36th week of 2021 patent applcation highlights part 58 |
Patent application number | Title | Published |
20210280407 | MULTIPOLE ASSEMBLY CONFIGURATIONS FOR REDUCED CAPACITIVE COUPLING | 2021-09-09 |
20210280408 | IMPACT IONISATION ION SOURCE | 2021-09-09 |
20210280409 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 2021-09-09 |
20210280410 | METHOD OF RESTORING COLLAPSED PATTERN, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE PROCESSING DEVICE | 2021-09-09 |
20210280411 | DEPOSITION METHOD | 2021-09-09 |
20210280412 | SEMICONDUCTOR COMPONENT AND METHOD FOR FABRICATING THE SAME | 2021-09-09 |
20210280413 | ELECTRONIC APPARATUS | 2021-09-09 |
20210280414 | Device and Method for High Pressure Anneal | 2021-09-09 |
20210280415 | Semiconductor Devices and Methods of Manufacture | 2021-09-09 |
20210280416 | MANUFACTURING METHOD AND SUPPORT OF SEMICONDUCTOR DEVICE | 2021-09-09 |
20210280417 | NANOWIRE WITH REDUCED DEFECTS | 2021-09-09 |
20210280418 | SYSTEM AND METHOD FOR RADICAL AND THERMAL PROCESSING OF SUBSTRATES | 2021-09-09 |
20210280419 | WAFER PROCESSING METHOD | 2021-09-09 |
20210280420 | Vapor Deposition Of Carbon-Based Films | 2021-09-09 |
20210280421 | SEMICONDUCTOR DEVICE STRUCTURE WITH FINE PATTERNS AT DIFFERENT LEVELS AND METHOD FOR FORMING THE SAME | 2021-09-09 |
20210280422 | SELF ALIGNED PATTERN FORMATION POST SPACER ETCHBACK IN TIGHT PITCH CONFIGURATIONS | 2021-09-09 |
20210280423 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | 2021-09-09 |
20210280424 | METHOD FOR MANUFACTURING A SIC ELECTRONIC DEVICE WITH REDUCED HANDLING STEPS, AND SIC ELECTRONIC DEVICE | 2021-09-09 |
20210280425 | SEMICONDUCTOR DEVICE STRUCTURE WITH FINE PATTERNS AND METHOD FOR FORMING THE SAME | 2021-09-09 |
20210280426 | Methods of Forming Contact Features in Semiconductor Devices | 2021-09-09 |
20210280427 | CONTACT STRUCTURES WITH DEPOSITED SILICIDE LAYERS | 2021-09-09 |
20210280428 | SYSTEM AND METHOD FOR RADICAL AND THERMAL PROCESSING OF SUBSTRATES | 2021-09-09 |
20210280429 | SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD | 2021-09-09 |
20210280430 | SEMICONDUCTOR MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME | 2021-09-09 |
20210280431 | PATTERN FORMATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2021-09-09 |
20210280432 | SEMICONDUCTOR DEVICE STRUCTURE HAVING GATE DIELECTRIC LAYER | 2021-09-09 |
20210280433 | ELECTRON EXCITATION ATOMIC LAYER ETCH | 2021-09-09 |
20210280434 | SEMICONDUCTOR DEVICE | 2021-09-09 |
20210280435 | Redistribution Lines Having Stacking Vias | 2021-09-09 |
20210280436 | METHOD OF APPLYING CONDUCTIVE ADHESIVE AND MANUFACTURING DEVICE USING THE SAME | 2021-09-09 |
20210280437 | METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING DISTRIBUTED WRITE DRIVING ARRANGEMENT | 2021-09-09 |
20210280438 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2021-09-09 |
20210280439 | ETCHING TOOL FOR DEMOUNTABLY ETCHING MULTIPLE PIECES OF SILICON CARBIDE | 2021-09-09 |
20210280440 | MOUNTING METHOD AND MOUNTING DEVICE | 2021-09-09 |
20210280441 | SUBSTRATE TRANSFER SYSTEM AND LOAD LOCK MODULE | 2021-09-09 |
20210280442 | APPARATUS FOR SENSING WAFER LOADING STATE USING SOUND WAVE SENSOR | 2021-09-09 |
20210280443 | CAPACITIVE SENSOR FOR CHAMBER CONDITION MONITORING | 2021-09-09 |
20210280444 | SUBSTRATE PROCESSING APPARATUS EQUIPPED WITH SUBSTRATE SCANNER | 2021-09-09 |
20210280445 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | 2021-09-09 |
20210280446 | MANIFOLD FOR A SUBSTRATE CONTAINER | 2021-09-09 |
20210280447 | SUBSTRATE TRANSFER SYSTEM AND ATMOSPHERIC TRANSFER MODULE | 2021-09-09 |
20210280448 | ALIGNMENT FIXTURE FOR A REACTOR SYSTEM | 2021-09-09 |
20210280449 | STAGE AND PLASMA PROCESSING APPARATUS | 2021-09-09 |
20210280450 | SUBSTRATE PROCESSING APPARATUS | 2021-09-09 |
20210280451 | LOW TEMPERATURE STEAM FREE OXIDE GAPFILL | 2021-09-09 |
20210280452 | CREATING AN IMPLANTED LAYER IN A SILICON-ON-INSULATOR (SOI) WAFER THROUGH CRYSTAL ORIENTATION CHANNELING | 2021-09-09 |
20210280453 | APPARATUS WITH MULTI-WAFER BASED DEVICE AND METHOD FOR FORMING SUCH | 2021-09-09 |
20210280454 | USING A LINER LAYER TO ENLARGE PROCESS WINDOW FOR A CONTACT VIA | 2021-09-09 |
20210280455 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICES | 2021-09-09 |
20210280456 | SKIP VIA CONNECTION BETWEEN METALLIZATION LEVELS | 2021-09-09 |
20210280457 | SELF-ALIGNED BLOCK VIA PATTERNING FOR DUAL DAMASCENE DOUBLE PATTERNED METAL LINES | 2021-09-09 |
20210280458 | SEMICONDUCTOR DEVICE AND FORMATION METHOD THEREOF | 2021-09-09 |
20210280459 | SEMICONDUCTOR STRUCTURE WITH MATERIAL MODIFICATION AND LOW RESISTANCE PLUG | 2021-09-09 |
20210280460 | Metal-Based Etch-Stop Layer | 2021-09-09 |
20210280461 | 3D IC METHOD AND DEVICE | 2021-09-09 |
20210280462 | Contact Metallization Process | 2021-09-09 |
20210280463 | CONDUCTIVE ROUTE PATTERNING FOR ELECTRONIC SUBSTRATES | 2021-09-09 |
20210280464 | METAL GATES OF TRANSISTORS HAVING REDUCED RESISTIVITY | 2021-09-09 |
20210280465 | Structurally Stable Self-Aligned Subtractive Vias | 2021-09-09 |
20210280466 | SEMICONDUCTOR WAFER AND SEMICONDUCTOR CHIP | 2021-09-09 |
20210280467 | SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2021-09-09 |
20210280468 | SEMICONDUCTOR STRUCTURE | 2021-09-09 |
20210280469 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2021-09-09 |
20210280470 | TWO-DIMENSIONAL VERTICAL FINS | 2021-09-09 |
20210280471 | Strain Enhancement for FinFETs | 2021-09-09 |
20210280472 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-09-09 |
20210280473 | Methods of Cutting Metal Gates and Structures Formed Thereof | 2021-09-09 |
20210280474 | DUMMY FIN TEMPLATE TO FORM A SELF-ALIGNED METAL CONTACT FOR OUTPUT OF VERTICAL TRANSPORT FIELD EFFECT TRANSISTOR | 2021-09-09 |
20210280475 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2021-09-09 |
20210280476 | SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE INCLUDING SEMICONDUCTOR SUBSTRATE, AND TEST METHOD OF SEMICONDUCTOR SUBSTRATE | 2021-09-09 |
20210280477 | SEMICONDUCTOR DEVICE STRUCTURE WITH MAGNETIC ELEMENT | 2021-09-09 |
20210280478 | Radio Frequency Package Implementing a Window Frame with Edge Plating and Processes of Implementing the Same | 2021-09-09 |
20210280479 | Component Carrier With a Stepped Cavity and a Stepped Component Assembly Embedded Within the Stepped Cavity | 2021-09-09 |
20210280480 | SEMICONDUCTOR DEVICE | 2021-09-09 |
20210280481 | PROTECTION STRUCTURES IN SEMICONDUCTOR CHIPS AND METHODS FOR FORMING THE SAME | 2021-09-09 |
20210280482 | Deformable Inductors | 2021-09-09 |
20210280483 | POWER SEMICONDUCTOR APPARATUS | 2021-09-09 |
20210280484 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2021-09-09 |
20210280485 | DEVICE AND FORMING METHOD OF DEVICE | 2021-09-09 |
20210280486 | PASSIVATION LAYERS FOR SEMICONDUCTOR DEVICES | 2021-09-09 |
20210280487 | SEMICONDUCTOR DIE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE | 2021-09-09 |
20210280488 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2021-09-09 |
20210280489 | CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND SUPERCOMPUTING DEVICE | 2021-09-09 |
20210280490 | Heat Removal Mechanism for Stack-based Electronic Device With Process Control Component and Processing Components | 2021-09-09 |
20210280491 | Heat Spreading Device and Method | 2021-09-09 |
20210280492 | HEAT SPREADING LAYER INTEGRATED WITHIN A COMPOSITE IC DIE STRUCTURE AND METHODS OF FORMING THE SAME | 2021-09-09 |
20210280493 | CHIP HEAT DISSIPATION STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND SUPERCOMPUTING DEVICE | 2021-09-09 |
20210280494 | ACCORDION HEAT SINK | 2021-09-09 |
20210280495 | METHODS OF FORMING FLEXURE BASED COOLING SOLUTIONS FOR PACKAGE STRUCTURES | 2021-09-09 |
20210280496 | MODERATED DEFORMATION OF A VAPOR CHAMBER TO MATCH A SHAPE OF A HEAT SOURCE | 2021-09-09 |
20210280497 | MODULAR TECHNIQUE FOR DIE-LEVEL LIQUID COOLING | 2021-09-09 |
20210280498 | COOLING APPARATUS | 2021-09-09 |
20210280499 | 3D SEMICONDUCTOR DEVICE WITH ISOLATION LAYERS | 2021-09-09 |
20210280500 | SEMICONDUCTOR DEVICE | 2021-09-09 |
20210280501 | PRESSURIZED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-09-09 |
20210280502 | MOLD FLOW BALANCING FOR A MATRIX LEADFRAME | 2021-09-09 |
20210280503 | MODULE | 2021-09-09 |
20210280504 | CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND SUPERCOMPUTING DEVICE | 2021-09-09 |
20210280505 | WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-09-09 |
20210280506 | PRINTABLE 3D ELECTRONIC COMPONENTS AND STRUCTURES | 2021-09-09 |