39th week of 2009 patent applcation highlights part 14 |
Patent application number | Title | Published |
20090236722 | SEMICONDUCTOR MEMORY CARD AND SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory card includes a wiring board having an outer shape where a cut-out portion is provided at a first long-edge. A second surface of the wiring board includes connection pads disposed along a portion except the cut-out portion of the first long-edge. A memory device is mounted on the second surface of the wiring board. The memory device includes electrode pads arranged along a long-edge positioning in a vicinity of the first long-edge of the wiring board, and one-sidedly disposed so as to correspond to disposed positions of the connection pads. A controller device is stacked on the memory device. | 2009-09-24 |
20090236723 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-IN-PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a package substrate, having a component side and a system side; mounting a first integrated circuit die on the component side of the package substrate; mounting a second integrated circuit die on the component side of the package substrate; mounting an internal package, having an internal die, over the first integrated circuit die; coupling chip interconnects between the first integrated circuit die, the second integrated circuit die, the internal die, the component side, or a combination thereof, and forming a stacked package body by encapsulating the component side, the first integrated circuit die, the second integrated circuit die, the internal package, and the chip interconnects. | 2009-09-24 |
20090236724 | IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA - Integrated circuit dies, integrated circuit packages, and methods for assembling the same are provided. An integrated circuit package includes a substrate, an integrated circuit die, a plurality of electrically conductive bump interconnects, an electrically conductive material, and one or more bond wires. The electrically conductive bump interconnects mount a first surface of the die to a first surface of the substrate. The electrically conductive material forms an electrically conductive path from a first electrically conductive feature on the first surface of the die to a second electrically conductive feature on the second surface of the die. The bond wire couples the second electrically conductive feature to a third electrically conductive feature on the first surface of the substrate. In this manner, flip chip bump interconnects and bond wires are available to interface signals of the die with the substrate. | 2009-09-24 |
20090236725 | Solder Preform and Electronic Component - An electronic component having a semiconductor element bonded to a substrate with solder has a decreased bonding strength if there is not a suitable clearance between the semiconductor element and the substrate. Therefore, a solder preform having high melting point metal particles dispersed in solder has been used in the manufacture of electronic components. However, when an electronic component was manufactured using a conventional solder preform, there were cases in which the semiconductor element leaned or the bonding strength was not adequate. | 2009-09-24 |
20090236726 | PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE - A semiconductor package that includes a substrate having first and second major surfaces is presented. The package includes a plurality of landing pads and a semiconductor die disposed on the first major surface. A molded cap is disposed on the first surface to encapsulate the die and substrate. The landing pads are covered when the cap is molded. Package interconnects are coupled to the landing pads. The package interconnects are exposed by the cap to facilitate package stacking. | 2009-09-24 |
20090236727 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate is provided. The wiring substrate includes a multilayer wiring structure and a stiffener. The multilayer wiring structure includes: a plurality of insulating layers; a plurality of wiring patterns; and a plurality of chip mounting pads which are electrically connected to the wiring patterns and on which a semiconductor chip is flip-chip mounted. The stiffener is provided on a portion of the multilayer wiring structure, which is outside of a mounting area on which the semiconductor chip is flip-chip mounted. A thermal expansion coefficient of the stiffener is substantially equal to that of the semiconductor chip. | 2009-09-24 |
20090236728 | Semiconductor device - A semiconductor device includes a header, a semiconductor chip fixed to the header constituting a MOSFET, and a sealing body of insulating resin which covers the semiconductor chip, the header and the like, and further includes a drain lead contiguously formed with the header and projects from one side surface of the sealing body, and a source lead and a gate lead which project in parallel from one side surface of the sealing body, and wires which are positioned in the inside of the sealing body and connect electrodes on an upper surface of the semiconductor chip and the source lead and the gate lead, with a gate electrode pad arranged at a position from the gate lead and the source lead farther than a source electrode pad. | 2009-09-24 |
20090236729 | MELTING TEMPERATURE ADJUSTABLE METAL THERMAL INTERFACE MATERIALS AND PACKAGED SEMICONDUCTORS INCLUDING THEREOF - A melting temperature adjustable metal thermal interface material (TIM) and a packaged semiconductor including thereof are provided. The metal TIM includes about 20-98 wt % of In, about 0.03-4 wt % of Ga, and at least one element of Bi, Sn, Ag and Zn. The metal TIM has an initial melting temperature between about 60-144° C. | 2009-09-24 |
20090236730 | Die substrate with reinforcement structure - Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate. | 2009-09-24 |
20090236731 | STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM - A stackable integrated circuit package system including mounting an integrated circuit device over a package carrier, mounting a stiffener over the package carrier and mounting a mountable package carrier over the stiffener with a vertical gap between the integrated circuit device and the mountable package carrier. | 2009-09-24 |
20090236732 | THERMALLY-ENHANCED MULTI-HOLE SEMICONDUCTOR PACKAGE - A thermal-enhanced multi-hole semiconductor package is revealed, primarily comprising a substrate with a plurality of alignment holes, a chip disposed on the substrate, an internal heat sink attached to the chip, and an encapsulant. The internal hear sink has a plurality of alignment bars and a heat dissipation surface. The alignment bars are inserted into the alignment holes, but not fully occupying the alignment holes to provide a plurality of flowing channels therein. The encapsulant completely encapsulates the alignment bars through filling the flowing channels. Therefore, the internal heat sink can be aligned to the substrate and is integrally connected with the chip and the substrate utilizing a small amount of adhesive or without any adhesive to form a composite having high rigidity and strong adhesion. | 2009-09-24 |
20090236733 | BALL GRID ARRAY PACKAGE SYSTEM - A ball grid array package system comprising: forming a package base including: fabricating a heat spreader having an access port, attaching an integrated circuit die to the heat spreader, mounting a substrate around the integrated circuit die, and coupling an electrical interconnect between the integrated circuit die and the substrate; and coupling a second integrated circuit package to the substrate through the access port. | 2009-09-24 |
20090236734 | Semiconductor Device With Cross-Talk Isolation Using M-CAP and Method Thereof - A semiconductor device is made by forming an oxide layer over a substrate and forming a first conductive layer over the oxide layer. The first conductive layer is connected to ground. A second conductive layer is formed over the first conductive layer as a plurality of segments. A third conductive layer is formed over the second conductive layer as a plurality of segments. If the conductive layers are electrically isolated, then a conductive via is formed through these layers. A first segment of the third conductive layer operates as a first passive circuit element. A second segment operates as a second passive circuit element. A third segment is connected to ground and operates as a shield disposed between the first and second segments. The shield has a height at least equal to a height of the passive circuit elements to block cross-talk between the passive circuit elements. | 2009-09-24 |
20090236735 | UPGRADEABLE AND REPAIRABLE SEMICONDUCTOR PACKAGES AND METHODS - A semiconductor device package includes a carrier, one or more semiconductor devices on the carrier, and a redistribution element above the uppermost of the one or more semiconductor devices. The redistribution element includes an array of contact pads that communicate with each semiconductor device of the package. The package may also include an encapsulant through which the contact pads of the redistribution element are at least electrically exposed. Methods for assembling and packaging semiconductor devices, as well as methods for assembling multiple packages, including methods for replacing the functionality of one or more defective semiconductor devices of a package according to embodiments of the present invention, are also disclosed. | 2009-09-24 |
20090236736 | MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING MICROELECTRONIC DEVICES - Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate with the through holes arranged in arrays, and attaching a plurality of singulated microelectronic dies to the substrate with an active side of the individual dies facing toward the substrate and with a plurality of terminals on the active side of the individual dies aligned with corresponding holes in the substrate. The singulated dies are attached to the substrate after forming the holes in the substrate. | 2009-09-24 |
20090236737 | RF TRANSISTOR OUTPUT IMPEDANCE TECHNIQUE FOR IMPROVED EFFICIENCY, OUTPUT POWER, AND BANDWIDTH - An RF/microwave circuit is configured to eliminate the physical constraint that requires a sacrifice of one output series inductor wirebond for each shunt inductor wirebond. The circuit employs a multi-level metalized substrate as part of its output impedance matching network. The lower level of the multi-level substrate serves as an intermediate connection point for the output series inductor wirebonds as it extends from the output terminal of an active device to an output metallization pad. The upper level of the multi-level substrate serves to support a DC block capacitor and as an intermediate connection point for the shunt inductor wirebonds. The multi-level substrate allows the series inductor wirebonds to be positioned at a lower height, and the shunt inductor wirebonds at a greater height. Because they are at different heights, the physical constraint of sacrificing a series wirebond per a shunt inductor wirebond can be eliminated. This leads to improved power efficiency, higher gain, and greater bandwidth. | 2009-09-24 |
20090236738 | Semiconductor Device and Method of Forming Oxide Layer on Signal Traces for Electrical Isolation in Fine Pitch Bonding - A semiconductor device has a semiconductor die with a solder bump formed on its surface. A contact pad is formed on a substrate. A signal trace is formed on the substrate. The pitch between the contact pad and signal trace is less than 150 micrometers. An electroless surface treatment is formed over the contact pad. The electroless surface treatment can include tin, ENIG, or OSP. A film layer is formed over the contact pad with an opening over the signal trace. An oxide layer is formed over the signal trace. The film layer and surface treatment prevent formation of the oxide layer over the contact pad. The film layer is removed. The solder bump is reflowed to metallurgically and electrically bond to the contact pad. In the event that the solder bump physically contacts the oxide layer, the oxide layer maintains electrical isolation between the solder bump and signal trace. | 2009-09-24 |
20090236739 | SEMICONDUCTOR PACKAGE HAVING SUBSTRATE ID CODE AND ITS FABRICATING METHOD - A semiconductor package with a substrate ID code and its manufacturing method are revealed. A circuit and a solder mask are formed on the bottom surface of a substrate where the solder mask covers most of the circuit and a circuit-free zone of the substrate. A chip is disposed on the top surface of the substrate. A substrate ID code consisting of a plurality of laser marks is inscribed in the solder mask or in a portion of an encapsulant on the bottom surface away from the circuit to show the substrate lot number on the bottom surface. Therefore, quality control and failure tracking and management can easily be implemented by tracking the substrate ID code from the semiconductor package without changing the appearance of the semiconductor package. Furthermore, the substrate ID code can be implemented by the existing laser imprinting machines for semiconductor packaging processes and be formed at the same time of formation of a product code. The complexity of the semiconductor packaging processes is not increased and the circuits of the substrates are not easily damaged. | 2009-09-24 |
20090236740 | Window ball grid array package - A WBGA (window ball grid array) semiconductor package includes a substrate having a slot as a window for a chip. The slot has four straight sections and four rounded corners respectively interconnecting adjacent two straight sides. Each rounded corner has a radius satisfying the minimum distance between the pads and the slot according to the design rule so as to increase the pad pitch in the chip. The plain area increased due to the pad pitch is suitable for ESD circuit or capacitors layout. | 2009-09-24 |
20090236741 | CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME - A conductive structure of a chip and a method for manufacturing the conductive structure are provided. An under bump metal (UBM) is formed on the redistribution layer (RDL) by performing an electroless plating process. Subsequently, the solder bump is formed on the under bump metal for electrical connection. Thus, the photomask can be economized and the cost of manufacturing can be reduced. | 2009-09-24 |
20090236742 | WIRE BONDING OVER ACTIVE CIRCUITS - A semiconductor device includes a semiconductor die mounted over a package substrate. The die has a bond pad located thereover. A stud bump consisting substantially of a first metal is located on the bond pad. A wire consisting substantially of a different second metal is bonded to the stud bump. | 2009-09-24 |
20090236743 | Programmable Resistive RAM and Manufacturing Method - Programmable resistive RAM cells have a resistance that depends on the size of the contacts. Manufacturing methods and integrated circuits for lowered contact resistance are disclosed that have contacts of reduced size. | 2009-09-24 |
20090236744 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME - A semiconductor device having a copper interconnection with high electromigration resistance is provided. A semiconductor device of the present invention includes an interconnection layer formed by forming a groove or a hole in an insulating film formed on a substrate, forming a barrier layer on the resulting substrate, forming a copper seed layer on the barrier layer, forming a copper-plated layer by an electrolytic plating method by use of this copper seed layer, and removing the copper-plated layer and the copper seed layer on the surface, wherein the copper seed layer comprises a plurality of layers including a small grain layer and a large grain layer, having different crystal grain sizes from each other, and the small grain layer is in contact with the barrier layer. | 2009-09-24 |
20090236745 | Adhesion to Copper and Copper Electromigration Resistance - The present invention relates to the improved adhesion between a patterned conductive metal layer, usually a copper layer, and a patterned barrier dielectric layer. The structure with the improved adhesion comprises an adhesion layer between a patterned barrier dielectric layer and a patterned conductive metal layer. The adhesion layer improves adhesion between the metal layer and the barrier layer without increasing the copper bulk electrical resistance. The method of making the structure with the improved adhesion comprises steps of thermal expositing the patterned conductive metal layer to an organometallic precursor to deposit an adhesion layer at least on the top of the patterned conductive metal layer. | 2009-09-24 |
20090236746 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A semiconductor device includes a contact plug electrically connected to a semiconductor substrate; a first barrier metal film with a columnar crystal structure arranged in contact with the semiconductor substrate at least on a bottom surface side of the contact plug; an amorphous film made of a material of the first barrier metal film arranged in contact with the first barrier metal film at least on the bottom surface side of the contact plug; a second barrier metal film made of a material identical to that of the first barrier metal film and having a columnar crystal structure, at least a portion of which is arranged in contact with the amorphous film on the bottom surface side and a side surface side of the contact plug; and a dielectric film arranged on the side surface side of the contact plug. | 2009-09-24 |
20090236747 | Semiconductor device and method for fabricating the same - A multilevel interconnect structure in a semiconductor device comprises a first insulating layer ( | 2009-09-24 |
20090236748 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A semiconductor device may include the following. A diffusion barrier formed over a semiconductor substrate having a conductive layer. An etching stop layer formed over a diffusion barrier. Inter-metal dielectric (IMD) layers (e.g. having via holes formed over an etching stop layer and trenches wider than the via holes). Metal interconnections that fill via holes and trenches. Via holes in IMD layers may pass through a diffusion barrier and an etching stop layer to connect to a conductive layer in a semiconductor substrate. | 2009-09-24 |
20090236749 | ELECTRONIC DEVICE AND MANUFACTURING THEREOF - One aspect is a method including providing a carrier having a first conducting layer, a first insulating layer over the first conducting layer, and at least one through-connection from a first face of the first insulating layer to a second face of the first insulating layer; attaching at least two semiconductor chips to the carrier; applying a second insulating layer over the carrier; opening the second insulating layer until the carrier is exposed; depositing a metal layer over the opened second insulating layer; and separating the at least two semiconductor chips after depositing the metal layer. | 2009-09-24 |
20090236750 | Package structure in which coreless substrate has direct electrical connections to semiconductor chip and manufacturing method thereof - A package structure in which a coreless substrate has direct electrical connections to a semiconductor chip and a manufacturing method thereof are disclosed. The method includes the following steps: providing a metal carrier board having a cavity; placing a chip having a plurality of electrode pads on an active surface in the cavity of a board; filling the cavity with an adhesive for fixing the chip; forming a solder mask on the active surface of the chip and the surface of the metal carrier board at the same side, wherein the solder mask has a plurality of openings to expose the electrode pads of the chip; forming a built-up structure on the solder mask and the exposed active surface of the chip in the openings; and removing the metal carrier board. In this method the metal carrier board can support the built-up structure to thereby avoid warpage. | 2009-09-24 |
20090236751 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SUPPORT STRUCTURE FOR DIE OVERHANG - An integrated circuit package system including: providing a substrate having a support mounted thereover; mounting an integrated circuit die above the substrate; mounting a wire-bonded die offset above the integrated circuit die creating an overhang supported by the support; connecting the wire-bonded die to the substrate with bond wires; and encapsulating the integrated circuit die, the wire-bonded die and the bond wires with an encapsulation. | 2009-09-24 |
20090236752 | PACKAGE-ON-PACKAGE SYSTEM WITH VIA Z-INTERCONNECTIONS - A package-on-package system includes: providing an interposer substrate; mounting a base substrate under the interposer substrate and having a first integrated circuit die connected thereto; forming an encapsulant between the interposer substrate and the base substrate, the encapsulant encapsulating the first integrated circuit die; and forming a via z-interconnection extending through the encapsulant and one of the substrates to the other of the substrates. | 2009-09-24 |
20090236753 | INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES - An integrated circuit package system includes: providing a lower interposer substrate with lower exposed conductors; attaching a die over the lower interposer substrate; applying a stack encapsulant over the die and the lower interposer substrate having the lower exposed conductors partially exposed adjacent the stack encapsulant; and attaching an upper interposer substrate having upper exposed conductors over the stack encapsulant and with the upper exposed conductors substantially exposed. | 2009-09-24 |
20090236754 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH STACKING MODULE - An integrated circuit package system includes: providing a module substrate having dimension predetermined for attachment adjacent a device; attaching a module die adjacent the module substrate; and applying a module molding material cantilevered from the module substrate and over the module die. | 2009-09-24 |
20090236755 | CHIP PACKAGE STRUCTURE - A chip package structure is provided. The chip package structure comprises a first substrate, a second substrate and a plurality of chips. Therein, one of the chips is connected to the first substrate and electrically connected to the first substrate through a via hole of the first substrate. Thereby, the second substrate does not need the via hole for electrical connection of chips and thus, the surface thereof is adapted to remain intact to allow for the disposition of conductive balls throughout the surface. | 2009-09-24 |
20090236756 | FLIP CHIP INTERCONNECTION SYSTEM - A flip chip interconnection system includes: providing a conductive lead coated with a protective coating; forming a groove through the protective coating to the conductive lead for controlling solder position on a portion of the conductive lead; and attaching a flip chip having a solderable conductive interconnect to the portion of the conductive lead. | 2009-09-24 |
20090236757 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING - A semiconductor device and method for manufacturing. One embodiment includes a carrier, a structured layer arranged over the carrier and a semiconductor chip applied to the structured layer. The structured layer includes a first structure made of an elastic material and a second structure made of an adhesive material. | 2009-09-24 |
20090236758 | SEMICONDUCTOR MODULE - A semiconductor module has a plurality of semiconductor devices arranged on a substrate and mutually connected by signal bus wiring lines. Each pair of first semiconductor devices are connected to each other by the signal bus wiring lines, skipping a second semiconductor device located between the pair of first semiconductor devices. | 2009-09-24 |
20090236759 | CURABLE SILICONE RUBBER COMPOSITION AND SEMICONDUCTOR DEVICE - A curable silicone rubber composition, comprising: (A) an organopolysiloxane containing two or more alkenyl groups within each molecule, (B) an organohydrogenpolysiloxane having two or more hydrogen atoms bonded to silicon atoms within each molecule, (C) a metal-based condensation reaction catalyst, (D) a platinum group metal-based addition reaction catalyst, and (E) an adhesion-imparting agent, wherein among the refractive indices of component (A), a mixture of component (A) and component (B), and component (E), the difference between the maximum refractive index and the minimum refractive index is not more than 0.03. | 2009-09-24 |
20090236760 | SUBSTRATE FOR A DISPLAY PANEL, AND A DISPLAY PANEL HAVING THE SAME - A substrate for a display panel includes an alignment accuracy measurement mark which is used for measuring alignment accuracy between patterns on the substrate without decreasing an aperture ratio of a pixel. The substrate for a display panel includes the alignment accuracy measurement mark in an isolated configuration which is used for measuring alignment accuracy between a pattern of a gate signal line and an auxiliary capacitance line and a pattern of a source signal line and a drain line, where the alignment accuracy measurement mark has a shape such that at least one straight line portion is included, is formed in a layer where the pattern of the source signal line and the drain line is formed, and is positioned on the gate signal line. | 2009-09-24 |
20090236761 | INTEGRATED CROSS-FLOW RESERVOIR - A cross-flow reservoir has a uniquely integrated filter and heat exchanger, whereby the reservoir, filtration and cooling functions are all performed by a single unit and without connecting fittings and connecting hoses therebetween. | 2009-09-24 |
20090236762 | METHOD AND APPARATUS FOR HUMIDIFYING GAS AND FOR CONDENSING STEAM ON CONDENSATION NUCLET - For the reliable condensation of steam on condensation nuclei in an aerosol flow and therefore for enlarging the particles in the aerosol, the invention provides a method which is characterized in that condensation nuclei are passed through an inner area of an evaporating zone forming a flow area, the liquid to be evaporated is contacted with the flow area and evaporated therein and the thus produced steam is condensed on the condensation nuclei. The invention also provides an apparatus for condensing steam on condensation nuclei with an inlet for condensation nuclei and an evaporating zone constructed in such a way that a flow area for the condensation nuclei has a heated liquid duct open thereto and that a condensation flue is connected to the flow area. The invention also provides methods and apparatuses for counting particles, for producing monodisperse aerosols using the aforementioned method or the aforementioned apparatus. | 2009-09-24 |
20090236763 | Resin transfer molding to toughen composite beam keys - Method of manufacturing composite wheel beam key by: forming entirely from carbon fiber precursors or from carbon fiber precursors and ceramic materials a fibrous preform blank in a shape of a desired wheel beam key, wherein the fiber volume fraction of the preform blank is at least 50%; carbonizing the carbon fiber precursors; rigidifying the carbonized preform blank by subjecting it to at least one cycle of CVD; grinding the surface of the preform blank to open pores on its surface; and subjecting the open-pored preform blank to RTM processing with pitch. Also, carbon-carbon composite or carbon-ceramic composite wheel beam key produced by this process, having a density of from 1.5 g/cc to 2.1 g/cc and a maximum internal porosity of 10% or less. | 2009-09-24 |
20090236764 | Sacrificial Anodes in Concrete Patch Repair - High performance proprietary cementitious concretes or mortars developed for use as patch repair materials for corrosion damaged concrete often have high resistivities that inhibit the performance of sacrificial anodes located within the patch repair areas. A method of repair is disclosed which comprises removing the corrosion damaged concrete to form a cavity to receive a concrete repair material and forming within this cavity a smaller distinct cavity for assembling a sacrificial anode assembly and placing within this second cavity a pliable viscous ionically conductive backfill and a sacrificial anode and an activating agent to form a sacrificial anode assembly and connecting the anode to the steel and covering the anode and the backfill in the second cavity with a repair material to restore the profile of the concrete structure. In this arrangement a high resistivity repair material promotes the flow of protection current to steel in adjacent contaminated concrete that is at risk of corrosion. | 2009-09-24 |
20090236765 | Three layer composite panel from recycled polyurethanes - A process for the manufacture of a three layer composite panel with improved moisture resistance, minimal thickness swell, thermal stability, and a smooth hard surface suitable for direct lamination. The composite panel is produced utilizing recycled polyurethanes, preferably obtained from vehicle headliners, insulated foam panels, foam insulation, energy absorbent panels, and polyisocyanurate foams along with materials incidental to at least one recycled component including composite resins, cloth, adhesives, fiberglass, and plastics. The composite panel is composed of a core layer pressed between two surface layers. | 2009-09-24 |
20090236766 | BLEND OF PLASTICS WITH WOOD PARTICLES - According to the invention blends of wood particles and plant particles and plastic are generated in an extruder thereby that the plastic is converted separately into a liquid melt before the joining takes place. | 2009-09-24 |
20090236767 | METHOD OF FEEDING MOLTEN RESIN AND APPARATUS FOR FEEDING MOLTEN RESIN - An apparatus for feeding a molten resin is operated for extended periods of time maintaining stability without permitting volatile components of the molten resin to adhere on the surfaces of conveyer means. An extruder in the apparatus for feeding the molten resin to the compression-forming machine has an extrusion unit which discharges a molten resin through an extrusion opening of an extrusion nozzle. An air injection nozzle for injecting the cooling gas is provided along the outer circumference of the extrusion nozzle, and the cooling gas is blown onto the surface of the molten resin extruded from the extrusion opening to cool the surface of the molten resin. | 2009-09-24 |
20090236768 | FIBERGLASS LAWN EDGING - A system of fiberglass lawn edging materials. The pultruded fiberglass system provides a lawn edging that is durable and easy to install. The fiberglass edging material comes in a long, flat shape that can be rolled up for ease of display and transport. The system includes metal or pultruded fiberglass stakes. The system includes a integral veil that allows for a variety of surface treatments. | 2009-09-24 |
20090236769 | INJECTION MOLD AND METHOD FOR MAKING A HOUSING USING THE INJECTION MOLD - An injection mold ( | 2009-09-24 |
20090236770 | METHOD OF MANUFACTURING REINFORCED MEDICAL TUBING - Methods for manufacturing reinforced tubing suitable for medical device applications are disclosed. An inner layer is molded around a core to define an inner surface adjacent to the core and an outer surface opposite the inner surface. The outer surface includes one or more recessed pathways defined therein. A reinforcement member is then formed in each of the one or more recessed pathways of the molded inner layer. An outer layer including an inner surface and an outer surface is subsequently molded over the inner layer and the reinforcement member. The inner surface of the outer layer substantially conforms to the outer surface of the inner layer and the reinforcement member. The core is then removed from within the inner layer to provide a lumen through the inner layer. | 2009-09-24 |
20090236771 | METHODS FOR MAKING COMPONENTS HAVING IMPROVED EROSION RESISTANCE - Methods for making components having improved erosion resistance including providing a component having a surface, applying at least one layer of an erosion system to at least a portion of the surface of the component, each layer of the erosion system containing a support, and a toughened resin applied to the support, and co-molding the component having the applied erosion system to produce a coated component having from about a 50% increase to about a 400% increase in erosion resistance per layer of the erosion system. | 2009-09-24 |
20090236772 | PATTERN TRANSFER MOLD AND PATTERN TRANSFER METHOD - A pattern transfer mold is suitable for transferring at least one decorative pattern of a film to at least one workpiece. The pattern transfer mold includes a mold base and a mold core. The mold base has a mold cavity and an air vent associated with the mold cavity. The mold core is inserted in the mold cavity of the mold base and has an upper surface and a plurality of upper air grooves on the upper surface. The mold cavity and the mold core have a plurality of mold air channels located between the mold cavity and the mold core. The upper air grooves are associated with the air vent via the mold air channels. | 2009-09-24 |
20090236773 | Manufacture of Inflatable Member for Bifurcation Catheter Assembly - A catheter inflatable member forming mold can include first and second frames that mate to define a mold cavity, the mold cavity defining a main cavity portion and a bulge cavity portion, the mold cavity being sized to receive an elongated tube member therein. The mold can also include a pin member with a head portion positioned in the mold cavity, the pin member extending into the mold cavity, the head portion of the pin member being moveable in a first direction to contact and move the tube member towards the bulge cavity portion of the mold cavity during molding. | 2009-09-24 |
20090236774 | Melt Distribution Apparatus for Use in a Hot Runner and a Related Method for a Balancing of Melt Flow - Disclosed, amongst other things, is a melt distribution apparatus of a hot runner and a related method for balancing melt flow to a plurality of drops. The melt distribution apparatus includes a plurality of chokes with each choke of the plurality of chokes being associated with a corresponding one of a drop of a plurality of drops. Each choke of the plurality of chokes being configured to contribute, during an injection of a molding material therethrough, a choke melt-pressure loss such that the plurality of chokes contribute an aggregate choke melt-pressure loss that is generally between 10% and 75% of an aggregate hot runner melt-pressure loss. | 2009-09-24 |
20090236775 | COPOLYAMIDE POWDER AND ITS PREPARATION, USE OF COPOLYAMIDE POWDER IN A SHAPING PROCESS AND MOULDINGS PRODUCED FROM THIS COPOLYAMIDE POWDER - A task often encountered in very recent times is the rapid provision of prototypes. Particularly suitable processes are those based on pulverulent materials and in which the desired structures are produced layer-by-layer through selective melting and solidification. The invention provides the constitution, production and use of a copolyamide powder which was produced using the following monomer units: a) laurolactam or ω-aminoundecanoic acid, and also b) dodecanedioic acid, and either c) decanediamine or dodecanediamine, in shaping processes, and also to mouldings produced through a layer-by-layer process which selectively melts regions of a powder layer, using this specific powder. Once the regions previously melted layer-by-layer have been cooled and solidified, the moulding can be removed from the powder bed. The mouldless layer-by-layer processes for the production of components using the copolyamide powder result in simplified and more reliable conduct of the process and better recyclability. | 2009-09-24 |
20090236776 | PROCESS FOR MAKING A STRETCH-BLOW MOULDED CONTAINER HAVING AN INTEGRALLY MOULDED HANDLE - The present invention relates to a process for making a container having an integral handle, comprising the steps of:
| 2009-09-24 |
20090236777 | Method for Manufacturing Bicycle Crank - A method for making a crank of a bicycle includes preparing a prepreg material and a bladder, heat-pressing the prepreg material and the bladder, cutting the prepreg material and the bladder to form two engaging sections to engage with two connectors, wrapping a carbon-fiber cloth, and heating the prepreg material and first and second connectors that is wrapped by the carbon-fiber cloth. | 2009-09-24 |
20090236778 | METHOD AND SYSTEM FOR LAYERWISE PRODUCTION OF A TANGIBLE OBJECT - A method cycle of a method for layerwise production of a tangible object ( | 2009-09-24 |
20090236779 | Apparatus and Method for Making a Tubular Composite Barrel - A 360° tool for making a one-piece composite tubular structure, such as a skin of an acoustic liner, is adjustable between a molding position and a non-molding position. The tool includes a base, a fixed segment mounted to the base, first and second doors hingedly connected on either side of the fixed sector, and third door hingedly connected to the second door. The third door has a circumferential extent that is less than one-fourth that of either the first or second door. Sealing members are provided between the doors. Collectively, the fixed sector, and the first, second and third doors have a predetermined shaped surface that corresponds to a portion of the contour of the tubular structure to be formed. After composite material is applied on the outer surfaces of the fixed sector and the doors, a vacuum bag is formed to surround the composite material and also the joint areas on the inner surface of the tool. The entire tool may be placed in an autoclave for curing. The tool may also be used for the layup and bonding of an acoustic core sandwiched between pre-cured skins. | 2009-09-24 |
20090236780 | Size for production of a bn-containing coating, method for production thereof, coated body production and use thereof - The invention relates to a water-containing slip for producing a BN-containing coating on a substrate, which comprises, based on the solids content of the slip,
| 2009-09-24 |
20090236781 | Lockable Piston-Cylinder Unit - A lockable piston-cylinder unit includes a cylinder having at least one axially facing counterstop; a piston dividing the cylinder into a first working chamber and a second working chamber; a piston rod extending through the first working chamber to a free end outside the cylinder; and a fastening tube having a first end in which the free end of the piston rod is fixed, a second end which receives the cylinder coaxially, and at least one axially facing supporting stop. When the piston rod is extended to maximum extension, the fastening tube is rotatable relative to the cylinder from a release position, wherein the supporting stop is offset from a respective counterstop, to a locking position, wherein the supporting stop faces the counterstop so that the fastening tube cannot move axially relative to the cylinder. | 2009-09-24 |
20090236782 | ONE-PIECE DOUBLE BALANCE SPRING AND METHOD OF MANUFACTURING THE SAME - The invention relates to a double balance spring ( | 2009-09-24 |
20090236783 | Gas Spring - A gas spring includes a center longitudinal axis and a closed first end, a cylinder filled with gas under pressure, a piston displaceably arranged in the cylinder and dividing the cylinder into a first work chamber near the closed end and a second work chamber remote of the closed end, a piston rod passing through the second work chamber and guided out of the cylinder through a guiding and sealing device, and a mechanical blocking device whose action depends upon the internal pressure. The piston has a piston chamber connected to the outside of the cylinder. A first safety element and a second safety element form the mechanical blocking device. The first safety element connects the first work chamber to the outside via the piston chamber when the pressure in the cylinder is too low and brings the second safety element into contact with the inner wall of the cylinder. | 2009-09-24 |
20090236784 | Portable Vise - A portable vise, particularly for use in supporting elongated member, provides a convenient design for safely cutting, drilling, welding, and painting. An elongated member is inserted through an aperture of a vise body. The vise rests upon the ground or other work surface such that one end of the elongated member is supported over the work surface while the other end of the elongated member rests upon the work surface. | 2009-09-24 |
20090236785 | PIN CLAMP ACCESSORIES - The present disclosure provides a pin clamp having first, second and third pins, a finger and stripper assembly. The first pin moves in response to an actuation. At least one finger is positioned adjacent the first pin, and is movable between clamped and unclamped positions. The second pin is located adjacent the first pin and is in operable communication with the finger. The stripper assembly comprises the third pin that is selectively engagable with the second pin, and an actuator that moves the third pin. The first activation of the actuator moves the third pin causing it to engage the second pin causing it to move the finger to the clamped position. The second actuation of the actuator moves the third pin causing it to disengage from the second pin causing it to not move the finger to the clamped position. | 2009-09-24 |
20090236786 | HAND HAVING ROCKING MECHANISM AND SUBSTRATE DELIVERING DEVICE HAVING THE SAME | 2009-09-24 |
20090236787 | Workpiece clamping fixture - The clamping fixture ( | 2009-09-24 |
20090236788 | PAPER SHEET ACCUMULATING/FEEDING APPARATUS - A paper sheet accumulating/feeding apparatus to execute an accumulating processing, in which paper sheets conveyed by a conveyance unit are accumulated in an accumulating unit in a direction of accumulation, and a feeding processing, in which paper sheets accumulated in the accumulating unit are fed to the conveyance unit, comprising a rotating member including one or more pieces, which spread radially from an axis thereof, the rotating member being provided in the vicinity of a connection between the conveyance unit and the accumulating unit to enable the piece or pieces to slap and move a paper sheet in the accumulating unit in the direction of accumulation at the time of accumulating processing, and a guide member provided to guide the piece or pieces to enable the same to be stored toward the axis of the rotating member, whereby the paper sheet accumulating/feeding apparatus is able to readily set the piece or pieces long and endures an operation over a long term and frequent operations. | 2009-09-24 |
20090236789 | SYSTEM FOR ALIGNING A SHEET FOR SIMULTANEOUS MODIFICATION OF A PLURALITY OF AREAS - A system and method are described for aligning a sheet for simultaneous modification of a plurality of areas of the sheet. The sheet may be received by an alignment device from a feeder. The alignment device may angularly align the sheet, which may cause the sheet to become flush to the alignment device. The alignment device may adjust the sheet to correct for an offset alignment which may cause the sheet to be aligned with the direction of travel of the sheet. The alignment device may also align the sheet with a plurality of print heads. A conveyor may then pass the sheet beneath the plurality of print heads. The plurality of print heads may simultaneously modify the plurality of areas of the sheet. | 2009-09-24 |
20090236790 | Sheet-feeding apparatus - A sheet-feeding apparatus having simple structure and capable of single-face/double-face scanning/printing sheets at high sheet-feeding efficiency. The sheet-feeding apparatus includes a sheet-feeding path in which sheets can pass through a scanning module and/or a printing module. The sheet-feeding path includes a first passage, a second passage communicating with the first passage and a subsidiary passage formed between the first and second passages. The sheets are selectively fed into and delivered through the first passage, the second passage or the subsidiary passage to be single-face/double-face scanned/printed. | 2009-09-24 |
20090236791 | RECORDING MEDIUM FEEDING DEVICE AND RECORDING APPARATUS - A recording medium feeding device includes a recording medium cassette that is detachable from a main body and a recording medium retracting unit that retracts a recording medium lying on a recording medium feeding path back to the recording medium cassette. The recording medium cassette includes a lower tray that accommodates a recording medium, and an upper tray that accommodates a recording medium and is provided to be slidable with respect to the lower tray along a transport direction of the recording medium. The recording medium feeding device is provided with a unit for performing a retracting operation of the recording medium using the recording medium retracting unit in accordance with sliding of the upper tray in the transport direction. | 2009-09-24 |
20090236792 | System of opposing alternate higher speed sheet feeding from the same sheet stack - In a printing system in which the print media sheets are alternately fed from the same stack in the same tray by two sheet feeders at opposite sides into different sheet paths, at least one of the sheet feeders is repositionable towards and away from the other for feeding different size sheets, and the connecting sheet path is repositionable with the repositioning of the sheet feeder. The repositioning of the sheet feeder and its associated sheet path may be automatic in coordination with the normal resetting of a tray stack edge guide with the loading of different size sheets into the tray. The enhanced rate sheet feeding may be for a dual print engine printing system and/or selectably common or reversed sheet facing. Alternating coordinated lifting of a nudger roll of one sheet feeder with operation of the opposing sheet feeder, and retard nips spaced from the stack, may be provided. | 2009-09-24 |
20090236793 | Sheet feeder for feeding printed sheets to a conveying device - A sheet feeder for feeding printed sheets to a conveying device, with a gripper drum that has at least one gripper for removing the printed sheets one at a time from a stack; a pocket is permanently mounted essentially in the peripheral area of the gripper drum wherein the printed sheets are aligned against a stop with the fold forward and set down on the conveying device with reversal of direction; and with a decelerating device for slowing the speed of the printed sheets downstream towards the stop. The decelerating device has at least one secondary stop, which rotates in the same direction as the gripper drum, has a slower speed than the gripper drum for slowing down the printed sheets, and on which the printed sheets are slowed down upstream of the stop. | 2009-09-24 |
20090236794 | SHEET FEED DEVICE AND IMAGE FORMING APPARATUS - A sheet feed device includes an air flow generating part that generates an air flow for floating a sheet; a feed member that feeds a sheet by rotating, while applying a load to the top one of sheets stacked; and a transport condition sensing unit that is positioned not to obstruct an air flow generated by the air flow generating part and senses a transport condition of a sheet fed by the feed member. | 2009-09-24 |
20090236795 | SHEET FEEDING APPARATUS, HOUSING INCORPORATING THE SAME AND IMAGE FORMING APPARATUS - A sheet feeding apparatus including a sheet tray for storing a plurality of sheets of paper, the sheet tray capable of being pulled out in a direction perpendicular to a sheet feed direction; a pair of side regulating members for regulating both lateral surfaces of the sheets, the regulating members being provided over the sheet tray and perpendicular to the sheet feed direction; a vacuum type belt to suck a sheet of paper from above and feed the sheets; and a moving mechanism for moving one of the belt and one of the regulating members that is provided on a back side in the direction of pulling out the sheet tray in the vertical directions, in such a way that, when the sheet tray is pulled out, the uppermost end of the regulating member is lower than the lowermost surface of the vacuum type belt. | 2009-09-24 |
20090236796 | EDGE REGULATING DEVICE, PRINTING MEDIUM CASSETTE, AND PRINTING APPARATUS - An edge regulating device that regulates edge of a printing medium by an edge guide includes a first holding unit that is able to hold the edge guide with a predetermined pitch along the direction of displacement of the edge guide and a second holding unit that is able to hold the edge guide with a pitch larger than the holding pitch by the first holding unit along the direction of displacement of the edge guide. | 2009-09-24 |
20090236797 | PAPER STACKING APPARATUS - A bottom surface of a stacking and accommodating portion is structured such as to be sloped to be lower in accordance with moving away from a paper carry-in side, and a push plate is controlled so as to be moved in a direction moving close to a carry-in port of the paper by detecting a stack paper width determined on the basis of a product of a stacked number count information of the papers and a thickness information per one paper, and the papers are accommodated. | 2009-09-24 |
20090236798 | SHEET PROCESSING DEVICE - In a sheet processing device in the form of an offset stacker, a sheet fence ( | 2009-09-24 |
20090236799 | IMAGE FORMING APPARATUS AND METHOD FOR CONTROLLING THE SAME - An image forming apparatus according to the present invention includes: a first sensor that is provided in a conveying path for a sheet and detects a first passage time of the sheet; a second sensor that is provided in a position different from a position of the first sensor in both a conveying direction of the sheet and a direction orthogonal to the conveying direction, and detects a second passage time of the sheet; a skew determining unit that calculates a skew amount of the sheet from a difference between the first passage time detected by the first sensor and the second passage time detected by the second sensor and determines occurrence of skew of the sheet on the basis of the skew amount; and a cause estimating unit that estimates, when the skew determining unit determines that the skew occurs, a cause of the occurrence of the skew. | 2009-09-24 |
20090236800 | Feed assist assembly - A media feedpath having a feed assist roller, comprises a media feedpath having a C-shaped portion, a media input and a feed roll nip, an input roller feeding media from the media input, a feed assist roller downstream of the C-shaped portion of the media feedpath, the feed assist roller assisting media indexing through the media feedpath on a single side and without an opposed pinch roller, the feed roll nip having a driven roller and a feed roll pinch roll opposite the driven roll, the feed assist roller being driven by a toggle gear transmission from the driven roller of the feed roll nip, the gear train adapted for toggling to operably engage or disengage the feed assist roller depending on a driving direction of the driven roller of the feed roll nip. | 2009-09-24 |
20090236801 | BUSINESS GAME APPARATUS - A business game apparatus based on Islamic values comprising a playing board ( | 2009-09-24 |
20090236802 | WORD GAME USING STYLIZED LETTERS THAT SHARE AT LEAST ONE COMMON SIDE - A word game in which a participant attempts to decipher a word formed from a plurality of stylized alphabet letters that share a common side. The alphabet letters are majuscule English language alphabet letters in a block style font formed of line segments on a square grid. A portion of the alphabet letters is assigned a first level of difficulty, another portion is assigned a second level of difficulty different than the first level of difficulty, and yet another portion may be assigned a third level of difficulty different than the first and the second levels of difficulty. A word score is determined by adding together the level of difficulty assigned to each of the alphabet letters. A word formed from the alphabet letters may be assigned a level of difficulty determined by the word score of the word and the number of letters in the word. | 2009-09-24 |
20090236803 | DEVICE FOR A GUESS-AND-MIND GAME - Device for a guess-and-mind game, comprising a holder ( | 2009-09-24 |
20090236804 | Playing Cards with Electronic Circuitry - A playing card for a game is constructed in layers and is electrically conductive through internal electronic circuitry. The electronic circuitry is electrically energized to generate an electrical signal that identifies suit and face value of the playing card. The electronic circuitry generates an electrical signal and sends it to an adjacent playing card in a deck. That card in turn appends its indicia to the signal and transmits the new signal to the next card in the deck and so on to the bottom card, thus, preserving the order of the cards. A dealing shoe, a cut-card and an image displaying card may be used in conjunction with the playing cards. | 2009-09-24 |
20090236805 | GAUGE GUARD FOR SANITARY PIPING SYSTEM - An elastomeric gasket for protecting the sensing diaphragm of a sanitary piping system pressure gauge, the gasket comprising a retaining cuff and first and second flat ring portions, the gauge flange being fittable between the cuff and the first flat ring portion, the second flat ring portion being axially spaced apart from the first flat ring portion, and a protective screen retained between the axially space apart flat rings. | 2009-09-24 |
20090236806 | Sealing element and sealing assembly for homokinetic joints - There is disclosed a sealing assembly including a sealing element and its placement in homokinetic joints. This sealing element is for sealing the outer joint part relative to a pipe or a hollow shaft. The sealing element is connected with the outer joint part which is connected with a sealing rolled bellows on the opposite side. In this case, the sealing element is configured as a closure lid provided with a pressed projection, and a set back piece on its outer circumference. This lid includes a cylindrical or turned over shape, and is disposed on the outer joint part of the homokinetic joint by way of the pressed projection and by means of secondary weld seams of a friction weld or magnetic arc weld that connects the outer joint part with a pipe. This connection is with a shape fit or a force fit whereby the closure lid in the set back partial piece is configured with a circumferential groove 16 as well as with planned breakage points. | 2009-09-24 |
20090236807 | METHODS AND APPARATUS FOR SUSPENDING VEHICLES - Embodiments of the invention generally relate to methods and apparatus for use in vehicle suspension. Particular embodiments of the invention relate to methods and apparatus useful for variable spring rate and/or variable damping rate vehicle suspension. In one embodiment, a shock absorber for a vehicle includes a gas spring having first and second gas chambers. The first chamber is utilized during a first travel portion of the shock absorber and the first and second chambers are both utilized during a second portion of travel. The shock absorber further includes a fluid isolated damper for regulating the speed of travel throughout both portions of travel. | 2009-09-24 |
20090236808 | APPARATUS FOR OPERATING ROLLER IMBEDDED IN A SHOE UP AND DOWN - An apparatus for operating a roller up and down is provided, which includes a main body fixed to a bottom of a shoe, an operating body to which the roller is imbedded, which is slidably mounted within the main body, and an operating assembly to move the operating body within the main body between an operating position and a non-operating position, wherein the roller protrudes out from the main body in the operating position while the roller is retracted into the main body in the non-operating position. A wearer of a shoe is capable of shifting the shoe between an operating position in which the roller protrudes out from the bottom of the shoe and a non-operating position in which the roller is retracted into the bottom of the shoe, by a simple operation. Accordingly, the shoe can be used as a roller shoe when the roller is in the operating position, and used as a general walking shoe for everyday use when the roller is in the non-operating position. As a result, the wearer can conveniently use a roller shoe as well as a walking shoe with one shoe. | 2009-09-24 |
20090236809 | DOLLY - The present invention provides a dolly ( | 2009-09-24 |
20090236810 | Wagon with removal bins - A wagon assembly for carrying items and materials typically used in lawn and garden care. The wagon assembly has a wheeled unitary body construction that forms a storage compartment. A storage bin can be placed inside the compartment or beneath and external the storage compartment. A lid is positionable over the storage compartment having recesses formed within the lid for holding of various items including a cushion, the recesses each having a drain to avoid the collection of water. A handle is provided by use of a flexible and detachable pull strap. The strap is adjustable in length and allows pulling of the wagon at most as well as hands free operation when desired. | 2009-09-24 |
20090236811 | Skateboard Riser with Integrated LED Light - A riser for a skateboard with an integrated LED light is disclosed. The riser is made of clear acrylic and attaches between the deck and the truck of the skateboard. The riser is battery powered and rechargeable. The LED emits light that travels through the riser and exits in almost all directions, thereby illuminating the space directly in front of and around the skateboard. | 2009-09-24 |
20090236812 | JOINT ARRANGEMENT FOR A VEHICLE - A joint arrangement for a vehicle is provided including a joint ( | 2009-09-24 |
20090236813 | System And Method For Adapting A Unit Bearing Front Driving Axle - A steering knuckle for adapting a unit bearing front axle of a vehicle using original equipment manufacturer (OEM) spindle and wheel hub assembly parts to replace the unit-bearing wheel assembly, wherein the steering knuckle comprises a first side of the steering knuckle that is configured to receive one or more components of the OEM spindle and wheel hub assembly. The steering knuckle includes a boring for receiving a spindle hub on an OEM spindle, and one or more apertures circumferentially spaced around the boring and for alignment with holes on a spindle flange of the OEM spindle. Studs are inserted through the apertures of the steering knuckle for securing the OEM spindle to the steering knuckle. A second side of the steering knuckle is configured to be affixed in pivoting relationship to an axle housing of the vehicle wherein the axle housing is originally manufactured to be linked to a unit-bearing steering knuckle. | 2009-09-24 |
20090236814 | VEHICLE MUD FLAP WITH WHEEL LINER ATTACHMENT TAB - A mud flap is provided with an integrally molded upstanding tab which captures a free edge of a wheel liner or similar wheel well-forming vehicle body element. The upstanding tab may be combined with OEM screw holes or clamping members to affix the mud flap to the vehicle wheel well. | 2009-09-24 |
20090236815 | Ride on device with integral fluid dispensing system - A ride on device such as a tricycle, big wheel, bicycle, three-wheeled bike or the like has an integral fluid dispensing system that enables the rider to disperse fluid into the atmosphere from a fluid reservoir formed internal to and within the frame of the ride on device through one or more spray nozzles. The spray nozzles are integral with the steering assembly of the ride on device and are predisposed to aim in cooperative with the direction of the steering assembly. An electric pump is utilized in cooperation with a power source to force the fluid from the internal fluid reservoir by actuation of a switch that is also disposed integral with the ride on device. | 2009-09-24 |
20090236816 | Skateboard street paddle - A street paddle which permits a rider of an associated skateboard or similar device to smoothly stroke and accelerate down the street using one's arms, hand and upper body, rather than using their foot to accelerate is disclosed. The street paddle is unique in that it allows a skateboard rider to pull and push their way on the street to accelerate, similar to an oarsman on the water, or a skier on snow, yet on the ground. A contact point, or footing, of the street paddle, where the paddle device comes in contact with the ground, connects to the bottom of an elongated shaft of the paddle. The footing comprises form and material that facilitates traction, when applied against a traveled surface, as well as shock dampening action to assist in smoothness and acceleration. As such the street paddle may also be used to decelerate the speed by dragging the footing on the ground in such a way that the friction of the contact slows the skateboard. | 2009-09-24 |
20090236817 | Bicycle Fork and Steering Tube - A combination bicycle fork and steering tube assembly is formed with a pair of downwardly directed, mutually converging end closure tabs that are bent over into abutment and welded together to define peripherally enclosed fork openings at the ends of the steerer tube. The upper ends of the hollow fork legs are configured to follow the surface contours of the lower end of the steerer tube and are welded to the end closure tabs about the circumferences of the enclosed fork openings at the lower end of the steering tube. The front wheel axle dropouts are formed directly in the lower ends of the fork legs, which include internal dropout support inserts. The dropout support inserts are sandwiched in between a pair of flat, mutually parallel dropout tabs defined directly in the lower ends of the fork legs. | 2009-09-24 |
20090236818 | BICYCLE WHEEL ASSEMBLY - A wheel assembly, which is particularly applicable to bicycles, includes a hub, a pair of laterally spaced bearings, and is constructed to cooperate with a frame of a bicycle. The bearings include an outer race that is directly engaged with the hub. An inner race of each bearing is constructed to directly receive a portion of the bicycle frame such that the wheel is supported by direct interaction of the bicycle frame and the bearing members. Optionally, a hollow axle may extend between adjacent bearings to further enhance the lateral stiffness of the wheel assembly. | 2009-09-24 |
20090236819 | Bicycle drop out - A bicycle drop out comprising a seat stay mount having a first receiving portion, a chain stay mount having a second receiving portion, a back plate releasably connected to the seat stay mount and the chain stay mount, the back plate comprising a first member for engaging the first receiving portion and a second member for engaging the second receiving portion, the back plate comprising a third slot for receiving an axle, the slot cooperatively disposed between the seat stay mount and the chain stay mount, and the seat stay mount and the chain stay mount having a gap therebetween for receiving a belt. | 2009-09-24 |
20090236820 | Motorcycle rear-wheels transmission and suspension system - A rear-wheels transmission and suspension system, adapted for modifying a two wheeled motorcycle into a motorcycle containing two rear wheels, includes a suspension device, a rear axle and a transmission device. The suspension device includes a supporting frame longitudinally extending along the central axis of a construction frame and pivotally connected with a seat portion of the construction frame of the motorcycle for supporting the rear axle at the rear end the supporting frame while defining a transmission cavity after a rear end of the supporting frame and at a central position behind an output of said engine along the central axis of the construction frame. Therefore the transmission device is able to be supported by the rear axle in the transmission cavity to transmit a rotation output from the engine to drive the rear axle to rotate for driving the rear wheels to rotate. | 2009-09-24 |
20090236821 | BOOM FOR RECUMBENT BICYCLE - A recumbent bicycle includes a boom that telescopes within one end of a center tube in the main frame of the bicycle, and a boom clamp that encircles the center tube of the main frame at a location overlying at least a portion of the boom. The boom clamp has a locator tab which extends into a notch formed in the center tube, and within a slot formed in the boom while the boom telescopes within the center tube. The location of the slot in the boom, and the location of the tab relative to the center tube, are chosen to ensure that throughout the telescoping movement of the boom it is retained in a desired orientation with respect to the main frame. | 2009-09-24 |