38th week of 2011 patent applcation highlights part 16 |
Patent application number | Title | Published |
20110227196 | ESD PROTECTION DEVICE - An ESD protection device includes a ceramic multilayer substrate, at least one pair of discharge electrodes provided in the ceramic multilayer substrate and facing each other with a space formed therebetween, external electrodes provided on a surface of the ceramic multilayer substrate and connected to the discharge electrodes. The ESD protection device includes a supporting electrode obtained by dispersing a metal material and a semiconductor material and being arranged in a region that connects the pair of discharge electrodes to each other. | 2011-09-22 |
20110227197 | SEMICONDUCTOR INTEGRATED CIRCUIT COMPRISING ELECTRO STATIC DISCHARGE PROTECTION ELEMENT - An electro static discharge protection element being formed by a diode including a well region of a first conductivity type on a surface of a semiconductor substrate, and a first diffusion layer of a second conductivity type in the well region. The first diffusion layer is surrounded by a second diffusion layer of the first conductivity type in the well region. The first diffusion layer has a surface on which a first contact region connected to an input/output terminal is formed. The first diffusion layer has a surface on which a second contact region connected to a reference voltage terminal is formed. | 2011-09-22 |
20110227198 | SEMIPOLAR SEMICONDUCTOR CRYSTAL AND METHOD FOR MANUFACTURING THE SAME - A method of manufacturing a semipolar semiconductor crystal comprising a group-III-nitride (III-N), the method comprising: providing a substrate comprising sapphire (Al | 2011-09-22 |
20110227199 | METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTRATE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND REACTION APPARATUS - There is provided a method of producing a semiconductor wafer by thermally processing a base wafer having a portion to be thermally processed that has a single-crystal layer and is to be subjected to thermal processing and a portion to be protected that is to be protected from heal, to be added during the thermal processing. The method comprises a step of forming, above the portion to be protected, a protective layer for protecting the portion to be protected from an electromagnetic wave to be applied to the base wafer, and a step of annealing the portion to be thermally processed, by applying the electromagnetic wave to the entire base wafer. | 2011-09-22 |
20110227200 | ALIGNMENT STRUCTURES FOR INTEGRATED-CIRCUIT PACKAGING - A multi-chip module (MCM) that includes alignment features is described. This MCM includes at least two substrates having facing surfaces with positive features disposed on them. Note that a given positive feature on either of the surfaces protrudes above the surface. Furthermore, the two substrates are mechanically coupled by these positive features. In particular, a given one of the positive features on one of the surfaces mates with a given subset of the positive features on the other of the surfaces. Additionally, the given subset of the positive features includes two or more of the positive features. | 2011-09-22 |
20110227201 | SEMICONDUCTOR CHIP WITH A ROUNDED CORNER - Various semiconductor chips and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a semiconductor wafer that has plural semiconductor chips. Each of the plural semiconductor chips includes a first principal side and a second and opposite principal side. Material is removed from the semiconductor wafer to define at least one rounded corner of the first principal side of at least one of the plural semiconductor chips. | 2011-09-22 |
20110227202 | SILICON WAFER AND FABRICATION METHOD THEREOF - A silicon wafer and fabrication method thereof are provided. The silicon wafer includes a first denuded zone formed with a predetermined depth from a top surface of the silicon wafer, the first denuded zone being formed with a depth ranging from approximately 20 μm to approximately 80 μm from the top surface, and a bulk area formed between the first denuded zone and a backside of the silicon wafer, the bulk area having a concentration of oxygen uniformly distributed within a variation of 10% over the bulk area. | 2011-09-22 |
20110227203 | Method of Providing a Semiconductor Device With a Dielectric Layer and Semiconductor Device Thereof - In some embodiments, a method of providing a semiconductor device can include: (a) providing a substrate; (b) depositing a first metal layer over the substrate; (c) spin-coating a first dielectric material over the first metal layer, where the first dielectric material includes an organic siloxane-based dielectric material; and (d) depositing a second dielectric material comprising silicon nitride over the first dielectric material. Other embodiments are disclosed in this application. | 2011-09-22 |
20110227204 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor chip including a first conducting element, and a second conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a first location. It further includes a third conducting element arranged outside the semiconductor chip and electrically connected to the first conducting element at a second location, and a fourth conducting element arranged outside the semiconductor chip. An encapsulating body encapsulates the semiconductor chip. A vertical projection of the fourth conducting element on the chip crosses the first conducting element between the first location and the second location. At least one of the second conducting element, third conducting element, and fourth conducting element extend over the semiconductor chip and the encapsulating body. | 2011-09-22 |
20110227205 | MULTI-LAYER LEAD FRAME PACKAGE AND METHOD OF FABRICATION - The present invention features a lead-frame package, having a first, second, third and fourth electrically conductive structures with a pair of semiconductor dies disposed therebetween defining a stacked structure. The first and second structures are spaced-apart from and in superimposition with the first structure. A semiconductor die is disposed between the first and second structures. The semiconductor die has contacts electrically connected to the first and second structures. A part of the third structure lies in a common plane with a portion of the second structure. The third structure is coupled to the semiconductor die. An additional semiconductor die is attached to one of the first and second structures. The fourth structure is in electrical contact with the additional semiconductor die. A molding compound is disposed to encapsulate a portion of said package with a sub-portion of the molding compound being disposed in the volume. | 2011-09-22 |
20110227206 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEAD FRAME AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base substrate; attaching a base device over the base substrate; attaching a leadframe having a leadframe pillar adjacent the base device over the base substrate; applying a base encapsulant over the base device, the base substrate, and the leadframe; removing a portion of the base encapsulant and a portion of the leadframe providing the leadframe pillar partially exposed; and attaching a base substrate connector to the base substrate directly below the leadframe pillar. | 2011-09-22 |
20110227207 | STACKED DUAL CHIP PACKAGE AND METHOD OF FABRICATION - The present invention is directed to a lead-frame having a stack of semiconductor dies with interposed metalized clip structure. Level projections extend from the clip structure to ensure that the clip structure remains level during fabrication. | 2011-09-22 |
20110227208 | Structure and Manufacture Method For Multi-Row Lead Frame and Semiconductor Package - The present invention relates to structure and manufacture method for multi-row lead frame and semiconductor package, the method characterized by forming a pad portion on a metal material (first step); performing a surface plating process or organic material coating following the first pattern formation (second step); forming a second pattern on the metal material (third step); and packaging a semiconductor chip following the second pattern formation (fourth step), whereby an under-cut phenomenon is minimized by applying a gradual etching. | 2011-09-22 |
20110227209 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: forming a base package including: fabricating a base package substrate having a component side and a system side, coupling a first integrated circuit die to the component side, and coupling stacking interconnects to the component side to surround the first integrated circuit die; forming a stacked integrated circuit package including: fabricating a stacked package substrate having a chip side, coupling a lower stacked integrated circuit die to the chip side, and attaching on a coupling side, of the stacked package substrate, the stacking interconnects; stacking the stacked integrated circuit package on the base package including the stacking interconnects of the stacked integrated circuit package on the stacking interconnects of the base package; and forming a stacked solder column by reflowing the stacked interconnects. | 2011-09-22 |
20110227210 | CHIP PACKAGE AND METHOD FOR FORMING THE SAME - An embodiment of the invention provides a chip package, which includes: a substrate having an upper surface and a lower surface; a passivation layer located overlying the upper surface of the substrate; a plurality of conducting pad structures disposed overlying the upper surface of the substrate, wherein at least portions of upper surfaces of the conducting pad structures are exposed; a plurality of openings extending from the upper surface towards the lower surface of the substrate; and a plurality of movable bulks located between the openings and connected with the substrate, respectively, wherein each of the movable bulks is electrically connected to one of the conducting pad structures. | 2011-09-22 |
20110227211 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE LEADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base panel having a first side with a cavity and a second side opposite the first side; connecting an integrated circuit device and the first side; applying a resist mask having an opening on the second side, the opening offset from the cavity; forming a bump contact in the opening; applying an encapsulation in the cavity over the integrated circuit device and the first side; and forming a package lead by removing a portion of the base panel under the cavity, a flared tip of the package lead intersecting a base side of the encapsulation. | 2011-09-22 |
20110227212 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FABRICATING THE SAME - A semiconductor device package and a method of fabricating the same are disclosed. The semiconductor device package includes a first substrate, a second substrate, two active chips, a bridge chip and a connection structure. The first substrate has a first surface facing a second surface of the second substrate. The active chips are disposed on and electrically connected to the first surface, and spaced apart from each other by an interval, wherein the active chips respectively have a first active surface. The bridge chip is mechanically and electrically connected to the second surface, and has a second active surface partially overlapped with the first active surfaces of the active chips, such that the bridge chip is used for providing a proximity communication between the active chips. The connection structure is disposed between the first surface and the second surface for combining the first substrate and the second substrate. | 2011-09-22 |
20110227213 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR DEVICE MADE THEREFROM - A method for fabricating semiconductor devices includes: (a) forming over a temporary substrate a sacrificial film layer; (b) growing laterally and epitaxially an epitaxial film layer; (c) forming over the epitaxial film layer a patterned mask that covers partially the epitaxial film layer and that defines a plurality of through holes to expose a plurality of epitaxial surface regions, respectively; (d) forming a plurality of conductive members respectively in the through holes and on the epitaxial surface regions; (e) removing the patterned mask and removing a part of the epitaxial film layer and a part of the sacrificial film layer beneath the patterned mask; (f) removing the sacrificial film layer; and (g) removing the temporary substrate. | 2011-09-22 |
20110227214 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A wiring board has a structure where multiple wiring layers are stacked one on top of another with insulating layers interposed therebetween. A sheet-shaped member is buried in an outermost insulating layer located on a side of the structure opposite to a side on which a semiconductor element is to be mounted. The sheet-shaped member has a modulus of elasticity and a coefficient of thermal expansion which are similar to a modulus of elasticity and a coefficient of thermal expansion of the semiconductor element. The sheet-shaped member is made of a material having a modulus of elasticity and a coefficient of thermal expansion which are enough to bring respective distributions thereof into a substantially symmetric form in a direction orthogonal to a surface of the wiring board in the case where the semiconductor element is mounted. | 2011-09-22 |
20110227215 | ELECTRONIC DEVICE, PACKAGE INCLUDING THE SAME AND METHOD OF FABRICATING THE PACKAGE - An electronic device, a package including the same, and a method of fabricating the package, the electronic device including a substrate having an operation structure therein; a first passivation layer on a first side of the substrate; and first conductive patterns on a second side of the substrate, the first conductive patterns being electrically connected to the operation structure, wherein the first passivation layer has a higher flexibility than the substrate when the substrate and the first passivation layer are bent. | 2011-09-22 |
20110227216 | Under-Bump Metallization Structure for Semiconductor Devices - An under-bump metallization (UBM) structure for a semiconductor device is provided. A passivation layer is formed over a contact pad such that at least a portion of the contact pad is exposed. A protective layer, such as a polyimide layer, may be formed over the passivation layer. The UBM structure, such as a conductive pillar, is formed over the underlying contact pad such that the underlying contact pad extends laterally past the UBM structure by a distance large enough to prevent or reduce cracking of the passivation layer and or protective layer. | 2011-09-22 |
20110227217 | SEMICONDUCTOR PACKAGE WITH STACKED CHIPS AND METHOD FOR MANUFACTURING THE SAME - A semiconductor package includes at least two semiconductor chips stacked to have step surfaces and possessing bonding pads disposed over the step surfaces. Conductive patterns are disposed over the step surfaces and electrically connect the bonding pads of the semiconductor chips with one another. An insulation member is formed over side and upper surfaces of the stacked semiconductor chips excluding the step surfaces and the conductive patterns. | 2011-09-22 |
20110227218 | SILICON SUBSTRATE FOR PACKAGE - In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the through electrode in the bottom surface side of the cavity has a connection part to a wiring that forms an electric circuit including the chip of the electronic device. The silicon substrate for a package is characterized in that (1) a thin film wiring is included as the wiring and the connection part is reinforced by a conductor connected to the thin film wiring and/or (2) a wire bonding part is included as the wiring and the connection part is formed by wire bonding the end part of the through electrode in the bottom surface side of the cavity. | 2011-09-22 |
20110227219 | ENHANCED WLP FOR SUPERIOR TEMP CYCLING, DROP TEST AND HIGH CURRENT APPLICATIONS - A WLP device is provided with a flange shaped UBM or an embedded partial solder ball UBM on top of a copper post style circuit connection. | 2011-09-22 |
20110227220 | STACKABLE SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A semiconductor package includes a set of stud bumps, which can be formed by wire bonding technology and can be bonded or joined to a semiconductor element to form a stacked package assembly. Since the process of bonding the semiconductor element to the stud bumps can be carried out without reflow, an undesirable deformation resulting from high temperatures can be controlled or reduced. | 2011-09-22 |
20110227221 | ELECTRONIC DEVICE HAVING INTERCONNECTIONS AND PADS - An electronic device includes first and second interconnections formed on a first surface of a substrate and spaced apart from each other. The electronic device includes a first insulating material layer disposed on the substrate including the first and second interconnections and including a first opening exposing a predetermined region of the first interconnection. The electronic device further includes a first pad filling the first opening and having a greater width than the first opening. The first pad covers at least a part of the second interconnection adjacent to one end of the first interconnection, and the first pad is electrically insulated from the second interconnection by the first insulating material layer. | 2011-09-22 |
20110227222 | SURFACE-MOUNTED ELECTRONIC COMPONENT - A surface-mounted electronic component including balls bonded to its front surface and, on the front surface, a protective resin layer having a thickness smaller than the ball height, wherein grooves extend in the resin layer between balls of the chip. | 2011-09-22 |
20110227223 | EMBEDDED DIE WITH PROTECTIVE INTERPOSER - Embodiments of the present disclosure provide a substrate having (i) a first laminate layer, (ii) a second laminate layer, and (iii) a core material that is disposed between the first laminate layer and the second laminate layer; and a die attached to the first laminate layer, the die having an interposer bonded to a surface of an active side of the die, the surface comprising (i) a dielectric material and (ii) a bond pad to route electrical signals of the die, the interposer having a via formed therein, the via being electrically coupled to the bond pad to further route the electrical signals of the die, wherein the die and the interposer are embedded in the core material of the substrate. Other embodiments may be described and/or claimed. | 2011-09-22 |
20110227224 | Semiconductor device and method for manufacturing the same - A semiconductor device includes an interlayer insulating film formed over a semiconductor substrate, a through hole formed in the interlayer insulating film, a Cu film filling the through hole, and a metal-containing base film formed on the sidewall inside the through hole and serving as a base of the Cu film. The metal-containing base film has a metal nitride layer at the interface with the Cu film in a first region including a sidewall area adjacent to the opening of the through hole. In a second region including a sidewall area nearer to the semiconductor substrate than is the first region, the metal-containing base film has a metal layer at the interface with the Cu film. The deposition rate of the Cu film on the surface of the metal layer is greater than the deposition rate of the Cu film on the surface of the metal nitride layer. | 2011-09-22 |
20110227225 | COPPER ALLOY VIA BOTTOM LINER - Improved mechanical and adhesive strength and resistance to breakage of copper integrated circuit interconnections is obtained by forming a copper alloy in a copper via/wiring connection in an integrated circuit while minimizing adverse electrical effects of the alloy by confining the alloy to an interfacial region of said via/wiring connection and not elsewhere by a barrier which reduces or substantially eliminates the thickness of alloy in the conduction path. The alloy location and composition are further stabilized by reaction of all available alloying material with copper, copper alloys or other metals and their alloys. | 2011-09-22 |
20110227226 | MULTI-CHIP STACK STRUCTURE HAVING THROUGH SILICON VIA - The invention discloses a multi-chip stack structure having through silicon via and a method for fabricating the same. The method includes: providing a wafer having a plurality of first chips; forming a plurality of holes on a first surface of each of the first chips and forming metal posts and solder pads corresponding to the holes so as to form a through silicon via (TSV) structure; forming at least one groove on a second surface of each of the first chips to expose the metal posts of the TSV structure so as to allow at least one second chip to be stacked on the first chip, received in the groove and electrically connected to the metal posts exposed from the groove; filling the groove with an insulating material for encapsulating the second chip; mounting conductive elements on the solder pads of the first surface of each of the first chips and singulating the wafer; and mounting and electrically connecting the stacked first and second chips to a chip carrier via the conductive elements. The wafer, which is not totally thinned but includes a plurality of first chips, severs a carrying purpose during the fabrication process and thereby solves problems, namely a complicated process, high cost, and adhesive layer contamination, facing the prior art that entails repeated use of a carrier board and an adhesive layer for vertically stacking a plurality of chips and mounting the stacked chips on a chip carrier. | 2011-09-22 |
20110227227 | INTEGRATED CIRCUIT HAVING TSVS INCLUDING HILLOCK SUPPRESSION - A method for fabricating integrated circuit (ICs) having through substrate vias (TSVs) includes forming active circuit elements on a semiconductor wafer and then forming a plurality of embedded vias through the top side of the wafer. A metal filler layer including a filler metal is deposited to fill the embedded vias. Chemical mechanical polishing (CMP) then forms a plurality of embedded TSVs that have polished top TSV surfaces having exposed filler metal. An electrically conductive hillock suppression structure is formed by forming a silicon or germanium doped region, or a silicide or germanicide at the polished top TSV surface or by forming a metal layer on the polished top TSV surface having a composition different from the filler metal. A dielectric layer is deposited on the semiconductor wafer including over the hillock suppression structure. The dielectric layer is removed over the polished top TSV surface to allow metal contact thereto. | 2011-09-22 |
20110227228 | FILLING COMPOSITION, SEMICONDUCTOR DEVICE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE - Provided is a filling composition. The filling composition includes: a first particle including Cu and/or Ag; a second particle electrically connecting the first particles; and a resin containing a high molecular compound, a hardener, and a reducer, in which the first and second particles are dispersed, wherein the hardener includes amine and/or anhydride, and the reducer includes carboxyl. | 2011-09-22 |
20110227229 | SEMICONDUCTOR WAFER PROCESSING - A method of processing a semiconductor wafer is provided which comprises treating a metallisation layer provided on a backside of the wafer to form a plurality of channels therein, such that at least some of the channels along substantially the length thereof extend through the thickness of the metallisation layer to the backside of the wafer, thereby exposing the material of the backside of the wafer. When the semiconductor wafer is separated into dies, each die is provided with a plurality of channels, which extend to an edge of the die. On attaching the die to a die attach flag by solder, the solder does not stick to the exposed material of the backside of the die, and channels are thereby formed in the solder. This allows venting of gases formed in the solder, and decreases void formation in the solder. | 2011-09-22 |
20110227230 | THROUGH-SILICON VIA FABRICATION WITH ETCH STOP FILM - For a semiconductor wafer substrate having an inter layer dielectric, a through-silicon via may be formed in the substrate by first depositing an etch stop film on top of the inter layer dielectric, followed by etching an opening through the etch stop film, the interlayer dielectric, and into the substrate. A dielectric liner is then deposited over the etch stop film and into the opening. For some embodiments, the dielectric liner may be etched away except for those portions adhering to the sidewall of the opening. Then a conductive material may be deposited into the opening and on the etch stop film. The excess conductive material may then be removed, and for some embodiments the etch stop film may also be removed. | 2011-09-22 |
20110227231 | SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING THE SAME - A semiconductor device may include plugs disposed in a zigzag pattern, interconnections electrically connected to the plugs and a protection pattern which is interposed between the plugs and the interconnections to selectively expose the plugs. The interconnections may include a connection portion which is in contact with plugs selectively exposed by the protection pattern. A method of manufacturing a semiconductor device includes, after forming a molding pattern and a mask pattern, selectively etching a protection layer using the mask pattern to form a protection pattern exposing a plug. | 2011-09-22 |
20110227232 | CRENULATED WIRING STRUCTURE AND METHOD FOR INTEGRATED CIRCUIT INTERCONNECTS - A method for forming crenulated conductors and a device having crenulated conductors includes forming a hardmask layer on a dielectric layer, and patterning the hardmask layer. Trenches are etched in the dielectric layer using the hardmask layer such that the trenches have shallower portions and deeper portions alternating along a length of the trench. A conductor is deposited in the trenches such that crenulated conductive lines are formed having different depths periodically disposed along the length of the conductive line. | 2011-09-22 |
20110227233 | Packaged Electronic Device Having Metal Comprising Self-Healing Die Attach Material - A method of assembling an electronic device and electronic packages therefrom. A die attach adhesive precursor is placed between a top surface of a workpiece and an IC die. The die attach adhesive precursor includes metal particles, a first plurality of first microcapsules having a polymerizable material inside, and a second plurality of second microcapsules having a polymerization agent inside to form a first polymer upon rupture of first and second microcapsules. A force sufficient to rupture at least a portion of the first plurality of first microcapsules and at least a portion of the second plurality of second microcapsules is applied to form a self-healing die attach adhesive wherein the first polymer binds the plurality of metal particles and the remaining microcapsules and secures the IC die to the top surface of the workpiece. The self-healing die attach adhesive generally includes at least 90 vol. % metal. | 2011-09-22 |
20110227234 | MULTI-FUNCTION CARD DEVICE - A multifunction card device has an external connection terminal, an interface controller, a memory, and the security controller connected to the interface controller and the external connection terminal. The interface controller has a plurality of interface control modes, and controls an external-interface action and a memory interface action by the control mode according to the instruction from the outside. The external connection terminals have an individual terminal individualized for every interface control mode, and a communalized common terminal. A clock input terminal, a power supply terminal, and an earthing terminal are included in the common terminals. A data terminal, and a dedicated terminal of the security controller are included in the individual terminals. Partial communalization and individualization of an external connection terminal attain a guarantee of the reliability of an interface, and increase control of physical magnitude to some kinds of interface control modes. The security process by a security controller independent interface can also be guaranteed. | 2011-09-22 |
20110227235 | Curable Organopolysiloxane Composition, Optical Semiconductor Element Sealant, and Optical Semiconductor Device - A curable organopolysiloxane composition and an optical semiconductor element sealant, each comprising (A) a diorganopolysiloxane that has at least 2 alkenyl groups wherein at least 70 mole % of all the siloxane units are methylphenylsiloxane units and the total content of 1,3,5-trimethyl-1,3,5-triphenylcyclotrisiloxane and 1,3,5,7-tetramethyl-1,3,5,7-tetraphenylcyclotetrasiloxane is no more than 5 weight %, (B) an organopolysiloxane that has at least 2 silicon-bonded hydrogen atoms wherein at least 15 mole % of the silicon-bonded organic groups are phenyl groups, and (C) a hydrosilylation reaction catalyst. An optical semiconductor device in which an optical semiconductor element within a housing is sealed with the cured product from the aforementioned composition. | 2011-09-22 |
20110227236 | APPARATUS AND METHOD FOR AN AIR BYPASS SYSTEM FOR A NATURAL DRAFT COOLING TOWER - The present invention relates to an apparatus and method for an air bypass system for a natural draft cooling tower that employs a wet heat exchanger, a direct dry heat exchanger or an indirect dry heat exchanger to extract heat from a heated fluid, which is usually liquid or steam. | 2011-09-22 |
20110227237 | RESPIRATORY GAS HUMIDIFIER FOR USE IN MR TOMOGRAPHY - The invention relates to a respiratory gas humidifier for heating and humidifying respiratory air, having a humidifier module through which water and respiratory air flow, the water and respiratory air flows being separated by flat elements that are permeable to water vapor, said respiratory gas humidifier having a fluid pump and a heating element for the water, characterized in that the fluid pump is a piezo pumps. | 2011-09-22 |
20110227238 | APPARATUS AND METHOD FOR PRODUCING OPTICAL SHEETING - [Object] An apparatus and a method for producing optical sheeting with which increased productivity can be achieved while maintaining the accuracy of produced optical sheeting. | 2011-09-22 |
20110227239 | METHOD OF MOLDING - There is provided a method of molding which is capable of more highly precisely molding a molded article to be molded such as a lens than conventional technologies. | 2011-09-22 |
20110227240 | MOLDED SKIN WITH ELECTROLUMINESCENT ELEMENTS - The invention relates to a method for producing an out of tool molded skin ( | 2011-09-22 |
20110227241 | MACHINE AND METHOD FOR LAYING OF A SECOND CONCRETE SLAB OF A SLEEPERLESS RAIL-BED - A slip-form machine ( | 2011-09-22 |
20110227242 | FASTENING EQUIPMENT FOR AN ELEVATOR INSTALLATION - Fastening equipment for an elevation installation comprises a shuttering element that can be attached to an elevator shaft wall and to an elevator guide rail. The shuttering element has walls that at least partially define a receiving region for hardenable casting material. | 2011-09-22 |
20110227243 | COMPOSITE BATTERY SEPARATOR FILM AND METHOD OF MAKING SAME - A microporous separator film for electrochemical cells and a method of making such films is disclosed. The microporous separator film includes an intimate mixture of an electrically insulating matrix phase and a self-switching voltage activated conductive phase, wherein the voltage activated conductive phase provides a plurality of conductive paths from a first face of the microporous separator film to a second face of the microporous separator film. The method for making the composite microporous separator film includes the steps of forming an intimate mixture of at least an insulating matrix phase and a self-switching voltage activated phase, forming a film from the mixture, and generating pores within the film. | 2011-09-22 |
20110227244 | MOLDED FIBER LID FOR A CONTAINER - A container lid formed of cellulose material is provided for mating with a base container to securely hold various items, such as food items. The container lid includes a body having a main portion and a perimeter, and a skirt extending substantially around the perimeter of the body. The skirt includes a shoulder and an intermediate member connected with the shoulder. The intermediate member extends inwardly towards the base container when mating therewith. The intermediate member and skirt cooperatively form a channel or undercut for receiving the base container so that the base container and lid may be interlocked together. | 2011-09-22 |
20110227245 | SYSTEM AND METHOD FOR CONTROLLING CURL IN MULTI-LAYER WEBS - A system and method for controlling curl in multi-layer webs. The method can include providing a coated web, bending the web to induce a strain or pre-curl in the web, and curing the coating to form a multi-layer web. Some coatings at least partially shrink when cured such that curing the coating induces a curl in the multi-layer web. Bending the web occurs prior to curing the coating, and the pre-curl can be configured to at least partially counteract the curl induced by curing to form a multi-layer web having a desired curvature. The system can include a curing section configured to cure a coating, and can further include a web bending section configured to bend the web to induce a strain in the web. The web bending section can be positioned upstream of the curing section such that the web is bent prior to the coating being cured. | 2011-09-22 |
20110227246 | BUR REMOVING PUNCH PIN, BUR REMOVING APPARATUS AND BUR REMOVING METHOD - A flash removing punch pin is provided with a rotating mechanism wherein a flange is formed on an upper end portion on an outer circumference side portion of a cutting edge portion, and a plurality of grooves are formed in the axis center direction to the side of a casting part from the flange. An inner portion is slidably inserted into an inner cover, and the inner portion and a processing portion are moved by a spring cylinder in a direction to be separated from each other. The spring cylinder is compressed when the punch pin is in proximity to the casting part, and then the flange of the punch pin contacts a flange portion of the casting part. When the inner portion slides into the inner cover, the processing portion rotates along the axis with the inner portion. | 2011-09-22 |
20110227247 | POLYMER ARTICLES, AND METHODS AND DIES FOR MAKING THE SAME - Provided are dies having a first section for orienting material being pressed through the die and a second section for shaping the oriented material into a desired form. In an embodiment, the surface area for shaping the oriented material into a desired form is limited. Also provided are polymer articles and processes for making the same. In an embodiment, the processes employ the dies. | 2011-09-22 |
20110227248 | POLYVINYL ALCOHOL FILM AND POLARIZING FILM AND POLARIZING PLATE USING THE SAME - The present invention provides a polyvinyl alcohol film which has a width of 3 m or more, an in-plane retardation value of 30 nm or less and a fluctuation of in-plane retardation value of 15 nm or less. | 2011-09-22 |
20110227249 | MOLD FOR USE IN MAKING COMPOSITE STRUCTURES - Machinable composite molds for use in molding composite structures. The mold includes a mold body having a tool surface that is shaped to provide the molded surface of the composite structure. The mold body is made up of at least one mold layer composed of a quasi-isotropic material composed of a plurality of randomly oriented fiber bundles or chips impregnated with a resin. The use of randomly oriented fiber chips allows post-cure machining of the mold body. | 2011-09-22 |
20110227250 | Container With Injection-Molded Feature And Tool For Forming Container - A container has a base panel, at least one side panel extending upwardly from the base panel, and at least one end panel extending upwardly from the base panel. At least one corner is formed at a junction between the side panel and end panel. A flange extends laterally outward from the upper edges of at least one of the side panel, end panel, and corner. An injection-molded structure extends along at least a portion of the flange, the injection-molded structure includes a base portion adjacent the upper edges of the side wall and the end wall, a distal portion extending laterally outward from the base portion, and an indentation in the distal portion extending along at least a portion of the flange of the container. An apparatus for forming the container and a method of manufacturing are also disclosed. | 2011-09-22 |
20110227251 | SHEET MEMBER AND MANUFACTURING METHOD OF THE SAME, AND EXHAUST GAS PROCESSING DEVICE - The papermaking sheet member includes inorganic fibers, and the inorganic fibers include a lump-shaped cohered fiber which coheres as a lump. | 2011-09-22 |
20110227252 | Circuit Interrupter Assembly and Method of Making the Same - A circuit interrupting device is manufacturable in a number of different configurations providing current path options, conductor connectivity options and sensing options. The device may include a configurable solid insulation housing into which various operable components are installed. The device may include a core element including a sensor assembly and conductor members, from which the various configurations may be established including a plurality of different current path configurations. A plurality of circuit interrupting devices may be configured together in an assembly with corresponding disconnect assemblies. An interlock is provided to prevent operation of the disconnect assemblies unless the circuit interrupting devices are in an open state. | 2011-09-22 |
20110227253 | METAL MOLD FOR USE IN MOLDING LENS COVER AND METHOD FOR PRODUCING LENS COVER - A metal mold for molding a lens cover can be provided without increasing the size of the metal mold or the production costs so as to prevent deterioration of production efficiency while also preventing any unfilled area or a thin thickness portion of a resin material from being formed in a final product. Also provided is a method for producing a lens cover utilizing such a metal mold. The metal mold can have a stationary mold, a movable mold and a slidable mold between them. A cavity for molding a lens sealing portion can be formed between the stationary mold and the movable mold, and the slidable mold can have a projection portion projecting into the cavity. | 2011-09-22 |
20110227254 | BIOFOAM COMPOSITIONS FOR PRODUCTION OF BIODEGRADABLE OR COMPOSTABLE PRODUCTS - The present invention provides improved compositions and methods that can be utilized to produce biofoams. Biodegradable articles made from such biofoams are also described. | 2011-09-22 |
20110227255 | Manufacturing method for a shaped article having a very fine uneven surface structure - Disclosed herein is a manufacturing method for a molded article having a very fine uneven surface structure wherein, while a laser irradiation region is successively moved with respect to a working face of a working object article for each one shot, a laser beam is repetitively irradiated upon the working face of the working object article, the manufacturing method including the steps of: setting an energy density for the laser beam; setting a number of shots with which a desired fine shape is to be formed; calculating a speed of movement of the laser irradiation region with respect to the working face; and irradiating the laser beam of the set energy density while the working face is moved relative to the laser irradiation region at the calculated speed of movement to form a very fine uneven structure formed from working marks on the working face on which the fine shape is formed. | 2011-09-22 |
20110227256 | METHOD OF DRYING HONEYCOMB FORMED BODY - A method of drying a ceramic formed body comprising the step of performing dielectric drying on an unfired honeycomb formed body formed with a ceramic material as a main raw material under a condition that a power density is 5 to 20 [kW/kg (water)]. | 2011-09-22 |
20110227257 | PHOTOCURABLE COMPOSITION AND PROCESS FOR PRODUCING MOLDED PRODUCT HAVING FINE PATTERN ON ITS SURFACE - To provide a photocurable composition whereby it is possible to obtain a cured product having both a release property and flexibility, and a process whereby it is possible to produce a flexible molded product having on its surface a fine pattern having a reverse pattern of a mold precisely transferred. | 2011-09-22 |
20110227258 | METHOD FOR PRODUCING A CONTAINER FOR USE WITH AN AIRLESS PUMP - A method for producing a container associable with airless pumps, in the interior of which container a deformable bag is formed by blow moulding a preform of plastic material. A vacuum is created in the container interior during or slightly before blowing. | 2011-09-22 |
20110227259 | METHODS OF FORMING SINTERED BORON CARBIDE - A method of forming a sintered boron carbide body includes washing boron carbide powder with essentially pure water at an elevated temperature to generate low oxygen boron carbide powder, mixing a sintering aid and a pressing aid with the low oxygen boron carbide powder to form a green mixture, and shaping the green mixture into a green boron carbide body. The method can include mixing titanium carbide powder having an average particle diameter in a range of between about 5 nm and about 100 nm with the low oxygen boron carbide powder. The method can further include sintering the green boron carbide body, and hot isostatic pressing the sintered body, to a density greater than about 98.5% of the theoretical density (TD) of boron carbide. Alternatively, the method can include sintering the shaped boron carbide green body at a temperature greater than about 2,200° C., to thereby form a eutectic liquid solid solution of B | 2011-09-22 |
20110227260 | Cellular Ceramics Apparatus and Methods of Production - Cellular ceramic materials, for example closed cell glass ceramic materials, for use in construction of buildings comprising a clay material, carbon, and water used to form the cellular ceramic blocks, slabs and beams by expansion of the particles inside the ware. The cellular ceramic materials are produced by first mixing the clay, carbon and about 40% to about 70% water by weight of the clay in the mixture, allowing the mixture to cure, drying the cured mixture, then firing the dried mixture at a temperature and for a period of time sufficient to melt the surface of the mixture. The clay material can be, for example, surface clays, ball clays, kaolin, shale, fly ash and/or bentonite. In another embodiment a mixture of volcanic ash, carbon and water can be formed and layered with the mixture of clay, carbon and water. The cellular ceramic materials are, in most cases, impervious to liquid, are capable of supporting substantial loads in tension and compression without reinforcement, and require no additional insulating material. Such cellular ceramic material may also be used in the construction of buildings with a metal skeleton comprising metal bars forming a structure for supporting the cellular ceramic building material. | 2011-09-22 |
20110227261 | METAL MELTING APPARATUS - A refractory well ( | 2011-09-22 |
20110227262 | PIVOTING SLAG DOOR - A pivoting, liquid cooled slag door for metallurgical furnaces is disclosed. The slag door can pivot from the top using one or more robust mechanisms that enable the door to be moved into and stopped in any position between a closed position and an open position. The slag door can also incorporate wing walls disposed in close proximity to the sides of the slag door. The wing walls can minimize air infiltration into the furnace when the slag door is in an open position. The slag door can be disposed in close proximity to the hearth of the furnace to eliminate problems associate with conventional slag door tunnels. The slag door can be fitted with a furnace apparatus such as a burner or a lance and can be used to provide access to the interior of the furnace and to control the flow of material out of the furnace. | 2011-09-22 |
20110227263 | METHOD AND DEVICE FOR PRODUCING STAINLESS STEEL WITHOUT USING A SUPPLY OF ELECTRICAL ENERGY, BASED ON PIG-IRON THAT HAS BEEN PRE-TREATED IN A DDD INSTALLATION - The aim of the invention is to produce stainless steel for all stainless steel products both in the austenitic and the ferritic range, based on liquid pig-iron and FeCr solids, without using a supply of electrical energy. According to the invention, the liquid pig-iron, after being pre-treated in a blast furnace, is subjected to a DDD treatment (dephosphorisation, desiliconisation and desulphuration), is heated, finished or alloyed and deoxidated. The quantity of slag-free liquid pig-iron that has been pre-treated in the blast furnace and a DDD device is separated and introduced into two classic “twin” AOD-L converters, where the required chemical process steps (of the heating, decarburisation and alloying stages) take place in parallel contrary processes using autogenous chemical energy, the heating stage being carried out first in the first twin AOD-L converter and the decarburisation being carried out first in the second twin AOD-L converter. | 2011-09-22 |
20110227264 | BUFFER FOR ABSORBING IMPACTS - In a buffer ( | 2011-09-22 |
20110227265 | SEISMIC ISOLATION DEVICE AND SEISMIC ISOLATION STRUCTURE - The present invention is intended to provide a seismic isolation device which, regardless of a load to be supported, is capable of reducing acceleration through lengthening a natural period of an upper structure, with excellent vibration energy absorbing capacity by obtaining a properly preferable frictional force as well as a returning characteristic, and others. | 2011-09-22 |
20110227266 | PIN FOR POSITIONING OF PARTS MADE OF COMPOSITE MATERIAL - A pin for the production and positioning of parts made of composite material and glued together in an aircraft, the pin including an elongated body ( | 2011-09-22 |
20110227267 | SUPPORT HEAD FOR HANDLING A LADLE SHROUD - The present invention relates to a support head ( | 2011-09-22 |
20110227268 | Locking pliers with one or two slide bars each secured to a stationary jaw carrier - One embodiment of a locking pliers includes a first stationary jaw carrier comprising a first jaw at one end; a second stationary jaw carrier comprising a second jaw at one end; a bent first handle integrally formed with the first stationary jaw carrier; a bent second handle joined the first handle at a spring-actuated pivot joint and engaged with the other end of the second stationary jaw carrier; a self-adjusting locking unit disposed between the first and second handles and comprising a spring-actuated release lever; a locking assembly comprising a slide bar having one end fixedly secured to the other end of the second stationary jaw carrier and the other end inserting into a portion of the second handle between the pivot joint and the other end of the second stationary jaw carrier, and a spring-actuated release lever member lockingly put on the slide bar. | 2011-09-22 |
20110227269 | Replaceable jaw carriers of bar clamp with adaptable jaws - A bar clamp includes a slide bar; a housing mounted on the slide bar; a rear handgrip extending from the housing; a forward trigger handle extending from the housing, a sliding block releasably mounted on the slide bar in front of the housing; a fixed jaw carrier having an adaptable first jaw at one end; a moveable jaw carrier having an adaptable second jaw at one end; a first coupling mechanism for releasably securing the housing to the fixed jaw carrier; and a second coupling mechanism for releasably securing the sliding block to the moveable jaw carrier. | 2011-09-22 |
20110227270 | SHAFT LOADING DEVICE - Shaft loading device for a test stand, having a shaft receptacle for receiving a shaft to be loaded for testing and a rotational bearing device which is constructed as a combination of sliding bearing support of the shaft receptacle and plurality of actuators acting directly on the sliding bearing support for selective application of bearing force to the shaft receptacle. | 2011-09-22 |
20110227271 | HEIGHT-ADJUSTABLE OUT-FEED TABLE FOR TABLE SAW - A portable out-feed support table has a planar main out-feed support surface which is adjustable for both height and plane. Optional extension leaves, hinged to the edges of the main support, facilitate expansion of the length and surface area of the table, and preferably have foldable, length-adjustable support legs. In its fully-expanded configuration, the out-feed table allows a table saw operator to cut through large or lengthy workpieces with the out-feed material being at all times supported at substantially the same height and in the same plane as the saw table. In its most compact configuration, with the main out-feed support in its lowermost position and with the extension leaves folded down, the out-feed table can be manually carried by a worker, and is readily stowable in a vehicle. The out-feed table can also be configured for use with mitre gauges or saw sleds which require travel beyond the saw table, but at a height below the table saw surface. | 2011-09-22 |
20110227272 | IMAGE FORMING APPARATUS AND JUNCTION UNIT - An image forming apparatus has a main body for performing an image forming process on a sheet. An internal discharge stores a sheet after the image forming process and a discharge opening discharges a sheet to the internal discharge. A post-processing unit can be attached to the apparatus main body to apply a specified post processing to a received sheet. A junction can be assembled into the internal discharge to convey a sheet from the discharge opening to a receiving opening of the post-processing unit. The junction includes a first guide having a first guide surface for guiding a sheet, a second guide having a second guide surface facing the first guide at a predetermined distance and a support for supporting the second guide by a rotatable supporting portion. The support has a facing surface facing the first guide surface and has the supporting portion arranged on the facing surface. | 2011-09-22 |
20110227273 | Separating device, fixing device, medium conveying device and image forming apparatus - A separating device includes a carrying-out portion for carrying-out a medium, and a conveying portion for conveying the medium carried out by the carrying-out portion. A separating portion is provided between the carrying-out portion and the conveying portion, and is rotatable about a rotation fulcrum. The separating portion has an end portion separably contacts the carrying-out portion to separate the medium therefrom. The separating portion includes a first guiding portion rotatably provided for guiding the medium separated from the carrying-out portion to the conveying portion. The first guiding portion is provided between the carrying-out portion and the conveying portion, and has a rotation center located on the carrying-out portion side with respect to the rotation fulcrum. When a straight line is defined by connecting contact areas of the carrying-out portion and the conveying portion, the rotation center is located on the straight line side with respect to the rotation fulcrum. | 2011-09-22 |
20110227274 | SHEET PROCESSING APPARATUS - A sheet processing apparatus includes an opening/closing member which is turnably supported by an apparatus body and through which a user accesses the apparatus, and a conveying guide which is movably supported by a user access door and which includes a sheet conveying surface. When the opening/closing member is opened in a state where a sheet remains on the sheet conveying surface, the conveying guide is separated from the opening/closing member by the remaining sheet. | 2011-09-22 |
20110227275 | STACKED OBJECT FEED-OUT APPARATUS AND METHOD FOR FEEDING OUT STACKED OBJECTS - An object of the present invention is to achieve increase in feed-out speed while having a freedom of selecting stacked objects from a wide range of objects by securing a stable separating and feed-out function of feeding out stacked objects one by one from a surface thereof. A stacked object feed-out apparatus A | 2011-09-22 |
20110227276 | FLOW CHANNEL OPENING AND CLOSING DEVICE AND SHEET HANDLING APPARATUS - According to one embodiment, a flow channel opening and closing device includes a first rotating plate provided rotatably along a face which crosses two adjacent flow channels, having a first fluid passing hole which overlaps with each of the two flow channels midway during rotation, which fully opens the one flow channel and blocks the other flow channel at a region except the first fluid passing hole by making the first fluid passing hole overlap with the one flow channel, and a second rotating plate provided adjacent to the first rotating plate and rotatably along a face which crosses the two flow channels, having a second fluid passing hole which overlaps with each of the two flow channels midway during rotation, which rotates to a position where the second fluid passing hole overlaps at least partially with the one flow channel when the first rotating plate rotates to a position where the first fluid passing hole fully opens the one flow channel. | 2011-09-22 |
20110227277 | MANUAL SHEET FEEDER AND IMAGE FORMING APPARATUS PROVIDED WITH THE SAME - A sheet feeder has a tray on which a sheet to be fed is to be placed. A lift plate is at a feeding end of the tray and has a first end at an upstream side in a feeding direction connected rotatably to the tray. The lift plate is displaceable between a feeding posture where a second end at a downstream side in the feeding direction is lifted up and a retracted posture where the second end is lower than in the feeding posture due to its own weight. A biasing member gives a biasing force to an elevating member in a direction to lift the lift plate to the feeding posture. A lowering mechanism gives a pressing force against the force of the biasing member to lower the lift plate to the retracted posture. | 2011-09-22 |
20110227278 | MEDIA RETRIEVAL MECHANISM AND DRIVING DEVICE THEREOF - A media retrieval mechanism includes a pivot shaft, a media delivery device and a driving device. The media delivery device is capable of rotating about the pivot shaft. The media delivery device includes a contact portion and a rotating arm. The contact portion is capable of engaging at least one media. The driving device is attached to the pivot shaft. The driving device is capable of being driven by the pivot shaft. The driving device includes a driving member and the driving member includes a driving arm. The driving arm is capable of directing the rotating arm to angle the media delivery device thereby elevating the contact portion from the lower position to a lift-up position for disengaging the at least one media. | 2011-09-22 |
20110227279 | SHEET SKEW FEEDING CORRECTING APPARATUS AND IMAGE FORMING APPARATUS - A sheet skew feeding correcting apparatus includes a shutter member which abuts against a leading end of the sheet conveyed by the conveying apparatus, the shutter member is movable between a first attitude where the shutter member abuts against the leading end of the sheet and a second attitude where the shutter member permits the sheet to pass therethrough, and a loop abutting portion against which a loop portion of the sheet formed while the sheet is conveyed by the first sheet conveying apparatus, wherein the loop portion of the sheet whose leading end is abut against the shutter member moves the shutter member from the first attitude to the second attitude by a force pressing the loop abutting portion. | 2011-09-22 |
20110227280 | DEVICE FOR FEEDING SHEETS TO A SHEET STACK - In a delivery of a sheet-processing machine, in particular a printing press, provision is made for chain gripper systems for holding the sheets to be transported at the leading and trailing edges thereof. The holding devices are configured such that they can be displaced relative to one another for the purpose of format adjustment. The chain gripper system has a sprocket drive shaft and a sprocket deflection shaft for the chains of the chain gripper system. Here, provision is made for both the sprocket drive shaft and the sprocket deflection shaft to have a clutch. | 2011-09-22 |
20110227282 | DYNAMIC DICE AND METHOD - A die and method of use include a body, generally shaped in a form of a regular polyhedron, and having an interior volume and a plurality of faces, a spherical cavity defined within the interior volume, and a sphere disposed within the spherical cavity. The method includes providing the die; placing the die in a contained volume; agitating the contained volume; and ejecting the die from the contained volume onto a substrate. | 2011-09-22 |
20110227283 | INTELLIGENT BACCARAT SHOE - A method of controlling the game of baccarat is disclosed, the method including the steps of providing a card delivery shoe equipped with a sensor capable of reading at least a rank of each card; a first processor capable of controlling operation of the card delivery shoe; and a second processor capable of receiving signals from the sensor and programmed to display information related to the game of baccarat. | 2011-09-22 |
20110227284 | Color By Symbol Picture Puzzle Kit - A picture puzzle kit is provided for coloring duplicate picture puzzles marked with distinct indicia corresponding to multiple colors. The picture puzzle kit comprises two or more sets of puzzle pieces comprising parts that define a picture puzzle. The puzzle pieces in one set are duplicates of corresponding puzzle pieces in another set. The puzzle pieces in one set are marked with indicia corresponding to a color, which are distinct from indicia marked on the puzzle pieces in another set. Opposing sides of the puzzle pieces can be marked with distinct indicia. Two or more color charts display colors corresponding to the distinct indicia marked on the puzzle pieces. Coloring tools are used to color the puzzle pieces based on the colors corresponding to the distinct indicia, displayed on the color charts. Corresponding colored puzzle pieces in the sets are interchanged for creating duplicate picture puzzles of different colors. | 2011-09-22 |
20110227285 | Puzzle assembly - A three-dimensional puzzle consisting of individual three-dimensional puzzle pieces, each with three-dimensional multi-planar curved surfaces which when placed together form a completed three-dimensional geometric puzzle. The three-dimensional puzzle pieces share all points in a space with a three-dimensional scene of solid objects in the same space. The surfaces of the individual three-dimensional puzzle pieces are multi-planar curved surfaces sharing the intersection on each surface with the intersection of the scene at the same points between the scene and the substrate and the space dissection rendered into artwork on the puzzle piece surface. Each individual puzzle piece has a fixed position in the three-dimensional space of the scene and as the puzzle pieces are assembled the scene is continually completed in all three dimensions. Length, width and depth is revealed by artwork on each puzzle piece surface for the solid objects in the scene at the puzzle surface dissection. | 2011-09-22 |
20110227286 | Board Game and Method of Playing the Same - The present invention provides a board game and a method of playing a board game in which players attempt to be the first to have their set of game pieces move from a start to a finish space along a path formed of a plurality of path spaces. Each player moves by selecting a movement card with indicia directing the player to either move a game piece a number of spaces or providing the player with “jump”, “sack”, “switch”, or “return” instructions. If a numbered card is drawn, the player is permitted to move substantially any game piece, either the player's piece or any opponent's piece, on the board the allotted number of spaces. If a moving game piece lands on a space occupied by another game piece, the occupying game piece is returned to the start space. | 2011-09-22 |
20110227288 | Gaming device for pellet guns - Gaming Device for Pellet Guns is a portable, all mechanical, target apparatus used by one or more players. The device subassemblies may include a multiple silhouette targets housed in a pellet trap, a dispenser, and a score counter. The silhouette targets are mounted on pivoting posts. Its surface areas and shapes are consequential to the targeting challenge. The dispenser is designed to eject a ball from the magazine stack every time the target is hit. The ball color or its markings reflect the number of points scored. The score counter subassembly keeps a tally by stacking ejected balls into the score bar. | 2011-09-22 |
20110227289 | BRUSH SEAL - The invention relates to a brush seal to seal a gap between two structural components, in particular between a rotor and a stator, having a bristle packet comprising bristles, with the bristles of the bristle packet being firmly attached to a bristle carrier via a fixation element. According to the invention, the bristle packet comprises several layers of bristles that are made of different materials. | 2011-09-22 |
20110227290 | FLOW INDUCING RING FOR A MECHANICAL SEAL - A flow inducing ring for a mechanical seal includes a body portion having a first edge face and a second edge face, and at least one first groove extending both axially and circumferentially in one direction across the body portion from the first edge face to the second edge face. At least one second groove extends both axially and circumferentially in an opposite direction across the body portion from the first edge face to the second edge face. Each of the first groove and the second groove includes an entry portion, configured to draw a barrier fluid into the groove from the first edge face, and an exit portion, that is configured to expel barrier fluid from the groove to the second edge face and to impede the drawing of barrier fluid into the groove from the second edge face. The first and second grooves preferably have substantially constant cross-sections throughout the entirety of their lengths for enhanced uniform fluid flow. | 2011-09-22 |
20110227291 | Energised Seal - A seal assembly ( | 2011-09-22 |
20110227292 | CONTAMINANT SEALING DEVICE - [Object] An object of the present invention is to provide a contaminant sealing device wherein the pressure force of the sliding part does not increase proportionately even if the sealed fluid pressure increases, and the amount of change in the friction of the sliding part can be reduced relative to the change in the sealed fluid pressure. | 2011-09-22 |
20110227293 | RADIAL SHAFT SEAL ASSEMBLY WITH LUBRICATION RETENTION AND DEBRIS EXCLUSION FEATURE AND METHOD OF CONSTRUCTION THEREOF - A radial shaft seal assembly includes an outer case having an axially extending cylindrical outer rim and an axially extending cylindrical inner rim spaced radially from one another by an annular pocket. A radially extending first leg connects the outer rim to the inner rim and a second leg extends radially inwardly from the inner rim to a free end. The assembly includes a wear sleeve having an axially extending cylindrical wall with an outer surface providing a running surface and a flange extending radially outwardly from the running surface. A seal lip extends inwardly from the free end of the second leg into sealing abutment with the running surface. A first porous filter is received in the pocket, and a second porous filter extends in substantial abutment with the outer rim and the second leg of the outer case. | 2011-09-22 |
20110227294 | Seal Mechanism and Treatment Apparatus - [Object] To provide a seal mechanism that reduces a maintenance frequency for replenishment of a lubricating material and has small friction resistance, and a treatment apparatus equipped with the seal mechanism.
| 2011-09-22 |
20110227295 | TWO-MATERIAL COMPOSITE GASKET - Disclosed is a two-material composite gasket, preferably a two-material composite annular gasket, for sealing a gap between two opposing surfaces, one of the surfaces having a concave gap portion, which is to be sealed by the gasket, the gasket having an oblong cross-sectional shape and having projections on the top end and bottom end thereof, the gasket including an upper low-hardness elastomer molded part formed of vulcanized rubber having a Shore A hardness of 5 to 35, a lower high-hardness elastomer molded part formed of vulcanized rubber having a Shore A hardness of 45 to 80, and a parting line bonding the low-hardness elastomer molded part and the high-hardness elastomer molded part, the parting line being positioned so that the height of the low-hardness elastomer molded part is 5 to 40% of the height of the entire gasket. The two-material composite gasket enables three-surface simultaneous sealing of a gap formed by three members, as typified in a joint structure composed of a cylinder block, a cylinder head, and a chain cover of an automobile engine. | 2011-09-22 |
20110227296 | Bi-directional seal assembly - A bi-directional seal assembly for sealing the annulus between an inner tubular member and an outer tubular member comprises an annular seal which in cross section includes a generally U-shaped first portion having a radially inner first leg and a radially outer second leg and a generally U-shaped second portion having a radially inner third leg and a radially outer fourth leg. The second and third legs are joined together such that the first leg engages the inner tubular member and the fourth leg engages the outer tubular member. Pressure below the seal urges the first leg into sealing engagement with the inner tubular member and forces the second and third legs radially outwardly to thereby urge the fourth leg into sealing engagement with the outer tubular member. Also, pressure above the seal urges the fourth leg into sealing engagement with the outer tubular member and forces the second and third legs radially inwardly to thereby urge the first leg into sealing engagement with the inner tubular member. | 2011-09-22 |
20110227297 | Railroad Car Seal for Railroad Hopper Cars - A seal is disclosed for retrofitting to an existing railroad hopper car having opposing sidewalls and at least one trough extending between the opposing sidewalls. The seal includes a first member configured to mate against a surface of a trough adjacent a sidewall, the first member including a first edge having angled sections corresponding to angled sections of where the sidewall meets the trough, and a second member integral with the first member and extending substantially upright from the first edge of the first member, the second member configured to mate against a surface of the sidewall adjacent the trough, wherein the second member is angled relative to the first member at each of the angled sections corresponding to angled sections of the sidewall adjacent the trough. | 2011-09-22 |