32nd week of 2022 patent applcation highlights part 82 |
Patent application number | Title | Published |
20220256704 | Component Carriers Connected by Staggered Interconnect Elements - An electronic device includes a first component carrier having a first stack with at least one first electrically conductive layer structure and/or at least one first electrically insulating layer structure, a second component carrier having a second stack with at least one second electrically conductive layer structure and/or at least one second electrically insulating layer structure, and an intermediate structure including at least three staggered electrically conductive and coupled vertical interconnect elements in an at least partially dielectric sheet and being directly connected between the first component carrier and the second component carrier for electrically coupling the first component carrier with the second component carrier. | 2022-08-11 |
20220256705 | ELECTRONIC DEVICE INCLUDING INTERPOSER - An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board. | 2022-08-11 |
20220256706 | DISPLAY APPARATUS AND METHOD FOR MANUFACTURING THE SAME - A display apparatus includes a display panel, a touch layer, and a flexible printed circuit (FPC) including a main FPC and a bridge FPC. A third soldering region and a fourth soldering region of the bridge FPC are respectively soldered to a first soldering region and a second soldering region of the main FPC. Ends of each first touch connection line are electrically connected to a touch chip and a first touch lead. Ends of each second touch connection line are electrically connected to a pad on the second soldering region and a second touch lead. Ends of each third touch connection line are electrically connected to a pad on the first soldering region and the touch chip. Ends of each touch transfer line are electrically connected to a pad on the third soldering region and a pad on the fourth soldering region. | 2022-08-11 |
20220256707 | MULTI-FUNCTIONAL PCB FOR ASSEMBLING GaN-BASED POWER CONVERTER - The present invention provides a multi-functional printed circuit board (PCB) for assembling a plurality of components of a power converter in to a single package. The PCB comprises: one or more planar coils respectively formed on one or more PCB layers and aligned with each other for constructing the transformer and the coupler; and a plurality of conducting traces and vias for providing electrical connection among the plurality of components of the power converter. | 2022-08-11 |
20220256708 | ELECTRONIC APPARATUS AND SUBSTRATE - Provided are an electronic apparatus and a substrate capable of reducing the size and the cost thereof regardless of whether or not a shielding function is needed. An electronic apparatus includes a substrate including a first substrate portion and a second substrate portion arranged in a position opposite the first substrate portion, and a capacitor component arranged between the first substrate portion and the second substrate portion and attached to at least one of the first substrate portion and the second substrate portion. The capacitor component includes a dielectric, a first electrode located on one side of the dielectric, and a second electrode located through the dielectric on a side opposite to the first electrode. The first substrate portion and the second substrate portion are electrically connected to each other through the first electrode. | 2022-08-11 |
20220256709 | ELECTRONIC COMPONENT PACKAGE BODY, ELECTRONIC COMPONENT ASSEMBLY STRUCTURE, AND ELECTRONIC DEVICE - Embodiments of this application disclose an electronic component package body, an electronic component assembly structure, and an electronic device. The electronic component assembly structure includes: an electronic component package body, where the electronic component package body includes a substrate, an electronic component, and a pin; the electronic component is packaged inside the substrate, and the pin is electrically connected to the electronic component; the pin includes a first part embedded in the substrate, and a second part protruding from the substrate; the second part includes a bottom surface and a side surface, the bottom surface is an outer surface that is of the pin and that is away from the substrate, and the side surface is connected between the bottom surface and the substrate. In this application, reliability of soldering between the electronic component package body and the circuit board is relatively high. | 2022-08-11 |
20220256710 | SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME - A substrate structure and electronic device provide improved power integrity and simplified manufacturing. The substrate structure includes a first printed circuit board, having a first side and a second side opposing each other, and a plurality of passive components embedded in the first printed circuit board. The plurality of passive components includes a first group, including a plurality of first passive components disposed adjacent to each other, and a second group, including a plurality of second passive components disposed adjacent to each other. A smallest distance between the first and second groups is greater than at least one of a smallest distance between adjacent first passive components and a smallest distance between adjacent second passive components. | 2022-08-11 |
20220256711 | SOFT MOTHERBOARD-RIGID PLUGIN MODULE ARCHITECTURE - Soft motherboards having rigid plugin modules are described herein. In one aspect of the present disclosure, an electronic device can include a polymeric substrate having: a plurality of slots, each configured for receiving an electronic module; one or more electrical junctions including a stretchable conductive interconnect electronically coupling a slot to another slot of the plurality of slots; and at least one electronic module including: a film configured to: support other components of the electronic module; and be inserted, and be partially housed in, one of the plurality of slots of the polymeric substrate; and at least one electrode coupled to the film and positioned to be in contact with a corresponding electrical junction of the polymeric substrate when the film is partially housed in the polymeric substrate. | 2022-08-11 |
20220256712 | WIRING CIRCUIT BOARD - A wiring circuit board includes a metal support layer, a base insulating layer disposed on one side in a thickness direction of the metal support layer, and a conductive layer disposed on one side in the thickness direction of the base insulating layer, and including a first terminal and a ground lead residual portion electrically connected to the first terminal. A thickness of the ground lead residual portion is thinner than a thickness of the first terminal. | 2022-08-11 |
20220256713 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARDS FORMED THEREBY - A method of manufacturing a printed circuit board is providedd, comprising: 1) imprinting an electrically conductive circuit pattern on a surface of a substrate; 2) applying a surface treatment composition to the surface of the substrate over the electrically conductive circuit pattern; and 3) allowing the surface treatment composition to form a self-assembled coating layer on the surface of the substrate in the form of a conformal coating. The surface treatment composition comprises: (a) a fluorine-containing polymer; (b) a solvent containing at least one C-F bond; and (c) a rheology modifying component. Also provided are electronic compoennts of a circuit assembly and printed circuit boards, comprising a substrate and a self-assembled coating layer applied to at least one surface of the substrate. The coating layer is in the form of a conformal coating and is formed from the surface treatment composition described above. | 2022-08-11 |
20220256714 | METHOD FOR PRODUCING A PRE-TINNING ARRANGEMENT AND PRE-TINNING ARRANGEMENT OF THIS TYPE - The invention relates to a method for producing a pre-tinning arrangement on a conductive surface, wherein, for a temporally and/or spatially subsequent soldering process, a soldering tin preform or a soldering tin round blank having a predefined three-dimensional shape is connected to the conductive surface in a captive and transportation-stable manner. For this purpose, the soldering tin preform or soldering tin round blank is fixed onto the conductive surface by means of a tacking solder, wherein the melting temperature of the tacking solder is below the melting temperature of the soldering tin preform or soldering tin round blank. | 2022-08-11 |
20220256715 | 5G mmWAVE COOLING THROUGH PCB - Embodiments of the invention include a mmWave transceiver and methods of forming such devices. In an embodiment, the mmWave transceiver includes an RF module. The RF module may include a package substrate, a plurality of antennas formed on the package substrate, and a die attached to a surface of the package substrate. In an embodiment, the mmWave transceiver may also include a mainboard mounted to the RF module with one or more solder balls. In an embodiment, a thermal feature is embedded within the mainboard, and the thermal feature is separated from the die by a thermal interface material (TIM) layer. According to an embodiment, the thermal features are slugs and/or vias. In an embodiment, the die compresses the TIM layer resulting in a TIM layer with minimal thickness. | 2022-08-11 |
20220256716 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD, AND PRINTED CIRCUIT BOARD - The present application provides a method for manufacturing a printed circuit board and a printed circuit board. The method for manufacturing a printed circuit board includes: providing a core board, wherein the core board includes an insulating baseplate, and a first surface and/or a second surface opposite to the first surface of the insulating baseplate is provided with a plurality of pads; and laminating a medium layer on a side of the insulating baseplate provided with the plurality of pads to form a laminated layer at least partially embedded among the plurality of pads. | 2022-08-11 |
20220256717 | CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF - A circuit board structure includes a first sub-board including a plurality of circuit patterns, a second sub-board including a plurality of pads, and a connecting structure layer having a plurality of through holes and including an insulating layer, first and second adhesive layers, and a plurality of conductive blocks. The first adhesive layer is directly connected to the first sub-board. The second adhesive layer is directly connected to the second sub-board. The through holes penetrate through the first adhesive layer, the insulating layer, and the second adhesive layer. The conductive blocks are located in the through holes. An upper surface and a lower surface of each conductive block are respectively lower than a first surface of the first adhesive layer and a second surface of the second adhesive layer relatively away from the insulating layer. Each circuit pattern contacts the upper surface, and each pad contacts the lower surface. | 2022-08-11 |
20220256718 | DISPLAY DEVICE AND MOUNTING BRACKET FOR BEZEL - Examples are disclosed that relate to display devices and mounting brackets for securing a bezel to a display device. In one example, a display device comprises a display unit and a bezel comprising at least one pocket. The display device comprises a mounting bracket comprising a display unit attachment portion affixed to the display unit and at least one tongue that extends at least partially into the at least one pocket. Adhesive binds the at least one tongue to at least one surface of the at least one pocket, thereby coupling the bezel to the display unit via the mounting bracket. | 2022-08-11 |
20220256719 | DISPLAY DEVICE - Provided is a display device including a display module including a curvature area configured to be folded about an axis substantially parallel to a first direction, a first flat area, and a second flat area spaced from the first flat area in a second direction crossing the first direction with the curvature area therebetween, and a support member below the display module, and including a first plate, a second plate below the first plate, and a first spacer pattern between the first plate and the second plate, and including main spacers and sub spacers, the main spacers being longer than the sub spacers. | 2022-08-11 |
20220256720 | ELECTRONIC DEVICES WITH TEXTURED ZIRCONIA-BASED COMPONENTS - Textured enclosure components formed from zirconia-based ceramics are disclosed. The texture of the enclosure component can give a matte appearance to an exterior surface of an electronic device. The texture of the enclosure component may also be configured so that it has one or more tactile properties suitable for use as a wearable device and can be readily cleaned. | 2022-08-11 |
20220256721 | CONNECTING STRUCTURE AND ELECTRONIC DEVICE HAVING THE SAME - A non-protruding connecting structure allowing zero to 360 degrees and any intermediate angle of relative rotation between two display screens includes a hinge assembly, a first shaft body, a second shaft body, and a fixing member. The hinge assembly includes first and second wheels sleeved on first and second shaft bodies, and an enmeshed worm engaged with the first and second wheels. A central axis of the first wheel is parallel to that of the second wheel. The axis of the worm is perpendicular to that of the first and second wheels. A rotation direction of the first wheel is opposite to that of the second wheel. The fixing member fixes the hinge assembly. An electronic device including the connecting structure is also disclosed. | 2022-08-11 |
20220256722 | ELECTRONIC DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - An electronic device package includes a substrate, at least one first electronic component and at least one electrical element. The substrate includes a first surface. The first surface comprises a plurality of electrical terminals including a first region and a second region, and a pitch of the electrical terminals of the first region is smaller than a pitch of the electrical terminals of the second region. The at least one first electronic component is electrically connected to the substrate and at least over the first region. The at least one electrical element is disposed above the first electronic component and farther from the substrate than the first electronic component. A number of the at least one electrical element under the first region is less than a number of the at least one electrical element under the second region. | 2022-08-11 |
20220256723 | HOUSING MODULE AND FIELD DEVICE - A housing module includes a housing including a housing wall, a first housing chamber and a second housing chamber separated by a partition wall, wherein: the partition wall has a through-opening for an electrical feedthrough for connecting measurement/operating electronics to interface electronics; the feedthrough satisfying requirements of an Ex-d standard; the feedthrough having an electrically insulating carrier body and a plurality of electrically conductive connecting devices for providing the electrical connection, which connecting devices extend through holes in the carrier body; the holes each having a first dimension along a hole axis and each having an inner diameter; the connecting devices each having an outer diameter; the carrier body being inserted into the through-opening from a side of the partition wall facing the first housing chamber, and forming a flame arrestor according to the Ex-d standard. | 2022-08-11 |
20220256724 | A MODULAR AND CONFIGURABLE ELECTRICAL DEVICE GROUP - A modular and configurable group of electrical device group | 2022-08-11 |
20220256725 | BLANK PANEL - A blank panel ( | 2022-08-11 |
20220256726 | SERVER CABINET ASSEMBLY - A server cabinet assembly includes a tray, a carrier, and an angle adjustment mechanism. The carrier is pivotably disposed on the tray about a pivot axis, and the carrier is configured to accommodate a data storage device. The angle adjustment mechanism includes a positioning component, a handle, and a latch. The positioning component is disposed on the tray. The positioning component has a plurality of first positioning portions. The handle is disposed on the carrier. The latch is movably disposed on the carrier and located between the positioning component and the handle. The latch includes an operation portion and a second positioning portion connected to each other. The operation portion is movable toward the handle to move the second positioning portion away from the positioning component or is movable away from the handle to make the second positioning portion engage with one of the plurality of first positioning portions. | 2022-08-11 |
20220256727 | INTERCONNECTION STRUCTURE USED IN ELECTRONIC DEVICE AND METHOD FOR ASSEMBLING INTERCONNECTION STRUCTURE - An interconnection structure used in an electronic device includes a chassis, a first line board, a second line board, and a heat dissipation component. The heat dissipation component is disposed on a first side surface of the chassis, the first side surface includes a first opening, the second line board is horizontally disposed inside the chassis, the first line board is vertically inserted onto a side surface of the second line board, and a second side surface that is of the chassis and that is opposite to the first side surface includes a second opening. The second line board is horizontally disposed inside the chassis, and the first line board is vertically inserted onto the side surface of the second line board, to reduce a quantity of parts on a system air duct, reduce a flow resistance of a system, and improve a heat dissipation capability of the system. | 2022-08-11 |
20220256728 | HYBRID MANAGEMENT SWITCH/CABLING SYSTEM - A hybrid management cable includes a cable connector having a first cable sub-connector and a second cable sub-connector, The cable connector connects to a hybrid management switch connector on a hybrid management switch and, in response, engages the first cable sub-connector with a first hybrid management switch sub-connector on the hybrid management switch connector, and engages the second cable sub-connector with a second hybrid management switch sub-connector on the hybrid management switch connector. A cable conduit extends from the cable connector. A first management data transmission medium is connected to the first cable sub-connector, located in the cable conduit, and extends along the length of the cable conduit. A second management data transmission medium is connected to the second cable sub-connector, located in the cable conduit and isolated from the first management data transmission medium, and extends along the length of the cable conduit. | 2022-08-11 |
20220256729 | FLUORINATED AROMATICS AND METHODS OF USING SAME - An apparatus for heat transfer includes a device and a mechanism for transferring heat to or from the device. The mechanism includes a working fluid that includes a fluorinated aromatic compound having structural formula (I): where Q is a carbon atom or a nitrogen atom; G is an oxygen atom or a sulfur atom; each R | 2022-08-11 |
20220256730 | POWER SUPPLY DEVICE WITH A HEAT GENERATING COMPONENT - This power supply device is provided with: a first heat-generating component; a case; a resin material; a circuit board; a second heat-generating component; and a heat dissipation casing. This power supply device is additionally provided with a heat transfer member which has a first portion that is arranged to be in contact with a first outer surface of the case and a second portion that is arranged to be in contact with a second outer surface of the case, and which has a higher thermal conductivity than the case. The second heat-generating component is arranged in contact with the heat transfer member; and the heat transfer member dissipates the heat of the first heat-generating component and the second heat-generating component by being arranged in contact with a wall surface that constitutes the heat dissipation casing. | 2022-08-11 |
20220256731 | CONTROLER AND MODULAR CONTROL SYSTEM OF AN INDUSTRIAL AUTOMATION SYSTEM - Controller for an industrial automation system, having a main module ( | 2022-08-11 |
20220256732 | WIRELESS CHARGER - The wireless charger includes a housing, a circuit board component, and a heat conduction structure. The housing has a first air inlet and a first air outlet, and a heat dissipation air channel that communicates with the first air inlet and the first air outlet and that is located inside the housing. is formed between the first air inlet and the first air outlet. The circuit board component is located in the heat dissipation air channel. The heat conduction structure includes a contact part and a connection part that are connected to each other, at least a part of the contact part is exposed to an outer surface of the housing, the contact part is configured to be in contact with a to-be-charged device, and the connection part is located inside the housing and is in contact with the heat dissipation air channel. | 2022-08-11 |
20220256733 | POWER ADAPTER - A power adapter includes a housing, a circuit board component, and a heat dissipation air duct. The housing has an air inlet and an air outlet, the circuit board component is located inside the housing, the heat dissipation air duct is located in the housing and/or a spacing area between the housing and the circuit board component, the heat dissipation air duct surrounds the circuit board component and is connected to the air inlet and the air outlet, and the heat dissipation air duct is configured to dissipate heat from the housing and/or the circuit board component. | 2022-08-11 |
20220256734 | HEAT SINK, HEAT SINK ARRANGEMENT AND MODULE FOR LIQUID IMMERSION COOLING - Heat sink and heat sink arrangements are provided for an electronic device immersed in a liquid coolant. A heat sink may comprise: a base for mounting on top of a heat-transmitting surface of the electronic device and transferring heat from the heat-transmitting surface; | 2022-08-11 |
20220256735 | CONFIGURABLE COLD-PLATES OF DATACENTER COOLING SYSTEMS - A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device. | 2022-08-11 |
20220256736 | CONFIGURABLE COLD-PLATES OF DATACENTER COOLING SYSTEMS - A cold plate that is configurable and for a datacenter liquid cooling system is disclosed. The cold plate includes a first section, a second section, and an intermediate layer, which is changeable and has first channels to enable flow of a coolant through the intermediate layer, and has second channels or at least one adapted second channel to concentrate the coolant or the flow of the coolant to at least one area within the configurable cold plate corresponding to at least a heat generating feature of an associated computing device. | 2022-08-11 |
20220256737 | LIQUID-COOLING BLOCK AND LIQUID-COOLING BLOCK ASSEMBLY AND LIQUID-COOLING HEAT DISSIPATION DEVICE - A liquid-cooling block, a liquid-cooling block assembly, and a liquid-cooling heat dissipation device are disclosed. The liquid-cooling block includes a reservoir and a thermally conductive sheet. The reservoir has a liquid inlet, a first liquid outlet, a second liquid outlet, and a flow-dividing channel located inside the reservoir. A liquid inlet end of the flow-dividing channel is in communication with the liquid inlet. A liquid outlet end of the flow-dividing channel has a first flow-dividing opening and a second flow-dividing opening. The thermally conductive sheet is hermetically fixed to the reservoir to form a closed accommodating chamber therebetween. The thermally conductive sheet is integrally formed with a plurality of fins located in the accommodating chamber. | 2022-08-11 |
20220256738 | COOLING SYSTEM FOR AN INFORMATION HANDLING SYSTEM - An information handling system having a heat exchanger positioned near and in thermally-conductive conduct with an electrical, heat-generating component of the information handling system, such as a central processing unit or graphics processing unit. A fan directs air across the heat exchanger to cool the electrical component by convection. A first portion of the heat pipe may be in direct physical contact with the electrical component and a second portion of the heat pipe may be in thermal contact with the electrical component and the first portion and in direct physical contact with an additional heat exchanger. The fan may direct air across both heat exchangers to cool the electrical component. | 2022-08-11 |
20220256739 | Heat-Conducting Assembly and Terminal - A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface. | 2022-08-11 |
20220256740 | TEMPERATURE EQUALIZATION COMPONENT AND ELECTRONIC DEVICE - This application relates to a temperature equalization component and an electronic device. The temperature equalization component may include a housing and a capillary structure. The housing may include a cavity, and the capillary structure is located in the cavity and is disposed on a side that is of the housing and that faces a heating element. The housing is provided with a first protrusion part and/or a first depression part, and the temperature equalization component is in direct contact with the heating element by using the first protrusion part and/or the first depression part, thereby improving heat transfer efficiency, reducing a probability that heat accumulates around the heating element, and improving a heat dissipation effect of the temperature equalization component. | 2022-08-11 |
20220256741 | CONTROL DEVICE - The present disclosure discloses a control device, which comprises: a circuit board; a heat dissipation cover comprising a heat dissipation cover plate and a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board, and a groove is formed between the plurality of heat dissipation fins; a thermally conductive strip disposed between the circuit board and the heat dissipation cover plate; and a fan arranged in the groove. The heat dissipation cover disclosed herein covers the circuit board as a holistic upper cover, the heat of the circuit board is conducted to the heat dissipation cover through the thermally conductive strip, and the fan in the through groove generate an airflow to dissipate heat, thereby realizing sealing, dustproof and heat dissipation of the circuit board simultaneously. | 2022-08-11 |
20220256742 | HEAT DISSIPATION STRUCTURE AND HEAT DISSIPATION MODULE - A heat dissipation structure includes a heat dissipation body and at least one cup-like structure. The heat dissipation body has a first surface and a second surface, wherein the first surface is adapted to couple with an electronic component. The cup-like structure is formed on the second surface of the heat dissipation body and includes a bottom and a curved structure. The curved structure connects the bottom and the second surface, and forms a closed contour at a junction with the second surface. A heat dissipation module includes the heat dissipation structure and a heat-conducting plate, wherein two sides of the heat-conducting plate adhere to the first surface and the electronic component, respectively. | 2022-08-11 |
20220256743 | SIMPLIFIED LIQUID COOLED CARD CAGE WITH INTERNAL AND EXTERNAL HEAT - The system and method for cooling a card cage using a compact combination vacuum/dip brazed card cage with integral liquid cooling passages, wherein all surfaces of the card cage are used for cooling. The card cage cooling 3U circuit cards internally and non-standard boards mounted externally by heat sinking the non-standard boards to the external walls. Finned, internal liquid cooling passages being orificed to maintain a total pressure drop from a single system inlet to a single system outlet of no more than 5 psi. | 2022-08-11 |
20220256744 | TWO PHASE IMMERSION COOLING SYSTEM WITH USEABLE WARMED LIQUID OUTPUT - An apparatus is described. The apparatus includes a controller to cause a volume of an ambient of a two phase immersion cooling system to be modulated. The ambient is to include a condenser that is to emit fluid warmed by vapor in the ambient. The vapor is to be generated by heat. The heat is to be generated by electronic devices that are to be immersed in a liquid bath. The controller is to cause the volume to increase in response to a first temperature of the fluid approaching a first lower limit. The controller is to cause the volume to decrease in response to a second temperature of the fluid approaching a second higher limit. | 2022-08-11 |
20220256745 | HEAT CONDUCTION MECHANISM - Provided is a heat conduction mechanism including: a first member including at least one heat source; a second member including a heat dissipation element, the second member displaceable with respect to the first member; and a heat conductive sheet that transfers heat of the heat source to the heat dissipation element, in which a protective sheet is provided to a portion of the heat conductive sheet that can be in contact with at least a part of the first member or the second member. | 2022-08-11 |
20220256746 | TAPE GUIDE, COMPONENT SUPPLY DEVICE, AND METHOD FOR USING TAPE GUIDE - A tape guide includes a guide section to guide the carrier tape, the carrier tape including the base tape provided with the component storage section for storing the electronic component and the cover tape provided on a surface of the base tape to close the component storage section, and a component exposing section having a tongue portion inserted between the base tape and the cover tape during conveyance of the carrier tape guided by the guide section to expose the electronic component in the component storage section. The tongue portion moves up and down so that a distal end portion of the tongue portion is movable between a first height position at which the distal end portion can enter between the base tape and the cover tape and a second height position higher than the first height position. | 2022-08-11 |
20220256747 | TRAY PARTS FEEDER - A tray-type component supply device includes a device main body, a magazine configured to be detachably held by the device main body and to accommodate multiple trays in each of which multiple components are arranged vertically, a shuttle mechanism configured to draw any of the trays from the magazine to enable the components to be supplied, a lifting/lowering mechanism configured to move the magazine or the shuttle mechanism up and down to select a tray to be drawn by the shuttle mechanism, and an automatic exchange section configured to exchange the magazine to be collected from the device main body and the magazine to be provided to the device main body. | 2022-08-11 |
20220256748 | COMPONENT MOUNTER - A component mounter includes a pickup member configured to pick up a component, and a control device. When a predetermined error occurs after a pickup operation that picks up the component is performed by the pickup member, the control device stops production in a state where the component, which is a target of an error, is held by the pickup member, in a case where a number of boards produced from a start of production is within a predetermined number of the boards, performs a retry operation that discards the component picked up by the pickup member and picks up a new component, in a case where the number of the boards produced from the start of production exceeds the predetermined number of the boards, and stops production when the error is not resolved even if the retry operation is performed. | 2022-08-11 |
20220256749 | AUTOMATIC BACK-UP PIN ARRANGEMENT SYSTEM FOR COMPONENT MOUNTING MACHINE - A component mounting machine automatically arranges backup pins at positions designated in a production job. A control device configured to control an operation of each of the component mounting machines determines whether a backup pins exists at a position where the backup pin cannot be automatically arranged in the arrangement of the backup pins designated in the production job, and when the backup pin exist at a position where the backup pin cannot be automatically arranged, excludes the backup pins at the position from the arrangement of the backup pins designated in the production job not to be automatically arranged, and automatically arranges only the other backup pins at the positions designated in the production job. | 2022-08-11 |
20220256750 | DEVICE AND METHOD FOR INSPECTING ADSORPTION NOZZLE - A device for inspecting a suction nozzle includes an imaging device configured to acquire an image by imaging a flange portion of a suction nozzle having a body cylinder and the flange portion protruding from an outer surface of the body cylinder, and a control device configured to execute an inspection process for determining whether the flange portion is defective based on the image. | 2022-08-11 |
20220256751 | MOUNTING DEVICE AND METHOD FOR CONTROLLING MOUNTING DEVICE - A mounting device includes a mounting section configured to pick up a component from a supply section that holds the component and execute a mounting process of the component on a mounting target, and a control section configured to acquire an inspection result obtained by executing an inspection process on the components placed on the mounting target and to notify an operator of the inspection result indicating that the component is defective at a timing before mounting an inspection resulted mounting component that is turned out to be mountable after the inspection result is determined. | 2022-08-11 |
20220256752 | OLIVE TREE NAMED 'I-42' - A new and distinct variety of olive tree, herein referred to by its cultivar name, ‘I-42’, is provided which forms a spreading growth habit. Fruit with a low weight and acute shape is produced. The fruit exhibit black coloration and the fruit nipple is moderately present. The stone of the fruit of the new variety is of very low to low weight, very elongated and possess a moderately rugose surface. | 2022-08-11 |
20220256753 | Asclepias linaria plant named 'Monarch Magnet 2.0' - A new and distinct | 2022-08-11 |
20220256754 | x DORITAENOPSIS PLANT NAMED 'BULLS EYE' - A new and distinct cultivar of | 2022-08-11 |
20220256755 | X DORITAENOPSIS PLANT NAMED 'STREET PARADE' - A new and distinct cultivar of | 2022-08-11 |
20220256756 | PHALAENOPSIS PLANT NAMED 'DIAMOND SKY' - A new and distinct cultivar of | 2022-08-11 |
20220256757 | PHALAENOPSIS PLANT NAMED 'GRAND MASTER' - A new and distinct cultivar of | 2022-08-11 |
20220256758 | PHALAENOPSIS PLANT NAMED 'MOTHERS FINEST' - A new and distinct cultivar of | 2022-08-11 |