26th week of 2021 patent applcation highlights part 64 |
Patent application number | Title | Published |
20210202135 | CONTAMINATION PROTECTION FOR HIGH-VOLTAGE INSULATORS - The invention relates to a contamination protection device ( | 2021-07-01 |
20210202136 | HIGH FREQUENCY SPIRAL TERMINATION - A high frequency termination for converting a high frequency electrical signal of a circuit into heat. The high frequency termination includes a substrate. The high frequency termination also includes a spiral resistor formed on the substrate and having a first end and a second end. The high frequency termination also includes a conductive pad electrically coupled to the first end of the spiral resistor. The high frequency termination also includes a contact electrically coupled to the conductive pad and configured to connect to the circuit. | 2021-07-01 |
20210202137 | RESISTOR COMPONENT - A resistor component includes an insulating substrate; a resistance layer disposed on one surface of the insulating substrate; and first and second terminals disposed on the insulating substrate to be spaced apart from each other and connected to the resistance layer, wherein each the first and second terminals comprises an inner electrode layer disposed on the resistance layer, and a via electrode penetrating the resistance layer to be in contact with the one surface of the insulating substrate and the inner electrode layer. | 2021-07-01 |
20210202138 | PTC DEVICE INCLUDING POLYSWITCH - Approaches provided herein include a protection device assembly having a protection component and a first electrode layer extending along a first main side of the protection component. The first electrode layer may include a first section separated from a second section by a first gap. The assembly may further include a second electrode layer extending along a second main side of the protection component, the second electrode layer including a third section separated from a fourth section by a second gap, wherein the first gap is aligned with the second gap. The assembly may further include a first insulation layer disposed over the first electrode layer, and a second insulation layer disposed over the second electrode layer. The assembly may further include a solder pad extending around an end of the protection component, the solder pad further extending over the first insulation layer and the second insulation layer. | 2021-07-01 |
20210202139 | Cascade Varistor Having Improved Energy Handling Capabilities - A varistor is provided having a rectangular configuration defining first and second opposing end surfaces offset in a lengthwise direction. The varistor may include a first terminal adjacent the first opposing end surface and a second terminal adjacent the second opposing end surface. The varistor may include an active electrode layer including a first electrode electrically connected with the first terminal and a second electrode electrically connected with the second terminal. The first electrode may be spaced apart from the second electrode in the lengthwise direction to form an active electrode end gap. The varistor may include a floating electrode layer including a floating electrode. The floating electrode layer may be spaced apart from the active electrode layer in a height-wise direction to form a floating electrode gap. A ratio of the active electrode end gap to the floating electrode gap may be greater than about 2. | 2021-07-01 |
20210202140 | FEED THROUGH VARISTORS WITH THERMALLY-ACTIVATED OVERRIDE - A varistor ( | 2021-07-01 |
20210202141 | BUS BAR ASSEMBLY WITH INTEGRATED SURGE ARRESTOR - An apparatus includes a laminated bus bar assembly with first and second bus bars and an intervening insulator layer. A surge arrestor (e.g., a metal oxide varistor) has a body mounted on the bus bar assembly and first and second terminals on first and second opposite sides of the body. In some embodiments, the body may be at least partially disposed in an opening in the first bus bar and the second terminal may be conductively bonded to a surface of the second bus bar that faces the insulator layer. In some embodiments, the second terminal may include a conductive stud passing through an opening in the second bus bar. The apparatus may include a spring clamp attached to the first bus bar and contacting the first side of the body to retain the body. | 2021-07-01 |
20210202142 | IRON-NITRIDE MAGNET BY NITRIDING A POROUS STRUCTURE - In general, the disclosure is directed to bulk iron-nitride materials having a polycrystalline microstructure having pores including a plurality of crystallographic grains surrounded by grain boundaries, where at least one crystallographic grain includes an iron-nitride phase including any of a body centered cubic (bcc) structure, a body centered tetragonal (bct), and a martensite structure. The disclosure further describes techniques producing a bulk iron-nitride material having a polycrystalline microstructure, including: melting an iron source to obtain a molten iron source; fast belt casting the molten iron source to obtain a cast iron source; cooling and shaping the cast iron source to obtain a bulk iron-containing material having a body-centered cubic (bcc) structure; annealing the bulk iron-containing material at an austenite transformation temperature and subsequently cooling the bulk iron-containing material; and nitriding the bulk iron-containing material to obtain the bulk iron-nitride material. | 2021-07-01 |
20210202143 | GRAIN-ORIENTED ELECTRICAL STEEL SHEET AND METHOD FOR MANUFACTURING GRAIN-ORIENTED ELECTRICAL STEEL SHEET - Provided is an oriented electrical steel sheet including: a forsterite film formed on one side or both sides of an oriented electrical steel sheet substrate; and a ceramic layer formed on an entire or partial region of the forsterite film. Provided is a manufacturing method for an oriented electrical steel sheet including: preparing an oriented electrical steel sheet having a forsterite film formed on one surface or both surfaces thereof; and forming a ceramic layer by spraying ceramic powder on the forsterite film. | 2021-07-01 |
20210202144 | SOFT MAGNETIC ALLOY, SOFT MAGNETIC ALLOY RIBBON, METHOD OF MANUFACTURING SOFT MAGNETIC ALLOY RIBBON, MAGNETIC CORE, AND COMPONENT - The soft magnetic alloy of the present disclosure is represented by a composition formula of Fe | 2021-07-01 |
20210202145 | ELECTRICAL STEEL SHEET HAVING INSULATING COATING, METHOD FOR PRODUCING THE SAME, TRANSFORMER CORE AND TRANSFORMER USING THE ELECTRICAL STEEL SHEET, AND METHOD FOR REDUCING DIELECTRIC LOSS IN TRANSFORMER - An electrical steel sheet having an insulating coating is provided. The electrical steel sheet is capable of reducing dielectric loss in a transformer in a case where the electrical steel sheet is used in a transformer core. | 2021-07-01 |
20210202146 | ELECTROMAGNETIC ACTUATOR DEVICE AND USE OF SUCH A DEVICE - An electromagnetic actuator includes an armature ( | 2021-07-01 |
20210202147 | SYSTEMS AND METHODS FOR MAGNETIZING PERMANENT MAGNET ROTORS - Systems and methods for reclaiming and remagnetizing permanent magnet motors such as may be used in electric submersible pumps. In one embodiment, a method includes removing a permanent magnet rotor assembly from a motor and heating the rotor to burn off the residual oil and evaporate water in between laminations of the rotor and on the rotor surface. The rotor should be heated to a temperature that is above a flashpoint of oil on the rotor and below a Curie temperature of a material of a set of permanent magnets in the rotor (e.g., at least 600° F. for at least 12 hours). The heating may partially or fully demagnetize the permanent magnets in the rotor. The exposed surfaces of the rotor are then cleaned and the permanent magnets in the rotor are remagnetized using a specialized magnetizing fixture. | 2021-07-01 |
20210202148 | COIL COMPONENT - A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body. | 2021-07-01 |
20210202149 | REACTOR - A reactor includes a coil; a magnetic core with an inner core portion arranged inside the coil; and an inwardly interposed member insulating the coil from the inner core portion. The inwardly interposed member has a thin portion defined by a recess of an inner-circumferential surface, and a thick portion that is thicker than the thin portion. The inner core portion has, on an outer circumferential surface facing the inwardly interposed member, a core-side projection portion has a shape conforming to the inner-circumferential surface shape of the thin portion. The thin portion has a thickness of 0.2 mm to 1.0 mm inclusive, and the thick portion has a thickness of 1.1 mm to 2.5 mm inclusive. The inner core portion and the inwardly interposed member are in intimate contact with each other, and the inwardly interposed member and the wound portion are in intimate contact with each other. | 2021-07-01 |
20210202150 | REACTOR - A reactor includes a coil including a winding portion; a magnetic core including an inner core portion disposed inside the winding portion and an outer core portion disposed outside the winding portion; and a resin mold portion that covers at least a portion of an outer circumferential surface of the outer core portion, wherein the outer core portion includes a resin core portion made of a composite material including a soft magnetic powder and a resin, and a first through-hole extending through the resin core portion; and a first end and a second end of the first through-hole open to a surface of the outer core portion other than a coil-facing surface that faces the coil, and the resin mold portion is inserted inside the first through-hole. | 2021-07-01 |
20210202151 | Reactor with High Common Mode Inductance - In an embodiment, a reactor includes at least one winding and a magnetic core having at least a first leg and a second leg, and at least a first yoke and a second yoke, wherein the at least one winding is placed on at least one of the first leg and the second leg, and wherein at least one of the first and the second yoke has at least one airgap. | 2021-07-01 |
20210202152 | ELECTRONIC COMPONENT - One object of the present invention is to provide an electronic component less prone to migration of impurity atoms between a conductor and an external electrode. A coil component as an electronic component includes: a base body; a conductor; a first external electrode electrically connected to the conductor; a second external electrode electrically connected to the conductor; and a metal film positioned between the conductor and the first external electrode, wherein the metal film contains metal particles configured such that an average of β/α is 0.8 to 1.2, where for each of the metal particles, α is a dimension of the metal particle in a direction horizontal to a boundary interface, and β is a dimension of the metal particle in a direction perpendicular to the boundary interface. | 2021-07-01 |
20210202153 | COIL COMPONENT, CIRCUIT BOARD, AND ELECTRONIC DEVICE - A coil component includes a base body containing metal magnetic particles and a binder binding together the metal magnetic particles and having a first surface extending along a coil axis and a second surface opposing the first surface, a first external electrode provided on the base body, a second external electrode provided on the base body, and a coil conductor electrically connected to the first and second external electrodes and extending around the coil axis. In one embodiment, the coil conductor has a winding portion, the winding portion has first conductor portions and one or more second conductor portions smaller in number than the first conductor portions, and the first and second conductor portions alternate with and are connected to each other, and a distance between the first conductor portions and the first surface is less than a distance between the second conductor portions and the second surface. | 2021-07-01 |
20210202154 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - One object of the present invention is to provide an electronic component less prone to migration of impurity atoms between a conductor and an external electrode. A coil component as an electronic component includes a base body, a conductor, a first external electrode electrically connected to one end portion of the conductor, a second external electrode electrically connected to the other end portion of the conductor, a first film positioned between one end portion of the conductor and the first external electrode, and a second film positioned between the other end portion of the conductor and the second external electrode. The diffusion velocity in the first film and the second film is lower than that in the first external electrode and the second external electrode. | 2021-07-01 |
20210202155 | COIL-FORMING APPARATUS - A coil-forming apparatus for forming a bare coil wire into a U-shape, the apparatus comprising: one bare coil-wire holding unit that winds and holds a bare coil wire; a take-up drum that includes one or a plurality of housing units that house the bare coil wire supplied from the one bare coil wire holding unit at a circumference; a cutting member that cuts the bare coil wire housed in housing units and wound around the take-up drum, at a portion of the circumference of the take-up drum; a drawing member for drawing the bare coil wire outward in a radial direction of the take-up drum after being cut by the cutting member, from a position separated from the cutting member; and a forming unit that forms the bare coil wire drawn by the drawing member into a U-shape. | 2021-07-01 |
20210202156 | INDUCTOR DEVICE - An inductor device includes a first wire, a second wire, at least one first connector, at least one second connector, and a first center-tapped terminal. The first wire includes a plurality of first sub-wires. The second wire includes a plurality of second sub-wires. The first sub-wires and the second sub-wires are disposed in an interlaced manner. The at least one first connector couples the first sub-wire that is disposed on an outer side and the first sub-wire that is disposed on an inner side in the first sub-wires. The at least one second connector couples the second sub-wire that is disposed on the outer side and the second sub-wire that is disposed on the inner side in the second sub-wires. The first center-tapped terminal is coupled to the first sub-wire that is disposed on the outer side in the first sub-wires. | 2021-07-01 |
20210202157 | COIL COMPONENT - A coil component includes a body having one surface and the other surface, opposing each other in one direction, and one end surface connecting the one surface and the other surface to each other, a support substrate embedded in the body, a coil portion disposed on the support substrate and including a lead-out pattern exposed from the one end surface, a first insulating layer disposed on the one end surface and having one region and the other regions spaced apart from each other in the other direction crossing the one direction, an external electrode having a connection portion, disposed between the one region and the other region to be connected to the lead-out pattern, and an extension portion extending from the connection portion to the one surface, and a second insulating layer disposed on the one end surface to cover the first insulating layer and the connection portion. | 2021-07-01 |
20210202158 | INDUCTOR ASSEMBLIES AND METHODS FOR FORMING THE SAME - A dual coil inductor assembly includes an inner coil assembly including an inner coil and first and second terminals, and an outer coil assembly including an outer coil and third and fourth terminals. The inner coil includes an inner metal foil, and an inner electrical insulator sheet spirally co-wound with the inner metal foil. The outer coil includes an outer metal foil, and an outer electrical insulator sheet spirally co-wound with the outer metal foil. The inner coil is disposed within an outer coil air core of the outer coil so that the outer coil circumferentially surrounds the inner coil. The first and second terminals are electrically connected to the inner metal foil at respective first and second locations spaced apart along the inner metal foil. The third and fourth terminals are electrically connected to the outer metal foil at respective third and fourth locations spaced apart along the outer metal foil. | 2021-07-01 |
20210202159 | COIL COMPONENT, CIRCUIT BOARD, AND ELECTRONIC DEVICE - One aspect of the present invention provides a coil component including a base body having a first surface extending along a coil axis and a second surface opposing the first surface, a first external electrode provided on the base body, a second external electrode provided on the base body, and a coil conductor electrically connected to the first and second external electrodes, where the coil conductor extends around the coil axis. In one embodiment, the coil conductor has a winding portion, the winding portion has a plurality of first conductor portions and one or more second conductor portions smaller in number than the first conductor portions, and the first and second conductor portions alternate with and are connected to each other, and a distance between the first conductor portions and the first surface is greater than a distance between the second conductor portions and the second surface. | 2021-07-01 |
20210202160 | MULTILAYER COIL COMPONENT - A multilayer coil component includes an insulator portion, a coil embedded in the insulator portion and including a plurality of coil conductor layers electrically connected together, and an outer electrode disposed on a surface of the insulator portion and electrically connected to the coil. The coil conductor layers have a thickness of 30 μm to 60 μm. The coil conductor layers are rectangular and include a corner portion with a radius of curvature of 0.08 mm to 0.24 mm. | 2021-07-01 |
20210202161 | MULTILAYER COIL COMPONENT - A multilayer coil component includes an insulator portion, a coil embedded in the insulator portion and including a plurality of coil conductor layers electrically connected together, and an outer electrode disposed on a surface of the insulator portion and electrically connected to the coil. At least one of the coil conductor layers includes an extended portion and a winding portion, and is connected to the outer electrode via the extended portion. The area S of an exposed portion of the extended portion exposed from the insulator portion is 0.018 mm | 2021-07-01 |
20210202162 | MULTILAYER COIL COMPONENT - A multilayer coil component includes an insulator portion, a coil in the insulator portion and including coil conductor layers electrically connected together, and an outer electrode on a surface of the insulator portion and electrically connected to the coil. The multilayer coil component has a void at a boundary between one main surface of each coil conductor layer and the insulator portion. At least one of the coil conductor layers includes extended and winding portions, and is connected to the electrode via the extended portion. Viewing the multilayer coil component in plan view in a stacking direction, an end of the void at the extended portion facing the electrode to which the extended portion is connected is closer to the electrode than is an end, facing the electrode, of the void at the coil conductor layer to which the extended portion is adjacent in the stacking direction. | 2021-07-01 |
20210202163 | MULTILAYER COIL COMPONENT - A multilayer coil component includes an insulator portion, a coil embedded in the insulator portion and including a plurality of coil conductor layers electrically connected together, and an outer electrode disposed on a surface of the insulator portion and electrically connected to the coil. The insulator portion is a multilayer body including first and second insulator layers. The coil conductor layers and the second insulator layers are disposed on the first insulator layers. The multilayer coil component has void layers (e.g., voids) between the first insulator layers and at least a portion of the coil conductor layers. If the thickness of the first insulator layers is a, the thickness of the coil conductor layers is b, and the thickness of the void layers is c, the ratio of c to b (c/b) is 0.10 to 0.70, and the ratio of a to b (a/b) is 0.25 to 1.00. | 2021-07-01 |
20210202164 | Inductive Component - In an embodiment, an inductive component includes at least one electrical conductor, a coil former with a hollow-shaped winding former, on a surface of which the at least one electrical conductor is wound around the winding former, a magnetic core arranged in a first cavity of the winding former and a potting material, wherein the at least one electrical conductor is surrounded by the potting material, wherein the potting material has no directly adherent contact with the magnetic core, wherein the magnetic core comprises a first part-body and a second part-body, which are connected to one another, wherein at least one of the first part-body or the second part-body of the magnetic core comprises a leg arranged in the first cavity of the winding former and at least one further leg arranged outside the first cavity of the winding former. | 2021-07-01 |
20210202165 | INDUCTIVE DEVICES AND METHODS OF FORMING INDUCTIVE DEVICES - An inductive device may be provided, including a substrate and an inductive structure arranged over the substrate. The inductive structure may include a bottom metal winding layer; a top metal winding layer arranged further away from the substrate than the bottom metal winding layer; a magnetic core layer arranged between the bottom metal winding layer and the top metal winding layer; a connector arranged to electrically connect the bottom metal winding layer and the top metal winding layer; and a top metal ring element arranged around the top metal winding layer, spaced apart from the top metal winding layer. The inductive device may further include a guard ring element arranged under the top metal ring element and around the magnetic core layer, spaced apart from the magnetic core layer; wherein the guard ring element may include a magnetic material. | 2021-07-01 |
20210202166 | ELECTRIC FIELD REDUCING INSULATING LAYER FOR AN INDUCTIVE COIL - An electric field-reducing insulating layer is described for an inductive coil. In some examples, a first coil having at least one first winding is arranged for being driven at a first voltage. A solid insulating layer is adjacent the first coil and has a first surface facing the first coil. The first surface of the solid insulating layer has a first groove between the first winding and the insulating layer, having a width that is smaller than a diameter of the electrical wire. The first groove forms a pocket between the first winding and the solid insulating layer. | 2021-07-01 |
20210202167 | METHOD FOR MANUFACTURING MAGNETIC BODY AND COIL COMPONENT CONTAINING MAGNETIC BODY - When manufacturing a magnetic body whose primary component is Ni—Zn ferrite, an iron oxide powder whose Mn content is 0.20 to 0.85 percent by mass is used as a raw material powder, or, in addition to using an iron oxide powder whose Mn content is 0.20 percent by mass or higher as a raw material powder, a mol ratio of Ni to Zn (Ni/Zn) in the ferrite material is determined based on the Mn content in the iron oxide powder and the raw material powders are compounded in such a way that the mol ratio is achieved. The magnetic body does not contain any additives as essential components other than the primary components of the Ni—Zn ferrite material. A coil component using the magnetic body has excellent direct-current superimposition property and magnetic permeability. | 2021-07-01 |
20210202168 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces, in which a metal or a metal oxide is disposed in the dielectric layer, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less. | 2021-07-01 |
20210202169 | DIELECTRIC COMPOSITION AND ELECTRONIC DEVICE - A dielectric composition includes main phases and Ca-RE-Si—O segregation phases. The main phases include a main component expressed by ABO | 2021-07-01 |
20210202170 | ELECTRONIC COMPONENT DEVICE - An electronic component device includes an electronic component, a pair of metal terminals, a bonding member, and an expansion member having thermal expansibility. The electronic component includes an element body and a pair of external electrodes. The element body has a pair of end faces opposed to each other. The pair of external electrodes is disposed on the pair of end faces. The pair of metal terminals is electrically connected to the pair of external electrodes. The bonding member bonds one of the pair of external electrodes to one of the pair of metal terminals. The bonding member electrically connects the one of the pair of external electrodes to the one of the pair of metal terminals. The one of the pair of metal terminals includes an opposing face. The opposing face is a flat face. | 2021-07-01 |
20210202171 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes, in at least one of a region between an end of a first internal electrode layer which is not connected to a second external electrode and the second external electrode, and a region between an end of a second internal electrode layer which is not connected to a first external electrode and the first external electrode, in a length direction, a defect portion provided on a plane including a stacking direction and a width direction, such that the defect portion is located between the first dielectric ceramic layers in the stacking direction and is located between the second dielectric ceramic layer and the third dielectric ceramic layer in the width direction. | 2021-07-01 |
20210202172 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component. | 2021-07-01 |
20210202173 | CERAMIC ELECTRONIC DEVICE AND MOUNTING SUBSTRATE - A ceramic electronic device includes a multilayer chip having dielectric layers and internal electrode layers and having a first main face and a second main face that have a rectangular shape in a planar view, external electrodes each of which extends from the first main face to the second main face at each of two diagonal corners of the rectangular shape, the external electrodes being spaced from each other, each of the external electrodes being connected to a part of the internal electrode layers, and a conductor that is provided on the first main face, the second main face or both of the first main face and the second main face, is spaced from the external electrodes, and is provided in a region which includes an intersection point of perpendicular bisectors of two adjacent sides of the rectangular shape. | 2021-07-01 |
20210202174 | ELECTRONIC COMPONENT - An electronic component includes a multilayer capacitor including a capacitor body having first to sixth surfaces, and first and second external electrodes; and an interposer including an interposer body and first and second external terminals; and the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes, the first and second internal electrodes are exposed through the third and fourth surfaces of the capacitor body, respectively, and the interposer further includes first and second solder fillet limiting layers disposed on upper sides of both surfaces of each of the first and second external terminals in the first direction, respectively. | 2021-07-01 |
20210202175 | MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON - The multilayer electronic component includes a capacitor body having first to sixth surfaces; first and second external electrodes including first and second connecting portions, and first and second band portions; first and second connection terminals connected to the first band portion; and third and fourth connection terminals connected to the second band portion. The first and second connection terminals include a first connection surface facing the first band portion, a second connection surface opposing the first connection surface, and a first circumferential surface connecting the first and second connection surfaces, a cross section of the first circumferential surface being circular. The third and fourth connection terminals include a third connection surface facing the second band portion, a fourth connection surface opposing the third connection surface, and a second circumferential surface connecting the third and fourth connection surfaces, a cross section of the second circumferential surface being circular. | 2021-07-01 |
20210202176 | MULTILAYERED ELECTRONIC COMPONENT - A multilayer electronic component includes a body including dielectric layers, and first and second internal electrodes alternately stacked in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, a resistor disposed on the second surface, a via electrode exposed to the second surface and connecting the second internal electrode and the resistor to each other, a first external electrode disposed on the third surface and connected to the first internal electrode, and a second external electrode disposed on the fourth surface and connected to the resistor. | 2021-07-01 |
20210202177 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a second alloy portion including one metal element provided in a greatest amount among metal elements of an internal electrode layer, and one or more metal elements among a metal group including Sn, In, Ga, Zn, Bi, Pb, Cu, Ag, Pd, Pt, Ph, Ir, Ru, Os, Fe, V, and Y is provided between a second dielectric ceramic layer and a first internal electrode layer, and between a second dielectric ceramic layer and a second internal electrode layer, respectively. | 2021-07-01 |
20210202178 | MULTILAYER CERAMIC CAPACITOR - In a multilayer ceramic capacitor, an intersection of an interface is defined by a second dielectric ceramic layer, a first internal electrode layer or a second internal electrode layer, and a third dielectric ceramic layer, on a plane including a length direction and a width direction, the second dielectric ceramic layer and the third dielectric ceramic layer include a near intersection region at or near the intersection, and an average particle size of dielectric particles in the near intersection region is smaller than average particle sizes of dielectric particles in the first dielectric ceramic layer, the second dielectric ceramic layer, and the third dielectric ceramic layer. | 2021-07-01 |
20210202179 | MULTILAYER CERAMIC CAPACITOR - In a multilayer ceramic capacitor, a first segregation defined by at least one metal element selected from a group consisting of Mg, Mn, and Si is present at each of an end in a length direction of a first internal electrode layer not connected to a second external electrode and an end in a length direction of a second internal electrode layer not connected to a first external electrode. A second segregation defined by at least one metal element selected from a group consisting of Mg, Mn, and Si is present at each of an end of the first internal electrode layer in a width direction and an end of the second internal electrode layer in the width direction. | 2021-07-01 |
20210202180 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a third segregation by each of metal elements of a first segregation and a second segregation is provided at each of a first corner region in which an end in a length direction in which the first segregation is provided overlaps an end in a width direction in which the second segregation is provided in a first internal electrode layer, and a second corner region in which an end in the length direction in which the second segregation is provided overlaps an end in the width direction in which the second segregation is provided in a second internal electrode layer. | 2021-07-01 |
20210202181 | MULTILAYER CERAMIC CAPACITOR - In a multilayer ceramic capacitor includes, in a plane including a center portion in a length direction, and a stacking direction and a width direction of a first dielectric ceramic layer, where a thickness at a center portion in the stacking direction is T | 2021-07-01 |
20210202182 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a laminated body and first and second external electrodes respectively on both end surfaces of the laminated body. When regions where first internal electrodes or second internal electrodes are not present are regarded as side margin portions in a cross section of the laminated body as viewed from the laminating direction, the side margin portions include multiple side margin layers, and the content of Si in the side margin layer closest to the internal electrode is lower than that in the side margin layer other than the side margin layer closest to the internal electrode. | 2021-07-01 |
20210202183 | PARALLEL PLATE CAPACITOR RESISTANCE MODELING AND EXTRACTION - A parallel plate capacitor structure in an integrated circuit has a first plate and a second plate separated by an insulator, such as a dielectric. Both plates are connected to an interconnect structure at a plurality of connection points. The area of the first plate that overlaps with the second plate is identified. This overlap region does not include any connection points on the first plate. For this overlap region, the lumped element model for the first plate includes nodes on the edge of the overlap region (edge nodes), and lumped resistances between the edge nodes and the node connected to the lumped capacitance. In one embodiment, the lumped element model also includes a common node, all of the edge nodes are connected to the common node by lumped resistances, and the common node is connected by a negative resistance to the lumped capacitance. | 2021-07-01 |
20210202184 | ELECTROLYTIC CAPACITOR AND METHOD FOR MANUFACTURING SAME - Provided is an electrolytic capacitor that can reliably exhibit redox capacity due to a conductive polymer layer of a cathode. The electrolytic capacitor includes: a cathode having a conductive substrate and a conductive polymer layer placed on the surface of the conductive substrate; an anode having a substrate composed of a valve metal and a dielectric layer composed of an oxide of the valve metal that is placed on the surface of the substrate, the anode being disposed such that the dielectric layer and the conductive polymer layer of the cathode are opposed to each other across a space; and an ion conductive electrolyte with which the space is filled, the conductive polymer layer of the cathode that is in contact with the ion conductive electrolyte exhibiting a redox capacity due to application of a voltage between the anode and the cathode, wherein the contact resistance between the conductive substrate and the conductive polymer layer in the cathode is 1 Ωcm | 2021-07-01 |
20210202185 | Enhanced Capacitor Tabs - A capacitor manufacturing method is disclosed herein that includes a process for the isolation of electrode tabs attached to the capacitors' electrodes from other elements in the capacitor. An isolation patch or layer may be deposited over the tabs by a machine or a device after the tab is attached and before the electrodes are wound into a cylindrical internal element of a capacitor. The device may coat the tabs and surrounding regions with an isolating material. Electrode tabs may be provided with an isolating material pre-deposited at least in part over the tabs. | 2021-07-01 |
20210202186 | Positive Electrode Precursor - This positive electrode precursor includes: a positive electrode active material containing a carbon material and an alkali metal compound, wherein 5≤A≤35, when A (g/m | 2021-07-01 |
20210202187 | DEVICES AND METHODS INCLUDING POLYACETYLENES - Embodiments described herein relate to compositions, devices, and methods for storage of energy (e.g., electrical energy). In some cases, devices including polyacetylene-containing polymers are provided. | 2021-07-01 |
20210202188 | Luminous Light Switch Assembly - A luminous light switch assembly for illuminating a light switch in a darkened room includes a wall plate that is mountable to a wall having the wall plate being aligned with a switch opening in the wall. A switch is positionable in the switch opening and the switch is wired into a light circuit for turning the light circuit on and off. Moreover, the switch has a fluorescent condition such that the switch is visible in a darkened environment. includes a wall plate that is mountable to a wall having the wall plate being aligned with a switch opening in the wall. A switch is positionable in the switch opening and the switch is wired into a light circuit for turning the light circuit on and off. Moreover, the switch has a fluorescent condition such that the switch is visible in a darkened environment. | 2021-07-01 |
20210202189 | MECHANICAL INTERLOCK FOR SWITCH - A mechanical interlock for a switch gear switch. The mechanical interlock includes a base and a slider. The slider is moveable relative to the base between a first position and a second position. The mechanical interlock is configured to lock the position of the switch when the slider is in the second position. | 2021-07-01 |
20210202190 | METAL CONTACT MEMBER AND RUBBER SWITCH MEMBER - A metal contact member | 2021-07-01 |
20210202191 | KEYSWITCH STRUCTURE - A keyswitch structure includes a base plate, a keycap, and two supports connected to the base plate and the keycap. The keycap is movable relative to the base plate through the two supports. The support is pivotally connected to the base plate through a pivotal connection structure that includes a guiding slot and a protruding shaft oppositely disposed on the support and the base plate. The guiding slot has an opening and an indentation portion. The opening is located at an upper end of the guiding slot. The protruding shaft enters the guiding slot from the opening to rotatably fit in the indentation portion, so that the support is pivotally connected to the base plate. | 2021-07-01 |
20210202192 | SWITCH DEVICE - A switch device includes a substrate having one surface and another surface; a switch disposed on the one surface of the substrate and configured to be pressed; a first housing; a second housing; and a pin member. An internal space is formed by the first housing and the second housing, and the substrate is disposed in the internal space. The first housing has an opening through which at least a part of the pin member is inserted into the internal space. The second housing includes a support portion that supports the another surface of the substrate. When the pin member is inserted into the internal space through the opening, the pin member presses the support portion against the another surface of the substrate so as to cause the support portion to support the another surface of the substrate. | 2021-07-01 |
20210202193 | OPTICAL SWITCH KEYBOARD ADJUSTMENT METHOD AND OPTICAL SWITCH KEYBOARD USING THE SAME - A method for adjusting an optical switch keyboard and an optical switch keyboard using the adjusting method are provided. The optical switch keyboard has a number of key units. The method includes the following steps. A scan signal is applied to one of a number of scan lines by a control unit at a first scan time point. A light is emitted by a light source according to the scan signal. A light emitted by the light source is detected by a detecting element to generate a detecting electric signal. The detecting electric signal is read by the control unit to obtain a first read signal voltage. When the first read signal voltage is outside the voltage range of the pressed state of the key unit, the period of the scan signal is increased by a first predetermined amount by the control unit to obtain an adjusted scan signal. | 2021-07-01 |
20210202194 | Hybrid Relay | 2021-07-01 |
20210202195 | High Voltage Electric Power Switch with Carbon Arcing Electrodes and Carbon Dioxide Dielectric Gas - A high voltage electric switch includes contacts with graphite carbon electrode forming the arc gap. In addition, the carbon contacts are located in a chamber containing at least 60% carbon dioxide (CO2) as a dielectric gas to achieve improved arc interrupting performance. In conventional switches, the metallic contacts introduce metallic vapors into the arc plasma that inhibits the ability of the dielectric gas to interrupt high voltage, high current arcs. As the element carbon is inherently present in CO2 gas, the addition of vapors from the carbon electrodes into the dielectric gas does not significantly interfere with the dielectric arc-interrupting performance of the CO2 dielectric gas. | 2021-07-01 |
20210202196 | MEMS DUAL SUBSTRATE SWITCH WITH MAGNETIC ACTUATION - Systems and methods for forming a magnetostatic MEMS switch include forming a movable beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A shunt bar on the movable plate may close the switch when lowered onto the contacts. The switch may generally be closed, with the shunt bar resting on the contacts. However, a magnetically permeable material may also be inlaid into the movable plate. The switch may then be opened by placing either a permanent magnet or an electromagnet in proximity to the switch. | 2021-07-01 |
20210202197 | Switch Device - In an embodiment a switching device includes at least two stationary contacts and one movable contact in a switching chamber, wherein the switching chamber has a switching chamber wall, wherein each of the stationary contacts projects into the switching chamber through a respective opening in the switching chamber wall, and wherein, on an inner side of the switching chamber that faces the movable contact, a continuous surface region occluded by the stationary contacts is located between the openings in the switching chamber wall. | 2021-07-01 |
20210202198 | ELECTROMAGNETIC RELAY - An electromagnetic relay includes a fixed contact, a movable contact piece, a drive shaft, and a movable iron core. The movable contact piece is movable in a first direction and in a second direction. The drive shaft that extends in the first direction and the second direction and that is coupled to the movable contact piece. The movable iron core is coupled to the drive shaft so as to be integrally movable at a position beyond the movable contact piece in the first direction or at a position beyond the movable contact piece in the second direction. The drive shaft includes a first contact portion configured to contact the movable contact piece, a second contact portion configured to contact the movable iron core, and an insulating portion made from an insulating material and configured to insulate the movable contact piece and the movable iron core from each other. | 2021-07-01 |
20210202199 | ELECTROSTATIC DRIVE SWITCH - Provided is an electrostatic drive switch, which includes a source plate to which a voltage for driving the electrostatic drive switch is applied and a drain electrode spaced apart from the source plate. The source plate includes a source electrode and an elastic part connected to the source electrode, and a first material and a second material having lower hardness than the first material are provided on the source electrode. When the source electrode and the drain electrode are electrically connected to each other by the voltage, the second material is brought into contact with the drain electrode by the elastic part after the first material is brought into contact with the drain electrode by the elastic part. | 2021-07-01 |
20210202200 | SNAP FIT CIRCUIT BREAKER AND LOAD CENTER SYSTEM - A circuit breaker and panel system includes a panel including a base pan having a plurality of base pan electrical connections. A circuit breaker including a housing having a plurality of circuit breaker electrical connections arranged to contact the base pan electrical connections when the circuit breaker is coupled to the base pan. The circuit breaker is rotatably coupleable with the base pan via a pivot joint for engaging the plurality of base pan electrical connections with the plurality of circuit breaker electrical connections per a predetermined electrical connection coupling sequence. One of the housing and the base pan includes a protrusion and the other of the housing and the base pan includes a corresponding recess which, when engaged with each other, retain the housing to the base pan to prevent reverse rotational movement of the breaker with respect to the base pan. | 2021-07-01 |
20210202201 | SAFETY APPARATUS HAVING TERMINAL SHIELD WITH INDICATION CIRCUIT, AND CIRCUIT INTERRUPTION APPARATUS - A safety apparatus is a terminal shield having an indication circuit incorporated therein. The safety apparatus is usable with a circuit interrupter to overlie one or more terminals of the circuit interrupter that are connected with line and load conductors and to thereby form a circuit interrupter apparatus. The safety apparatus can be employed at the line side of a circuit interrupter, at the load side of a circuit interrupter, or at both sides of a circuit interrupter. The safety apparatus can be provided as part of a new circuit interrupter apparatus or can be provided to retrofit existing circuit interrupters. The indication circuit advantageously outputs from a top surface of the terminal shield one of a visual indication and an audible indication when one or more terminals of the circuit interrupter are electrified, thereby easily conveying to a technician the portions of the circuit interrupter that are electrified. | 2021-07-01 |
20210202202 | THERMAL FUSE SLEEVING - Provided is a battery that may include a first terminal or cable, a second terminal or a cable, a thermal fuse configured to connect to the first terminal or cable and the second terminal or cable, a first sleeving layer that is disposed on the thermal fuse, and that is configured to muffle an arc explosion of the thermal fuse and encapsulate molten material generated by the arc explosion of the thermal fuse, and a second sleeving layer that is disposed on the first sleeving layer, and that is configured to encapsulate the molten material generated by the arc explosion of the thermal fuse that penetrates the first sleeving layer. An overcurrent protection system and a sleeving are also provided. | 2021-07-01 |
20210202203 | THIN AND FLEXIBLE DEVICE THAT ACTS AS A FUSE UNDER EXCESS CURRENT LOAD IN AN MRI RECEIVE COIL - A flexible and non-magnetic fuse that can be used in a MRI. The fuse is made up of a substrate and a first layer located upon the substrate. The first layer including a first electrical conductor material suspended within a first base material. Upon the first layer is located a second layer. This second is made up of a material that is suspended within a second base material. The second layer has a solid to liquid phase transition temperature lower than a solid to liquid phase transition temperature of a material of the first layer and the second base material intermixes with the first base material at the transition temperature the second layer. | 2021-07-01 |
20210202204 | SYSTEM AND METHOD FOR LOW-NOISE EDGE DETECTION AND ITS USE FOR PROCESS MONITORING AND CONTROL - In one embodiment, a method includes generating a model trained to predict a low-probability stochastic defect, calibrating, using unbiased measurement data, the model to a specific lithography process, patterning process, or both to generate a calibrated model, using the calibrated model to predict the low-probability stochastic defect; and modifying, based on the low-probability stochastic defect, a variable, parameter, setting, or some combination of a manufacturing process of a device. | 2021-07-01 |
20210202205 | METHOD AND SYSTEM FOR AUTOMATIC ZONE AXIS ALIGNMENT - Automatic alignment of the zone axis of a sample and a charged particle beam is achieved based on a diffraction pattern of the sample. An area corresponding to the Laue circle is segmented using a trained network. The sample is aligned with the charged particle beam by tilting the sample with a zone axis tilt determined based on the segmented area. | 2021-07-01 |
20210202206 | CHARGED PARTICLE BEAM INSPECTION APPARATUS AND CHARGED PARTICLE BEAM INSPECTION METHOD - A charged particle beam inspection apparatus includes a movable stage, configured to hold a substrate placed on the movable stage; a stage control circuit, configured to continuously move the movable stage in a direction opposite to a first direction; a deflection control circuit, configured to control a deflector to collectively deflect multiple beams to an N×N′ small region group including N small regions, the collective deflection includes performing tracking deflection of the multiple beams and collectively deflecting the multiple beams to a new group of N×N′ small regions and sequentially perform a first and a second step, a detector configured to detect secondary electrons emitted from the substrate due to irradiation of the substrate with the multiple beams, and combinations of a value of N and a value of M are set such that the greatest common divisor of the value of N and the value of M is 1. | 2021-07-01 |
20210202207 | PLASMA PROCESSING METHOD, AND ELEMENT CHIP MANUFACTURING METHOD - A plasma processing method, including: a trenched substrate preparation process of preparing a trenched substrate having trenches having a bottom exposing an oxide film; and an oxide film removal process of exposing the trenched substrate to a plasma, to remove the oxide film. The oxide film removal process includes a plurality of cycles, each cycle including: an oxide film etching step of etching the oxide film; and a cleaning step of removing an attached matter on inner walls of the trenches, after the oxide film etching step. | 2021-07-01 |
20210202208 | MODULAR RECIPE CONTROLLED CALIBRATION (MRCC) APPARATUS USED TO BALANCE PLASMA IN MULTIPLE STATION SYSTEM - A circuit tuning radio frequency (RF) power. The circuit includes a low to mid frequency (LF/HF) tuning circuit including a variable LF/MF capacitor coupled in series with an LF/MF inductor. The LF/MF tuning circuit is coupled between ground and a common node configured to receive an RF input. The circuit includes a high frequency (HF) tuning circuit coupled in parallel to the LF/MF tuning circuit between ground and the common node. The HF tuning circuit includes a variable HF capacitor coupled in series with an HF inductor. Cross parallel isolation occurs between the LF/MF inductor of the LF/MF tuning circuit and the HF inductor of the HF tuning circuit when adjusting the variable LF/MF capacitor or variable HF capacitor. | 2021-07-01 |
20210202209 | INTEGRATED CONTROL OF A PLASMA PROCESSING SYSTEM - Plasma processing systems and power delivery methods are disclosed. A system may comprise at least one modulating supply that modulates plasma properties where the modulation of the plasma properties has a repetition period, T. Electrical characteristics of an output of the modulating supply are monitored and provided to a controller where the electrical characteristics are analyzed. Characteristics of a waveform with the repetition period T are communicated to at least one piece of equipment connected to plasma processing system to enable synchronization of pieces of equipment connected to the plasma processing system. And in addition, instructions are relayed to the modulating supply and a match network, based on the analyzing of the electrical characteristics, enabling simultaneous tuning of the modulating supply and the match network. | 2021-07-01 |
20210202210 | Impedance Adjustment Device - An impedance adjustment device includes a variable capacitor unit. A microcomputer changes the capacitance value of the variable capacitor unit by switching on or off PIN diodes included in n capacitor circuits separately. Thus, the impedance on the plasma generator side when viewed from a high frequency power supply is adjusted. When changing the capacitance value of the variable capacitor unit to a target capacitance value, the microcomputer changes the capacitance value to a relay capacitance value different from the target capacitance value. The microcomputer changes the capacitance value to the target capacitance value after the capacitance value is changed to the relay capacitance value. | 2021-07-01 |
20210202211 | High-Frequency Power Supply System - Proposed are techniques for suppressing an increase in a reflected wave power Pr (synonymous with a reflection coefficient) due to IMD. A high-frequency power supply system for providing a high-frequency power to a connected load includes: a bias power supply that outputs a bias power at a first frequency: a source power supply that outputs a source power at a second frequency higher than the first frequency; and a matching unit including an impedance matching circuit that acquires the bias power and the source power, and provides matching between an impedance on the source power supply side and an impedance on the load side. The source power supply supplies the bias power supply with a sinusoidal synchronizing signal including information about an output frequency to be outputted by the bias power supply, and the bias power supply outputs the bias power of a frequency corresponding to the output frequency included in the sinusoidal synchronizing signal. The matching unit performs a process for dividing a forward wave power due to the source power supply for one cycle of the bias power and a reflected wave power toward the source power supply, into a plurality of sections, a process for performing, with respect to each of the plurality of sections, a frequency matching calculation to determine a frequency setting value for each section, and a process for transmitting the frequency setting value for each section to the source power supply. The source power supply, in accordance with the frequency setting values for the plurality of sections transmitted from the matching unit, outputs the bias power in the plurality of section. | 2021-07-01 |
20210202212 | MICROWAVE COUPLING/COMBINING DEVICE AND ASSOCIATED MICROWAVE GENERATOR - A microwave coupling/combining device for coupling and combining at least two microwave sources includes a waveguide provided with a sleeve extending longitudinally along a main axis and having two opposing ends having a first end provided with an element forming a short-circuit and a second open end. The device further includes at least one transverse bar extending inside the sleeve along a transverse axis orthogonal to the main axis; and at least two coaxial connectors provided for being connected respectively to microwave sources. Each coaxial connector is mounted externally on the sleeve and has a central conductive core connected to and extended by a conductive antenna extending in a direction orthogonal to the transverse axis and to the main axis inside the sleeve and ending by an end attached to a transverse bar. | 2021-07-01 |
20210202213 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND PLASMA GENERATOR - There is provided a technique that includes: a process chamber in which a substrate is processed; a gas supply system configured to supply a processing gas into the process chamber; a first plasma generator installed to be wound around an outer periphery of the process chamber and configured to generate plasma from the processing gas in the process chamber; and a second plasma generator installed at an upper portion of the process chamber to protrude toward an inside of the process chamber and configured to generate plasma from the processing gas in the process chamber. | 2021-07-01 |
20210202214 | Chamber Seasoning to Improve Etch Uniformity by Reducing Chemistry - Processes for surface treatment of a workpiece are provided. In one example implementation, a method can include conducting a pre-treatment process on a processing chamber to generate a hydrogen radical affecting layer on a surface of the processing chamber prior to performing a hydrogen radical based surface treatment process on a workpiece in the processing chamber. In this manner, a pretreatment process can be conducted to condition a processing chamber to increase uniformity of hydrogen radical exposure to a workpiece. | 2021-07-01 |
20210202215 | PLASMA GENERATING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - There is provided a substrate processing apparatus that includes a substrate support configured to support one or more substrates, a process chamber in which the one or more substrates are processed, a gas supplier configured to supply gas, and a plasma generator including a plurality of first rod-shaped electrodes connected to a high-frequency power supply; and a second rod-shaped electrode installed between two first rod-shaped electrodes is grounded; and a buffer structure configured to accommodate the plurality of first rod-shaped electrodes and the second rod-shaped electrode, and having a first wall surface on which a gas supply port that supplies gas into the process chamber is installed. Wherein the plasma generator is configured to convert gas into plasma by the plurality of first rod-shaped electrodes and the second rod-shaped electrode to supply the plasma-converted gas to the process chamber from the gas supply port. | 2021-07-01 |
20210202216 | PLASMA GENERATING DEVICE, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - There is provided a plasma generating device that includes a first electrode connected to a high-frequency power supply, and a second electrode to be grounded, a buffer structure configured to form a buffer chamber that accommodates the first and second electrodes wherein the first electrode and the second electrode are alternately arranged such that a number of electrodes of the first electrode and the second electrode are in an odd number of three or more in total, and wherein the second electrode is used in common for two of the first electrode being respectively adjacent to the second electrode used in common, and wherein a gas supply port that supplies gas into a process chamber is installed on a wall surface of the buffer structure. | 2021-07-01 |
20210202217 | EDGE RING, SUBSTRATE PROCESSING APPARATUS HAVING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE APPARATUS - An edge ring includes an annular body portion having a bottom surface and a top surface, a first step portion extending along an inner periphery of the body portion and having an annular first bottom surface positioned higher than the bottom surface of the body portion by a first height, an inclined portion extending along an inner periphery of the first step portion and having an inclined bottom surface extending at a first angle with respect to a first plane in which the first bottom surface is placed, a second step portion extending along an inner periphery of the inclined portion and having a second bottom surface positioned higher than the bottom surface of the body portion by a second height greater than the first height, and a plurality of passages extending outwardly from the first bottom surface of the first step portion at a second angle with respect to the first bottom surface. | 2021-07-01 |
20210202218 | TARGETED HEAT CONTROL SYSTEMS - Exemplary semiconductor processing chambers may include a chamber body including sidewalls and a base. The chambers may include a substrate support extending through the base of the chamber body. The substrate support may include a support platen configured to support a semiconductor substrate. The substrate support may include a shaft coupled with the support platen. The substrate support may include a shield coupled with the shaft of the substrate support. The shield may include a plurality of apertures defined through the shield. The substrate support may include a block seated in an aperture of the shield. | 2021-07-01 |
20210202219 | STAGE, SUBSTRATE PROCESSING APPARATUS, AND HEAT TRANSFER GAS SUPPLY METHOD - A stage includes: a pin insertion passage penetrating the stage on which a substrate is mounted, and configured to allow a lifter pin to be inserted into and penetrate the pin insertion passage, a heat transfer gas passage penetrating the stage, and configured to introduce a heat transfer gas onto a mounting surface of the stage; a common gas passage in communication with the pin insertion passage and the heat transfer gas passage, and configured to allow the heat transfer gas to flow through the common gas passage; and a first member disposed to face the common gas passage at a location at which the pin insertion passage and the common gas passage intersect each other, and configured to adjust a flow rate of the heat transfer gas introduced onto the mounting surface of the stage from the pin insertion passage. | 2021-07-01 |
20210202220 | INSPECTION METHOD OF PLASMA FORMING SOURCE AND LOAD - There is provided an inspection method of a plasma forming source. The method includes providing a load configured to be capacitively and inductively coupled to the plasma forming source; and calculating a characteristic of the plasma forming source by receiving a signal from the plasma forming source while sending a reference signal to the plasma forming source. | 2021-07-01 |
20210202221 | MAGNETRON SPUTTERING APPARATUS AND CATHODE DEVICE THEREOF - The present disclosure provides a magnetron sputtering apparatus and a cathode device of the magnetron sputtering apparatus. The cathode device includes a target material component, a magnetic circuit component, a transmission component and a driving component. The magnetic circuit component is configured to be arranged opposite to the target material component. The magnetic circuit component includes a plurality of magnetic circuit units capable of independently generating magnetic field. The transmission component is connected with each of the magnetic circuit units simultaneously. The driving component is configured to drive the magnetic circuit component to reciprocate between a first position and a second position in a preset direction by the transmission component. | 2021-07-01 |
20210202222 | BENCH-TOP TIME OF FLIGHT MASS SPECTROMETER - A Time of Flight analyser comprising a flight tube ( | 2021-07-01 |
20210202223 | METHOD AND DEVICE FOR PROCESSING IMAGING-ANALYSIS DATA - In a device for processing imaging-analysis data, two kinds of imaging-analysis data are stored in a storage section | 2021-07-01 |
20210202224 | TIME-OF-FLIGHT MASS SPECTROMETRY DEVICE - A time-of-flight mass spectrometry device, includes: a flight tube: a flight tube power supply that applies a voltage to the flight tube; and a noise reduction circuit that is connected to a flight tube voltage portion which lies between the flight tube and the flight tube power supply, wherein: the noise reduction circuit inverts and amplifies an input voltage from an input end of the noise reduction circuit, and feeds inverted and amplified voltage back to the flight tube voltage portion through an output end. | 2021-07-01 |
20210202225 | APPARATUS AND METHOD FOR CALIBRATING OR RESETTING A CHARGE DETECTOR - A CDMS may include an ELIT having a charge detection cylinder (CD), a charge generator for generating a high frequency charge (HFC), a charge sensitive preamplifier (CP) having an input coupled to the CD and an output configured to produce a charge detection signal (CHD) in response to a charge induced on the CD, and a processor configured to (a) control the charge generator to induce an HFC on the CD, (b) control operation of the ELIT to cause a trapped ion to oscillate back and forth through the CD each time inducing a charge thereon, and (c) process CHD to (i) determine a gain factor as a function of the HFC induced on the CD, and (ii) modify a magnitude of the portion of CHD resulting from the charge induced on the CD by the trapped ion passing therethrough as a function of the gain factor. | 2021-07-01 |
20210202226 | TRAP FILL TIME DYNAMIC RANGE ENHANCMENT - A method of mass and/or ion mobility spectrometry is disclosed that comprises accumulating ions for a first period of time (T | 2021-07-01 |
20210202227 | MASS SPECTROMETER - A mass spectrometer provided with an ionization chamber ( | 2021-07-01 |
20210202228 | DIRECT SAMPLE INTRODUCTION DEVICE AND METHOD FOR COOLING SAMPLE INTRODUCTION PROBE - A direct sample introduction device includes: a pre-evacuating chamber that has an internal space extending in a first direction through which a sample introduction probe extends in the first direction; a first ventilation unit that is allowed to be opened and closed, with a first end thereof being connected to the pre-evacuating chamber; and a second ventilation unit a first end of which is connected to the pre-evacuating chamber and a second end of which is connected to a low pressure source. | 2021-07-01 |
20210202229 | TIME-OF-FLIGHT MASS SPECTROMETER - An acceleration voltage generator ( | 2021-07-01 |
20210202230 | RF ION TRAP ION LOADING METHOD - A method of processing ions in a mass spectrometer comprises introducing one or more precursor ions into a collision cell to fragment at least a portion of said ions, where the collision cell is configured to confine ions having m/z ratios above a selected threshold (i.e., high m/z ions). The ions are released from the collision cell and introduced into a downstream analyzer ion trap to radially confine high m/z ions. The collision cell and the analyzer ion trap are configured to confine ions having m/z ratios below said selected threshold (i.e., low m/z ions). Ions are introduced into the collision cell and undergo fragmentation. The fragment ions are released from the collision cell and introduced into the analyzer ion trap, thus loading the analyzer ion trap with both high m/z and low m/z ions. The ions are released from the analyzer ion trap and detected by a detector. | 2021-07-01 |
20210202231 | Systems and Methods for Removal of Hardmask - Apparatus, systems, and methods for conducting a hardmask (e.g., boron doped amorphous carbon hardmask) removal process on a workpiece are provided. In one example implementation, a method includes supporting a workpiece on a workpiece support in a processing chamber. The method can include generating a plasma from a process gas in a plasma chamber using a plasma source. The process gas includes a fluorine containing gas. The method can include exposing the workpiece to one or more radicals generated in the plasma to perform a plasma strip process on the workpiece to at least partially remove the hardmask layer from the workpiece. The method can include exposing the workpiece to one or more hydrogen radicals as a passivation agent during the plasma strip process. | 2021-07-01 |
20210202232 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM - Described herein is a technique capable of improving a controllability of a thickness distribution of an oxide film formed on a surface of a substrate. According to one aspect of the technique, there is provided a method of manufacturing a semiconductor device, including: (a) forming a first oxide layer by supplying an oxygen-containing gas and an hydrogen-containing gas to a heated substrate at a first pressure less than an atmospheric pressure and by oxidizing a surface of the substrate; and (b) forming a second oxide layer by supplying the oxygen-containing gas and the hydrogen-containing gas to the heated substrate at a second pressure less than the atmospheric pressure and different from the first pressure and by oxidizing the surface of the substrate on which the first oxide layer is formed. | 2021-07-01 |
20210202233 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS - A substrate processing method suppresses a shape abnormality of a pattern formed on a substrate. The substrate processing method executed by a substrate processing apparatus includes step a), step b), and step c). The step a) is a step of providing a substrate including an etching target film and a mask layer formed on the etching target film in which the mask layer has an opening. The step b) is a step of forming a protective film on an upper portion of an opening of the mask. The step c) is a step of etching the mask while suppressing a variation of an opening dimension of the upper portion of the opening by the protective film, and varying a dimension of a lower portion of the opening not covered by the protective film. | 2021-07-01 |
20210202234 | ALD PROCESS AND HARDWARE WITH IMPROVED PURGE EFFICIENCY - Embodiments described herein provide a gas supply system for reducing purge time and increasing processing throughput, and an atomic layer deposition (ALD) chamber having the same. The gas supply system includes an inert gas line and a precursor supply line. The inert gas line is configured to be coupled to an inlet of the chamber separate from the precursor supply line. Therefore, the inert gas is supplied concurrently to the precursor supply line and the processing region of the chamber such that total purge time is reduced. The reduction of the total purge time due to the gas supply system increases purge efficiency and increases processing throughput. Furthermore, the gas supply system allows inert gas to be utilized as a dilution gas during flow of precursors. | 2021-07-01 |