31st week of 2015 patent applcation highlights part 75 |
Patent application number | Title | Published |
20150215983 | TRANSMISSION DEVICES, RECEIVING DEVICES AND METHODS OF SHARING DATA - A transmission device, a receiving device and a method of sharing data are provided. The transmission device includes a touch-display module which includes one or a plurality of display areas, wherein each of the display areas displays a respective display result corresponding to the same or different applications; a link module which is configured to establish a touch link with one or a plurality of receiving devices through the touch-display module; a judgment module which is configured to determine the display area which the receiving device is in physical proximity to, to generate the judgment information; a management module which is configured to generate application information according to the judgment information; and a sending module, configured to transmit the application information to the receiving device through the touch-display module. | 2015-07-30 |
20150215984 | COMMUNICATION TERMINAL DEVICE, COMMUNICATION DEVICE, COMMUNICATION NETWORK SERVER AND METHOD FOR CONTROLLING - In various aspects of this disclosure, a communication terminal device may be provided. The communication terminal device may include a cellular wide area radio communication technology circuit. The cellular wide area radio communication technology circuit may be configured to provide a communication according to a cellular wide area radio communication technology. The communication terminal device may further include a circuit. The circuit may be configured to provide a direct communication terminal device to communication terminal device communication bypassing a radio access network according to information received via the radio access network. The communication terminal device may further include a message generator. The message generator may be configured to generate a message to transmit to a base station. The message may include at least one message field specifying information about at least one capability to provide the direct communication terminal device to communication terminal device communication of the communication terminal device. The message may be generated for a network communication protocol. | 2015-07-30 |
20150215985 | DIGITAL MULTIMETER HAVING REMOTE DISPLAY WITH AUTOMATIC COMMUNICATION BINDING - A method of automatically binding first and second devices for RF communication is disclosed. One step of the method involves establishing a secure, non-RF communication mode between the first and second devices. According to another step, first and second communication addresses respectively identifying the first and second devices are exchanged in the secure, non-RF communication mode such that the first and second devices will recognize each other as communication partners. The secure, non-RF communication mode is then terminated and an RF communication mode is established between the first and second devices as a first bound pair. | 2015-07-30 |
20150215986 | VEHICLE TELEMATICS CONNECTION RETRY - A method of re-establishing a cellular connection between a vehicle telematics unit and a wireless carrier system includes detecting a loss of cellular connection between a vehicle telematics unit and a wireless carrier system; accessing a technology order table (TOT) that orders a plurality of radio access technologies (RATs) capable of use at the vehicle telematics unit according to desirability; attempting to re-establish the cellular connection by: determining the RAT used by the vehicle telematics unit when the loss of cellular connection was detected; searching the TOT to locate a less desirable RAT relative to the RAT used by the vehicle telematics unit when the loss of cellular connection was detected; attempting to connect with the wireless carrier system using the less desirable RAT and a group of PLMNs that is limited to home and home-equivalent PLMNs; and if that attempt fails, attempting to connect with the wireless carrier system by iterating through each of the RATs ordered in the TOT beginning with a next less desirable RAT and including in the iteration the RAT used by the vehicle telematics unit when the loss of cellular connection was detected, wherein step (c4) uses all non-forbidden PLMNs. | 2015-07-30 |
20150215987 | METHOD AND APPARATUS FOR TRANSMITTING AND RECEIVING DATA USING A PLURALITY OF CARRIERS IN MOBILE COMMUNICATION SYSTEM - A bearer reconfiguration method performed by a User Equipment (UE) in a wireless communication system supporting a multi-bearer is provided. The bearer reconfiguration method includes, if the UE performs a bearer reconfiguration from a single bearer to the multi-bearer, reordering Packet Data Convergence Protocol (PDCP) Protocol Data Units (PDUs) received through the multi-bearer, using a timer after a completion of the bearer reconfiguration, and processing the reordered PDCP PDUs into at least one PDCP Service Data Unit (SDU). The method may also include, if the UE performs bearer reconfiguration from the multi-bearer to the single bearer, reordering PDCP PDUs received through the multi-bearer, using a timer until a predetermined condition is satisfied, and processing the reordered PDCP PDUs into at least one PDCP SDU. | 2015-07-30 |
20150215988 | MOBILE STATION - To avoid a situation where a MAC layer function and a physical layer function have state inconsistencies, i.e., the MAC layer function recognizes that a certain uplink signal has been transmitted while the physical layer function has not actually transmitted the uplink signal. In a mobile station UE according to the present invention, a layer | 2015-07-30 |
20150215989 | TECHNIQUES AND SYSTEMS FOR EXTENDED DISCONTINUOUS RECEPTION - Embodiments of techniques and systems for extended discontinuous reception (DRX) are described herein. In some embodiments, a user equipment (UE) configured for extended DRX may include receiver circuitry and paging circuitry. The receiver circuitry may be configured to receive a system frame number from an eNB and receive extension data from the eNB. The paging circuitry may be configured to determine an augmented system frame number based on the system frame number and the extension data, determine a paging frame number based on the extension data, and monitor for paging occasions when the augmented system frame number is equal to the paging frame number. Other embodiments may be described and/or claimed. | 2015-07-30 |
20150215990 | METHOD FOR SUPPORTING COMMUNICATION USING TWO OR MORE RADIO ACCESS TECHNOLOGIES AND APPARATUS FOR SAME - A method for supporting communication using two or more heterogeneous radio access technologies (RAT) includes the steps of: the terminal receiving a first message that includes whether to provide support to simultaneous access two or more RATs and parameters requesting that a notification be provided for the supported RAT from a base station in a first RAT network supporting a first RAT; transmitting, to the base station in the first RAT network, a second message including an indicator indicating whether to support simultaneous access to the two or more RAT networks and information on a supported RAT network type in response to the first message, wherein the supported second RAT network type corresponds to a network that is different from the first RAT network. | 2015-07-30 |
20150215991 | COMMUNICATIONS ASSEMBLY AND APPARATUS - A communications assembly, comprising a first device ( | 2015-07-30 |
20150215992 | ELECTRICAL RESISTOR HEATING - Electrical resistor heating with an electrical resistor heating circuitry which includes an AC power source of at least one phase, a plurality of heating resistors provided in a spatial arrangement, and switches to connect the AC power source with the heating resistors generating ON and OFF power states. Power scheduling is provided to adjust the power fed from the AC power source to the heating resistors at a desired partial-power level by ON/OFF switching a number of switches, wherein the power scheduling causes at least some of the switches to switch between the ON and OFF states in a staggered manner so that energization of the partial-power level of different resistors takes place, at least partially, non-simultaneously. | 2015-07-30 |
20150215993 | CORDLESS HANDHELD HEATER - A cordless heating tool, including a housing, a battery coupled to the housing, a heat source, a control circuit for controlling power of the heat source, one or more reflectors mounted on the housing to focus radiant energy from the heat source toward a focal region, an opening in the housing for receiving an object to be heated in the focal region. | 2015-07-30 |
20150215994 | HEAT GENERATING ELEMENT - A heat generating element for an electrical heating device of a motor vehicle, including at least one PTC element and two contact plates which are in contact with opposite sides of the PTC element and are provided on their outer side facing away from the PTC element with an insulating layer. Shielding is provided, comprising a first shell-like shielding plate and a second shell-like shielding plate which are each provided on the outer side of the insulating layer and are connected thereto in a thermally conductive manner. The longitudinal wall sections, directed towards one another, of the first and second shielding plate form an overlapping region. In order to reduce EMC problems, two shielding plates are sealed by way of an adhesive which is received in one of the two shielding plates and into which the end of a rim of the other shielding plate dips. | 2015-07-30 |
20150215995 | INDUCTION HEATING CONTAINER - To provide an induction heating container that can be used safely in which bumping that occurs when a liquid object to be heated such as water or soup accommodated therein is heated by an electromagnetic cooker is effectively suppressed, thereby preventing a user from getting burned or the surrounding area of the electromagnetic cooker from being contaminated. This induction heating container | 2015-07-30 |
20150215996 | MICROWAVE HEATING DEVICE AND FIRING FACILITY - A microwave heating device which enables use of a conveyor with a metallic belt is provided, as is a baking facility having the device. The device includes a conveying means for conveying objects to be heated; a microwave generating means for emitting microwaves to the objects to be heated conveyed by the conveying means; a rotating member that is provided between the objects to be heated and the microwave generating means, and that has a rotary vane configured to reflect the microwaves emitted from the microwave generating means; and a shielding member configured to reflect the microwaves, provided between the rotating member and the objects to be heated. The conveying means has a metallic holding member for holding the objects to be heated, and the shielding member has a microwave transmitting unit for transmitting the microwaves. The microwave transmitting unit extends in a direction orthogonal to the conveyance direction of the objects to be heated conveyed by the conveying means. | 2015-07-30 |
20150215997 | DEVICE AND METHOD FOR REDUCING NETWORK REACTIONS WHEN AN ELECTRIC ARC FURNACE IS IN OPERATION - Disclosed is a device and method for reducing network feedback during operation of an electric-arc furnace ( | 2015-07-30 |
20150215998 | DEVICE AND METHOD FOR CONTROLLING AN ELECTRIC ARC FURNACE IN THE INITIAL PHASE OF A MELTING PROCESS - Disclosed is a device and a method for regulating an electric arc furnace ( | 2015-07-30 |
20150215999 | METHOD OF DRIVING A LIGHT EMITTING DEVICE - The present invention is characterized in that a transistor with its L/W set to 10 or larger is employed, and that |V | 2015-07-30 |
20150216000 | COMBINATION SOLAR/LOW-VOLTAGE LIGHTING APPARATUS - A lighting apparatus includes a housing, a plurality of lighting elements coupled to the housing, wherein a first subset of the plurality of lighting elements is powered by a solar power source and a second subset of the plurality of lighting elements is powered by a low-voltage electrical power source, and a switch for selectively switching between operation of the first subset and the second subset. | 2015-07-30 |
20150216001 | An LED Lighting System - An LED lighting system comprises: lighting blocks; and one or more switches, wherein electrical connections between the lighting blocks are configured using the one or more switches, and wherein the one or more switches are operated as a function of an input voltage. Based upon the input voltage to the LED lighting system, the electrical connections of the lighting blocks can be configured accordingly. | 2015-07-30 |
20150216002 | LOW-COST LOW-POWER LIGHTING SYSTEM AND LAMP ASSEMBLY - In accordance with embodiments of the present disclosure, a method and apparatus may include receiving an input waveform from a dimmer, wherein the input waveform is periodic at a first frequency. The method and apparatus may also include generating an output waveform independent of a load coupled to the output waveform, wherein the output waveform is periodic at a second frequency substantially greater than the first frequency, wherein at least one of the second frequency and an amplitude of the output waveform is based on a phase-cut angle of the input waveform indicative of a control setting of the dimmer. | 2015-07-30 |
20150216003 | Anti-Flickering LED Lighting System - An LED lighting system has anti-flickering capabilities. The LED lighting system comprises: a rectifier, wherein the rectifier generates a rectified input voltage; a lighting block; and an energy storage device (“ESD”) for generating a first voltage, wherein if the rectified voltage is less than a predefined threshold voltage, the generated first voltage is applied to the lighting block, else, the rectified input voltage is applied to the lighting block and to the ESD. | 2015-07-30 |
20150216004 | Multiple Stage Sequential Current Regulator - An LED driver circuit for controlling direct current supplied to a plurality of serially connected segments of Light Emitting Diodes (LEDs) is disclosed. In one embodiment, the LED driver circuit comprises a self-commutating circuit, which comprises a plurality of current control elements, each current control element having two ends, a first end connected to a different end of each segment along the plurality of serially connected segments of LEDs and a second end connected to a path to ground. The path to ground comprises a sense resistor and the path to ground is shared by the second end of each current control element. Each current control element is coupled to an adjacent current control element by a cross-regulation circuit and controlled by a signal from an adjacent current control element. | 2015-07-30 |
20150216005 | LIGHT STRING - An electrical circuit for use as a string of lights is provided with a load including a plurality of lamps connected in series, the lamps including a plurality of LEDs and a plurality of incandescent light bulbs, and a plurality of electrical resistors connected in series, the electrical resistors being in parallel with the lamps. The load is activated by a source of AC. The LEDs are alternate with the incandescent light bulbs. | 2015-07-30 |
20150216006 | MULTI-STAGE LED LIGHTING SYSTEMS - Multi-stage LED drivers and lighting systems are disclosed. The lighting system comprises a bridge rectifier receiving power from an AC power line source, two or more current limiting devices, and a string of LEDs having a corresponding number of LED lamps connected in electrical series. Each of the current limiting devices is coupled to and provides current to the corresponding LED. When the instantaneous voltage of the alternating current source is near zero volts, no significant current flows through the string of LEDs. As the instantaneous voltage from the bridge rectifier increases beyond the forward voltages of the LEDs in the string, the current limiting devices energize and provide current to the corresponding LEDs as well as the LEDs connected to the cathode of the corresponding LED. The equivalent circuits of the lighting system vary throughout the power cycle of the AC line power source. | 2015-07-30 |
20150216007 | CONTROL CIRCUIT FOR REDUCING OF TOTAL HARMONIC DISTORTION (THD) IN THE POWER SUPPLY TO AN ELECTRIC LOAD - A control circuit for reducing Total Harmonic Distortion (THD) in the power supply to an electric load, includes an input stage ( | 2015-07-30 |
20150216008 | METHODS AND APPARATUS FOR ADAPTABLE LIGHTING UNIT - Disclosed are methods and apparatus for a lighting unit ( | 2015-07-30 |
20150216009 | Control Methods and Backlight Controllers for Light Dimming - A control method is disclosed for light dimming. A dimming condition signal is provided to represent whether a light emitting device is expected to be emitting light. The duration when the dimming condition signal is at a logic value indicating the light emitting device is emitting light is a dimming-ON time, in which a close loop is provided to make a power converter convert electric energy to the light emitting device such that the light emitting device is capable of emitting light. A power-ON time is the duration when the power converter converts electric energy to the light emitting device. When the dimming-ON time ends and is less than a minimum power-ON time, the power converter continues converting the electric energy to the light emitting device so as to keep the power-ON time not less than the minimum power-ON time. | 2015-07-30 |
20150216010 | Method for Controlling Light-Emitting Diodes - The brightness generated by LEDs in an LED strip is adjusted by pulse-width modulation, wherein the LEDs connected in series are driven temporally offset to one another. If there is a shift in the on-time of at least one LED, a controller inserts at least one additional drive pulse to switch on the LEDs if the interval of the on-times of an LED in the time frame before the shift and in the drive frame after the shift is so large that the interval arising therefrom exceeds a first threshold. Alternatively, the controller reduces at least one drive pulse for switching on the LEDs to curtail the on-time of the LEDs if the interval of the on-times of an LED in the time frame before the shift and in the time frame after the shift is so small that the interval arising therefrom drops below a second threshold. | 2015-07-30 |
20150216011 | Circuit for Driving Lighting Devices - The inventive subject matter provides a circuit and a method for efficiently operating a lighting device, such as a light-emitting diode and a fluorescent lamp. In one aspect of the invention, the circuit includes an oscillator that generates a series of current pulses at a frequency that is at least 50,000 Hz and that corresponds to a resonant frequency of the circuit including the lighting device. The series of pulses is operated at a low duty cycle of no more than 15%. The lighting device has a manufacturer's specification for current consumption and power consumption for a specified luminosity. The circuit provides a current to the lighting device at no more than 1/500 of the manufacturer's specification to produce at least the specified luminosity. The lighting device also operates within the circuit at no more than 50% of the manufacturer's specification to produce the specified luminosity. | 2015-07-30 |
20150216012 | LED ILLUMINATION DIMMING CIRCUIT AND LED ILLUMINATION DIMMING METHOD - An LED illumination dimming circuit comprises a capacitor connected to the first output terminal at a first end thereof and to the second output terminal at a second end thereof; a coil connected to the second end of the capacitor at a first end thereof; a switch element connected to a second end of the coil at a first end thereof; a resistor connected to a second end of the switch element at a first end thereof and to the ground terminal at a second end thereof; a diode connected to the power supply terminal at a cathode thereof and to the second end of the coil at an anode thereof; and a controlling circuit that controls an operation of the switch element with a switch controlling signal. | 2015-07-30 |
20150216013 | TRAILER TAIL LIGHT ADAPTER/CONVERTER - An electrical adapter configured to allow a towing vehicle's standard six wire electrical output connection to be used with a trailer's standard four wire electrical input connection, with the adapter combining electrical signals from the towing vehicle by use of a pair of logic circuits in a manner that results in the trailer's tail lights displaying all desired signals, including simultaneous braking and turning signals, and a converter configured to allow a towing vehicle's standard four wire electrical output connection to be used with a trailer's standard four wire electrical input connection, with the converter combining electrical signals from the towing vehicle by use of a pair of logic circuits in a manner that results in the trailer's tail lights displaying all desired signals, including simultaneous braking and turning signals. | 2015-07-30 |
20150216014 | THEATRICAL EFFECTS CONTROLLER WITH COLOR CORRECTION - Provided is a system for controlling lighting effects. A console transmits primary color parameters to one or more wireless controller devices controlling light sources that mix primary colors. The controller devices adjust the primary color parameters so different sets of light sources controlled by the controller devices produce the same color output when receiving the same primary color parameters. The amount of adjustment may be previously defined by the user based on visually matching the different sets of light sources. | 2015-07-30 |
20150216015 | SELF-ADAPTIVE BRIGHTNESS SENSOR LIGHT, BRIGHTNESS SENSOR MODULE, AND BRIGHTNESS-ADJUSTING METHOD OF THE SAME - A self-adaptive brightness sensor light performs a brightness level adjusting procedure upon activating a lamp body thereof. The brightness level adjusting procedure has steps of acquiring an ambient brightness level, determining if the ambient brightness level is greater than a daytime bright level, and if positive, generating a new daytime brightness level to make it greater than the ambient brightness level, and deactivating the lamp body according to the new daytime brightness level. The daytime brightness level can be automatically adjusted after the lamp body is activated, so as to avoid repeated on-and-off condition of the sensor lights that occur due to immediate deactivation of the sensor light after the sensor light is turned on. | 2015-07-30 |
20150216016 | AMBIENT LIGHT CONTROL IN SOLID STATE LAMPS AND LUMINAIRES - A luminaire comprising a solid-state light source and a photosensitive transducer each operatively coupled to a controller. The photosensitive transducer is oriented to be within an illumination path of the solid-state light source. When the solid-state light source is in an ON state in which at least some light is produced, the controller controls the solid-state light source to be in the OFF state in which no light is produced for a brief measurement period imperceptible to a human. During the measurement period the controller obtains an ambient light level measurement from the photosensitive transducer without interference from the solid-state light source, which is in the OFF state. The controller may record turn ON and turn OFF times of the solid-state light source for use in controlling the solid-state light source in various circumstances. | 2015-07-30 |
20150216017 | SENSOR MODULE FOR A LIGHTING FIXTURE - A sensor module is integrated into a lighting fixture. The sensor module includes one or more environmental sensors and can be readily installed in or removed from the lighting fixture. In one embodiment, a heatsink of the lighting fixture is configured to receive the sensor module. Readings from the environmental sensors may be passed to control electronics associated with the lighting fixture and used to control the light output of the lighting fixture. The readings may also be passed on to other lighting fixtures, which may also use the readings to control their light output. | 2015-07-30 |
20150216018 | METHODS AND APPARATUS FOR LIGHTING UNIT CONFIGURE FOR PRESENCE DETECTION - Methods and apparatus related to a LED-based lighting unit ( | 2015-07-30 |
20150216019 | OUTDOOR LIGHTING FIXTURES CONTROL SYSTEMS AND METHODS - One embodiment of the invention relates to a system for operating a plurality of streetlights in response to motion from a vehicle. The system includes a sensor associated with at least one of the streetlights and configured to detect the presence of a moving vehicle and to provide a signal representative of the moving vehicle. The system further includes a radio frequency transceiver associated with each of the streetlights. The system yet further includes processing electronics configured to receive the signal representative of the moving vehicle from the sensor and to cause the radio frequency transceiver to transmit a command to one or more of the plurality of the streetlights to change lighting states along a pathway for the vehicle. | 2015-07-30 |
20150216020 | LED LAMP - An LED lamp includes LED chips, a translucent cover housing the LED chips, a motion sensor unit, a condensing lens, and a power unit. The motion sensor unit includes a light receiving element for light of a predetermined wavelength. The lens condenses light of the predetermined wavelength onto the light receiving element. The power unit controls the state of operation of the LED chips based on an output from the motion sensor unit. The motion sensor unit includes a light shielding member disposed to overlap the light receiving element in an optical axis direction of the condensing lens and also to surround the light receiving element as viewed in the optical axis direction. The light shielding member is made of a material having a lower light transmissivity than that of the condensing lens for a range of wavelengths including the predetermined wavelength. | 2015-07-30 |
20150216021 | Synchronized Speed Bump Illumination System and Method - A synchronized speed bump illumination system and method is provided that includes powered LEDs that may be seen by individuals at night and in low light conditions, or during the day to increase visibility and direct a driver's attention to the speed bump. The speed bump system comprises sections each with a housing having a flat bottom surface and an elevated top surface to form the bump. A plurality of LEDs provides illumination to light windows embedded in the top surface of the sections. A wireless remote control is used to simultaneously transmit signals to an independent circuit in each section so that the groupings of LEDs in each section provide a predefined illumination pattern among the sections. | 2015-07-30 |
20150216022 | THEATRICAL EFFECTS CONTROLLER - Provided is a system for controlling theatrical effects. The system comprises a console and one or more wireless controller devices. The console transmits wirelessly effects parameters to the wireless controller devices. The controller devices receive the effects parameters, generate output effects parameters using a combination of zero or more of a digital effects engine, a color controller, and/or a router, and provide the output effects parameters to dimmer output channels. The controller device may use an H-bridge to control a bidirectional DC motor driver, an AC inverter, light dimming, and pulse-code-modulation of servo motors. User-adjustable parameters may be available to select the functional mode and characteristics of operation in each mode. | 2015-07-30 |
20150216023 | ELECTRONIC DEVICE FOR CONTROLLING AND POWERING DISCHARGE LAMPS - Electronic device ( | 2015-07-30 |
20150216024 | Electronic Devices Having Electrostatic Discharge Paths - An electronic device may have a display and other electrical components that are sensitive to electrostatic charge. A button may pass through an opening in a layer of the display. A metal trim may surround the button. The housing may have an opening with a clear lens surrounded by a metal trim. To prevent damage from electrostatic discharge, an electrostatic discharge path may be formed in the device that includes a metal trim surrounding a component such as a button member or camera lens, metal traces on the inner surface of a display layer or a housing, a grounded metal housing structure, and a spring or other conductive structure that couples the metal traces to the grounded metal housing structure. Displays may be provided with electrostatic discharge paths that route electrostatic charge to grounded metal housing structures. | 2015-07-30 |
20150216025 | METHOD FOR DRIVING MULTI ELECTRIC FIELD EMISSION DEVICES AND MULTI ELECTRIC FIELD EMISSION SYSTEM - Provided is a method of driving multi electrical field emission devices. The method includes: respectively connecting first current control circuit devices for current path formation to a plurality of electric field emission devices; commonly connecting a second current control circuit device to the first current control circuit devices to commonly control the first current control circuit devices; and driving the first current control circuit devices at different timings when the second current control circuit device is driven. | 2015-07-30 |
20150216026 | Electrode Arrangement for a Barrier Plasma - An electrode arrangement for forming a dielectrically impeded plasma between an active surface of a flexible, planar electrode that can be connected to a high voltage source has a planar, flexible dielectric that forms the active surface which is connected to the planar electrode to form an electrode element where the electrode is completely covered towards to surface to be treated. The electrode arrangement is adaptable to irregular surfaces using a contact with surface elasticity for pressing onto the rear face of the electrode element facing away from the surface such that the electrode element by local deformation is automatically adapted to the irregularities. | 2015-07-30 |
20150216027 | INDUCTION DEVICES AND METHODS OF USING THEM - Certain embodiments described herein are directed to induction devices that can be used to sustain a plasma. In certain configurations, the induction device may comprise one or more radial fins electrically coupled to a base. The induction device may take numerous forms including, for example, coils and plate electrodes. | 2015-07-30 |
20150216028 | APPARATUS FOR ACCELERATING AND COMPRESSING PLASMA - Examples of a plasma acceleration and compression device are described. The device includes a plasma accelerator with a high compression funnel section extending from an inlet of the accelerator and an elongated section connected to the high compression funnel section that can extend from the end of the funnel section to an accelerator's outlet. The funnel section can be a cone with a steep tapering while the elongated section can have a mild, gentle, tapering along its length toward the outlet. The device further includes a power source for providing a current pulse to the accelerator to generate a pushing flux to accelerate and compress a plasma torus throughout the accelerator. The current pulse can be so shaped so that the current pulse behind the plasma torus at the outlet of the elongated section is significantly smaller than the current pulse at the first end of the elongated section while the pressure of the plasma torus at the outlet of the elongated section is greater than the pressure of the plasma torus at the beginning of the elongated section. | 2015-07-30 |
20150216029 | Target for Neutron-Generating Device and Manufacturing Method Therefor - Provided are a long-lived target for a neutron-generating device and a method for manufacturing the target therefore. The target is for a neutron-generating device and includes: a metal substrate retaining a target material; and a metal thin film for sealing that holds the target material at a retention surface X side. The retention surface X side of the metal substrate includes: a frame portion; and an embossed structure including: a plurality of island portions that are surrounded by the frame portion; and the rest recessed portion that is created by decreasing a thickness of a region other than the frame portion and the island portions by a thickness of the target material. The metal thin film and surfaces of the frame portion and the island portions are subjected to hot isostearic pressing (HIP) bonding to seal the target material onto the recessed portion by using the metal thin film. | 2015-07-30 |
20150216030 | Multi-Dimensional Integrated Circuit Structures and Methods of Forming the Same - An embodiment is method comprising attaching a first die and a second die to a first surface of a first interposer using respective ones of first conductive connectors coupled to respective first surfaces of the first die and the second die; attaching a third die and a fourth die to a second surface of the first interposer using respective ones of second conductive connectors, the second surface of the first interposer being opposite the first surface of the interposer; and attaching the first die and the second die to a substrate using respective ones of third conductive connectors coupled to respective second surfaces of the first die and the second die. | 2015-07-30 |
20150216031 | SOLID STATE MEMORY UNIT COOLING APPARATUS - Apparatus for thermally cooling a solid state memory unit, such as but not limited to densely packed flash memory storage devices in a data storage system. In some embodiments, a thermally conductive corrugated plate has one or more corrugations. The corrugations are adapted for positioning adjacent at least one solid state memory unit to form one or more channels for a cooling fluid to flow therethrough. | 2015-07-30 |
20150216032 | COVER STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a cover structure is provided. A metal substrate disposed on a carrier is provided. The carrier has a surface, and the metal substrate has a plurality of openings exposing a portion of the surface. A first metal layer is formed on the metal substrate and is conformal with the metal substrate. The first metal layer covers the portion of the surface exposed by the openings. An insulating layer and a second metal layer located on the insulating layer are laminated on the metal substrate. The insulating layer is located between the first metal layer and the second metal layer to cover the first metal layer and fill the openings. The metal substrate and the carrier are removed to expose the first metal layer and define a plurality of cavity regions and a plurality of connecting regions connected with the cavity regions. | 2015-07-30 |
20150216033 | HIGH FREQUENCY MODULE - A high frequency module includes a ground mounting electrode connected to a ground terminal of a component, a first ground in-plane conductor in a multilayer substrate on a portion under the component and connected to the ground mounting electrode with a first ground interlayer connecting conductor, a signal mounting electrode connected to a signal terminal of the component, and a signal in-plane conductor provided in the multilayer substrate on a portion under the first ground in-plane conductor and connected to the specific signal mounting electrode with a signal interlayer connecting conductor. The first ground in-plane conductor is between the component and the signal in-plane conductor, and the signal interlayer connecting conductor is on an outer side portion of the first ground in-plane conductor when seen from above. | 2015-07-30 |
20150216034 | MULTILAYER WIRING BOARD - A multilayer wiring board including a multilayer body including a plurality of insulating layers includes a ground electrode for external connection disposed in a center of a lower surface of the multilayer body, a plurality of individual electrodes at an outer edge of the lower surface of the multilayer body, and a surface insulating film including an interelectrode insulating portion and a surface covering portion, the interelectrode insulating portion covering an edge portion of the ground electrode to provide insulation between the ground electrode and each of the individual electrodes, the surface covering portion being disposed on a surface of a main body of the ground electrode to divide the surface of the main body into a plurality of regions. | 2015-07-30 |
20150216035 | SEMICONDUCTOR DEVICE - A semiconductor device is provided that is inexpensively manufactured with variation in high-frequency characteristics suppressed. Internal matching circuit boards are disposed on at least one signal transmission path of an input-side signal transmission path between an input terminal and a semiconductor element and an output-side signal transmission path between the semiconductor element and an output terminal and is provided for matching at least between output impedance of an external circuit connected to the input terminal and input impedance of the semiconductor device or between input impedance of an external circuit connected to the output terminal and output impedance of the semiconductor device, and components are electrically connected by at least one wire causing a change exceeding an allowable value in high-frequency characteristics of the semiconductor device due to a change in wire length and are disposed in contact with each other inside a package. | 2015-07-30 |
20150216036 | PRINTED BOARD AND IMAGE FORMING APPARATUS - The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion. | 2015-07-30 |
20150216037 | ELECTRONIC DEVICE AND MANUFACTURING METHOD FOR SAME - An electronic device includes: electronic elements; expandable and contractible conductors each disposed between two of the electronic elements adjacent to each other; a seal which covers the electronic elements and the conductors except principal surfaces of the electronic elements and first surfaces of the conductors, the principal surfaces of the electronic elements and the first surfaces of the conductors being present on a same plane on which surfaces of the seal are present; and leading electrode films each of which is attached in a film-like form to three surfaces which are the surface of the seal positioned between one of the electronic elements and one of the conductors, the first surface of the conductor, and part of the principal surface of the electronic element, to electrically connect the electronic element and the conductor through the leading electrode film. | 2015-07-30 |
20150216038 | PACKAGING SHELL AND A POWER MODULE HAVING THE SAME - The present invention provides a packaging shell and a power module having the same. The packaging shell mainly comprises an accommodating recess for receiving a substrate disposed with a plurality of electronic devices/components, so as to make the substrate be further assembled with a heat sink through the support of the packaging shell. Most importantly, in the present invention, the accommodating recess has a stepped surface for contacting with the substrate, and the stepped surface is a curve surface having a flatness difference. By such design, the compressional force generated when assembling the packaging shell, the heat sink and the system circuit board can be uniformly transmitted to substrate via the curve surface structure; such that the compressional force is avoid from being concentrated to a certain point on the substrate, and then the substrate is protected from being ruptured due to the action of the concentrated compressional force. | 2015-07-30 |
20150216039 | SUSPENSION BOARD WITH CIRCUIT ASSEMBLY SHEET - A suspension board with circuit assembly sheet includes an assembly provided region provided with a plurality of suspension boards with circuits at spaced intervals to each other along one direction and a margin region provided at least at one side in a crossing direction with respect to the one direction of the assembly provided region. In the assembly provided region, a first opening portion is provided between the suspension boards with circuits that are adjacent to each other and in the margin region, a fragile portion is provided. | 2015-07-30 |
20150216040 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR MOUNTING SUBSTRATE - A semiconductor device manufacturing method includes: a first-process for placing, on a first-substrate on which traces and first-electrodes are formed, each of the first-electrodes being connected to one of traces, a second-substrate in which through-holes corresponding to the first-electrodes and relay-members are disposed, each of the relay-members being formed of solder, penetrating through one of the through-holes, and projecting from both ends of the one of the through-holes, so that the first-electrodes are aligned with the through-holes in a plan view; a second-process for melting the relay-members so that the relay-members are connected to the first-electrodes, after the first-process; and a third-process for placing a semiconductor substrate on which a second-electrodes corresponding to the first-electrodes are formed on a side opposite to the first-substrate across the second-substrate, after the second-process, to connect the first-electrodes and the second-electrodes to each other via the relay-members. | 2015-07-30 |
20150216041 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device includes a laminated wiring formed of a low-resistance conductive film, and a low-reflection film mainly containing Al and functioning as an antireflective film which are sequentially arranged on a transparent substrate, a wiring terminal part provided at an end part of the laminated wiring and has the same laminated structure as that of the laminated wiring, and an insulating film for covering the laminated wiring and the wiring terminal part, in which the insulating film side serves as a display surface side, the wiring terminal part has a first opening part penetrating the insulating film and the low-reflection film and reaching the low-resistance conductive film, and an outer peripheral portion of the first opening part has a laminated structure of the low-resistance conductive film, the low-reflection film, and the insulating film, in at least one part. | 2015-07-30 |
20150216042 | MICRO DEVICE TRANSFER HEAD ARRAY - A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure. | 2015-07-30 |
20150216043 | SILVER HALIDE CONDUCTIVE ELEMENT PRECURSOR AND DEVICES - A conductive film element precursor can be used to provide conductive silver lines from silver halide in a non-color hydrophilic photosensitive layer. This precursor has a substrate having, in order on at least one supporting side: a non-color hydrophilic photosensitive layer comprising a silver halide at a coverage of less than 5000 mg Ag/m | 2015-07-30 |
20150216044 | CHIP PARTS AND METHOD FOR MANUFACTURING THE SAME, CIRCUIT ASSEMBLY HAVING THE CHIP PARTS AND ELECTRONIC DEVICE - The chip part of the present invention includes a substrate, an electrode on the substrate and having a front surface in which a plurality of recessed portions are formed toward the thickness direction thereof, and an element region having a circuit element that is electrically connected to the electrode. | 2015-07-30 |
20150216045 | DISPLAY SUBSTRATE STRUCTURE - A display substrate structure includes a substrate, at least one chip, and a plurality of conductive lines. A display region and a periphery region are defined on the substrate. The periphery region is disposed around the display region, and the chip is disposed in the periphery region. The conductive lines are disposed in the periphery region and at least between the chip and the display region. Each conductive line has a fan-out portion and at least one adjustment portion. Each adjustment portion is electrically connected to the fan-out portion of the same conductive line. The adjustment portion of each conductive line has a winding wire, and at least one of the adjustment portions of the conductive lines has a straight wire, which is electrically connected to and at least partially overlaps the winding wire of the same conductive line. | 2015-07-30 |
20150216046 | Structure to Dampen Barrel Resonance of Unused Portion of Printed Circuit Board Via - A printed circuit board includes a first trace, a second trace, and a first via. The first trace is in a first conductive layer. The second trace is in a second conductive layer. The first via interconnects the first trace and the second trace, and communicates a first signal from the first trace to the second trace through a third conductive layer. The third conductive layer has a higher impedance than the first conductive layer and the second conductive layer. | 2015-07-30 |
20150216047 | Wafers, Panels, Semiconductor Devices, and Glass Treatment Methods - Glass treatment methods, wafer, panels, and semiconductor devices are disclosed. In some embodiments, a method of forming a wafer or panel includes forming an opening through a glass substrate, forming a composite film on the glass substrate and on sidewalls of the opening, and filling the opening. | 2015-07-30 |
20150216048 | PACKAGE SUBSTRATE - A package substrate includes an insulating layer; and circuit patterns formed on the insulating layer and divided into pad areas and pattern areas that have different heights. In one aspect, there can be a non-conductive paste (NCP) interposed between the circuit patterns and pads of a die connected to the circuit patterns to fix the die onto the insulating layer. | 2015-07-30 |
20150216049 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first interlayer insulation layer, a second interlayer insulation layer formed on the first interlayer insulation layer and having an opening portion, first conductive pads formed on the second interlayer insulation layer, a conductive plane layer formed on the first interlayer insulation layer such that the conductive plane layer is exposed by the opening portion of the second interlayer insulation layer, a wiring structure positioned directly on the conductive plane layer such that the wiring structure is accommodated in the opening portion of the second interlayer insulation layer, and second conductive pads formed on the wiring structure such that the first conductive pads and the second conductive pads are set to be positioned on a same plane. | 2015-07-30 |
20150216050 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion. | 2015-07-30 |
20150216051 | METHOD OF FABRICATING ELECTRICAL FEEDTHROUGHS USING EXTRUDED METAL VIAS - A method of fabricating high-density, preferably bio-compatible, electrical feedthrough structures and interfaces by extruding electrically conductive material into electrically conductive film-coated throughholes formed on an electrically non-conductive substrate to form extrusion-formed electrically conductive vias which pass through the substrate for microelectronic applications. | 2015-07-30 |
20150216052 | PRINTED CIRCUIT BOARD - A printed circuit board includes a substrate; and a hole passing through first and second surfaces of the substrate. The hole includes an area in which a width of the hole formed in an inner side of the substrate is formed larger than that of an opening formed on the first surface and/or the second surface. | 2015-07-30 |
20150216053 | Integrated Circuit Package - An integrated circuit package may have a package substrate with a surface to which an integrated circuit die is soldered. A first set of contacts on the package substrate may mate with contacts on the integrated circuit die. Solder may be used to connect the integrated circuit die to the first set of contacts. A covering material such as a plastic mold cap may be used to cover the integrated circuit die and the first set of contacts. The mold cap may have a rectangular shape or other footprint. A rectangular ring-shaped border region or a border region of other shapes may surround the mold cap and may be free of mold cap material. A second set of contacts on the package substrate may be formed on the surface in the border region. | 2015-07-30 |
20150216054 | Electronic Component, Arrangement and Method - A method includes applying solder paste to a portion of a circuit board, arranging a first contact pad of a first electronic component adjacent the layer of solder paste, the first electronic component comprising a dielectric layer, at least one semiconductor die embedded in the dielectric layer, the at least one first contact pad being electrically coupled to the semiconductor die and arranged on a lower side of the dielectric layer, and at least one second contact pad positioned on an upper side of the dielectric layer, and melting the solder paste to produce a molten solder that flows onto at least one of the first contact pad and the second contact pad of the first electronic component. | 2015-07-30 |
20150216055 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board including providing a starting material including an insulating resin substrate having first and second surfaces, irradiating laser upon the first surface of the insulating resin substrate such that a first opening portion having an opening on the first surface is formed, irradiating laser upon the second surface of the insulating resin substrate such that a second opening portion having an opening on the second surface and communicated to the first opening portion is formed and that a penetrating-hole having the first and second opening portions is formed, forming a first conductor on the first surface of the insulating resin substrate, forming a second conductor on the second surface of the insulating resin substrate, and forming a through hole conductor structure in the penetrating-hole to electrically connecting the first conductor and the second conductor. | 2015-07-30 |
20150216056 | CERAMIC CIRCUIT SUBSTRATE AND ITS PRODUCTION METHOD - A method for producing a ceramic circuit substrate comprising the steps of forming brazing regions each comprising brazing material powder and an organic binder on a ceramic substrate; setting metal plates on the ceramic substrate via the brazing regions, and heating the ceramic substrate, the brazing regions and the metal plates to bond the metal plates to the ceramic substrate via brazing layers made of the brazing material, thereby forming a bonded body; and cleaning the bonded body with a hypochlorite-containing agent. | 2015-07-30 |
20150216057 | METHOD FOR MANUFACTURING FLEXIBLE-EMBEDDED ELECTRODE FILM USING HEAT-PRESSURE WELDING TRANSCRIPTION - This invention relates to a method of manufacturing a buried flexible electrode film, including 1) preparing a release-substrate; 2) forming a conductive pattern layer on the release-substrate; 3) positioning a transfer-substrate on the conductive pattern layer and then performing thermal and pressure lamination so that the conductive pattern layer formed on the release-substrate is inserted or buried in the surface of the transfer-substrate; and 4) separating the release-substrate and the conductive pattern layer from each other, and to a buried flexible electrode film manufactured thereby. | 2015-07-30 |
20150216058 | SCREEN PRINTING APPARATUS, ELECTRONIC COMPONENT MOUNTING SYSTEM AND SCREEN PRINTING METHOD - A screen printing apparatus includes a substrate positioning part that upwardly and downwardly moves a substrate with the substrate clamped by a clamp member to thereby bring the substrate into contact with a mask stretched in a frame body and fixed in a predetermined height position from an underside of the mask and position the substrate in a predetermined height position, a mask suction part that is provided in the clamp member and sucks the mask in contact with the substrate, and a screen printing part that prints paste on the substrate through a pattern hole formed in the mask by sliding a squeegee on the mask to which the paste is supplied. The mask is pressed up by a predetermined amount through the substrate with the mask sucked by the mask suction part when the substrate is upwardly moved by the substrate positioning part. | 2015-07-30 |
20150216059 | WIRING BOARD AND MANUFACTURING METHOD OF THE SAME - To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion. | 2015-07-30 |
20150216060 | Monitor and Working Vehicle Provided with the Monitor - A monitor includes a display in a form of a liquid crystal display, a monitor substrate that is electrically connected to the liquid crystal display, a connector that is used for electrical connection between the monitor substrate and an outside, and a resin-made exterior case that houses the liquid crystal display and the monitor substrate. On a back face opposed to the monitor substrate of the exterior case, a connector attachment portion is provided in a manner to be dented toward the connector. In the connector attachment portion, an opening from which the connector is exposed is provided. At least a part of an inner circumferential surface of the connector attachment portion is provided by an inclined surface portion that is enlarged toward the back face from an elevational portion (opening). | 2015-07-30 |
20150216061 | Components and methodology for producing custom-sized, small aluminum modular chassis based on a single design and production process - Components and methodology for producing custom-sized, small aluminum modular chassis based on a single design and production process is disclosed. The unique designs of the components and the modularity of the design allow for the cost-effective production of varying size chassis. A broad range of chassis sizes can be produced without the need to modify the production setup and can be produced with basic, relatively inexpensive machinery. All components and extrusion profiles are unique to the design and assembly of the chassis. | 2015-07-30 |
20150216062 | HOOK-TYPE DISPLAY MODULE - A hook-type display module includes a base assembly, a display hook receiving plate and at least one display hook. The base assembly includes a pair of spaced-apart side frame members having distal ends and proximal ends and a front frame member connecting the distal ends of the side frame members. The display hook receiving plate is positioned so as to extend between the spaced-apart side frame members and is located proximate to the proximal ends of the spaced-apart side frame members. The at least one display hook includes a base coupled to the display hook receiving plate and a hook extending from the base to a distal end. The distal end of the hook terminates at a location between the display hook receiving plate and the front frame member. | 2015-07-30 |
20150216063 | SUPPORTING DEVICE - A supporting device is provided, including a longitudinal main body, a connecting member, and a longitudinal supporting member. The connecting member is pivotally connected to the main body, such that the main body is rotatable relative to the connecting member along a first axis. The main body is extended along the first axis. The supporting member is pivotally connected to the connecting member, such that the supporting member is rotatable relative to the connecting member along a second axis. The first axis is substantially perpendicular to the second axis. | 2015-07-30 |
20150216064 | SUPPORTING APPARATUS OF HOUSING - A housing supporting apparatus includes: a base-plate body having a base-plate axis; a connection plate body having one end formed with a connection plate axis and pivotally connected to one end of the base-plate body; a first supporting plate having a first axis pivotally connected to the one end of the connection plate body; and a second supporting plate having a second axis pivotally connected to one end of the first supporting plate. The second supporting plate has one end pivotally connected to the base-plate axis. | 2015-07-30 |
20150216065 | POWER SUPPLY AND METHOD FOR ASSEMBLING POWER SUPPLY - A power supply includes a housing, a power module, a top cover, a sealing sheet, and a filling member. The power module is disposed in the housing. The top cover is disposed above the housing. The sealing sheet is at least partially disposed between the housing and the top cover. The filling member is disposed between the housing and the sealing sheet. | 2015-07-30 |
20150216066 | INTEGRATED CIRCUIT PACKAGE HAVING IMPROVED COPLANARITY - One aspect of the present disclosure provides an IC package that includes a printed circuit board (PCB) having a first material layer located thereon. The first material layer has bond pads located therein that form a contact array defined by a perimeter. A second material layer is located at or adjacent an outer edge of the PCB. The second material layer is located outside the perimeter of the contact array and has a higher coefficient of thermal expansion (CTE) value and a greater thickness than the first material layer. | 2015-07-30 |
20150216067 | LOW PROFILE, HIGHLY CONFIGURABLE, CURRENT SHARING PARALLELED WIDE BAND GAP POWER DEVICE POWER MODULE - A power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events. Wide low profile power contacts provide low inductance, short current paths, and large conductor cross section area provides for massive current carrying. An internal gate & source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction. Gate drive connectors are provided on either left or right size of the module. The module is configurable as half bridge, full bridge, common source, and common drain topologies. | 2015-07-30 |
20150216068 | SENSOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a sensor package and a method of manufacturing the same. According to the embodiment of the present invention, a sensor package includes: a metal frame; a sensor chip formed on the metal frame and including a sensing part; a protective layer formed on the sensor chip and formed on remaining portions except for the sensing part; and a molding part formed to cover the metal frame and the sensor chip, wherein an upper surface of the protective layer and an upper surface of the molding part are disposed on the same surface. | 2015-07-30 |
20150216069 | INFORMATION PROCESSING APPARATUS AND REPLACEMENT UNIT - A disclosed information processing apparatus includes: an enclosure; a plurality of replacement units each provided inside the enclosure and including a component and a joint bendably coupled to each other; and a plurality of guide rails which are provided inside the enclosure for each of the plurality of replacement units and to which the replacement unit is fitted. | 2015-07-30 |
20150216070 | WATERPROOF CONTROL UNIT AND METHOD OF ASSEMBLING THE SAME - In a waterproof control unit ( | 2015-07-30 |
20150216071 | SLIDING RAIL MECHANISM AND RACK WITH SLIDING RAIL MECHANISM - A sliding rail mechanism includes a first rail, a second rail slidably mounted to the first rail, a third rail slidably mounted to the second rail, and a securing member. The securing member includes a stopping portion and an engaging portion. The second rail and the third rail can slide in a first direction. The stopping portion and the engaging portion are insertable into the second rail when the second rail slides to a first position. The stopping portion can prevent the second rail from sliding in the first direction. The engaging portion can prevent the middle rail from sliding in a second direction opposite to the first direction. The engaging portion is extruded out from the second rail when the inner rail is slided to a second position, thereby enabling the second rail to slide in the second direction. A rack with the sliding rail mechanism is also provided. | 2015-07-30 |
20150216072 | MODULAR SKID FRAME WITH SHEAR MEMBER - A modular skid frame and device to reduce the potential for harm and injury from arc flashes. The modular skid frame comprises a plurality of frame members secured together to form the skid frame, and one or more hook members formed on one or more of the frame members to permit the receipt of a bucket or blade from a loader, scoop tram or other construction or mining equipment into the bowl portion and behind the bill portion of the hook member to facilitate the lifting and moving of the skid frame. Also disclosed is a device for racking a circuit breaker into and out of a circuit breaker cradle. The device comprises an actuator operatively connected to the circuit breaker cradle to permit the circuit breaker to be racked into and out of the cradle without direct or indirect contact on the part of an operator. | 2015-07-30 |
20150216073 | Systems and Methods for Cooling Electric Drives - Systems and methods for cooling a drive for downhole electric equipment such as an ESP, wherein the drive's electrical components are contained in one or more sealed enclosures to protect them from contaminants in external cooling air. In one embodiment, the drive has two sealed compartments that contain electrical components. Air internal to these compartments is circulated through air-to-air heat exchangers that are positioned in an adjacent duct. Alternating horizontal and vertical passageways through the heat exchangers are formed by flat plates that are offset from each other and connected alternately at their top/bottom and side edges. Air external to the sealed compartments is circulated through the duct to cool the heat exchangers. The amount of air circulated through each heat exchanger may be controlled by valves that regulate airflow through one or more outlets from the duct. | 2015-07-30 |
20150216074 | HEAT DISSIPATION PLATE - A heat dissipation plate includes: a substantially rectangular heat transfer surface that comes in contact with an electronic component; a plurality of side walls that are provided respectively in four directions of the heat transfer surface; and a heat-dissipation base surface that is connected to the heat transfer surface via the side walls. The heat generated by the electronic component is received by the heat transfer surface, is transmitted from the heat transfer surface to the heat-dissipation base surface via the side walls, and is dissipated from the heat-dissipation base surface. A plurality of vents are provided on at least one of the side walls. | 2015-07-30 |
20150216075 | MODULAR ELECTRONIC SYSTEM - Modular electronic system | 2015-07-30 |
20150216076 | RESILIENT DEFORMABLE AIR VALVE - An air valve may include a sheet on a panel that serves as a portion of one wall of an air-cooled enclosure. The panel has a first aperture, having a first radius. The sheet may be deformable and resilient, and have a conductive film on one surface and a second aperture. A plurality of leaves lie in a plane parallel to the panel and extend inwardly a particular distance from a perimeter define the second aperture. The perimeter has a second radius equal to the first radius. The particular distance is less than the second radius. The leaves may deform in response to air flow. The second aperture has a first diameter and first depth in an un-deformed state, and a second diameter and second depth in a deformed state. The second diameter and second depth are greater than the first diameter and first depth. | 2015-07-30 |
20150216077 | ELECTRONIC EQUIPMENT COOLING DEVICE AND POWER CONVERTER HAVING ELECTRONIC EQUIPMENT COOLING DEVICE - An electronic equipment cooling device is provided, which has housing in which heat-generating components are housed, and which can cool surfaces of the housing. A blower fan blows air toward the surfaces via a chamber room. An inclined flat plate-like partition portion is provided inside the chamber room so as to distribute a desired amount of air corresponding to a heat generating ratio of the respective surfaces. | 2015-07-30 |
20150216078 | Electrical Room Of An Industrial Equipment Such As A Container Crane, The Electrical Room Comprising A Cooling Device - An electrical room housing electrical and electronic apparatus for operating and controlling electrical motors of an industrial equipment is disclosed. The electrical room includes a cooling device with a first heat exchanger which is arranged with a first set of channels through which is conducted a first flow of air drawn from inside the electrical room. Warm air from inside the electrical room is circulated through the first heat exchanger of the cooling device and returned to the electrical room in a closed loop, and the air temperature in the electrical room is controlled dependent on a setpoint of between 24-40° C. A method for controlling the cooling device to cool the electrical room and one or more computer programs arranged for controlling the cooling device are also described. | 2015-07-30 |
20150216079 | COOLING SYSTEM AND ELECTRIC APPARATUS USING THE SAME - There is a problem in a shape of a fin of a boiling heat transfer surface of a conventional cooling system that a boiling nucleus may be stuck to the fin. In contrast, a cooling system of the present invention is provided with a boiling heat transfer surface that vaporizes a refrigerant liquid. Such that the refrigerant liquid forms a thin film at a root and a base portion of a fin for various refrigerants, it is provided with a configuration in which a protruding portion of the fin is inclined from a fin base. Further, it is provided with a configuration in which a notch is provided to the fin base at the fin root. Still further, it is provided with a configuration in which the protruding portion of the fin is cut in a fin base direction. | 2015-07-30 |
20150216080 | SYSTEM FOR COOLING HEAT GENERATING ELECTRICALLY ACTIVE COMPONENTS FOR SUBSEA APPLICATIONS - A subsea power module includes an outer pressure compensated vessel defining an interior chamber and one or more heat generating electrical components disposed within the interior chamber. The outer pressure compensated vessel is configured to maintain a pressure within the interior chamber substantially the same as an ambient pressure outside the outer pressure compensated vessel. Each of the electrical components may be disposed within an inner chamber of a pressure vessel disposed within the interior chamber of the outer pressure compensated vessel. Each of the one or more heat generating electrical components is configured to transfer heat generated within the interior chamber of the outer pressure compensated vessel through the wall defining the interior chamber to a fluid, such as seawater, surrounding the outer pressure compensated vessel. | 2015-07-30 |
20150216081 | HEAT DISSIPATION MECHANISM FOR HANDHELD ELECTRONIC APPARATUS - A heat dissipation mechanism for handheld electronic apparatus includes a thin metal sheet having one or multiple elongated mounting grooves and an elongated rib extending along each of two opposite lateral sides of each elongated mounting groove, and one or multiple heat pipes respectively press-fitted into one respective elongated mounting groove of the thin metal sheet. After insertion of each heat pipe into one respective elongated mounting groove, the elongated ribs are deformed to wrap about each loaded heat pipe. | 2015-07-30 |
20150216082 | HEAT DISSIPATION MECHANISM FOR HANDHELD ELECTRONIC APPARATUS - A heat dissipation mechanism for handheld electronic apparatus includes a thin metal sheet having spaced integral clamping plates, and one or multiple heat pipes attached to the clamping plates and secured thereto. After insertion of each heat pipe into the clamping plates, the clamping plates are deformed to wrap about the loaded heat pipe(s). | 2015-07-30 |