29th week of 2020 patent applcation highlights part 57 |
Patent application number | Title | Published |
20200227238 | Systems And Methods For Controlling Directionality Of Ions In An Edge Region By Using An Electrode Within A Coupling Ring | 2020-07-16 |
20200227239 | Electrostatic Shield for Inductive Plasma Sources | 2020-07-16 |
20200227240 | METHOD OF CONTROLLING UNIFORMITY OF PLASMA AND PLASMA PROCESSING SYSTEM | 2020-07-16 |
20200227241 | PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | 2020-07-16 |
20200227242 | THERMAL REPEATABILITY AND IN-SITU SHOWERHEAD TEMPERATURE MONITORING | 2020-07-16 |
20200227243 | METHODS FOR THERMALLY CALIBRATING REACTION CHAMBERS | 2020-07-16 |
20200227244 | Optimizing Quadrupole Collision Cell RF Amplitude for Tandem Mass Spectrometry | 2020-07-16 |
20200227245 | METHOD FOR IONIZING GASEOUS SAMPLES BY MEANS OF A DIELECTRIC BARRIER DISCHARGE AND FOR SUBSEQUENTLY ANALYZING THE PRODUCED SAMPLE IONS IN AN ANALYSIS APPLIANCE | 2020-07-16 |
20200227246 | TIME-OF-FLIGHT MASS SPECTROMETER | 2020-07-16 |
20200227247 | MASS ANALYZER | 2020-07-16 |
20200227248 | Light Bulb Changing Device | 2020-07-16 |
20200227249 | METHODS FOR IMPROVED SILICON NITRIDE PASSIVATION FILMS | 2020-07-16 |
20200227250 | METHOD AND APPARATUS FOR FILLING A GAP | 2020-07-16 |
20200227251 | ENGINEERED SUBSTRATE STRUCTURES FOR POWER AND RF APPLICATIONS | 2020-07-16 |
20200227252 | METHOD OF FORMING FILM ON SUBSTRATE AND METHOD OF MANUFACTURING LIQUID EJECTION HEAD | 2020-07-16 |
20200227253 | SUPERCRITICAL DRYING APPARATUS AND METHOD OF DRYING SUBSTRATE USING THE SAME | 2020-07-16 |
20200227254 | CONDENSER SYSTEM FOR HIGH PRESSURE PROCESSING SYSTEM | 2020-07-16 |
20200227255 | METHOD FOR POROSIFYING A MATERIAL AND SEMICONDUCTOR STRUCTURE | 2020-07-16 |
20200227256 | STEAM OXIDATION INITIATION FOR HIGH ASPECT RATIO CONFORMAL RADICAL OXIDATION | 2020-07-16 |
20200227257 | SEMICONDUCTOR DEVICE OR DISPLAY DEVICE INCLUDING THE SAME | 2020-07-16 |
20200227258 | METHOD OF FORMING FILM STACKS WITH REDUCED DEFECTS | 2020-07-16 |
20200227259 | BASE SUBSTRATE, FUNCTIONAL ELEMENT, AND METHOD FOR MANUFACTURING BASE SUBSTRATE | 2020-07-16 |
20200227260 | SELECTIVE GROWTH OF METAL-CONTAINING HARDMASK THIN FILMS | 2020-07-16 |
20200227261 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | 2020-07-16 |
20200227262 | CRYSTAL LAMINATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2020-07-16 |
20200227263 | Device Substrate With High Thermal Conductivity And Method Of Manufacturing The Same | 2020-07-16 |
20200227264 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2020-07-16 |
20200227265 | SILICIDE FILMS THROUGH SELECTIVE DEPOSITION | 2020-07-16 |
20200227266 | ADVANCED ETCHING TECHNOLOGIES FOR STRAIGHT, TALL AND UNIFORM FINS ACROSS MULTIPLE FIN PITCH STRUCTURES | 2020-07-16 |
20200227267 | MID-PROCESSING REMOVAL OF SEMICONDUCTOR FINS DURING FABRICATION OF INTEGRATED CIRCUIT STRUCTURES | 2020-07-16 |
20200227268 | INDIUM PHOSPHIDE WAFER HAVING PITS ON THE BACK SIDE, METHOD AND ETCHING SOLUTION FOR MANUFACTURING THE SAME | 2020-07-16 |
20200227269 | METHOD OF FORMING DIELECTRIC LAYER BY ORGANIC DIELECTRIC LAYER | 2020-07-16 |
20200227270 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | 2020-07-16 |
20200227271 | METHOD OF ETCHING A DIELECTRIC LAYER | 2020-07-16 |
20200227272 | Interconnect Structure with Porous Low K Film | 2020-07-16 |
20200227273 | HARD MASK AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2020-07-16 |
20200227274 | WET ETCHING OF SAMARIUM SELENIUM FOR PIEZOELECTRIC PROCESSING | 2020-07-16 |
20200227275 | Methods Of Etching Metal Oxides With Less Etch Residue | 2020-07-16 |
20200227276 | METHODS OF ETCHING METAL-CONTAINING LAYERS | 2020-07-16 |
20200227277 | INTERPOSER WITH MANGANESE OXIDE ADHESION LAYER | 2020-07-16 |
20200227278 | Method of Forming a Layer Structure, Layer Structure, Method of Forming a Contact Structure, Method of Forming a Chip Package, and Chip Package | 2020-07-16 |
20200227279 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-07-16 |
20200227280 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2020-07-16 |
20200227281 | HEATING OF A SUBSTRATE FOR EPOXY DEPOSITION | 2020-07-16 |
20200227282 | MOLDED PACKAGE | 2020-07-16 |
20200227283 | APPARATUS AND METHOD FOR HANDLING WAFER CARRIER DOORS | 2020-07-16 |
20200227284 | METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES | 2020-07-16 |
20200227285 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD | 2020-07-16 |
20200227286 | PROCESSING LIQUID SUPPLYING APPARATUS AND PROCESSING LIQUID SUPPLYING METHOD | 2020-07-16 |
20200227287 | PROCESSING APPARATUS | 2020-07-16 |
20200227288 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | 2020-07-16 |
20200227289 | PLASMA PROCESSING METHOD, PLASMA PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE APPARATUS | 2020-07-16 |
20200227290 | SUBSTRATE PROCESSING APPARATUS | 2020-07-16 |
20200227291 | MEMBER FOR SEMICONDUCTOR MANUFACTURING APPARATUS | 2020-07-16 |
20200227292 | PEELING APPARATUS | 2020-07-16 |
20200227293 | PROCESSING APPARATUS | 2020-07-16 |
20200227294 | OPTICAL STACK DEPOSITION AND ON-BOARD METROLOGY | 2020-07-16 |
20200227295 | PURGE DEVICE, PURGE STOCKER, AND PURGE METHOD | 2020-07-16 |
20200227296 | Interface Device for a Purging Unit for Purging a Wafer Container | 2020-07-16 |
20200227297 | A SILICON WAFER PRINTING MACHINE | 2020-07-16 |
20200227298 | METHOD FOR ALIGNMENT, PROCESS TOOL AND METHOD FOR WAFER-LEVEL ALIGNMENT | 2020-07-16 |
20200227299 | METHOD AND DEVICE FOR ALIGNMENT OF SUBSTRATES | 2020-07-16 |
20200227300 | ELECTROSTATIC CHUCK AND ELECTROSTATIC CHUCK APPARATUS INCLUDING THE SAME | 2020-07-16 |
20200227301 | MOUNTING OF SEMICONDUCTOR-ON-DIAMOND WAFERS FOR DEVICE PROCESSING | 2020-07-16 |
20200227302 | STRUCTURE AND METHOD FOR TRANSFERRING A MICRO SEMICONDUCTOR ELEMENT | 2020-07-16 |
20200227303 | WORKPIECE UNIT | 2020-07-16 |
20200227304 | PLANAR SUBSTRATE EDGE CONTACT WITH OPEN VOLUME EQUALIZATION PATHWAYS AND SIDE CONTAINMENT | 2020-07-16 |
20200227305 | DIELECTRIC ISOLATION FOR NANOSHEET DEVICES | 2020-07-16 |
20200227306 | FIN STRUCTURES WITH BOTTOM DIELECTRIC ISOLATION | 2020-07-16 |
20200227307 | INTERCONNECT STRUCTURES WITH AIRGAPS ARRANGED BETWEEN CAPPED INTERCONNECTS | 2020-07-16 |
20200227308 | INTERCONNECT STRUCTURES WITH AIRGAPS AND DIELECTRIC-CAPPED INTERCONNECTS | 2020-07-16 |
20200227309 | SEMICONDUCTOR DEVICE HAVING A RADIO FREQUENCY CIRCUIT AND A METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | 2020-07-16 |
20200227310 | Packages with Through-Vias Having Tapered Ends | 2020-07-16 |
20200227311 | METHOD, ATOMIC FORCE MICROSCOPY SYSTEM AND COMPUTER PROGRAM PRODUCT | 2020-07-16 |
20200227312 | SEMICONDUCTOR DEVICES INCLUDING ADHESION PROMOTING STRUCTURES AND METHODS FOR MANUFACTURING THEREOF | 2020-07-16 |
20200227313 | Forming Barrierless Contact | 2020-07-16 |
20200227314 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES | 2020-07-16 |
20200227315 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2020-07-16 |
20200227316 | Method for Forming Interconnect Structure | 2020-07-16 |
20200227317 | ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE | 2020-07-16 |
20200227318 | CAVITY-DISRUPTING BACKSIDE TRENCH FILL STRUCTURES FOR A THREE-DIMENSIONAL MEMORY DEVICE AND METHOD OF MAKING THE SAME | 2020-07-16 |
20200227319 | WORKPIECE CUTTING METHOD | 2020-07-16 |
20200227320 | FORMATION OF EPI SOURCE/DRAIN MATERIAL ON TRANSISTOR DEVICES AND THE RESULTING STRUCTURES | 2020-07-16 |
20200227321 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | 2020-07-16 |
20200227322 | DIFFERING DEVICE CHARACTERISTICS ON A SINGLE WAFER BY SELECTIVE ETCH | 2020-07-16 |
20200227323 | ISOLATION STRUCTURES OF FINFET SEMICONDUCTOR DEVICES | 2020-07-16 |
20200227324 | TRANSISTOR WITH STRAINED CHANNEL AND FABRICATION METHOD THEREOF | 2020-07-16 |
20200227325 | METHOD FOR FORMING A SEMICONDUCTOR DEVICE STRUCTURE AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | 2020-07-16 |
20200227326 | PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | 2020-07-16 |
20200227327 | Substrates, Structures Within A Scribe-Line Area Of A Substrate, And Methods Of Forming A Conductive Line Of A Redistribution Layer Of A Substrate And Of Forming A Structure Within A Scribe-Line Area Of The Substrate | 2020-07-16 |
20200227328 | ELECTRONIC DEVICE PACKAGE WITH BOARD LEVEL RELIABILITY | 2020-07-16 |
20200227329 | SEMICONDUCTOR DEVICE | 2020-07-16 |
20200227330 | SUBSTRATES FOR SEMICONDUCTOR PACKAGES | 2020-07-16 |
20200227331 | Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices | 2020-07-16 |
20200227332 | THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES | 2020-07-16 |
20200227333 | Power Semiconductor Device and Power Conversion Apparatus Including the Same | 2020-07-16 |
20200227334 | SEMICONDUCTOR ARRANGEMENT | 2020-07-16 |
20200227335 | PACKAGE WITH A HIGHLY CONDUCTIVE LAYER DEPOSITED ON DIE USING THROUGHPUT ADDITIVE DEPOSITION PRIOR TO TIM1 DISPENSE | 2020-07-16 |
20200227336 | PACKAGE WITH THERMAL INTERFACE MATERIAL RETAINING STRUCTURES ON DIE AND HEAT SPREADER | 2020-07-16 |
20200227337 | THERMALLY CONDUCTIVE SHEET | 2020-07-16 |