34th week of 2015 patent applcation highlights part 74 |
Patent application number | Title | Published |
20150237698 | LAMP AND ILLUMINATION APPARATUS - An LED lamp is used being connected to an external switch for performing an ON-OFF operation. The LED lamp, when causing a light emitting module to emit light in a first lighting mode, controls a power supply circuit to cause the light emitting module to emit light at a first brightness for a predetermined time period from when a timer circuit is activated, and to cause the light emitting module to emit light at a second brightness lower than the first brightness, after passage of the predetermined time period. The LED lamp, when causing the light emitting module to emit light in a second lighting mode, controls the power supply circuit to cause the light emitting module to continue to emit light at the first brightness irrespective of a state of the timer circuit. | 2015-08-20 |
20150237699 | LIGHTING SYSTEM AND CONTROL CIRCUIT FOR THE SAME - Disclosed herein are a lighting system for emitting light using power having a phase controlled by a dimmer and improving the light emission state of a light source and a control circuit for the same. Shimmer can be improved by performing charging and discharging using a current supplied to a load or a current flowing in the current path of a load and performing current control using a charging voltage generated by the charging and discharging. | 2015-08-20 |
20150237700 | SYSTEMS AND METHODS TO CONTROL COLOR AND BRIGHTNESS OF LIGHTING DEVICES - Systems and methods are provided to control the color and brightness of LED lighting. A control signal generator generates a hybrid control signal using pulse width modulation and analog control to drive an LED driver with increased resolution to maintain color mixing while adjusting brightness of the LED lighting. | 2015-08-20 |
20150237701 | LOAD DRIVING APPARATUS RELATED TO LIGHT EMITTING DIODES - A load driving apparatus related to light-emitting-diodes (LEDs) is provided. The load driving apparatus includes a power conversion circuit, a current detection circuit, and a control chip. The power conversion circuit receives a DC input voltage and provides a DC output voltage to at least one LED string in response to a gate pulse-width-modulation (PWM) signal. The current detection circuit is serially connected with the LED string and provides a feedback voltage related to a current flowing through the LED string. The control chip generates the gate PWM signal to control the operation of the power conversion circuit. When the LED string is short-circuited, the control chip is shut down in response to the feedback voltage from the current detection circuit, so as to stop generating the gate PWM signal and thus protect the load driving apparatus from being damaged. | 2015-08-20 |
20150237702 | CONTROL LOOP WITH A VARIABLE TIME CONSTANT FOR POWER FACTOR CORRECTION FOR A LOAD CIRCUIT COMPRISING LIGHT-EMITTING MEANS - The invention proposes a method for operating an actively clocked PFC circuit ( | 2015-08-20 |
20150237703 | SYSTEM AND METHOD FOR MANAGING LIGHTING SYSTEMS - This invention discloses a method and system for managing artificial lighting sources to provide acceptable quality of lighting while reducing cost of operation of the artificial lighting sources. In one aspect of the invention, at least one color characteristic of the artificial light source is adjusted based on an illuminance of a natural light source and the at least one color characteristic of the artificial light source. | 2015-08-20 |
20150237704 | ILLUMINATION SYSTEM COMPRISING AN INTEGRATED PROJECTION UNIT - An illumination system is disclosed having at least a control unit, a projection unit, an illumination unit, and a sensor unit. The sensor unit is designed to capture a position of a movement of a person in a space. The control unit is designed to actuate the projection unit in dependence on the position of the movement, in order to project an operating element onto a surface of the space for controlling the illumination unit. Accordingly the user sees the operating element only when the user needs it. Furthermore, the user can comfortably reach the operating element from the position of the user. | 2015-08-20 |
20150237705 | Dimmer Switch - A dimmer switch for controlling a light includes a wheel assembly, a rotational motion detector and a dimmer control. As the wheel assembly is rotated, the light is dimmed. An on/off control is responsive to a push detector for detecting whether the wheel assembly has been pushed. The on/off control controls where the light is on or off. | 2015-08-20 |
20150237706 | LIGHT FIXTURE CONNECTABLE DEVICE USEFUL FOR ESTABLISHING A NETWORK INFRASTRUCTURE - Disclosed are devices suitable for connection to a light fixture, that in some embodiments are useful as components of a network and/or position-determining system. | 2015-08-20 |
20150237707 | LIGHTING APPARATUS - Provided is a lighting apparatus that may form and control a multi-zone of a plurality of lighting devices connected to a wireless network. The lighting apparatus may include a plurality of devices including a plurality of lighting devices included in a network set in advance, a coordinator to manage the network, a remote controller to control a multi-zone that is included in the network and that performs grouping of the plurality of lighting devices into a plurality of groups. | 2015-08-20 |
20150237708 | SUBSTRATE FOR LIGHT-EMITTING DIODE - A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing an insulation reliability and high-humidity reliability of the substrate is provided. | 2015-08-20 |
20150237709 | THERMAL METAL GROUND FOR INTEGRATED CIRCUIT RESISTORS - Metal thermal grounds are used for dissipating heat from integrated-circuit resistors. The resistors may be formed using a front end of line layer, for example, a titanium-nitride layer. A metal region (e.g., in a first metal layer) is located over the resistors to form a heat sink. An area of thermal posts connected to the metal region is also located over the resistor. The metal region can be connected to the substrate of the integrated circuit to provide a low impedance thermal path out of the integrated circuit. | 2015-08-20 |
20150237710 | SUBSTRATE FOR LIGHT-EMITTING DIODE - A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing insulation reliability and high-humidity reliability of the substrate is provided. | 2015-08-20 |
20150237711 | Stretchable and Foldable Electronic Devices - Disclosed herein are stretchable, foldable and optionally printable, processes for making devices and devices such as semiconductors, electronic circuits and components thereof that are capable of providing good performance when stretched, compressed, flexed or otherwise deformed. Strain isolation layers provide good strain isolation to functional device layers. Multilayer devices are constructed to position a neutral mechanical surface coincident or proximate to a functional layer having a material that is susceptible to strain-induced failure. Neutral mechanical surfaces are positioned by one or more layers having a property that is spatially inhomogeneous, such as by patterning any of the layers of the multilayer device. | 2015-08-20 |
20150237712 | RADIO FREQUENCY MODULE - A radio frequency module includes a plurality of insulating base material layers made of a thermoplastic resin defining a multilayer circuit board and including a cavity inside thereof, an IC chip disposed in the cavity and including a noise generation source, and planar ground conductive bodies provided in the multilayer circuit board. The planar ground conductive bodies are disposed on a layer not exposed to the inner surface of the cavity, and include inter-layer connection conductive bodies protruding in the direction of the noise generation source from the planar ground conductive bodies. | 2015-08-20 |
20150237713 | ELECTRO-MAGNETIC INTERFERENCE (EMI) SHIELDING TECHNIQUES AND CONFIGURATIONS - Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed. | 2015-08-20 |
20150237714 | PLANE CONNECTED EMBEDDED SUBSTRATE CAPACITOR - A package substrate is provided that includes a substrate and a capacitor. The substrate comprises a cavity penetrating a core layer and metal layers of the substrate. The capacitor comprises electrode pads and is disposed in the cavity. One of the metal layers of the substrate includes a discontinuous metal plane, and the electrode pads directly contact the discontinuous metal plane. | 2015-08-20 |
20150237715 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first dielectric layer, a first ground layer, a second dielectric layer, a first power layer, a first via hole and a ground hole extending through the printed circuit board. A first signal line is laid on the first dielectric layer. A third signal line is laid on the second dielectric layer. The first and third signal lines are electrically connected to the first via hole. An extending direction of the first signal line on the first dielectric layer is the same as an extending direction of the third signal line is laid on the second dielectric layer. A first void area is defined in the first ground layer around the first via hole. A second void area is defined in the first power layer around the first via hole. The ground hole is outside the first void area and the second void area. | 2015-08-20 |
20150237716 | FLEXIBLE CIRCUIT BOARD WITH TEAR PROTECTION STRUCTURE - Disclosed is a tear protection structure for a flexible circuit board. In an extension section of a flexible circuit board, at least a slit line is formed. The slit line has at least a terminal end from which a stress-diverting cut segment extends. The stress-diverting cut segment is formed by cutting in a cutting direction that defines an angle with respect to an extension direction of the extension section to serve as the tear protection structure of the flexible circuit board. The extension section of the flexible circuit board is foldable along the slit line. The stress-diverting cut segment may further include a tear protection hole formed in a termination end thereof. | 2015-08-20 |
20150237717 | PACKAGE SUBSTRATE AND STRUCTURE - A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate. | 2015-08-20 |
20150237718 | POWER SEMICONDUCTOR DEVICE - A circuit board having a power semiconductor element mounted thereon includes an insulating plate, a bonding pattern, a circuit pattern, and a pad plate. The insulating plate is made of aluminum nitride ceramic and has a first surface and a second surface opposite to the first surface. The bonding pattern is bonded to the first surface of the insulating plate and made of any of aluminum and aluminum alloy. The circuit pattern is bonded to the second surface of the insulating plate and made of any of aluminum and aluminum alloy. The pad plate is bonded to the circuit pattern, only partially covers the circuit pattern, and is made of any of copper and copper alloy. | 2015-08-20 |
20150237719 | Air Cooled Inline Sensor Light Source with Solid State UV Emitter - Light source for an inline sensor having one or more solid state UV emitters for emitting light at single wavelengths in the range of 240 to 400 nm. The light emitted by each of the emitters has a bandwidth on the order of 10-20 nm and is directed toward a measurement detector in the inline sensor. The UV emitters are enclosed in a housing which can be attached to the inline sensor, with a reference detector and a regulator for the UV emitters also within the housing, and an aperture through which the light passes from the emitters to the measurement detector. In some embodiments, air cooling is provided for the UV emitters. | 2015-08-20 |
20150237720 | WATERMARKED CONDUCTIVE PATTERN - A watermarked conductive pattern includes a conductive pattern disposed on a transparent substrate, a plurality of watermark filler shapes disposed on the transparent substrate in a predetermined watermark area, and a plurality of background filler shapes disposed on the transparent substrate in an area adjacent to the predetermined watermark area. | 2015-08-20 |
20150237721 | STACKED ELECTRONIC PACKAGES - A stacked electronic package includes a substrate and conductive straps each having sides, a top, and a bottom opposite the top. Each conductive strap is coupled along the bottom to an upper surface of the substrate and is separate from others of the conductive straps. A length of at least one of the sides is greater than a width of at least another one of the sides. An encapsulant extends over the upper surface and side surfaces of the substrate and the sides of the conductive straps. A passive electronic component is disposed over the conductive straps, and each conductive strap is coupled along the top to a terminal of the passive electronic component. | 2015-08-20 |
20150237722 | Anode Array - An anode array system includes a number of electrically conductive strips arranged in an array to form an anode, each of the plurality of electrically conductive strips having a first end and a second end, electrical connectors at the first end and at the second end of each of the electrically conductive strips, and a substrate at least partially supporting the electrically conductive strips, wherein the substrate is porous. | 2015-08-20 |
20150237723 | CONDUCTIVE SHEET, USAGE METHOD OF CONDUCTIVE SHEET AND CAPACITIVE TYPE TOUCH PANEL - Disclosed are a conductive sheet, a usage method of the conductive sheet and a capacitive type touch panel. For a first conductive sheet, two or more conductive first large grids are formed atop a first transparent base, wherein each first large grid is constituted by combining two or more small grids, and the shapes of facing sides of each first large grid are formed to alternate. For example, rectangular waveshapes of a first side portion of the first large grid and of a fourth side portion facing the first side portion are made to alternate, and rectangular waveshapes of a second side portion of the first large grid and of a third side portion facing the second side portion are made to alternate. | 2015-08-20 |
20150237724 | MULTILAYER SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - The invention provides a slip layer substrate which can reduce the thermal residual stresses between components induced by their mismatch of thermal expansion, thus greatly improve the reliability of electronic packages. The slip layer substrate comprises: a base material; a first metallization layer formed on the base material; a first diffusion barrier layer formed on the first metallization layer; a slip layer formed on the first diffusion barrier layer; a second diffusion barrier layer formed on the slip layer; and a second metallization layer formed on the second diffusion barrier layer. | 2015-08-20 |
20150237725 | ANISOTROPIC CONDUCTIVE FILM, CONNECTION METHOD, AND ASSEMBLY - An anisotropic conductive film, which contains a crystalline resin, an amorphous resin, and conductive particles, wherein the anisotropic conductive film is an anisotropic conductive film configured to anisotropic conductively connect a terminal of a first electronic part and a terminal of a second electronic part, and wherein the crystalline resin contains a crystalline resin containing a bond characterizing a resin, which is identical to a bond characterizing a resin contained in the amorphous resin. | 2015-08-20 |
20150237726 | TAPE PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME - A tape package includes a base substrate including a signal transmitting area and a protruding area protruded from the signal transmitting area, an integrated circuit chip mounted on the base substrate, and a lead line disposed on the base substrate and including a first portion electrically connected with the integrated circuit chip, a second portion electrically connected with the first portion and extending in a first direction, and a third portion electrically connected with the second portion and extending in a second direction crossing the first direction. | 2015-08-20 |
20150237727 | POWER SEMICONDUCTOR MODULE COMPRISING MODULE-INTERNAL LOAD AND AUXILIARY CONNECTION DEVICES OF LOW-INDUCTANCE CONFIGURATION - A power semiconductor module comprising internal load and auxiliary connection devices embodied as wire bonding connections. A substrate has a plurality of load and auxiliary potential areas, wherein a power switch is arranged on a first load potential area, said power switch being embodied as a plurality of controllable power subswitches arranged in series. The power subswitches have a load bonding connection consisting of a plurality of load bonding wires to a second load potential area, wherein a first bonding base is arranged on the second load potential area and an adjacent second bonding base of the respective load bonding wire is arranged on a contact area of the power subswitch. | 2015-08-20 |
20150237728 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board according to the embodiment includes an insulating layer; a first pad on a top surface of the insulating layer; a second pad on a bottom surface of the insulating layer; and a via formed in the insulating layer and having one surface connected to the first pad and an opposite surface connected to the second pad, wherein the via includes a plurality of via parts which are at least partially overlapped with each other. | 2015-08-20 |
20150237729 | SUBSTRATE DEVICE AND ELECTRIC CIRCUIT ARRANGEMENT - A substrate device for electronic circuits or devices includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x | 2015-08-20 |
20150237730 | CONTROL SYSTEM WITH MULTIPLE TERMINAL BOARDS AND METHOD FOR CONNECTING MULTIPLE TERMINAL BOARDS - A control system may include a plurality of terminal boards. Each of the plurality of terminal boards may at least include a power pin. The definition of the power pin on at least one of the plurality of terminal boards may be different from the definition of the power pin on another one of the plurality of terminal boards. Thus, if the at least one of the plurality of terminal boards is connected to a wrong input/output module, the input/output module will not get a process power supplied via the power pin on the terminal board. Therefore, a wrong input/output signal will not be transferred, and the input/output module will not be damaged even if a higher process voltage is provided by a wrong terminal board. | 2015-08-20 |
20150237731 | ELECTRONIC DEVICE - To improve electric characteristics of an electronic device. An electronic device includes a semiconductor device and a three-terminal capacitor mounted on the upper surface of a mounting substrate, the semiconductor device includes a power supply pad and a ground pad, the power supply pad and the ground pad are electrically connected with a power supply land and a ground land, respectively, and the power supply land and the ground land are allocated to a land line in an outermost periphery of the semiconductor device, Then, the power supply land and the ground land are electrically connected to the three-terminal capacitor by wirings formed on the upper surface of the mounting substrate. | 2015-08-20 |
20150237732 | LOW-PROFILE PACKAGE WITH PASSIVE DEVICE - A low-profile passive-on-package is provided that includes a plurality of recesses that receive corresponding interconnects. Because of the receipt of the interconnects in the recesses, the passive-on-package has a height that is less than a sum of a thickness for the substrate and an interconnect height or diameter. | 2015-08-20 |
20150237733 | PRINTED CIRCUIT BOARD COMPRISING AN ELECTRONIC COMPONENT INTEGRATED THEREIN - A printed circuit board having two completed printed circuit board elements which consists of a plurality of interconnected plies or layers, wherein at least one printed circuit board element has a cutout or depression containing the component to be integrated on one of the printed circuit board elements or in the cutout of the at least one printed circuit board element, and the printed circuit board elements are connected with the component being accommodated in the cutout, as a result of which it is possible to obtain secure and reliable accommodation of the component in the printed circuit board. Furthermore, a printed circuit board of this type also contains an electronic component integrated therein. | 2015-08-20 |
20150237734 | MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPONENT INCORPORATED SUBSTRATE MANUFACTURED USING THE METHOD - In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line. | 2015-08-20 |
20150237735 | Lighting Apparatus - Of the various technological features disclosed in the present specification, a structure according to the one technological feature is as follows. A lighting apparatus changeable between an illuminating state and a non-illuminating state comprising: a non-contact motion sensor arranged to sense a movement of a hand near the lighting apparatus; and a controller arranged to control the lighting apparatus in the non-illuminating state to change from the non-illuminating state to the illuminating state in response to the movement of hand sensed by the non-contact motion sensor, and to control the lighting apparatus in the illuminating state to cause a change in illumination with the illuminating state kept in response to the same movement of hand sensed by the non-contact motion sensor. | 2015-08-20 |
20150237736 | METHOD OF PRODUCTION OF CIRCUIT BOARD - A method of production of a circuit board comprising a step of forming resist patterns | 2015-08-20 |
20150237737 | SURFACE TREATED COPPER FOIL AND LAMINATE USING THE SAME, PRINTED WIRING BOARD, AND COPPER CLAD LAMINATE - A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided. The surface treated copper foil to be laminated on a polyimide having the following ΔB (PI) of 50 or more and 65 or less before being laminated to the copper foil so as to form a copper clad laminate comprising a surface having a color difference ΔE*ab of 50 or more based on JIS Z 8730 through the polyimide and a difference between the top average Bt and the bottom average Bb in a brightness curve extending from an edge of the copper foil to a portion without the copper foil ΔB (ΔB=Bt−Bb) of 40 or more, wherein the brightness curve is obtained from an observation spot versus brightness graph of measurement results of the brightness of the photographed image of the copper foil through the polyimide laminated from the surface treated surface side with a CCD camera for the respective observation spots along the perpendicular direction of the extending direction of the observed copper foil. | 2015-08-20 |
20150237738 | METHOD FOR PRODUCING A CIRCUIT BOARD ELEMENT, AND CIRCUIT BOARD ELEMENT - A method for producing a circuit board element, and a corresponding circuit board element, with which it is possible to suppress the risk of delamination in the region of a component (e.g. a wire or a plate-like shaped part) that is embedded in the circuit board element. To this end, the present invention suggests that the surface of the component should be roughened, at least partially, in order to ensure a better adhesive bond with the surrounding cover layer (e.g. a prepreg made of an insulating material compound). The component surface can be roughened by chemical methods such as etching or by purely mechanical methods such as sand blasting. | 2015-08-20 |
20150237739 | PATTERN-FORMING COMPOSITION AND PATTERN-FORMING METHOD USING THE SAME - The present invention relates to a pattern-forming composition used to form a conductive circuit pattern. The pattern-forming composition comprises Cu powders, a solder for electrically coupling the Cu powders, a polymer resin, a curing agent and a reductant. According to the present invention, a circuit pattern having superior conductivity can be formed at low cost. | 2015-08-20 |
20150237740 | ELECTRONIC CIRCUIT COMPONENT MOUNTER - An electronic circuit component mounter including a component supply device which supplies electronic circuit components to a component holding tool; and a mounting device including a component holding tool and a movable device to move the tool relative to a substrate. If a moving type component supply mounting supply mode is set, a passage-equipped component case is checked for, passage-equipped component case is attached to head main body, moved together with suction nozzle, and supplies components. When component mounting by performing main body side component supply mounting supply mode is set, components supplied from tape feeders provided on the module main body are mounted, thus passage-equipped component case is not required, the presence of passage-equipped component case is checked for, and if it is attached to head main body, it is removed. | 2015-08-20 |
20150237741 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board (PCB) includes an adhesive film disposed between an insulating layer and a circuit pattern, wherein the adhesive film includes poly(glycidyl methacrylate). The printed circuit board may include the adhesive film between the circuit pattern and the insulating layer, and thus, adhesive strength may be increased, while having a low roughness value, a fine circuit pattern may be formed, and reliability thereof may be enhanced. | 2015-08-20 |
20150237742 | SUBSTRATE PROCESSING METHOD FOR SUPPORTING A CATALYST PARTICLE FOR PLATING PROCESS - The present invention provides a method for treating a substrate that supports metal fine particles for forming a plating layer on a circuit pattern or TSVs in various substrates, in which further micronization treatment is enabled compared with the conventional methods, and the formation of a stable plating layer is enabled. The present invention is a method for treating a substrate, the method including bringing a substrate into contact with a colloidal solution containing metal particles in order to support the metal particles that serve as a catalyst for forming a plating layer on the substrate, in which the colloidal solution contains metal particles formed of Pd and having a particle size of 0.6 nm to 4.0 nm and a face-to-face dimension of the (111) plane of 2.254 Å or more. When an organic layer such as SAM is formed on a surface of the substrate before this treatment, the binding force of the Pd particles can be increased. | 2015-08-20 |
20150237743 | DISPLAY APPARATUS - A display apparatus includes a base, a screen, and a seal member. The base includes a mounting frame, and the mounting frame has a plurality of slanted surfaces. The screen includes a display panel and a plurality of side surfaces coupled to the display panel. The seal member is surrounded the display panel and attached to the plurality of side surfaces. The seal member is sandwiched between the screen and the mounting frame, and the plurality of slanted surfaces resists the seal member, to seal gaps between the screen and the mounting frame. | 2015-08-20 |
20150237744 | ELECTRICAL SWITCH ASSEMBLY - An electrical switch assembly for an electrical appliance having an electrical load such as a motor, includes a housing with an opening, switch terminals, and an on/off mechanical switching module. The switch assembly includes an electronic control module operable with a semiconductor switching device to control operation of the load, and a heat sink in thermal contact with the switching device for dissipating heat. The heat sink is electrically conductive and is in electrical circuit connection with a first terminal of the switching device and one of the switch terminals. The heat sink closes the opening and forms part of the housing. | 2015-08-20 |
20150237745 | Data card and data interaction system - Disclosed is a data card, comprising a casing, a PCB and a main antenna arranged in the internal cavity of the casing, and an adapter fixedly connected to the casing. The data card also comprises a metal rotating shaft for an adapter which is arranged in the casing and electrically connected to the adapter. The metal rotating shaft for an adapter and the adapter form a diversity an antenna of the data card. Also disclosed is a data interaction system comprising a data card and a user terminal. By means of the solution disclosed in the present invention, since a diversity antenna need not be independently arranged, the overall dimensions of a data card are reduced, and the appearance of the data card is ensured, thereby reducing the production cost of the data card. | 2015-08-20 |
20150237746 | DISPLAY APPARATUS - Disclosed is a display apparatus which does not use some elements of cases and set cover members necessary for producing the display apparatus and thus can minimize a thickness and enhance a sense of beauty with an innovative design. The display apparatus includes a display panel, a panel supporting member, an adhesive member, a guide frame, and a cover member. The panel supporting member is disposed to have a side inserting space, and supports a rear edge of the display panel. The adhesive member is disposed at the panel supporting member, and couples the display panel and the panel supporting member. The guide frame supports the panel supporting member. The cover member is inserted into the side inserting space of the panel supporting member, and surrounds a side surface of the guide frame, thereby enabling movement of the panel supporting member. | 2015-08-20 |
20150237747 | COLD SHRINKABLE PRIMARY JOINT - A splice housing is configured to slide over and engage with a metallic connector that couples together cable conductors in an electrical distribution system. The splice housing has a first end arranged to engage a first cable, a second end arranged to engage a second cable and a central portion set between the first and second ends that engages the metallic connector. A first support core holds the first end in an expanded state, while a second support core holds the second end in an expanded state. The first and the second ends are molded so that they have relaxed internal diameters that are smaller than a relaxed internal diameter of the central portion. | 2015-08-20 |
20150237748 | MAGNETIC LATCH - Magnetic latch mechanisms are provided. The latch mechanisms may be employed to releasably hold a portable computing device in a closed configuration. The latch mechanism may include first and second magnetic members that may be respectively coupled to the base and lid of the portable computing device. One of the magnetic members may be moveable. Accordingly, when the moveable magnetic member is moved, the position of the magnetic members relative to one another changes, which alters a magnetic interaction therebetween. For example, attractive portions of the magnetic members may be moved away from one another. Additionally, repulsive portions of the magnetic members may be moved into proximity. Thus, opening of the lid of the portable computing device may be facilitated. | 2015-08-20 |
20150237749 | RETENTION-EXTRACTION DEVICE FOR REMOVABLE CARDS IN A CHASSIS - A retention-extraction device is provided for a removable card in a chassis. The device includes an actuation rod having a cam slot, the actuation rod configured to provide linear movement along the length of the actuation rod, and an extraction lever operatively connected to a proximal end of the actuation rod and pivotally secured to the chassis. The device also includes a bell crank with a cam follower that is configured to ride in the cam slot and a latch hook that pivots between an open and closed position based on the motion of the bell crank. The linear movement of the actuation rod causes the extraction lever to apply a force to a portion of the card and causes the latch hook to pivot to an open position to allow removal of the card. | 2015-08-20 |
20150237750 | DETACHABLE MOUNTING SYSTEMS FOR ELECTRONIC DEVICES - A detachable mounting system for securing an electronic device includes a protective housing for mounting to the electronic device. The protective housing includes a mounting piece. The system also includes a base capable of being coupled with a supporting surface and includes a securing device detachably coupled between the protective housing and the first end of the base for securing the protective housing. The system further includes a security alarm capable of detecting at least one of an attachment or detachment of the mounting piece to or from the securing device and a communication device configured to communicate to the security alarm a signal reflecting at least one of the attachment and the detachment. | 2015-08-20 |
20150237751 | MOBILE TERMINAL - A mobile terminal includes a case capable of being assembled or disassembled, a printed circuit board (PCB) arranged in the case and having a tamper detection pattern, the tamper detection pattern having a plurality of conductive areas and at least one non-conductive area, a conductive area connection unit arranged between the case and the PCB and electrically connecting a part of the conductive areas during assembly of the case and electrically disconnecting the part of the conductive areas during disassembly of the case, and a conductive area connection detection circuit electrically connected to the conductive areas and detecting an electric connection state between the conductive areas. The conductive areas includes a first conductive area, a plurality of second conductive areas arranged to be separated from one another and connected to the first conductive area via the conductive area connection unit, and a third conductive area, at least a part of which is arranged between the second conductive areas. | 2015-08-20 |
20150237752 | CIRCUIT BOX - A circuit box includes a housing having an internal compartment. The housing includes first and second entrances for receiving first and second electrical wires, respectively, into the internal compartment. The housing includes first and second wire receptacles that include first and second dielectric shells, respectively, and first and second contacts, respectively, that are held by the first and second dielectric shells, respectively. The first and second contacts are electrically connected together. The first and second dielectric shells include first and second cavities that include pluggable interfaces that are configured to mechanically receive first and second wire terminals, respectively, that terminate the first and second electrical wires, respectively, such that the first and second contacts mechanically mate with the first and second wire terminals, respectively. A circuit element is held within the internal compartment of the housing. The circuit element is electrically connected to the first and second electrical wires. | 2015-08-20 |
20150237753 | FRAME FOR AN OBJECT - A frame for an object comprising a frame body arranged to removably engage, support or operate with the object, wherein the frame body includes one or more functional modules each arranged to provide a processing or active function to the frame body or the object when the frame is engaging, supporting or operating with thereof; and wherein the frame body is further arranged to at least partially encompass or surround the object. | 2015-08-20 |
20150237754 | HOLDING DEVICE ADAPTED TO CASING OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE THEREWITH - A holding device adapted to a casing of an electronic device is disclosed. The holding device includes a holding body and at least one tenon structure. The holding body is separably installed in an inserting slot on the casing. The at least one tenon structure protrudes from the holding body, and the at least one tenon structure is for providing a place for force to be applied, so as to activate the holding body to separate from the inserting slot. The at least one tenon structure is further for inserting into at least one engaging slot on the casing, so as to fix the holding body on the casing for holding an object. | 2015-08-20 |
20150237755 | DAM MEMBER AND DISPLAY APPARATUS INCLUDING THE SAME - A dam member and display apparatus including the same. According to an embodiment of the present invention, a dam member includes an interception block having a long side and a short side, and a cover sheet attached to an upper surface or a lower surface of the interception block, wherein the cover sheet includes a surface extending in a direction of the long side of the interception block. | 2015-08-20 |
20150237756 | METHOD AND APPARATUS FOR SEAMLESSLY AFFIXING A PROTECTIVE FILM TO AN ELECTRONIC DEVICE - The present disclosure provides for a method for seamlessly affixing a protective film to an electronic device. The method includes affixing the protective film to a topside of a lens such that an empty space is formed between a perimeter of the lens and the protective film. The method further includes inserting housing material within the empty space such that the protective film is seamlessly affixed to the topside of the lens and the housing material. | 2015-08-20 |
20150237757 | Electronic Devices With Housing-Based Interconnects and Coupling Structures - An electronic device has an electronic device housing containing electrical components such as integrated circuits and other components. The electronic device housing may be provided with an interconnect stack that has layers of dielectric and metal traces forming signal paths. Electrical components may be mounted on printed circuits. Coupling structures such as screws or other fasteners, washers, standoffs, nuts, springs, and spring-loaded pins may be used in forming signal paths that couple the signal paths of the interconnect stack to components such as buttons, batteries, printed circuits with integrated circuits, displays, and other circuitry. | 2015-08-20 |
20150237758 | SWITCHING ASSEMBLY AND INTERCONNECT ASSEMBLY THEREFOR - An interconnect assembly for a switching assembly in which the switching assembly includes a bus bar and an electromagnetic switching device having a contactor bus. The interconnect assembly is structured to mechanically couple and electrically connect the contactor bus to the bus bar. The interconnect assembly includes a socket member structured to engage the bus bar, a post assembly that includes a post member structured to extend through the contactor bus, in which at least a portion of the post member extends into the socket member, and a locking member disposed on the post member. The locking member is structured to extend through and removably engage the socket member in order to mechanically couple and electrically connect the contactor bus to the bus bar. | 2015-08-20 |
20150237759 | ADAPTABLE AUTOMATION CONTROL MODULE WITH INTEGRATED POWER BUS DISTRIBUTOR - Present embodiments include an adaptable automation control component that includes a base capable of communicatively coupling with a system bus and with a functional module that includes communication and control circuitry. The adaptable automation control component also includes a device power bus including electrical contacts that are capable of communicatively coupling the adaptable automation control component with a separate automation control component, and an activation mechanism including circuitry capable of continuing the device power bus when the activation mechanism is engaged, and capable of discontinuing the device power bus when the activation mechanism is disengaged. The adaptable automation control component facilitates functionality of the adaptable automation control component as an input/output module or a power distribution module depending on whether the activation mechanism is engaged or disengaged. | 2015-08-20 |
20150237760 | SERVER DEVICE - A server device includes a server rack having a front opening, a network switch device disposed in the server rack, a plurality of server computers stacked in the server rack, and a plurality of signal cables located at the front opening of the server rack. The network switch device includes a plurality of first I/O ports located at the front opening of the server rack. Each of the server computers includes a plurality of second I/O ports located at the front opening of the server rack. All of the signal cables electrically connect to both of the first I/O ports and the second I/O ports toolessly, and fix on the inner surface of the server rack. | 2015-08-20 |
20150237761 | Heat Exchanger for Back to Back Electronic Displays - Exemplary embodiments include an electronic display assembly for back to back electronic image assemblies. A first closed gaseous loop may encircle the first electronic image assembly while a second closed gaseous loop may encircle the second electronic image assembly. A heat exchanger is preferably positioned within the path of the first and second closed gaseous loop along with an open loop of ambient air. A circulating fan(s) may be used to force circulating gas around the closed gaseous loops. An open loop fan may be used to force ambient air through the heat exchanger and through an optional channel behind each electronic image assembly. | 2015-08-20 |
20150237762 | INTEGRATED THERMAL MANAGEMENT SYSTEM - A thermal management system for a heat generating electrical component and a method of making such a thermal management system. Additive manufacturing is used to form at least a portion of the thermal management system as a unitary, monolithic structure. Such a structure maximizes heat transfer by reducing or eliminating thermal interfaces between the components of the thermal management system. The use of additive manufacturing also allows for the production of varying thermal management system geometries that are not possible with conventional methods. | 2015-08-20 |
20150237763 | EFFICIENT HEAT TRANSFER FROM CONDUCTION-COOLED CIRCUIT CARDS - A conduction-cooled card assembly is disclosed that includes a conduction-cooling frame, a printed wiring board mounted on the frame, and a wedgelock fastener. The conduction-cooling frame has a thermal management interface adapted to transfer heat from the frame to a chassis, and the wedgelock fastener is adapted to press the thermal management interface of the conduction-cooling frame against a rail of the chassis. The assembly also has one or more of the following characteristics: (a) the thermal management interface of the conduction-cooling frame is made primarily of a first material and a portion of the thermal management interface that is adapted to engage the wedgelock fastener or the rail of the chassis is made of a second material that is softer than the first material, and (b) the wedgelock fastener is made primarily of a first material and a portion of the wedgelock fastener that is adapted to engage the thermal management interface or another rail of the chassis is made of a second material that is softer than the first material. A chassis for conduction-cooled card assemblies is also disclosed which comprises a housing and at least first and second rails within the housing that are adapted to receive a conduction-cooled card assembly therebetween. At least one of the first and second rails is made primarily of a first material and has a surface portion made of a second material that is softer than the first material. | 2015-08-20 |
20150237764 | ELECTRONIC DEVICE AND HEAT DISSIPATION METHOD - An electronic device including a main body, a supporting layer and at least one press element is provided. The main body has an inner space. The supporting layer is disposed on the main body and covers the inner space, wherein the supporting layer has at least one first opening The press element is disposed on the supporting layer and has a chamber and at least one second opening, wherein the first opening and the second opening are connected to the chamber. When the press element is pressed and elastically deformed, air inside the chamber flows to the inner space through the first opening. When the press element is stopped being pressed and restored, air outside the chamber flows to inside the chamber through the second opening. In addition, a heat dissipation method adapted to the electronic device is also provided. | 2015-08-20 |
20150237765 | Device for Controlling Heat Dissipation Fan and Electronic Equipment - Disclosed are a device for controlling a heat dissipation fan and an electric equipment, to solve the problem that the reliability of speed-regulation control for a fan in the device for controlling a heat dissipation fan is relatively poor. The device includes a control system and a protection module, wherein the protection module includes a control signal output end for outputting a fan speed-regulation control signal to the fan, wherein, when a control system normal operation indication signal is normal, the control signal output end of the protection module outputs the fan speed-regulation control signal provided by the control system, otherwise the protection module outputs a fan speed-regulation control signal preset by itself so as to make the fan operate stably. | 2015-08-20 |
20150237766 | Closed Circulating Water Cooling Apparatus and Method - A closed circulating water cooling apparatus and method. The cooling apparatus comprises: an internal cooling apparatus, a plate heat exchanger ( | 2015-08-20 |
20150237767 | HEAT SINK FOR USE WITH PUMPED COOLANT - A heat sink for cooling a heat source can include a thermally conductive base member configured to mount on, or be placed in thermal communication with, a heat source. The heat sink can include a heat sink module mounted on the thermally conductive base member. The heat sink module can include an inlet chamber formed within the heat sink module and an outlet chamber formed at least partially in the heat sink module and bounded by the surface of the thermally conductive base member. The heat sink module can include a first plurality of orifices extending from the inlet chamber to the outlet chamber. The first plurality of orifices can be configured to deliver a plurality of jet streams of coolant into the outlet chamber and against the surface of the thermally conductive base member when pumped coolant is provided to the inlet chamber. | 2015-08-20 |
20150237768 | MODULAR DATA CENTER AND METHOD OF CONTROLLING MODULAR DATA CENTER - A modular data center includes a fan which creates a cooling wind by taking in outside air, electronic devices which takes in the cooling wind and to discharge an exhaust flow, a flow passage which guides a part of the exhaust flow to upstream of the fan, an opening-closing portion which opens and closes the flow passage, and a control unit which adjusts the cooling wind by controlling the fan, and thereby to cool a temperature of the electronic device to a specified temperature. The control unit closes the opening-closing portion when a first assumed value of power consumed by the fan is smaller than a current value of the power. The control unit opens the opening-closing portion when a second assumed value of the power consumed by the fan is smaller than the current value of the power. | 2015-08-20 |
20150237769 | RF SHIELD ASSEMBLY - An electronic device such as a set top box is provided having a vertical chassis wall having an aperture; a horizontal circuit board that extends toward the vertical chassis wall; F-connector connected to the horizontal circuit board, either under or over the board, and extending out of the a vertical chassis wall through the aperture; and inner shield, which can generally be used to contain/shield the RF circuit components mounted on the PCB, on the interior side of the vertical chassis wall and connected to the F-connector on or under the horizontal circuit board, wherein the inner shield comprises a series of vertical peripheral walls that surround components (either under or over the board); and a shield cover that covers the inner shield, the shield cover comprises a top portion that runs along or extends horizontally and side portions that extend from the periphery of the top portion and downward to overlap a part of the shield wall. The side portions contact the exterior side of the shield walls or are substantially close to the exterior side to ensure no gap therebetween or such a minimal spacing to ensure direct path for electromagnetic interference. | 2015-08-20 |
20150237770 | ELECTROMAGNETIC SHIELDING TUBE - An electromagnetic shielding tube has a resin inner layer as the innermost layer, a resin outer layer as the outermost layer, and a metal metal-layer between the inner layer and the outer layer. The bonding strength between the outer layer and the metal layer is made weaker with respect to the bonding strength between the inner layer and the metal layer. For example, while an adhesive layer is provided between the inner layer and the metal layer, the outer layer can be directly extrusion coated onto the metal layer without providing an adhesive layer or the like between the outer layer and the metal layer. | 2015-08-20 |
20150237771 | Electromagnetic Shield Termination Device - An electromagnetic shield termination assembly includes a wire assembly having an electrically conductive wire. An electromagnetic shield extends coaxially with the electrically conductive wire and covers at least a portion of a circumference of the electrically conductive wire, the electromagnetic shield and the electrically conductive wire covered thereby defining a shielded portion of the wire assembly. A non-shielded portion of the wire assembly extends outward of a terminal end of the electromagnetic shield. A termination device has an electrically conductive housing mounted to the wire assembly about the terminal end of the electromagnetic shield such that a portion of the housing engages a portion of the electromagnetic shield, and wherein the housing provides a flow path for an electrical current flowing in the electromagnetic shield. | 2015-08-20 |
20150237772 | BULK COMPONENT SUPPLY SYSTEM AND BULK COMPONENT REPLENISHMENT METHOD - A bulk component supply system which includes a bulk component supply device which is moved together with a mounting head; and a method for replenishing bulk components to that bulk component supply device are disclosed. A passage-equipped component case of a bulk component supply device which is moved together with a mounting head is removed, held by the empty one of case holding sections of a slide in the bulk head component case exchange region. Bulk components are replenished and a passage-equipped component case held on the other of the case holding sections is held on the mounting head. The slide is moved to a bulk component replenishment region, and components are automatically replenished from bulk component storage vessel to the passage-equipped component case received from the mounting head which is empty. After replenishment, the slide is moved to a bulk component case exchange region. | 2015-08-20 |
20150237773 | COMPONENT MOUNTER - A component mounter comprising a head placement section on which rotary heads for exchange are placed and a nozzle placement section on which suction nozzles for exchange are placed. A rotary head is exchangeably held on a head holding unit moved by a head moving device, and a suction nozzle is exchangeably held on a rotary head. The component mounter including a control device that controls the operation holding the rotary head on a head placement section and the operation for the suction nozzle on a nozzle placement section to be held by rotary head. By this, automatic exchange of rotary head and automatic exchange of suction nozzle by appropriately selecting them and the time required for exchanging rotary head or suction nozzle can be shortened, thus the operation rate of a component mounter can be improved. | 2015-08-20 |
20150237774 | SYSTEM AND METHOD FOR EXTRACTING COMPONENTS - A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device. | 2015-08-20 |
20150237775 | Blueberry plant named 'FL03-228' - ‘FL03-228’ is a new and distinct southern highbush blueberry ( | 2015-08-20 |
20150237776 | Blueberry plant named 'FL98-423' - ‘FL98-423’ is a new and distinct southern highbush blueberry ( | 2015-08-20 |
20150237777 | NECTARINE TREE NAMED '0322E82NB' - A new and distinct variety of white nectarine tree denominated ‘0322E82NB’ has fruits with high eating quality and very long shelf life without alteration before and after harvesting, with a semi-sweet white flesh, with a slightly red pigmentation into the stone cavity and a star-shaped red pigmentation around the stone cavity, and an attractive luminous and homogenous skin with a high percentage of purple red blush on skin surface, on a light red background. | 2015-08-20 |
20150237778 | Nectarine tree named 'Cakereve' - A new and distinct variety of white flat nectarine tree denominated ‘CAKEREVE’ has fruits with high eating quality and very long shelf life without alteration before and after harvesting, with a semi-sweet white flesh, with a slightly red pigmentation close to the skin, near the pistil, and an attractive luminous skin with a high percentage of purple red blush on skin surface, on an orange red background. | 2015-08-20 |
20150237779 | Peach tree named 'CRISPDIVA' - A new and distinct variety of yellow peach tree denominated ‘CRISPDIVA’ has fruits with high eating quality and very long shelf life without alteration before and after harvesting, with a semi-sweet yellow flesh, with a slightly red pigmentation into the stone cavity and a star-shaped red pigmentation around the stone cavity, and an attractive luminous and homogenous skin with a very high percentage of purple red blush on skin surface, on an orange red background. | 2015-08-20 |
20150237780 | Citrus rootstock named `UFR-6' - ‘UFR-6’ is a new and distinct allotetraploid citrus rootstock for tree size control and improved disease resistance. ‘UFR-6’ has shown a positive reaction to the Huanglongbing disease (HLB, or citrus greening disease) in multiple experimental field trials. Scion trees grafted on this rootstock show a reduced frequency of infection and reduced disease symptoms once infected as compared to commercial diploid rootstocks. | 2015-08-20 |
20150237781 | Citrus rootstock named 'UFR-15' - ‘UFR-15’ is a new and distinct diploid hybrid citrus rootstock for improved disease resistance. ‘UFR-15’ has shown a positive reaction to the Huanglongbing disease (HLB, or citrus greening disease) in multiple experimental field trials. Scion trees grafted on this rootstock show a reduced frequency of infection and reduced disease symptoms once infected as compared to commercial diploid rootstocks. | 2015-08-20 |
20150237782 | Citrus rootstock named 'UFR-1' - ‘UFR-1’ is a new and distinct allotetraploid citrus rootstock for tree size control and improved disease resistance. ‘UFR-1’ has shown a positive reaction to the Huanglongbing disease (HLB, or citrus greening disease) in multiple experimental field trials. Scion trees grafted on this rootstock show a reduced frequency of infection and reduced disease symptoms once infected as compared to commercial diploid rootstocks. | 2015-08-20 |
20150237783 | Citrus rootstock named 'UFR-5' - ‘UFR-5’ is a new and distinct allotetraploid citrus rootstock for tree size control and improved disease resistance. ‘UFR-5’ has shown a positive reaction to the Huanglongbing disease (HLB, or citrus greening disease) in multiple experimental field trials. Scion trees grafted on this rootstock show a reduced frequency of infection and reduced disease symptoms once infected as compared to commercial diploid rootstocks. | 2015-08-20 |
20150237784 | Mandarin variety named 'BELALATE' - A new and distinct variety of | 2015-08-20 |
20150237785 | Blackberry plant named 'APF-122' - A new and distinct cultivar of blackberry plant named ‘APF-122’. Characteristics include its precocity, high soluble solids (even at the red-black stage), very little postharvest reddening (<10%), heavy over-crops on its compact primocanes such that a floricane crop would generally not be economically viable. | 2015-08-20 |
20150237786 | Rhipsalis Plant Named 'RUITSWEET' - A new and distinct | 2015-08-20 |
20150237787 | Haworthia Plant Named 'SEASTAR' - A new and distinct | 2015-08-20 |
20150237788 | Rhipsalis plant named 'RUITMAGI' - A new and distinct | 2015-08-20 |