34th week of 2021 patent applcation highlights part 61 |
Patent application number | Title | Published |
20210265155 | SYSTEMS AND METHODS FOR SEPARATING IONS AT ABOUT OR ABOVE ATMOSPHERIC PRESSURE | 2021-08-26 |
20210265156 | FLASH DISCHARGE TUBE AND FLASH DEVICE | 2021-08-26 |
20210265157 | Methods And Apparatus For Low Temperature Silicon Nitride Films | 2021-08-26 |
20210265158 | METHOD OF FORMING LOW-K MATERIAL LAYER, STRUCTURE INCLUDING THE LAYER, AND SYSTEM FOR FORMING SAME | 2021-08-26 |
20210265159 | SUBSTRATE TREATMENT DEVICE | 2021-08-26 |
20210265160 | METHOD FOR FABRICATING PATTERN OF CURED PRODUCT AND METHODS FOR MANUFACTURING OPTICAL COMPONENT, CIRCUIT BOARD AND QUARTZ MOLD REPLICA AS WELL AS COATING MATERIAL FOR IMPRINT PRETREATMENT AND CURED PRODUCT THEREOF | 2021-08-26 |
20210265161 | METHOD FOR MANUFACTURING NANOWIRES | 2021-08-26 |
20210265162 | METHOD FOR GROWING III-V COMPOUND SEMICONDUCTORS ON SILICON-ON-INSULATORS | 2021-08-26 |
20210265163 | TIN OXIDE FILMS IN SEMICONDUCTOR DEVICE MANUFACTURING | 2021-08-26 |
20210265164 | FORMING A SEMICONDUCTOR FEATURE USING ATOMIC LAYER ETCH | 2021-08-26 |
20210265165 | Multi-Layer Structures and Methods of Forming | 2021-08-26 |
20210265166 | VIA-VIA SPACING REDUCTION WITHOUT ADDITIONAL CUT MASK | 2021-08-26 |
20210265167 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2021-08-26 |
20210265168 | Process for Producing an Electrical Contact on a Silicon Carbide Substrate | 2021-08-26 |
20210265169 | ETCHING METHOD AND ETCHING APPARATUS | 2021-08-26 |
20210265170 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | 2021-08-26 |
20210265171 | Arrays Of Elevationally-Extending Strings Of Memory Cells And Methods Used In Forming An Array Of Elevationally-Extending Strings Of Memory Cells | 2021-08-26 |
20210265172 | Method with CMP for Metal Ion Prevention | 2021-08-26 |
20210265173 | TIN OXIDE MANDRELS IN PATTERNING | 2021-08-26 |
20210265174 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2021-08-26 |
20210265175 | POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME RELATED APPLICATION | 2021-08-26 |
20210265176 | SUBSTRATE PROCESSING APPARATUS AND METHOD FOR FABRICATING CATALYST PROCESSING MEMBER | 2021-08-26 |
20210265177 | SUBSTRATE TREATING APPARATUS | 2021-08-26 |
20210265178 | SUBSTRATE TREATING APPARATUS | 2021-08-26 |
20210265179 | HYDROGEN FLUORIDE VAPOR PHASE CORROSION APPARATUS AND METHOD | 2021-08-26 |
20210265180 | SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM, AND STORAGE MEDIUM | 2021-08-26 |
20210265181 | SUBSTRATE TREATMENT APPARATUS AND SUBSTRATE TREATMENT METHOD | 2021-08-26 |
20210265182 | HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICES MANUFACTURED THEREBY | 2021-08-26 |
20210265183 | DUMMY WAFER | 2021-08-26 |
20210265184 | COMMUNICATION METHOD, TRANSPORT SYSTEM, AND COMMUNICATION DEVICE | 2021-08-26 |
20210265185 | SYSTEMS AND METHODS FOR SEMICONDUCTOR CHIP SURFACE TOPOGRAPHY METROLOGY | 2021-08-26 |
20210265186 | CARRIER TRAY | 2021-08-26 |
20210265187 | MODULAR PRESSURIZED WORKSTATION | 2021-08-26 |
20210265188 | SUBSTRATE PROCESS APPARATUS | 2021-08-26 |
20210265189 | CERAMIC STRUCTURE AND WAFER SYSTEM | 2021-08-26 |
20210265190 | SAMPLE HOLDER | 2021-08-26 |
20210265191 | Setting Up Ultra-Small or Ultra-Thin Discrete Components for Easy Assembly | 2021-08-26 |
20210265192 | HYBRID PANEL METHOD OF MANUFACTURING ELECTRONIC DEVICES AND ELECTRONIC DEVICES MANUFACTURED THEREBY | 2021-08-26 |
20210265193 | Semiconductor Processing Adhesive Tape and Method of Manufacturing Semiconductor Device | 2021-08-26 |
20210265194 | SERVO CONTROL OF A LIFT APPARATUS AND METHODS OF USE THEREOF | 2021-08-26 |
20210265195 | FETS and Methods of Forming FETS | 2021-08-26 |
20210265196 | Semiconductor Device and Method | 2021-08-26 |
20210265197 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | 2021-08-26 |
20210265198 | INTEGRATED CIRCUIT STRUCTURE WITH SEMICONDUCTOR-BASED ISOLATION STRUCTURE AND METHODS TO FORM SAME | 2021-08-26 |
20210265199 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF | 2021-08-26 |
20210265200 | SEMICONDUCTOR DEVICE, FABRICATION METHOD FOR A SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS | 2021-08-26 |
20210265201 | LINE CUT PATTERNING USING SACRIFICIAL MATERIAL | 2021-08-26 |
20210265202 | VIA-FIRST PROCESS FOR CONNECTING A CONTACT AND A GATE ELECTRODE | 2021-08-26 |
20210265203 | STAIRCASE FORMATION IN THREE-DIMENSIONAL MEMORY DEVICE | 2021-08-26 |
20210265204 | Patterning Interconnects and Other Structures by Photo-Sensitizing Method | 2021-08-26 |
20210265205 | DIELECTRIC ETCH STOP LAYER FOR REACTIVE ION ETCH (RIE) LAG REDUCTION AND CHAMFER CORNER PROTECTION | 2021-08-26 |
20210265206 | Cu3Sn VIA METALLIZATION IN ELECTRICAL DEVICES FOR LOW-TEMPERATURE 3D-INTEGRATION | 2021-08-26 |
20210265207 | CUSTOMIZED SMART DEVICES AND TOUCHSCREEN DEVICES AND CLEANSPACE MANUFACTURING METHODS TO MAKE THEM | 2021-08-26 |
20210265208 | Structure and Method for Interconnection with Self-Alignment | 2021-08-26 |
20210265209 | WAFER PROCESSING METHOD | 2021-08-26 |
20210265210 | PROCESSING METHOD OF WAFER | 2021-08-26 |
20210265211 | PROCESSING METHOD OF DEVICE WAFER | 2021-08-26 |
20210265212 | WAFER PROCESSING METHOD | 2021-08-26 |
20210265213 | SEMICONDUCTOR COMPONENT HAVING A COMPRESSIVE STRAIN LAYER AND METHOD FOR PRODUCING THE SEMICONDUCTOR COMPONENT HAVING A COMPRESSIVE STRAIN LAYER | 2021-08-26 |
20210265214 | METHODS AND APPARATUS FOR AN IMPROVED INTEGRATED CIRCUIT PACKAGE | 2021-08-26 |
20210265215 | Method for Producing a Detachment Area in a Solid Body | 2021-08-26 |
20210265216 | METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES, AND ELECTRONIC SYSTEMS | 2021-08-26 |
20210265217 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2021-08-26 |
20210265218 | SEMICONDUCTOR DEVICE STRUCTURE HAVING AIR GAP AND METHOD FOR FORMING THE SAME | 2021-08-26 |
20210265219 | Gate Formation Process | 2021-08-26 |
20210265220 | SEMICONDUCTOR DEVICE WITH ISOLATION STRUCTURES | 2021-08-26 |
20210265221 | METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE USING DEHYDRATING CHEMICAL, AND METHOD FOR FORMING A SEMICONDUCTOR STRUCTURE | 2021-08-26 |
20210265222 | FIN ISOLATION STRUCTURE FOR FINFET AND METHOD OF FORMING THE SAME | 2021-08-26 |
20210265223 | COMPLEMENTARY CELL CIRCUITS EMPLOYING ISOLATION STRUCTURES FOR DEFECT REDUCTION AND RELATED METHODS OF FABRICATION | 2021-08-26 |
20210265224 | Semiconductor Device with Dual Isolation Liner and Method of Forming the Same | 2021-08-26 |
20210265225 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2021-08-26 |
20210265226 | BOARD AND SEMICONDUCTOR APPARATUS | 2021-08-26 |
20210265227 | STRUCTURES FOR BONDING ELEMENTS | 2021-08-26 |
20210265228 | Integrated Circuit Package and Method | 2021-08-26 |
20210265229 | SEMICONDUCTOR PACKAGE WITH IMPROVED CLAMP | 2021-08-26 |
20210265230 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2021-08-26 |
20210265231 | SEMICONDUCTOR DEVICE PACKAGE INCLUDING THERMAL DISSIPATION ELEMENT AND METHOD OF MANUFACTURING THE SAME | 2021-08-26 |
20210265232 | SEMICONDUCTOR DEVICE | 2021-08-26 |
20210265233 | ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT MODULE INCLUDING THE SAME | 2021-08-26 |
20210265234 | THERMAL INTERFACE MATERIALS | 2021-08-26 |
20210265235 | DOUBLE-SIDED COOLING TYPE POWER MODULE | 2021-08-26 |
20210265236 | Chip Warpage Reduction Via Raised Free Bending & Re-entrant (Auxetic) Trace Geometries | 2021-08-26 |
20210265237 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 2021-08-26 |
20210265238 | CARBON BASED POLYMER THERMAL INTERFACE MATERIALS WITH POLYMER CHAIN TO CARBON BASED FILL PARTICLE BONDS | 2021-08-26 |
20210265239 | COOLING APPARATUS, SEMICONDUCTOR MODULE, AND VEHICLE | 2021-08-26 |
20210265240 | Modular Microjet Cooling Of Packaged Electronic Components | 2021-08-26 |
20210265241 | FRONT-END-OF-LINE (FEOL) THROUGH SEMICONDUCTOR-ON-SUBSTRATE VIA (TSV) | 2021-08-26 |
20210265242 | FABRICATING FIELD-EFFECT TRANSISTORS WITH INTERLEAVED SOURCE AND DRAIN FINGER CONFIGURATION | 2021-08-26 |
20210265243 | SEMICONDUCTOR DEVICE | 2021-08-26 |
20210265244 | ELECTRONIC PACKAGE STRUCTURE | 2021-08-26 |
20210265245 | LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS | 2021-08-26 |
20210265246 | Packaged Electronic Device With Film Isolated Power Stack | 2021-08-26 |
20210265247 | FLIP CHIP SELF-ALIGNMENT FEATURES FOR SUBSTRATE AND LEADFRAME APPLICATIONS | 2021-08-26 |
20210265248 | HOUSINGS FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS | 2021-08-26 |
20210265249 | Device Carrier Configured for Interconnects, a Package Implementing a Device Carrier Having Interconnects, and Processes of Making the Same | 2021-08-26 |
20210265250 | INTEGRATED PASSIVE DEVICE (IPD) COMPONENTS AND A PACKAGE AND PROCESSES IMPLEMENTING THE SAME | 2021-08-26 |
20210265251 | SEMICONDUCTOR PACKAGE | 2021-08-26 |
20210265252 | SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE | 2021-08-26 |
20210265253 | SPLIT SUBSTRATE INTERPOSER WITH INTEGRATED PASSIVE DEVICE | 2021-08-26 |
20210265254 | SPLIT SUBSTRATE INTERPOSER | 2021-08-26 |