32nd week of 2019 patent applcation highlights part 55 |
Patent application number | Title | Published |
20190244836 | APPARATUS AND METHOD FOR WET PROCESS ON SEMICONDUCTOR SUBSTRATE | 2019-08-08 |
20190244837 | METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES | 2019-08-08 |
20190244838 | Method of Forming Boron-Based Film, and Film Forming Apparatus | 2019-08-08 |
20190244839 | Heating Apparatus, Method and System for Producing Semiconductor Chips in the Wafer Assembly | 2019-08-08 |
20190244840 | TEMPERATURE CONTROLLER FOR MANUFACTURING SEMICONDUCTOR | 2019-08-08 |
20190244841 | SEMICONDUCTOR MANUFACTURING APPARATUS | 2019-08-08 |
20190244842 | Position And Temperature Monitoring Of ALD Platen Susceptor | 2019-08-08 |
20190244843 | DATA PROCESSING METHOD, DATA PROCESSING APPARATUS, DATA PROCESSING SYSTEM, AND RECORDING MEDIUM HAVING RECORDED THEREIN DATA PROCESSING PROGRAM | 2019-08-08 |
20190244844 | PATTERN INSPECTION METHOD AND PATTERN INSPECTION APPARATUS | 2019-08-08 |
20190244845 | BRIDGING FRONT OPENING UNIFIED POD (FOUP) | 2019-08-08 |
20190244846 | TRANSFER DEVICE | 2019-08-08 |
20190244847 | HEATER FOR SEMICONDUCTOR MANUFACTURING APPARATUS | 2019-08-08 |
20190244848 | COOLING ELEMENT FOR AN ELECTROSTATIC CHUCK ASSEMBLY | 2019-08-08 |
20190244849 | Thermal Pad for Etch Rate Uniformity | 2019-08-08 |
20190244850 | Wafer Composite and Method for Producing Semiconductor Components | 2019-08-08 |
20190244851 | Method and Apparatus for Bonding Semiconductor Devices | 2019-08-08 |
20190244852 | TCB Bond Tip Design to Mitigate Top Die Warpage and Solder Stretching Issue | 2019-08-08 |
20190244853 | Wafer Composite and Method for Producing a Semiconductor Component | 2019-08-08 |
20190244854 | SUBSTRATE HAVING TWO SEMICONDUCTOR MATERIALS ON INSULATOR | 2019-08-08 |
20190244855 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-08-08 |
20190244856 | SEMICONDUCTOR DEVICE | 2019-08-08 |
20190244857 | METHOD FOR FORMING AN ELECTRICAL CONTACT BETWEEN A SEMICONDUCTOR FILM AND A BULK HANDLE WAFER, AND RESULTING STRUCTURE | 2019-08-08 |
20190244858 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-08-08 |
20190244859 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer | 2019-08-08 |
20190244860 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-08-08 |
20190244861 | Method for Singulating Packaged Integrated Circuits and Resulting Structures | 2019-08-08 |
20190244862 | HIGH ASPECT RATIO CHANNEL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME | 2019-08-08 |
20190244863 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE STRUCTURE | 2019-08-08 |
20190244864 | Semiconductor Device and Method | 2019-08-08 |
20190244865 | INSULATING GATE SEPARATION STRUCTURE | 2019-08-08 |
20190244866 | INTEGRATED STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-08-08 |
20190244867 | FINFET DEVICE | 2019-08-08 |
20190244868 | METHOD AND STRUCTURE FOR CMOS METAL GATE STACK | 2019-08-08 |
20190244869 | FABRICATION OF TRANSISTORS HAVING STRESSED CHANNELS | 2019-08-08 |
20190244870 | Method of Feature Exaction from Time-series of Spectra to Control Endpoint of Process | 2019-08-08 |
20190244871 | Method of Manufacturing an Integrated Fan-out Package having Fan-Out Redistribution Layer (RDL) to Accommodate Electrical Connectors | 2019-08-08 |
20190244872 | LAYERED COOLING STRUCTURE INCLUDING INSULATIVE LAYER AND MULTIPLE METALLIZATION LAYERS | 2019-08-08 |
20190244873 | FLEXIBLE GRAPHITE RIBBON HEAT SINK FOR THERMOELECTRIC DEVICE | 2019-08-08 |
20190244874 | SEMICONDUCTOR APPARATUS | 2019-08-08 |
20190244875 | HEAT CONDUCTIVE SHEET AND METHOD OF PRODUCING SAME, AND HEAT DISSIPATION DEVICE | 2019-08-08 |
20190244876 | Positioning assembly for computer radiator | 2019-08-08 |
20190244877 | BI-DIRECTIONAL HEATSINK DAMPENING FORCE SYSTEM | 2019-08-08 |
20190244878 | SEMICONDUCTOR DEVICE HAVING PLANARIZED PASSIVATION LAYER AND METHOD OF FABRICATING THE SAME | 2019-08-08 |
20190244879 | SILICON CARBIDE SEMICONDUCTOR DEVICE | 2019-08-08 |
20190244880 | INTEGRATED CIRCUIT, AND MOTOR DEVICE INCLUDING THE SAME | 2019-08-08 |
20190244881 | DISPLAY DEVICE AND CHIP-ON-FILM STRUCTURE THEREOF | 2019-08-08 |
20190244882 | Formation of Fine Pitch Traces Using Ultra-Thin PAA Modified Fully Additive Process | 2019-08-08 |
20190244883 | PACKAGE WITH WALL-SIDE CAPACITORS | 2019-08-08 |
20190244884 | SEMICONDUCTOR DEVICE | 2019-08-08 |
20190244885 | SEMICONDUCTOR PACKAGE | 2019-08-08 |
20190244886 | ELECTRONIC DEVICE | 2019-08-08 |
20190244887 | Packaged Semiconductor Devices and Methods of Packaging Thereof | 2019-08-08 |
20190244888 | SEMICONDUCTOR DEVICE | 2019-08-08 |
20190244889 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2019-08-08 |
20190244890 | LOW COST METALLIZATION DURING FABRICATION OF AN INTEGRATED CIRCUIT (IC) | 2019-08-08 |
20190244891 | HARDWARE FALLBACK FOR NON-CONFIGURABLE FEATURES | 2019-08-08 |
20190244892 | THREE-DIMENSIONAL MEMORY DEVICES HAVING A PLURALITY OF NAND STRINGS | 2019-08-08 |
20190244893 | THREE-DIMENSIONAL MEMORY DEVICES HAVING A PLURALITY OF NAND STRINGS | 2019-08-08 |
20190244894 | METAL-ON-METAL CAPACITORS | 2019-08-08 |
20190244895 | SERIES MIM STRUCTURES | 2019-08-08 |
20190244896 | SEMICONDUCTOR DEVICE INCLUDING VIA PLUG AND METHOD OF FORMING THE SAME | 2019-08-08 |
20190244897 | HYBRID COPPER STRUCTURE FOR ADVANCE INTERCONNECT USAGE | 2019-08-08 |
20190244898 | Methods for Reducing Dual Damascene Distortion | 2019-08-08 |
20190244899 | INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING | 2019-08-08 |
20190244900 | Power Distribution Circuitry | 2019-08-08 |
20190244901 | DUAL POWER STRUCTURE WITH CONNECTION PINS | 2019-08-08 |
20190244902 | SPLIT RAIL STRUCTURES LOCATED IN ADJACENT METAL LAYERS | 2019-08-08 |
20190244903 | PCB MODULE ON PACKAGE | 2019-08-08 |
20190244904 | FLEXIBLE DISPLAY DEVICE | 2019-08-08 |
20190244905 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 2019-08-08 |
20190244906 | SEMICONDUCTOR PACKAGES AND DISPLAY DEVICES INCLUDING THE SAME | 2019-08-08 |
20190244907 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2019-08-08 |
20190244908 | Integrated Structures with Conductive Regions Having At Least One Element from Group 2 of the Periodic Table | 2019-08-08 |
20190244909 | SEMICONDUCTOR PACKAGES | 2019-08-08 |
20190244910 | Electrically Conductive Laminate Structures | 2019-08-08 |
20190244911 | SUBSTRATE STRUCTURE WITH SPATIAL ARRANGEMENT CONFIGURED FOR COUPLING OF SURFACE PLASMONS TO INCIDENT LIGHT | 2019-08-08 |
20190244912 | SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING THE SAME | 2019-08-08 |
20190244913 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | 2019-08-08 |
20190244914 | INTEGRATED CIRCUIT WITH BACKSIDE STRUCTURES TO REDUCE SUBSTRATE WARP | 2019-08-08 |
20190244915 | METHOD FOR DETECTING A BREACH OF THE INTEGRITY OF A SEMICONDUCTOR SUBSTRATE OF AN INTEGRATED CIRCUIT FROM ITS REAR FACE, AND CORRESPONDING DEVICE | 2019-08-08 |
20190244916 | DEVICE AND METHOD FOR GENERATING IDENTIFICATION KEY | 2019-08-08 |
20190244917 | Transition Structure and High-Frequency Package | 2019-08-08 |
20190244918 | METHODS OF FORMING CONNECTOR PAD STRUCTURES, INTERCONNECT STRUCTURES, AND STRUCTURES THEREOF | 2019-08-08 |
20190244919 | Semiconductor Devices and Methods of Manufacture Thereof | 2019-08-08 |
20190244920 | Interconnect Structures and Methods of Forming Same | 2019-08-08 |
20190244921 | Methods and Apparatus for Transmission Lines in Packages | 2019-08-08 |
20190244922 | NICKEL-TIN MICROBUMP STRUCTURES AND METHOD OF MAKING SAME | 2019-08-08 |
20190244923 | METAL PAD MODIFICATION | 2019-08-08 |
20190244924 | BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION | 2019-08-08 |
20190244925 | SEMICONDUCTOR DEVICE | 2019-08-08 |
20190244926 | CHIP-ON-CHIP STRUCTURE AND METHODS OF MANUFACTURE | 2019-08-08 |
20190244927 | COVER FILM AND APPLICATION THEREOF | 2019-08-08 |
20190244928 | SEMICONDUCTOR PACKAGES AND RELATED METHODS | 2019-08-08 |
20190244929 | SEMICONDUCTOR ASSEMBLIES USING EDGE STACKING AND METHODS OF MANUFACTURING THE SAME | 2019-08-08 |
20190244930 | SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING MULTIPLE SHINGLED STACKS OF SEMICONDUCTOR DIES | 2019-08-08 |
20190244931 | LAND GRID ARRAY PACKAGE EXTENSION | 2019-08-08 |
20190244932 | SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR CHIP | 2019-08-08 |
20190244933 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE | 2019-08-08 |
20190244934 | MANUFACTURING METHOD AND A RELATED STACKABLE CHIP PACKAGE | 2019-08-08 |
20190244935 | Semiconductor Packages and Methods of Forming the Same | 2019-08-08 |