covers an edge of the hole of the second surface. | 2015-06-25 |
20150181737 | ELECTRONIC DEVICE - An electronic device includes a first housing, an second housing coupled to the first housing, and a flexible sealing member mounted on the second housing. The first housing defines a receiving groove substantially in a shape of a loop. The flexible sealing member includes a fixing portion, a first sealing portion protruding from the fixing portion and substantially in a shape of a ring, and a second sealing portion protruding from the fixing portion and substantially in a shape of a ring. The second sealing portion is surrounded by the first sealing portion. The first sealing portion and the second sealing portion are deformed and received in the receiving groove. The first sealing portion resists the second sealing portion. The first sealing portion and the second sealing portion both resist the first housing. | 2015-06-25 |
20150181738 | ELECTRICALLY ISOLATED HEAT DISSIPATING JUNCTION BOX - A junction box used for making electrical connections to a photovoltaic panel. The junction box has two chambers including a first chamber and a second chamber and a wall common to and separating both chambers. The wall may be adapted to have an electrical connection therethrough. The two lids are adapted to seal respectively the two chambers. The two lids are on opposite sides of the junction box relative to the photovoltaic panel. The two lids may be attachable using different sealing processes to a different level of hermeticity. The first chamber may be adapted to receive a circuit board for electrical power conversion. The junction box may include supports for mounting a printed circuit board in the first chamber. The second chamber is configured for electrical connection to the photovoltaic panel. A metal heat sink may be bonded inside the first chamber. | 2015-06-25 |
20150181739 | ELECTRONIC COMPONENT MODULE AND AN ASSEMBLY INCLUDING THE SAME - An electronic component module includes a board, a plurality of external terminals provided on a first surface of the board, and a first semiconductor chip provided on a region on the first surface surrounded by the plurality of external terminals. The first semiconductor chip more protrudes along a normal to the first surface than ends of the external terminals do. | 2015-06-25 |
20150181740 | MOUNTING STRUCTURE AND METHOD FOR SUPPLYING REINFORCING RESIN MATERIAL - A mounting structure for an electronic component and a method for mounting the electronic component are provided with a sufficient reinforcing effect for the relatively tall electronic component raised from a substrate. The mounting structure and the mounting method can easily respond to a change of the shape of the electronic component. In a mounting structure | 2015-06-25 |
20150181741 | MODULAR ALERT SYSTEM - The present invention provides methods and systems for a modular alert system that includes at least one module having a top portion and a bottom portion. The at least one module provides an alarm for one or more monitored conditions, and the bottom portion and the top portion of the at least one module contains mating features. A mounting plate that has a top portion and a bottom portion contains mounting features, and the mounting features of the bottom portion correspond to the mounting features of the top portion of the module for forming a selectively secured arrangement. The system may also include at least one speaker housed within the module, and a smoke detector. | 2015-06-25 |
20150181742 | MOUNTING SYSTEM FOR ARRANGING ELECTRIC DEVICES, FOR EXAMPLE, ESPECIALLY IN SWITCHGEAR CABINETS - The invention relates to a mounting system ( | 2015-06-25 |
20150181743 | EJECTOR AND CABLE MANAGEMENT SYSTEM AND METHOD - An electronic device includes a blade having a faceplate and a handle out locked position ejector. The handle out locked position ejector is configured to secure the blade to a chassis. The handle out locked position ejector includes two ejectors and a handle binding the two ejectors together. The handle out locked position ejector extends perpendicularly from the faceplate when the blade is secured to the chassis thus locating the handle out of the way of ports of the blade. | 2015-06-25 |
20150181744 | DETACHABLE CRANK AND SLIDER CIRCUIT PACK EJECTOR - A mechanism for connecting a first object, such as a chassis and/or motherboard, to a second object, such as a faceplate and/or daughterboard. A first link may be connected to the first object and a second link may be connected to the second object. The second link may have a slot and the first link may have a pin which is releasably connectable to the slot to form a pivot connecting the first link to the second link. The pin may be releasable from the slot at a first point of travel of the pivot and the pin may not be releasable from the slot at a second point of travel of the pivot. The first link may include a first retaining lobe and the second link may include a second retaining lobe disposed to interlock with the first retaining lobe. | 2015-06-25 |
20150181745 | Mounting Latch - A mounting latch for mounting a device to a rail is provided. The mounting latch comprises: a moveable actuator having a profile; a latch mechanism comprising first and second opposed rail engaging members, at least one of the members having a face for causing the member to yield against a bias source when the latch mechanism is engaging with the rail; and a follower enabling the at least one member to follow a rotational movement of the actuator such that movement of the actuator in a first direction causes the at least one member to become unlatched from the rail. | 2015-06-25 |
20150181746 | CIRCUIT BOARD ASSEMBLY CONFIGURATION - A rack unit configuration is described that includes a first printed circuit board (PCB) assembly interleaved with a second PCB assembly that is inverted with respect to the first PCB assembly. The configuration of the first PCB assembly and the second PCB assembly allow for increased component and power densities within computing systems, memory systems, etc. The increased density may be achieved while allowing sufficient mechanical clearance to allow easy component replacement and servicing (e.g., and hot pluggability). Power density may also be increased with PCB assemblies including nested and interleaved power modules. | 2015-06-25 |
20150181747 | MODULAR APPLICATION OF PERIPHERAL PANELS AS EXPANSION SLEEVES AND CABLE MANAGEMENT COMPONENTS WITHIN A RACK-BASED INFORMATION HANDLING SYSTEM - A rack-based information handling system (RIHS) includes: a rack chassis having a plurality of interconnected panels forming a volumetric space having a front section and a rear section, both with opposing side panels forming a front access space and a rear access space, respectively, between corresponding opposing side panels; one or more IT gear sleds that are inserted into the front section of the rack chassis; and a pair of front expansion panels that are added to the rack chassis and which extend past an end of the opposing side panels at the front section of the rack chassis to provide a deeper IT bay within the front section and enable insertion of longer-than-standard depth IT gear within the rack chassis. The front expansion panels are cable management panels that include at least one strap that is utilized to secure one or more cables extending from one or more IT gear inserted into the rack chassis. | 2015-06-25 |
20150181748 | SINGLE UNIT HEIGHT STORAGE SLED WITH LATERAL STORAGE DEVICE ASSEMBLY SUPPORTING HOT-REMOVAL OF STORAGE DEVICES AND SLIDABLE INSERTION AND EXTRACTION FROM AN INFORMATION HANDLING SYSTEM RACK - A rack-based information handling system (IHS) includes a rack containing at least one chassis having a plurality of bays open to laterally receive sleds that contain a plurality of information technology (IT) components that, when operational, enable the rack to function as an IHS. A storage sled including a stationary tray received in the chassis and a moveable trace received in the stationary tray. One or more hot swap bays that are horizontally arrayed in the storage sled in less than one (1) Server System Infrastructure (SSI) rack unit of height, wherein the moveable tray is extendable from the rack to a service position to expose all of its hot swap bays. Storage devices are insertable into a respective one of the hot swap bays of the storage sled. Each storage device may include a latching handle to lift and downward position the storage device in the corresponding hot swap bay. | 2015-06-25 |
20150181749 | SERVER CASING - A server casing includes a main body, a front panel, a rotatable assembly, and a locking assembly. A retaining member is coupled to a bottom surface of the main body and defines an aperture. A hook protrudes from a top surface of the front panel. A rotatable assembly is movably coupled to the retaining member and includes a sliding block and an arm. The sliding block is slidably received in the aperture. The arm is coupled to the sliding block and the top surface. The front panel can rotate about the main body via the rotatable assembly, to allow the server casing to be in an open position and a closed position. The locking assembly is secured to the bottom surface. The locking assembly is engaged with the hook when the casing is in the closed position, and disengaged from the hook when the front panel is pressed. | 2015-06-25 |
20150181750 | MODULARLY-EXPANDABLE MINI-RACK SERVER SYSTEM - A rack apparatus includes a frame having (i) a power and cooling area and (ii) a block chassis forming one or more information technology (IT) bays that enable insertion of IT components. A plurality of IT components are contained within a component cabinet inserted in the block chassis. When operational, enable the rack apparatus to function as one of an information handling system (IHS) and an extension of a modular, scalable/expandable rack-based IHS. A busbar physically located at a back of the block chassis within the power and cooling area and enables direct coupling to one of another busbar and a power source to supply power to the plurality of IT components from a power interface board. A block controller is contained in the block chassis and communicatively coupled to the other IT components. The block controller performs all localized, block level control for the rack apparatus. | 2015-06-25 |
20150181751 | STABILIZING RACK SYSTEMS FOR SEISMIC LOADS - A system for performing computing operations includes a rack that rests on a floor and a stabilization device coupled on the top of the rack. The stabilization device includes a mounting portion coupled to the rack, a ballast member, and one or more spring devices coupled between the ballast member and the mounting portion. The ballast member reduces displacement of the rack from seismic loads transmitted from the floor to the rack to mitigate effects of the seismic loads on the rack. | 2015-06-25 |
20150181752 | PREDICTIVE POWER CAPPING AND POWER ALLOCATION TO COMPUTING NODES IN A RACK-BASED INFORMATION HANDLING SYSTEM - A rack-based information handling system (RIHS) includes a rack chassis having at least two opposing side panels which are structurally held in place by one or more segments spanning between the two opposing side panels to generate an internal volume between the at least two opposing side panels. The internal volume has structures that enable insertion and retention of information technology (IT) gear and other components of the IHS at one of a front access space and a rear access space of the rack chassis that extend between the two opposing side panels. The RIHS also includes at least one security screen that is removably affixed to opposing edges of the two opposing side panels and span across a first segment of an access space to prevent direct physical access to the IT gear or other components that are inserted within the rack chassis behind the security screen. | 2015-06-25 |
20150181753 | ELECTRONIC APPARATUS, RAIL STRUCTURE AND RACK - An electronic apparatus, comprising: a rack including a far side post, a near side post, and an opening formed at a side of the near side post; a pair of rail members to slidably move, the pair of rail members including: a first rail member attached to the far side post, and a second rail member attached to the near side post; an engaging member, provided at an end portion of the first rail member, to engage with an engaged portion formed on the far side post, to block movement of the engaging member in a disengaging direction; an unlocking member, provided on the second rail member, to move the locking member to an unlocking position of the engaging member by sliding the second rail member; and an electronic device mounted on the pair of rail members. | 2015-06-25 |
20150181754 | POWER MODULE PACKAGE - There is provided a power module package. According to an exemplary embodiment of the present disclosure, the power module package includes a lead frame and a heat radiating substrate mounted with power devices and control ICs controlling the power devices, a sealing part made of a sealing resin to expose one surface of the heat radiating substrate to the outside, a first heat sink attached to one surface of the heat radiating substrate, a second heat sink attached to the sealing part to be disposed at an opposite side of the first heat sink; and a connection part connecting between the first and second heat sinks. Therefore, according to the power module package according to the exemplary embodiment of the present disclosure, a heat radiating function is improved, and thus heat radiation related reliability of the power module package may be improved. | 2015-06-25 |
20150181755 | JUNCTION BOX FOR VEHICLE - A junction box for a vehicle is provided. The junction box includes at least one printed circuit board having a metal core and a heat transfer member formed at an edge of the printed circuit board. In addition, the junction box includes a case in which at least one printed circuit board is disposed. Further, the heat transfer member contacts the inner surface of the case. | 2015-06-25 |
20150181756 | COOLING DEVICE, ELECTRIC AUTOMOBILE AND ELECTRONIC DEVICE EQUIPPED WITH SAID COOLING DEVICE - In cooling device, refrigerant is circulated through heat receiving unit, heat radiation passage, heat radiation unit, return passage, and heat receiving unit, and cooling is performed by making use of a phase change between a liquid phase and a gaseous phase of refrigerant. Heat receiving unit is configured by placing in series a plurality of heat receivers each of which has inflow port and an outflow port. Check valve is provided on an inflow port side of heat receiver which is closest to return passage among the plurality of heat receivers. | 2015-06-25 |
20150181757 | Power Entry And Distribution For Network Processing Systems - Power entry and distribution for network communication systems are disclosed. For certain embodiments depicted, a power distribution board with an open-grid configuration receives power feed/return lines from a power entry connector and distributes the power feed/return lines for a network processing system. The open-grid configuration facilitates airflow through a chassis and thereby provides improved cooling. Further, a modular power entry connector can be used to facilitate connection of power feed/return cables to the chassis for the network processing systems while improving safety for high power implementations. | 2015-06-25 |
20150181758 | SLICE-IO HOUSING WITH SIDE VENTILATION - An input/output (I/O) device having a base portion configured to communicatively connect the I/O device with at least one other device, an I/O module physically and communicatively connected to the base portion and comprising I/O communication circuitry and a terminal block mount surface, and a terminal block physically and communicatively connected to the terminal block mount surface of the I/O module. The terminal block mount surface has a width that is greater than a corresponding width of the terminal block such that a portion of the terminal block mount surface extends beyond the terminal block, said portion of the terminal block mount surface extending beyond the terminal block including at least one vent for permitting the flow of air through the I/O module and along the terminal block. | 2015-06-25 |
20150181759 | VENTILATION DENOISING DEVICE AND VENTILATION DENOISING SYSTEM - A ventilation denoising device that includes at least one ventilation module disposed with at least two air ducts inside, the air ducts are communicated end-to-end to form a circuitous air duct. The ventilation module is provided with a first ventilation opening communicated with one end of the air duct, and a second ventilation opening communicated with the other end of the air duct. Also disclosed is a ventilation denoising system equipped with the above mentioned ventilation denoising device. The ventilation denoising device can be installed outside equipments, such as a machine cabinet, as ventilation means thereof, and also reduce the noise generated during the equipment operation. | 2015-06-25 |
20150181760 | AXIALLY ALIGNED ELECTRONIC CHASSIS - A technique for housing printed circuit board assemblies (PCAs) includes providing a set of backplane or midplane boards that are oriented orthogonally and edge-to-edge with an array of PCAs such that air introduced at one end of the chassis passes in a straight line course through the PCAs and through the backplane or midplane boards with no substantial bends or changes in direction. | 2015-06-25 |
20150181761 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat absorption piece, a attachment bracket, a heat dissipation device, and a heat transfer member. The heat absorption piece is configured to make contact with an electronic element electrically connected to a circuit board, to absorb heat generated by the electronic element. The attachment bracket is attached to the circuit board and defines a first groove configured to receive the heat absorption piece. A first part of the heat transfer member touches the heat absorption piece. A second part of the heat transfer member touches the heat dissipation device. The heat transfer member is configured to transfer the heat of the heat absorption piece to the second part of the heat transfer member to be dissipated by the heat dissipation device. | 2015-06-25 |
20150181762 | Appliance Immersion Cooling System - A appliance immersion tank system comprising: a generally rectangular tank adapted to immerse in a dielectric fluid a plurality of appliances, each in a respective appliance slot distributed vertically along, and extending transverse to, the long axis of the tank; a primary circulation facility adapted to circulate the dielectric fluid through the tank; a secondary fluid circulation facility adapted to extract heat from the dielectric fluid circulating in the primary circulation facility, and to dissipate to the environment the heat so extracted; and a control facility adapted to coordinate the operation of the primary and secondary fluid circulation facilities as a function of the temperature of the dielectric fluid in the tank. A plenum, positioned adjacent the bottom of the tank, is adapted to dispense the dielectric fluid substantially uniformly upwardly through each appliance slot. A weir, integrated horizontally into a long wall of the tank, is adapted to facilitate substantially uniform recovery of the dielectric fluid flowing through each appliance slot. All active and most passive components of both the primary and secondary fluid circulation facilities, and the control facility are fully redundant, and are adapted automatically to operate in a fail-soft mode. | 2015-06-25 |
20150181763 | ELECTRONICS CHASSIS AND METHOD OF FABRICATING THE SAME - An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment. | 2015-06-25 |
20150181764 | SHEET-TYPE HEAT PIPE - Provided is a sheet-type heat pipe that has a sufficient heat transport capability and can be effortlessly installed in a thin chassis. The sheet-type heat pipe is made of a sealed container formed by stacking and joining together at least two etched sheet bodies formed as metal foil sheets. Particularly, etching or pressing is performed on the surface of the sheet bodies to join at least two sheet bodies such that fine concavities and convexities can be formed on the inner surface of the container and the sheet-type heat pipe with a sufficient heat transport capability can thus be obtained even when the sealed container is thinly formed with its thickness not larger than, e.g. 0.5 mm. More particularly, since the thickness of the container is thinly formed, the sheet-type heat pipe of the present invention can be effortlessly installed in a thin chassis of a mobile terminal. | 2015-06-25 |
20150181765 | HEAT DISSIPATING MODULE AND ASSEMBLING METHOD THEREOF - A heat dissipating module of an electronic device includes a casing, a circuit board, at least one heat generation element, and a fastening assembly. The casing includes at least one lateral plate. The at least one heat generation element is firmly fixed on the at least one lateral plate through a fixing element. After the at least one lateral plate and the circuit board are combined together through the fastening assembly, the at least one lateral plate and the circuit board pass through a reflow furnace, so that the at least one heat generation element is welded on the circuit board. The heat generated by the at least one heat generation element is transferred to the at least one lateral plate of the casing so as to be dissipated away. | 2015-06-25 |
20150181766 | SUBSTRATE AND THE METHOD TO FABRICATE THEREOF - The present invention discloses a substrate where the lateral surface of the substrate is formed to expose at least one portion of a via(s) for circuit connection. The substrate comprises a plurality of insulating layers; and a plurality of conductive layers separated by the plurality of insulating layers. A first lateral surface of the substrate is formed by the plurality of conductive layers and the plurality of insulating layers. The first lateral surface of the substrate comprises at least one first portion of a first via filled with a first conductive material. | 2015-06-25 |
20150181767 | CARRIER MODULE WITH BRIDGING ELEMENT FOR A SEMICONDUCTOR ELEMENT - Carrier module ( | 2015-06-25 |
20150181768 | BACKPLANE STRUCTURE AND SERVER SYSTEM UTILIZING THE SAME - A server system utilizing a backplane structure comprises first and second hard disk modules; a first backplane comprising a first wiring board comprising air vents and passive components and a second wiring board connected to a bottom portion of the first wiring board at a first angle and comprising first active components; and a second backplane comprising a third wiring board comprising second air vents and second passive components and a fourth wiring board connected to a bottom portion of the third wiring board at a second angle and comprising second active components thereon; wherein the first and second backplanes are disposed between the first and second hard disk modules; the first wiring board is directly corresponding to the first hard disk module; the third wiring board is directly corresponding to the second hard disk module; the first backplane is higher than the second backplane. | 2015-06-25 |
20150181769 | AIR CONDITIONING SYSTEM - An air-conditioning system includes: an interior heat exchanging system that partitions a hot area side of a rack row, where a plurality of racks, in which heat generating equipment is held, are aligned in a lateral direction, along the rack row to form a cold air buffer area to the outside of the hot area; a supplying fan that supplies cold air from the cold air buffer area to a cold area side of the rack row via an underfloor side of a double floor on which the rack row has been disposed; and an exterior heat exchanging system, a refrigerant circulating between the exterior heat exchanging system and the interior heat exchanging system via a piping system. It is possible to provide an air-conditioning system with low power consumption suited to air conditioning of a server room. | 2015-06-25 |
20150181770 | AIR FLOW DISTRIBUTION SYSTEM FOR DATA CENTER SERVER RACKS - An air flow distribution system for cooling server racks includes at least one server rack partially defining a hot aisle and a cold aisle, a first air foil disposed above the server rack, and a second air foil disposed above the first air foil. The first air foil and the second air foil are configured to receive air from the hot aisle, and to form turbulent wake patterns in the cold aisle partially defined by the server rack. The air flow distribution system may include a convex ceiling member above the second air foil. A corresponding method includes causing air to be directed between a first air foil disposed above a server rack and a second air foil disposed above the first air foil to form turbulent wake patterns in the cold aisle. An electrical enclosure assembly includes a receptacle and a cover member configured as an air foil. | 2015-06-25 |
20150181771 | MOVABLE SHIELDED CABLE EGRESS - A device having an upper plate comprising a top face and a bottom face with an opening. A lower plate comprising a top face and a bottom face substantially parallel to the upper plate, with an opening. A middle plate between and substantially parallel to the upper plate and lower plate, capable of moving with respect to the upper plate and lower plate, and having a top face a bottom face and at least one opening. A plurality of gaskets configured to electrically connect the upper plate, the middle, plate, and the lower plate and provide an interface that is designed to allow the middle plate to slide substantially parallel to the upper plate and the lower plate. At least one waveguide through the at least one opening of the middle plate. | 2015-06-25 |
20150181772 | ELECTRONIC DEVICES AND ELECTRONIC CIRCUITS AND METHODS FOR MANUFACTURING THE SAME - An electronic device ( | 2015-06-25 |
20150181773 | RECEIVING DEVICE AND SHIELD CASE CONNECTION METHOD - A receiving device comprising: a shield case which is in a hollow box shape that is open on one side, the shield case reducing external interfering signals which interfere with an input signal of a broadcast wave; and a printed wiring board including a conductive portion that is electrically connected with an electronic component, wherein a soldered portion is formed along a side of an opening edge of the shield case, the soldered portion electrically connecting with solder the shield case and the conductive portion. | 2015-06-25 |
20150181774 | REDUCING CROSSTALK IN BOARD-TO-BOARD ELECTRONIC COMMUNICATION - A technique for communicating electronic signals between circuit boards includes separating conductive traces for carrying TX signals from those for carrying RX signals and conveying the separated TX and RX signals between circuit boards on respective sets of distinct midplane circuit board layers. The layers may be distinct circuit board layers on a single board or distinct layers on different boards. | 2015-06-25 |
20150181775 | WEB FOR ABSORBING ELECTROMAGNETIC WAVE AND HOUSING OF ELECTRONIC PARTS USING THE SAME - An electromagnetic wave-absorbing web for controlling interference by electromagnetic wave at a low frequency band generated from various electric and electronic parts and for securing strength without added material and achieving lightweight is provided. The web is manufactured of a mixture solution in the form of a fabric having a mesh structure, wherein the mixture solution is made by mixing a conductive nanomaterial, a magnetic nanofiller, a binder, and a solvent. | 2015-06-25 |
20150181776 | ATTACHMENT FOR FEEDER INSTALLATION AND METHOD FOR FEEDER INSTALLATION - A feeder installing attachment includes: a main body portion including attachment side fitting parts provided on a lower surface thereof and having an installing compatibility with first feeder side fitting parts provided on a lower surface of a first tape feeder; and second feeder installing slots formed on an upper surface of the main body portion and engaging with second feeder side fitting parts provided on a lower surface of a second tape feeder having a standard width smaller than that of the first tape feeder. In a state where the attachment is mounted, an array pitch of the second feeder installing slots is smaller than an array pitch of the base side installing slots, and becomes an array pitch corresponding to the standard width of the second tape feeder. | 2015-06-25 |
20150181777 | BULK FEEDER - A bulk feeder for supplying electronic components to a supply position which is provided with a storage section for storing multiple electronic components in a loose state and a supply passage for guiding the electronic components stored in that storage section to an electronic component supply position while arranged in a single line, a section of the supply passage is a section which has flexibility and groove block member which includes an electronic component supply position is moved using the flexibility of that section with flexibility. By this, it is possible to perform correction of the supply position and it is possible to suitably align the electronic component holding position and supply position. | 2015-06-25 |
20150181778 | MOUNTING SYSTEM - A mounting system which mounts an LED element on a board and mounts a lens so as to cover the LED element, in which control devices which control operations of operating machines include an LED element mounting unit which mounts the LED element in a predetermined mounting position, a deviation amount acquisition unit which acquires a deviation amount between a mounting position and the predetermined mounting position of the LED element, a first lens mounting unit which mounts the lens on the board using a position of the LED element mounted on the board as a reference, when the deviation amount is smaller than a threshold value, and a second lens mounting unit which mounts the lens in a preset position on the board, regardless of the position of the LED element mounted on the board, when the deviation amount is equal to or greater than the threshold value. | 2015-06-25 |
20150181779 | FLEXIBLE ASSEMBLY MACHINE, SYSTEM AND METHOD - An assembly machine includes a plurality of track modules, each track module including a section of track, the plurality of track modules connectable to form a continuous circuitous track, the continuous circuitous track configured to receive a dispensing head, the dispensing head configured to rotate about the continuous circuitous track and at least partially assemble an unfinished product. The machine includes a first feeder module attached to a first length of the continuous circuitous track configured to feed a component to the dispensing head, and a first placement module attached to a second length of the continuous circuitous track configured to receive the unfinished product. The dispensing head is configured to place the component on the unfinished product. The assembly machine is reconfigurable by attaching or removing one or more of the plurality of track modules, the first feeder module and the first placement module. | 2015-06-25 |
20150181780 | MAGNIFERA PLANT NAMED '201230' - A new and distinct | 2015-06-25 |
20150181781 | Nectarine tree, Burnecttwentyeight - A new and distinct variety of nectarine tree ( | 2015-06-25 |
20150181782 | Nectarine Tree, BURNECTTWENTYNINE - A new and distinct variety of nectarine tree ( | 2015-06-25 |
20150181783 | Raspberry plant named 'Sapphire' - The present invention is a new and distinct floricane fruiting red raspberry cultivar named ‘Sapphire’, which is capable of producing large, attractive, flavorful and firm fruit which has exceptional consumer appeal characteristics. The cultivar is characterized by its thorniness throughout the plant, as described herein, lack of fall or primocane fruiting, its strong and distinctive flavor and firmness and its very large fruit size, weight and morphology, specifically its truncated conic, very uniform, fruit shape with minimal bulginess in its basal region or on its receptacle. ‘Sapphire’ plants are very productive in regions having sufficient chilling to produce sufficient spring bud break. Its high yield, firmness, storage ability and large size make ‘Sapphire’ economical to pick mid to mid late season floricane variety for shipping. | 2015-06-25 |
20150181784 | Raspberry plant named 'autumn glory' - The present invention is a new and distinct primocane fruiting red raspberry cultivar named ‘Autumn Glory’, which is capable of producing consistent sized, attractive, flavorful and firm fruit that has exceptional consumer appeal characteristics. The cultivar is characterized by its flower truss pattern at the apex of its primocanes, its fruit glossiness and color, and several morphological characteristics including: thorn shape and pattern, leaf vein and margin characteristics, and its compact plant size and fruiting seasons. | 2015-06-25 |
20150181785 | Grape plant named 'ARRATWENTYEIGHT' - A new distinct variety of grapevine named ‘ARRATWENTYEIGHT’ abundantly forms attractive large firm and meaty seedless berries with a red skin coloration; in medium-to-large clusters which display natural flavor. The fruit commonly is ready for harvesting during October in San Joaquin Valley of Central California, U.S.A, and displays good eating qualities as a table grape. The fruit firmness renders the fruit well amenable for handling, shipping, and storage. | 2015-06-25 |
20150181786 | Grape plant named 'ARRATWENTYNINE' - A new distinct variety of grapevine named ‘ARRATWENTYNINE’ abundantly forms attractive large firm and meaty seedless berries with a red skin coloration; in medium-large clusters which display a sweet apple flavor. The fruit commonly is ready for harvesting during June in San Joaquin Valley of Central California, U.S.A, and displays good eating qualities as a table grape. The fruit firmness renders the fruit well amenable for handling, shipping, and storage. | 2015-06-25 |
20150181787 | Grape plant named 'ARRATWENTYFIVE' - A new distinct variety of grapevine named ‘ARRATWENTYFIVE’ abundantly forms attractive medium firm and meaty seedless berries with a yellow/green skin coloration; in medium-to-large clusters which display a sweet Muscat flavor. The fruit commonly is ready for harvesting during October in San Joaquin Valley of Central California, U.S.A, and displays good eating qualities as a table grape. The fruit firmness renders the fruit well amenable for handling, shipping, and storage. | 2015-06-25 |
20150181788 | Magnolia plant named 'JURMAG5' - A new and distinct | 2015-06-25 |
20150181789 | Weigela Plant Named 'NOVAWEIFUS' - The new plant resulted as an induced mutation of the ‘Brigela’ cultivar (U.S. Plant Pat. No. 12,666). Tissue cultured shoots were subjected to gamma irradiation followed by selection from the resulting plants. A dense compact bushy rounded growth habit is displayed. Attractive light-green somewhat golden foliage having a wavy margin is displayed which resists burning. Attractive red blossoms that contrast well with the blossom coloration are formed commonly from about May to June. The plant is well suited for providing attractive ornamentation in the landscape. | 2015-06-25 |
20150181790 | Rhubarb plant named 'LMR2013" - A new and distinct cultivar of rhubarb, | 2015-06-25 |
20150181791 | Perovskia plant named 'NOVAPERLAC' - The new plant resulted as a mutation of a common plant of | 2015-06-25 |
20150181792 | New Guinea impatiens plant named 'SAKIMP019' - A New Guinea | 2015-06-25 |
20150181793 | New Guinea Impatiens plant named 'SAKIMP031' - A New Guinea Impatiens plant particularly distinguished by having a pink flower color, strong root system and a spreading plant growth habit, is disclosed. | 2015-06-25 |
20150181794 | New Guinea Impatiens Plant Named 'SAKIMP029' - A New Guinea | 2015-06-25 |
20150181795 | Zoysia Japonica Plant Named 'DR2011' - A new and distinct cultivar of | 2015-06-25 |