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34th week of 2019 patent applcation highlights part 55
Patent application number
Title
Published
20190259645
MARKING POSITION CORRECTING APPARATUS AND METHOD
2019-08-22
20190259646
SAMPLE HOLDER
2019-08-22
20190259647
DEPOSITION RING FOR PROCESSING REDUCED SIZE SUBSTRATES
2019-08-22
20190259648
PATTERNED VACUUM CHUCK FOR DOUBLE-SIDED PROCESSING
2019-08-22
20190259649
DUAL AIRGAP STRUCTURE
2019-08-22
20190259650
METHOD FOR PROTECTING COBALT PLUGS
2019-08-22
20190259651
APPARATUS WITH OVERLAPPING DEEP TRENCH AND SHALLOW TRENCH AND METHOD OF FABRICATING THE SAME WITH LOW DEFECT DENSITY
2019-08-22
20190259652
Oxidative Volumetric Expansion Of Metals And Metal Containing Compounds
2019-08-22
20190259653
FOUNDRY-AGNOSTIC POST-PROCESSING METHOD FOR A WAFER
2019-08-22
20190259654
HIGH RESISTIVITY SILICON-ON-INSULATOR WAFER MANUFACTURING METHOD FOR REDUCING SUBSTRATE LOSS
2019-08-22
20190259655
SOI SUBSTRATE
2019-08-22
20190259656
METAL VIA PROCESSING SCHEMES WITH VIA CRITICAL DIMENSION (CD) CONTROL FOR BACK END OF LINE (BEOL) INTERCONNECTS AND THE RESULTING STRUCTURES
2019-08-22
20190259657
Method of Forming Trenches with Different Depths
2019-08-22
20190259658
Semiconductor Interconnect Structure Having a Graphene Barrier Layer
2019-08-22
20190259659
METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
2019-08-22
20190259660
METHODS OF FABRICATING CONDUCTIVE TRACES AND RESULTING STRUCTURES
2019-08-22
20190259661
Semiconductor Device and Method
2019-08-22
20190259662
PROCESS OF FORMING SEMICONDUCTOR DEVICE
2019-08-22
20190259663
Assemblies Containing PMOS Decks Vertically-Integrated with NMOS Decks, and Methods of Forming Integrated Assemblies
2019-08-22
20190259664
LEAKAGE REDUCTION METHODS AND STRUCTURES THEREOF
2019-08-22
20190259665
GATE CUT USING SELECTIVE DEPOSITION TO PREVENT OXIDE LOSS
2019-08-22
20190259666
INTEGRATING METAL-INSULATOR-METAL CAPACITORS WITH FABRICATION OF VERTICAL FIELD EFFECT TRANSISTORS
2019-08-22
20190259667
MIDDLE OF LINE STRUCTURES
2019-08-22
20190259668
METHODS AND STRUCTURES FOR A GATE CUT
2019-08-22
20190259669
DEVICE INTEGRATED WITH JUNCTION FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME
2019-08-22
20190259670
METHODS OF PERFORMING FIN CUT ETCH PROCESSES FOR FINFET SEMICONDUCTOR DEVICES
2019-08-22
20190259671
FIN FIELD-EFFECT TRANSISTOR
2019-08-22
20190259672
HIGH MOBILITY SEMICONDUCTOR FINS ON INSULATOR
2019-08-22
20190259673
STACKED SHORT AND LONG CHANNEL FINFETS
2019-08-22
20190259674
Feedback Control System for Iterative Etch Process
2019-08-22
20190259675
GLASS FRAME FAN OUT PACKAGING AND METHOD OF MANUFACTURING THEREOF
2019-08-22
20190259676
III-V CHIP-SCALE SMT PACKAGE
2019-08-22
20190259677
DEVICE COMPRISING INTEGRATION OF DIE TO DIE WITH POLYMER PLANARIZATION LAYER
2019-08-22
20190259678
Molding Structure for Wafer Level Package
2019-08-22
20190259679
ELECTRONIC DEVICE AND METHOD OF MANUFACTURE THEREFOR
2019-08-22
20190259680
SEMICONDUCTOR PACKAGE AND METHOD MANUFACTURING THE SAME
2019-08-22
20190259681
SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
2019-08-22
20190259682
SEMICONDUCTOR DIE WITH IMPROVED RUGGEDNESS
2019-08-22
20190259683
MULTIPART LID FOR A SEMICONDUCTOR PACKAGE WITH MULTIPLE COMPONENTS
2019-08-22
20190259684
Robust Through-Silicon-Via Structure
2019-08-22
20190259685
Multi-Layer Die Attachment
2019-08-22
20190259686
PRESSING-TYPE SEMICONDUCTOR POWER DEVICE PACKAGE
2019-08-22
20190259687
SEMICONDUCTOR DEVICE
2019-08-22
20190259688
PACKAGE COMPRISING CARRIER WITH CHIP AND COMPONENT MOUNTED VIA OPENING
2019-08-22
20190259689
Re-Routable Clip for Leadframe Based Product
2019-08-22
20190259690
SEMICONDUCTOR DEVICE
2019-08-22
20190259691
METHOD OF INTEGRATING CAPACITORS IN SEMICONDUCTOR DEVICES AND CORRESPONDING DEVICE
2019-08-22
20190259692
PARALLEL SEAM WELDING LEADLESS CERAMIC PACKAGE
2019-08-22
20190259693
Semiconductor Device Sub-Assembly
2019-08-22
20190259694
BALL GRID ARRAY UNDERFILLING SYSTEMS
2019-08-22
20190259695
HIGH DENSITY ROUTING FOR HETEROGENEOUS PACKAGE INTEGRATION
2019-08-22
20190259696
THROUGH ELECTRODE SUBSTRATE AND MOUNTING SUBSTRATE
2019-08-22
20190259697
CARRIER SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
2019-08-22
20190259698
INTERCONNECTS CONTAINING SERPENTINE LINE STRUCTURES FOR THREE-DIMENSIONAL MEMORY DEVICES AND METHODS OF MAKING THE SAME
2019-08-22
20190259699
INTEGRATED CIRCUIT DEVICE WITH BACK-SIDE INERCONNECTION TO DEEP SOURCE/DRAIN SEMICONDUCTOR
2019-08-22
20190259700
Plurality of Different Size Metal Layers for a Pad Structure
2019-08-22
20190259701
FOLDED METAL-OXIDE-METAL CAPACITOR OVERLAPPED BY ON-CHIP INDUCTOR/TRANSFORMER
2019-08-22
20190259702
POWER DISTRIBUTION FOR ACTIVE-ON-ACTIVE DIE STACK WITH REDUCED RESISTANCE
2019-08-22
20190259703
MEMORY DEVICES INCLUDING STAIR STEP OR TIERED STRUCTURES AND RELATED METHODS
2019-08-22
20190259704
RING-IN-RING CONFIGURABLE-CAPACITANCE STIFFENERS AND METHODS OF ASSEMBLING SAME
2019-08-22
20190259705
SEMICONDUCTOR PACKAGING WITH HIGH DENSITY INTERCONNECTS
2019-08-22
20190259706
DEVICE COMPRISING NANOSTRUCTURES AND METHOD OF MANUFACTURING THEREOF
2019-08-22
20190259707
METHOD FOR MANUFACTURING GRAPHENE WIRING STRUCTURE AND METHOD FOR MANUFACTURING WIRING STRUCTURE
2019-08-22
20190259708
MARK STRUCTURE FOR ALIGNING LAYERS OF INTEGRATED CIRCUIT STRUCTURE AND METHODS OF FORMING SAME
2019-08-22
20190259709
Optically Detectable Reference Feature for Die Separation
2019-08-22
20190259710
APPARATUS FOR LITHOGRAPHICALLY FORMING WAFER IDENTIFICATION MARKS AND ALIGNMENT MARKS
2019-08-22
20190259711
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME AND WIRELESS COMMUNICATION APPARATUS
2019-08-22
20190259712
IC CARD
2019-08-22
20190259713
WARPAGE CONTROL FOR MICROELECTRONICS PACKAGES
2019-08-22
20190259714
Info Structure and Method Forming Same
2019-08-22
20190259715
RF Switch on High Resistive Substrate
2019-08-22
20190259716
Device Package with Reduced Radio Frequency Losses
2019-08-22
20190259717
Nickel Alloy for Semiconductor Packaging
2019-08-22
20190259718
SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES
2019-08-22
20190259719
MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF
2019-08-22
20190259720
Pad Design For Reliability Enhancement in Packages
2019-08-22
20190259721
TOOLING FOR COUPLING MULTIPLE ELECTRONIC CHIPS
2019-08-22
20190259722
COPPER PILLARS HAVING IMPROVED INTEGRITY AND METHODS OF MAKING THE SAME
2019-08-22
20190259723
FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE
2019-08-22
20190259724
Dummy Flip Chip Bumps for Reducing Stress
2019-08-22
20190259725
MANUFACTURING METHOD OF DIE-STACK STRUCTURE
2019-08-22
20190259726
CHIP PACKAGE STRUCTURE
2019-08-22
20190259727
PACKAGE STRUCTURES AND METHODS OF FORMING THE SAME
2019-08-22
20190259728
MICRO DEVICE TRANSFERRING METHOD, AND MICRO DEVICE SUBSTRATE MANUFACTURED BY MICRO DEVICE TRANSFERRING METHOD
2019-08-22
20190259729
PROCESS FOR MANUFACTURING ASSEMBLY PADS ON A CARRIER FOR THE SELF-ASSEMBLY OF AN ELECTRONIC CIRCUIT ON THE CARRIER
2019-08-22
20190259730
METHODS FOR GENERATING WIRE LOOP PROFILES FOR WIRE LOOPS, AND METHODS FOR CHECKING FOR ADEQUATE CLEARANCE BETWEEN ADJACENT WIRE LOOPS
2019-08-22
20190259731
SUBSTRATE BASED FAN-OUT WAFER LEVEL PACKAGING
2019-08-22
20190259732
MEMORY DEVICE INCLUDING BUMP ARRAYS SPACED APART FROM EACH OTHER AND ELECTRONIC DEVICE INCLUDING THE SAME
2019-08-22
20190259733
SEMICONDUCTOR PACKAGE
2019-08-22
20190259734
Integrated RGB LED Display Screen
2019-08-22
20190259735
QFN Surface-Mounted RGB LED Packaging Module and Preparing Method Thereof
2019-08-22
20190259736
Surface-Mounted RGB-LED Packaging Module and Preparing Method Thereof
2019-08-22
20190259737
SEMICONDUCTOR PACKAGE
2019-08-22
20190259738
OPTOELECTRONIC COMPONENT, OPTOELECTRONIC DEVICE, FLASHLIGHT AND HEADLIGHT
2019-08-22
20190259739
METHOD FOR INTEGRATING A LIGHT EMITTING DEVICE
2019-08-22
20190259740
OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURING SAME
2019-08-22
20190259741
OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME
2019-08-22
20190259742
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
2019-08-22
20190259743
METHODS OF FABRICATING SEMICONDUCTOR PACKAGES INCLUDING REINFORCEMENT TOP DIE
2019-08-22
20190259744
METHOD FOR FABRICATING SUBSTRATE STRUCTURE AND SUBSTRATE STRUCTURE FABRICATED BY USING THE METHOD
2019-08-22