38th week of 2021 patent applcation highlights part 66 |
Patent application number | Title | Published |
20210296197 | SEMICONDUCTOR DEVICE | 2021-09-23 |
20210296198 | SEMICONDUCTOR MODULE INCLUDING HEAT DISSIPATION LAYER | 2021-09-23 |
20210296199 | THERMALLY ENHANCED SEMICONDUCTOR PACKAGE WITH AT LEAST ONE HEAT EXTRACTOR AND PROCESS FOR MAKING THE SAME | 2021-09-23 |
20210296200 | SEMICONDUCTOR PACKAGE | 2021-09-23 |
20210296201 | Silicon Carbide Module Integrated with Heat Sink and the Method Thereof | 2021-09-23 |
20210296202 | MOTOR CONTROLLER HEAT DISSIPATING SYSTEMS AND METHODS | 2021-09-23 |
20210296203 | HEAT DISSIPATION SUBSTRATE, PREPARATION METHOD AND APPLICATION THEREOF, AND ELECTRONIC COMPONENT | 2021-09-23 |
20210296204 | POWER-MODULE SUBSTRATE WITH HEAT-SINK | 2021-09-23 |
20210296205 | STRUCTURE AND JOINED COMPOSITE | 2021-09-23 |
20210296206 | METALLIZED CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING SAME | 2021-09-23 |
20210296207 | THERMALLY CONDUCTIVE SHEET, METHOD FORMANUFACTURING THE SAME, AND METHOD FOR MOUNTING THERMALLY CONDUCTIVE SHEET | 2021-09-23 |
20210296208 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME | 2021-09-23 |
20210296209 | LIQUID-COOLED CHIP | 2021-09-23 |
20210296210 | NOVEL THROUGH SILICON CONTACT STRUCTURE AND METHOD OF FORMING THE SAME | 2021-09-23 |
20210296211 | SEMICONDUCTOR DEVICE HAVING A THROUGH SILICON VIA AND METHODS OF MANUFACTURING THE SAME | 2021-09-23 |
20210296212 | HIGH VOLTAGE SEMICONDUCTOR DEVICE LEAD FRAME AND METHOD OF FABRICATION | 2021-09-23 |
20210296213 | PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF | 2021-09-23 |
20210296214 | SEMICONDUCTOR DEVICE | 2021-09-23 |
20210296215 | SEMICONDUCTOR DEVICE | 2021-09-23 |
20210296216 | Semiconductor device, lead frame, and method for manufacturing semiconductor device | 2021-09-23 |
20210296217 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | 2021-09-23 |
20210296218 | CASCODE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | 2021-09-23 |
20210296219 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | 2021-09-23 |
20210296220 | Reinforcing Package Using Reinforcing Patches | 2021-09-23 |
20210296221 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2021-09-23 |
20210296222 | SEMICONDUCTOR PACKAGE | 2021-09-23 |
20210296223 | WIRING BOARD AND SEMICONDUCTOR DEVICE | 2021-09-23 |
20210296224 | SEMICONDUCTOR DEVICE | 2021-09-23 |
20210296225 | STRUCTURAL ELEMENTS FOR APPLICATION SPECIFIC ELECTRONIC DEVICE PACKAGES | 2021-09-23 |
20210296226 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR MODULE | 2021-09-23 |
20210296227 | SEMICONDUCTOR MEMORY DEVICE | 2021-09-23 |
20210296228 | SEMICONDUCTOR PACKAGE | 2021-09-23 |
20210296229 | SEMICONDUCTOR DEVICES | 2021-09-23 |
20210296230 | WIRING STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2021-09-23 |
20210296231 | PLANAR SLAB VIAS FOR INTEGRATED CIRCUIT INTERCONNECTS | 2021-09-23 |
20210296232 | STAIRCASE STRUCTURE IN THREE-DIMENSIONAL MEMORY DEVICE AND METHOD FOR FORMING THE SAME | 2021-09-23 |
20210296233 | SEMICONDUCTOR CHIP WITH STACKED CONDUCTOR LINES AND AIR GAPS | 2021-09-23 |
20210296234 | INTERCONNECTION FABRIC FOR BURIED POWER DISTRIBUTION | 2021-09-23 |
20210296235 | INTEGRATED CIRCUIT APPARATUS AND POWER DISTRIBUTION NETWORK THEREOF | 2021-09-23 |
20210296236 | SEMICONDUCTOR MEMORY DEVICE | 2021-09-23 |
20210296237 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME | 2021-09-23 |
20210296238 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR MEMORY DEVICE, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2021-09-23 |
20210296239 | SEMICONDUCTOR STORAGE DEVICE | 2021-09-23 |
20210296240 | EMIB COPPER LAYER FOR SIGNAL AND POWER ROUTING | 2021-09-23 |
20210296241 | MICROELECTRONIC PACKAGE WITH REDUCED THROUGH-SUBSTRATE ROUTING | 2021-09-23 |
20210296242 | SIDE MOUNTED INTERCONNECT BRIDGES | 2021-09-23 |
20210296243 | PACKAGE INCLUDING METALLIC BOLSTERING PATTERN AND MANUFACTURING METHOD OF THE PACKAGE | 2021-09-23 |
20210296244 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-09-23 |
20210296245 | Semiconductor Package and Method | 2021-09-23 |
20210296246 | PACKAGE COMPRISING A SUBSTRATE AND A HIGH-DENSITY INTERCONNECT INTEGRATED DEVICE COUPLED TO THE SUBSTRATE | 2021-09-23 |
20210296247 | ELECTRONIC DEVICES WITH YIELDING SUBSTRATES | 2021-09-23 |
20210296248 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2021-09-23 |
20210296249 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2021-09-23 |
20210296250 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | 2021-09-23 |
20210296251 | SEMICONDUCTOR PACKAGES | 2021-09-23 |
20210296252 | PACKAGE HAVING REDISTRIBUTION LAYER STRUCTURE WITH PROTECTIVE LAYER AND METHOD OF FABRICATING THE SAME | 2021-09-23 |
20210296253 | SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD OF THE SAME | 2021-09-23 |
20210296254 | SEMICONDUCTOR DEVICE | 2021-09-23 |
20210296255 | MEMORY DEVICE AND METHOD OF MANUFACTURING MEMORY DEVICE | 2021-09-23 |
20210296256 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE | 2021-09-23 |
20210296257 | FABRICATION METHOD OF SEMICONDUCTOR STRUCTURE | 2021-09-23 |
20210296258 | SEMICONDUCTOR PACKAGING DEVICE COMPRISING A SHIELD STRUCTURE | 2021-09-23 |
20210296259 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | 2021-09-23 |
20210296260 | SEMICONDUCTOR PACKAGING SUBSTRATE, FABRICATION METHOD AND PACKAGING PROCESS THEREOF | 2021-09-23 |
20210296261 | METHOD FOR FABRICATING SUBSTRATE STRUCTURE | 2021-09-23 |
20210296262 | SEMICONDUCTOR DEVICE | 2021-09-23 |
20210296263 | SEMICONDUCTOR PACKAGE STRUCTURE FOR IMPROVING DIE WARPAGE AND MANUFACTURING METHOD THEREOF | 2021-09-23 |
20210296264 | ELECTRONIC DEVICE | 2021-09-23 |
20210296265 | ISOLATOR | 2021-09-23 |
20210296266 | RF SUBSTRATE WITH JUNCTIONS HAVING AN IMPROVED LAYOUT | 2021-09-23 |
20210296267 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2021-09-23 |
20210296268 | Die-Beam Alignment for Laser-Assisted Bonding | 2021-09-23 |
20210296269 | SEMICONDUCTOR STRUCTURE CONTAINING MULTILAYER BONDING PADS AND METHODS OF FORMING THE SAME | 2021-09-23 |
20210296270 | SEMICONDUCTOR PACKAGE AND METHODS OF FORMING THE SAME | 2021-09-23 |
20210296271 | FABRICATION METHOD OF SEMICONDUCTOR DIE AND CHIP-ON-PLASTIC PACKAGING OF SEMICONDUCTOR DIE | 2021-09-23 |
20210296272 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2021-09-23 |
20210296273 | SEMICONDUCTOR PACKAGE | 2021-09-23 |
20210296274 | Interconnect Structures, Packaged Semiconductor Devices, and Methods of Packaging Semiconductor Devices | 2021-09-23 |
20210296275 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THEREOF | 2021-09-23 |
20210296276 | SEMICONDUCTOR DEVICE WITH COMPOSITE DIELECTRIC STRUCTURE AND METHOD FOR FORMING THE SAME | 2021-09-23 |
20210296277 | SEMICONDUCTOR WAFER AND METHOD OF MANUFACTURING THE SAME | 2021-09-23 |
20210296278 | SEMICONDUCTOR DEVICE PACKAGE COMPRISING POWER MODULE AND PASSIVE ELEMENTS | 2021-09-23 |
20210296279 | SEMICONDUCTOR DEVICE AND INSPECTION DEVICE | 2021-09-23 |
20210296280 | STACKED MODULE PACKAGE INTERCONNECT STRUCTURE WITH FLEX CABLE | 2021-09-23 |
20210296281 | WAFER-BONDING STRUCTURE AND METHOD OF FORMING THEREOF | 2021-09-23 |
20210296282 | DIMENSION COMPENSATION CONTROL FOR DIRECTLY BONDED STRUCTURES | 2021-09-23 |
20210296283 | 3D TRENCH CAPACITOR FOR INTEGRATED PASSIVE DEVICES | 2021-09-23 |
20210296284 | SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AND METHODS OF FORMING THE SAME | 2021-09-23 |
20210296285 | SEMICONDUCTOR STRUCTURE CONTAINING REENTRANT SHAPED BONDING PADS AND METHODS OF FORMING THE SAME | 2021-09-23 |
20210296286 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2021-09-23 |
20210296287 | INTEGRATED CIRCUIT CHIP, METHOD OF MANUFACTURING THE INTEGRATED CIRCUIT CHIP, AND INTEGRATED CIRCUIT PACKAGE AND DISPLAY APPARATUS INCLUDING THE INTEGRATED CIRCUIT CHIP | 2021-09-23 |
20210296288 | PACKAGE STRUCTURE, CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME | 2021-09-23 |
20210296289 | APPARATUSES EXHIBITING ENHANCED STRESS RESISTANCE AND PLANARITY, AND RELATED MICROELECTRONIC DEVICES AND MEMORY DEVICES | 2021-09-23 |
20210296290 | METHOD OF FORMING MESH PLATE AND DISPLAY DEVICE CONTAINING THE MESH PLATE | 2021-09-23 |
20210296291 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-09-23 |
20210296292 | LED ARRAY FOR IN-PLANE OPTICAL INTERCONNECTS | 2021-09-23 |
20210296293 | DISPLAY PANEL, METHOD OF MANUFACTURING THE DISPLAY PANEL, AND SUBSTRATE | 2021-09-23 |
20210296294 | PACKAGING BODY AND PREPARATION METHOD THEREFOR | 2021-09-23 |
20210296295 | METHOD FOR FABRICATING ELECTRONIC PACKAGE | 2021-09-23 |
20210296296 | MICRO LIGHT SOURCE ARRAY, DISPLAY DEVICE HAVING THE SAME, AND METHOD OF MANUFACTURING DISPLAY DEVICE | 2021-09-23 |