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31st week of 2021 patent applcation highlights part 66
Patent application number
Title
Published
20210242123
CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
2021-08-05
20210242124
PHOTONIC WAFER COMMUNICATION SYSTEMS AND RELATED PACKAGES
2021-08-05
20210242125
STACKED INTEGRATED CIRCUIT DEVICES INCLUDING A ROUTING WIRE
2021-08-05
20210242126
SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME
2021-08-05
20210242127
BACK-END-OF-LINE (BEOL) SIDEWALL METAL-INSULATOR-METAL (MIM) CAPACITOR
2021-08-05
20210242128
THREE-DIMENSIONAL MEMORY DEVICE CONTAINING HORIZONTAL AND VERTICAL WORD LINE INTERCONNECTIONS AND METHODS OF FORMING THE SAME
2021-08-05
20210242129
SEMICONDUCTOR DEVICE HAVING INTER-METAL DIELECTRIC PATTERNS AND METHOD FOR FABRICATING THE SAME
2021-08-05
20210242130
Random Cut Patterning
2021-08-05
20210242131
METHODS FOR FABRICATING MICROELECTRONIC DEVICES WITH CONTACTS TO CONDUCTIVE STAIRCASE STEPS, AND RELATED DEVICES AND SYSTEMS
2021-08-05
20210242132
MICROELECTRONIC DEVICE INCLUDING FIBER-CONTAINING BUILD-UP LAYERS
2021-08-05
20210242133
SEMICONDUCTOR DEVICE
2021-08-05
20210242134
COMPONENT-EMBEDDED SUBSTRATE
2021-08-05
20210242135
DISPLAY DEVICES AND METHODS FOR MANUFACTURING THE SAME
2021-08-05
20210242136
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
2021-08-05
20210242137
ELECTROMAGNETIC WAVE SHIELDING SHEET
2021-08-05
20210242138
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
2021-08-05
20210242139
MITIGATING THERMAL-MECHANICAL STRAIN AND WARPAGE OF AN ORGANIC LAMINATE SUBSTRATE
2021-08-05
20210242140
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
2021-08-05
20210242141
Physical Unclonable Functions in Integrated Circuit Chip Packaging for Security
2021-08-05
20210242142
SEMICONDUCTOR DEVICE INCLUDING PHYSICAL UNCLONABLE FUNCTION
2021-08-05
20210242143
Semiconductor Device Having Features to Prevent Reverse Engineering
2021-08-05
20210242144
SEMICONDUCTOR DEVICE
2021-08-05
20210242145
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
2021-08-05
20210242146
FLIP CHIP PACKAGING REWORK
2021-08-05
20210242147
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
2021-08-05
20210242148
SEMICONDUCTOR DEVICE HAVING ALIGNMENT PADS AND METHOD OF MANUFACTURING THE SAME
2021-08-05
20210242149
SEMICONDUCTOR STRUCTURE, REDISTRIBUTION LAYER (RDL) STRUCTURE, AND MANUFACTURING METHOD THEREOF
2021-08-05
20210242150
Semiconductor Package System and Method
2021-08-05
20210242151
NIckel Alloy for Semiconductor Packaging
2021-08-05
20210242152
SELECTIVE ALTERATION OF INTERCONNECT PADS FOR DIRECT BONDING
2021-08-05
20210242153
ISOLATION STRUCTURE FOR BOND PAD STRUCTURE
2021-08-05
20210242154
INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
2021-08-05
20210242155
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
2021-08-05
20210242156
SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
2021-08-05
20210242157
INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS ELECTRICALLY COUPLED THROUGH A SYNCHRONIZATION SIGNAL
2021-08-05
20210242158
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
2021-08-05
20210242159
PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE THEREOF
2021-08-05
20210242160
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A THERMAL CONDUCTIVE PACKAGE SUBSTRATE WITH DIE REGION SPLIT, AND RELATED FABRICATION METHODS
2021-08-05
20210242161
SEMICONDUCTOR ASSEMBLY AND METHOD OF MANUFACTURING THE SAME
2021-08-05
20210242162
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2021-08-05
20210242163
SEMICONDUCTOR ARRANGEMENT AND METHOD FOR PRODUCING THE SAME
2021-08-05
20210242164
RESIST STRUCTURE FOR FORMING BUMPS
2021-08-05
20210242165
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
2021-08-05
20210242166
LOW TEMPERATURE HYBRID BONDING STRUCTURES AND MANUFACTURING METHOD THEREOF
2021-08-05
20210242167
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED METHODS
2021-08-05
20210242168
CHIP ON WAFER ON SUBSTRATE OPTOELECTRONIC ASSEMBLY AND METHODS OF ASSEMBLY THEREOF
2021-08-05
20210242169
ENCAPSULATED FAN-IN SEMICONDUCTOR PACKAGE WITH HEAT SPREADER AND METHOD OF MANUFACTURING THE SAME
2021-08-05
20210242170
HIGH DENSITY 3D INTERCONNECT CONFIGURATION
2021-08-05
20210242171
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
2021-08-05
20210242172
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
2021-08-05
20210242173
Stacked Integrated Circuit Structure and Method of Forming
2021-08-05
20210242174
MULTI-HEIGHT INTERCONNECT STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS
2021-08-05
20210242175
SEMICONDUCTOR MEMORY DEVICE
2021-08-05
20210242176
SEMICONDUCTOR PACKAGES
2021-08-05
20210242177
PACKAGE STRUCTURE WITH UNDERFILL
2021-08-05
20210242178
THROUGH-SILICON VIA INTERCONNECTION STRUCTURE AND METHODS FOR FABRICATING SAME
2021-08-05
20210242179
POWER SEMICONDUCTOR MODULE
2021-08-05
20210242180
LED COLOR DISPLAYS WITH MULTI-LED SUB-PIXELS
2021-08-05
20210242181
METHOD FOR MANUFACTURING PLANAR LIGHT SOURCE
2021-08-05
20210242182
WHITE LIGHT SOURCE SYSTEM
2021-08-05
20210242183
PORTABLE LIGHT
2021-08-05
20210242184
THREE DIMENSIONAL INTEGRATED CIRCUIT
2021-08-05
20210242185
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THEREOF
2021-08-05
20210242186
PACKAGE-ON-PACKAGE (POP) SEMICONDUCTOR PACKAGE AND ELECTRONIC SYSTEM INCLUDING THE SAME
2021-08-05
20210242187
Power Electronic Circuit Having A Plurality Of Power Modules
2021-08-05
20210242188
DISPLAY MODULE
2021-08-05
20210242189
3D SEMICONDUCTOR DEVICES AND STRUCTURES
2021-08-05
20210242190
METHODS OF MANUFACTURING SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE
2021-08-05
20210242191
SEMICONDUCTOR MANUFACTURING APPARATUS
2021-08-05
20210242192
Metal Gate Structure Cutting Process
2021-08-05
20210242193
ELECTROSTATIC DISCHARGE PROTECTION
2021-08-05
20210242194
INTEGRATED CIRCUIT
2021-08-05
20210242195
PROTECTIVE CIRCUIT AGAINST ELECTROSTATIC DISCHARGES
2021-08-05
20210242196
MEMORY DEVICES
2021-08-05
20210242197
FinFET Varactor with Low Threshold Voltage and Method of Making the Same
2021-08-05
20210242198
SEMICONDUCTOR INTEGRATED CIRCUIT
2021-08-05
20210242199
METHOD FOR FORMING CAPACITOR, SEMICONDUCTOR DEVICE, MODULE, AND ELECTRONIC DEVICE
2021-08-05
20210242200
NORMALLY OFF III NITRIDE TRANSISTOR
2021-08-05
20210242201
INTEGRATED CIRCUIT (IC) DEVICE
2021-08-05
20210242202
INTEGRATED CIRCUIT DEVICES INCLUDING VERTICAL FIELD-EFFECT TRANSISTORS
2021-08-05
20210242203
SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR CHIPS
2021-08-05
20210242204
COMPOSITE TRANSISTOR
2021-08-05
20210242205
SEMICONDUCTOR DEVICE HAVING BURIED LOGIC CONDUCTOR TYPE OF COMPLEMENTARY FIELD EFFECT TRANSISTOR, METHOD OF GENERATING LAYOUT DIAGRAM AND SYSTEM FOR SAME
2021-08-05
20210242206
DUMMY FINS AND METHODS OF FORMING THEREOF
2021-08-05
20210242207
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
2021-08-05
20210242208
HIGH-DENSITY 3D-DRAM CELL WITH SCALED CAPACITORS
2021-08-05
20210242209
DYNAMIC RANDOM ACCESS MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
2021-08-05
20210242210
MEMORY DEVICE
2021-08-05
20210242211
SEMICONDUCTOR DEVICE HAVING BURIED WORD LINE AND METHOD OF MANUFACTURING THE SAME
2021-08-05
20210242212
Buried Metal Track and Methods Forming Same
2021-08-05
20210242213
MEMORY STRUCTURE AND ITS FORMATION METHOD
2021-08-05
20210242214
CONTACTS AND METHOD OF MANUFACTURING THE SAME
2021-08-05
20210242215
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
2021-08-05
20210242216
INTERCONNECT AND MEMORY STRUCTURES HAVING REDUCED TOPOGRAPHY VARIATION FORMED IN THE BEOL
2021-08-05
20210242217
Flexible Merge Scheme for Source/Drain Epitaxy Regions
2021-08-05
20210242218
SEMICONDUCTOR DEVICE
2021-08-05
20210242219
SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
2021-08-05
20210242220
SEMICONDUCTOR DEVICE
2021-08-05
20210242221
Integrated Assemblies Having Ferroelectric Transistors with Heterostructure Active Regions
2021-08-05
20210242222
CONTROLLING TRAP FORMATION TO IMPROVE MEMORY WINDOW IN ONE-TIME PROGRARM DEVICES
2021-08-05