37th week of 2008 patent applcation highlights part 28 |
Patent application number | Title | Published |
20080218906 | MAGNETIC RECORDING MEDIA AND METHOD OF MANUFACTURE OF THE SAME - A magnetic recording medium is disclosed in which there is no degradation of magnetic characteristics at the time of manufacture, such as is seen in proposed discrete-track media or patterned media. The medium can be manufactured by a simple method and results in excellent productivity. Magnetic recording media have a substrate, and, provided thereon in order from the substrate side, are a soft magnetic layer, a crystal orientation control layer, and a magnetic recording layer. The area of at least a portion of the crystal orientation control layer is provided with a depressed portion. Portions of the magnetic layer formed on this depressed portion have a non-granular structure, whereas portions of the magnetic formed on the crystal orientation control layer outside the depressed portion have a granular structure. A method for manufacturing the magnetic recording media is disclosed having a soft magnetic layer formation process of forming a soft magnetic layer on a substrate; a crystal orientation layer formation process of providing a crystal orientation control layer on the soft magnetic layer; a depressed portion formation process of providing a depressed portion in the area of at least a portion of the crystal orientation control layer; and a process of forming a magnetic recording layer on the crystal orientation control layer on which the depressed portion is formed. | 2008-09-11 |
20080218907 | MAGNETO-RESISTANCE EFFECT ELEMENT AND THIN-FILM MAGNETIC HEAD - A magneto-resistance effect element (MR element) used for a thin film magnetic head is configured by a buffer layer, an anti-ferromagnetic layer, a pinned layer, a spacer layer, a free layer, and a cap layer, which are laminated in this order, and a sense current flows through the element in a direction orthogonal to the layer surface, via a lower shield layer and a upper shield layer. The pinned layer comprises an outer layer in which a magnetization direction is fixed, a non-magnetic intermediate layer, and an inner layer which is a ferromagnetic layer. The spacer layer comprises a first non-magnetic metal layer, a semiconductor layer, and a second non-magnetic metal layer. The first non-magnetic metal layer and the second non-magnetic metal layer comprise CuPt films having a thickness ranging from a minimum of 0.2 nm to a maximum of 2.0 nm, and the Pt content ranges from a minimum of 5 at % to a maximum of 25 at %. The semiconductor layer comprises a ZnO film, ZnS film, or GaN film having a thickness ranging from a minimum of 1.0 nm to a maximum of 2.5 nm. | 2008-09-11 |
20080218908 | PERPENDICULAR MAGNETIC RECORDING HEAD AND MANUFACTURING METHOD THEREOF - A perpendicular magnetic recording head includes a main magnetic pole layer; and a return yoke layer laminated on the main magnetic pole layer with a magnetic gap layer formed of a nonmagnetic material disposed on an opposing surface opposite a recording medium. The return yoke layer includes a first throat part opposing the main magnetic pole layer at a side close to the recording medium-opposing surface with a first gap spacing corresponding to a film thickness of the magnetic gap layer; and a second throat part extending to a deeper side than the first throat part in a height direction and opposing the main magnetic pole layer with a second gap spacing greater than the first gap spacing. A throat height determining layer is provided on the main magnetic pole layer or the magnetic gap layer, the throat height determining layer defining a dimension of the first throat part of the return yoke layer in the height direction and formed of an inorganic nonmagnetic material. | 2008-09-11 |
20080218909 | THIN-FILM MAGNETIC HEAD HAVING HEATING ELEMENT WITH LOWER-RESISTANCE PORTION - Provided is a thin-film magnetic head having a heating element in which excessive increase in temperature is suppressed corresponding to smaller area of the shield layers of the MR effect element. The thin-film magnetic head comprises: an electromagnetic coil element; an MR effect element having two shield layers sandwiching an MR effect multilayer; and a heating element having a heating layer provided at least between the electromagnetic coil element and the MR effect element, and further in the head, at least a portion of a run-off portion of the heating layer running off the shield layer closer to the heating layer than the other shield layer has a resistance per unit length smaller than a resistance per unit length of the other portions than the portion running off the shield layer. | 2008-09-11 |
20080218910 | Magnetic detection element and manufacturing method thereof - Embodiments of the present invention help to reduce etching damage at end parts of a magnetoresistive sensor in ion beam etching. According to one embodiment, ion beam etching (IBE) is used in a magnetoresistive sensor track width forming step. This IBE irradiates Ar ion beam to a substrate in a state that the substrate is inclined and further rotates the substrate about its normal as a rotational axis. In a conventional track width forming step, the IBE irradiates the Ar ion beam to the substrate all the time while the IBE is rotating the substrate. By contrast, the IBE according to embodiments of the present invention irradiates the Ar ion beam to the substrate only in a predetermined specific angular range. | 2008-09-11 |
20080218911 | CPP with elongated pinned layer - CPP magnetic read head designs have been improved by increasing the length of the AFM layer relative to that of both the free and spacer layers. The length of the pinned layer is also increased, but by a lesser amount, an abutting conductive layer being inserted to fill the remaining space over the AFM layer. The extended pinned layer increases the probability of spin interaction while the added conducting layer serves to divert sensor current away from the bottom magnetic shield which now is no longer needed for use as a lead. | 2008-09-11 |
20080218912 | CPP-type magnetoresistive element having spacer layer that includes semiconductor layer - An MR element includes: a free layer whose direction of magnetization changes in response to a signal magnetic field; a pinned layer whose direction of magnetization is fixed; and a spacer layer disposed between these layers. The spacer layer includes: a semiconductor layer made of an n-type semiconductor; and a Schottky barrier forming layer made of a metal material having a work function higher than that of the n-type semiconductor that the semiconductor layer is made of, the Schottky barrier forming layer being disposed in at least one of a position between the semiconductor layer and the free layer and a position between the semiconductor layer and the pinned layer, touching the semiconductor layer and forming a Schottky barrier at an interface between the semiconductor layer and itself The semiconductor layer is 1.1 to 1.7 nm in thickness, and the Schottky barrier forming layer is 0.1 to 0.3 nm in thickness. | 2008-09-11 |
20080218913 | TUNNELING MAGNETORESISTIVE ELEMENT WHICH INCLUDES Mg-O BARRIER LAYER AND IN WHICH NONMAGNETIC METAL SUBLAYER IS DISPOSED IN ONE OF MAGNETIC LAYERS - In a tunneling magnetoresistive element, an insulating barrier layer is made of Mg—O, and a first pinned magnetic layer has a laminated structure in which a nonmagnetic metal sublayer made of Ta is interposed between a lower ferromagnetic sublayer and an upper ferromagnetic sublayer. The nonmagnetic metal sublayer has an average thickness of about 1 Å or more and about 5 Å or less. | 2008-09-11 |
20080218914 | READ SENSOR WITH A UNIFORM LONGITUDINAL BIAS STACK - A read sensor with a uniform longitudinal bias (LB) stack is proposed. The read sensor is a giant magnetoresistance (GMR) sensor used in a current-in-plane (CIP) or a current-perpendicular-to-plane (CPP) mode, or a tunneling magnetoresistance (TMR) sensor used in the CPP mode. The transverse pinning layer of the read sensor is made of an antiferromagnetic Pt—Mn, Ir—Mn or Ir—Mn—Cr film. In one embodiment of this invention, the uniform LB stack comprises a longitudinal pinning layer, preferable made of an antiferromagnetic Ir—Mn—Cr or Ir—Mn film, in direct contact with and exchange-coupled to sense layers of the read sensor. In another embodiment of the present invention, the uniform LB stack comprises the Ir—Mn—Cr or Ir—Mn longitudinal pinning layer exchange coupled to a ferromagnetic longitudinal pinned layer, and a nonmagnetic antiparallel-coupling spacer layer sandwiched between and the ferromagnetic longitudinal pinned layer and the sense layers. | 2008-09-11 |
20080218915 | Tunnel Magnetoresistive Effect Element With Lower Noise and Thin-Film Magnet Head Having the Element - Provided is a TMR effect element having no special structures needing much man-hour cost for the formation, in which the high temperature noise and the low temperature noise are suppressed and a sufficiently high resistance-change ratio is provided. The TMR effect element comprises: a tunnel barrier layer formed by oxidizing a base film; and two ferromagnetic layers stacked so as to sandwich the tunnel barrier layer, the base film having a film thickness larger than a film thickness at which a resistance-change ratio of the TMR effect element indicates a maximum value. Here, in the case that the base film is an aluminum film, the film thickness of the aluminum film is preferably in the range of 0.50 nm to 1.5 nm. | 2008-09-11 |
20080218916 | SYSTEM AND METHOD FOR COMPONENT FAILURE PROTECTION - A system and method is presented for component failure protection. In one embodiment, the system includes an operational circuit configured to operate in a first operational state, wherein the first operational state is in proximity of a circuit failure threshold. Additionally, the system may include a canary circuit configured to mimic the operational characteristics of the operational circuit, wherein the canary circuit is configured to operate in a second operational state, and wherein the second operational state is in closer proximity of a circuit failure threshold than the proximity of the of the first operational state. The system may also include a variable input control coupled to the operational circuit and the canary circuit, wherein the variable input control is configured to monitor the second operational state and adjust an input to the operational circuit based on the proximity of the second operational state to the circuit failure threshold. | 2008-09-11 |
20080218917 | METHODS AND SYSTEMS FOR OPERATING DIRECT CURRENT MOTORS - A method for applying power to an electronically commutated motor (ECM) is described. The method includes connecting an AC voltage source to an input of a rectification circuit, connecting a DC voltage source to an output of the rectification circuit, and electrically connecting the DC voltage source and rectification circuit output to operational components of the ECM. The DC voltage source is capable of providing a voltage equal to or greater than a rectified voltage originating from the AC voltage source, and the DC voltage source is connected in parallel with the output of the rectification circuit. | 2008-09-11 |
20080218918 | Battery Power Management In Over-Discharge Situation - A method of operating battery power management unit (PMU) in over-discharge situation is disclosed. Furthermore, a power management unit (PMU) and a device comprising a power management unit (PMU) are disclosed. The power management unit (PMU) is part of a system, comprising a battery and a safety circuit connected to the battery. The state of the safety circuit of the battery is determined and the on/off control of the device is made inactive while the safety circuit remains active. Thereby avoiding an application run on the device to go into an active state, i.e. to be turned on, at a moment when the battery has not returned to its normal operation mode. | 2008-09-11 |
20080218919 | PROTECTION OF INTEGRATED ELECTRONIC CIRCUITS FROM ELECTROSTATIC DISCHARGE - Circuit nodes are identified which, in unpowered mode, can be charged with positive or negative charges but cannot be discharged. Then protective elements are added to allow the discharge of these nodes. These elements do not affect the operation of the circuit in powered mode. Discharges of the two polarities are handled, positive and negative. The circuit is thus more resistant to ESD and passes CDM tests. | 2008-09-11 |
20080218920 | METHOD AND APARATUS FOR IMPROVED ELECTROSTATIC DISCHARGE PROTECTION - An apparatus having an inter-domain electrostatic discharge (ESD) protection circuit for protection of an integrated circuit (IC) with multiple power domains. The protection circuit in response to an ESD event provides an ESD protection between different power domains. Specifically, the protection circuit comprises at least one clamp coupled to one power domain, which conducts current during an ESD event to provide extra current in the interface line between the two different power domains. This extra current also in turn increases the voltage over the impedance element on the interface line, thus improving the design margins for the ESD protection and providing a better ESD protection capability for IC products. | 2008-09-11 |
20080218921 | Control Circuit with Reduced Load for a Bypass Switch - The invention relates to a control circuit for controlling the power supplied from a power source to an electromotor, whereby the control circuit comprises a semiconductor switching element connected in series to the electromotor and the power source for controlling the power supplied to the electromotor and operating means connected to the semiconductor switching element for controlling the semiconductor switching element, whereby the operating means are arranged for controlling the semiconductor switching element when the control range of the semiconductor switching element is exceeded for at least a moment in a fully conducting state. Because the current reaches this value for at least a moment, the switch no longer has to interrupt a relatively large current. | 2008-09-11 |
20080218922 | MOS transistor triggered transient voltage supressor to provide circuit protection at a lower voltage - An electronic device formed as an integrated circuit (IC) wherein the electronic device further includes a transient voltage suppressing (TVS) circuit. The TVS circuit includes a triggering MOS transistor connected between an emitter and a collector of a first bipolar-junction transistor (BJT) coupled to a second BJT to form a SCR functioning as a main clamp circuit of the TVS circuit. The TVS circuit further includes a triggering circuit for generating a triggering signal for the triggering MOS transistor wherein the triggering circuit includes multiple stacked MOS transistors for turning into a conductive state by a transient voltage while maintaining a low leakage current. | 2008-09-11 |
20080218923 | SUPPRESSING ARC DISCHARGES - For suppressing arc discharges in a plasma process, a method includes monitoring of at least one parameter of the plasma process, determining a temporal feature of a first countermeasure and performing the first countermeasure. The temporal feature is determined as a function of, for example, at least one of an interval in time from at least one previous countermeasure, a development of the at least one parameter since a relevant time of introduction of the countermeasure, or since a variable period of time ahead of the relevant time of introduction of the countermeasure, and a differentiation as to whether a previous countermeasure was triggered based on the behavior of the at least one parameter, or based on the interval in time from at least one previous countermeasure. | 2008-09-11 |
20080218924 | LOW LEVEL VOLTAGE PROGRAMMABLE LOGIC CONTROL - An improved programmable logic control device for monitoring the current of a circuit and for signalling a circuit control device, the programmable logic control device including electrical power circuitry for activating the circuit control device and electrical circuitry for monitoring the current in the electrical circuit, the electrical circuitry including: adjustable electrical signal input circuitry to monitor the electrical current in the circuit; adjustable pick-up circuitry for adjusting the level of the current monitored in the electrical circuit, the pick-up circuitry having a thermister means for improved stabilization; adjustable time circuitry to command the electrical power circuitry to activate the circuit control device when the electrical current in the electrical circuit reaches the selected level and time duration, the time circuitry having an increased time duration to minimize nuisance tripping; and a zener diode in reverse mode for controlling the level of voltage applied to the adjustable pick-up circuitry and time circuitry substantially without resistive burden, the zener diode in reverse mode passing a reference voltage which is less than an input voltage to the said device. The device is preferably packaged in material that is resistant to radiation, such as ceramic, and is well-suited for harsh environment applications. | 2008-09-11 |
20080218925 | MOV FAILURE MODE IDENTIFICATION - A surge protector includes a thermal fuse, a metal oxide varistor electrically connected in series relation to the thermal fuse, and a detection network electrically connected in parallel relation to the thermal fuse and the metal oxide varistor. A first indicating means indicates whether or not the thermal fuse is in operation and a second indicating means indicates whether or not the metal oxide varistor is in operation. | 2008-09-11 |
20080218926 | Control module for an electric circuit breaker, method for operation thereof, and electric protection system - A control module with interrupt function for an electric circuit breaker has a voltage input for a control voltage, an output carrying the control voltage to which output an interrupter for the circuit breaker can be connected, an input for the control voltage fed back from the interrupter, a terminal for the circuit breaker, said terminal being connected to the input, and a measuring unit for measuring current and/or voltage at the input and at the output. An electric protection system has an electric circuit breaker, an interrupter and a control module. In a method for operating a control module, the circuit breaker is supplied during its operation with voltage and current via the terminal, the measuring unit determines currents and/or voltages at the input and the output, the control module transmits currents and/or voltages to an evaluating unit for determining a characteristic value which correlates to the quality of the interrupter, the evaluating unit determines, from currents and/or voltages, a characteristic value which correlates to the quality of the interrupter. | 2008-09-11 |
20080218927 | HIGH FREQUENCY FRONT-END MODULE AND DUPLEXER - A high frequency front-end module includes an antenna terminal ANT, a diplexer, high frequency switches, LC filters, and SAW duplexers. The SAW duplexer is defined by SAW filters and high-pass filters disposed at input sides thereof. The high-pass filters function as phase-matching elements having an anti-surge function against a surge coming from the antenna terminal ANT. | 2008-09-11 |
20080218928 | COIL-DRIVING APPARATUS OF ELECTRONIC MAGNETIC CONTACTOR - A coil-driving apparatus of an electro magnetic contactor is disclosed, which replaces the main units in an analog scheme with those in a digital scheme using a PWM controller of low power consumption to reduce the number of the analog components, minimize power consumption, and controls a constant voltage that flows on the coil by receiving the feedback current flowing on the coil, whereby error and defect generation rates are reduced, and deterioration and burning of components are prevented. | 2008-09-11 |
20080218929 | MAGNETIC LEVITATION APPARATUS - A magnetic levitation apparatus supports a magnetic element in a magnetic field. A control system controls a variable magnetic field to maintain the magnetic element at an equilibrium location relative to an unstable axis. In some embodiments the variable magnetic field has a gradient in the direction of the unstable axis but no field component. In some embodiments the magnetic field is provided by an array of four discrete magnets. In some embodiments additional magnets provide increased field intensity at the equilibrium location this increases stability of the levitated magnetic element against overturning. Light and electrical power may be supplied to the levitating magnetic element. | 2008-09-11 |
20080218930 | Control Apparatus and Control Method of Electromagnetic Drive Valve Operating Mechanism - When a target valve timing determined in accordance with the state of operation of an internal combustion engine is acquired, a feed forward control of setting a command timing of a valve body on the basis of the target valve timing and a predicted delay time is performed, and a feedback control of setting the actual delay time in the previous cycle as a predicted delay time for the next cycle is performed. The valve timings (opening, closure) are specified at a timing at which the valve body reached a position that is apart from a pre-determined position on a basis of a buffer height of a buffer mechanism. This makes it to possible to accurately detect the actual delay time in the feedback control, and allows the command timing to be properly set in the feed forward control. | 2008-09-11 |
20080218931 | SYSTEM FOR DECHARGING A WAFER OR SUBSTRATE AFTER DECHUCKING FROM AN ELECTROSTATIC CHUCK - A system for decharging a wafer or substrate disposed on an electrostatic chuck, includes a capacitance detector for measuring a capacitance between the electrostatic chuck and the wafer or substrate, and a decharging voltage calculator for calculating a decharging voltage based at least in part on the capacitance measured by the capacitance detector. The decharging voltage calculated by the decharging voltage calculator of the system is applied to the electrostatic chuck after dechucking to substantially neutralize electrostatic charges on the wafer or substrate. | 2008-09-11 |
20080218932 | Embedded capacitor - An embedded capacitor method and system is provided for printed circuit boards. The capacitor structure is embedded within an insulator substrate, minimizes real-estate usage, provides a high capacitance, enhances capacitance density, and yet forms an advantageous planar surface topography. A cavity is defined within and contained by an insulator substrate layer, and a dielectric material at least partially fills the cavity. The dielectric material is connected to an electrical conductor, and vias are used for interconnections and traces. In an aspect, a plurality of stacked insulator substrate layers define a plurality of cavities filled with the dielectric material, providing even greater capacitance. In another aspect, an array of cavities is formed in the insulator substrate layer. The embedded capacitor can be employed within numerous systems that utilize capacitors including automotive electronics such as a pressure sensor, an engine control module, a transmission controller, and radio systems including satellite radio devices. | 2008-09-11 |
20080218933 | Movable micro-device - A micro-device includes a movable part, a frame and a connecting part. The movable part has a main portion, a first capacitor electrode and a first driver electrode. The capacitor electrode and the driver electrode have electrode teeth extending from the main portion. The frame includes second capacitor and driver electrodes, where the second capacitor electrode has electrode teeth extending toward the first capacitor electrode, and the second driver electrode has electrode teeth extending toward the first driver electrode. The connecting part connects the movable part to the frame. The first and second capacitor electrodes have their electrode teeth overlapped in their initial position. The movable part is rotatable for varying the extent of the overlapping between the first and second driver electrodes. | 2008-09-11 |
20080218934 | Method of Manufacturing a Microsystem, Such a Microsystem, a Stack of Foils Comprising Such a Microsystem, an Electronic Device Comprising Such a Microsystem and Use of the Electronic Device - The invention relates to a method of manufacturing a microsystem and further to such microsystem. With the method a microsystem can be manufactured by stacking pre-processed foils ( | 2008-09-11 |
20080218935 | Ultra Low Temperature Fixed X7R And BX Dielectric Ceramic Composition And Method Of Making - Multilayer ceramic chip capacitors which satisfy X7R and BX requirements and which are compatible with silver-palladium internal electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a lead-free and cadmium-free barium titanate base material doped with other metal oxides such oxides of zinc, boron, bismuth, cerium, tungsten, copper, manganese, neodymium, niobium, silver, barium, silicon and nickel in various combinations. The dielectric ceramic materials herein can be sintered together (fired) at less than 1000° C. with an inner electrode having more than 80 wt % Ag and less than 20 wt % Pd to form a multilayer ceramic capacitor (MLCC). | 2008-09-11 |
20080218936 | Analog capacitor - Analog capacitors, and methods of fabricating the same, include a lower electrode having a lower conductive layer, a capacitor dielectric layer on the lower conductive layer, and an upper electrode on the capacitor dielectric layer to be opposite to the lower electrode, wherein the upper electrode includes at least an upper conductive layer in contact with the capacitor dielectric layer, wherein the upper conductive layer has a resistivity higher than that of the lower conductive layer. | 2008-09-11 |
20080218937 | VARIABLY ORIENTATED CAPACITIVE ELEMENTS FOR PRINTED CIRCUIT BOARDS AND METHOD OF MANUFACTURING SAME - Variably oriented capacitive elements for printed circuit boards (PCBs) and method of manufacturing the same. In one form the disclosure, a PCB can include a first multiple-layered capacitor including a first orientation and placed along a surface operable to mount electronic components. The PCB can also include a second multiple-layered capacitor including a second orientation different from the first. The second multiple-layered capacitor can be placed along the surface near the first multiple-layered capacitor. | 2008-09-11 |
20080218938 | NEGATIVE ELECTRODE CURRENT COLLECTOR FOR HETEROGENEOUS ELECTROCHEMICAL CAPACITOR AND METHOD OF MANUFACTURE THEREOF - A current collector for use in an electric double layer electrochemical capacitor having a sulfuric acid electrolyte. The current collector uses a conducting carbon (e.g., graphite foil) basis with p-type conductivity. A protective film covers at least a portion of the graphite foil basis. The protective film is comprised of a conducting composite material made with a conducting carbon and a conducting organic polymer with p-type conductivity. The protective film is grown on the current collector basis such that it preferably fills the pores of the current collector basis. A lug portion of the current collector basis may be protected with an insulating polymer material. | 2008-09-11 |
20080218939 | Nanowire supercapacitor electrode - A nanowire super-capacitor electrode for storing electrical energy. The electrode is formed by anodizing a porous membrane having a uniform pore size and diameter, depositing a metal layer on the membrane back, electroplate metal through the pores of the membrane, dissolving the porous membrane. The formed nanowire electrode is placed in an electrolyte to integrate said nanowire into an electrolytic capacitor. | 2008-09-11 |
20080218940 | High dielectric capacitor materials and method of their production - Methods of producing polycrystalline and single crystal dielectrics are disclosed, including dielectrics comprising CaCu | 2008-09-11 |
20080218941 | MULTIFUNCTIONAL POWER STORAGE DEVICE - A device and method for the fabrication of a power storage device or ultracapacitor manufactured from a process comprising nickel, chromium or stainless steel sintered on a metal substrate at a temperature of at least 850° C. in an inert atmosphere. The method further comprises stainless steel as the substrate. A catalyst of magnesium, manganese and iron combine with Nitric acid and de-ionized water may also be used. | 2008-09-11 |
20080218942 | Conductive polymer solid electrolytic capacitor - A solid electrolytic capacitor having an electrolytic layer containing at least two types of ionic liquids and a conductive polymer is provided. Preferably, the ionic liquids include at least one type of ionic liquid for supplying an excellent impedance characteristic and at least one type of ionic liquid for supplying an excellent withstand voltage characteristic. Thus, a solid electrolytic capacitor exhibiting a high withstand voltage and an excellent impedance characteristic can be obtained. | 2008-09-11 |
20080218943 | SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor is provided which is capable of exhibiting an excellent characteristic and high reliability against thermal stress. The solid electrolytic capacitor includes a base member having a capacitor element connecting face on its upper surface side and an electrode mounting face on its lower surface side and being made up of an insulating plate having first conductors and second conductors, disposed in a staggered format, each providing conduction between the upper and lower surface sides of the base member, and the capacitor element having anode portions and cathode portions, each being disposed in a staggered format, connected to each of the first and second conductors. | 2008-09-11 |
20080218944 | Solid electrolytic capacitor, electric circuit, and solid electrolytic capacitor mounting structure - A solid electrolytic capacitor (A | 2008-09-11 |
20080218945 | Capacitor Electode Member, Method for Manufacturing the Same, and Capacitor Provided with the Electrode Member - The invention provides a capacitor electrode member in which layers constituting the electrode member are highly adhesive. The capacitor electrode member comprises aluminum material ( | 2008-09-11 |
20080218946 | Bus-Bar and Connector - A bus-bar having a prismatic housing, an elongate conductor extending along a length of the housing, and a resilient retainer which extends along a length of the housing and retains the conductor in the housing is disclosed. | 2008-09-11 |
20080218947 | Method and apparatus of integration for primary and secondary power with addition of fiber storage for use in FTTx deployments - A mounting apparatus having at least one power source compartment, a slack storage unit attached thereto, and at least one mechanism configured to attachably receive at least one network terminal. A method of installing the apparatus comprises attaching a power source and the network terminal to the mounting apparatus and installing the mounting apparatus. In this manner, both time and costs of installing an ONT can be reduced. | 2008-09-11 |
20080218948 | STABILIZING APPARATUS FOR ELECTRONIC DEVICE - A stabilizing apparatus for preventing a server cabinet from moving, includes two mounting members oppositely mounted to the server cabinet, two support members slidably mounted to the mounting members respectively, an operating member, and two locating assemblies. Each locating assembly is mounted to a corresponding support member, the operating member, and a corresponding mounting member respectively. The operating member moves down to drive the corresponding locating assemblies respectively to move the corresponding support members down, until the support members stand on a supporting plane. | 2008-09-11 |
20080218949 | ENCLOSURE FOR CONTAINING ONE OR MORE ELECTRONIC DEVICES AND COOLING MODULE - An enclosure for containing one or more electronic devices is disclosed. The enclosure comprises walls defining a channel; an air movement device in the channel, the channel having an air inlet upstream of the air movement device in communication with a first region of the enclosure; and, a pressure chamber in the channel downstream of the air movement device. The air movement device is arranged so as in use to blow air drawn from the air inlet into the pressure chamber. The pressure chamber has an increased resistance to airflow so as to positively pressurise the air flowing therethrough. The pressure chamber has a first air outlet in communication with a second region of the enclosure and a second air outlet in communication with the exterior of the enclosure. | 2008-09-11 |
20080218950 | Mobile quick-keying device - The present invention relates to making data entry on a handheld device quicker and easier, while still being able to interact with the software/firmware in a familiar way. In particular, we disclose a device and method for text entry that uses a combination of keys on the front and back of a device held in two hands. Keys on the back are utilized in a manner that takes advantage of the muscle memory associated with QWERTY keyboards. Particular aspects of the present invention are described in the claims, specification and drawings. | 2008-09-11 |
20080218951 | Protection Panel for Electronic Apparatus Display Window and Production Method for Protection Panel - To provide a low reflectance protection panel with decoration for a display window of an electronic apparatus, superior in productivity. A decorating film is laminated on the surface of a transparent protective plate: the decorating film forms at least a window forming layer having a transparent window portion on the surface of a hard coating film at the transparent protective plate side and is formed with a low reflectance processed layer on the opposite surface thereof: and a low reflectance processed layer is formed on the rear surface of the transparent protective plate. Or, a decorating film is laminated on a surface of an optical isotropic transparent protective plate being interposed by a polarizing plate, the decorating film forms at least a window forming layer having a transparent window portion on the surface of the hard coating film at the transparent protective plate side. | 2008-09-11 |
20080218952 | Flat Screen Television Unit - A flat screen television unit comprises a mounting plate ( | 2008-09-11 |
20080218953 | LOCKING MECHANISM FOR FLAT DISPLAY DEVICE - Provided is a locking mechanism for a flat display device. The locking unit for a single axis rotation flat display device in which an upper body and a lower body are coupled to each other by a rear main hinge, includes: a latch member movable on a guide disposed in the upper body, a locking hole formed in the latch member and a bent portion slantingly bent at a lower end of the latch member which is made of a ferromagnetic material. In a retracted state, the latch member is substantially disposed within the upper body, while in deployed state the latch member protrudes therefrom. A restoration member provides a restoration force to the latch member so as to urge it into its retracted state. A hook member hingedly coupled to the lower body. The hook member having a hook portion whose upper end engages the locking hole. a magnet is installed to or in proximity to the hook member under the hook portion. A push button protrudes from a side portion of the lower body and pushes the hook member so that the hook portion disengages the locking hole when the pushbutton is pressed. | 2008-09-11 |
20080218954 | DISPLAY DEVICE - A display device includes: a rear frame having a bottom surface and a side surface, the side surface being provided with a female screw that projects outwardly; a flat light guide plate arranged inside the rear frame, the flat light guide plate receiving light from a light source to emit the same in a flat manner; a display panel opposed to the flat light guide plate, the display panel controlling the light emitted from the flat light guide plate to display an image; and a front frame with an opening facing the display panel, the front frame being provided with a fitting portion in the form of an aperture on its side surface, the fitting portion being fitted with the female screw which thereby forms a fixing member for fixation to an outer casing. | 2008-09-11 |
20080218955 | Electronic apparatus - An electronic apparatus includes a first part, a second part, and a rotating holding part configured to rotatably hold the second part to the first part, wherein, in addition to a closed state in which the first part and the second part are placed upon one another and an opened state in which the second part is apart from the first part so that both first and second parts are opened, an intermediate state is provided in which respective opposite faces of the first and second parts are apart by a predetermined space and thereby radiation is available, and a lifting mechanism is provided to cause an end of the second part to be apart from a corresponding end of the first part in the rotating holding part so that the opposite faces of both parts are apart by the predetermined space and thus the intermediate state is created. | 2008-09-11 |
20080218956 | Plasma display device - A plasma display device allowing easy insertion of a cable into a cable connector and preventing skewing during insertion of the cable, may be constructed with a plurality of signal transmission members including a plurality of electronic devices and flexible cables, with one end of each signal transmission member connected to a circuit unit installed on a chassis base, and another end connected to the plasma display panel in order to transmit a signal that is generated by the circuit unit to drive the plasma display panel; and a plurality of cable connectors mounted on the circuit unit to electrically connect the signal transmission member to the circuit unit. Each cable connector has an inserting unit into which a cable of the signal transmission member is inserted, wherein the width of an inlet of the inserting unit gradually narrows toward the inside of the cable connector. | 2008-09-11 |
20080218957 | Memory module and cover therefor - A storage device has a memory module enclosed within a housing and a removable cover. In a first configuration of the storage device, while leaving a portion of the housing exposed, the cover encloses at least a connector that extends from the housing and that is electrically coupled to the memory module. In a second configuration of the storage device, while leaving at least the connector exposed, the cover encloses at least the portion of the housing that was exposed in the first configuration. | 2008-09-11 |
20080218958 | COMPUTER ENCLOSURE WITH DRIVE BRACKET - A computer enclosure includes a chassis with a supporter attached therein and a drive bracket assembly with a sliding member formed thereon. The supporter has an arced surface. A plurality of parallel ridges are protruded from the arced surface and arranged along the arced surface. The drive bracket assembly is mounted on the chassis, and configured to rotate on the chassis between a securing position where the drive bracket assembly is horizontally located on the supporter and different inclined positions where a corresponding ridge of the plurality of ridges blocks the sliding member to prevent the sliding member sliding freely by gravity. | 2008-09-11 |
20080218959 | Combo internal and external storage system - A combo internal and external storage system which comprising: an enclosure portion, having a plurality of openings on it's real wall and a hollow space for containing the storage device which further comprises a first power interface and a first data interface; and a first PCB, being disposed in the hollow space and further comprising a first connector, a second power interface, a second data interface, a second connector and a power connector; wherein the first connector is used to connect to the first power interface and first data interface of the storage device, the second data interface and second data interface are used to connect to a power interface and data interface of the cradle portion, and the second connector and power connector are used to connect to the computer or equipment by the cable. | 2008-09-11 |
20080218960 | Techniques for Safely Shipping Tape Drives While Mounted Inside a Frame of an Automated Tape Library - A system of shipping tape drives while they are mounted to a frame uses shipment brackets to retain the drives within the frame in retracted positions during shipment. The brackets allow the drives to be shipped inside the frame. The brackets hold the drives in the retracted position within the frame by clipping into the drives and the shelves above the drives. Tabs on each bracket snap into a drive such that the drive cannot move with respect to the bracket or the shelf. The drive is pushed into position until the bracket is fully engaged with the shelf above the drive and the tabs have prevented the drive from further insertion. Because the bracket is engaged, the drive no longer can move in or out of the shelf. | 2008-09-11 |
20080218961 | HEAT DISSIPATION MODULE AND DESKTOP HOST USING THE SAME - A heat dissipation module suitable for a desktop host includes a case, a power supply with a fan, and a mother board. The power supply and the mother board are disposed in the case. The mother board includes a work components. The heat dissipation module includes a first heat sink, a second heat sink and a heat pipe. The first heat sink is disposed on the work components. The second heat sink is disposed outside the case and at the outlet port of the fan. The heat pipe is connected between the first heat sink and the second heat sink. Hence, the heat dissipation module can dissipate the heat generated by the work component. | 2008-09-11 |
20080218962 | COMPUTER SYSTEM - A computer system includes a chassis ( | 2008-09-11 |
20080218963 | DESKTOP PERSONAL COMPUTER AND THERMAL MODULE THEREOF - A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a housing, a power supply, and a motherboard, the power supply being located inside the housing, and including a fan having an outlet oriented toward an outside of the housing, and the motherboard being located inside the housing, and including thereon a plurality of electronic elements. The thermal module comprises a first heat sink, an adjustment device, a first heat pipe, a second heat sink, and a second heat pipe. The first heat sink is disposed on one of the electronic elements. The adjustment device is slidably and thermally connected to the first heat sink by the first heat pipe, and is slidably and thermally connected to the second heat sink, located outside the housing at the outlet of the fan, by the second heat pipe. | 2008-09-11 |
20080218964 | DESKTOP PERSONAL COMPUTER AND THERMAL MODULE THEREOF - A thermal module adapted for a desktop personal computer is provided. The desktop personal computer comprises a motherboard including a central processing unit and electronic elements. The thermal module comprises a first heat sink, at least one second heat sink, and a heat conductive plate. The first heat sink is disposed above the central processing unit. The second heat sink is disposed above one of the electronic elements. The heat conductive plate is coupled to the second heat sink, extends from the second heat sink to the central processing unit, and is engagingly sandwiched between the central processing unit and the first heat sink. | 2008-09-11 |
20080218965 | ELECTRONIC DEVICE, PACKAGE HAVING THE SAME, AND ELECTRONIC APPARATUS - There is provided an electronic device that includes a circuit element that transmits a signal to an external board and receives the signal from the external board, a signal wire that connects the external board to the circuit element, and a heat radiation wire that thermally contacts the circuit element, and radiates heat from the circuit element. | 2008-09-11 |
20080218966 | Mounting Plate for Electronic Components - A mounting plate for electronic components, including cooling conduits that are integrated into a plate body and that are traversed by a coolant, a fixing device for mounting electronic components that are to be cooled being located on the plate body. The mounting plate has the fixing device including at least one first groove with an approximately C-shaped cross-section, which extends in a linear manner in the extension direction of the mounting plate. At least one screw nut is inserted and locked against torsion in the groove in order to form a screw connection with an electronic component. | 2008-09-11 |
20080218967 | Real Time Adaptive Active Fluid Flow Cooling - The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element. | 2008-09-11 |
20080218968 | WINGED PIEZO FAN - A winged piezo-fan to dissipate the heat generated by the devices in an electronic system is disclosed. The winged piezo-fan may comprise a piezo-ceramic element and two blades. The blades may be coupled to the piezo-ceramic element, which may change its physical dimension in response to receiving an alternating voltage signal. The blades coupled to the piezo-ceramic element may move upwards and downwards in a direction that is perpendicular to the axis drawn along the length dimension of the blades in response to the changes in the physical dimension of the piezo-ceramic element. The movement of the blades may cause a flapping movement, which may create turbulence in the surrounding air. The turbulence so created may create eddies, which may dissipate the heat generated by the devices positioned close to the winged piezo-fan. | 2008-09-11 |
20080218969 | ELECTRONIC SYSTEM WITH ADJUSTABLE VENTING SYSTEM - An electronic system is provided including determining temperature in an enclosure, controlling airflow into the enclosure based on the temperature, and adjusting the airflow through an opening of the enclosure. | 2008-09-11 |
20080218970 | Thermal Management for a Ruggedized Electronics Enclosure - The present invention relates to a liquid cooling assembly for cooling electronic components. The liquid cooling assembly contains a heat spreader plate for providing mechanical support and thermal dissipation; a fluid channel for directing a cooling fluid in the plane of the heat spreader; and a bottom plate for protecting against destructive shock events and for providing thermal dissipation. The present invention also provides a maze structure in the liquid cooling assembly to increase structural stability against destructive shock events. The present invention also relates to a ruggedized electronics enclosure for housing electronic components. A top compartment contains a first electronics layer and a second electronics layer adjacent to said first electronics layer and a cooling assembly. A thermal shunt is configured to channel heat from the first and second electronics layers to the cooling assembly and to provide additional mechanical support to protect against potentially destructive shock events. | 2008-09-11 |
20080218971 | METHOD AND STRUCTURE TO IMPROVE THERMAL DISSIPATION FROM SEMICONDUCTOR DEVICES - A method and structure of improving thermal dissipation from a module assembly include attaching a first side of at least one chip to a single chip carrier, the at least one chip having a second side opposite of the first side; grinding the second side of the at least one chip to a desired surface profile; applying a heat transfer medium on at least one of a heat sink and the second side of the at least one chip; and disposing the heat sink on the second side of the at least one chip with the heat transfer medium therebetween defining a gap between the heat sink and the second side of the at least one chip. The gap is controlled to improve heat transfer from the second side of the at least one chip to the heat sink. | 2008-09-11 |
20080218972 | Cooling device, system containing same, and cooling method - A cooling device includes a heat sink ( | 2008-09-11 |
20080218973 | Apparatus, system and method for use in mounting electronic elements - The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one lateral side surface. A recess is formed in the first surface and extends into the casing. A plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation. | 2008-09-11 |
20080218974 | Method and Structure for Connecting, Stacking, and Cooling Chips on a Flexible Carrier - A heat sink apparatus having a plurality of chips attached to a first surface of a flexible carrier and a plurality of heat sink fins. One or more additional chips may be attached to a second surface of the flexible carrier. The flexible carrier has at least one complementary fold, the complementary fold having a counterclockwise fold and a clockwise fold as seen from the side. A first chip back surface of a first chip and a second chip back surface of a second chip are in thermal contact with a particular heat sink fin, that is, sharing the same heat sink fin. Thermal contact between the chips and heat sink fins is effected by force, by thermally conducting adhesive, by thermal grease, or by a combination of force and/or thermally conducting adhesive and/or thermal grease. | 2008-09-11 |
20080218975 | MOUNTING STRUCTURE WITH HEAT SINK FOR ELECTRONIC COMPONENT AND FEMALE SECURING MEMBER FOR SAME - A mounting structure is provided which is capable of easily attaching a heat sink irrespective of a thickness of an LSI (Large-Scale Integration circuit) mounted on a printed circuit board. Each female screw metal fitting of each female screw portion is attached on an upper surface of a cylindrical gel in a stacked manner and a lower surface of the cylindrical gel is attached to the printed circuit board. An end portion of each male screw is made to pass through each through-hole of the heat sink so as to be screwed into each of the female screw portions. With a progress of screwing therein, each of the female screw portions is elevated and the cylindrical gel is pulled and elongated. Since a restoring force occurs when the cylindrical gel is elongated, the heat sink is pulled by each of the female screw portions toward the LSI. Thus, variations in height can be accommodated. | 2008-09-11 |
20080218976 | RETENTION MODULE FOR A HEAT SINK - A retention module ( | 2008-09-11 |
20080218977 | Cycling Led Heat Spreader - A graphite heat spreader is provided for use with a flash LED light source for a camera of a handheld device such as a cell phone. Dramatically reduced operating temperatures are provided at substantially increased life of the electronic components. | 2008-09-11 |
20080218978 | IC fixing structure - The IC fixing component includes a locking case accommodating the IC in such a manner that a side of the IC out of a face-to-face contact with the heat dissipation plate is brought into a face-to-face contact with the locking case so as to be covered and a through hole and a rotation stop protrusion inserted into a rotation limiting hole. After the IC has been accommodated in the locking case, the screw member inserted through the through hole is screwed into a screw hole of the heat dissipation plate so that the side of the IC out of face-to-face contact with the locking case is pressed by the locking case thereby to be brought into a face-to-face contact with the heat dissipation plate. | 2008-09-11 |
20080218979 | Printed circuit (PC) board module with improved heat radiation efficiency - A Printed Circuit (PC) board module is structured such that heat generated by an Integrated Circuit (IC) device can be sufficiently radiated to the outside. The PC board module includes: a first PC board having a first conductive ground pad arranged therein; a plurality of via holes contained within the first PC board and positioned below the first ground pad; a plurality of conductive via lines contained within the plurality of via holes; a second PC board arranged below the first PC board; and a second conductive ground pad arranged on the second PC board and contacting the plurality of via lines. | 2008-09-11 |
20080218980 | Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology - Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load. | 2008-09-11 |
20080218981 | PACKAGE STRUCTURE FOR CONNECTION WITH OUTPUT/INPUT MODULE - A package structure for connection with an output/input module is disclosed. The package structure can be applied to conventional multi-chip packages and system in packages. The package structure defines at least one insertion cavity that is vertically or horizontally disposed. By simply inserting an output/input module into the insertion cavity, an electrical connection can be established between the output/input module and the package structure. Accordingly, the package structure thus constructed can address the repairing, replacement and upgrading problems of electronic components encountered by a package structure that adopts the conventional soldering connection method. | 2008-09-11 |
20080218982 | Surge Protector with a Mounting Base - A surge protector includes a housing with connectors for passing through an electrical lead that is to be protected, whereby a surge voltage discharge device is located inside the housing and a mounting base for placement on a mounting rail is located on the outside of the housing. The mounting base on the housing exhibits a power surge proof discharge contact for contacting the mounting rail with the discharge contact being connected to the discharge connector of the surge protector. An attachment is connected in a removeable fashion to the mounting base which includes a contact component which contacts the discharge contact of the mounting base and is connected in an electrically conducting manner with a lead that exits the attachment. | 2008-09-11 |
20080218983 | METHOD OF MANUFACTURING CIRCUIT BOARD AND CIRCUIT BOARD - A method of manufacturing a circuit board is provided. The method includes forming a plurality of first holes in a semiconductor substrate, each of the first holes being opened toward a front surface of the semiconductor substrate, filling a bottom side of the plurality of first holes with an insulating layer, filling the first holes filled with the insulating layer on the bottom side thereof with a first electro-conductive layer, polishing the semiconductor substrate from the back surface thereof until the respective insulating layers filled in the plurality of first holes are exposed, and forming a second hole in each of the exposed insulating layers so as to reach the first electro-conductive layer, and forming a second electro-conductive layer by filling each second hole with the second electro-conductive layer to connect the first electro-conductive layer. | 2008-09-11 |
20080218984 | Flexible substrate, mounted structure, display unit, and portable electronic apparatus - It is an object to provide a flexible substrate according to which noise due to layered components can be reduced effectively without depending on changing layered components and the mounting positions thereof. To attain this object, a flexible substrate, which is a flexible substrate for mounting a capacitor, has flexibility, and has thereon a mounting region for mounting the capacitor, and a vibration transmission suppressing region in which holes are formed so as to surround the mounting region. | 2008-09-11 |
20080218985 | MULTILAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME - A printed circuit board is provided which is capable of shortening intervals among core layer vias and suppressing high impedance. After the core layer vias each having a cylindrical conducting layer are formed so that conducting portions come into contact with one another, a punching process is performed along a symmetric axis of each of four core layer vias so that a through-hole of a specified diameter passes through a core board to form the core layer vias separated from one another and the through-hole is filled with an insulator and a punching process is performed along a central axis of the through-hole filled with the insulator so as to pass through the core board to form the through-hole having a diameter being shorter than that of the through-hole and the conducting layer is formed on an inside wall of the through-hole to form the core layer via. | 2008-09-11 |
20080218986 | Increased Stand-Off Height Integrated Circuit Assemblies, Systems, and Methods - Disclosed are integrated circuit assemblies with increased stand-off height and methods and systems for their manufacture. Methods of the invention provide for assembling a semiconductor device by aligning a die with a substrate and interposing solder between corresponding substrate and die bond pads. A lifting force is applied to the die during heating of the solder to a liquescent state, thereby increasing the stand-off height of the die above the substrate. The lifting force is maintained during cooling of the solder to a solid state, thereby forming increased stand-off height solder connections. | 2008-09-11 |
20080218987 | MONOLITHIC BACKPLANE HAVING A FIRST AND SECOND PORTION - A subrack having a front side and a rear side, wherein the subrack is coupled to receive an Advanced Mezzanine Card module, the subrack includes a monolithic backplane having a first portion and second portion, where the first portion runs substantially along the front side and the second portion runs substantially along the rear side. A first slot is to receive the Advanced Mezzanine Card module inserted via the front side and connect the Advanced Mezzanine Card module directly to the second portion of the monolithic backplane. A second slot is to receive the Advanced Mezzanine Card module inserted via the rear side and connect the Advanced Mezzanine Card module directly to the first portion of the monolithic backplane. A virtual carrier manager, where the virtual carrier manager provides a control management function for the Advanced Mezzanine Card module, where the virtual carrier manager provides a central switching function for the Advanced Mezzanine Card module, and where the virtual carrier manager provides a power control function for the Advanced Mezzanine Card module. | 2008-09-11 |
20080218988 | Interconnect for an electrical circuit substrate - A passive surface mount part such as a capacitor or a resistor is employed to attach a first substrate to a second substrate, or a semiconductor device to a substrate, for an electrical circuit assembly. Applicable forms of substrates include a printed circuit board such as a motherboard and a daughterboard, and applicable forms of semiconductor devices include an integrated circuit. In an aspect, a low profile attachment is provided forming a planar structure. Space is conserved, signal transmission is provided, and electrical performance is increased. In another aspect, a standoff is defined between the substrates setting the substrates apart a desired distance, compensating for any surface irregularities, increasing thermal separation, and increasing interconnect flexibility. As an application, the standoff defined between the substrates can be utilized for a structure such as optical glass structure to be situated between the substrates for use with an optical circuit assembly. | 2008-09-11 |
20080218989 | THIN FILM DEPOSITION AS AN ACTIVE CONDUCTOR AND METHOD THERFOR - A method includes populating components in a cavity of a substrate, disposing a polymer over the components and within the cavity. The polymer is cured and a thin film is formed on the polymer. In addition, a method includes forming an EMI shield within a medical device by depositing a thin film of metal on a surface within the medical device. The thin film of metal, of gold, aluminum, or copper, is formed by vapor deposition or sputtering. An apparatus includes a first substrate assembly including a first substrate having a cavity. A first set of electronic components are disposed within the cavity, and a first polymer is disposed over the first set of components. Deposited on an outer surface of the first polymer by vapor deposition is a thin film of metal. The thin film of metal is electrically coupled with a ground. A second substrate assembly including a second substrate is coupled with the first substrate assembly. | 2008-09-11 |
20080218990 | ELECTRONIC COMPONENTS ON TRENCHED SUBSTRATES AND METHOD OF FORMING SAME - A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints. | 2008-09-11 |
20080218991 | LIGHT-GUIDING METHOD OF LIGHT-GUIDING PLATE AND KEY PAD ASSEMBLY USING THE LIGHT-GUIDING PLATE - A key pad assembly includes a printed circuit board, a first elastic layer, a second elastic layer, a light-shielding layer, a keycap group, a light-emitting element and a light-shielding piece. The second elastic layer has a light-guiding plate thereon. The light-guiding plate has a chain-like light-shielding structure. The light-shielding structure is constituted of a plurality of penetrating holes with neighboring ones arranged alternatively and divides the light-guiding plate into two light-guiding sections. When the lights with different colors are introduced from the outside of the two light-guiding sections into the light-guiding plate, and the light of either light-guiding section passes through the light-shielding structure, the intensity of the light passing through the penetrating hole is so reduced that it cannot achieve the other light-guiding section, thereby to avoid the mutual interference and mixing of the lights of the two light-guiding sections. | 2008-09-11 |
20080218992 | Light emitting diode (LED) based lighting systems - A lighting system comprises at least one excitation source ( | 2008-09-11 |
20080218993 | LED signal lamp - An LED signal lamp ( | 2008-09-11 |
20080218994 | COMPUTER PANEL WITH LIGHT-ADJUSTING MECHANISM - A panel assembly includes a panel ( | 2008-09-11 |
20080218995 | Variable color aquarium lighting - A variable color aquarium lighting system that allows for a naturalistic day and moonlight cycle. The device will mount in the hood of an aquarium and can optionally be suspended above the aquarium by other means. Another embodiment of the device will allow the device to display a selected color. | 2008-09-11 |
20080218996 | Hand-Worn Signaling Device - An improved hand-worn signaling device is disclosed that comprises at least one light-emitting assembly on the palmar side of the hand and at least one light-emitting assembly on the dorsal side of the hand; in one embodiment of the invention, the palmar light-emitting assembly is red and the dorsal light-emitting assembly is green. One embodiment of the device also comprises a controller that detects hand motions by the user and activates the appropriate light-emitting assembly in response. In another embodiment, the controller detects the angle of the user's wrist or knuckles, and activates the appropriate light-emitting assembly depending on the angle of the user's joints. In another embodiment, the controller detects the spatial orientation of the user's hand, and activates the appropriate light-emitting assembly depending on whether the user's hand is positioned vertically with the fingers pointing straight up (the “stop” position) or in any other orientation. An interlock switch that prevents inadvertent activation, and a feedback device that enables the user to tell which light-emitting assembly is on, are also disclosed. | 2008-09-11 |
20080218997 | LIGHT EMITTING APPARATUS FOR USE IN A CONTAINER - The present invention includes an apparatus for illuminating an inner portion of a container. The apparatus includes a first electroluminescent lamp for emitting light within the container. Also, the apparatus includes a holding member for stabilizing the position of the lamp within the container. The holding member includes a first lamp retaining portion secured to the first electroluminescent lamp. Additionally, the holding member includes an extending portion continuous with the first lamp retaining portion. The extending portion has a width and a length defining a surface for engaging an inner portion of the container. Further, at least a portion of the length of the extending portion is remote from the retaining portion. | 2008-09-11 |
20080218998 | DEVICE HAVING MULTIPLE LIGHT SOURCES AND METHODS OF USE - A visualization device is described. The visualization device includes a body. The body includes a cavity configured to receive one or more components. One or more activating light sources may be positioned in the cavity of the body and are configured to produce activating light. One or more white light sources may be positioned opposite to the activating light source in the cavity of the body and are configured to produce white light. The activating light sources and the white light sources are both coupled to one or more power sources. Methods of detecting leaks using the visualization device are also described. | 2008-09-11 |
20080218999 | Variable-wavelength illumination system for interferometry - An illumination system for an interferometer combines a white-light source and a green source with a reflective green dichroic filter. When the green source alone is energized for PSI measurements, the output of the illumination system is green only. When a white-light output is desired for VSI measurements, both sources are energized and the intensity of the green light is judiciously calibrated to match the spectral band filtered out by the dichroic mirror. Therefore, the system can switch between green and white light simply by changing the selection of energized sources, without any mechanical switching and attendant delays and vibrations. Multiple narrowband sources may be combined with white light in a similar manner. | 2008-09-11 |
20080219000 | Lampshade with at least one LED - A lampshade with at least one LED has a circuit card, at least one LED and a reflector. The at least one LED is attached to the circuit card. The reflector is mounted around the circuit card and has at least one recess corresponding to the LED. Each recess has a reflecting sidewall to reflect light emitting from the LED. When the LED is lighting, the light is reflected via the reflecting sidewall to reflect light of the LEDs to all directions. Therefore, the brightness in all directions of the lampshade is enhanced. | 2008-09-11 |
20080219001 | Led Control Utilizing Dynamic Resistance of Leds - The present invention is directed to an LED light fixture. The LED light fixture comprises an interface for connecting the fixture to a source of electrical power, a power control section for supplying and controlling power to an LED array producing a light of a suitable intensity and color for the task for which the fixture is to be used and a light diffuser for diffusing the light from the LED array. The present invention is also directed to a novel power control for supplying and controlling power to an LED array comprising a non switching linear design based on a monolithic approach of power control whereby the load (the LED array) becomes part of the power control system. | 2008-09-11 |
20080219002 | LED LIGHTING SYSTEMS FOR PRODUCT DISPLAY CASES - An LED lamp for use in a display case includes a plurality of LEDs and an optic for redirecting the light to illuminate the contents of the display case. | 2008-09-11 |
20080219003 | Backlight Unit and Liquid Crystal Display Apparatus Including the Same - Provided are a backlight unit and a liquid crystal display apparatus including the same. The backlight unit comprises: a housing comprising an opening part; a module substrate in the opening part of the housing; a light emitting diode on the module substrate; and a reflection sheet in which the light emitting diode inserted thereto. | 2008-09-11 |
20080219004 | Illumination Device for Illuminating an Object - An illumination device ( | 2008-09-11 |
20080219005 | LIGHT EMITTING DEVICE, DISPLAY DEVICE AND A METHOD OF MANUFACTURING DISPLAY DEVICE - Disclosed herein is a light emitting device, which includes a light emitting element configured to emit a light, and a concave mirror portion configured to reflect the light emitted from the light emitting element, the concave mirror portion being erected on a circumference of an emission surface of the light emitting element. The concave mirror portion has a light reflecting surface obtained by rotating a part of a parabola. A central axis of the rotation is set in a position of passing through a side of the parabola with respect to a middle point of a line segment joining the part of the parabola and a focal point of the parabola. | 2008-09-11 |