26th week of 2019 patent applcation highlights part 69 |
Patent application number | Title | Published |
20190198430 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR MODULE | 2019-06-27 |
20190198431 | SEMICONDUCTOR MODULE USING LEAD FRAME FOR POWER AND CONTROL TERMINALS AND BOTH HAVING ASYMMETRIC OR INHOMOGENEOUS CONFIGURATION | 2019-06-27 |
20190198432 | ELECTRONIC COMPONENT-INCORPORATING SUBSTRATE AND SHEET SUBSTRATE | 2019-06-27 |
20190198433 | WIRING SUBSTRATE | 2019-06-27 |
20190198434 | SEMICONDUCTOR PACKAGING STRUCTURE WITH ANTENNA ASSEMBLY | 2019-06-27 |
20190198435 | INTEGRATED INTERPOSER SOLUTIONS FOR 2D AND 3D IC PACKAGING | 2019-06-27 |
20190198436 | METHODS OF EMBEDDING MAGNETIC STRUCTURES IN SUBSTRATES | 2019-06-27 |
20190198437 | INTERPOSER SUBSTRATE AND SEMICONDUCTOR PACKAGE | 2019-06-27 |
20190198438 | Chip on Film and a Display Device Having Thereof | 2019-06-27 |
20190198439 | TRACE/VIA HYBRID STRUCTURE AND METHOD OF MANUFACTURE | 2019-06-27 |
20190198440 | TRACE/VIA HYBRID STRUCTURE AND METHOD OF MANUFACTURE | 2019-06-27 |
20190198441 | SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198442 | Feol/Beol Heterogeneous Integration | 2019-06-27 |
20190198443 | SEMICONDUCTOR DEVICES HAVING ELECTRICALLY AND OPTICALLY CONDUCTIVE VIAS, AND ASSOCIATED SYSTEMS AND METHODS | 2019-06-27 |
20190198444 | FORMING DUAL METALLIZATION INTERCONNECT STRUCTURES IN SINGLE METALLIZATION LEVEL | 2019-06-27 |
20190198445 | EMBEDDED MULTI-DIE INTERCONNECT BRIDGE PACKAGES WITH LITHOTGRAPHICALLY FORMED BUMPS AND METHODS OF ASSEMBLING SAME | 2019-06-27 |
20190198446 | PRINTED WIRING BOARD | 2019-06-27 |
20190198447 | MULTI-CHIP PACKAGE WITH HIGH DENSITY INTERCONNECTS | 2019-06-27 |
20190198448 | ANISOTROPICALLY CONDUCTIVE ELASTIC ADHESIVE FILMS IN SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF ASSEMBLING SAME | 2019-06-27 |
20190198449 | Hybrid Integrated Circuit Architecture | 2019-06-27 |
20190198450 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE | 2019-06-27 |
20190198451 | SEMICONDUCTOR PACKAGE HAVING A METAL PAINT LAYER | 2019-06-27 |
20190198452 | SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198453 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-27 |
20190198454 | LEADFRAME WITH PAD ANCHORING MEMBERS AND METHOD OF FORMING THE SAME | 2019-06-27 |
20190198455 | SEMICONDUCTOR APPARATUSES WITH RADIO-FREQUENCY LINE ELEMENTS, AND ASSOCIATED MANUFACTURING METHODS | 2019-06-27 |
20190198456 | TOPSIDE RADIO-FREQUENCY ISOLATION CAVITY CONFIGURATION | 2019-06-27 |
20190198457 | WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCESS, EQUIPMENT STRESS MANAGEMENT AND THERMAL MANAGEMENT | 2019-06-27 |
20190198458 | RADIO-FREQUENCY ISOLATION CAVITIES AND CAVITY FORMATION | 2019-06-27 |
20190198459 | SEMICONDUCTOR MODULE | 2019-06-27 |
20190198460 | CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE | 2019-06-27 |
20190198461 | FORMING A MODIFIED LAYER WITHIN A RADIO FREQUENCY (RF) SUBSTRATE FOR FORMING A LAYER TRANSFERRED RF FILTER-ON-INSULATOR WAFER | 2019-06-27 |
20190198462 | SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198463 | SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198464 | SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198465 | Compensation Device for Transistors | 2019-06-27 |
20190198466 | SEMICONDUCTOR PACKAGE STRUCTURE HAVING ANTENNA MODULE | 2019-06-27 |
20190198467 | POLARIZATION DEFINED ZERO MISALIGNMENT VIAS FOR SEMICONDUCTOR PACKAGING | 2019-06-27 |
20190198468 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-06-27 |
20190198469 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-27 |
20190198470 | INTERCONNECT STRUCTURES FOR PREVENTING SOLDER BRIDGING, AND ASSOCIATED SYSTEMS AND METHODS | 2019-06-27 |
20190198471 | LOCATION DISPLACEMENT DETECTION METHOD, LOCATION DISPLACEMENT DETECTION DEVICE, AND DISPLAY DEVICE | 2019-06-27 |
20190198472 | DESIGNS AND METHODS FOR CONDUCTIVE BUMPS | 2019-06-27 |
20190198473 | CHIP STRUCTURE | 2019-06-27 |
20190198474 | MULTIPLE SIZED BUMP BONDS | 2019-06-27 |
20190198475 | LASER ABLATION FOR WIRE BONDING ON ORGANIC SOLDERABILITY PRESERVATIVE SURFACE | 2019-06-27 |
20190198476 | BONDING APPARATUS AND METHOD FOR USING THE SAME | 2019-06-27 |
20190198477 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198478 | FAN OUT PACKAGE AND METHODS | 2019-06-27 |
20190198479 | SEMICONDUCTOR DEVICE INCLUDING OPTICALLY CONNECTED WAFER STACK | 2019-06-27 |
20190198480 | DUAL-SIDED MEMORY MODULE WITH CHANNELS ALIGNED IN OPPOSITION | 2019-06-27 |
20190198481 | INTEGRATED CIRCUIT DIE HAVING BACKSIDE PASSIVE COMPONENTS AND METHODS ASSOCIATED THEREWITH | 2019-06-27 |
20190198482 | SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198483 | DISPLAY DEVICE | 2019-06-27 |
20190198484 | LIGHT EMITTING DEVICE | 2019-06-27 |
20190198485 | LIGHT EMITTING DEVICE WITH LED STACK FOR DISPLAY AND DISPLAY APPARATUS HAVING THE SAME | 2019-06-27 |
20190198486 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-06-27 |
20190198487 | INFRA-RED DEVICE | 2019-06-27 |
20190198488 | MICRO LED DISPLAY PANEL AND MANUFACTURING METHOD THEREOF | 2019-06-27 |
20190198489 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE | 2019-06-27 |
20190198490 | ELECTRONIC PACKAGE UNIT AND MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE | 2019-06-27 |
20190198491 | INTEGRATED CIRCUITS HAVING CROSS-COUPLE CONSTRUCTS AND SEMICONDUCTOR DEVICES INCLUDING INTEGRATED CIRCUITS | 2019-06-27 |
20190198492 | DIODE STRUCTURE AND ELECTROSTATIC DISCHARGE PROTECTION DEVICE INCLUDING THE SAME | 2019-06-27 |
20190198493 | DEVICE AND METHOD FOR ELECTROSTATIC DISCHARGE (ESD) PROTECTION | 2019-06-27 |
20190198494 | SEMICONDUCTOR DEVICE FOR ENHANCING ELECTROSTATIC DISCHARGE PROTECTION AND LAYOUT STRUCTURE THEREOF | 2019-06-27 |
20190198495 | POWER MODULE AND POWER CONVERTER | 2019-06-27 |
20190198496 | Layout Method | 2019-06-27 |
20190198497 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-27 |
20190198498 | SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198499 | SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198500 | FORMATION OF FULL METAL GATE TO SUPPRESS INTERFICIAL LAYER GROWTH | 2019-06-27 |
20190198501 | SEMICONDUCTOR MEMORY DEVICE | 2019-06-27 |
20190198502 | TRANSISTOR STRUCTURE AND SEMICONDUCTOR LAYOUT STRUCTURE | 2019-06-27 |
20190198503 | SEMICONDUCTOR MEMORY DEVICES HAVING AN UNDERCUT SOURCE/DRAIN REGION | 2019-06-27 |
20190198504 | SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR PREPARING THE SAME | 2019-06-27 |
20190198505 | METHOD FOR PREPARING A SEMICONDUCTOR MEMORY STRUCTURE | 2019-06-27 |
20190198506 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-06-27 |
20190198507 | SEMICONDUCTOR MEMORY DEVICE | 2019-06-27 |
20190198508 | DUAL PORT MEMORY CELL WITH IMPROVED ACCESS RESISTANCE | 2019-06-27 |
20190198509 | Memory Cells, Memory Arrays, and Methods of Forming Memory Arrays | 2019-06-27 |
20190198510 | Memory Arrays, and Methods of Forming Memory Arrays | 2019-06-27 |
20190198511 | VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME | 2019-06-27 |
20190198512 | CELL DISTURB PREVENTION USING A LEAKER DEVICE TO REDUCE EXCESS CHARGE FROM AN ELECTRONIC DEVICE | 2019-06-27 |
20190198513 | NONVOLATILE MEMORY DEVICE COMPENSATING FOR VOLTAGE DROP OF TARGET GATE LINE | 2019-06-27 |
20190198514 | NONVOLATILE MEMORY DEVICE, METHOD OF OPERATING NONVOLATILE MEMORY DEVICE AND STORAGE DEVICE INCLUDING THE SAME | 2019-06-27 |
20190198515 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING MULTI-THRESHOLD-VOLTAGE DRAIN SELECT GATES AND METHOD OF MAKING THE SAME | 2019-06-27 |
20190198516 | MEMORY HAVING A CONTINUOUS CHANNEL | 2019-06-27 |
20190198517 | SEMICONDUCTOR MEMORY DEVICE | 2019-06-27 |
20190198518 | Conductive Structures, Assemblies Having Vertically-Stacked Memory Cells Over Conductive Structures, and Methods of Forming Conductive Structures | 2019-06-27 |
20190198519 | Assemblies Having Vertically-Extending Structures, and Methods of Forming Assemblies Having Vertically-Extending Channel Material Pillars | 2019-06-27 |
20190198520 | Memory Arrays | 2019-06-27 |
20190198521 | SEMICONDUCTOR DEVICE | 2019-06-27 |
20190198522 | SEMICONDUCTOR MEMORY | 2019-06-27 |
20190198523 | SEMICONDUCTOR MEMORY DEVICE | 2019-06-27 |
20190198524 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME | 2019-06-27 |
20190198525 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING SAME | 2019-06-27 |
20190198526 | Methods Of Forming An Array Of Elevationally-Extending Strings Of Memory Cells | 2019-06-27 |
20190198527 | SEMICONDUCTOR MEMORY DEVICE | 2019-06-27 |
20190198528 | Integrated Structures | 2019-06-27 |
20190198529 | SEMICONDUCTOR DEVICE | 2019-06-27 |