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38th week of 2016 patent applcation highlights part 60
Patent application number
Title
Published
20160276192
COMMUNICATION DEVICE AND METHOD FOR CONTROLLING COMMUNICATION DEVICE
2016-09-22
20160276193
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
2016-09-22
20160276194
STOCKER AND METHOD FOR DISPATCHING WAFER CARRIER IN STOCKER
2016-09-22
20160276195
METHOD FOR TRANSFER OF SEMICONDUCTOR DEVICES
2016-09-22
20160276196
CERAMIC ELECTROSTATIC CHUCK BONDED WITH HIGH TEMPERATURE POLYMER BOND TO METAL BASE
2016-09-22
20160276197
GAS FLOW FOR CONDENSATION REDUCTION WITH A SUBSTRATE PROCESSING CHUCK
2016-09-22
20160276198
ELECTROSTATIC CHUCK
2016-09-22
20160276199
DECOMPRESSION PROCESSING APPARATUS
2016-09-22
20160276200
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR MANUFACTURING DEVICE
2016-09-22
20160276201
SEMICONDUCTOR MANUFACTURING METHOD AND LAMINATED BODY
2016-09-22
20160276202
CARRIER SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING FLEXIBLE DISPLAY DEVICE USING THE CARRIER SUBSTRATE
2016-09-22
20160276203
Wafer pin chuck fabrication and repair
2016-09-22
20160276204
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MANUFACTURING APPARATUS
2016-09-22
20160276205
Method and Apparatus for Transfer of Semiconductor Devices
2016-09-22
20160276206
Substrate Processing Apparatus
2016-09-22
20160276207
CUP-WASH DEVICE, SEMICONDUCTOR APPARATUS, AND CUP CLEANING METHOD
2016-09-22
20160276208
SELECTIVE FORMATION OF METALLIC FILMS ON METALLIC SURFACES
2016-09-22
20160276209
HANDLE SUBSTRATE FOR USE IN MANUFACTURE OF SEMICONDUCTOR-ON-INSULATOR STRUCTURE AND METHOD OF MANUFACTURING THEREOF
2016-09-22
20160276210
INTEGRATED CIRCUITS USING SILICON ON INSULATOR SUBSTRATES AND METHODS OF MANUFACTURING THE SAME
2016-09-22
20160276211
Manufacturing Method of Semiconductor Device
2016-09-22
20160276212
Method For Producing Semiconductor Device
2016-09-22
20160276213
RELIABLE CONTACTS
2016-09-22
20160276214
METHODS FOR ETCHING VIA ATOMIC LAYER DEPOSITION (ALD) CYCLES
2016-09-22
20160276215
Method for Manufacturing Semiconductor Device
2016-09-22
20160276216
ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
2016-09-22
20160276217
DIFFUSION BARRIER LAYER FORMATION
2016-09-22
20160276218
METHOD OF MANUFACTURING Cu WIRING
2016-09-22
20160276219
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2016-09-22
20160276220
MAGNETIC TRAP FOR CYLINDRICAL DIAMAGNETIC MATERIALS
2016-09-22
20160276221
STRUCTURE AND FORMATION METHOD OF DAMASCENE STRUCTURE
2016-09-22
20160276222
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2016-09-22
20160276223
METHOD OF DIVIDING WAFER
2016-09-22
20160276224
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
2016-09-22
20160276225
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING SEMICONDUCTOR DEVICES
2016-09-22
20160276226
LOW-COST SOI FINFET TECHNOLOGY
2016-09-22
20160276227
METHOD AND APPARATUS FOR REDUCING RADIATION INDUCED CHANGE IN SEMICONDUCTOR STRUCTURES
2016-09-22
20160276228
NON-DESTRUCTIVE, WAFER SCALE METHOD TO EVALUATE DEFECT DENSITY IN HETEROGENEOUS EPITAXIAL LAYERS
2016-09-22
20160276229
METHOD AND APPARATUS FOR BOND-PAD CHARGING PROTECTION OF REFERENCE TRANSISTOR TEST STRUCTURES
2016-09-22
20160276230
Controlling Azimuthal Uniformity of Etch Process in Plasma Processing Chamber
2016-09-22
20160276231
OPTICAL PROGRAMMING OF ELECTRONIC DEVICES ON A WAFER
2016-09-22
20160276232
Semiconductor Device and Method of Forming Build-Up Interconnect Structures Over Carrier for Testing at Interim Stages
2016-09-22
20160276233
System and Method for Dual-Region Singulation
2016-09-22
20160276234
SEMICONDUCTOR MODULE AND RESIN CASE
2016-09-22
20160276235
STRUCTURE FOR DIE PROBING
2016-09-22
20160276236
METHOD OF FORMING A MOLDED SUBSTRATE ELECTRONIC PACKAGE AND STRUCTURE
2016-09-22
20160276237
Semiconductor Device and Method to Minimize Stress on Stack Via
2016-09-22
20160276238
Semiconductor Device and Method of Forming Supporting Layer Over Semiconductor Die in Thin Fan-Out Wafer Level Chip Scale Package
2016-09-22
20160276239
Semiconductor Device and Method of Forming Stacked Vias Within Interconnect Structure for FO-WLCSP
2016-09-22
20160276240
METHOD FOR INSULATING SINGULATED ELECTRONIC DIE
2016-09-22
20160276241
ORGANIC-INORGANIC HYBRID THIN FILM AND METHOD FOR PRODUCING THE SAME
2016-09-22
20160276242
THERMAL SPREADER HAVING INTER-METAL DIFFUSION BARRIER LAYER
2016-09-22
20160276243
MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
2016-09-22
20160276244
BONDED BODY AND POWER MODULE SUBSTRATE
2016-09-22
20160276245
SEMICONDUCTOR DEVICE
2016-09-22
20160276246
SHEET-LIKE STRUCTURE, ELECTRONIC EQUIPMENT USING THE SAME, FABRICATION METHOD OF SHEET-LIKE STRUCTURE AND ELECTRONIC EQUIPMENT
2016-09-22
20160276247
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2016-09-22
20160276248
NON-VERTICAL THROUGH-VIA IN PACKAGE
2016-09-22
20160276249
SEMICONDUCTOR DEVICE
2016-09-22
20160276250
SEMICONDUCTOR PACKAGE FOR A LATERAL DEVICE AND RELATED METHODS
2016-09-22
20160276251
Lead Frames With Wettable Flanks
2016-09-22
20160276252
LEAD FRAME FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SAME
2016-09-22
20160276253
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE
2016-09-22
20160276254
SEMICONDUCTOR ASSEMBLY AND METHOD TO FORM THE SAME
2016-09-22
20160276255
WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE
2016-09-22
20160276256
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF AND SUBSTRATE STRUCTURE
2016-09-22
20160276257
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE USING THROUGH ELECTRODE SUBSTRATE
2016-09-22
20160276258
Semiconductor Device and Method of Forming an Embedded SOP Fan-Out Package
2016-09-22
20160276259
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
2016-09-22
20160276260
METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME
2016-09-22
20160276261
SEMICONDUCTOR DEVICE
2016-09-22
20160276262
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2016-09-22
20160276263
SEMICONDUCTOR DEVICE
2016-09-22
20160276264
SEMICONDUCTOR MEMORY DEVICE
2016-09-22
20160276265
SEMICONDUCTOR DEVICE
2016-09-22
20160276266
DEVICE MANUFACTURE AND PACKAGING METHOD THEREOF
2016-09-22
20160276267
METHODS OF FORMING WIRING STRUCTURES IN A SEMICONDUCTOR DEVICE
2016-09-22
20160276268
MULTILEVEL INTERCONNECT STRUCTURE AND METHODS OF MANUFACTURING THE SAME
2016-09-22
20160276269
INTEGRATED MAGNETICALLY COUPLED DEVICES AND METHOD OF MAKING THE SAME
2016-09-22
20160276270
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
2016-09-22
20160276271
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
2016-09-22
20160276272
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FORMING THE SAME
2016-09-22
20160276273
SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME
2016-09-22
20160276274
POWER AND GROUND ROUTING OF INTEGRATED CIRCUIT DEVICES WITH IMPROVED IR DROP AND CHIP PERFORMANCE
2016-09-22
20160276275
MIS (METAL-INSULATOR-SEMICONDUCTOR) CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES
2016-09-22
20160276276
SEMICONDUCTOR DEVICE
2016-09-22
20160276277
SEMICONDUCTOR DEVICE AND WAFER LEVEL PACKAGE INCLUDING SUCH SEMICONDUCTOR DEVICE
2016-09-22
20160276278
Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices
2016-09-22
20160276279
SEMICONDUCTOR DEVICE
2016-09-22
20160276280
ULTRATHIN MULTILAYER METAL ALLOY LINER FOR NANO CU INTERCONNECTS
2016-09-22
20160276281
MANUFACTURING METHOD OF WIRING STRUCTURE AND WIRING STRUCTURE
2016-09-22
20160276282
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
2016-09-22
20160276283
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
2016-09-22
20160276284
Eliminate Sawing-Induced Peeling Through Forming Trenches
2016-09-22
20160276285
Method for Forming Alignment Marks and Structure of Same
2016-09-22
20160276286
CHIP PART AND METHOD OF MAKING THE SAME
2016-09-22
20160276287
SEMICONDUCTOR DEVICE
2016-09-22
20160276288
SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING ELECTROMAGNETIC WAVE SHIELD LAYER
2016-09-22
20160276289
WAFER STRUCTURE FOR ELECTRONIC INTEGRATED CIRCUIT MANUFACTURING
2016-09-22
20160276290
SEMICONDUCTOR PACKAGE AND MOBILE DEVICE USING THE SAME
2016-09-22
20160276291
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
2016-09-22