29th week of 2019 patent applcation highlights part 55 |
Patent application number | Title | Published |
20190221418 | SYSTEMS AND METHODS FOR QUANTIFYING AN ANALYTE EXTRACTED FROM A SAMPLE | 2019-07-18 |
20190221419 | METHOD AND FOUR-DIMENSIONAL MICROSCOPE FOR MEASURING INTERFACIAL PHOTOELECTRON TRANSFER AND PHOTO-CATALYTIC ACTIVITIES OF MATERIALS | 2019-07-18 |
20190221420 | NANO-GAS LIGHT SOURCES BASED ON GRAPHENE FOR DISPLAYS | 2019-07-18 |
20190221421 | IMPRINT APPARATUS, IMPRINT METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221422 | SELECTIVELY DEPOSITED PARYLENE MASKS AND METHODS RELATED THERETO | 2019-07-18 |
20190221423 | WET STRIPPABLE OPL USING REVERSIBLE UV CROSSLINKING AND DE-CROSSLINKING | 2019-07-18 |
20190221424 | Method and Apparatus for Forming a Thin Layer | 2019-07-18 |
20190221425 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 2019-07-18 |
20190221426 | Amorphous Silicon Doped Yttrium Oxide Films And Methods of Formation | 2019-07-18 |
20190221427 | ARGON ADDITION TO REMOTE PLASMA OXIDATION | 2019-07-18 |
20190221428 | SELF-ALIGNED PATTERNING METHODS WHICH IMPLEMENT DIRECTED SELF-ASSEMBLY | 2019-07-18 |
20190221429 | METHODS OF MANUFACTURING THIN FILM TRANSISTOR, ARRAY SUBSTRATE AND DISPLAY DEVICE | 2019-07-18 |
20190221430 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2019-07-18 |
20190221431 | Gate Isolation Plugs Structure and Method | 2019-07-18 |
20190221432 | SUBSTRATE PROCESSING APPARATUS | 2019-07-18 |
20190221433 | METHOD FOR DEPOSITING A MATERIAL FILM ON A SUBSTRATE WITHIN A REACTION CHAMBER BY A CYCLICAL DEPOSITION PROCESS AND RELATED DEVICE STRUCTURES | 2019-07-18 |
20190221434 | TUNGSTEN FILM FORMING METHOD, FILM FORMING SYSTEM AND FILM FORMING APPARATUS | 2019-07-18 |
20190221435 | METHOD OF MANUFACTURING BONDED WAFER | 2019-07-18 |
20190221436 | PLANARIZATION METHOD | 2019-07-18 |
20190221437 | ETCHING APPARATUS AND METHODS | 2019-07-18 |
20190221438 | CATALYST-ASSISTED CHEMICAL ETCHING WITH A VAPOR-PHASE ETCHANT | 2019-07-18 |
20190221439 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE BY THE SAME | 2019-07-18 |
20190221440 | Etching Method and Etching Apparatus | 2019-07-18 |
20190221441 | METHODS FOR ETCHING A HARDMASK LAYER | 2019-07-18 |
20190221442 | Pre-Heat Processes for Millisecond Anneal System | 2019-07-18 |
20190221443 | CONDUCTING WIRE PROCESS ARRAY ETCHING METHOD | 2019-07-18 |
20190221444 | PRINTED CIRCUIT BOARD WITH PROTECTIVE MEMBER AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING THE SAME | 2019-07-18 |
20190221445 | 3D Packages and Methods for Forming the Same | 2019-07-18 |
20190221446 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2019-07-18 |
20190221447 | HIGH DENSITY ORGANIC INTERCONNECT STRUCTURES | 2019-07-18 |
20190221448 | REDISTRIBUTION SYSTEM WITH DENSE PITCH AND COMPLEX CIRCUIT STRUCTURES IN MULTI-LAYERED HOMOGENEOUS STRUCTURE AND A METHOD OF MANUFACTURING THEREOF | 2019-07-18 |
20190221449 | Semiconductor Module and Method for Producing the Same | 2019-07-18 |
20190221450 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | 2019-07-18 |
20190221451 | SUBSTRATE SUPPORT DEVICE AND SUBSTRATE CLEANING DEVICE INCLUDING THE SAME | 2019-07-18 |
20190221452 | PROCESSING APPARATUS | 2019-07-18 |
20190221453 | SUBSTRATE PROCESSING APPARATUS | 2019-07-18 |
20190221454 | DEGASSING CHAMBER AND SEMICONDUCTOR PROCESSING APPARATUS | 2019-07-18 |
20190221455 | APPARATUS FOR TREATING SUBSTRATE | 2019-07-18 |
20190221456 | SELECTIVE AND MULTILEVEL SOLDER PASTE PIN TRANSFER | 2019-07-18 |
20190221457 | SUBSTRATE TREATING APPARATUS | 2019-07-18 |
20190221458 | ADVANCED TEMPERATURE MONITORING SYSTEM AND METHODS FOR SEMICONDUCTOR MANUFACTURE PRODUCTIVITY | 2019-07-18 |
20190221459 | ENHANCED SELENIUM SUPPLY IN COPPER INDIUM GALLIUM SELENIDE PROCESSES | 2019-07-18 |
20190221460 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221461 | PATTERN FORMING APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221462 | Substrate Breakage Detection in a Thermal Processing System | 2019-07-18 |
20190221463 | PROCESS KIT COMPONENTS FOR USE WITH AN EXTENDED AND INDEPENDENT RF POWERED CATHODE SUBSTRATE FOR EXTREME EDGE TUNABILITY | 2019-07-18 |
20190221464 | ELECTROSTATIC CHUCKING METHOD AND SUBSTRATE PROCESSING APPARATUS | 2019-07-18 |
20190221465 | Method of Forming a Chip Arrangement, Chip Arrangement, Method of Forming a Chip Package, and Chip Package | 2019-07-18 |
20190221466 | TRANSFER METHOD, MOUNTING METHOD, TRANSFER DEVICE, AND MOUNTING DEVICE | 2019-07-18 |
20190221467 | APPARATUS FOR FIXING OBJECTS BY MEANS OF VACUUM | 2019-07-18 |
20190221468 | Substrate Processing Apparatus | 2019-07-18 |
20190221469 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2019-07-18 |
20190221470 | METHOD FOR MANUFACTURING BONDED SOI WAFER | 2019-07-18 |
20190221471 | METHOD FOR TRANSFERRING A USEFUL LAYER | 2019-07-18 |
20190221472 | DEVICES AND METHODS OF FORMING THEREOF BY POST SINGLE LAYER TRANSFER FABRICATION OF DEVICE ISOLATION STRUCTURES | 2019-07-18 |
20190221473 | SKIP VIA STRUCTURES | 2019-07-18 |
20190221474 | MERGE MANDREL FEATURES | 2019-07-18 |
20190221475 | SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221476 | ELEMENT ISOLATION LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2019-07-18 |
20190221477 | LOW-RESISTIVITY METALLIC INTERCONNECT STRUCTURES WITH SELF-FORMING DIFFUSION BARRIER LAYERS | 2019-07-18 |
20190221478 | DECOUPLED VIA FILL | 2019-07-18 |
20190221479 | MANUFACTURING PROCESS OF ELEMENT CHIP | 2019-07-18 |
20190221480 | METHOD OF PROCESSING A WAFER | 2019-07-18 |
20190221481 | Methods for Splitting Semiconductor Devices and Semiconductor Device | 2019-07-18 |
20190221482 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221483 | SINGLE WORK FUNCTION ENABLEMENT FOR SILICON NANOWIRE DEVICE | 2019-07-18 |
20190221484 | THREE-DIMENSIONAL STACKED VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR LOGIC GATE WITH BURIED POWER BUS | 2019-07-18 |
20190221485 | TEST CONDITION DETERMINING APPARATUS AND TEST CONDITION DETERMINING METHOD | 2019-07-18 |
20190221486 | INSPECTION SYSTEM AND INSPECTION METHOD | 2019-07-18 |
20190221487 | SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221488 | MODULE INSTALLATION ON PRINTED CIRCUIT BOARDS WITH EMBEDDED TRACE TECHNOLOGY | 2019-07-18 |
20190221489 | INSULATING SUBSTRATE AND SEMICONDUCTOR DEVICE USING SAME | 2019-07-18 |
20190221490 | ELECTRONIC DEVICE | 2019-07-18 |
20190221491 | ELECTRICAL CONNECTOR EQUIPPED WITH CLIP | 2019-07-18 |
20190221492 | PROCESSOR SOCKET ASSEMBLY AND CARRIER THEREOF | 2019-07-18 |
20190221493 | HIGH POWER MODULE SEMICONDUCTOR PACKAGE WITH MULTIPLE SUBMODULES | 2019-07-18 |
20190221494 | SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221495 | Method and Apparatus of Operating a Compressible Thermal Interface | 2019-07-18 |
20190221496 | SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221497 | HOLDING DEVICE FOR SEMICONDUCTOR ELEMENT, AND POWER CONVERSION DEVICE USING HOLDING DEVICE | 2019-07-18 |
20190221498 | ADHESIVE SEALING OF THERMAL INTERFACE MATERIALS | 2019-07-18 |
20190221499 | HEAT MANAGEMENT SYSTEM | 2019-07-18 |
20190221500 | PACKAGED POWER DEVICE HAVING IMPROVED HEAT DISSIPATION CAPACITY AND BETTER THERMAL PERFORMANCES | 2019-07-18 |
20190221501 | METHOD OF PRODUCING HEAT-DISSIPATING UNIT | 2019-07-18 |
20190221502 | Down Bond in Semiconductor Devices | 2019-07-18 |
20190221503 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-07-18 |
20190221504 | SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221505 | SUBSTRATE-WITH-SUPPORT | 2019-07-18 |
20190221506 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2019-07-18 |
20190221507 | SEMICONDUCTOR DEVICE MOUNTING BOARD AND SEMICONDUCTOR PACKAGE | 2019-07-18 |
20190221508 | WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE | 2019-07-18 |
20190221509 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-07-18 |
20190221510 | BONDING OF LAMINATES WITH ELECTRICAL INTERCONNECTS | 2019-07-18 |
20190221511 | COIL BUILT-IN MULTILAYER SUBSTRATE AND POWER SUPPLY MODULE | 2019-07-18 |
20190221512 | SEMICONDUCTOR PACKAGE HAVING A CIRCUIT PATTERN | 2019-07-18 |
20190221513 | SEMICONDUCTOR PACKAGE | 2019-07-18 |
20190221514 | SEMICONDUCTOR DEVICE INCLUDING SWITCH CELLS | 2019-07-18 |
20190221515 | METAL-INSULATOR-METAL CAPACITORS WITH ENLARGED CONTACT AREAS | 2019-07-18 |
20190221516 | THIN FILM RESISTOR WITH PUNCH-THROUGH VIAS | 2019-07-18 |
20190221517 | SEMICONDUCTOR DEVICE | 2019-07-18 |