31st week of 2020 patent applcation highlights part 67 |
Patent application number | Title | Published |
20200243447 | Metal Patterning For Internal Cell Routing | 2020-07-30 |
20200243448 | SEMICONDUCTOR PACKAGE WITH THROUGH BRIDGE DIE CONNECTIONS | 2020-07-30 |
20200243449 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-07-30 |
20200243450 | BRIDGE EMBEDDED INTERPOSER, AND PACKAGE SUBSTRATE AND SEMICONDCUTOR PACKAGE COMPRISING THE SAME | 2020-07-30 |
20200243451 | HIGH PERFORMANCE MODULE FOR SIP | 2020-07-30 |
20200243452 | FLEXIBLE CIRCUIT BOARD AND CHIP PACKAGE INCLUDING SAME | 2020-07-30 |
20200243453 | PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME | 2020-07-30 |
20200243454 | PACKAGE STRUCTURE | 2020-07-30 |
20200243455 | HYBRID BONDING USING DUMMY BONDING CONTACTS AND DUMMY INTERCONNECTS | 2020-07-30 |
20200243456 | Semiconductor Package Authentication Feature | 2020-07-30 |
20200243457 | ELECTROMAGNETIC WAVE ATTENUATOR AND ELECTRONIC DEVICE | 2020-07-30 |
20200243458 | SEMICONDUCTOR APPARATUS FOR DETECTING OR OSCILLATING ELECTROMAGNETIC WAVES | 2020-07-30 |
20200243459 | Semiconductor Package With EMI Shield and Fabricating Method Thereof | 2020-07-30 |
20200243460 | SEMICONDUCTOR STRUCTURE | 2020-07-30 |
20200243461 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2020-07-30 |
20200243462 | SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEMICONDUCTOR DIE AND HEAT SPREADING STRUCTURE | 2020-07-30 |
20200243463 | RADAR SENSOR, MOTOR VEHICLE AND METHOD FOR PRODUCING A RADAR SENSOR | 2020-07-30 |
20200243464 | SEMICONDUCTOR PACKAGE HAVING IMPROVED THERMAL INTERFACE BETWEEN SEMICONDUCTOR DIE AND HEAT SPREADING STRUCTURE | 2020-07-30 |
20200243465 | SEMICONDUCTOR STRUCTURES | 2020-07-30 |
20200243466 | SEMICONDUCTOR DEVICE HAVING BONDING PADS | 2020-07-30 |
20200243467 | CHIPLETS WITH CONNECTION POSTS | 2020-07-30 |
20200243468 | ELECTRONIC DEVICE | 2020-07-30 |
20200243469 | FILM SCHEME FOR BUMPING | 2020-07-30 |
20200243470 | ELECTRONIC CONTROL DEVICE | 2020-07-30 |
20200243471 | SEMI-CONDUCTOR PACKAGE STRUCTURE | 2020-07-30 |
20200243472 | CODE PATTERN FOR REPRESENTING TRACING NUMBER OF CHIP | 2020-07-30 |
20200243473 | HYBRID BONDING USING DUMMY BONDING CONTACTS | 2020-07-30 |
20200243474 | CHIP-ON-FILM AND METHOD OF MANUFACTURING THE SAME | 2020-07-30 |
20200243475 | CHIP PACKAGE STRUCTURE | 2020-07-30 |
20200243476 | BONDING APPARATUS AND BONDING METHOD | 2020-07-30 |
20200243477 | DIE BONDING APPARATUS AND DIE BONDING METHOD | 2020-07-30 |
20200243478 | METHOD AND STRUCTURE FOR DIE BONDING USING ENERGY BEAM | 2020-07-30 |
20200243479 | PRECISION ALIGNMENT OF MULTI-CHIP HIGH DENSITY INTERCONNECTS | 2020-07-30 |
20200243480 | SOLDERING A CONDUCTOR TO AN ALUMINUM METALLIZATION | 2020-07-30 |
20200243481 | SEMICONDUCTOR WAFER PROCESSING SYSTEM AND METHOD | 2020-07-30 |
20200243482 | DISPLAY DEVICE AND ELECTRONIC DEVICE | 2020-07-30 |
20200243483 | SEMICONDUCTOR DEVICE, CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-07-30 |
20200243484 | RADIO FREQUENCY (RF) SWITCH DEVICE INCLUDING RF SWITCH INTEGRATED CIRCUIT (IC) DIVIDED BETWEEN SIDES OF PCB | 2020-07-30 |
20200243485 | Semiconductor device package having integrated circuits with I/O interface circuits powered by the same core voltage | 2020-07-30 |
20200243486 | DEVICE WITH EMBEDDED HIGH-BANDWIDTH, HIGH-CAPACITY MEMORY USING WAFER BONDING | 2020-07-30 |
20200243487 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE | 2020-07-30 |
20200243488 | SEMICONDUCTOR PACKAGE | 2020-07-30 |
20200243489 | Semiconductor Arrangements | 2020-07-30 |
20200243490 | SEMICONDUCTOR DEVICE | 2020-07-30 |
20200243491 | APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE | 2020-07-30 |
20200243492 | ILLUMINATION DEVICES USING EXTERNALLY INTERCONNECTED ARRAYS OF LIGHT EMITTING DEVICES, AND METHODS OF FABRICATING SAME | 2020-07-30 |
20200243493 | SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | 2020-07-30 |
20200243494 | SEMICONDUCTOR DEVICES AND SEMICONDUCTOR STRUCTURES | 2020-07-30 |
20200243495 | MULTI-LAYER POWER CONVERTER WITH DEVICES HAVING REDUCED LATERAL CURRENT | 2020-07-30 |
20200243496 | SEMICONDUCTOR DIE WITH IMPROVED THERMAL INSULATION BETWEEN A POWER PORTION AND A PERIPHERAL PORTION, METHOD OF MANUFACTURING, AND PACKAGE HOUSING THE DIE | 2020-07-30 |
20200243497 | PACKAGE STRUCTURE | 2020-07-30 |
20200243498 | THREE-DIMENSIONAL MEMORY DEVICE WITH LOGIC SIGNAL ROUTING THROUGH A MEMORY DIE AND METHODS OF MAKING THE SAME | 2020-07-30 |
20200243499 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-07-30 |
20200243500 | THREE-DIMENSIONAL SEMICONDUCTOR CHIP CONTAINING MEMORY DIE BONDED TO BOTH SIDES OF A SUPPORT DIE AND METHODS OF MAKING THE SAME | 2020-07-30 |
20200243501 | Integrated Assemblies Having Capacitive Units, and Having Resistive Structures Coupled with the Capacitive Units | 2020-07-30 |
20200243502 | INTEGRATED CIRCUIT INCLUDING MULTI-HEIGHT STANDARD CELL AND METHOD OF DESIGNING THE SAME | 2020-07-30 |
20200243503 | ELECTRONIC DEVICE INCLUDING A TRANSISTOR HAVING STRUCTURES WITH DIFFERENT CHARACTERISTICS | 2020-07-30 |
20200243504 | RECTIFICATION DEVICE HAVING A FORWARD PN JUNCTION AND A REVERSE SCHOTTKY BARRIER FORMED IN AN EPITAXIAL SEMICONDUCTOR LAYER FORMED OVER A SEMICONDUCTOR SUBSTRATE | 2020-07-30 |
20200243505 | Semiconductor Die | 2020-07-30 |
20200243506 | DIODE, TRANSISTOR AND DISPLAY DEVICE | 2020-07-30 |
20200243507 | Silicon Controlled Rectifier and Manufacturing Method Therefor | 2020-07-30 |
20200243508 | ELECTROSTATIC DISCHARGE HANDLING FOR LATERAL TRANSISTOR DEVICES | 2020-07-30 |
20200243509 | Semiconductor Device Having Overload Current Carrying Capability | 2020-07-30 |
20200243510 | SYSTEMS AND METHODS FOR PROTECTING A SEMICONDUCTOR DEVICE | 2020-07-30 |
20200243511 | HIGH VOLTAGE PROTECTION FOR HIGH-SPEED DATA INTERFACE | 2020-07-30 |
20200243512 | NMOS TRANSISTOR WITH BULK DYNAMICALLY COUPLED TO DRAIN | 2020-07-30 |
20200243513 | A CONCEPT FOR SILICON CARBIDE POWER DEVICES | 2020-07-30 |
20200243514 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2020-07-30 |
20200243515 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2020-07-30 |
20200243516 | THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS | 2020-07-30 |
20200243517 | BURIED CHANNEL STRUCTURE INTEGRATED WITH NON-PLANAR STRUCTURES | 2020-07-30 |
20200243518 | HEMT POWER DEVICE OPERATING IN ENHANCEMENT MODE AND MANUFACTURING PROCESS THEREOF | 2020-07-30 |
20200243519 | SEMICONDUCTOR DEVICE STRUCTURE WITH EPITAXIAL STRUCTURE AND METHOD FOR FORMING THE SAME | 2020-07-30 |
20200243520 | SEMICONDUCTOR DEVICE | 2020-07-30 |
20200243521 | SEMICONDUCTOR DEVICE | 2020-07-30 |
20200243522 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING GATE-ALL-AROUND STRUCTURE WITH OXYGEN BLOCKING LAYERS | 2020-07-30 |
20200243523 | SEMICONDUCTOR DEVICES | 2020-07-30 |
20200243524 | SEMICONDUCTOR DEVICE | 2020-07-30 |
20200243525 | VERTICAL FIN FIELD EFFECT TRANSISTOR DEVICES WITH A REPLACEMENT METAL GATE | 2020-07-30 |
20200243526 | VERTICAL FIN FIELD EFFECT TRANSISTOR DEVICES WITH A REPLACEMENT METAL GATE | 2020-07-30 |
20200243527 | VERTICAL FIN FIELD EFFECT TRANSISTOR DEVICES WITH A REPLACEMENT METAL GATE | 2020-07-30 |
20200243528 | SEMICONDUCTOR STRUCTURE FORMATION | 2020-07-30 |
20200243529 | Semiconductor Memory Device Having an Electrically Floating Body Transistor | 2020-07-30 |
20200243530 | Method of Operating Semiconductor Memory Device with Floating Body Transistor Using Silicon Controlled Rectifier Principle | 2020-07-30 |
20200243531 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-07-30 |
20200243532 | INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-07-30 |
20200243533 | MEMORY TRANSISTOR, FABRICATION METHOD THEREOF AND SEMICONDUCTOR DEVICE | 2020-07-30 |
20200243534 | DRAM ARRAY, SEMICONDUCTOR LAYOUT STRUCTURE THEREFOR AND FABRICATION METHOD | 2020-07-30 |
20200243535 | REDUCTION OF ROUGHNESS ON A SIDEWALL OF AN OPENING | 2020-07-30 |
20200243536 | COLUMN FORMATION USING SACRIFICIAL MATERIAL | 2020-07-30 |
20200243537 | FORMATION OF A TRENCH USING A POLYMERIZING RADICAL MATERIAL | 2020-07-30 |
20200243538 | Integrated Assemblies Which Include Metal-Containing Interconnects to Active-Region Pillars, and Methods of Forming Integrated Assemblies | 2020-07-30 |
20200243539 | SEMICONDUCTOR DEVICES COMPRISING DIGIT LINE CONTACTS AND RELATED SYSTEMS AND METHODS | 2020-07-30 |
20200243540 | CONTACT PATTERNING | 2020-07-30 |
20200243541 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2020-07-30 |
20200243542 | SEMICONDUCTOR DEVICE HAVING EQUIVALENT SERIES RESISTANCE UNIT | 2020-07-30 |
20200243543 | 2S-1C 4F2 CROSS-POINT DRAM ARRAY | 2020-07-30 |
20200243544 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2020-07-30 |
20200243545 | SEMICONDUCTOR DEVICE | 2020-07-30 |
20200243546 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-07-30 |