31st week of 2016 patent applcation highlights part 60 |
Patent application number | Title | Published |
20160225698 | SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225699 | INTEGRATED ELECTRONIC DEVICE HAVING A DISSIPATIVE PACKAGE, IN PARTICULAR DUAL SIDE COOLING PACKAGE | 2016-08-04 |
20160225700 | SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225701 | SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225702 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-08-04 |
20160225703 | POWER SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME | 2016-08-04 |
20160225704 | SEMICONDUCTOR PACKAGE STRUCTURE AND FORMING METHOD THEREOF | 2016-08-04 |
20160225705 | CORELESS MULTI-LAYER CIRCUIT SUBSTRATE WITH MINIMIZED PAD CAPACITANCE | 2016-08-04 |
20160225706 | PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2016-08-04 |
20160225707 | ELECTRONIC ASSEMBLY THAT INCLUDES STACKED ELECTRONIC DEVICES | 2016-08-04 |
20160225708 | SEMICONDUCTOR SUBSTRATE AND MANUFACTURING METHOD THEREOF | 2016-08-04 |
20160225709 | METAL LAYOUT FOR RADIO-FREQUENCY SWITCHES | 2016-08-04 |
20160225710 | SEMICONDUCTOR DEVICE WITH LINE-TYPE AIR GAPS AND METHOD FOR FABRICATING THE SAME | 2016-08-04 |
20160225711 | SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225712 | ELECTRO-MIGRATION ENHANCING METHOD FOR SELF-FORMING BARRIER PROCESS IN COPPER METTALIZATION | 2016-08-04 |
20160225713 | SEMICONDUCTOR PACKAGE DESIGN PROVIDING REDUCED ELECTROMAGNETIC COUPLING BETWEEN CIRCUIT COMPONENTS | 2016-08-04 |
20160225714 | SEMICONDUCTOR DEVICES AND METHODS FOR FORMING THE SAME | 2016-08-04 |
20160225715 | MICROELECTRONIC TRANSISTOR CONTACTS AND METHODS OF FABRICATING THE SAME | 2016-08-04 |
20160225716 | Structure and Method for a Low-K Dielectric with Pillar-Type Air-Gaps | 2016-08-04 |
20160225717 | ELECTRONIC COMPONENT | 2016-08-04 |
20160225718 | DEVICE INCLUDING A METALLIZATION LAYER AND METHOD OF MANUFACTURING A DEVICE | 2016-08-04 |
20160225719 | FOLDED BALLISTIC CONDUCTOR INTERCONNECT LINE | 2016-08-04 |
20160225720 | Method and Apparatus for Creating and Placing a Micro Message | 2016-08-04 |
20160225721 | SEMICONDUCTOR PACKAGE | 2016-08-04 |
20160225722 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD, AND ELECTRONIC APPARATUS | 2016-08-04 |
20160225723 | ENGINEERED CARRIER WAFERS | 2016-08-04 |
20160225724 | DEVICE AND METHOD FOR GENERATING IDENTIFICATION KEY | 2016-08-04 |
20160225725 | LASER DETECTOR USING LATCH AND SEMICONDUCTOR DEVICE INCLUDING THE SAME | 2016-08-04 |
20160225726 | SEMICONDUCTOR DEVICES HAVING AN ELECTRO-STATIC DISCHARGE PROTECTION STRUCTURE | 2016-08-04 |
20160225727 | Method and Apparatus of ESD Protection in Stacked Die Semiconductor Device | 2016-08-04 |
20160225728 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2016-08-04 |
20160225729 | SEMICONDUCTOR DEVICE, INTEGRATED CIRCUIT STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF | 2016-08-04 |
20160225730 | ELECTRODE CONNECTION STRUCTURE AND ELECTRODE CONNECTION METHOD | 2016-08-04 |
20160225731 | METHODS OF FORMING CONDUCTIVE PILLARS FOR SEMICONDUCTOR DEVICES, METHODS OF FORMING ELECTRICAL INTERCONNECTS, AND SEMICONDUCTOR DEVICES | 2016-08-04 |
20160225732 | SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCING STRESS | 2016-08-04 |
20160225733 | Chip Scale Package | 2016-08-04 |
20160225734 | SEMICONDUCTOR DEVICES AND PACKAGES AND METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES | 2016-08-04 |
20160225735 | Method for Producing a Connecting Medium on an Assembly Partner, Method for Producing a Material-Fit Connection Between an Assembly Partner and a Metal Layer, and a System for Carrying out the Methods | 2016-08-04 |
20160225736 | Fog Bonding Device and Method Thereof | 2016-08-04 |
20160225737 | SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME | 2016-08-04 |
20160225738 | POWER SEMICONDUCTOR CHIP WITH A METALLIC MOULDED BODY FOR CONTACTING THICK WIRES OR STRIPS AND METHOD FOR THE PRODUCTION THEREOF | 2016-08-04 |
20160225739 | OFF SUBSTRATE KINKING OF BOND WIRE | 2016-08-04 |
20160225740 | METHOD FOR MANUFACTURING SEMICONDUCTOR DISPLAY PANEL | 2016-08-04 |
20160225741 | METHODS FOR CONSTRUCTING THREE DIMENSIONAL (3D) INTEGRATED CIRCUITS (ICs) (3DICs) AND RELATED SYSTEMS | 2016-08-04 |
20160225742 | POLYGON DIE PACKAGING | 2016-08-04 |
20160225743 | PACKAGE-ON-PACKAGE TYPE STACK PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2016-08-04 |
20160225744 | SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, MEMORY CARDS INCLUDING THE SAME AND ELECTRONIC SYSTEMS INCLUDING THE SAME | 2016-08-04 |
20160225745 | Semiconductor Device Having a Chip Under Package | 2016-08-04 |
20160225746 | MULTIPLE DIE STACKING FOR TWO OR MORE DIE | 2016-08-04 |
20160225747 | LIGHTING MODULE WITH SEMICONDUCTOR LIGHT SOURCES AND CARRIER PLATE | 2016-08-04 |
20160225748 | PACKAGE-ON-PACKAGE (POP) STRUCTURE | 2016-08-04 |
20160225749 | Optoelectronic Semiconductor Chip and Optoelectronic Component | 2016-08-04 |
20160225750 | ELECTRIC POWER CONVERTER AND POWER MODULE | 2016-08-04 |
20160225751 | Hollow Metal Pillar Packaging Scheme | 2016-08-04 |
20160225752 | SEMICONDUCTOR DEVICE AND LAYOUT METHOD THEREOF | 2016-08-04 |
20160225753 | MEMORY CIRCUIT, LAYOUT OF MEMORY CIRCUIT, AND METHOD OF FORMING LAYOUT | 2016-08-04 |
20160225754 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-08-04 |
20160225755 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE AND ELECTROSTATIC DISCHARGE PROTECTION SYSTEM | 2016-08-04 |
20160225756 | METHOD OF FORMING AN ESD DEVICE AND STRUCTURE THEREFOR | 2016-08-04 |
20160225757 | ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE IN A SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225758 | SEMICONDUCTOR DEVICE COMPRISING AN ESD PROTECTION CIRCUIT | 2016-08-04 |
20160225759 | POWER FET WITH A RESONANT TRANSISTOR GATE | 2016-08-04 |
20160225760 | TRANSITION FREQUENCY MULTIPLIER SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225761 | SEMICONDUCTOR DEVICE HAVING A PLURALITY OF FINS AND METHOD FOR FABRICATING THE SAME | 2016-08-04 |
20160225762 | SINGLE DIFFUSION BREAK WITH IMPROVED ISOLATION AND PROCESS WINDOW AND REDUCED COST | 2016-08-04 |
20160225763 | SPECIAL CONSTRUCT FOR CONTINUOUS NON-UNIFORM RX FINFET STANDARD CELLS | 2016-08-04 |
20160225764 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-08-04 |
20160225765 | Multi-Fin Device and Method of Making Same | 2016-08-04 |
20160225766 | SEMICONDUCTOR DEVICE WITH LOW-K SPACER | 2016-08-04 |
20160225767 | OFF-CENTER GATE CUT | 2016-08-04 |
20160225768 | III-V CMOS INTEGRATION ON SILICON SUBSTRATE VIA EMBEDDED GERMANIUM-CONTAINING LAYER | 2016-08-04 |
20160225769 | CIRCUIT DESIGN SYSTEM AND SEMICONDUCTOR CIRCUIT DESIGNED BY USING THE SYSTEM | 2016-08-04 |
20160225770 | REPLACEMENT FIN PROCESS IN SSOI WAFER | 2016-08-04 |
20160225771 | FABRICATING FIN STRUCTURES WITH DOPED MIDDLE PORTIONS | 2016-08-04 |
20160225772 | SEMICONDUCTOR DEVICE AND MEMORY DEVICE | 2016-08-04 |
20160225773 | SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225774 | STORAGE ELEMENT, STORAGE DEVICE, AND SIGNAL PROCESSING CIRCUIT | 2016-08-04 |
20160225775 | METHODS FOR PRODUCING A THIN FILM FERROELECTRIC DEVICE USING A TWO-STEP TEMPERATURE PROCESS | 2016-08-04 |
20160225776 | Method to Improve Floating Gate Uniformity for Non-Volatile Memory Devices | 2016-08-04 |
20160225777 | NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF | 2016-08-04 |
20160225778 | NON-VOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-08-04 |
20160225779 | SEMICONDUCTOR NONVOLATILE MEMORY ELEMENT AND MANUFACTURING METHOD THEREOF | 2016-08-04 |
20160225780 | Method of Forming a Logic Compatible Flash Memory | 2016-08-04 |
20160225781 | THREE-DIMENSIONAL NONVOLATILE MEMORY DEVICES INCLUDING INTERPOSED FLOATING GATES | 2016-08-04 |
20160225782 | METHODS OF ADJUSTING FLATBAND VOLTAGE OF A MEMORY DEVICE | 2016-08-04 |
20160225783 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME | 2016-08-04 |
20160225784 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225785 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | 2016-08-04 |
20160225786 | VERTICAL MEMORY DEVICES HAVING CHARGE STORAGE LAYERS WITH THINNED PORTIONS | 2016-08-04 |
20160225787 | DISPLAY APPARATUS | 2016-08-04 |
20160225788 | THIN FILM TRANSISTOR ARRAY PANEL AND A METHOD FOR MANUFACTURING THE SAME | 2016-08-04 |
20160225789 | REPLACEMENT FIN PROCESS IN SSOI WAFER | 2016-08-04 |
20160225790 | SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225791 | ULTRATHIN BODY (UTB) FINFET SEMICONDUCTOR STRUCTURE | 2016-08-04 |
20160225792 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-08-04 |
20160225793 | DIRECT BANDGAP SUBSTRATES AND METHODS OF MAKING AND USING | 2016-08-04 |
20160225794 | ARRAY SUBSTRATE AND METHOD FOR PRODUCING THE SAME AND DISPLAY APPARATUS | 2016-08-04 |
20160225795 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE, OR DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225796 | SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR DEVICE | 2016-08-04 |
20160225797 | DISPLAY DEVICE INCLUDING TRANSISTOR AND MANUFACTURING METHOD THEREOF | 2016-08-04 |