39th week of 2010 patent applcation highlights part 22 |
Patent application number | Title | Published |
20100244248 | NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME - A nonvolatile memory device, includes: a lower side electrode aligned in a first direction; an upper side electrode positioned above the lower side electrode and aligned in a second direction intersecting the first direction; and a memory unit provided between the lower side electrode and the upper side electrode. At least one selected from the lower side electrode and the upper side electrode includes a first electrode and a second electrode, the first electrode having a forward-tapered side wall, the second electrode having a reverse-tapered side wall and being adjacent to the first electrode via an insulating layer in substantially identical plane. | 2010-09-30 |
20100244249 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a semiconductor die attached to a support having electrically conductive paths, the semiconductor die having a bond-pad electrically connected to the electrically a conductive path on the support by a wire-bond of a first metallic composition, the wire-bond and the bond-pad being coated with a protection layer of a second metallic composition. | 2010-09-30 |
20100244250 | SEMICONDUCTOR INTEGRATED CIRCUIT, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE USING SEMICONDUCTOR INTEGRATED CIRCUIT - A step of forming a through hole in a semiconductor substrate, or a step of polishing the semiconductor substrate from its back surface requires a very long time and causes decrease of productivity. In addition, when semiconductor substrates are stacked, a semiconductor integrated circuit which is formed of the stack is thick and has poor mechanical flexibility. A release layer is formed over each of a plurality of substrates, layers each having a semiconductor element and an opening for forming a through wiring are formed over each of the release layers. Then, layers each having the semiconductor element are peeled off from the substrates, and then overlapped and stacked, a conductive layer is formed in the opening, and the through wiring is formed; thus, a semiconductor integrated circuit is formed. | 2010-09-30 |
20100244251 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a first semiconductor chip, an electrode pad formed in an upper surface portion of the first semiconductor chip, a second semiconductor chip formed on the first semiconductor chip, and a through-via formed in the second semiconductor chip. A hollowed portion is formed in the electrode pad, and a bottom portion of the through-via is embedded in the hollowed portion. | 2010-09-30 |
20100244252 | Self Forming Metal Fluoride Barriers for Fluorinated Low-K Dielectrics - A device and method of forming fluoride metal barriers at an interface of a fluorinated low-K dielectric and Cu or Cu alloy interconnects is disclosed. The fluoride metal barriers may prevent interconnects from reacting with the fluorinated low-K dielectric. The method may include depositing a thin film of metal or metal alloy on the fluorinated low-K dielectric. The thin film may include a metal or metal alloying element that reacts with free fluorine and/or fluorine compounds from the fluorinated low-K dielectric to form fluoride metal barriers. | 2010-09-30 |
20100244253 | COPPER LINE HAVING SELF-ASSEMBLED MONOLAYER FOR ULSI SEMICONDUCTOR DEVICES, AND A METHOD OF FORMING SAME - A copper line having self assembled monolayer for use in ULSI semiconductor devices and methods of making the same are presented. The copper line includes an interlayer dielectric, a self-assembled monolayer, catalytic particles on the monolayer, and a copper layer on the monolayer with the catalytic particles. The method includes the steps of forming an interlayer dielectric on a semiconductor substrate having a metal line forming region; forming a self-assembled monolayer on the metal line forming region; adsorbing catalytic particles on the self-assembled monolayer; forming using an electroless process a copper seed layer on the self-assembled monolayer having the catalytic particles adsorbed thereto; and forming a copper layer on the copper seed layer to fill in the metal line forming region. | 2010-09-30 |
20100244254 | Semiconductor device - A semiconductor device is disclosed, which includes a first interlayer insulating film, a lower-layer interconnection in a first groove in the first film, a second interlayer insulating film over the first film, having a normal via hole opening to the lower-layer interconnection, a normal plug in the normal hole, a third interlayer insulating film over the second film, having a second groove opening to the normal plug, an upper-layer interconnection in the second groove, and a first dummy plug in a first dummy via hole in the second film, the first dummy via hole opening to one of the lower-layer and upper-layer interconnections, wherein a short side of the first dummy plug is larger than a minimum width of a minimum width interconnection and smaller than a minimum diameter of a minimum diameter via hole and a long side is larger than a shortest length of a shortest length interconnection. | 2010-09-30 |
20100244255 | Wiring structures - A wiring structure includes a conductive pattern on a substrate, a first insulation layer pattern between adjacent conductive patterns and a second insulation layer pattern on the first insulation layer pattern. The first insulation layer pattern is separated from the conductive pattern by a first distance to provide a first air gap. The second insulation layer pattern is spaced apart from the conductive pattern by a second distance substantially smaller than the first distance to provide a second air gap. The wiring structure may have a reduced parasitic capacitance while simplifying processes for forming the wiring structure. | 2010-09-30 |
20100244256 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes an interlayer insulating film formed above a semiconductor substrate. The interlayer insulating film has a concave portion. A barrier metal layer is formed along a bottom and a sidewall of the concave portion. The barrier metal layer has a first portion provided along the sidewall of the concave portion and a second portion provided along the bottom of the concave portion. A metal wiring layer is formed in the concave portion via the barrier metal layer. The first portion of the barrier metal layer is composed of a titanium nitride layer whose titanium content is more than 50 at %, and the second portion of the barrier metal layer is composed of a titanium nitride layer whose titanium content is relatively larger than the titanium content of the first portion or of a Ti layer. | 2010-09-30 |
20100244257 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND THE SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device includes forming a plurality of mask patterns by anisotropically etching a mask-forming film until upper surfaces of core patterns are exposed. A facing pair includes a pair of the mask patterns facing the core pattern located between the paired mask patterns. The mask patterns of the facing pair have respective lower portions spaced from each other by a first distance. An adjacent pair includes a pair of mask patterns adjacent to each other with a space having no core pattern. The mask patterns of the adjacent pair have respective lower portions spaced from each other by a second distance. The mask patterns are formed so that the second distance is larger than the first distance. | 2010-09-30 |
20100244258 | SUBSTRATE AND MANUFACTURING METHOD THEREFOR - It is an object of the present invention to provide a substrate having a barrier film for preventing copper diffusion having both a barrier function and a catalytic function, wherein the barrier properties during high-temperature heating is excellent. | 2010-09-30 |
20100244259 | SUBSTRATE AND MANUFACTURING METHOD THEREFOR - It is an object of the present invention to provide a substrate having a barrier film for preventing copper diffusion having both a barrier function and a catalytic function, wherein the barrier properties during high-temperature heating is excellent. | 2010-09-30 |
20100244260 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes: a first insulting film formed on a semiconductor substrate; a contact including a conductive film buried in the first insulating film to reach the semiconductor substrate; and a first barrier layer including a high melting point metal, formed between the semiconductor substrate and the conductive film and between the first insulating film and the conductive film. The device also includes a second barrier layer lower in moisture permeability than the first barrier layer, formed between the first barrier layer and the conductive film. | 2010-09-30 |
20100244261 | THROUGH-HOLE CONTACTS IN A SEMICONDUCTOR DEVICE - Devices with conductive through-waver vias. In one embodiment, the device is formed by a method comprising providing a layer of semiconducting material, forming a layer of metal on a first side of the layer of semiconducting material, forming an opening in the layer of semiconducting material to thereby expose a portion of the layer of metal, the opening extending from at least a second side of the layer of semiconducting material to the layer of metal, and performing a deposition process to form a conductive contact in the opening using the exposed portion of the metal layer as a seed layer. | 2010-09-30 |
20100244262 | DEPOSITION METHOD AND A DEPOSITION APPARATUS OF FINE PARTICLES, A FORMING METHOD AND A FORMING APPARATUS OF CARBON NANOTUBES, AND A SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME - A deposition method of fine particles, includes the steps of irradiating a fine particle beam formed by size-classified fine particles to an irradiated subject under a vacuum state, and depositing the fine particles on a bottom part of a groove structure formed at the irradiated subject. | 2010-09-30 |
20100244263 | CHIP PACKAGES - Chip assemblies are disclosed that include a semiconductor substrate, multiple devices in and on the semiconductor substrate, a first metallization structure over the semiconductor substrate, and a passivation layer over the first metallization structure. First and second openings in the passivation layer expose first and second contact pads of the first metallization structure. A first metal post is positioned over the passivation layer and over the first contact pad. A second metal post is positioned over the passivation layer and over the second contact pad. A polymer layer is positioned over the passivation layer and encloses the first and second metal posts. A second metallization structure is positioned on the polymer layer, on the top surface of the first metal post and on the top surface of second metal post. The second metallization structure includes an electroplated metal. Related fabrication methods are also described. | 2010-09-30 |
20100244264 | Semiconductor device - A semiconductor device including a first wire made of a material mainly composed of Cu, two second wires made of a material mainly composed of Cu, an interlayer dielectric film formed between the first wire and the two second wires, two vias made of a material mainly composed of Cu and each penetrating through the interlayer dielectric film and connecting the first wire and a respective one of the two second wires, and a dummy via formed between the two second wires. The dummy via is made of a material mainly composed of Cu, has a diameter smaller than a diameter of each of the two vias, and is connected to the first wire while not contributing to electrical connection between the first wire and the two second wires. | 2010-09-30 |
20100244265 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - Wiring grooves are formed on a first interlayer insulating film | 2010-09-30 |
20100244266 | METALLIC BONDING STRUCTURE FOR COPPER AND SOLDER - The present invention discloses a metallic bonding structure for copper and solder, which applies to connect at least one electronic element. The metallic bonding structure comprises at least one copper-based member and at least one zinc bonding member. The copper-based members are arranged on the electronic element through at least one solder member. The zinc bonding members are arranged between the copper-based members and the solder members. The solder members are tin-based solder bumps. | 2010-09-30 |
20100244267 | INTERCONNECT STRUCTURE FOR A SEMICONDUCTOR DEVICE AND RELATED METHOD OF MANUFACTURE - A semiconductor device having a device substrate is provided. The semiconductor device comprises an electrically-conductive pad formed overlying the device substrate, an electrically-conductive platform formed overlying the electrically-conductive pad and enclosing a cavity, the electrically-conductive platform having a perimeter portion extending away from the electrically-conductive pad and a capping portion atop the perimeter portion, and a cushioning material disposed in the cavity. | 2010-09-30 |
20100244268 | APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES - Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed. | 2010-09-30 |
20100244269 | Semiconductor device having integral structure of contact pad and conductive line - Provided are a semiconductor device and a method of forming a semiconductor device in which a plurality of patterns are simultaneously formed to have different widths and the pattern densities of some regions are increased using a double patterning. The semiconductor device includes a plurality of conductive lines each including a first line portion and a second line portion, where the first line portion extends on a substrate in a first direction, the second line portion extends from one end of the first line portion in a second direction different from the first direction; a plurality of contact pads each of which is connected with a respective conductive line of the plurality of conductive lines and a respective second line portion of a respective conductive line of the plurality of conductive lines; and a plurality of dummy conductive lines each including a first dummy portion extending from a respective contact pad of the plurality of contact pads, in parallel with the corresponding second line portion in the second direction. | 2010-09-30 |
20100244270 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A semiconductor device includes: a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the component substrate; via holes made in the support plate material; a conducting material filled in the via holes; and a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material. | 2010-09-30 |
20100244271 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device has a first insulation film defining a plurality of contact holes arranged along a predetermined direction. A plurality of first contact plugs is respectively formed in the contact holes. A second insulation film is formed on the first insulation film and defining an opening to expose a predetermined region of the first insulation film including a region where the first contact plugs are formed. A plurality of interconnections are formed to extend across the opening and to be in contact with top surfaces of the first contact plugs, respectively. | 2010-09-30 |
20100244272 | PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES - Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member, a first die attached to the support member, and a second die attached to the first die in a stacked configuration. The device can also include an attachment feature between the first and second dies. The attachment feature can be composed of a dielectric adhesive material. The attachment feature includes (a) a single, unitary structure covering at least approximately all of the back side of the second die, and (b) a plurality of interconnect structures electrically coupled to internal active features of both the first die and the second die. | 2010-09-30 |
20100244273 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DEVICE UNITS AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: forming a first device unit, having first external interconnects arranged along a perimeter of the first device unit, and a second device unit, having second external interconnects arranged along a perimeter of the second device unit, in an array configuration; mounting an integrated circuit die over the first device unit; connecting the integrated circuit die and the first external interconnects; encapsulating with an encapsulation covering the integrated circuit die, the first device unit, and the second device unit with both the first external interconnects and the second external interconnects partially exposed; and forming a partial encapsulation cut in the encapsulation electrically isolating the first external interconnects and the second electrical interconnects. | 2010-09-30 |
20100244274 | WIRING BOARD - A wiring board includes a first conductor constituting a signal line, a second conductor constituting a ground conductor or a power conductor, a dielectric layer disposed between and separately the first and second conductors, and a third conductor arranged between the first and second conductor, the third conductor being connected to the second conductor, and having a width narrower than that of the first conductor, the third conductor entirely opposing the first conductor, the entire portion of the third conductor being covered by the first conductor. | 2010-09-30 |
20100244275 | CONTACT STRUCTURE FOR AN ELECTRONIC CIRCUIT SUBSTRATE AND ELECTRONIC CIRCUIT COMPRISING SAID CONTACT STRUCTURE - A substrate for an electronic circuit is provided wherein the substrate comprises a plurality of contact areas ( | 2010-09-30 |
20100244276 | THREE-DIMENSIONAL ELECTRONICS PACKAGE - An electronics package | 2010-09-30 |
20100244277 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE UNDERFILL AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a sacrificial carrier assembly having a stack interconnector thereover; mounting an integrated circuit having a connector over the sacrificial carrier assembly with the connector over the stack interconnector; dispensing an underfill material between the sacrificial carrier assembly and the integrated circuit with the underfill material substantially free of a void; encapsulating the integrated circuit over the sacrificial carrier assembly and the underfill material; exposing the stack interconnector by removing the sacrificial carrier assembly; and forming a base array over the underfill material and the stack interconnector. | 2010-09-30 |
20100244278 | STACKED MULTICHIP PACKAGE - A stacked multichip package comprises a first chip having a first active surface and a first rear surface, a first chip carrier having a first opening and being configured to carrier the first active surface, a plurality of first conductive leads passing through the first opening and being configured to electrically connect the first active surface and the first chip carrier, a second chip having a second active surface and a second rear surface, an adhesive layer configured to enclose the first conductive leads and to electrically couple the first chip carrier to the second rear surface, a second chip carrier having a second opening and being electrically connected to the second active surface, and a plurality of conductive leads passing through the second opening and being configured to electrically connect the second active surface and the second chip carrier. | 2010-09-30 |
20100244279 | Liquid resin composition for underfill, flip-chip mounted body and method for manufacturing the same - The invention relates to a liquid resin composition for underfill comprising (A) an epoxy resin, (B) an amine-based curing agent, and (C) an inorganic filler, a viscosity at a temperature of 25° C. being 1 to 150 Pa·s, and a time required for the viscosity to become 1 Pa·s at a temperature of 100° C. being 40 to 180 minutes. | 2010-09-30 |
20100244280 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE - A board on which a wiring having an electrode pad is formed is prepared. A resist film is formed on the board in order to cover the wiring and then the resist film is left on the electrode pad through patterning. An inorganic insulating film is formed on the board in order to cover the wiring and then the resist film is removed, thereby removing the inorganic insulating film provided on the resist film to leave the inorganic insulating film between the wirings. A solder resist layer is formed on the board in order to cover the wiring and then the electrode pad is exposed. | 2010-09-30 |
20100244281 | FLEXIBLE PRINTED WIRING BOARD AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME - Objects of the present invention is to provide a flexible printed wiring board which has a simple structure, which can be produced at low cost, and which can effectively dissipate heat generated by semiconductor chips, and to provide a semiconductor device employing the flexible printed wiring board. The flexible printed wiring board of the invention has an insulating substrate, and a wiring pattern formed of a conductor layer and provided on one surface of the insulating substrate, wherein the wiring pattern includes inner leads for mounting a semiconductor chip and outer leads for input and output wire connection, and a metal layer is adhered to the wiring pattern via an insulating adhesion layer. | 2010-09-30 |
20100244282 | ASSEMBLY OF ELECTRONIC COMPONENTS - An electronic component assembly that has a supporting structure, an integrated circuit die with a plurality of contacts pads, a printed circuit board with a plurality of conductors, the integrated circuit die and the PCB being mounted to the supporting structure by a die attach film such that they are adjacent and spaced from each other and, wire bonds electrically connecting the contact pads to the conductors. An intermediate portion of each of the wire bonds is adhered to the die attach film to lower the profile of the wire bond arcs. | 2010-09-30 |
20100244283 | METHOD OF JOINING ELECTRONIC COMPONENT AND THE ELECTRONIC COMPONENT - Dummy electrodes ( | 2010-09-30 |
20100244284 | METHOD FOR ULTRA THIN WAFER HANDLING AND PROCESSING - A method for thin wafer handling and processing is provided. In one embodiment, the method comprises providing a wafer having a plurality of semiconductor chips, the wafer having a first side and a second side. A plurality of dies are attached to the first side of the wafer, at least one of the dies are bonded to at least one of the plurality of semiconductor chips. A wafer carrier is provided, wherein the wafer carrier is attached to the second side of the wafer. The first side of the wafer and the plurality of dies are encapsulated with a planar support layer. A first adhesion tape is attached to the planar support layer. The wafer carrier is then removed from the wafer and the wafer is diced into individual semiconductor packages. | 2010-09-30 |
20100244285 | Semiconductor device and method of manufacturing the same - In a semiconductor device, corner portions of a inner insulating film are chamfered, and hence a damage is less likely to reach the corner portion of the inner insulating film, though the corner portion of an outer insulating film is damaged. Therefore, a hermeticity of a semiconductor element can be effectively maintained, and the yield of semiconductor pellets can be improved. Moreover, since it is not necessary to chamfer the corner portion of the outer insulating film, the structure remains simple and the productivity can be improved. | 2010-09-30 |
20100244286 | NANOCOMPOSITES FOR OPTOELECTRONIC DEVICES - Nanoparticles (<100 nm) and submicron particles (<400 nm) can be used as filler material to form a nanocomposite that can be used as an encapsulant for optoelectronic devices. These nanocomposites can function to reduce light scattering and increase thermal, mechanical and dimensional stability of the optoelectronic device. Such nanocomposites can also improve moisture barrier characteristics, lower the dielectric constant and increase resistivity of the optoelectronic device. | 2010-09-30 |
20100244287 | METHOD OF MEASUREMENT IN SEMICONDUCTOR FABRICATION - Provided is a method of fabricating a semiconductor device. The method includes providing a device substrate having a front side and a back side, the device substrate having a first refractive index, forming an embedded target over the front side of the device substrate, forming a reflective layer over the embedded target, forming a media layer over the back side of the device substrate, the media layer having a second refractive index less than the first refractive index, and projecting radiation through the media layer and the device substrate from the back side so that the embedded target is detected for a semiconductor process. | 2010-09-30 |
20100244288 | METHOD AND APPARATUS FOR FABRICATING SEMICONDUCTOR CHIPS USING VARYING AREAS OF PRECISION - A system that fabricates a semiconductor chip. The system places patterns for components which require fine line-widths within a high resolution region of a reticle, wherein the high resolution region provides sharp focus for a given wavelength of light used by the lithography system. At the same time, the system places patterns for components which do not require fine line-widths outside of the high-resolution region of the reticle, thereby utilizing the region outside of the high-resolution region of the reticle instead of avoiding the region. Note that the coarseness for components placed outside of the high resolution region of the reticle is increased to compensate for the loss of optical focus outside of the high resolution region. | 2010-09-30 |
20100244289 | Universal Valved Humidification Column - An embodiment in accordance with the present invention provides a humidifier including a universal, valved humidification column and a water reservoir for use with a breathing circuit. In accordance with the present invention, the universal valved humidification column includes a float valve which controls the water level in the column. Additionally, the water reservoir includes a gas permeable vent to control the pressure within the water reservoir. | 2010-09-30 |
20100244290 | FLUID DISTRIBUTION TO PARALLEL FLOW VAPOR-LIQUID CONTACTING TRAYS - Fluid distribution systems, and particularly those for distributing liquids into apparatuses containing parallel flow trays for carrying out vapor-liquid contacting, are described. Representative fluid distribution systems comprise one or more extended troughs having a plurality of outlet spouts that are aligned for distribution to a vapor-liquid contacting deck zones of a parallel flow stage. The trough(s) may be orthogonal to liquid distribution pans which are in alignment with outlet spouts (e.g., in discrete outlet spout zones) of the trough(s). | 2010-09-30 |
20100244291 | IMPRINTING METHOD FOR MAKING OPTICAL COMPONENTS - An imprinting method for making optical components includes: providing an imprinting mold, the imprinting mold comprising a molding surface and a molding portion formed on the molding surface; providing a substrate comprising a first surface, the first surface comprising a plurality of supporting areas arranged in an array, each of the supporting areas configured for supporting a mass of molding material; applying a mass of molding material on each of the supporting areas; pressing the imprinting mold on each mass of the molding material; and solidifying the imprinted molding material to form the optical components. | 2010-09-30 |
20100244292 | PROCESS AND APPARATUS FOR PRODUCING GAS HYDRATE PELLET - Provided is a process and an apparatus for producing at low cost gas hydrate pellets having an excellent storability. A gas hydrate generated from a raw-material gas and raw-material water is dewatered and simultaneously molded into pellets with compression-molding means under conditions suitable for generating the gas hydrate while the gas hydrate is generated from the raw-material gas and the raw-material water that exist among particles of the gas hydrate. | 2010-09-30 |
20100244293 | Method For The Manufacture Of Stable, Nano-Sized Particles - The current invention relates to methods of making nano-particles of a material with a narrow polydispersity. The particle materials are active agents, organic compounds, polymers, and combinations thereof. | 2010-09-30 |
20100244294 | SMC CROWN SHELLS - A dental article such as a crown is fabricating by layering one or more preformed shells of SMC material onto an understructure. The understructure may be fabricated from any suitably strong material for use in replacing dentition. At the same time, a number of SMC shells may be used to provide a finished dental article having a natural-looking, multi-chromatic appearance. The SMC material(s) may be cured to provide an exterior hardness suitable for use in dental applications. | 2010-09-30 |
20100244295 | METHOD FOR MANUFACTURING ROOFING PRODUCTS - A method of making a roofing product such as a shingle is provided. One such method includes creating a mixture having at least a polymer and a filler, forming a sheet from the mixture, cooling the sheet, embossing the sheet, forming multiple roofing products from the sheet and bundling at least some of the roofing products together. This method is performed using an automated procedure. Another method of the present invention involves creating a composite roofing product using mold cavities, using a robot to transfer some of the roofing products from some of the mold cavities to a conveying system, and stacking together at least two of the roofing products that have different colors of different surface configurations. | 2010-09-30 |
20100244296 | COMPOSITE COMPONENT AND METHOD OF MANUFACTURING THE SAME - A method of producing a composite component that includes both a structural insert and a plastic casing. According to an exemplary embodiment, the method uses a closed-loop control system and includes the following steps: evaluating the structural insert for various attributes, placing the structural insert in a mold cavity, adjusting the position and/or orientation of the structural insert with respect to the mold cavity based on, among other things, the evaluated attributes, and injecting molten material into the mold cavity so that it at least partially surrounds the structural insert. | 2010-09-30 |
20100244297 | MOLDING APPARATUS - A molding apparatus includes two metal molds arranged at positions opposing to each other and each having a die for molding a member into a desired shape, a heating unit for heating the member, an ultrasonic wave transmitting and receiving unit arranged on the metal mold for irradiating the member with an ultrasonic wave and receiving the reflected ultrasonic wave, a drive unit for driving at least one of the metal molds and a control unit for detecting a partial contact of the member with respect to the metal mold using wave readings from the ultrasonic wave transmitting and receiving unit and controlling the drive unit to adjust a pressing velocity of the metal mold. | 2010-09-30 |
20100244298 | DEVICE FOR TRANSPORTING A HOLLOW BODY, INSTALLATION PROVIDED WITH SUCH DEVICES, AND METHOD FOR CONVEYING A HOLLOW BODY ATTACHED TO SUCH A DEVICE - The preform conveying installation ( | 2010-09-30 |
20100244299 | Method For Producing Continuous Expanded Polystyrene Foam Parts - The invention relates to a novel, innovative industrial method for producing polystyrene (EPS) foam parts of arbitrary length and having a constant cross-section, with mixed densities located in accordance with the mechanical and thermal properties required for each application. The invention also relates to a machine (apparatus) for producing said solid parts having localized densities defined by the mechanical and thermal requirements of the application. The aforementioned products are produced by joined both longitudinally and transversely. The invention can be used to reduce the standard method to three steps, thereby resulting in a significant saving in terms of production. Moreover, unlike with the standard method, variants can be produced using the above-mentioned method, thereby increasing the range of application said type of products. | 2010-09-30 |
20100244300 | FOAMED BINDER AND ASSOCIATED SYSTEMS AND METHODS FOR PRODUCING A WOOD PRODUCT - The disclosure relates to foamed binders for wood strand products and methods and systems for producing wood strand products using foamed binders. In some embodiments, the disclosure includes a method for producing a wood strand product from cellulosic particles, the method comprising the steps of foaming a phenol formaldehyde binder to produce a foam, tumbling the cellulosic particles in a rotary blender, applying the foam to the cellulosic particles in the rotary blender, blending the cellulosic particles and the foam so that the foam covers the cellulosic particles, and consolidating the cellulosic particles under heat and pressure. | 2010-09-30 |
20100244301 | MATERIAL SYSTEM AND METHOD FOR CHANGING PROPERTIES OF A PLASTIC COMPONENT - The instant invention relates to a method for changing characteristics of a plastic component, wherein a medium is introduced into the plastic component, which encompasses a porosity and wherein the medium forms a homogenous compound with the plastic component by at least partially dissolving the plastic component. | 2010-09-30 |
20100244302 | METHOD OF MANUFACTURING CONNECTOR - A connector is manufactured by integrally molding with a resin, by using a first molding die having a molding portion for molding outer shapes of first and second connection portions of the connector, and a cylindrical second molding die inserted into the molding portion to mold an insertion hole in which a connection member is inserted. In the molding, a circular core portion is inserted into the molding portion in a state where the second molding die is inserted into the core portion. Then, the molded first and second connection portions are removed together with the core portion, from the first and second molding dies. Thereafter, the core portion in the first connection portion is dissolved by using a solvent, so that a circular recess portion for arranging an O-ring is formed to be recessed from a peripheral surface of the insertion hole to a radial outside. | 2010-09-30 |
20100244303 | PRODUCTION METHOD OF AROMATIC POLYCARBONATE - The object of the present invention is to provide a production method for an aromatic polycarbonate, in which eye boogers at the time of extrusion molding are reduced, and a continuous operation for a long period of time is possible. The present invention relates to a method when an extrusion molding is produced using an extruder in which a tapered part | 2010-09-30 |
20100244304 | STENTS FABRICATED FROM A SHEET WITH INCREASED STRENGTH, MODULUS AND FRACTURE TOUGHNESS - Methods of fabricating a polymeric stent from a polymer sheet with improved strength, modulus and fracture toughness are disclosed. The methods include stretching the polymer sheet along one or more axesto increase the strength, fracture toughness, and modulus of the polymer along the axis of stretching. The methods further include forming a tubular stent from the stretched sheet. The stent can include a slide-and-lock mechanism that permits the stent to move from a collapsed diameter to an expanded diameter and inhibiting radial recoil from the expanded diameter. | 2010-09-30 |
20100244305 | METHOD OF MANUFACTURING A POLYMERIC STENT HAVING IMPROVED TOUGHNESS - Methods of manufacturing polymeric intraluminal stents are disclosed. Specifically, a method of manufacturing polymeric intraluminal stents by inducing molecular orientation into the stent by radial expansion. | 2010-09-30 |
20100244306 | ASYMMETRIC GAS SEPARATION MEMBRANES WITH SUPERIOR CAPABILITIES FOR GAS SEPARATION - This invention relates to a method of making flat sheet asymmetric membranes, including cellulose diacetate/cellulose triacetate blended membranes, polyimide membranes, and polyimide/polyethersulfone blended membranes by formulating the polymer or the blended polymers dopes in a dual solvent mixture containing 1,3 dioxolane and a second solvent, such as N,N′-methylpyrrolidinone (NMP). The dopes are tailored to be closed to the point of phase separation with or without suitable non-solvent additives such as methanol, acetone, decane or a mixture of these non-solvents. The flat sheet asymmetric membranes are cast by the phase inversion processes using water as the coagulation bath and annealing bath. The dried membranes are coated with UV curable silicone rubber. The resulting asymmetric membranes having a skin thickness of less than 100 nm, exhibit excellent permeability and selectivity compared to the intrinsic dense film performances. | 2010-09-30 |
20100244307 | METHOD AND APPARATUS FOR GROWING NANOTUBE FORESTS, AND GENERATING NANOTUBE STRUCTURES THEREFROM - The present invention provides apparatus and methods for growing fullerene nanotube forests, and forming nanotube films, threads and composite structures therefrom. In some embodiments, an interior-flow substrate includes a porous surface and one or more interior passages that provide reactant gas to an interior portion of a densely packed nanotube forest as it is growing. In some embodiments, a continuous-growth furnace is provided that includes an access port for removing nanotube forests without cooling the furnace substantially. In other embodiments, a nanotube film can be pulled from the nanotube forest without removing the forest from the furnace. A nanotube film loom is described. An apparatus for building layers of nanotube films on a continuous web is described. | 2010-09-30 |
20100244308 | EXTRUSION-FORMING DEVICE AND METHOD FOR MANUFACTURING FORMED ARTICLE BY USE OF THIS DEVICE - An extrusion-forming device | 2010-09-30 |
20100244309 | DIE FOR FORMING HONEYCOMB STRUCTURE AND MANUFACTURING METHOD OF THE SAME - A die for forming a honeycomb structure, comprising a platy die base member having a clay supply face on back surface thereof and including a plurality of introduction holes for introducing a mixed raw material for forming; and a clay forming face on upper surface including a plurality of slits for extrusion of the material being connected to the introduction holes and formed lattice-like partition regions; at least a part of lattice-like partition regions being provided in such a position that the extended line of at least part of a plurality of lattice-like regions overlap with the slits at edges thereof as top view, slits including inner peripheral slits formed in the inner peripheral region, and outer peripheral slits formed in the outer peripheral region surrounding the inner peripheral region and having a width-enlarged portion having a width larger than that of the inner peripheral slit, and production method thereof. | 2010-09-30 |
20100244310 | REFRACTORY ALLOY, FIBRE-FORMING PLATE AND METHOD FOR PRODUCING MINERAL WOOL - An alloy, characterized in that it contains the following elements (the proportions being indicated in percentages by weight of the alloy): | 2010-09-30 |
20100244311 | METHOD AND APPARATUS FOR MANUFACTURING VITREOUS SILICA CRUCIBLE - A method of manufacturing a vitreous silica crucible by a rotary mold method, which includes performing arc melting in a state in which electrodes are provided so as to be shifted from a mold central line, wherein, by this eccentric arc, the glass temperature difference during melting of a straight body portion, a curved portion and a bottom of the crucible is controlled to 300° C. or below and the thickness of a transparent layer of the straight body portion and the bottom is controlled to 70 to 120% of the thickness of a transparent layer of the curved portion. | 2010-09-30 |
20100244312 | MOLD FOR THE MANUFACTURE OF CERAMIC PRODUCTS - A mold for making ceramic products ( | 2010-09-30 |
20100244313 | Method for Handling a Liquid - A method for handling a liquid, in particular for the metered transfer of a liquid that is viscous at room temperature from a reservoir to a receiving container for the purpose of further processing the viscous liquid. In the method the receiving container is filled with the liquid. In this arrangement the liquid is present in a plurality of individual portions. Furthermore, the liquid is cooled such that the individual portions are present in a predominantly solid state of aggregation. Preferably, the individual portions are sufficiently small so that the transferred liquid is a frozen granulate. | 2010-09-30 |
20100244314 | INJECTION MOLDING MACHINE FOR TWO-MATERIAL MOLDING AND METHOD OF CONTROLLING THE SAME - In an injection molding machine for two-material molding including two sets of injection units | 2010-09-30 |
20100244315 | INTERNALLY PRESSURE COMPENSATED NON-CLOGGING DRIP EMITTER - Drip emitter having a pressure compensating element that does not contact the enclosing pipe. First known drip emitter formed from a two-shot injection mold process that includes a deformable element, membrane, compressible element or pressure compensating element that compensates pressure or flow of water against a stiff injection molded surface that is part of the drip emitter body. In addition, this is the first drip emitter (two-shot or otherwise) that includes a compensating surface that is not parallel to the membrane, i.e., at an angle to the plane of the pressure compensating element. May include fluid retainment valve, ventable/anti-siphon/non-drain or other, as part of second injection with second or third material. Allows for simple injection mold construction and eliminates need for ISO conditioning to properly seat the membrane before testing. | 2010-09-30 |
20100244316 | CONNECTING FIBER-REINFORCED MATERIAL TO AN NJECTION-MOULDED MATERIAL - A process for the bonding of a fiber-reinforced material to an injection-molding material and an article produced by the process. The process improves the bond between a fiber-reinforced starting material and a material applied by injection. A further plastics material is inserted under pressure into a fiber-reinforced plastics material. This results in interlock bonding between the further plastics material and the fibers of the fiber-reinforced plastics material. This type of bonding is substantially more stable than known bonding. | 2010-09-30 |
20100244317 | APPARATUS FOR MOULDING A PART OF A PACKAGING CONTAINER - An apparatus for moulding a thermoplastic package part(s) to an end portion of a container body includes inner and outer mould elements between which a mould cavity per package part is formed. At least one of these mould elements is at least partly freely suspended. When one package part is moulded with the mould elements, plastic melt is injected in a first number ≧1 of points in the cavity, an island of plastic melt for each point is formed inside the cavity, and the distribution of the points causes a force centre to pass through a surface defined by a parallel projection of each first number of islands on a plane orthogonal to a direction of the compression force, and when the first number >1, a second number of imaginary straight lines interconnecting a third number of parallel projections such that the surface is at its maximum. | 2010-09-30 |
20100244318 | INSERT MOLDING METHOD AND DEVICE - An insert molding method and device that does not require secondary injection of molten resin uses a metallic mold which forms a cavity | 2010-09-30 |
20100244319 | METHOD AND APPARATUS FOR PRODUCING FIGURED VENEER - A method and apparatus for making a piece of figured veneer comprise means for, and the steps of, softening lignin in a sheet of veneer, pressing the sheet of veneer between complementary corrugating press rollers having a pitch and a depth to press the sheet of veneer into a wavy or corrugated configuration, and surfacing the pressed sheet of veneer to remove crests of the corrugations, making the piece of figured veneer. Another method and apparatus for making a piece of figured veneer, comprise means for, and the steps of, softening lignin in a sheet of veneer, placing the sheet of veneer onto a wavy or corrugated surface of a plate, pressing the sheet of veneer using a press roller so that the roller presses the sheet of veneer against the surface to achieve a wavy or corrugated veneer, and surfacing the pressed sheet of veneer to remove peaks of the corrugations, making the piece of figured veneer. Yet another method and apparatus for making a piece of figured veneer, comprise means for, and the steps of, softening lignin in a sheet of veneer, placing the sheet of veneer onto a corrugated surface of a plate having such a wavy or corrugated surface, pressing the sheet of veneer onto the troughs and peaks of the surface using a flexible platen having a corrugated surface so that the corrugated surface of the platen presses the sheet of veneer against the corrugated surface of the plate to achieve a wavy or corrugated veneer, and surfacing the pressed sheet of veneer to remove peaks of the corrugations, making the piece of figured veneer. | 2010-09-30 |
20100244320 | Apparatus and method for forming a clay slab - An apparatus and method for forming a clay slab includes a frame, a front panel supported on the frame and a rear panel supported on the frame. An outer cable is attached to the rear panel at one end and to the rear panel and to the front panel at another end. A rotatable drive axle is configured to simultaneously wind and unwind the outer cable and thereby move the front panel and the rear panel from an initial position to an intermediate position to draw a block of prepared clay into a gap defined by the front panel and the rear panel. The drive axle is further configured to simultaneously wind and unwind the outer cable in the opposite direction and thereby move the front panel and the rear panel from the intermediate position back to the initial position to remove the clay slab from the slab roller. | 2010-09-30 |
20100244321 | Production Of UHMWPE Sheet Materials - UHMWPE panels of large width may be ram extruded from a slit die in a stable process, by restraining a panel which exits the die below the crystalline melt temperature against movement away from the die by a back pressure device, so as to exert a back pressure between the back pressure device and the die, the back pressure device preferably constructed of a plurality of differentially adjustable elements so as to be able to compensate for changes in processing characteristics over time. Vertically restraining UHMWPE panels as they further cool also greatly improves product characteristics. | 2010-09-30 |
20100244322 | DEVICE FOR INJECTION MOLDING - The present disclosure relates to a device for the injection molding of an item including at least one face, a protruding peripheral part provided with an edge for the connection with another face, said device including mold elements movable with respect to each other and jointly cooperating by delimiting therebetween joint planes as well as a cavity intended to be filled with liquid plastic material through injection channels to form said item after the ejection from the mold, characterized in that it includes a mold element to form the protruding part of the item, whose joint plane with the immediately adjacent front mold element is angularly oriented from said edge and on at least a portion of the length thereof, according to the direction of ejection. | 2010-09-30 |
20100244323 | DISPENSING VALVES - A dispensing valve for flowable material comprises a valve plate ( | 2010-09-30 |
20100244324 | METHODS AND APPARATUS FOR RAPID IMPRINT LITHOGRAPHY - A mold for imprinting a patterned region by imprint lithography is provided with a peripheral groove around the patterned region. The groove is connected, as by channels through the mold, to a switchable source for gas removal to prevent bubbles and for the application of pressurized gas to separate the mold and substrate. In use, the mold is disposed adjacent the moldable surface and gas is withdrawn from the patterned region through the groove as the mold is pressed toward and into the moldable surface. At or near the end of the imprinting, the process is switched from removal of gas to the application of pressurized gas. The pressurized gas passes through the groove and separates or facilitates separation of the mold and the moldable surface. | 2010-09-30 |
20100244325 | BISTABLE DISPLAY - A bistable display having one or more permanent hideable mark, and a method of forming the permanent hideable mark, are described. The permanent hideable mark can be hidden and revealed numerous times without loss of information. | 2010-09-30 |
20100244326 | IMPRINT PATTERN FORMING METHOD - An imprint pattern forming method includes contacting a template with a pattern in a front surface with an imprint material formed in a substrate to fill the imprint material into the pattern, curing the imprint material filled in the pattern to form an imprint material pattern, and after forming the imprint material pattern, separating the template from the imprint material pattern while applying pressure to the back surface of the template. | 2010-09-30 |
20100244327 | Method For Curing Resin With Ultrasound - A method for curing a resin includes the steps of placing the resin into a reaction vessel, drawing a vacuum in the reaction vessel, positioning the reaction vessel in a gaseous coupling fluid, and applying ultrasonic energy to the coupling fluid. | 2010-09-30 |
20100244328 | CURABLE COMPOSITION FOR PHOTOIMPRINT, AND METHOD FOR PRODUCING CURED PRODUCT USING SAME - A curable composition for photoimprints comprising a photopolymerizable monomer, a polymerization initiator and a compound of the following formula (1), wherein the content of compounds having a molecular weight of at least 1000 is at most 10% by mass of all the solid content therein, and the content of the compound of the formula (1) is from 0.3 to 10.0% by mass of all the solid content therein: | 2010-09-30 |
20100244329 | Medical Device with Regioselective Structure-Property Distribution - A medical device such as a stent having selected regions with different material properties than other regions is disclosed. Selection and modification of the regions may be based on facilitating a desired mechanical behavior and/or therapeutic prophylactic property of the device. | 2010-09-30 |
20100244330 | Packaging and applicator device including a member for reshaping an applicator surface thereof and a method of reshaping an applicator surface - A packaging and applicator device comprising: a body; a block of fluidizable substance that is stationary relative to the body while the substance is in the solid state, said block of substance projecting beyond the body to define at least one surface serving as an applicator surface; and a reshaper member for reshaping the applicator surface, said reshaper member being positionable on the body to co-operate therewith to define at least one cavity into which the substance can flow when fluidized by supplying heat, the substance retaining the shape of the cavity when it returns to the solid state after cooling. | 2010-09-30 |
20100244331 | Method for Production of Nanofibres - The invention relates to the method for production of nanofibres through electrostatic spinning of polymer matrices prepared upon biopolymers of chitosan or collagen. The biopolymer before spinning is dissolved as clean or in mixture with auxiliary non-toxic polymer in solvent system, which comprises an organic or inorganic acid, selected from the group of acetic acid in concentration from 30% to 90% of weight, lactic acid, malic acid, trihydrogen-phosphoric acid and their mixtures, and this solution is brought into electrostatic field between the spinning electrode and collecting electrode, while the produced biopolymer nanofibres comprise more than 90% of weight of biopolymer in dry mass. | 2010-09-30 |
20100244332 | METHODS UTILIZING REVERSIBLY ADHESIVE LAYERS FOR FORMING PATTERNED MICROSTRUCTURES - A method for forming a nano/microstructure includes applying a release coating having a transition temperature to a mold, the release coating promoting adhesion thereto at temperatures below the transition temperature and release at temperatures above the transition temperature. A cast material is adhered to the release coating at a first temperature below the transition temperature and released from the mold by exposing the release coating to a second temperature greater than the transition temperature. | 2010-09-30 |
20100244333 | Apparatus for Three Dimensional Printing Using Imaged Layers - A three-dimensional printer adapted to construct three dimensional objects is disclosed. In an exemplary embodiment, the printer includes a first surface adapted to receive a bulk layer of sinterable powder, a polymer such as nylon powder; a radiant energy source, e.g., an incoherent heat source adapted to focus the heat energy to sinter an image from the layer of sinterable powder; and a transfer mechanism adapted to transfer or print the sintered image from the first surface to the object being assembled while fusing the sintered image to the object being assembled. The transfer mechanism is preferably adapted to simultaneously deposit and fuse the sintered image to the object being assembled. The process of generating an image and transferring it to the object being assembled is repeated for each cross section until the assembled object is completed. | 2010-09-30 |
20100244334 | METHOD OF MANUFACTURING A POLYMERIC STENT HAVING A CIRCUMFERENTIAL RING CONFIGURATION - Methods of manufacturing polymeric intraluminal stents and intraluminal stents are disclosed. The methods provide a method of manufacturing polymeric intraluminal stents having a circumferential ring configuration. The polymeric stents have a circumferential ring configuration. | 2010-09-30 |
20100244335 | Apparatus and method for supporting continuous casting nozzle, sliding nozzle system and continuous casting nozzle - It is intended to provide a continuous-casting-nozzle support apparatus capable of enhancing sealing performance between a continuous casting nozzle and an SN device. The continuous-casting-nozzle support apparatus comprises: a holding mechanism | 2010-09-30 |
20100244336 | LOW NOx FUEL INJECTION FOR AN INDURATING FURNACE - An indurating furnace has a heating station and an air passage leading to the heating station. A draft of preheated recirculation air is driven through the passage toward the heating station, and is mixed with fuel gas to form a combustible mixture of preheated recirculation air and fuel gas that ignites in the passage. This is accomplished by injecting the fuel gas into the passage in a stream that does not form a combustible mixture with the preheated recirculation air before entering the passage. | 2010-09-30 |
20100244337 | NOx Suppression Techniques for an Indurating Furnace - Techniques for suppressing NOx in an indurating furnace include the use of a premix burner, the use of a staged fuel injector structure to enhance fuel lean conditions in the downdraft, and the use of a Venturi mixture structure in the downcomer. | 2010-09-30 |
20100244338 | NON-FERROUS METAL MELT PUMP AND NON-FERROUS METAL MELTING FURNACE USING THE SAME - A non-ferrous metal melting furnace includes a non-ferrous metal melt pump, a vortex chamber body, and a magnetic field device formed of permanent magnets. The vortex chamber body makes a non-ferrous metal melt flow into a vortex chamber from an inlet, makes the non-ferrous metal melt flow in a spiral shape by applying a driving force to the non-ferrous metal melt in the vortex chamber, and discharges the non-ferrous metal melt from the vortex chamber to an outlet. The magnetic field device formed of permanent magnets is disposed outside the vortex chamber and below a bottom plate of the vortex chamber, and applies the driving force to the non-ferrous metal melt by an electromagnetic force that is generated by current flowing in the non-ferrous metal melt and magnetic lines of force from the magnetic field device formed of permanent magnets. | 2010-09-30 |
20100244339 | FILTER HAVING MULTILAYERED STRUCTURE FOR FILTERING IMPURITY PARTICLES FROM MOLTEN METAL - A filter has a multi-layered structure for removing impurity particles from a molten metal. The filter includes: a plurality of filter layers sequentially disposed along the flow direction of the molten metal in a downward direction and comprising a plurality of pore channels, wherein the filter layers disposed upstream comprise larger pore channels than those of the filter layers disposed downstream. | 2010-09-30 |
20100244340 | METHODS AND APPARATUS FOR COMBINED VARIABLE DAMPING AND VARIABLE SPRING RATE SUSPENSION - Pressure-sensitive vales are incorporated within a dampening system to permit user-adjustable tuning of a shock absorber. In one embodiment, a pressure-sensitive valve includes an isolated gas chamber having a pressure therein that is settable by a user. | 2010-09-30 |
20100244341 | ACTIVE VIBRATION ISOLATING SUPPORT APPARATUS - In a so-called motoring state at the time of engine starting before actuating engine, there is a problem that a roll vibration, which is generated when an engine revolution speed Ne is at a predetermined engine revolution speed and vibrates the engine and the vehicle body largely, can not be suppressed. For this reason, the present invention provides an active vibration isolating support apparatus in which the roll vibration can be suppressed in the motoring state at the time of engine starting. | 2010-09-30 |
20100244342 | MECHANICAL JIG - A jig for drilling intersecting holes in a work piece. The jig comprises a base for supporting the work piece and a first template operatively coupled to the base and having a bolt-hole guide located along a first axis of the template, the bolt-hole guide having a diameter sized to receive a first drill bit. The jig also includes a second template operatively coupled to the base and having a barrel-nut hole guide located along a second axis of the template, perpendicular and intersecting the first axis. The barrel-nut hole guide has a diameter larger than the diameter of the bolt-hole guide and is sized to receive a second drill bit. | 2010-09-30 |
20100244343 | THERMALLY SWITCHED FERROMAGNETIC LATCHING SUPPORT SYSTEM - A ferromagnetic latching support system for positioning a surface is disclosed. The latching support system includes a mechanical support and a ferromagnetic device. | 2010-09-30 |
20100244344 | COMPACT TOOLS WITH SUCTION CUPS FOR HANDLING ROBOT - The invention relates to a tool that comprises a body ( | 2010-09-30 |
20100244345 | HOLDING JIG, MEASUREMENT DEVICE AND HOLDING DEVICE USING THE SAME - A holding jig includes, in a case where a tilt angle with respect to a plane as a holding surface of a holding target is defined as a holding tilt angle: a first holding portion having a holding tilt face with the holding tilt angle; a second holding portion connected to the first holding portion so as to slide toward the holding tilt face along a plane substantially parallel to the holding surface; and an elastic holding portion provided at a position of the second holding portion facing the holding tilt face and elastically deformed toward the holding surface by the holding tilt face while abutting on the holding tilt face, when the second holding portion slides toward the holding tilt face, to press and hold the holding target. | 2010-09-30 |
20100244346 | Apparatus for guiding and aligning semiconductor chip package - Provided is an apparatus for guiding and aligning a semiconductor chip package. The apparatus may include an insert, a plate above the insert, and an adapter. The insert may be configured to house various sizes of semiconductor chip packages. The plate may be configured to move vertically with respect to the insert. The adapter may be coupled to the plate and may be configured to guide at least one semiconductor chip package into the insert and to perform alignment of the at least one semiconductor chip package. In accordance with example embodiments, the at least one semiconductor chip package may have a size corresponding to at least one of the various sizes. | 2010-09-30 |
20100244347 | DEVICE AND SYSTEM FOR POSITIONING CIRCULAR WORK PIECES - A device and a system for positioning work pieces having cylindrical and/or hollow conical bodies, to be processed in workstations. The system comprises at least a first and a second independent positioning devices for positioning and driving in rotation the work pieces to be processed; each positioning device for a base frame provided with two roll groups for supporting the work piece to be processed, each provided with parallely arranged rolls. One or both of roll groups are movable in horizontal and/or vertical direction with respect to the base frame; a gear motor is operatively connected to the roll of at least one of the roll groups for drivingly rotate the work piece to be processed. | 2010-09-30 |