35th week of 2020 patent applcation highlights part 59 |
Patent application number | Title | Published |
20200273703 | POLY-SILICON LAYER AND METHOD OF MANUFACTURING THE SAME, METHODS OF MANUFACTURING THIN FILM TRANSISTOR AND ARRAY SUBSTRATE | 2020-08-27 |
20200273704 | EXTREME ULTRAVIOLET PATTERNING PROCESS WITH RESIST HARDENING | 2020-08-27 |
20200273705 | FILM STACK FOR LITHOGRAPHY APPLICATIONS | 2020-08-27 |
20200273706 | WAFER BONDING METHOD AND STRUCTURE THEREOF | 2020-08-27 |
20200273707 | REPLACEMENT METAL GATE FORMATION OF PMOS ULTRA-LOW VOLTAGE DEVICES USING A THERMAL IMPLANT | 2020-08-27 |
20200273708 | SINGLE PROCESS FOR LINER AND METAL FILL | 2020-08-27 |
20200273709 | Gate Isolation Plugs Structure and Method | 2020-08-27 |
20200273710 | CONFINED WORK FUNCTION MATERIAL FOR GATE-ALL AROUND TRANSISTOR DEVICES | 2020-08-27 |
20200273711 | PLASMA ETCH PROCESSES | 2020-08-27 |
20200273712 | DEPOSITION PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | 2020-08-27 |
20200273713 | Method of Atomic Layer Etching of Oxide | 2020-08-27 |
20200273714 | ETCHING BACK METHOD | 2020-08-27 |
20200273715 | METHOD OF SMOOTHING AND PLANARIZING OF ALTIC SURFACES | 2020-08-27 |
20200273716 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273717 | DIRECT GROWTH METHODS FOR PREPARING DIAMOND-ASSISTED HEAT-DISSIPATION SILICON CARBIDE SUBSTRATES OF GAN-HEMTS | 2020-08-27 |
20200273718 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-08-27 |
20200273719 | Integrated Circuits for Flexible Electronics Applications and High-Speed, Stamping-Based Methods of Attaching the Same to an Antenna or Other Substrate | 2020-08-27 |
20200273720 | LASER ABLATION SURFACE TREATMENT FOR MICROELECTRONIC ASSEMBLY | 2020-08-27 |
20200273721 | EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME | 2020-08-27 |
20200273722 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2020-08-27 |
20200273723 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2020-08-27 |
20200273724 | SEMICONDUCTOR PACKAGE STRUCTURE AND A METHOD OF MANUFACTURING THE SAME | 2020-08-27 |
20200273725 | Substrate Processing Apparatus and Substrate Processing Method | 2020-08-27 |
20200273726 | SUBSTRATE TREATMENT APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273727 | SUBSTRATE TREATMENT APPARATUS | 2020-08-27 |
20200273728 | BOLTED WAFER CHUCK THERMAL MANAGEMENT SYSTEMS AND METHODS FOR WAFER PROCESSING SYSTEMS | 2020-08-27 |
20200273729 | RADIATION SHIELD | 2020-08-27 |
20200273730 | SEMICONDUCTOR MANUFACTURING APPARATUS | 2020-08-27 |
20200273731 | AUTO-CALIBRATION TO A STATION OF A PROCESS MODULE THAT SPINS A WAFER | 2020-08-27 |
20200273732 | Substitute Sample, Method for Determining Control Parameter of Processing, and Measurement System | 2020-08-27 |
20200273733 | Apparatus and Methods for Testing Semiconductor Devices | 2020-08-27 |
20200273734 | METHOD AND APPARATUS FOR SUBSTRATE TRANSPORT APPARATUS POSITION COMPENSATION | 2020-08-27 |
20200273735 | VAPOR DEPOSITION MASK AND METHOD FOR MANUFACTURING SAME, VAPOR DEPOSITION MASK DEVICE AND METHOD FOR MANUFACTURING SAME, INTERMEDIATE, VAPOR DEPOSITION METHOD, AND METHOD FOR MANUFACTURING ORGANIC EL DISPLAY DEVICE | 2020-08-27 |
20200273736 | ELECTROSTATIC CHUCK DEVICE | 2020-08-27 |
20200273737 | MICRO LED CARRIER BOARD | 2020-08-27 |
20200273738 | WAFER THINNING SYSTEMS AND RELATED METHODS | 2020-08-27 |
20200273739 | METHOD OF PROCESSING WAFER HAVING PROTRUSIONS ON THE BACK SIDE | 2020-08-27 |
20200273740 | METHOD AND DEVICE FOR WAFER TAPING | 2020-08-27 |
20200273741 | Wafer Table With Dynamic Support Pins | 2020-08-27 |
20200273742 | APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273743 | Air-Gap Containing Metal Interconnects | 2020-08-27 |
20200273744 | SEMICONDUCTOR DEVICES | 2020-08-27 |
20200273745 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, SOLID-STATE IMAGING DEVICE, AND ELECTRONIC APPARATUS | 2020-08-27 |
20200273746 | METAL-INSULATOR-METAL (MIM) STRUCTURE SUPPORTING HIGH VOLTAGE APPLICATIONS AND LOW VOLTAGE APPLICATIONS | 2020-08-27 |
20200273747 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273748 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273749 | SEMICONDUCTOR DEVICE, SUBSTRATE FOR SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273750 | Composite Wafer, Semiconductor Device and Electronic Component | 2020-08-27 |
20200273751 | Integration of III-N transistors and semiconductor layer transfer | 2020-08-27 |
20200273752 | NON-PLANAR I/O AND LOGIC SEMICONDUCTOR DEVICES HAVING DIFFERENT WORKFUNCTION ON COMMON SUBSTRATE | 2020-08-27 |
20200273753 | FORMING SHALLOW TRENCH ISOLATION REGIONS FOR NANOSHEET FIELD-EFFECT TRANSISTOR DEVICES USING SACRIFICIAL EPITAXIAL LAYER | 2020-08-27 |
20200273754 | Fin Critical Dimension Loading Optimization | 2020-08-27 |
20200273755 | CONTACT FORMATION FOR STACKED VERTICAL TRANSPORT FIELD-EFFECT TRANSISTORS | 2020-08-27 |
20200273756 | VERTICAL TRANSISTOR HAVING REDUCED EDGE FIN VARIATION | 2020-08-27 |
20200273757 | Silicon and Silicon Germanium Nanowire Formation | 2020-08-27 |
20200273758 | SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273759 | SYSTEMS AND METHODS FOR BONDING SEMICONDUCTOR ELEMENTS | 2020-08-27 |
20200273760 | SEMICONDUCTOR MODULE | 2020-08-27 |
20200273761 | DISPLAY PANEL | 2020-08-27 |
20200273762 | SEMICONDUCTOR ELEMENT BONDING BODY, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT BONDING BODY | 2020-08-27 |
20200273763 | GLASS CORE, MULTILAYER CIRCUIT BOARD, AND METHOD OF MANUFACTURING GLASS CORE | 2020-08-27 |
20200273764 | LOW STRESS MOISTURE RESISTANT STRUCTURE OF SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273765 | CHIP PACKAGE WITH STAGGERED PIN PATTERN | 2020-08-27 |
20200273766 | CHIP-SCALE SENSOR PACKAGE STRUCTURE | 2020-08-27 |
20200273767 | ELECTRONIC CHIP PACKAGE | 2020-08-27 |
20200273768 | CRYSTALLINE CARBON HEAT SPREADING MATERIALS FOR IC DIE HOT SPOT REDUCTION | 2020-08-27 |
20200273769 | HERMETICALLY SEALED ELECTRONIC PACKAGES WITH ELECTRICALLY POWERED MULTI-PIN ELECTRICAL FEEDTHROUGHS | 2020-08-27 |
20200273770 | Chip Package Structure and Chip Package Method | 2020-08-27 |
20200273771 | SEMICONDUCTOR PACKAGE | 2020-08-27 |
20200273772 | COUPLED COOLING FINS IN ULTRA-SMALL SYSTEMS | 2020-08-27 |
20200273773 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2020-08-27 |
20200273774 | REUSABLE HOLDING COMPONENT FOR HEATSINK | 2020-08-27 |
20200273775 | ACTIVE PACKAGE COOLING STRUCTURES USING MOLDED SUBSTRATE PACKAGING TECHNOLOGY | 2020-08-27 |
20200273776 | THERMAL MANAGEMENT SOLUTIONS FOR INTEGRATED CIRCUIT PACKAGES | 2020-08-27 |
20200273777 | DEVICE AND METHOD FOR DIRECT LIQUID COOLING VIA METAL CHANNELS | 2020-08-27 |
20200273778 | Power Semiconductor Arrangement and Method for Fabricating a Power Semiconductor Arrangement | 2020-08-27 |
20200273779 | VERTICALLY STACKED TRANSISTOR DEVICES WITH ISOLATION WALL STRUCTURES CONTAINING AN ELECTRICAL CONDUCTOR | 2020-08-27 |
20200273780 | SEMICONDUCTOR DEVICE INCLUDING TSV AND METHOD OF MANUFACTURING THE SAME | 2020-08-27 |
20200273781 | Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture | 2020-08-27 |
20200273782 | SEMICONDUCTOR PACKAGE WITH HEATSINK | 2020-08-27 |
20200273783 | STACKED SILICON DIE ARCHITECTURE WITH MIXED FLIPCIP AND WIREBOND INTERCONNECT | 2020-08-27 |
20200273784 | ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES | 2020-08-27 |
20200273785 | Ultra-Thin Component Carrier Having High Stiffness and Method of Manufacturing the Same | 2020-08-27 |
20200273786 | ARRAY SUBSTRATE, DISPLAY DEVICE, METHOD FOR MANUFACTURING THEM, AND SPLICED DISPLAY DEVICE | 2020-08-27 |
20200273787 | SEMICONDUCTOR PACKAGE AND METHOD OF MAKING | 2020-08-27 |
20200273788 | Semiconductor Component and Semiconductor Package | 2020-08-27 |
20200273789 | METHOD FOR FABRICATING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING THE SAME | 2020-08-27 |
20200273790 | Clip Frame Assembly, Semiconductor Package Having a Lead Frame and a Clip Frame, and Method of Manufacture | 2020-08-27 |
20200273791 | Gate Drive Interposer with Integrated Passives for Wide Band Gap Semiconductor Devices | 2020-08-27 |
20200273792 | Low-Impedance Bus Assemblies and Apparatus Including the Same | 2020-08-27 |
20200273793 | DEVICES INCLUDING VIAS EXTENDING THROUGH ALTERNATING DIELECTRIC MATERIALS AND CONDUCTIVE MATERIALS, AND RELATED ELECTRONIC DEVICES | 2020-08-27 |
20200273794 | SEMICONDUCTOR DEVICE AND METHODS OF FORMING THE SAME | 2020-08-27 |
20200273795 | SEMICONDUCTOR STRUCTURE | 2020-08-27 |
20200273796 | SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273797 | SEMICONDUCTOR PACKAGE | 2020-08-27 |
20200273798 | Stacked IC Structure with System Level Wiring on Multiple Sides of the IC Die | 2020-08-27 |
20200273799 | SYSTEM-IN-PACKAGES INCLUDING A BRIDGE DIE | 2020-08-27 |
20200273800 | SYSTEM-IN-PACKAGES INCLUDING A BRIDGE DIE | 2020-08-27 |
20200273801 | SEMICONDUCTOR PACKAGE INCLUDING A BRIDGE DIE | 2020-08-27 |
20200273802 | Package for a Multi-Chip Power Semiconductor Device | 2020-08-27 |