40th week of 2020 patent applcation highlights part 75 |
Patent application number | Title | Published |
20200312739 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2020-10-01 |
20200312740 | LOW THERMAL RESISTANCE POWER MODULE PACKAGING | 2020-10-01 |
20200312741 | THERMOELECTRIC COOLER TO ENHANCE THERMAL-MECHANICAL PACKAGE PERFORMANCE | 2020-10-01 |
20200312742 | BUMP INTEGRATED THERMOELECTRIC COOLER | 2020-10-01 |
20200312743 | SEMICONDUCTOR DEVICE | 2020-10-01 |
20200312744 | HEATSINK RETAINER ASSEMBLY | 2020-10-01 |
20200312745 | Connector | 2020-10-01 |
20200312746 | Modular Microjet Cooling Of Packaged Electronic Components | 2020-10-01 |
20200312747 | SEMICONDUCTOR DEVICE WITH METAL DIE ATTACH TO SUBSTRATE WITH MULTI-SIZE CAVITY | 2020-10-01 |
20200312748 | LEADFRAME SYSTEMS AND RELATED METHODS | 2020-10-01 |
20200312749 | SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME | 2020-10-01 |
20200312750 | ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND LEAD FRAME | 2020-10-01 |
20200312751 | FLEXIBLE SEMICONDUCTOR DEVICE WITH GRAPHENE TAPE | 2020-10-01 |
20200312752 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT | 2020-10-01 |
20200312753 | DEVICE FOR MOUNTING SEMICONDUCTOR ELEMENT, LEAD FRAME, AND SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT | 2020-10-01 |
20200312754 | SEMICONDUCTOR DEVICE | 2020-10-01 |
20200312755 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2020-10-01 |
20200312756 | SEMICONDUCTOR PACKAGE SUBSTRATE, ELECTRONIC PACKAGE AND METHODS FOR FABRICATING THE SAME | 2020-10-01 |
20200312757 | SEMICONDUCTOR PACKAGE | 2020-10-01 |
20200312758 | Packages with Si-Substrate-Free Interposer and Method Forming Same | 2020-10-01 |
20200312759 | VARIABLE IN-PLANE SIGNAL TO GROUND REFERENCE CONFIGURATIONS | 2020-10-01 |
20200312760 | INTERPOSER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 2020-10-01 |
20200312761 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME | 2020-10-01 |
20200312762 | PACKAGING METHOD, PANEL ASSEMBLY, WAFER PACKAGE AND CHIP PACKAGE | 2020-10-01 |
20200312763 | CHIP PACKAGE STRUCTURE AND CHIP PACKAGE METHOD INCLUDING BARE CHIPS WITH CAPACITOR POLAR PLATE | 2020-10-01 |
20200312764 | INTERCONNECTS SEPARATED BY A DIELECTRIC REGION FORMED USING REMOVABLE SACRIFICIAL PLUGS | 2020-10-01 |
20200312765 | MEMORY DIE CONTAINING STRESS REDUCING BACKSIDE CONTACT VIA STRUCTURES AND METHOD OF MAKING THE SAME | 2020-10-01 |
20200312766 | INTEGRATED CIRCUIT PACKAGE WITH INTEGRATED VOLTAGE REGULATOR | 2020-10-01 |
20200312767 | INORGANIC-BASED EMBEDDED-DIE LAYERS FOR MODULAR SEMICONDUCTIVE DEVICES | 2020-10-01 |
20200312768 | CONTROLLED ORGANIC LAYERS TO ENHANCE ADHESION TO ORGANIC DIELECTRICS AND PROCESS FOR FORMING SUCH | 2020-10-01 |
20200312769 | INTERPOSER WITH STEP FEATURE | 2020-10-01 |
20200312770 | BOARD SUBSTRATES, THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORMING THE SAME | 2020-10-01 |
20200312771 | PATTERNABLE DIE ATTACH MATERIALS AND PROCESSES FOR PATTERNING | 2020-10-01 |
20200312772 | CHIP PACKAGE STRUCTURE AND CHIP PACKAGE METHOD | 2020-10-01 |
20200312773 | STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT FEATURE | 2020-10-01 |
20200312774 | SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME | 2020-10-01 |
20200312775 | SEMICONDUCTOR DEVICE HAVING A BARRIER LAYER MADE OF TWO DIMENSIONAL MATERIALS | 2020-10-01 |
20200312776 | PATTERNED WAFER SOLDER DIFFUSION BARRIER | 2020-10-01 |
20200312777 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE | 2020-10-01 |
20200312778 | Die Screening Using Inline Defect Information | 2020-10-01 |
20200312779 | CHIP PACKAGE METHOD AND CHIP PACKAGE STRUCTURE | 2020-10-01 |
20200312780 | PANEL LEVEL PACKAGING FOR DEVICES | 2020-10-01 |
20200312781 | METHOD TO IMPLEMENT WAFER-LEVEL CHIP-SCALE PACKAGES WITH GROUNDED CONFORMAL SHIELD | 2020-10-01 |
20200312782 | ELECTROMAGNETIC INTERFERENCE SHIELD CREATED ON PACKAGE USING HIGH THROUGHPUT ADDITIVE MANUFACTURING | 2020-10-01 |
20200312783 | SEMICONDUCTOR PACKAGE | 2020-10-01 |
20200312784 | IMAGE PICKUP APPARATUS AND CAMERA MODULE | 2020-10-01 |
20200312785 | CIRCUIT SYSTEMS | 2020-10-01 |
20200312786 | TECHNIQUES FOR THERMAL MATCHING OF INTEGRATED CIRCUITS | 2020-10-01 |
20200312787 | ELECTRONIC DEVICE PACKAGE WITH REDUCED THICKNESS VARIATION | 2020-10-01 |
20200312788 | COMPRESSIVE ZONE TO REDUCE DICING DEFECTS | 2020-10-01 |
20200312789 | SEMICONDUCTOR PACKAGE | 2020-10-01 |
20200312790 | SEMICONDUCTOR DEVICE PACKAGE WITH WARPAGE CONTROL STRUCTURE | 2020-10-01 |
20200312791 | Packaged Semiconductor Devices, Methods of Packaging Semiconductor Devices, and PoP Devices | 2020-10-01 |
20200312792 | SEMICONDUCTOR CHIP | 2020-10-01 |
20200312793 | ELECTRONIC DEVICE PACKAGE INCLUDING A CAPACITOR | 2020-10-01 |
20200312794 | PROCESS AND METHOD FOR ACHIEVING HIGH IMMUNITY TO ULTRAFAST HIGH VOLTAGE TRANSIENTS ACROSS INORGANIC GALVANIC ISOLATION BARRIERS | 2020-10-01 |
20200312795 | Packaging Substrate | 2020-10-01 |
20200312796 | SUBSTRATE INTEGRATED INDUCTORS USING HIGH THROUGHPUT ADDITIVE DEPOSITION OF HYBRID MAGNETIC MATERIALS | 2020-10-01 |
20200312797 | SEMICONDUCTOR PACKAGE | 2020-10-01 |
20200312798 | ANTENNA APPARATUS, ANTENNA MODULE, AND WIRELESS APPARATUS | 2020-10-01 |
20200312799 | TRIODE PACKAGING METHOD AND TRIODE | 2020-10-01 |
20200312800 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2020-10-01 |
20200312801 | SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME | 2020-10-01 |
20200312802 | SEMICONDUCTOR DEVICE | 2020-10-01 |
20200312803 | ALIGNED CORE BALLS FOR INTERCONNECT JOINT STABILITY | 2020-10-01 |
20200312804 | FILP CHIP PACKAGE | 2020-10-01 |
20200312805 | ANISOTROPIC CONDUCTIVE FILM (ACF) WITH CONTROLLABLE DISTRIBUTION STATE OF CONDUCTIVE SUBSTANCE AND MANUFACTURING METHOD THEREOF | 2020-10-01 |
20200312806 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE | 2020-10-01 |
20200312807 | CHIP PACKAGE STRUCTURE | 2020-10-01 |
20200312808 | COPPER ALLOY BONDING WIRE FOR SEMICONDUCTOR DEVICES | 2020-10-01 |
20200312809 | INTEGRATED CIRCUIT CHIP AND CONFIGURATION ADJUSTMENT METHOD FOR THE SAME | 2020-10-01 |
20200312810 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-10-01 |
20200312811 | CHIP BONDING APPARATUS, A SYSTEM FOR REPLACING BONDING TOOL ASSEMBLY, AND A METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE USING THE CHIP BONDING APPARATUS | 2020-10-01 |
20200312812 | SPACER FOR DIE-TO-DIE COMMUNICATION IN AN INTEGRATED CIRCUIT | 2020-10-01 |
20200312813 | SEMICONDUCTOR PACKAGE | 2020-10-01 |
20200312814 | THREE-DIMENSIONAL PACKAGING TECHNIQUES FOR POWER FET DENSITY IMPROVEMENT | 2020-10-01 |
20200312815 | DIFFUSED BITLINE REPLACEMENT IN STACKED WAFER MEMORY | 2020-10-01 |
20200312816 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME | 2020-10-01 |
20200312817 | HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS | 2020-10-01 |
20200312818 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME | 2020-10-01 |
20200312819 | LED DISPLAY MODULE AND METHOD OF MAKING THEREOF | 2020-10-01 |
20200312820 | DISPLAY PANEL AND METHOD FOR MANUFACTURING DISPLAY PANEL | 2020-10-01 |
20200312821 | ELECTRONIC DEVICE | 2020-10-01 |
20200312822 | DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME | 2020-10-01 |
20200312823 | LIGHT-EMITTING DEVICE | 2020-10-01 |
20200312824 | LIGHT EMITTING STRUCTURE TO AID LED LIGHT EXTRACTION | 2020-10-01 |
20200312825 | DISPLAY PANEL AND METHOD FOR FABRICATING THE SAME | 2020-10-01 |
20200312826 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 2020-10-01 |
20200312827 | OPTICAL SENSING CHIP PACKAGING STRUCTURE | 2020-10-01 |
20200312828 | DISPLAY DEVICE AND METHOD FOR FORMING THE SAME | 2020-10-01 |
20200312829 | DISPLAY APPARATUS | 2020-10-01 |
20200312830 | SEMICONDUCTOR MEMORY DEVICE HAVING WIRING LINE STRUCTURE | 2020-10-01 |
20200312831 | DISPLAY PANEL AND DISPLAY DEVICE | 2020-10-01 |
20200312832 | DISPLAY PANEL AND DISPLAY DEVICE HAVING AT LEAST ONE DISPLAY AREA REUSED AS A SENSOR RESERVED AREA | 2020-10-01 |
20200312833 | DISTRIBUTED SEMICONDUCTOR DIE AND PACKAGE ARCHITECTURE | 2020-10-01 |
20200312834 | BONDED NANOFLUIDIC DEVICE CHIP STACKS | 2020-10-01 |
20200312835 | PHOTOMASK DESIGN FOR GENERATING PLASMONIC EFFECT | 2020-10-01 |
20200312836 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2020-10-01 |
20200312837 | SEMICONDUCTOR DEVICE COMPRISING DEEP COUNTER WELL | 2020-10-01 |
20200312838 | DUAL MODE SNAP BACK CIRCUIT DEVICE | 2020-10-01 |