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33rd week of 2019 patent applcation highlights part 58
Patent application number
Title
Published
20190252262
METHODS AND STRUCTURES FOR FORMING UNIFORM FINS WHEN USING HARDMASK PATTERNS
2019-08-15
20190252263
METHODS AND STRUCTURES FOR FORMING UNIFORM FINS WHEN USING HARDMASK PATTERNS
2019-08-15
20190252264
INTEGRATING METAL-INSULATOR-METAL CAPACITORS WITH FABRICATION OF VERTICAL FIELD EFFECT TRANSISTORS
2019-08-15
20190252265
SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
2019-08-15
20190252266
Isolation Manufacturing Method for Semiconductor Structures
2019-08-15
20190252267
VERTICAL FIELD EFFECT TRANSISTOR WITH SELF-ALIGNED CONTACTS
2019-08-15
20190252268
GATE CUT IN REPLACEMENT METAL GATE PROCESS
2019-08-15
20190252269
METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT
2019-08-15
20190252270
Measurement of Overlay Error Using Device Inspection System
2019-08-15
20190252271
METHOD FOR MEASUREMENT OF SEMICONDUCTOR DEVICE FABRICATION TOOL IMPLEMENT
2019-08-15
20190252272
CONTROL WAFER AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
2019-08-15
20190252273
Semiconductor Structure and Method for Forming the Same
2019-08-15
20190252274
ENDPOINTING DETECTION FOR CHEMICAL MECHANICAL POLISHING BASED ON SPECTROMETRY
2019-08-15
20190252275
SEMICONDUCTOR PACKAGE WITH ELASTIC COUPLER AND RELATED METHODS
2019-08-15
20190252276
SEMICONDUCTOR DEVICE
2019-08-15
20190252277
METHOD OF FORMING A SEMICONDUCTOR PACKAGE
2019-08-15
20190252278
MULTIPLE WAFERS FABRICATION TECHNIQUE ON LARGE CARRIER WITH WARPAGE CONTROL STIFFENER
2019-08-15
20190252279
POWER MODULE AND INVERTER EQUIPMENT
2019-08-15
20190252280
Packaged Semiconductor Devices and Methods of Packaging Semiconductor Devices
2019-08-15
20190252281
PACKAGED SEMICONDUCTOR COMPONENTS HAVING SUBSTANTIALLY RIGID SUPPORT MEMBERS AND METHODS OF PACKAGING SEMICONDUCTOR COMPONENTS
2019-08-15
20190252282
Semiconductor Device with a Passivation Layer and Method for Producing Thereof
2019-08-15
20190252283
Conductive Line System and Process
2019-08-15
20190252284
Heat Transfer Plate Having Small Cavities For Taking Up A Thermal Transfer Material
2019-08-15
20190252285
SEMICONDUCTOR DEVICE PACKAGES USING A THERMALLY ENHANCED CONDUCTIVE MOLDING COMPOUND
2019-08-15
20190252286
SEGMENTED HEATSINK
2019-08-15
20190252287
ELECTRONICS PACKAGE WITH IMPROVED THERMAL PERFORMANCE
2019-08-15
20190252288
SEMICONDUCTOR SUBSTRATE
2019-08-15
20190252289
POWER MODULE AND POWER CONVERTOR
2019-08-15
20190252290
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
2019-08-15
20190252291
Chip Warpage Reduction Via Raised Free Bending & Re-entrant (Auxetic) Trace Geometries
2019-08-15
20190252292
POWER MODULE AND SEMICONDUCTOR APPARATUS
2019-08-15
20190252293
SEMICONDUCTOR DEVICE
2019-08-15
20190252294
Cooling Devices, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices
2019-08-15
20190252295
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD OF THE SAME
2019-08-15
20190252296
Interconnect Structure for Package-on-Package Devices and a Method of Fabricating
2019-08-15
20190252297
INTEGRATED CIRCUIT HAVING CONTACT JUMPER
2019-08-15
20190252298
CHIP ON FILM PACKAGE AND FLEXIBLE SUBSTRATE THEREOF
2019-08-15
20190252299
SEMICONDUCTOR DEVICE
2019-08-15
20190252300
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
2019-08-15
20190252301
ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF
2019-08-15
20190252302
SEMICONDUCTOR DEVICE
2019-08-15
20190252303
CASCODE SEMICONDUCTOR PACKAGE AND RELATED METHODS
2019-08-15
20190252304
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
2019-08-15
20190252305
SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME
2019-08-15
20190252306
PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
2019-08-15
20190252307
SEMICONDUCTOR DEVICE
2019-08-15
20190252308
METHOD OF FABRICATING FIELD EFFECT TRANSISTOR HAVING NON-ORTHOGONAL GATE ELECTRODE
2019-08-15
20190252309
TAPERING DISCRETE INTERCONNECTION FOR AN INTEGRATED CIRCUIT (IC)
2019-08-15
20190252310
CONNECTING STRUCTURE AND CIRCUIT
2019-08-15
20190252311
FAN-OUT SEMICONDUCTOR PACKAGE
2019-08-15
20190252312
Via for Semiconductor Device Connection and Methods of Forming the Same
2019-08-15
20190252313
PORE-FILLED DIELECTRIC MATERIALS FOR SEMICONDUCTOR STRUCTURE FABRICATION AND THEIR METHODS OF FABRICATION
2019-08-15
20190252314
SEMICONDUCTOR PACKAGING STRUCTURE AND SEMICONDUCTOR DEVICE
2019-08-15
20190252315
Device-Manufacturing Scheme for Increasing the Density of Metal Patterns in Inter-Layer Dielectrics
2019-08-15
20190252316
PERPENDICULAR INDUCTORS INTEGRATED IN A SUBSTRATE
2019-08-15
20190252317
SEMICONDUCTOR STRUCTURE WITH ULTRA THICK METAL AND MANUFACTURING METHOD THEREOF
2019-08-15
20190252318
Semiconductor Device and Method
2019-08-15
20190252319
INTERCONNECT STRUCTURE WITH AIR-GAPS
2019-08-15
20190252320
CONTACT AND INTERCONNECT STRUCTURES
2019-08-15
20190252321
INTERCONNECTOR WITH BUNDLED INTERCONNECTS
2019-08-15
20190252322
HIGH DENSITY INTERCONNECT STRUCTURES CONFIGURED FOR MANUFACTURING AND PERFORMANCE
2019-08-15
20190252323
INTEGRATED FAN-OUT PACKAGE
2019-08-15
20190252324
HERMETIC FLAT TOP INTEGRATED HEAT SPREADER ( IHS)/ELECTROMAGNETIC INTERFERENCE (EMI) SHIELD PACKAGE AND METHOD OF MANUFACTURING THEREOF FOR REDUCING WARPAGE
2019-08-15
20190252325
CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
2019-08-15
20190252326
Semiconductor Device with Shielding Structure for Cross-talk Reduction
2019-08-15
20190252327
SEMICONDUCTOR APPARATUS, CAMERA, AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
2019-08-15
20190252328
Methods of Manufacturing an Integrated Circuit Having Stress Tuning Layer
2019-08-15
20190252329
SEMICONDUCTOR PACKAGE
2019-08-15
20190252330
Method for Substrate Moisture NCF Voiding Elimination
2019-08-15
20190252331
HIGH-VOLTAGE CAPACITOR STRUCTURE AND DIGITAL ISOLATION APPARATUS
2019-08-15
20190252332
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
2019-08-15
20190252333
IMAGE SENSORS WITH DEEP SILICON ETCH AND RELATED METHODS
2019-08-15
20190252334
Semiconductor Device and Method of Manufacture
2019-08-15
20190252335
Bond Structures and the Methods of Forming the Same
2019-08-15
20190252336
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
2019-08-15
20190252337
METHODS AND APPARATUSES FOR REFLOWING CONDUCTIVE ELEMENTS OF SEMICONDUCTOR DEVICES
2019-08-15
20190252338
SEMICONDUCTOR DEVICES AND SEMICONDUCTOR DEVICES INCLUDING A REDISTRIBUTION LAYER
2019-08-15
20190252339
MANUFACTURING METHOD OF INTEGRATED FAN-OUT PACKAGE
2019-08-15
20190252340
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
2019-08-15
20190252341
Package with UBM and Methods of Forming
2019-08-15
20190252342
SEMICONDUCTOR DEVICE MODULES AND RELATED METHODS
2019-08-15
20190252343
STACK TOOL FOR REFLOW AND STACK APPARATUS HAVING THE SAME
2019-08-15
20190252344
METHOD FOR MANUFACTURING ELECTRONIC PACKAGE
2019-08-15
20190252345
PACKAGE STRUCTURE AND METHOD FOR CONNECTING COMPONENTS
2019-08-15
20190252346
Integrated Circuit with a Thermally Conductive Underfill and Methods of Forming Same
2019-08-15
20190252347
Trace Design for Bump-on-Trace (BOT) Assembly
2019-08-15
20190252348
SINTERING BONDING METHOD FOR SEMICONDUCTOR DEVICE
2019-08-15
20190252349
METHODS OF BONDING SEMICONDUCTOR ELEMENTS TO A SUBSTRATE, INCLUDING USE OF A REDUCING GAS, AND RELATED BONDING MACHINES
2019-08-15
20190252350
SEMICONDUCTOR CHIP TRANSFER METHOD AND TRANSFER TOOL
2019-08-15
20190252351
SEMICONDUCTOR PACKAGE STRUCTURE HAVING AN ANTENNA PATTERN ELECTRICALLY COUPLED TO A FIRST REDISTRIBUTION LAYER (RDL)
2019-08-15
20190252352
Discrete Polymer in Fan-Out Packages
2019-08-15
20190252353
FACE-TO-FACE THREE-DIMENSIONAL INTEGRATED CIRCUIT OF SIMPLIFIED STRUCTURE
2019-08-15
20190252354
Stacked Integrated Circuits with Redistribution Lines
2019-08-15
20190252355
METHODS AND SYSTEMS FOR IMPROVING POWER DELIVERY AND SIGNALING IN STACKED SEMICONDUCTOR DEVICES
2019-08-15
20190252356
APPARATUSES AND METHODS FOR SCALABLE MEMORY
2019-08-15
20190252357
ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS
2019-08-15
20190252358
METHOD FOR ARRAYING MICRO-LED CHIPS FOR MANUFACTURING LED DISPLAY PANEL AND MULTI-CHIP CARRIER USED IN THE METHOD
2019-08-15
20190252359
PACKAGE STRUCTURE WITH DUMMY DIE
2019-08-15
20190252360
MICRO-LED MODULE AND METHOD FOR FABRICATING THE SAME
2019-08-15
20190252361
VERTICAL CHIP INTERPOSER AND METHOD OF MAKING A CHIP ASSEMBLY CONTAINING THE VERTICAL CHIP INTERPOSER
2019-08-15