31st week of 2014 patent applcation highlights part 17 |
Patent application number | Title | Published |
20140210076 | FLIP-CHIP HYBRIDIZATION OF MICROELECTRONIC COMPONENTS BY LOCAL HEATING OF CONNECTING ELEMENTS - A method of forming a hybridized device including forming a first component provided with metal bumps, and a second component provided with connection elements, attaching the bumps to the connection elements. The manufacturing of the second component includes forming, on a surface of a substrate, resistive elements at the locations provided for the connection elements; depositing an electric insulator layer at least on the resistive elements; and forming the connection elements, each comprising a metal well having an opening capable of receiving the corresponding metal bump of the first microelectronic component and at least partially filled with a fusible element, particularly indium or an alloy of tin and gold, or with a conductive ink, particularly based on silver or copper. Further, the attachment of the balls to the connection elements comprises applying an electric current through the resistive elements to heat the bumps. | 2014-07-31 |
20140210077 | INTEGRATED CIRCUIT SYSTEM WITH DISTRIBUTED POWER SUPPLY - An integrated circuit system comprises an interposer, a first integrated circuit, and at least one voltage regulator module. The first integrated circuit comprises first bond pads, and is electrically connected to the interposer at a first position of the interposer via the first bond pads. The first integrated circuit also comprises second bond pads. The first integrated circuit further comprises at least two circuit blocks. The at least two circuit blocks are configured to operate at different operating voltages. The at least one voltage regulator module is electrically connected to the first integrated circuit via the second bond pads, and the at least one voltage regulator module is configured to convert a received power supply voltage to the respective operating voltage of one of the at least two circuit blocks and supply the respective operating voltage via the second bond pads. | 2014-07-31 |
20140210078 | RFID Chip Module - A chip module comprises a carrier, having a first main surface and a second main surface opposite to the first main surface. A first recess structure is arranged in the carrier in the first main surface, and a chip is arranged in the first recess structure of the carrier. A patterned metallization layer is deposited on the second main surface of the carrier, the metallization layer having a first metallization structure and a second metallization structure, the first metallization structure being electrically isolated from the second metallization structure. The chip is electrically connected to the first metallization structure and the second metallization structure. The chip module comprises in particular an RFID chip and is suited to be connected to a textile substrate by way of laser reflow soldering. | 2014-07-31 |
20140210079 | METHOD FOR DESIGNING POWER DISTRIBUTION NETWORK OF CIRCUIT SYSTEM AND RELATED CIRCUIT SYSTEM - A method for designing a power distribution network of a circuit system includes the following steps: determining positions of a plurality of power source nodes; estimating a current distribution condition of the circuit system; and creating a first part of the power distribution network according to at least the positions of the power source nodes. | 2014-07-31 |
20140210080 | PoP Device - A method of forming a PoP device comprises placing an adhesive layer on a carrier substrate, coupling a plurality of chip packages to the adhesive layer on the carrier substrate, placing a bonding layer on the chip packages, and coupling a plurality of chips to the bonding layer on the chip packages. The method further comprises injecting a molding compound to encapsulate the chip packages and the chips on the carrier substrate, grinding the molding compound to expose a plurality of connecting elements of the chips and a plurality of second connecting elements of the chip packages, forming a redistribution layer (RDL) on the molding compound and the exposed connecting elements and second connecting elements, forming a ball grid array (BGA) on the RDL, and de-bonding the carrier substrate. | 2014-07-31 |
20140210081 | Packaging Methods and Packaged Semiconductor Devices - Packaging methods and packaged semiconductor devices are disclosed. In some embodiments, a method of packaging semiconductor devices includes forming first contact pads on a carrier, forming a wiring structure over the first contact pads, and forming second contact pads over the wiring structure. A first packaged semiconductor device is coupled to a first set of the second contact pads, and a second packaged semiconductor device is coupled to a second set of the second contact pads. The carrier is removed. The second packaged semiconductor device comprises a different package type than the first packaged semiconductor device. | 2014-07-31 |
20140210082 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device. The semiconductor device includes: a first board; a second board joined to the first board; a connection terminal provided between the first board and the second board and electrically connecting the first board and the second board; and an electronic component on at least one of the first board and the second board. The connection terminal serves as an antenna. | 2014-07-31 |
20140210083 | THERMALLY AND ELECTRICALLY ENHANCED BALL GRID ARRAY PACKAGE - In one embodiment, a device package is provided. The device package can include a substrate having first and second opposing surfaces, an opening being formed through the first and second surfaces of the substrate; a stiffener coupled to the first surface of the substrate, the stiffener having an extending portion that extends into the opening of the substrate; and an integrated circuit (IC) die coupled to the extending portion of the stiffener, the IC die being electrically coupled to the substrate. | 2014-07-31 |
20140210084 | SEMICONDUCTOR DEVICE CONNECTED BY ANISOTROPIC CONDUCTIVE FILM - A semiconductor device connected by an anisotropic conductive film, the anisotropic conductive film including a binder resin; a first radical polymerization material having one or two (meth)acrylate reactive groups in a structure thereof and a second radical polymerization material having at least three (meth)acrylate reactive groups in a structure thereof; and conductive particles, the anisotropic conductive film having a moisture permeability of 170 g/m | 2014-07-31 |
20140210085 | Capping Layer for Improved Deposition Selectivity - The present disclosure relates to a method and apparatus for improving back-end-of-the-line (BEOL) reliability. In some embodiments, the method forms an extreme low-k (ELK) dielectric layer having one or more metal layer structures over a semiconductor substrate. A first capping layer is formed over the ELK dielectric layer at a position between the one or more metal layer structures. A second capping layer is then deposited over the one or more metal layer structures at a position that is separated from the ELK dielectric layer by the first capping layer. The first capping layer has a high selectivity that limits interaction between the second capping layer and the ELK dielectric layer, reducing diffusion of the atoms from the second capping layer to the ELK dielectric layer and improving dielectric breakdown of the ELK dielectric layer. | 2014-07-31 |
20140210086 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes forming a barrier metal film on a surface of at least one of a first electrode of a wiring board and a second electrode of a semiconductor element, providing a connection terminal between the first and second electrodes, the connection terminal being made of solder containing tin, bismuth and zinc, and bonding the connection terminal to the barrier metal film by heating the connection terminal and maintaining the temperature of the connection terminal at a constant temperature not lower than a melting point of the solder for a certain period of time. | 2014-07-31 |
20140210087 | INTERCONNECTION STRUCTURES FOR SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME - An interconnection structure includes an underlying layer including a lower interconnection, and an interlayered dielectric layer including a contact hole and a trench therein. The contact hole exposes a portion of the lower interconnection, and the trench extends along a first direction to be connected to the contact hole. A contact plug extends through the contact hole in the interlayered dielectric layer, and an upper interconnection line extends in the trench of the interlayered dielectric layer and connects to the contact plug. The contact plug includes lower and upper sidewalls inclined at first and second angles, respectively, relative to the underlying layer, and the second angle is less than the first angle. Related devices and fabrication methods are also discussed. | 2014-07-31 |
20140210088 | METHOD FOR REDUCING WETTABILITY OF INTERCONNECT MATERIAL AT CORNER INTERFACE AND DEVICE INCORPORATING SAME - A semiconductor device includes a recess defined in a dielectric layer, the recess having an upper sidewall portion extending to an upper corner of the recess and a lower sidewall portion below the upper sidewall portion. An interconnect structure is positioned in the recess. The interconnect structure includes a continuous liner layer having upper and lower layer portions positioned laterally adjacent to the upper and lower sidewall portions, respectively. The upper layer portion includes an alloy of a first transition metal and a second transition metal and the lower layer portion includes the second transition metal but not the first transition metal. The interconnect structure also includes a fill material substantially filling the recess, wherein the second transition metal has a higher wettability for the fill material than the alloy. | 2014-07-31 |
20140210089 | COPPER INTERCONNECT STRUCTURE AND ITS FORMATION - A structure with improved electromigration resistance and methods for making the same. A structure having improved electromigration resistance includes a bulk interconnect having a dual layer cap and a dielectric capping layer. The dual layer cap includes a bottom metallic portion and a top metal oxide portion. Preferably the metal oxide portion is MnO or MnSiO and the metallic portion is Mn or CuMn. The structure is created by doping the interconnect with an impurity (Mn in the preferred embodiment), and then creating lattice defects at a top portion of the interconnect. The defects drive increased impurity migration to the top surface of the interconnect. When the dielectric capping layer is formed, a portion reacts with the segregated impurities, thus forming the dual layer cap on the interconnect. Lattice defects at the Cu surface can be created by plasma treatment, ion implantation, a compressive film, or other means. | 2014-07-31 |
20140210090 | Circuit module and method of manufacturing the same - Manufacturing method and circuit module, which comprises an insulator layer and, inside the insulator layer, at least one component, which comprises contact areas, the material of which contains a first metal. On the surface of the insulator layer are conductors, which comprise at least a first layer and a second layer, in such a way that at least the second layer contains a second metal. The circuit module comprises contact elements between the contact areas and the conductors for forming electrical contacts. The contact elements, for their part, comprise, on the surface of the material of the contact area, an intermediate layer, which contains a third metal, in such a way that the first, second, and third metals are different metals and the contact surface area (A | 2014-07-31 |
20140210091 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - To provide a semiconductor device having a reduced size and thickness while suppressing deterioration in reliability. After a semiconductor wafer is ground at a back surface thereof with a grinding material into a predetermined thickness, the resulting semiconductor wafer is diced along a cutting region to obtain a plurality of semiconductor chips. While leaving grinding grooves on the back surface of each of the semiconductor chips, the semiconductor chip is placed on the upper surface of a die island via a conductive resin paste so as to face the back surface of the semiconductor chip and the upper surface of the die island each other. The die island has, on the upper surface thereof, a concave having a depth of from 3 μm to 10 μm from the edge of the concave to the bottom of the concave. | 2014-07-31 |
20140210092 | Refractory Metal Nitride Capped Contact - According to one disclosed embodiment, an electrical contact for use on a semiconductor device comprises an electrode stack including a plurality of metal layers and a capping layer formed over the plurality of metal layers. The capping layer comprises a refractory metal nitride. In one embodiment, a method for fabricating an electrical contact for use on a semiconductor device comprises forming an electrode stack including a plurality of metal layers over the semiconductor device, and depositing a refractory metal nitride capping layer of the electrode stack over the plurality of metal layers. The method may further comprise annealing the electrode stack at a temperature of less than approximately 875° C. In some embodiments, the method may additionally include forming one of a Schottky metal layer and a gate insulator layer between the electrode stack and the semiconductor device. | 2014-07-31 |
20140210093 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device includes a functional block unit, external terminals and, and an external resin sealing body. The functional block unit includes an internal resin sealing body having an edge and an opposite edge. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The edge side of the internal resin sealing body covers a first end of an internal terminal, but does not cover a second end of the internal terminal. The external resin sealing body covers the root portion and a portion of the middle portion of the external terminal, but does not cover the terminal portion of the external terminal. The functional block unit and the external terminals and are integrally connected together and sealed by the external resin sealing body. | 2014-07-31 |
20140210094 | WIRING STRUCTURE, DROPLET DISCHARGE HEAD, AND DROPLET DISCHARGE APPARATUS - A droplet discharge head includes: a vibrating plate on which first and second terminals are formed; a reservoir forming substrate bonded to the vibrating plate and including a first inclined surface as a side surface on which a first wiring electrically connected to the first terminal is formed and that is inclined to a plate surface; and a wiring substrate bonded to the vibrating plate and including a second inclined surface as a side surface on which a second wiring electrically connected to the second terminal is formed and that is inclined to a plate surface along the first inclined surface. | 2014-07-31 |
20140210095 | METHODS OF MANUFACTURING NAND FLASH MEMORY DEVICES - A NAND flash memory device includes a plurality of continuous conductors disposed on a common level of a multilayer substrate, the plurality of continuous conductors including respective conductive lines extending in parallel along a first direction, respective contact pads disposed at ends of the respective conductive lines and respective conductive dummy lines extending in parallel from the contact pads along a second direction | 2014-07-31 |
20140210096 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, SEMICONDUCTOR DEVICE DESIGN APPARATUS, AND PROGRAM - A semiconductor device includes a semiconductor chip, the semiconductor chip including a substrate, a multilayer interconnect layer formed over the substrate, an outer peripheral cell column disposed along an edge of the substrate in a plan view, the outer peripheral cell column having at least one first I/O cell, and an inner peripheral cell column formed at an inner peripheral side of the outer peripheral cell column, the inner peripheral cell column having at least one second I/O cell. | 2014-07-31 |
20140210097 | INTEGRATED CIRCUIT PACKAGE WITH ACTIVE INTERPOSER - An integrated circuit package may include a substrate and an interposer. The interposer is disposed over the substrate. The interposer may include embedded switching elements that may be used to receive different power supply signals. An integrated circuit with multiple logic blocks is disposed over the substrate. The switching elements embedded in the interposer may be used to select a power supply signal from the power supply signals and may be used to provide at least one circuit block in the integrated circuit with a selected power supply signal. | 2014-07-31 |
20140210098 | TECHNIQUES FOR ENHANCING FRACTURE RESISTANCE OF INTERCONNECTS - Techniques and structure are disclosed for enhancing fracture resistance of back-end interconnects and other such interconnect structures by increasing via density. Increased via density can be provided, for example, within the filler/dummified portion(s) of adjacent circuit layers within a die. In some cases, an electrically isolated (floating) filler line of an upper circuit layer may include a via which lands on a floating filler line of a lower circuit layer in a region corresponding to where the filler lines cross/intersect. In some such cases, the floating filler line of the upper circuit layer may be formed as a dual-damascene structure including such a via. In some embodiments, a via similarly may be provided between a floating filler line of the upper circuit layer and a sufficiently electrically isolated interconnect line of the lower circuit layer. The techniques/structure can be used to provide mechanical integrity for the die. | 2014-07-31 |
20140210099 | Packaged Semiconductor Devices and Packaging Methods - Packaged semiconductor devices and packaging methods are disclosed. In some embodiments, a packaged semiconductor device includes an integrated circuit die and through-vias disposed in a molding compound. A first redistribution layer (RDL) is disposed over a first side of the through-vias, the integrated circuit die, and the molding compound. A second RDL is disposed over a second side of the through-vias, the integrated circuit die, and the molding compound. Contact pads are disposed over the second RDL. An insulating material of the second RDL includes a recess around a perimeter of one of the contact pads. | 2014-07-31 |
20140210100 | CONDUCTIVE LINE ROUTING FOR MULTI-PATTERNING TECHNOLOGY - A method comprises: forming a plurality of reference voltage patterns in a first layer of a semiconductor substrate using a first mask, the reference voltage patterns including alternating first reference voltage patterns and second reference voltage patterns; and forming a plurality of signal patterns in the first layer of the semiconductor substrate using a second mask, ones of the plurality of signal patterns located between successive pairs of reference voltage patterns. | 2014-07-31 |
20140210101 | Die package with Openings Surrounding End-portions of Through Package Vias (TPVs) and Package on Package (PoP) Using the Die Package - Various embodiments of mechanisms for forming through package vias (TPVs) with openings surrounding end-portions of the TPVs and a package on package (PoP) device with bonding structures utilizing the TPVs are provided. The openings are formed by removing materials, such as by laser drill, surrounding the end-portions of the TPVs. The openings surrounding the end-portions of the TPVs of the die package enable solders of the bonding structures formed between another die package to remain in the openings without sliding and consequently increases yield and reliability of the bonding structures. Polymers may also be added to fill the openings surrounding the TPVs or even the space between the die packages to reduce cracking of the bonding structures under stress. | 2014-07-31 |
20140210102 | SYSTEMS AND METHODS FOR PRODUCING FLAT SURFACES IN INTERCONNECT STRUCTURES - Methods and apparatus for forming a semiconductor device are provided which may include any number of features. One feature is a method of forming an interconnect structure that results in the interconnect structure having a co-planar or flat top surface. Another feature is a method of forming an interconnect structure that results in the interconnect structure having a surface that is angled upwards greater than zero with respect to a top surface of the substrate. The interconnect structure can comprise a damascene structure, such as a single or dual damascene structure, or alternatively, can comprise a silicon-through via (TSV) structure. | 2014-07-31 |
20140210103 | MRAM with Sidewall Protection and Method of Fabrication - BEOL memory cells are described that include one or more sidewall protection layers on the memory device (including, for example, an MTJ element) deposited prior to interconnect via etching to prevent the formation of electrical shorts between layers. One embodiment uses a single layer sidewall protection sleeve that is deposited after the memory device has been patterned. The layer material is vertically etched down to expose the upper surface of the top electrode while leaving a residual layer of protective material surrounding the rest of the memory device. The material for the protection layer is selected to resist the etchant used to remove the first dielectric material from the via in the subsequent interconnect process. A second embodiment uses dual-layer sidewall protection in which the first layer covers the memory element is preferably an oxygen-free dielectric and the second layer protects the first layer during via etching. In either the first or second embodiments a single layer or a dual layer etch stop layer structure can be deposited over the wafer after the sidewall protection sleeve has been formed and before the inter-layer dielectric (ILD) is deposited. | 2014-07-31 |
20140210104 | NON-LITHOGRAPHIC FORMATION OF THREE-DIMENSIONAL CONDUCTIVE ELEMENTS - A method of forming a conductive element on a substrate and the resulting assembly are provided. The method includes forming a groove in a sacrificial layer overlying a dielectric region disposed on a substrate. The groove preferably extends along a sloped surface of the substrate. The sacrificial layer is preferably removed by a non-photolithographic method, such as ablating with a laser, mechanical milling, or sandblasting. A conductive element is formed in the groove. The grooves may be formed. The grooves and conductive elements may be formed along any surface of the substrate, including within trenches and vias formed therein, and may connect to conductive pads on the front and/or rear surface of the substrate. The conductive elements are preferably formed by plating and may or may not conform to the surface of the substrate. | 2014-07-31 |
20140210105 | METHOD OF FORMING INTERCONNECTION LINES - The invention concerns a method comprising: forming a plurality of parallel lines ( | 2014-07-31 |
20140210106 | ULTRA THIN PoP PACKAGE - A PoP (package-on-package) package includes a bottom package coupled to a top package. The bottom package includes a die coupled to an interposer layer with an adhesive layer. One or more terminals are coupled to the interposer layer on the periphery of the die. The terminals and the die are at least partially encapsulated in an encapsulant. The terminals and the die are coupled to a redistribution layer (RDL). Terminals on the bottom of the RDL are used to couple the PoP package to a motherboard or a printed circuit board (PCB). One or more additional terminals couple the interposer layer to the top package. The additional terminals may be located anywhere along the surface of the interposer layer. | 2014-07-31 |
20140210107 | STACKED WAFER DDR PACKAGE - A top package used in a PoP (package-on-package) package includes two memory die stacked with a redistribution layer (RDL) between the die. The first memory die is encapsulated in an encapsulant and coupled to a top surface of the RDL. A second memory die is coupled to a bottom surface of the RDL. The second memory die is coupled to the RDL with either a capillary underfill material or a non-conductive paste. The RDL includes routing between each of the memory die and one or more terminals coupled to the RDL on a periphery of the die. | 2014-07-31 |
20140210108 | SEMICONDUCTOR PACKAGE - A semiconductor package offers improved product reliability by supplying a power voltage and a ground voltage to a semiconductor chip in a secured manner using a redistribution layer (RDL) structure. The semiconductor package includes a first semiconductor chip disposed on a substrate, a second semiconductor chip disposed on the first semiconductor chip, a plurality of redistribution lines disposed on the first semiconductor chip and electrically connecting the first semiconductor chip to the second semiconductor chip, and a redistribution wire disposed on the first semiconductor chip and electrically connecting one of the redistribution lines to another. | 2014-07-31 |
20140210109 | BUILT-IN ELECTRONIC COMPONENT SUBSTRATE AND METHOD FOR MANUFACTURING THE SUBSTRATE - A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first substrate and covering the side surfaces of the electronic component, a second substrate provided above the electronic component and the first resin and layered on the first substrate, a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates, a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate, and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin. | 2014-07-31 |
20140210110 | ATTACHMENT OF MICROELECTRONIC COMPONENTS - Sub-micron precision alignment between two microelectronic components can be achieved by applying energy to incite an exothermic reaction in alternating thin film reactive layers between the two microelectronic components. Such a reaction rapidly distributes localized heat to melt a solder layer and form a joint without significant shifting of components. | 2014-07-31 |
20140210111 | EMBEDDED PACKAGE ON PACKAGE SYSTEMS - In some embodiments, a semiconductor device package assembly may include a substrate. The substrate may include a first surface, a second surface substantially opposite of the first surface, and a first set of electrical conductors coupled to the first surface. The first set of electrical conductors may function to electrically connect the substrate. The second surface may include a die electrically coupled to the second surface. In some embodiments, the semiconductor device package may include an electrically insulating material covering at least a portion of the second surface and the die. The electrically insulating material may include a dielectric polymer. The dielectric polymer may function to inhibit deformation of the package during use. The dielectric polymer may include a coefficient of thermal expansion of between about 5 to about 15 ppm/° C. The dielectric polymer may include a modulus of between about 15 to about 25 Gpa. | 2014-07-31 |
20140210112 | ENCAPSULATION STRUCTURE FOR AN OPTOELECTRONIC COMPONENT AND METHOD FOR ENCAPSULATING AN OPTOELECTRONIC COMPONENT - An encapsulation structure for an optoelectronic component may include: a barrier thin-film layer for protecting an optoelectronic component against chemical impurities; a cover layer applied above the barrier thin-film layer and serving for protecting the barrier thin-film layer against mechanical damage; and an intermediate layer applied on the barrier thin-film layer between barrier thin-film layer and cover layer and including a curable material designed such that when the non-cured intermediate layer is applied to the barrier thin-film layer, particle impurities at the surface of the barrier thin-film layer are enclosed by the intermediate layer and the applied intermediate layer has a substantially planar surface, and that after the intermediate layer has been cured, mechanical loads on the barrier thin-film layer as a result of particle impurities during the application of the cover layer are reduced by the intermediate layer. | 2014-07-31 |
20140210113 | ALIGNMENT MARK RECOVERY WITH REDUCED TOPOGRAPHY - When opaque films are deposited on semi-conductor wafers, underlying alignment marks may be concealed. The re-exposure of such alignment marks is one source of resulting surface topography. In accordance with one implementation, alignment marks embedded in a wafer may be exposed by removing material from one or more layers and by replacing such material with a transparent material. In accordance with another implementation, the amount of material removed in an alignment mark recovery process may be mitigated by selectively ashing or etching above a stop layer. | 2014-07-31 |
20140210114 | FAN ASSEMBLY - A fan assembly includes a nozzle having a first casing section, a second casing section, an air inlet, an air outlet, and an interior passage for conveying air from the air inlet to the air outlet. The nozzle defines a bore through which air from outside the fan assembly is drawn by air emitted from the nozzle. The nozzle is detachably mounted on a body including a motor and impeller unit for generating an air flow through the interior passage, and a humidifier for humidifying the air flow before it enters the interior passage. The first casing section defines, at least in part, the interior passage, and is detachable from the second casing section to allow the interior passage to be accessed by a user for cleaning. | 2014-07-31 |
20140210115 | FAN ASSEMBLY - Humidifying apparatus includes a chamber, and a water tank for supplying water to the chamber. A baffle located within the chamber divides the chamber into an inlet section and an outlet section, and guides water received from the water tank along the inlet section to the outlet section. An air flow is conveyed over water stored in the outlet section of the chamber and is emitted from the apparatus. Water within both the inlet section and the outlet section of the chamber is irradiated with ultraviolet radiation. The water within the outlet section is atomized by a transducer to humidify the air flow. | 2014-07-31 |
20140210116 | ILLUMINATED SURGICAL INSTRUMENT - An illuminated surgical instrument is disclosed. One embodiment of the illuminated surgical instrument comprises a cannula and an injection-molded light-sleeve adjacent to and encircling at least a portion of the cannula. The surgical instrument can be a vitrectomy probe having a cutting port disposed at a distal end of the cannula. The light-sleeve can terminate near a distal end of the cannula, for example, near the cutting port of the vitrectomy probe. The light-sleeve is optically coupled to a light source. The light-sleeve can be injection-molded during manufacture using the cannula as an insert for the injection molding. The light-sleeve can be oriented for providing illumination in a direction along a longitudinal axis of the instrument. | 2014-07-31 |
20140210117 | PHARMACEUTICAL COMPOSITIONS OF DISPERSIONS OF DRUG AND NEUTRAL POLYMERS - In one aspect, pharmaceutical compositions comprising dispersions of an acid-sensitive drug and a neutral dispersion polymer are disclosed. The acid-sensitive drug has improved chemical stability relative to dispersions of the drug and acidic polymers. In another aspect, pharmaceutical compositions of low-solubility drugs and amphiphilic, hydroxy-functional vinyl copolymers are disclosed. | 2014-07-31 |
20140210118 | POLYMER OR POLYMER COMPOSITE MEMBRANE HAVING THROUGH-THICKNESS MICROPORES, AND METHOD FOR PREPARING SAME - A polymer or polymer composite membrane having through-thickness micropores and a method of preparing the same are provided. More particularly, a polymer or polymer composite membrane having a pore structure such that micropores are aligned in a mesh structure in the thickness direction of the polymer or polymer composite membrane due to unidirectional freezing in the thickness direction of a solvent. The membrane has through-thickness micropores, and thus has improved permeability in the thickness direction and superior uniformity in size of the micropores and wall thickness between the micropores. For these reasons, the membrane can be used for a porous membrane substrate, microfiltration membrane, etc. | 2014-07-31 |
20140210119 | CONTROLLED VALVE PIN MOVEMENT BASED ON CAVITY SENSOR FEEDBACK - Apparatus for performing an injection molding cycle, comprising:
| 2014-07-31 |
20140210120 | FLAME-RETARDANT REGENERATED CELLULOSE FILAMENT FIBERS AND PROCESS FOR PRODUCTION THEREOF - In a process for producing regenerated cellulose fibers, in which particles of a flame-retardant solid are incorporated into the fiber, the particles are placed into a mold, the dimension of which in a major axis of the particle is greater than in the two orthogonal minor axes of the particle, and the major axes of the particles in the fiber are aligned in a preferential direction parallel to the spinning direction thereof | 2014-07-31 |
20140210121 | Semi Permanent Tool Coating Enhancement for Extended Number of Releases - A mold release agent having an extended life and methods for making and using the same are provided. The extended life mold release agent may include a first material configured to be placed in direct physical contact with a surface of a mold cavity to seal the surface. The extended life mold release agent may also include a second material configured to coat the first material to protect the first material during a foam production process performed within the mold cavity. The second material includes a siloxane oil. | 2014-07-31 |
20140210122 | Porous Manganese Oxide Absorbent for Lithium Having Spinel Type Structure and a Method of Manufacturing the Same - The present invention relates to a porous manganese oxide-based lithium absorbent and a method for preparing the same. The method includes the steps of preparing a mixture by mixing a reactant for the synthesis of a lithium-manganese oxide precursor powder with an inorganic binder, molding the mixture, preparing a porous lithium-manganese oxide precursor molded body by heat-treating the molded mixture, and acid-treating the porous lithium-manganese oxide precursor molded body such that lithium ions of the porous lithium-manganese oxide precursor are exchanged with hydrogen ions, wherein pores are formed in the lithium-manganese oxide precursor molded body by gas generated in the heat treatment. The porous manganese oxide-based lithium adsorbent according to the present invention is easy to handle and has many more adsorption reaction sites compared to existing molded adsorbents, thus providing high lithium adsorption efficiency. | 2014-07-31 |
20140210123 | PROCESS AND STRUCTURE TO UNCURL EMBOSSED THIN FLEX CIRCUITS - A method and structure for flattening or straightening a curled flexible printed circuit, such as a flexible printed circuit that has been curled during a contact embossing process. The structure can include a cylindrical opening and a support shaft suspended within the cylindrical opening that prevents buckling of the flexible printed circuit during straightening. To flatten the curled flexible printed circuit, the curled end of the flexible printed circuit can be inserted into the cylindrical opening until the curled end is wrapped partially or completely around the support shaft. | 2014-07-31 |
20140210124 | Cast Split Low Voltage Coil With Integrated Cooling Duct Placement After Winding Process - A coil for a transformer includes first and second coil segments with each coil segment being defined by successive layers of wound conductor sheeting. The coil segments are electrically connected together and are adjacent, defining a space therebetween. A plurality of cooling duct pairs are disposed between certain of the layers in each of the first and second coil segments such that, for each cooling duct pair, an end of a cooling duct disposed in the first coil segment is adjacent to an end of a cooling duct disposed in the second coil segment, with the ends being disposed in the space. A connector connects the adjacent ends of each pair of cooling ducts. | 2014-07-31 |
20140210125 | METHOD FOR MAKING CARBON NANTOUBE FILM - A method includes the following steps. An original carbon nanotube film is provided. The original carbon nanotube film includes a plurality of carbon nanotubes substantially oriented along a first direction. The original carbon nanotube film is suspended. The suspended original carbon nanotube film is soaked with an atomized organic solvent to shrink into a carbon nanotube film. Wherein the atomized organic solvent comprises a plurality of dispersed organic droplets with diameters of larger than or equal to 10 micrometers, and less than or equal to 100 micrometers. | 2014-07-31 |
20140210126 | PROCESS FOR THE MANUFACTURING OF DECORATIVE BOARDS - A process for manufacturing a coated panel. The process can comprise providing a panel of a desired dimension or cutting a panel to a desired dimension. In some embodiments a panel can be provided with joining functionality. A surface of the panel can be coated with a powder and the powder cured to thereby treat a surface of the panel. | 2014-07-31 |
20140210127 | FILTER ELEMENT COMPRISING MULTIFUNCTIONAL FIBROUS SMOKE-ALTERING MATERIAL - A filter element for use in a smoking article and providing filtration of particulate material and gaseous components of mainstream smoke is provided. The filter element includes a segment of fibrous tow comprising a plurality of individual filaments, wherein each individual filament includes a plurality of adsorbent material particles at least partially encapsulated with a removable encapsulant imbedded therein. The individual filaments may further include an outer coating that provides a plurality of reactive groups adapted for reaction with one or more components of mainstream smoke. Alternatively, the multifunctional filter element combines different fibrous filter materials, such as cellulose acetate or polyolefin filaments combined with activated carbon filaments and at least one of ion exchange filaments and catalytic filaments. A method of providing a cellulose acetate fibrous tow containing an imbedded adsorbent material is provided, wherein a plurality of encapsulated adsorbent particles are mixed with a cellulose acetate dope. | 2014-07-31 |
20140210128 | POLYMER INTERLAYERS COMPRISING SKIN LAYERS - The present invention is in the field of polymer interlayers used in multiple layer glass panels, and specifically the present invention is in the field of various performance enhancing agents for polymer interlayers and methods of effectively incorporating such performance enhancing agents into interlayers. | 2014-07-31 |
20140210129 | METHOD FOR MANUFACTURING CARBON ELECTRODE MATERIAL - A method of extruding a dry mixture includes providing mixing materials to a twin screw extruder. The mixing materials are substantially dry and may include a substantially unfibrillated binder and a carbon material. The method includes extruding the mixing materials via a twin screw extruder to form an extruded mixture that is substantially dry. In one embodiment, the substantially dry mixture exiting the extruder may be further processed to form an electrode material, such as by a calendaring step. | 2014-07-31 |
20140210130 | MIXTURE FOR FORMING MOLDED PRODUCTS - A mixture and method for forming molded products includes, in a preferred embodiment, Portland cement, shredded polystyrene, chopped fiberglass fibers, a waterproof coating agent, and water. These components may be mixed together, preferably in a large capacity mixer, to form a slurry, which may then be poured into a mold. The slurry is allowed to dry within the mold, and is then removed from the mold. The final product is a precast, molded item that is formed into a desired shape for use in the construction industry, and may be attached to a structure using screws, nails, adhesive, or any other suitable means of attachment. | 2014-07-31 |
20140210131 | ELECTROMAGNETIC NOISE SUPPRESSION SHEET, FLAT CABLE FOR HIGH-FREQUENCY SIGNALS, FLEXIBLE PRINTED CIRCUIT BOARD, AND PROCESS FOR PRODUCING THE ELECTROMAGNETIC NOISE SUPPRESSION SHEET - An electromagnetic noise suppression sheet obtained by using combination of a conductive carbon and spinel ferrite particles having a cumulative 50% volume particle diameter of 1 to 10 μm, can exhibit an excellent transmission attenuation power ratio and a reduced return loss in a near electromagnetic field, and is suitable for high-density mounting. The electromagnetic noise suppression sheet of the present invention can be produced by the process of the present invention which includes the steps of applying a coating material in which the conductive carbon and the spinel ferrite particles having a cumulative 50% volume particle diameter of 1 to 10 μm are dispersed, to form a coating film having a thickness of 10 to 100 μm after dried, and subjecting the resulting coating film to thermoforming under pressure. | 2014-07-31 |
20140210132 | SYSTEM AND METHOD OF MANUFACTURING A TWO-PART FASTENER - A system for manufacturing a two-part fastener may include a fastener-molding housing and an actuating assembly. The fastener-molding housing may include a fastener mold having a first mold section connected to a second mold section through a flash connection mold section. The fastener mold is configured to receive fastener-forming material to form a pre-engaged fastener having a first fastener portion within the first mold section and a second fastener portion within the second mold section. The first fastener portion is temporarily secured to the second fastener portion through a flash connection portion formed within the flash connection mold section. The an actuating assembly includes a stripper plate, a connecting member, and at least one ejection member. The connecting member is configured to securely retain the first fastener portion. The stripper plate is configured to be moved relative to the connecting member in order to drive one of the first or second fastener portions into the other of the first or second fastener portions to form a fully-formed fastener. The ejection member is configured to eject the fully-formed fastener from the actuating assembly. | 2014-07-31 |
20140210133 | PATTERN FORMING APPARATUS AND PATTERN FORMING METHOD - A pattern forming apparatus comprises: a first holder which holds a blanket carrying a pattern forming material on one surface in a horizontal posture with a carrying surface for the pattern forming material faced up; a second holder which holds a plate for patterning the pattern forming material or a substrate, to which a pattern is transferred, as a processing object such that the processing object is proximate to and facing the carrying surface of the blanket held on the first holder; and a push-up unit which partially pushes up an effective area in a central part of the blanket from a lower surface side of the blanket to bring the effective area into contact with the processing object held on the second holder and moves along the lower surface of the blanket to change a push-up position of the blanket. | 2014-07-31 |
20140210134 | NANOIMPRINTING APPARATUS, NANOIMPRINTING METHOD, DISTORTION IMPARTING DEVICE AND DISTORTION IMPARTING METHOD - A nanoimprinting apparatus is equipped with: a distortion imparting device that applies external force onto an imprinting member, which is one of a mold and a substrate, to maintain the imprinting member in a predetermined flexed state, thereby imparting permanent distortion to the imprinting member; and an imprinting unit that utilizes the imprinting member having the permanent distortion imparted thereto by the distortion imparting device to execute imprinting. A pattern of protrusions and recesses of the mold can be caused to contact resist from the central portion thereof utilizing any imprinting member, regardless of the rigidity of the imprinting member. | 2014-07-31 |
20140210135 | METHOD OF FABRICATING A PERFLUOROSULFONATED IONOMER MEMBRANE WITH A MOLECULAR ALIGNMENT - The current disclosure provides a method of fabricating a perfluorosulfonated ionomer membrane with a surface having an array of a plurality of fine pillars. The pillars are fabricated by a rapid deformation of the membrane via thermal imprint lithography under appropriate temperatures and pressures. This fabrication process induces the molecular alignment of a polymer in the pillars. As a result, the main chain via C—F and C—C bonds in the pillar is controlled to reduce the proton transport resistance in the pillars. Therefore, the fuel cells utilizing the invented membrane show improved performance under low humidity. | 2014-07-31 |
20140210136 | BINDING BISPHENOL A IN A POLYCARBONATE CONTAINER - Embodiments of the disclosure provide a method for removing residual BPA from a residual BPA-containing substance and a method for making a container with residual BPA removed. The method may consist of preparing a stabilization reagent, wherein water is removed from the stabilization reagent. The method may also include preparing the residual BPA-containing substance. The method may also include reacting the residual BPA-containing substance in a melt condensation process with the stabilization reagent, wherein the stabilization reagent is non-toxic. | 2014-07-31 |
20140210137 | Fixed Printhead Fused Filament Fabrication Printer and Method - A fused filament fabrication printer uses a plurality of fixed printing heads mounted to a structure over a build platform on which the model is built by constructing each layer of the model as the build platform is indexed through a multiplicity of successive print planes. The build platform may be in the form of a circular disk mounted for rotation about a z-axis and for linear motion along the z-axis between successive print planes, and for linear motion along a y-axis which is a selected radial direction perpendicular to the z-axis. Because the printheads are fixed, multiple printheads are easily affixed with respect to the build platform along the same radial line defining the y-axis transverse to the selected radial direction along which the build platform moves. | 2014-07-31 |
20140210138 | FORMING OR PATTERNING COMPOSITE MICROSTRUCTURES USING MICROFLUIDICS - Techniques comprising systems and methods for forming or pattering microstructures using microfluidics are described. A target structure can include a microchannel passage with a chamber into which a light hardenable material can be injected and selectively exposed to light to adhere to a desired location of a substrate. Unhardened material can be washed out of the chamber. One or more subsequent cycles can repeat the process using the same or a different material. A variety of composite microstructures can be created, including structures encapsulating viable living cells, such as for cell study or tissue engineering. | 2014-07-31 |
20140210139 | METHOD OF INCREASING THE HARDNESS OF WURTZITE CRYSTALLINE MATERIALS - The method of increasing the hardness of wurtzite crystalline materials is directed to the production of tool bits and inserts having a hardness approaching that of diamond, while simultaneously providing greater toughness and fracture resistance than diamond. The method includes forming a workpiece of boron nitride having a wurtzite crystal structure (wBN), and optionally combining boron nitride having a cubical crystal structure (cBN) with the wBN material. The workpiece is heat-treated by a defocused laser beam moved across the surface at a rate sufficient to preclude melting or deformation of the workpiece. The heated area is quickly quenched by a water jet, and a gas jet immediately follows the laser path to assure separation of the water from the laser contact area. The result is an increase in hardness of about 88%, from an initial hardness of about 40 GPa to a treated hardness of about 75 GPa. | 2014-07-31 |
20140210140 | NANOIMPRINTING METHOD AND RESIST COMPOSITION EMPLOYED IN THE NANOIMPRINTING METHOD - A nanoimprinting method employs a resist composition including polymerizable compounds and a polymerization initiating agent, each having absorption spectrum properties with absorption regions within a range from 250 nm to 500 nm. The polymerization initiating agent has an absorption region with a longer wavelength end wavelength longer than the longer wavelength end wavelength of the absorption region of the polymerizable compounds. Further, exposure of the resist composition is executed by light having spectral intensity properties that satisfy a predetermined relational formula. The present invention enables contamination of molds by adhered matter to be suppressed, and enables formation of resist patterns having sufficient etching resistance by nanoimprinting. | 2014-07-31 |
20140210141 | PROCESS OF MAKING DIMENSIONALLY STABLE NONWOVEN FIBROUS WEBS - Dimensionally stable nonwoven fibrous webs include a multiplicity of continuous fibers formed from one or more thermoplastic polyesters and polypropylene in an amount greater than 0% and no more than 10% by weight of the web. The webs have at least one dimension which decreases by no greater than 10% in the plane of the web when heated to a temperature above a glass transition temperature of the fibers. A spunbond process may be used to produce substantially continuous fibers that exhibit molecular orientation. A meltblown process may be used to produce discontinuous fibers that do not exhibit molecular orientation. In some embodiments, the fibers comprise a viscosity modifier and/or an anionic surfactant. The webs may be used as articles for filtration, sound absorption, thermal insulation, surface cleaning, cellular growth support, drug delivery, personal hygiene, medical apparel, or wound dressing. | 2014-07-31 |
20140210142 | Method of Post-Mold Crosslinking Thermoplastic Polyurethane Golf Ball Cover Compositions - A multi-piece golf ball is manufactured by molding a cover layer and a core layer to form a golf ball preform in a mold. The cover layer has a thermoplastic polyurethane composition which may be crosslinked by ultraviolet radiation. After molding, the golf ball preform is removed from the mold. A UV curable topcoat composition is applied to the golf ball preform. The golf ball preform is then irradiated with ultraviolet radiation under conditions sufficient to both crosslink the crosslinkable thermoplastic polyurethane and cure the UV curable topcoat composition. | 2014-07-31 |
20140210143 | Molding Composition With Reduced Coefficient Of Friction And Improved Release Properties - This invention relates to a composition and method of modifying the surface of a polymeric to produce a film or article with a reduced coefficient of friction (COF) and improved release properties. The reduced coefficient of friction improves both the slip and anti-blocking properties of the material as well aiding in processing of the polymeric material. Additionally, the invention improves demolding and release of the polymeric c material from other polymeric surfaces or adhesives as well as metal molding surfaces. | 2014-07-31 |
20140210144 | COMPOSITE DEGASSING TUBE - Disclosed is a degassing tube formed, at least partially, of a composite material and configured to degas molten metal. The degassing tube may include a supply tube configured to deliver gas received from a supply source to an outlet of the degassing tube, and a diffuser body coupled to the supply tube and formed, at least partially, of a composite material. In some embodiments, a combination of the composite material and a phosphate bonded refractory material may be used to form respective sections of the diffuser body. The composite material may include layers of a woven fiber reinforcing fabric embedded within a ceramic matrix. In some embodiments, the phosphate bonded refractory material is a castable monolithic refractory which chemically bonds to the composite material. | 2014-07-31 |
20140210145 | METAL MELTING FURNACE VORTEX CHAMBER BODY AND METAL MELTING FURNACE USING THE SAME - A metal melting furnace includes: a furnace body which includes a storage space storing molten metal; a vortex chamber body which includes a vortex chamber capable of communicating with the storage space of the furnace body; and a drop weir part which changes a communication state and an interruption state between the storage space and the vortex chamber, wherein the drop weir part includes a blind drop weir and an opening type drop weir which are formed as separate members, wherein at least the blind drop weir is movable up and down with respect to the vortex chamber body and is selectively positioned at an upward movement position and a downward movement position so as to switch the communication state and the interruption state, and wherein the opening type drop weir includes notches which communicate the vortex chamber and the storage space with each other in the communication state. | 2014-07-31 |
20140210146 | SPRING LEG OF FRONT FORK - In a spring leg of a front fork, the capacity of a rebound air spring chamber is expanded and a stable rebound reaction force is ensured, and the spring leg of the front fork is provided with a sub-tank including an air chamber communicating with a rebound air spring chamber. | 2014-07-31 |
20140210147 | SHOCK ABSORBER - A shock absorber includes a shock absorbing member being to be rotated around an axis and having an outer circumferential surface being in contact with an end portion of a member that moves back and forth with respect to the shock absorbing member, the shock absorbing member having at least one of elasticity and viscosity against an movement of the member, each of the elasticity and viscosity changing in accordance with a rotation angle of the shock absorbing member around the axis, and a device that changes the rotation angle of the shock absorbing member to adjust at least one of the elasticity and the viscosity against the member. | 2014-07-31 |
20140210148 | CYLINDRICAL VIBRATION-DAMPING DEVICE - A cylindrical vibration-damping device wherein an outer cylindrical member is made in a configuration of two sections divided along an circumference, the outer cylindrical member being externally fitted onto intermediate rings in a non-adhesive manner by means of having the intermediate rings sandwiched by the outer cylindrical member in a radial direction, and a plurality of regulating protrusions protruding inward in the radial direction are formed on the outer cylindrical member at a given distance and arranged on both sides of the intermediate rings in an axial direction so as to provide a positioning member that positions the intermediate rings with respect to the outer cylindrical member in the axial direction by means of abutting the intermediate rings against the regulating protrusions in the axial direction. | 2014-07-31 |
20140210149 | FIXTURE FOR SELECTABLY HOLDING DISSIMILAR WORKPIECES - A fixture for selectably supporting a number of dissimilar workpieces. The fixture includes a frame with one or more rotatable workpiece tooling assemblies. Each workpiece tooling assembly has multiple faces to which is mounted workpiece support tooling. The workpiece support tooling may be designed to support dissimilar workpieces, such that a single fixture may support any of a given number of workpieces by simply rotating the workpiece tooling assembly or assemblies until the corresponding support tooling is properly positioned. A locking assembly may be provided to releasably secure each workpiece tooling assembly in the various support orientations that coincide with each of its faces. | 2014-07-31 |
20140210150 | ADJUSTABLE WORK HOLDING SYSTEM - An adjustable work holding system can quickly adjust for different sized work pieces and can grip components with a small, about 0.100 inch, grip on the material, eliminating wasted material. Adjustable jaws can be mounted on a base plate and tightened into a desired position. Grippers are attached to the jaws and extend only about 0.100 inch over the jaws to provide a gripping surface. The grippers can be resiliently held open by a resilient member, such as an O-ring. A drive bolt for each gripper can be tightened to move the grippers closer together and grip material. The grippers provide strong holding forces and pulls the work piece down, which allows for more aggressive machining operations as compared to conventional work holding systems. | 2014-07-31 |
20140210151 | Ningbo Yinzhou Zhonghe Hualida Plastic Mould Factory - A die pressing plate including a main body, an adjusting groove, and a main through hole, each of the left or right surface of the main through hole has at least one guiding groove; a lower cushion block having a top curve surface; and an upper cushion block having a lower curve surface for engaging the top curve surface of the lower cushion block, at least one extension portion protruding away from the lower curve surface, the at least one extension portion having two blocking portions, the blocking portions of the at least one extension portion engage the at least one guiding groove, the at least one extension portion extends elastically when the blocking portion slide downwardly, and the blocking portion is blocked by the bottom surface of the main body. The die pressing plate is simple in structure, fast and convenient to assemble and use, and low in cost. | 2014-07-31 |
20140210152 | SHEET CONVEYANCE DEVICE, DOCUMENT CONVEYANCE DEVICE, AND IMAGE FORMING APPARATUS - In a sheet conveyance device, if a sheet has not been detected at a second position when a predetermined time has elapsed since the sheet has been detected at a first position, a separating portion switches operation thereof from a separating operation to a non-separating operation of conveying the sheet from upstream to downstream in a sheet conveyance path, and a sheet feed portion continues a feeding operation. If the sheet has not been detected at the second position by the time a predetermined time has elapsed since the separating portion has started the non-separating operation, the separating portion and the sheet feed portion stop driving, and if the sheet has been detected at the second position by the time, the separating portion switches operation thereof from the non-separating operation to the separating operation, and the sheet feed portion continues the feeding operation. | 2014-07-31 |
20140210153 | PRINTING MACHINE - A printing machine includes: a paper feed unit configured to feed a sheet of paper; a suction transfer unit configured to transfer the sheet of paper fed by the paper feed unit in a transfer direction, with the sheet of paper being attached by suction onto a transfer surface; a transfer and paper discharge unit configured to receive the sheet of paper from the suction transfer unit to transfer and discharge the sheet of paper; and a controller configured to control a suction force of the suction transfer unit in accordance with a paper type. When the controller changes the suction force of the suction transfer unit between successive sheets of paper, the controller is configured prior to a discharge of a precedent sheet of paper to change the suction force of the suction transfer unit and drive the paper feed unit to feed a subsequent sheet of paper. | 2014-07-31 |
20140210154 | SHEET FEED DEVICE AND IMAGE RECORDING APPARATUS HAVING SUCH SHEET FEED DEVICE - An image recording apparatus including a first tray having a first holding portion for holding sheets, a second tray disposed above the first tray and including a second holding portion for holding sheets, a sheet feeder that selectively feeds a sheet from one of the first tray and the second tray in a sheet feed direction, a recording unit that records an image on the sheet fed by the sheet feeder, and a discharge roller that discharges the sheet on which the image is recorded by the recording unit. The second holding portion of the second tray moves above the first holding portion of the first tray. The second tray further includes a discharged sheet receiving portion for receiving the sheet discharged by the discharge roller. The second tray including the discharged sheet receiving portion pivots relative to the first tray. | 2014-07-31 |
20140210155 | CONVEYOR DEVICE AND IMAGE FORMING APPARATUS - A conveyor device includes a support portion in which a through hole is formed and which is configured to support a to-be-conveyed medium;a negative pressure chamber configured to cause negative pressure to act on the to-be-conveyed medium through the through hole to suck the to-be-conveyed medium to the support portion; and a conveyance section configured to convey the to-be-conveyed medium sucked to the support portion. The negative pressure chamber includes a wall in which a communication hole to communicate the negative pressure chamber with the air is formed. The conveyor device further includes a shutter configured to slide on the wall of the negative pressure chamber to open/close the communication hole. | 2014-07-31 |
20140210156 | Sheet Ejector and Sheet Feeder Having the Same - A sheet ejector is provided that includes an ejection roller unit including a first roller and a second roller, a pushing member that rotates concentrically with the first roller and includes a projection formed on a circumferential surface thereof, the projection contacting a trailing end of a sheet to be ejected and pushing out the sheet in an ejecting direction, and a contact member including a contact portion disposed, in a view along a rotational-axis direction of the first roller, in such a position as to overlap or be downstream relative to a most downstream position of a rotational trajectory of the pushing member in the ejecting direction, the contact portion configured to extend up to a position closer to the second roller than the rotational axis of the first roller and contact the trailing end of the sheet ejected from the ejection roller unit. | 2014-07-31 |
20140210157 | SHEET FEEDER AND IMAGE FORMING APPARATUS INCORPORATING SAME - A sheet feeder, which is included in an image forming apparatus, includes a sheet tray on which a recording medium is loaded, a regulating member, a link mechanism, and a guide storage. The regulating member is movably disposed to regulate a position of the recording medium loaded on the sheet tray and has guide portions having a height higher than a maximum possible thickness of a sheet stack loadable on the sheet tray and the height thereof is changeable. The link mechanism rotatably supports the sheet tray with respect to a tray storing position and a sheet feeding position. The guide storage stores the guide portions of the regulating member as the link mechanism moves the sheet tray from the sheet feeding position to the tray storing position and has a depth set to be greater than a length in a height direction of the guide portions. | 2014-07-31 |
20140210158 | APPARATUS AND METHODS FOR DETERMINING STACKER CAPACITY - A media stacking system suitable for processing flexible substrate sheets includes an elevating stacker support and a controller configured to control the elevating stacker support according to a weight of a cut sheet stack supported by the elevating stacker support in loading positions. | 2014-07-31 |
20140210159 | MEDIUM CARRYING DEVICE AND IMAGE FORMING APPARATUS - A medium carrying device includes an apparatus body, medium guide unit that is detachable with respect to the apparatus body, a carrying roller that is disposed in the apparatus body, and is configured to rotate to carry a print medium passing through the medium guide unit, and a driven roller that is disposed in the medium guide unit at a position corresponding to the carrying roller in a contacting manner so that the driven roller rotates in accordance with a rotation of the carrying roller. | 2014-07-31 |
20140210160 | SHEET FEEDER - A sheet feeder is provided that includes a driving roller, a driven roller configured to rotate in accordance with rotation of the driving roller and feed a sheet while pinching the sheet with the driving roller, an elastic shaft inserted through the driven roller and configured to rotatably support the driven roller, the elastic shaft including a protrusion formed on at least one end of the elastic shaft in an axial direction of the elastic shaft, the protrusion protruding outward in a radial direction of the driven roller, and two recess-shaped bearings configured to support two end portions of the elastic shaft in the axial direction, respectively, at least one of the bearings including a contact surface configured to contact the protrusion when the elastic shaft is supported by the bearings. | 2014-07-31 |
20140210161 | VALUABLE FILE IDENTIFICATION DEVICE - A valuable file identification device, comprising a housing; a hollow transparent drum; an annular clamping belt supported by at least two tension rollers and pressing against the transparent drum, the outer surface of the annular clamping belt and the outer surface of the transparent drum forming a clamping and conveying channel for the valuable file, and the length of the clamping and conveying channel being greater than that of the valuable file in the conveying direction; at least one information acquisition device, the information acquisition element of the information acquisition device being adjacent to the inner surface of the transparent drum, facing at least a part of the outer surface of the annular clamping belt, and being fixed relative to the side wall of the housing; and a power-driven device respectively driving the transparent drum and the annular clamping belt to move synchronously in opposite directions. | 2014-07-31 |
20140210162 | MEDIUM CONVEYANCE DEVICE AND IMAGE FORMATION APPARATUS - A medium conveyance device includes a pressed member, a first retention member retaining the pressed member and including a first bias-member retention portion, a press member provided facing the pressed member, a second retention member being provided movable relative to the first retention member and retaining the press member wherein the second retention member includes a second bias-member retention portion, and a bias member provided between the first bias-member retention portion and the second bias-member retention portion and supported at one end thereof by the first bias-member retention portion and at another end thereof by the second bias-member retention portion, thereby pressing the press member against the pressed member. | 2014-07-31 |
20140210163 | SHEET STORAGE APPARATUS AND IMAGE FORMING APPARATUS - A sheet storage apparatus for storing sheets including a sheet storage unit including a lower guide configured to guide a lower surface of the conveyed sheet, an upper guide configured to guide an upper surface of the conveyed sheet, and a shutting-off unit provided in one of the lower guide and the upper guide, configured to be movable around a rotational axis and between a shutting-off position at which a downstream end of the conveying direction of the sheet stored in the sheet storage unit is shut off and a retracting position for retracting from the shutting-off position, and a plurality of stages of sheet storage units is vertically stacked and at least a part of the shutting-off unit overlaps the rotational axis of the adjacent sheet storage unit in a vertical direction at the shutting-off position. | 2014-07-31 |
20140210164 | TWO-WHEEL ROULETTE GAME - Two modified roulette wheels are used to generate a pair of cards for a card game. Players may wager on one or more outcomes selected from a group of predetermined outcomes including one of the wheels producing a winning card value, the wheels producing equal card values, one or more of the wheels producing a card value below a first predetermined value, and one or more of the wheels producing a card value above a second predetermined value. The wheels are spun to produce one or more game outcomes from the group of predetermined outcomes, and the wagers are settled. | 2014-07-31 |
20140210165 | Surface Sealing System - A method and apparatus comprising a sealing member, an integral structure associated with the sealing member, and an engagement section extending from the sealing member. The sealing member is configured to be attached to a surface of an object. The sealing member is consolidated with the integral structure. The engagement section is deformable and configured to engage a receiving structure in the object. | 2014-07-31 |
20140210166 | CARTRIDGE SEAL ASSEMBLIES AND ASSOCIATED METHODS - The present cartridge seal assemblies pertain to rotary lip-type seals. In certain embodiments, a sealing member is constructed of a relatively hard material that increases the lifespan of the sealing member. The sealing member is energized with a canted-coil spring, which in some embodiments includes an adjustable spring force. The present embodiments enable control of sealing force to achieve an appropriate sealing force between the sealing member and the shaft based on factors such as temperature, pressure, rotary speed, properties of fluid media, etc. to achieve longer seal life. | 2014-07-31 |
20140210167 | AIR CYCLE MACHINE WITH SEAL SHAFT - A seal shaft for use in an air cycle machine has two axial edges. An axial distance is measured between contact faces at the axial edges, with a tolerance to the dimension. A greatest variation between the axial distance at a plurality of spaced locations on the edge face is maintained with a ratio of the greatest variation to the tolerance being less than 0.2. A rotor assembly, an air cycle machine and a method are also disclosed. | 2014-07-31 |
20140210168 | CHUCK DEVICE HAVING TWO COLLETS - A chuck device includes front and rear collets, a driving ring, and a driving sleeve. The driving ring and the driving sleeve can be driven hydraulically to move toward or away from each other. When the driving ring and the driving sleeve are moved hydraulically away from each other, each of the front and rear collets is moved to a release position, when the driving ring and the driving sleeve are moved hydraulically toward each other, each of the front and rear collets is moved to a clamping position. | 2014-07-31 |
20140210169 | SHRINK FIT TOOL HOLDER - A tool holder has a chuck portion with a retaining bore in which a cutting tool can be inserted. The tool has flat surfaces extending from its end, and circumferential groove at rear ends of the flat surfaces. When the tool is inserted into the retaining bore, first protrusions of the tool holder pass through spaces between the flat surfaces and the inner wall of the retaining bore and fitted in the groove. When the tool is turned, the protrusions move in and engage the side edges of the groove, thus preventing the tool from pulling out of the chuck portion. When the first protrusions are fitted in the groove, second protrusions of the tool holder are located on the flat surfaces. When the tool is turned, the second protrusions are received in ends of the respective spaces, thereby preventing rotation of the tool relative to the chuck portion. | 2014-07-31 |
20140210170 | AIR SPRING FOR VEHICLES - An air spring for a vehicle with a lifting function includes an upper rolling piston and a lower rolling piston disposed opposite to each other. A rolling bellows encloses a compressed air space and has double rolling folds. The pressure effective surfaces of the rolling folds are coordinated with each other in such a manner that, during dynamic spring operation of the air spring over a predetermined spring travel, the pressure effective surface of the rolling fold on the lower rolling piston is larger than the pressure effective surface of the rolling fold on the upper rolling piston. | 2014-07-31 |
20140210171 | BASKET - A basket for public use includes a substantially upright tapered body for repeatedly moving purchasable items within a store; the body includes an interior space and an open top; the open top permits access to the interior for placing the plurality of purchasable items in the interior. Wheels allow rolling the basket within the store and a telescoping handle provided on a face of the body rollingly pulls the basket. A like-basket is nestable in the basket in a first and a second position; eg the telescoping handles are proximate to each other or the telescoping handles are distal from each other. | 2014-07-31 |
20140210172 | WHEELED CART FOR CARRYING AND SECURING SKI EQUIPMENT AND PERSONAL ITEMS. - A wheeled hand-cart configured to carry and secure ski equipment and accessories is described. The hand-cart is of the type where a user adjusts an attitude of the hand-cart for rolling travel so as to balance the load about a wheel axis of the hand-cart. The hand-cart includes a load platform extensive enough to carry ski boots as well as a large securable container. Ski mounts joined to the hand-cart carry skis outboard of the load platform at an attitude that provides for ample clearance between the tips of the skis and the user's upper body. The ski-carrying cart may include a voluminous securable container to serve as a mobile ski locker, and locking devices may be provided to secure the skis and the cart. The hand-cart is further configured to partially collapse to a narrow-stance mode adapted for rolling travel in narrow spaces. | 2014-07-31 |
20140210173 | Auxiliary Axle and Suspension Assembly - A vehicle suspension assembly includes an axle member movable between a first position and a second position, mounting brackets adapted to couple to a vehicle frame assembly, trailing arms pivotably coupled to mounting brackets and pivotably coupled to the axle member, a lift arrangement including a pair of diaphragm chambers each having a push plate and a flexible bladder, the push plate of the diaphragm chamber dividing the associated diaphragm chamber into a first compartment and a second compartment, the first compartment of each diaphragm chamber being adjustably pressurized to move the push plate of the associated diaphragm chamber, and at least one push rod defining a single longitudinal axis and connected to each push plate such that pressurization of the diaphragm chambers cause a translational movement of the at least one push rod, thereby causing the axle member to move between the first and second positions. | 2014-07-31 |
20140210174 | Auxiliary Axle and Suspension Assembly - A vehicle suspension assembly includes first and second mounting brackets each adapted to couple to a vehicle frame assembly, first and second trailing arms each having a first end pivotably coupled to the mounting brackets, and a second end located outboard of the first end of the associated trailing arm; an axle member having a first end and a second end; an integrated first mounting arrangement and an integrated second mounting arrangement coupled to the associated ends of the axle member, wherein the mounting arrangements pivotably couple the second end of the associated trailing arm to one of the ends of the axle member, and wherein the mounting arrangements couple one of the ends of the axle member to the spindle assembly. | 2014-07-31 |
20140210175 | SKATEBOARD WITH HIGHER OPERABILITY AND CONTROLLABILITY - A skateboard includes a board body, a front roller assembly and a rear roller assembly. The front and rear roller assemblies are mounted under a bottom face of the board body. The skateboard further includes an arch contact section. The arch contact section is a raised section disposed on a top face of the board body near the rear end thereof. When a user uses the skateboard, the arch of the user's rear foot is in snug contact with the arch contact section, whereby the foot is in good contact with the board body of the skateboard. The arch contact section also provides antislip effect for the user's foot. By means of the arch contact section, the user can more easily operate/control the skateboard. | 2014-07-31 |