26th week of 2021 patent applcation highlights part 87 |
Patent application number | Title | Published |
20210204440 | MODULAR DATA CENTER COOLING - A modular arrangement is provided for housing electronic equipment and associated cooling structure in a data center environment. The modular units provide cooling air on an as-needed basis to individual pieces of equipment by way of individual plenums and associated valves. The units can be interconnected by vertical stacking, in side-to-side arrangements, and back-to-back arrangements. A number of units can be interconnected to form a cell. The cells can be interconnected to form larger units. In this manner, data centers can be configured in any desired arrangement without requiring complicated cooling design. | 2021-07-01 |
20210204441 | ELECTRONIC DEVICE - An electronic device includes a main body, a case, and an airbag. The main body includes an accommodation space and an opening, and a fan is disposed in the accommodation space. The case is disposed on the opening and one side of the case is connected to one side wall of the main body surrounding the opening. The airbag is disposed in the accommodation space below the orthographic projection of the case and communicates with the fan. When the airbag is not yet inflated, the case horizontally covers the opening. When the fan rotates at a speed greater than a critical speed, the airbag is inflated by the fan to lift another side of the case, so that the case is tilted on the main body to expose the opening. | 2021-07-01 |
20210204442 | POWER ELECTRONICS SYSTEM HAVING A HOUSING, A COOLING DEVICE, A POWER SEMICONDUCTOR MODULE AND A CAPACITOR DEVICE - A power electronics system has a housing, a cooling device, a power semiconductor module and a capacitor device, wherein a cooling section of a capacitor connection device is in theinially conducting contact with a cooling surface of the cooling device. | 2021-07-01 |
20210204443 | Modularized Water-Cooling Heat Sink - A modularized water-cooling heat sink includes a cold discharge body, a water tank and a water pump. The water pump is connected with the water tank, and connected with the cold discharge body via an external cold head. The cold discharge body is provided with a first through hole in communication with outside, and the water pump is provided with a second through hole in communication with outside. The first through hole is located on the end of the cold discharge body away from the connection with the water pump. The water tank and the cold discharge body are detachably connected. The modularized water-cooling heat sink has such a modular structure design that it is assembled as simple as an integrated water-cooling heat sink, and that the heat dissipation effect thereof is as good as a split water-cooling heat sink. | 2021-07-01 |
20210204444 | EMBEDDED AND IMMERSED HEAT PIPES IN AUTOMATED DRIVING SYSTEM COMPUTERS - Technologies for embedded and immersed heat pipes in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more heat pipes coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more heat pipes; and a chassis housing the one or more cold plates, the one or more processors, and the one or more heat pipes. | 2021-07-01 |
20210204445 | EMBEDDED AND IMMERSED VAPOR CHAMBERS IN AUTOMATED DRIVING SYSTEM COMPUTERS - Technologies for embedded and immersed vapor chambers in automated driving system computers (ADSC) are described herein. In some examples, an ADSC can include one or more cold plates including one or more fluid channels, the one or more fluid channels being configured to circulate a first working fluid from a respective ingress point to a respective egress point; one or more processors coupled to the one or more cold plates; one or more vapor chambers coupled to or embedded in the one or more cold plates and configured to collect heat from the one or more processors and transfer the heat away from the one or more processors via a second working fluid in the one or more vapor chambers; and a chassis housing the one or more cold plates, the one or more processors, and the one or more vapor chambers. | 2021-07-01 |
20210204446 | ASSEMBLIES INCLUDING HEAT DISPERSING ELEMENTS AND RELATED SYSTEMS AND METHODS - Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprises at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy includes transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink. | 2021-07-01 |
20210204447 | Containerized HVAC Control - Disclosed is a containerized heating, ventilation, and air-conditioning (HVAC) system comprising an HVAC unit and one or more ducts from the HVAC unit to an equipment rack. The ducts prevent mixing between the fresh and exhaust airflow, thus improving efficiency. Sensors located at sources of heat generating equipment within the racks may be used by controllers to monitor temperatures of the components at the source of heat generation, typically at the highest temperatures. The temperatures may be aggregated to determine the temperatures of devices, modules, racks, and the container interior cavity. Dampers on the ducts, at the rack inlets, at the module inlets, at the devices inlets, and such may assist in regulating airflow preferentially to the hottest components, devices, modules, or racks. | 2021-07-01 |
20210204448 | DATA CENTER COOLING SYSTEM THAT SELECTIVELY DELAYS COMPRESSOR RESTART OF A MECHANICAL COOLING SYSTEM - A multiple mode cooling system circulates outside air through a data center to cool heat-generating information technology (IT) component(s). Based on outside and interior air temperature values and outside humidity value, a controller determines that outside air cooling poses a risk of damage to the heat-generating IT component(s) due to condensation or overheating. Controller also determines that compressor(s) of the cooling system have been inactive for less than a minimum off-time specified for maintaining service life of the compressor(s). In response, controller checks a cooling mode setting and, based on determining that a cooling mode setting indicates an optimization preference for avoiding the posed risk of damage to the heat-generating IT component(s) over compressor service life, the controller restarts the compressor(s) before expiration of the minimum off-time. | 2021-07-01 |
20210204449 | COOLING DESIGN FOR ELECTRONICS ENCLOSURE - In one embodiment, an electronics enclosure for housing a data processing system includes a number of enclosure panels forming a fully enclosed container to contain electronics, including a first enclosure panel having a liquid cooling component therein and a second enclosure panel having an air cooling component therein. The enclosure is thermally managed by implementing these panels. The first enclosure panel includes an inlet port to receive cooling liquid from an external cooling liquid source, a cooling plate disposed on an inner surface of the first enclosure panel to receive a motherboard of the data processing system and to extract heat from the motherboard using the cooling liquid and an outlet port to return the cooling liquid back to the external liquid source. The second enclosure panel includes a liquid to air heat exchanger to cool air flowing through an air space within the fully enclosed container using at least a portion of the cooling liquid. | 2021-07-01 |
20210204450 | COMPOSITE LIQUID COOLING DEVICE - In one embodiment, an electronic cooling device includes an inlet port to receive cooling liquid from an external cooling liquid source. The cooling device further includes a base cooling unit having a first liquid distribution channel therein. The base cooling unit includes a cooling plate that forms a lower surface to be positioned on a top surface of one or more electronic devices to extract heat from the devices through the cooling plate using at least a portion of the cooling liquid from the external cooling liquid source. The cooling device further includes an upper cooling unit having a second liquid distribution channel to extract heat from air contacting the upper cooling unit using at least a portion of the cooling liquid received from the external cooling liquid source. The cooling device further includes an outlet port to return the cooling liquid to the external cooling liquid source. Internal fluid channel structural design can be used and customized for different applications and use cases. | 2021-07-01 |
20210204451 | SELF-CONTAINED IMMERSION COOLING SERVER ASSEMBLIES - Self-contained server assemblies for housing servers or server blades and associated computing facilities are disclosed herein. In one embodiment, a server assembly includes an enclosure having an interior space housing a server blade, a dielectric coolant submerging heat producing components of the server blade, and a condenser assembly having a condenser coil in fluid communication with a vapor gap in the interior space. The condenser coil is configured to receive a coolant that removes heat from a vapor of the dielectric coolant in the vapor gap, thereby condensing the vapor into a liquid form to be returned to the server blade. | 2021-07-01 |
20210204452 | Reverse Flow Prevention - The present concepts maintain forward flow and prevent reverse flow of heat-transferring media. A first zone and a second zone are proximate to each other. A first fan moves air through the first zone in a forward direction. A second fan moves air through the second zone in a forward direction. The speed of the first fan is compared with the speed of the second fan. If the first fan speed is slower than the second fan speed, then the first fan speed is adjusted to match the second fan speed. Therefore, reverse airflow in the first zone is prevented. | 2021-07-01 |
20210204453 | COOLING DEVICE - A cooling device includes a cooling assembly which includes a cold plate extending in a first direction, a pump and a tank on one side of the cold plate in a second direction perpendicular to the first direction, and a partition extending in the first direction and covering the cold plate on one side in the second direction. The cold plate and the partition define a first refrigerant flow path through which a refrigerant flows. The pump includes a pump chamber in which an impeller is housed, the impeller moving the refrigerant. The tank includes a tank chamber in which the refrigerant flows. The pump chamber and the tank chamber communicate with each other through a first tank hole portion. The partition includes a first hole portion through which the first refrigerant flow path and the tank chamber communicate. The first tank hole portion is provided on one side in the first direction with respect to the first hole portion. | 2021-07-01 |
20210204454 | DISPLAY APPARATUS - A display apparatus includes a heat dissipation sheet and a first plate disposed on the rear surface of a display panel, a printed circuit board disposed on one surface of the first plate, a component disposed on one surface of the printed circuit board, and a second plate disposed adjacent to the first plate. The first plate includes a bent extended portion and a coupling portion, and the bent extended portion is not in contact with the heat dissipation sheet. | 2021-07-01 |
20210204455 | DISPLAY DEVICE - A display device includes a display panel, a heat radiation metal plate arranged on a rear surface or a side surface of the display panel, a printed circuit board arranged on a rear surface of the heat radiation plate so as to be connected to the display panel, and a conductive tape configured to cover the heat radiation plate and the printed circuit board. The conductive tape conductively connects the rear surface of the heat radiation plate to a ground terminal of the printed circuit board. | 2021-07-01 |
20210204456 | MODULE - A module is provided with a substrate including a principal surface, a plurality of electronic components arranged on the principal surface, a sealing resin covering the principal surface and the plurality of electronic components, a ground electrode arranged on the principal surface or inside the substrate, a conductive layer covering the sealing resin and electrically connected to the ground electrode, and a magnetic member. The magnetic member includes a magnetic plate member arranged so as to cover at least a part of the sealing resin and a magnetic wall member arranged in a wall shape between any of the plurality of electronic components. The module is further provided with a metal pin or a metal wire provided along the magnetic wall member and connected to the ground electrode. | 2021-07-01 |
20210204457 | COMPONENT SUPPLY DEVICE AND TAPE FEEDER - A component supply device includes a plurality of kinds of tape feeders capable of mounting a first component storing tape by which supplying of components is performed precedingly, and a second component storing tape by which supplying of components is performed succeedingly; a component sensor configured to detect runout of the components in the first component storing tape; and a control unit configured to control a tape feeding operation. A specified discharge length by which the first component storing tape is discharged at the time of occurrence of the runout of the components is preliminarily set for each kind of the tape feeder. The control unit is configured to make the tape feeder perform a tape feeding operation for feeding the first component storing tape by the specified discharge length when the component sensor detects the runout of the components in the first component storing tape. | 2021-07-01 |
20210204458 | SYCAMORE PLANT NAMED DRABROT - A new variety of | 2021-07-01 |
20210204459 | Buddleia Plant Named 'SRPbudroy' - A new and distinct variety of | 2021-07-01 |