35th week of 2020 patent applcation highlights part 60 |
Patent application number | Title | Published |
20200273803 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2020-08-27 |
20200273804 | SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PILLARS AND METHODS OF MANUFACTURING THE SAME | 2020-08-27 |
20200273805 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME | 2020-08-27 |
20200273806 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2020-08-27 |
20200273807 | SEMICONDUCTOR PACKAGE WITH SILICON CRYSTAL STRUCTURE | 2020-08-27 |
20200273808 | SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273809 | CAGE-SHIELDED INTERPOSER INDUCTANCES | 2020-08-27 |
20200273810 | SEMICONDUCTOR DEVICE WITH INTEGRAL EMI SHIELD | 2020-08-27 |
20200273811 | IC DIE PACKAGE THERMAL SPREADER AND EMI SHIELD COMPRISING GRAPHITE | 2020-08-27 |
20200273812 | SEMICONDUCTOR PACKAGE STRUCTURE | 2020-08-27 |
20200273813 | SEMICONDUCTOR PACKAGES INCLUDING ROUGHENING FEATURES | 2020-08-27 |
20200273814 | SEMICONDUCTOR PACKAGE | 2020-08-27 |
20200273815 | DISPLAY PANEL, ARRAY SUBSTRATE, DISPLAY DEVICE AND METHOD FOR FABRICATING ARRAY SUBSTRATE | 2020-08-27 |
20200273816 | DISPLAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | 2020-08-27 |
20200273817 | METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2020-08-27 |
20200273818 | Covert Gates To Protect Gate-Level Semiconductors | 2020-08-27 |
20200273819 | DISPLAY DEVICE | 2020-08-27 |
20200273820 | METHOD FOR FORMING SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273821 | METHOD FOR CONVEYING HIGH FREQUENCY MODULE AND A HIGH-FREQUENCY MODULE | 2020-08-27 |
20200273822 | HIGH-FREQUENCY MODULE | 2020-08-27 |
20200273823 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2020-08-27 |
20200273824 | TRANSCEIVER DIE INTERCONNECT INTERFACES | 2020-08-27 |
20200273825 | SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273826 | REPLACEABLE END EFFECTOR CONTACT PADS, END EFFECTORS, AND MAINTENANCE METHODS | 2020-08-27 |
20200273827 | MICRO-CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-08-27 |
20200273828 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2020-08-27 |
20200273829 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2020-08-27 |
20200273830 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2020-08-27 |
20200273831 | DRIVING CHIP AND DISPLAY DEVICE | 2020-08-27 |
20200273832 | WAFER LEVEL PACKAGE STRUCTURE WITH INTERNAL CONDUCTIVE LAYER | 2020-08-27 |
20200273833 | ELECTRONIC MODULE, METHOD OF MANUFACTURING CONNECTOR, AND METHOD OF MANUFACTURING ELECTRONIC MODULE | 2020-08-27 |
20200273834 | ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF | 2020-08-27 |
20200273835 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND BONDING METHOD | 2020-08-27 |
20200273836 | MANUFACTURING METHOD AND MANUFACTURING APPARATUS FOR STACKED SUBSTRATE, AND PROGRAM | 2020-08-27 |
20200273837 | SEMICONDUCTOR ELEMENT MOUNTING STRUCTURE, AND COMBINATION OF SEMICONDUCTOR ELEMENT AND SUBSTRATE | 2020-08-27 |
20200273838 | Universal Surface-Mount Semiconductor Package | 2020-08-27 |
20200273839 | MICROELECTRONIC ASSEMBLIES | 2020-08-27 |
20200273840 | MICROELECTRONIC ASSEMBLIES WITH COMMUNICATION NETWORKS | 2020-08-27 |
20200273841 | MEMORY DIE LAYOUTS FOR FAILURE PROTECTION IN SSDS | 2020-08-27 |
20200273842 | OPTOELECTRONIC MODULE AND DISPLAY ELEMENT | 2020-08-27 |
20200273843 | HIGH BANDWIDTH DIE TO DIE INTERCONNECT WITH PACKAGE AREA REDUCTION | 2020-08-27 |
20200273844 | TSV SEMICONDUCTOR DEVICE INCLUDING TWO-DIMENSIONAL SHIFT | 2020-08-27 |
20200273845 | MULTICHIP MODULE, ELECTRONIC DEVICE AND MANUFACTURING METHOD OF MULTICHIP MODULE | 2020-08-27 |
20200273846 | Semiconductor Device Having Through Silicon Vias and Manufacturing Method Thereof | 2020-08-27 |
20200273847 | LED Support and LED Light Source Comprising Such Support | 2020-08-27 |
20200273848 | METHOD FOR MASS TRANSFER OF MICRO SEMICONDUTOR ELEMENTS | 2020-08-27 |
20200273849 | DISPLAY ASSEMBLY, DISPLAY DEVICE AND MANUFACTURING METHOD OF THE SAME | 2020-08-27 |
20200273850 | SEMICONDUCTOR DEVICE HAVING A FIRST CELL ROW AND A SECOND CELL ROW | 2020-08-27 |
20200273851 | SEMICONDUCTOR STRUCTURE | 2020-08-27 |
20200273852 | INTEGRATED CIRCUIT (IC) DEVICE | 2020-08-27 |
20200273853 | INTEGRATED CIRCUIT (IC) DEVICE | 2020-08-27 |
20200273854 | SEMICONDUCTOR DEVICE WITH EQUIPOTENTIAL RING ELECTRODE | 2020-08-27 |
20200273855 | TRENCH DIODE AND POWER SEMICONDUCTOR DEVICE INCLUDING THE SAME | 2020-08-27 |
20200273856 | SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING A PROTECTION CIRCUIT AND SEMICONDUCTOR INTEGRATED CIRCUIT STRUCTURE | 2020-08-27 |
20200273857 | COINTEGRATION OF FET DEVICES WITH DECOUPLING CAPACITOR | 2020-08-27 |
20200273858 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE | 2020-08-27 |
20200273859 | CURRENT SOURCE AND METHOD OF FORMING SAME | 2020-08-27 |
20200273860 | INTEGRATION OF III-N TRANSISTORS AND NON-III-N TRANSISTORS BY SEMICONDUCTOR REGROWTH | 2020-08-27 |
20200273861 | CO-INTEGRATION OF NON-VOLATILE MEMORY ON GATE-ALL-AROUND FIELD EFFECT TRANSISTOR | 2020-08-27 |
20200273862 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | 2020-08-27 |
20200273863 | ASYMMETRIC FINFET IN MEMORY DEVICE, METHOD OF FABRICATING SAME AND SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273864 | HIGH-DENSITY LOW VOLTAGE NON-VOLATILE MEMORY WITH UNIDIRECTIONAL PLATE-LINE AND BIT-LINE AND PILLAR CAPACITOR | 2020-08-27 |
20200273865 | HIGH-DENSITY LOW VOLTAGE NON-VOLATILE DIFFERENTIAL MEMORY BIT-CELL WITH SHARED PLATE-LINE | 2020-08-27 |
20200273866 | HIGH-DENSITY LOW VOLTAGE NON-VOLATILE MEMORY WITH UNIDIRECTIONAL PLATE-LINE AND BIT-LINE AND PILLAR CAPACITOR | 2020-08-27 |
20200273867 | HIGH-DENSITY LOW VOLTAGE NON-VOLATILE MEMORY WITH UNIDIRECTIONAL PLATE-LINE AND BIT-LINE AND PILLAR CAPACITOR | 2020-08-27 |
20200273868 | WORD LINE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2020-08-27 |
20200273869 | SEMICONDUCTOR MEMORY DEVICE INCLUDING A SUBSTRATE, VARIOUS INTERCONNECTIONS, SEMICONDUCTOR MEMBER, CHARGE STORAGE MEMBER AND A CONDUCTIVE MEMBER | 2020-08-27 |
20200273870 | VERTICAL NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-08-27 |
20200273871 | MEMORY DEVICE AND MANUFACTURING METHOD THEREOF | 2020-08-27 |
20200273872 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | 2020-08-27 |
20200273873 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | 2020-08-27 |
20200273874 | STAIRCASE STRUCTURE WITH MULTIPLE DIVISIONS FOR THREE-DIMENSIONAL MEMORY | 2020-08-27 |
20200273875 | THREE-DIMENSIONAL MEMORY DEVICES AND FABRICATING METHODS THEREOF | 2020-08-27 |
20200273876 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR STORAGE DEVICE | 2020-08-27 |
20200273877 | INTEGRATED CIRCUIT DEVICE | 2020-08-27 |
20200273878 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME | 2020-08-27 |
20200273879 | SEMICONDUCTOR MEMORY DEVICE | 2020-08-27 |
20200273880 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | 2020-08-27 |
20200273881 | SEMICONDUCTOR MEMORY DEVICE | 2020-08-27 |
20200273882 | TRANSISTOR, THREE DIMENSIONAL MEMORY DEVICE INCLUDING SUCH TRANSISTOR AND METHOD OF FABRICATING SUCH MEMORY DEVICE | 2020-08-27 |
20200273883 | SEMICONDUCTOR MEMORY DEVICE | 2020-08-27 |
20200273884 | PIXEL ARRAY SUBSTRATE | 2020-08-27 |
20200273885 | ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | 2020-08-27 |
20200273886 | SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273887 | HIGH VOLTAGE THREE-DIMENSIONAL DEVICES HAVING DIELECTRIC LINERS | 2020-08-27 |
20200273888 | DISPLAY SUBSTRATE, DISPLAY PANEL AND METHOD OF FABRICATING DISPLAY SUBSTRATE | 2020-08-27 |
20200273889 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE | 2020-08-27 |
20200273890 | DISPLAY SUBSTRATE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE | 2020-08-27 |
20200273891 | METHOD OF MANUFACTURING ARRAY SUBSTRATE AND DISPLAY PANEL | 2020-08-27 |
20200273892 | IMAGE SENSOR WITH NEAR-INFRARED AND VISIBLE LIGHT PHASE DETECTION PIXELS | 2020-08-27 |
20200273893 | WAFER LEVEL SHIM PROCESSING | 2020-08-27 |
20200273894 | PHOTOELECTRIC CONVERSION DEVICE, IMAGING SYSTEM, AND MOBILE APPARATUS | 2020-08-27 |
20200273895 | PHOTOELECTRIC CONVERSION APPARATUS, PHOTOELECTRIC CONVERSION SYSTEM, AND MOVING OBJECT | 2020-08-27 |
20200273896 | IMAGE SENSOR DEVICES AND RELATED METHODS | 2020-08-27 |
20200273897 | IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME | 2020-08-27 |
20200273898 | SOLID STATE IMAGING DEVICE, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC EQUIPMENT | 2020-08-27 |
20200273899 | PHOTOELECTRIC CONVERSION DEVICE, METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE, IMAGING SYSTEM, AND IMAGE READING APPARATUS | 2020-08-27 |
20200273900 | IMAGE SENSORS | 2020-08-27 |
20200273901 | SEMICONDUCTOR APPARATUS AND EQUIPMENT | 2020-08-27 |
20200273902 | IMAGE-CAPTURING UNIT AND IMAGE-CAPTURING APPARATUS | 2020-08-27 |