26th week of 2011 patent applcation highlights part 18 |
Patent application number | Title | Published |
20110156252 | SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND FABRICATION METHOD THEREOF - A semiconductor package having electrical connecting structures includes: a conductive layer having a die pad and traces surrounding the die pad; a chip; bonding wires; an encapsulant with a plurality of cavities having a depth greater than the thickness of the die pad and traces for embedding the die pad and the traces therein, and the cavities exposing the die pad and the traces; a solder mask layer formed in the cavities and having a plurality of openings for exposing the trace ends and a portion of the die pad; and solder balls formed in the openings and electrically connected to the trace ends. Engaging the solder mask layer with the encapsulant enhances adhesion strength of the solder mask layer so as to prolong the moisture permeation path and enhance package reliability. | 2011-06-30 |
20110156253 | MICRO-BUMP STRUCTURE - A dished micro-bump structure with self-aligning functions is provided. The micro-bump structure takes advantage of the central concavity for achieving the accurate alignment with the corresponding micro-bumps. | 2011-06-30 |
20110156254 | MODIFIED CHIP ATTACH PROCESS - A process for assembling a package for a semiconductor device comprising reducing the stress in an inner dielectric layer during packaging by heating the die and the substrate to a temperature where a solder reflows, dropping to a temperature where a selected epoxy will cure, liquefying the epoxy, adding the liquefied epoxy to the die and substrate, and maintaining the die and substrate at a temperature where the epoxy cures for a selected amount of time. | 2011-06-30 |
20110156255 | CARBON NANOTUBE-BASED FILLER FOR INTEGRATED CIRCUITS - A variety of characteristics of an integrated circuit chip arrangement with a chip and package-type substrate are facilitated. In various example embodiments, a carbon nanotube-filled material ( | 2011-06-30 |
20110156256 | ELECTROMIGRATION-RESISTANT UNDER-BUMP METALLIZATION OF NICKEL-IRON ALLOYS FOR SN-RICH SOLDER BUMPS OF PB-FREE FLIP-CHIP APPLICATIONS - A process comprises manufacturing an electromigration-resistant under-bump metallization (UBM) flip chip structure comprising a Cu layer by applying to the Cu layer a metallic reaction barrier layer comprising NiFe. The solder employed in the flip chip structure comprise substantially lead-free tin. A structure comprises a product produced by this process. In another embodiment a process comprises manufacturing an electromigration-resistant UBM Sn-rich Pb-free solder bump flip chip structure wherein the electromigration-resistant UBM structure comprises a four-layer structure, or a three-layer structure, wherein the four layer structure is formed by providing 1) an adhesion layer, 2) a Cu seed layer for plating, 3) a reaction barrier layer, and 4) a wettable layer for joining to the solder, and the three-layer structure is formed by providing 1) an adhesion layer, 2) a reaction barrier layer, and 3) a wettable layer. In a further embodiment, the reaction barrier layer comprises metals selected from Ni, Fe, Pd, Pt, Co, Cu and their alloys, and combinations thereof. A structure comprises a product produced by the immediately foregoing process. | 2011-06-30 |
20110156257 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a semiconductor device includes providing a substrate including pattern formed over the substrate and a first insulating layer formed over the pattern. A diffusion barrier layer is formed over the first insulation layer. A second insulating layer is formed over the diffusion barrier layer. The second insulating layer, the diffusion layer, and the first insulating layer are patterned to form a trench exposing the pattern. A metal layer is formed over the second insulating layer and within the trench to define a metal interconnection pattern coupling the pattern within the trench, the metal particles from the metal layer diffuse into the second insulating layer. The second insulation layer and the metal particles that have been diffused therein are removed. | 2011-06-30 |
20110156258 | SEMICONDUCTOR DEVICE HAVING THROUGH VIA AND METHOD FOR FABRICATING THE SAME - In one embodiment, a semiconductor device may includes a through via disposed within a substrate with a diffusion barrier layer disposed over the through via and the substrate. An insulation layer may be disposed over the diffusion barrier layer, a metal interconnection layer disposed within the insulation layer over at least a portion of the via contact, and a via contact disposed between the metal interconnection layer and the through via within the insulation layer. The via contact may have a cross-sectional area larger than a cross-sectional area of the through via so that the through via and the diffusion barrier layer do not contact each other. | 2011-06-30 |
20110156259 | METAL-TO-CONTACT OVERLAY STRUCTURES AND METHODS OF MANUFACTURING THE SAME - The present invention provides a semiconductor device with a metal-to-contact overlay structure. The semiconductor device includes a substrate, a dielectric layer on the substrate, a contact coupled to the substrate in the dielectric layer, a first conductive region on the contact in the dielectric layer, a dielectric sidewall on the contact in the dielectric layer, the dielectric sidewall surrounding the first conductive region, and a second conductive region on the first conductive region on the dielectric layer. | 2011-06-30 |
20110156260 | PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE - An integrated circuit chip includes a substrate; a topmost metal layer overlying the substrate; and a pad in the topmost metal layer. A thickness of the pad is less than a thickness of the topmost metal layer. | 2011-06-30 |
20110156261 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING SAME - An integrated circuit package includes a first dielectric layer comprising a dielectric film having a first side and a second side, the first side having a plurality of contact locations and a plurality of non-contact locations. The package includes a plurality of components, each component having a first surface and a second surface, wherein the first surface of each of the plurality of components is affixed to a corresponding one of the plurality of contact locations of the dielectric film absent a layer of adhesive therebetween that is distinct from a material of the dielectric film. | 2011-06-30 |
20110156262 | SEMICONDUCTOR DEVICE WITH BURIED GATE AND METHOD FOR FABRICATING THE SAME - A method for fabricating a semiconductor device includes forming landing plugs over a substrate, forming a trench by etching the substrate between the landing plugs, forming a buried gate to partially fill the trench, forming a gap-fill layer to gap-fill an upper side of the buried gate, forming protruding portions of the landing plugs, and trimming the protruding portions of the landing plugs. | 2011-06-30 |
20110156263 | SEMICONDUCTOR DEVICE - A semiconductor device may include, but is not limited to: a semiconductor substrate having an element formation region and a dicing region; an element layer over the element formation region and the dicing region; and a multi-layered wiring structure over the dicing region. The multi-layered wiring structure extends upwardly from the element layer. The multi-layered wiring structure has a groove penetrating the multi-layered wiring structure. | 2011-06-30 |
20110156264 | SEMICONDUCTOR ELEMENT BUILT-IN DEVICE - A semiconductor element built-in device includes: a first substrate having a first pad thereon; a semiconductor element on the first substrate; a second substrate having a second pad thereon and mounted on the first substrate via a solder terminal having a solder coated thereon; a resin layer provided between the first substrate and the second substrate such that the solder terminal and the semiconductor element are embedded in the resin layer; and a dam provided at least partially around at least one of the first and second pads, the dam being configured to restrain the solder flowing from the solder terminal. | 2011-06-30 |
20110156265 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge. | 2011-06-30 |
20110156266 | METHODS FOR FORMING THROUGH-SUBSTRATE CONDUCTOR FILLED VIAS, AND ELECTRONIC ASSEMBLIES FORMED USING SUCH METHODS - Through substrate vias for back-side electrical and thermal interconnections on very thin semiconductor wafers without loss of wafer mechanical strength during manufacturing are provided by: forming desired device regions with contacts on the front surface of an initially relatively thick wafer; etching via cavities partly through the wafer in the desired locations; filling the via cavities with a conductive material coupled to some device region contacts; mounting the wafer with its front side facing a support structure; thinning the wafer from the back side to expose internal ends of the conductive material filled vias; applying any desired back-side interconnect region coupled to the exposed ends of the filled vias; removing the support structure and separating the individual device or IC assemblies so as to be available for mounting on a further circuit board, tape or larger circuit. | 2011-06-30 |
20110156267 | Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element - The present invention relates to a semiconductor process, a semiconductor element and a package having a semiconductor element. The semiconductor element includes a base material and at least one through via structure. The base material has a first surface, a second surface, at least one groove and at least one foundation. The groove opens at the first surface, and the foundation is disposed on the first surface. The through via structure is disposed in the groove of the base material, and protrudes from the first surface of the base material. The foundation surrounds the through via structure. Whereby, the foundation increases the strength of the through via structure, and prevents the through via structure from cracking. | 2011-06-30 |
20110156268 | Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element - The present invention relates to a semiconductor process, a semiconductor element and a package having a semiconductor element. The semiconductor process includes the following steps: (a) providing a semiconductor element including a silicon base material and at least one conductive via structure disposed in the silicon base material; (b) removing part of the silicon base material to form a first surface, wherein the conductive via structure protrudes from the first surface of the silicon base material so as to form a through via structure; (c) forming a protective layer on the first surface of the silicon base material to cover the through via structure, wherein the protective layer is made of photo-sensitive material; (d) removing part of the protective layer to form a first surface, so as to expose the through via structure on the first surface of the protective layer. Whereby, the protective layer disposed on the through via structure is totally removed, so that the yield rate of electrically connecting the through via structure and external elements is ensured. | 2011-06-30 |
20110156269 | SEMICONDUCTOR PACKAGE AND STACK SEMICONDUCTOR PACKAGE HAVING THE SAME - A semiconductor package includes a semiconductor chip having a first region defined at a center portion of a first surface of the semiconductor chip, and having second and third regions defined on both sides of the first region, respectively. Bonding pads are disposed in the first region and a substrate having a substrate body is disposed in the second region of the semiconductor chip. The substrate includes an extension portion projecting away from the semiconductor chip. The substrate also includes circuit patterns disposed on the substrate body having a first ends placed adjacent to the bonding pads and second ends placed on the extension portion. Connection members electrically connect the first ends of the circuit patterns and the bonding pads. | 2011-06-30 |
20110156270 | CONTACT ELEMENTS OF SEMICONDUCTOR DEVICES FORMED ON THE BASIS OF A PARTIALLY APPLIED ACTIVATION LAYER - When forming contact levels of sophisticated semiconductor devices, a superior bottom to top fill behavior may be accomplished by applying an activation material selectively in the lower part of the contact openings and using a selective deposition technique. Consequently, deposition-related irregularities, such as voids, may be efficiently suppressed even for high aspect ratio contact openings. | 2011-06-30 |
20110156271 | SEMICONDUCTOR MODULE - A semiconductor module having a second semiconductor package | 2011-06-30 |
20110156272 | Multilayered Wiring Substrate - A multilayered wiring substrate, comprising: a plurality of first main surface side connecting terminals arranged in a first main surface of a stack structure; and a plurality of second main surface side connecting terminals being arranged in a second main surface of the stack structure; wherein a plurality of conductor layers are alternately formed in a plurality of stacked resin insulation layers and are operably connected to each other through via conductors tapered such that diameters thereof are widened toward the first or the second main surface, wherein a plurality of openings are formed in an exposed outermost resin insulation layer in the second main surface, and terminal outer surfaces of the second main surface side connecting terminals arranged to match with the plurality of the openings are positioned inwardly from an outer main surface of the exposed outermost resin insulation layer, and edges of terminal inner surfaces are rounded. | 2011-06-30 |
20110156273 | CIRCUIT SUBSTRATE AND METHOD - Embodiments of the invention are concerned with semiconductor circuit substrates for use in a radiation detection device, said radiation detection device comprising a detector substrate having a plurality of detector cells arranged to generate charge in response to incident radiation, each of said detector cells including at least one detector cell contact for coupling charge from said detector cell to said semiconductor circuit substrate. More particularly, in embodiments of the invention the semiconductor circuit substrate comprises: a plurality of cell circuit contacts, each of which is configured to receive charge from a corresponding detector cell contact, cell circuitry associated with said plurality of cell circuit contacts; one or more conductive pathways arranged to carry at least one of control, readout and power supply signals to and/or from said cell circuitry; and one or more signal pathways extending through said semiconductor circuit substrate, said one or more signal pathways being electrically coupled to said conductive pathways so as to provide an external signal interface for said cell circuitry. Embodiments in accordance with the present invention thus provide a means of routing signals through the semiconductor circuit substrate to an electrical contact on a surface of the semiconductor circuit substrate. The electrical contact on the surface of the circuit substrate can then be directly coupled to a corresponding electrical contact on a mount. | 2011-06-30 |
20110156274 | SEMICONDUCTOR DEVICE - The present invention provides a semiconductor device capable of suppressing degradation in connection reliability due to the decrease in thickness of a conductive adhesive caused by the movement of a connecting plate in a semiconductor device to which a power transistor is mounted. A step is provided in the thin part of the connecting plate connected to a lead post to lock the connecting plate by contacting the step to the tip of the lead post. Alternatively, a groove is provided in the thin part of the connecting plate to lock the connecting plate by connecting the lead post to only the part of the connecting plate on the tip side from the groove. | 2011-06-30 |
20110156275 | INTEGRATED CIRCUIT PACKAGING SYSTEM HAVING PLANAR INTERCONNECT AND METHOD FOR MANUFACTURE THEREOF - A method for manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a planar interconnect, over a carrier with the planar interconnect at a non-active side of the integrated circuit and an active side of the integrated circuit facing the carrier; connecting the integrated circuit and the carrier; connecting the planar interconnect and the carrier; and forming an encapsulation over the integrated circuit, the carrier, and the planar interconnect. | 2011-06-30 |
20110156276 | Patch on interposer assembly and structures formed thereby - Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure. | 2011-06-30 |
20110156277 | DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE - The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface contains a black pigment. | 2011-06-30 |
20110156278 | FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE - The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has an elastic modulus (at 50° C.) of 10 MPa or less and the laser marking layer has an elastic modulus (at 50° C.) of 100 MPa or more. | 2011-06-30 |
20110156279 | FILM FOR FLIP CHIP TYPE SEMICONDUCTOR BACK SURFACE - The present invention provides a film for flip chip type semiconductor back surface, which is to be formed on a back surface of a semiconductor element flip-chip connected on an adherend, the film including a wafer adhesion layer and a laser marking layer, in which the wafer adhesion layer has a light transmittance of 40% or more in terms of a light having a wavelength of 532 nm and the laser marking layer has a light transmittance of less than 40% in terms of a light having a wavelength of 532 nm. | 2011-06-30 |
20110156280 | DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE - The present invention provides a dicing tape-integrated film for semiconductor back surface, which includes: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which a peel force (temperature: 23° C., peeling angle: 180°, tensile rate: 300 mm/min) between the pressure-sensitive adhesive layer of the dicing tape and the film for flip chip type semiconductor back surface is from 0.05 N/20 mm to 1.5 N/20 mm. | 2011-06-30 |
20110156281 | Quad Flat No Lead (QFN) Package - The present invention relates to a quad flat no lead (QFN) package is provided. In the invention, a plurality of first pads are disposed outside an extension area of a conductive circuit layer, and a plurality of second pads are disposed inside a die bonding area of the conductive circuit layer, wherein the extension area surrounds the die bonding area. First ends of a plurality of traces are connected to the second pads, and second ends of the traces are located in the extension area. An insulating layer fills at least the die bonding area and the extension area, and exposes top surfaces and bottom surfaces of the second pads. A chip is mounted at the die bonding area and a plurality of wires electrically connect the chip to the first pads and the second ends of the traces respectively. An encapsulation material is used to cover the conductive circuit layer, the chip and the wires. Whereby, the package of the invention can have more inputs/outputs terminals, and the insulating layer can prevent moisture permeation from corroding the joints between the wires and the first pads and the second ends of the traces, thus increasing the reliability of the package of the invention. | 2011-06-30 |
20110156282 | Gate Conductor Structure - A gate conductor structure is provided having a barrier region between a N-type device and a P-type device, wherein the barrier region minimizes or eliminates cross-diffusion of dopant species across the barrier region. The barrier region comprises at least one sublithographic gap in the gate conductor structure. The sublithographic gap is formed by using self-assembling copolymers to form a sublithographic patterned mask over the gate conductor structure. According to one embodiment, at least one sublithographic gap is a slit or line that traverses the width of the gate conductor structure. The sublithographic gap is sufficiently deep to minimize or prevent cross-diffusion of the implanted dopant from the upper portion of the gate conductor. According to another embodiment, the sublithographic gaps are of sufficient density that cross-diffusion of dopants is reduced or eliminated during an activation anneal such that changes in Vt are minimized. | 2011-06-30 |
20110156283 | Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages - A microelectronic package comprises a die ( | 2011-06-30 |
20110156284 | DEVICE AND METHOD FOR ALIGNMENT OF VERTICALLY STACKED WAFERS AND DIE - A device is provided that includes a first die having a first alignment structure that includes a plurality of first transmission columns arranged in a pattern and a second die positioned on the first die, the second die having a second alignment structure that includes a plurality of second transmission columns arranged in the same pattern as the first transmission columns. The first and second transmission columns are each coplanar with a first surface and a second surface of the first and second die, respectively. | 2011-06-30 |
20110156285 | INTEGRATED ALIGNMENT AND OVERLAY MARK, AND METHOD FOR DETECTING ERRORS OF EXPOSED POSITIONS THEREOF - An integrated alignment and overlay mark for detecting the exposed errors of the photolithography process between a pre-layer and a current layer is disclosed. The integrated alignment and overlay mark includes an alignment mark and an overlay mark in the same shot region. The alignment mark is formed surrounding the overlay mark; therefore, the gap or the orientation between the pre-layer and the current layer can be calculated in order to check the alignment accuracy of photolithography process. | 2011-06-30 |
20110156286 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes an alignment mark formed over a semiconductor substrate and an inhibition pattern arranged over the alignment mark with a pattern edge of the inhibition pattern located in a mark functional region of the alignment mark in order to inhibit the alignment mark being recognized as such by an image detector of an exposure device. | 2011-06-30 |
20110156287 | MICROBUBBLE WATER GENERATOR - A microbubble water generator includes a gas absorbing device respectively communicating with a pressure conveying motor, a gas supplier and a water switch. Wherein, the water switch is electrically connected with the pressure conveying motor and the gas supplier, and the pressure conveying motor communicates with a booster pipe. The booster pipe is further connected to a pressure release coupling, and the pressure release coupling thence joints to a water output valve, thereby outputting microbubble water with even and fine properties. | 2011-06-30 |
20110156288 | ULTRASONIC AROMA HUMIDIFIER CAPABLE OF FACILITATING CLEANING - The present device concerns an ultrasonic aroma humidifier which facilitates cleaning. For this purpose, the present device comprises a main body, a vaporizer which is coupled with the bottom of the main body, and a base. The main body includes a water shortage indicating lamp, and a handle with a built-in air blowing port, wherein a water container and a water container mount are formed. The vaporizer includes: an ultrasonic oscillator which generates sprayed mist through an ultrasonic oscillation, a water level detecting sensor which detects the water level, a circuit board for controlling the ultrasonic oscillator when there is a lack of water and turning on and off the water shortage indicating lamp, and an electric connector which supplies electric power to the ultrasonic oscillator. The base houses an electric connection protrusion which is coupled with the electric connector, ultrasonic oscillation and control circuits which respectively drive and control the vaporizer, a blowing fan for taking in external air, a humidifying switch which regulates the degree of humidification, a blowing switch which regulates blowing intensity, and a power source cord. The top of the main body is coupled with a cover in which a humidifying outlet for discharging humidifying particles and a nozzle are included. In the inner side of the main body, an attachable/detachable filter net storing aroma and cosmetic materials and a stationary ring are included. According to the constitution as the above mentioned ultrasonic humidifier, since the main body has a function as a water tank and a humidifying body, and the air blowing port is handle-shaped, the internal structure is simple. Cleaning and water supply are easy and free because the main body is independently separated from the base wherein an electric circuit and a blowing fan are embedded, using an electric power transmitting method at a contact point. In addition, position change and installation are free and humidification and aroma and cosmetic material discharge are simultaneously enabled by letting a user freely add aroma and cosmetic materials because the filter net for aroma is formed inside the main body. | 2011-06-30 |
20110156289 | DEVICE FOR HUMIDIFYING BREATHING AIR FOR ARTIFICIAL RESPIRATION - A device for humidifying breathing air for artificial respiration of mammals, in particular human beings, includes at least one essentially closed container for receiving water, a first opening for letting in the non-humidified air and a second opening for letting out humidified air, and an inlet for supplying the water to the container. The inlet is located in the upper part of the container, which is adjoined by a tube essentially crossing through the container interior, and on the free end of the tube, a valve is disposed, which limits the level of the water supplied via the tube in such a way that the container bottom in the container interior is essentially covered with water. | 2011-06-30 |
20110156290 | Medium Orbital Flow Oxygenator - An apparatus for oxygenating and mixing a body of liquid includes an impeller rotating about a vertical axis and driven by a submersible motor. The impeller is incased in a housing with intake ports for both oxygen and water. Ports are located around the circumference of the housing such that the oxygen infused water may exit the housing in a radial direction and be dispersed across the tank before the pockets of oxygen rise to the surface. The motor and impeller housing are mounted to a horizontally positioned plate which is suspended from a float by adjustable chains or cables allowing variance in the depth of submersion for use in lagoons. Alternatively the unit may be mounted to the bottom of a tank or basin in applications where permanent installation is feasible such as in tanks. Pure oxygen is supplied from a source outside the body of water and is of a purity level that allows highly efficient transfer of oxygen to the water receiving treatment. The invention disperses combined water and oxygen in the treatment basin for the purpose of dissolving oxygen in the water receiving treatment. | 2011-06-30 |
20110156291 | METHOD FOR MANUFACTURING FRESNEL LENS - A method for manufacturing a Fresnel lens includes the flowing steps: a. providing a mixture for forming the Fresnel lens; b. providing a lower mold on which the mixture is disposed; c. vacuumizing the mixture on the lower mold; d. providing an upper mold to exert a pressure on a top surface of the mixture; e. vacuumizing the mixture on the lower mold again; and f. heating the mixture on the lower mold to harden the mixture whereby the Fresnel lens can be obtained. | 2011-06-30 |
20110156292 | METHOD OF MANUFACTURING BRIGHTNESS ENHANCEMENT FILM AND ROLLER USED THEREIN - A method of manufacturing brightness enhancement film includes a roller with an outer surface and a plurality of micro-structures formed on the outer surface undergoing sandblasting, thereby forming a plurality of rough portions on the outer surface, rolling the blasted roller onto a substrate whereby the micro-structures and the rough portions imprint the substrate to form a plurality of brightness enhancement portions and a plurality of diffusion portions on the outer surface of the blasted roller, and cutting the imprinted substrate to provide a brightness enhancement film. | 2011-06-30 |
20110156293 | EMBOSSING ASSEMBLY, MANUFACTURING METHOD THEREOF, AND EMBOSSING METHOD USING THE SAME - A light guide plate is manufactured by applying an embossing assembly. The embossing assembly includes a roller and an embossing layer applied on the roller. The embossing assembly is formed by electroforming embossing micro-structures on the outer surface of the embossing layer to an embossing substrate and embossing micro-structures on a surface thereof. | 2011-06-30 |
20110156294 | METHOD OF MANUFACTURING BRIGHTNESS ENHANCEMENT FILM AND ROLLER USED THEREIN - A method of manufacturing a brightness enhancement film utilizes a roller with an outer surface and a plurality of slot portions formed thereon by sandblasting and includes heating a substrate, rolling the textured roller on to the substrate such that the slot portions imprint the substrate and form a plurality of protrusions thereon, and cutting the substrate which has been imprinted to provide a brightness enhancement film. | 2011-06-30 |
20110156295 | EMBOSSING ASSEMBLY, MANUFACTURING METHOD THEREOF, AND EMBOSSING METHOD USING THE SAME - A method of manufacturing a brightness enhancement film includes the following: providing a embossing substrate, providing a first embossing assembly including a roller and an embossing layer applied on the roller, which is formed by electroforming and includes protruding micro-structures formed on the outer surface of the embossing layer, rolling the embossing layer onto the embossing substrate, and embossing the recessed micro-structures on a surface of the embossing substrate. | 2011-06-30 |
20110156296 | Surface Mount Optoelectronic Component with Lens Having Protruding Structure - The invention relates to a surface mount optoelectronic component with a lens attachment, the method for precising the lens position and the method to manufacture the whole component. | 2011-06-30 |
20110156297 | DENSIFICATION OF C-C COMPOSITES WITH PITCHES FOLLOWED BY CVI/CVD - A method of manufacturing pitch-based carbon-carbon composite useful as a brake disc, includes (a) providing annular carbon fiber brake disc preform; (b) heat-treating the carbon fiber preform; (c) infiltrating the carbon fiber preform with pitch feedstock by VPI or RTM processing; (d) carbonizing the pitch-infiltrated carbon fiber preform; (e) repeating steps (c) and (d) to achieve a density in the carbon fiber preform of approximately 1.5 g/cc to below 1.7 g/cc; and (f) densifying the preform by CVI/CVD processing to a density higher than 1.7 g/cc. Employing lower cost VPI and/or RTM processing in early pitch densification cycles and using more expensive CVI/CVD processing only in the last densification cycle provides C-C composites in which the pitch-based components resist pullout, resulting in a longer wearing composite. | 2011-06-30 |
20110156298 | INJECTION MOLDING METHOD OF STONE-BASED COMPOSITE MATERIAL - The invention provides an injection molding method of stone-based composite material and equipment thereof, wherein the method comprises the following steps: a. putting raw materials into a charging device and then pushing the raw materials into a preforming machine barrel of a preforming device by a pressing component in the charging device; b. keeping the temperature being between 15° C. and 55° C. and compacting the raw materials with the rotation of a preforming screw and transporting the raw materials into a collecting block; c. injecting the raw materials into a mold through a mold gate under the injection force of 50 Mpa to 180 Mpa; d. keeping the temperature of the mold between 140° C. and 200° C. and curing time between 40 seconds and 300 seconds; and e. opening the mold to get the product. The invention has the advantages of simple production process, high acceptance rate of products manufactured, high production efficiency and low production cost. The product has the advantages of high mechanical strength, good fire resistance, thermal stability, corrosion resistance and electrical property, low cost and the like. The product is capable of substituting the majority of thermoset plastics and thermoplastics, thus reducing the usage amount of plastic products and providing powerful support and safeguard for creating resource-conservation and environment-friendly industry. | 2011-06-30 |
20110156299 | MELTBLOWN WETLAID METHOD FOR PRODUCING NON-WOVEN FABRICS WITH ANTI-MILDEW, ANTI-BACTERIA AND DEODORIZING CAPABILITIES FROM NATURAL CELLULOSE - The present invention provides a meltblown wetlaid method for producing non-woven fabrics with anti-mildew, anti-bacteria and deodorizing capabilities from natural cellulose. The method comprises selecting wood pulp as raw material and using N-methylmorpholine N-oxide (NMMO) as dissolving solvent and 1,3-phenylene-bis 2-oxazoline (BOX) as stabilizer to form mixed cellulose mucilage as well as using modified and nano-miniaturized natural chitosan as additive for blending and dissolution to form cellulose dope. By meltblown method, the dope is extruded out of spinnerets to form filament bundle, then by ejecting mist aerosol of water, the filament bundle is coagulated with regeneration. After post treatments of water rinsing, hydro-entangled needle punching, drying, winding-up and the like having been orderly applied, then final product for nonwoven fabric of continuous filament with anti-mildew, anti-bacteria and deodorizing capabilities is produced. | 2011-06-30 |
20110156300 | METHODS AND APPARATUS FOR USE IN SOLID FREEFORM FABRICATION - A method and apparatus are disclosed for producing a three-dimensional body consisting of individual solidified layers, whereby a coating material is disposed on one of a carrier plate and an already-solidified layer of the body in a first layer thickness by slidably withdrawing a bottom plate of a storage container filled with the coating material, thereby allowing coating material to descend from the storage container onto the carrier plate or already-solidified layer of the body. The first layer thickness of the coating material is then reduced to a lesser second layer thickness by re-inserting the bottom plate through the coating material disposed on the carrier plate or already-solidified layer. The coating material is then solidified at predetermined locations in order to generate a desired layer contour of one solidified layer of the three-dimensional body. | 2011-06-30 |
20110156301 | THREE DIMENSIONAL PRINTING MATERIAL SYSTEM AND METHOD USING PLASTICIZER-ASSISTED SINTERING - Materials system, kit, and methods are provided to enable the formation of articles by three dimensional printing. The kit includes (i) a substantially dry particulate material including an aqueous-insoluble thermoplastic particulate material, plaster, and a water-soluble adhesive; (ii) an aqueous fluid binder, and (iii) an infiltrant. | 2011-06-30 |
20110156302 | METHOD FOR MAKING CARBON NANOTUBE STRUCTURE - A method for making a carbon nanotube structure is provided. The method includes the following steps. A carbon nanotube array on a substrate is provided. The carbon nanotube array is divided with a separating line to form a strip-shaped carbon nanotube array. A carbon nanotube film is pulled out from the strip-shaped carbon nanotube array. | 2011-06-30 |
20110156303 | SPUNBOND WETLAID METHOD FOR PRODUCING NON-WOVEN FABRICS FROM NATURAL CELLULOSE - The present invention provides a “spunbond wetlaid method for producing non-woven fabrics from natural cellulose” using pulp as raw material and N-methylmorpholine N-oxide (NMMO) as solvent for dissolving into dope. Then, the dope is extruded out of a spinneret to form filament bundle by spunbond method. The dope is extruded out of a spinneret bank of grouped spinnerets to form filament bundle for further stretching process under quench condition. The filament bundle is coagulated with regeneration in a coagulating solution. The coagulated filament bundle is rapidly stretched under high pressure by an air draw-off machine. The stretched filament bundle is collected and stacked on a collecting net as web nonwoven. After post treatments of water rinsing, hydro-entangled needle punching, drying, winding-up and the like have been orderly applied then final product of nonwoven fabrics with continuous filament are produced from natural cellulose. | 2011-06-30 |
20110156304 | Die Tool Production Methods Utilizing Additive Manufacturing Techniques - A method for producing a die tool includes forming a substantially complete face plate of the die tool utilizing an additive manufacturing process, forming a support structure of the die tool independently from the face plate, and coupling the face plate with the support structure. A die tool for use in composite manufacturing includes a face plate and stiffening structure integrated with the face plate. The stiffening structure forms one or more hollow channels that transport fluid for heating or cooling during the composite manufacturing. A die tool for use in composite manufacturing includes a face plate and a support structure coupled with the face plate. A ratio of weight of the support structure to weight of the die tool is less than 0.33. | 2011-06-30 |
20110156305 | METHOD AND DEVICE FOR MANUFACTURING A FIBER COMPOSITE COMPONENT WITH AN INTEGRAL STRUCTURAL DESIGN - A method for manufacturing a fiber composite component having an integral structural design includes positioning a sheet-like fibrous semi-finished product in a mold that defines an outer contour of the fiber composite component. Dimensionally stable fibrous semi-finished products, each having dimensions corresponding to a respective portion of the manufactured fiber composite component, are arranged on the sheet-like fibrous semi-finished product. The dimensionally stable fibrous semi-finished products are stabilized and fixed in place using mold cores. The semi-finished products are resin infiltrated using one of a first or a second gating process so as to form a construct. The first gating process includes gating via the mold cores at a head of each dimensionally stable fibrous semi-finished product and performing extraction in an area of the mold. The second gating process including gating in an area of the mold and performing extraction via the mold cores at the head of each dimensionally stable fibrous semi-finished product. The construct is hardened and demolded by removing the mold cores. | 2011-06-30 |
20110156306 | IMPLANTABLE LEADS WITH A UNITARY SILICONE COMPONENT - A method of manufacturing a medical electrical lead includes molding a lead body pre-form, stringing an electrode onto the pre-form and overmolding the pre-form with a polymer to form a lead body portion. The pre-form has a proximal end, a distal end and at least one lumen extending between the proximal and distal ends. At least one asymmetric region of the pre-form has a transverse cross-section that has a non-circular outer dimension. The overmolding causes the asymmetric region to become substantially circular. | 2011-06-30 |
20110156307 | CHEWABLE ANIMAL TOY - A chewable animal toy having an edible core and a tearable outer shell molded around the edible core such that a portion of the edible core protrudes from the outer shell is provided. Further provided is a mold unit for making the chewable animal toy having a first mold half including a first mold cavity and a second mold half having a second mold cavity. The second mold half is engageable with the first mold half such that the first and second mold cavities cooperatively define an outer shell mold cavity. A first pocket is defined between the first and second mold halves that is adapted to receive a first protruding portion of the edible core. A first shut off defined within the first pocket is adapted to surround the first protruding portion of the edible core such that it is substantially isolated from the outer shell mold cavity. | 2011-06-30 |
20110156308 | MOLDING INSERT CORE AND INSERT MOLDING PROCESS UTILIZING THE CORE - An exemplary molding insert core used in an insert mold includes two first molding bars, two second molding bars, two first support members, and two second support members. Each first molding bar is partially arranged on one first support member. Each second molding bar is partially arranged on one second support member. | 2011-06-30 |
20110156309 | METHOD AND DEVICE FOR THE MANUFACTURE OF A COMPONENT - A method of manufacturing a component from a composite-fiber-material semifinished product includes providing a forming support having a contour including at least one section corresponding to a surface of the manufactured component. The semifinished product is placed onto the forming support and the semifinished product is formed such that the semifinished product contacts the forming support. Further, a device form manufacturing component includes the forming support having the contour including at least one section corresponding to the surface of the manufacture component. | 2011-06-30 |
20110156310 | SHAPE MEMORY POLYMER - A shape memory polymer composition is described comprising greater that 90 wt. % cyclooctene, less than 10 wt. % of a multicyclic diene, comprising at least two cyclo olefinic rings with at least two reactive double bonds, and less than 2 wt. % of a metathesis catalyst. | 2011-06-30 |
20110156311 | Balloon Folding Device - A balloon folding device comprises a first die having an external contacting surface and a second die having a cavity. A portion of the cavity comprises a contacting surface shaped complimentary to the external contacting surface of the first die. The second die is movable with respect to the first die. A balloon catheter having a primary balloon and a secondary balloon is oriented with the secondary balloon located between the first die and the second die. The secondary balloon is folded by moving the second die toward the first die until the contacting surfaces of the dies contact, fold and deflate the secondary balloon. In some embodiments, the dies are moved until at least a portion of the external contacting surface of the first die is oriented within the cavity of the second die. | 2011-06-30 |
20110156312 | Method and Apparatus for Belling Plastic Pipe - An improved pipe belling process is shown which features a mandrel having a specially designed backup or forming collar. The backup collar has an outer contact surface which forms an undulating pattern when viewed in cross section. The undulating surface reduces the contact area between the outer contact surface of the collar and the lip region of a plastic pipe being belled, thereby lowering the coefficient of friction that exists between the pipe lip region and the collar. | 2011-06-30 |
20110156313 | CONTOURED FLAT MOLD - Particular embodiments of the present invention include a contoured tire tread, and a mold and method for forming the contoured tread. In a particular embodiment, a mold is provided for forming a contoured tread, the mold including a first mold member and a second mold member. The first and second mold members are reversibly displaceable from each other from a first, closed position in which the first and second members substantially enclose a mold cavity, to a second open position in which the first and second members are displaced from each other. The first mold member contains a mold cavity adapted to contain a polymeric material and having inner wall members and sipe-forming members. The first mold member having a contoured mold cavity bottom surface, and the second mold member having a contoured molding surface. | 2011-06-30 |
20110156314 | METHOD OF MAKING AN AUXETIC MESH - A method of making an auxetic mesh, which method includes: (a) extruding a polymeric material | 2011-06-30 |
20110156315 | System and Method for Manufacturing a Medication - An apparatus for manufacturing a medication comprising an ejector unit adapted for ejecting a predefined amount of a drug having a liquid component to a solid carrier substrate. The ejector unit comprises a capillary and a tubular piezoelectric actuator surrounding at least a part of the capillary. The apparatus further comprises a control unit adapted for applying an electric signal to the piezoelectric actuator which, in response to the electric signal, is adapted to generate a compressional wave in the capillary for ejecting the predefined amount of the drug via an orifice of the capillary. Moreover, a method of manufacturing a medication is provided, the method comprising ejecting a predefined amount of a drug having a liquid component to a solid carrier substrate. Furthermore, a medication is provided comprising a solid carrier substrate, and a predefined amount of a drug ejected with a liquid component to the solid carrier substrate by an ejector unit. | 2011-06-30 |
20110156316 | ELECTROCHEMICAL CELL - An electrochemical cell, membrane, and method for making the membrane and electrochemical cell are disclosed in which ion passage channels of the membrane have advantageous characteristics relating to dimensions, positioning, and patterning. The ion passage channels are formed by selected means of radiation, many of which require post-radiation manipulation. | 2011-06-30 |
20110156317 | RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING STARTING PLATE FOR LASER ENGRAVING, PROCESS FOR MAKING RELIEF PRINTING PLATE, AND RELIEF PRINTING PLATE - A process for making a relief printing plate is provided that includes (1) a step of crosslinking by means of heat and/or light a relief-forming layer formed from a resin composition containing (Component A) a compound having a hydrolyzable silyl group and/or a silanol group, (Component B) a thermoplastic elastomer, and (Component C) a polymerizable compound, and (2) a step of forming a relief layer by laser-engraving the crosslinked relief-forming layer. | 2011-06-30 |
20110156318 | RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING SAME - A process for making a relief printing plate is provided that includes a layer formation step of forming a relief-forming layer from a resin composition that contains (Component A) a compound having a hydrolyzable silyl group and/or a silanol group and a polyurethane as (Component B) a binder polymer, a crosslinking step of crosslinking the relief-forming layer by heat and/or light to thus obtain a relief printing plate precursor having a crosslinked relief-forming layer, and an engraving step of laser-engraving the relief printing plate precursor having a crosslinked relief-forming layer to thus form a relief layer. | 2011-06-30 |
20110156319 | METHOD AND APPARATUS FOR PRODUCING NANOFIBERS - A container having a plurality of orifices in an outer peripheral wall and having a space communicating with the orifices is rotated to extrude an electrically charged raw material liquid containing a polymer material from the space through the orifices by centrifugal force. This allows the electrically charged raw material liquid to form a fibrous material. At this time, the raw material liquid is supplied to the space in which the raw material liquid is filled by a raw material liquid pump so that the raw material liquid is extruded from the orifices at a predetermined pressure. That is, the raw material liquid in the space is pressurized. Also, the shape of the space in the container is set so that the centrifugal force exerted on the raw material liquid is constant. | 2011-06-30 |
20110156320 | Method for preparing patterned metal oxide layer or patterned metal layer by using solution type precursor or sol-gel precursor - Methods for preparing a patterned metal/metal oxide layer by using a solution type precursor or sol-gel precursor are provided and, especially, a method for preparing a patterned carrier transport of a solar cell and a method for preparing biomedical material are provided, which comprise the following steps: (A) providing a substrate, and a mold with designed patterns formed thereon; (B) coating the substrate with a solution of a precursor to form a precursor layer, wherein the precursor is a metal precursor or a metal oxide precursor; (C) pressing the mold together with the precursor layer to transfer the patterns of the mold onto the precursor layer; (D) curing or pre-curing the precursor layer; (E) removing the mold; and (F) conducting an optional post-treatment, if it being demanded, to further modify the properties of precursor layer. | 2011-06-30 |
20110156321 | Method and Apparatus for the Production of Fine Fibres - A method and apparatus provided for the production of fine fibres by electrospinning fibres by applying an electrical field between a primary electrode and a counter electrode ( | 2011-06-30 |
20110156322 | IMPRINT MATERIAL AND PROCESSING METHOD - According to one embodiment, an imprint material includes a resin and a plurality of fine particles. The resin is cured from a liquid state by receiving energy while being in contact with a protrusion-depression pattern of a template. The plurality of fine particles are contained in a solid state in the resin and are different from the resin in volume shrinkage ratio upon receiving the energy. | 2011-06-30 |
20110156323 | PROCESS FOR PRODUCING ALUMINUM TITANATE-BASED CERAMICS - The invention provides a process for producing a shaped body of aluminum titanate-based ceramic such as aluminum titanate or aluminum magnesium titanate having smaller shrinkage ratio relative to a shaped body of a starting material mixture, and having a smaller coefficient of thermal expansion. The invention is a process for producing an aluminum titanate-based ceramic, comprising firing a starting material mixture containing a titanium source material and an aluminum source material, wherein the BET specific surface area of the aluminum source material is 0.1 m | 2011-06-30 |
20110156324 | SIDEWALL AND BOTTOM ELECTRODE ARRANGEMENT FOR ELECTRICAL SMELTING REACTORS AND METHOD FOR FEEDING SUCH ELECTRODES - Metallurgical reactors having cooling capability and electrode feed capability are disclosed. The reactors may include a shell having a sidewall and a bottom, where the shell is adapted to contain a molten material. The reactors may include at least one consumable electrode protruding through an opening of the shell and into the molten material. The reactors may include a current contact clamp configured to conduct operating current to the electrode, where the current clamp is in contact with the electrode, and where the current clamp comprises at least one internal channel, wherein the internal channel is configured to circulate a cooling medium. The reactors may include an electric isolation ring disposed between the electrode and the opening of the shell, wherein the electric isolation ring is configured to sealingly engage the electrode and the opening so as to restrict flow of the molten material out of the shell. | 2011-06-30 |
20110156325 | Numerically Controlled Tool Holding Device for Blast Machining - The invention relates to a numerically controlled tool-holding device for jet/beam cutting. It is a device designed specifically for the requirements of jet/beam cutting of thick, plate-shaped components, and it is to be understood as a component of a gantry-type, robot-like machine. With the aid of this device it is possible to change the orientation of the jet/beam-producing tool ( | 2011-06-30 |
20110156326 | IRON BATH-TYPE MELTING FURNACE - Disclosed is an iron bath-type melting furnace characterized by comprising a furnace body and a plurality of tap holes provided at different positions of the furnace body in the direction of the height thereof so as to extend through the furnace body, and in that an iron source as a raw material together with a carbon material and a slag-making material is charged into the furnace and further an oxygen-containing gas is injected into the furnace to melt the iron source as the raw material by combustion heat generated by combustion of the carbon material and/or carbon contained in the molten iron and to produce molten iron and molten slag are produced, and the plurality of the tap holes is used while switching from the uppermost tap hole toward downward tap holes to tap the iron slag being conducted, whereby molten iron is produced by intermittently taking out the molten iron and the molten slag to the outside of the furnace while maintaining the furnace body erect. | 2011-06-30 |
20110156327 | BUMP STOPPER AND MANUFACTURING METHOD THEREFOR - Disclosed are a bump stopper and a manufacturing method therefor which can maintain the shock-absorbing characteristics and durability performance constantly for a prolonged period of time regardless of the temperature or humidity of the usage environment, which can maintain a constant dimensional precision for a finished product, which is excellent in material yield rate and manufacturing efficiency, and which is low-cost, lightweight, recyclable, and ecological. A bump stopper ( | 2011-06-30 |
20110156328 | INTEGRAL RETAINER TO RETAIN A SPRING - A power, motor, or clock spring featuring an integral retainer that prevents the spring from returning to its relaxed state. The integral retainer includes at least two of the coils of the spring being bonded together either through direct bond or via a welding material. The formation of an integral retainer in which the bonded coils of the spring itself acts as the retainer, creates a power spring that is easier and safer to handle and less expensive to create. The bond can be located only at the outermost point of the spring bonding the two outermost coils together adjacent an outer hook of the power spring. | 2011-06-30 |
20110156329 | CLAMPING MECHANISM - A clamp mechanism for a workpiece having an oblique surface is provided. The clamp mechanism includes a base, a fixing member, and a locking assembly. The base includes a main body, a pivot shaft, and two holding portions on the main body which are away from the pivot shaft, and each holding portion defines a curved sliding slit extending around the pivot shaft. The locking assembly includes a locking member and an engaging member engaging with the locking member. The locking member passes through and slides along the sliding slits of the holding portions of the base. One end of the fixing member is rotatably connected to the base, and the locking member passes through the other end of the fixing member. | 2011-06-30 |
20110156330 | PLATFORM AND METHOD FOR SUPPORTING A WORKPIECE TO BE CUT FROM SHEET MATERIAL - A platform for supporting a sheet material having a workpiece portion to be cut is disclosed. The platform comprises one or more movable supports arranged to support the workpiece portion in a support position. The or each support is movable to a cutting position in which a cutting agent may cut the workpiece adjacent the support position without damaging the support. | 2011-06-30 |
20110156331 | NON-CONTACT HOLDER AND NON-CONTACT HOLDING HAND - A non-contact holder holds the workpiece on the holding surface without contact between the workpiece and the holding surface by generating a negative pressure at the opening using a circular flow of gas introduced into the inside of the column body and generating a positive pressure between the holding surface and the workpiece using the gas flowing from the opening provided on the holding surface, and the holding surface has (2 | 2011-06-30 |
20110156332 | TRANSFER APPARATUS AND TRANSFER METHOD - The present invention provides a clamp transfer device which keeps a load from incurring damage and transfers the load at a high-speed. The transfer device includes: a first member which is attached so as to rotate about an axis of rotation perpendicular to a horizontal direction in which the load is clamped, and makes contact with the load, the first member having a profile with (i) a first radius stretching from the axis of rotation to a periphery of the first member, and (ii) a second radius being shorter than the first radius; a second member which clamps the load by working together with the first member; and a first clamping mechanism which (i) rotates the first member about the axis of rotation so that a distance between an end portion of the first radius and the second member diminishes, and (ii) produces a clamping force for clamping the load. | 2011-06-30 |
20110156333 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle stitch unit configured to stitch a center of a sheet bundle, in which printed sheets are bundled, with a staple, a fold unit configured to fold the center stitched by the saddle stitch unit and to form a fold line, and a fold reinforcing unit configured to reinforce the fold line formed by the fold unit, the fold reinforcing unit includes a roller unit that includes a reinforce roller and moves along a direction of the fold line while applying pressure by the reinforce roller to the fold line of the sheet bundle transported from the fold unit, a drive unit configured to move the roller unit along the direction of the fold line, and a control unit configured to control a movement speed of the roller unit, and the control unit causes the roller unit to move at a first speed in an outside of a specified range including the edge of the staple, and causes the roller unit to move at a second speed not higher than the first speed in the specified range including the edge of the staple. | 2011-06-30 |
20110156334 | METHOD FOR HANDLING PAPER SHEETS - When handling paper sheets, the paper sheet present at the uppermost or lowest part of each batch of the paper sheets is assigned as a designated paper sheet, and then intrinsic information on this designated paper sheet is associated with transaction information corresponding to the batch of the paper sheets. Thereafter, a plurality of batches of the paper sheets are stacked, one on another, in a certain number corresponding to transactions, while the intrinsic information on each designated paper sheet is already associated with the corresponding transaction information. Then, such stacked batches of the paper sheets are handled, collectively, by a paper sheet handling system. Thereafter, each recognition result on the plurality of batches of the paper sheets, respectively handled by the paper sheet handling system, is separated by utilizing each designated paper sheet. As such, information on the association between each recognition result on the paper sheets and the transaction information can be obtained. | 2011-06-30 |
20110156335 | CONVEYING DIRECTION-SWITCHING DEVICE FOR PAPER LEAVES, CONVEYING DIRECTION CONTROL METHOD, AND PAPER LEAVES PROCESSOR - A conveying direction-switching device is formed by direction-changing drums each having the same hollow cylindrical shape having a length corresponding to a lateral width of paper money bills to be conveyed. The direction-changing drum has first to fourth openings arranged in the outer periphery thereof, in a manner spaced from each other by a rotational angle of 90 degrees, and the rotational angle position thereof is controlled to be a predetermined phase angle. Inside the direction-changing drum, the first opening and the fourth opening are connected by a paper money guide forming a first curved passage, the second opening and the fourth opening are connected by a paper money guide forming a straight passage, and the third opening and the fourth opening are connected by a paper money guide forming a second curved passage. | 2011-06-30 |
20110156336 | IMAGE FORMING APPARATUS - A reversely-rotatable roller conveys a sheet having an image formed on its one side at a sheet conveying velocity faster than that of a conveying roller by normal rotation and then, the reversely-rotatable roller conveys the sheet to a re-conveying path by reverse rotation. The sheet conveying velocity of the reversely-rotatable roller when the reversely-rotatable roller reversely rotates is made slower than the sheet conveying velocity when the reversely-rotatable roller normally rotates so that the sheet conveying velocity of the re-conveying roller is substantially equal to or slower than the sheet conveying velocity of the conveying roller. | 2011-06-30 |
20110156337 | AUTOMATIC DOCUMENT FEEDER - An automatic document feeder includes a sheet input tray, a transfer channel, a sheet pick-up module, a retard roller, a thickness detecting module and a controlling unit. When the sheet pick-up module is driven, the documents placed on the sheet input tray are fed into the transfer channel. The thickness detecting module is used for detecting a thickness of the documents. The controlling unit is used for judging whether a multiple-feeding event occurs. In a case that the multiple-feeding event occurs, the sheet pick-up module is reversely rotated such that the documents are returned to the sheet input tray. When the sheet pick-up module is reversely rotated, the retard roller provides a lower frictional force, so that the documents are allowed to be returned to the sheet input tray. | 2011-06-30 |
20110156338 | IMAGE RECORDING APPARATUS - An image recording apparatus includes a recording unit configured to record an image on a sheet, a tray on which the sheet is placed, a first roller configured to feed the sheet placed on the tray, a first guide member configured to guide the sheet fed from the first roller to the recording unit, a second guide member configured to guide the sheet passed through the recording unit, a second roller configured to feed the sheet guided by the second guide member, a third guide member configured to guide the sheet fed from the second roller to the recording unit, a common roller configured to transmit a rotation force to the first roller and the second roller, and a second-roller arm including the second roller at a distal end thereof and configured to be pivotable about an axis. | 2011-06-30 |
20110156339 | STACKING APPARATUS, TRANSPORTATION APPARATUS AND RECORDING APPARATUS - A stacking apparatus includes: a cassette which accommodates a plurality of recording media in a superimposed manner; a mounting portion on which the cassette is mounted; a transportation path which is arranged at a downstream side in a direction in which the cassette is mounted on the mounting portion and on which the recording media are transported from the cassette mounted on the mounting portion; a stopper of which surface for regulating downstream side edges of the recording media regulates the side edges until the cassette is mounted on the mounting portion and of which surface for regulating the side edges of the recording media releases the regulation of the side edges with a rotational operation after the cassette is mounted on the mounting portion; and a slider which slides along a back surface of the regulating surface of the stopper for regulating the side edges. | 2011-06-30 |
20110156340 | SHEET FEED DEVICE - A sheet feed device includes: a sheet accommodation unit; a separation roller that applies conveyance force to sheets; and a separation resistance body including a friction portion facing the separation roller for separating the sheets one at a time. The sheet accommodation unit includes a guide portion provided at an upstream of the separation roller in a sheet feed direction for guiding the sheet. The separation resistance body includes an extension portion, which is pressed toward the separation roller while being supported to be contacted/separated to/from the separation roller, and which is extended upstream in the sheet feed direction from an upstream end portion of the separation resistance body. The guide portion and the extension portion are arranged in a line in a width direction. An upstream end portion of the extension portion is retreated with regard to a guide surface of the guide portion when feeding the sheets. | 2011-06-30 |
20110156341 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - The apparatus of the present invention is provided with: a spherical conveying rotation member that is driven to rotate in a desired direction; a driven rotation member disposed above the conveying rotation member so as to be pressed onto an upper portion of the conveying rotation member so that the driven rotation member nips a sheet in cooperation with the conveying rotation member to convey the sheet; two driving rollers press with the conveying rotation member so as to drive the conveying rotation member to rotate; and a driven roller that is made in press-contact with the conveying rotation member to be driven together therewith, and in this structure, the two driving rollers and the driven roller are disposed below the conveying rotation member so as to support the conveying rotation member by the two driving rollers and the driven roller from below. | 2011-06-30 |
20110156342 | Image Forming Apparatus - An image forming apparatus includes an image forming unit, a first main body frame and a second main body frame, a sheet placing portion, a feed roller, a link arm and a bridge frame. The feed roller moves with the link arm. The bridge frame is configured to join the first main body frame with the second main body frame and to swingably support the link arm. The link arm is movable between a temporary mounting position, in which the entirety of the link arm is positioned between the first main body frame and the second main body frame, and a final mounting position, in which the link arm is supported by the bridge frame and cooperates with the feed roller. At least one of the link arm and the bridge frame is positioned with holding mechanism configured to hold the link arm in the temporary mounting position. | 2011-06-30 |
20110156343 | Dual Shaft Media Picking Mechanism - A media picking mechanism includes a pair of transmission shafts rotating in opposite directions. A housing is mounted around the pair of transmission shafts such that the first transmission shaft and the second transmission shaft are positioned substantially equidistant from a centerline of the housing. During a media picking operation, the rotation of the first transmission shaft of the pair of transmission shafts provides a first moment to the housing and rotation of a second transmission shaft of the pair of transmission shafts provides a second moment to the housing, which is equal and opposite to the first moment such that a net moment on the housing is near zero minimizing twisting of the housing. The two transmission shafts rotating in opposite directions, also results in substantially equal normal force to be applied by the first and second pick tires on the media. | 2011-06-30 |
20110156344 | RETARD ROLLER AND RETARD ROLLER MODULE HAVING SUCH RETARD ROLLER - A retard roller of an automatic document feeder provides a frictional force to separate plural documents from each other. The retard roller can provide a first damping torque and a second damping torque with different directions. The second damping torque is smaller than the first damping torque. As such, the frictional force exerted on the document is reduced for returning the document out of the automatic document feeder. A retard roller module having such a retard roller is also provided. | 2011-06-30 |
20110156345 | CLOSED LOOP LATERAL AND SKEW CONTROL - According to aspects illustrated herein, a method, a system, and a printmaking device for performing closed loop lateral and skew control of a sheet is provided. The printmaking device includes a feed path, printing module, and sheet registration system. First, the feed path moves the sheet in a process direction past the lateral sensor. Next, the sheet is registered by measuring a lateral position of one side edge of the sheet at a fixed reference using the lateral sensor and determining a lateral position error of the sheet using the lateral position measurement. After that, a sheet angular velocity is calculated based on the lateral position error using the registration controller. Then, the lateral position error is corrected using the at least one pair of registration nips to adjust the sheet by applying the sheet angular velocity to the sheet. | 2011-06-30 |
20110156346 | AUTOMATIC FEEDER WITH SEPARABLE TRANSMISSION GEARS AND IMAGE ACQUIRING APPARATUS - In an automatic feeder and an image acquiring apparatus, a cover is rotatably connected to a body through a first pin and openable and closable with respect to the body. A roller gear rotates a transporting roller to transport a sheet. An actuating member is attached to the first pin and driven by rotation of the first pin. A middle gear, displaceable by the actuating member, is selectively engaged with a power-output gear and the roller gear so as to transmit a power to the roller gear. An actuating member moves the middle gear to be engaged with the power-output gear and the roller gear when the cover is closed upon the body, and moves the middle gear to be disengaged from at least one of the power-output gear and roller gear when the cover is opened. | 2011-06-30 |
20110156347 | SHEET FEEDER, ORIGINAL DOCUMENT TRANSPORT DEVICE, IMAGE FORMING APPARATUS, AND SHEET FEEDING METHOD - Provided is a sheet feeder, which includes: a sheet placing table; a rotary body which is movable and sends out sheets; a sheet placement detection portion for detecting placement of sheets; an upper limit detection portion for detecting that the rotary body has reached an upper limit position; a transport detection portion for detecting transport of sheets; and a control part which rotates the rotary body so as to perform sheet feeding operation regardless of a detection state of the upper limit detection portion when sheets are set on the sheet placing table, determines that a non-feed jam has occurred when no sheet arriving is detected, and stops rotating the rotary body by determining that the sheet feeder is brought into a sheet feeding restriction state, when sheets are set again on the sheet placing table and the rotary body is detected to be in the upper limit position. | 2011-06-30 |
20110156348 | SIMULATING SPORTS BOARD GAME USING BOTTLE CAPS - A game using bottle caps or similar shape pieces, to represent: soccer, baseball, football or basketball players. The bottle caps are used on a rug or similar material that simulates the surface of the field. The bottle caps “kick, pass, shoot, throw” (hitting) a proportional realistic ball or “run” (slide) by means of finger flicking or catapulting the cap with the fingers, depending if the ball is on the rug surface or on the cap respectively. | 2011-06-30 |
20110156349 | Chip Earning for Prolonged Player Interest - Poker players lose interest when a game is finished. Methods and devices are described that continue interest over longer series of games. Token rewards are given for long multiple hand playing that can be exchanged for drawing one or more cards in a later hand. Another reward for long term playing is to receive a free ante, free spin or free game. These methods are particularly useful for Texas Hold'em and other games that can be played electronically. | 2011-06-30 |
20110156350 | VISUAL PERCEPTUAL SKILL BUILDING GAME - The present invention provides a system which helps a user develop his or her visual perceptual skills in a game-style activity that is challenging and interesting, and encourages sustained visual attention with self-checking of answers. The present invention may develop the seven visual perceptual skills identified in the widely used and norm-based assessment of the Test of Visual Perceptual Skills 3. | 2011-06-30 |
20110156351 | Bottle cap golf apparatus and method - A target apparatus adapted to receive projectiles such as bottle caps tossed or otherwise launched towards the target. Three vertically aligned catch structures are disposed to receive and retain the bottle caps. The three catch structures have different sizes resulting in different degrees of difficulty in projecting a bottle cap into the respective structures. The lowest catch structure is the largest, the middle catch structure being the smallest, and the uppermost catch structure being sized between the lower and the middle structures. Chains completely surround the middle and upper catch structures. Chains only surround the sides and rear of the lowest catch structure. An opening in the front of the lowest catch structure is adapted to receive a projectile therein that is routed to a special basket. A scoring system is provided that awards points depending upon which of the catch structures retains a bottle cap. | 2011-06-30 |