40th week of 2019 patent applcation highlights part 71 |
Patent application number | Title | Published |
20190304783 | TECHNIQUES FOR FORMING LOW STRESS ETCH-RESISTANT MASK USING IMPLANTATION | 2019-10-03 |
20190304784 | REDUCING IN-PLANE DISTORTION FROM WAFER TO WAFER BONDING USING A DUMMY WAFER | 2019-10-03 |
20190304785 | METHOD FOR FORMING EPITAXIAL LAYER AT LOW TEMPERATURE | 2019-10-03 |
20190304786 | METHOD OF FABRICATING TRANSISTORS, INCLUDING AMBIENT OXIDIZING AFTER ETCHINGS INTO BARRIER LAYERS AND ANTI-REFLECTING COATINGS | 2019-10-03 |
20190304787 | METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | 2019-10-03 |
20190304788 | NITRIDE SEMICONDUCTOR DEVICE | 2019-10-03 |
20190304789 | COPPER ELECTRODEPOSITION SEQUENCE FOR THE FILLING OF COBALT LINED FEATURES | 2019-10-03 |
20190304790 | METHOD OF FORMING AN ELECTRODE ON A SUBSTRATE AND A SEMICONDUCTOR DEVICE STRUCTURE INCLUDING AN ELECTRODE | 2019-10-03 |
20190304791 | Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording Medium | 2019-10-03 |
20190304792 | Interconnect Structure and Method of Forming the Same | 2019-10-03 |
20190304793 | SURFACE TREATMENT OF SILICON OR SILICON GERMANIUM SURFACES USING ORGANIC RADICALS | 2019-10-03 |
20190304794 | METHOD FOR ETCHING SHAPES INTO SILICON | 2019-10-03 |
20190304795 | METHODS OF FORMING SEMICONDUCTOR DEVICES | 2019-10-03 |
20190304796 | DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL LAYER AND STRUCTURE FORMED THEREBY | 2019-10-03 |
20190304797 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM | 2019-10-03 |
20190304798 | METHODS FOR CYCLIC ETCHING OF A PATTERNED LAYER | 2019-10-03 |
20190304799 | UNIFORM BACK SIDE EXPOSURE OF THROUGH-SILICON VIAS | 2019-10-03 |
20190304800 | METHOD OF PRODUCING WAFER AND APPARATUS FOR PRODUCING WAFER | 2019-10-03 |
20190304801 | ETCHING METHOD AND ETCHING APPARATUS | 2019-10-03 |
20190304802 | TERMINAL, MOLDED PRODUCT FOR POWER MODULE PROVIDED WITH TERMINAL, AND METHOD OF MANUFACTURING MOLDED PRODUCT FOR POWER MODULE PROVIDED WITH TERMINAL | 2019-10-03 |
20190304803 | Redistribution Structures for Semiconductor Packages and Methods of Forming the Same | 2019-10-03 |
20190304804 | METHOD OF DICING WIRING SUBSTRATE, AND PACKAGING SUBSTRATE | 2019-10-03 |
20190304805 | ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-10-03 |
20190304806 | METHOD FOR MANUFACTURING A MODULE AND AN OPTICAL MODULE | 2019-10-03 |
20190304807 | ELECTRONIC DEVICE WITH ADAPTIVE VERTICAL INTERCONNECT AND FABRICATING METHOD THEREOF | 2019-10-03 |
20190304808 | MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DISPENSE OF UNDERFILL BETWEEN A NARROW DIE-TO-DIE GAP | 2019-10-03 |
20190304809 | METHOD TO ENABLE INTERPOSER TO INTERPOSER CONNECTION | 2019-10-03 |
20190304810 | DRYING APPARATUS | 2019-10-03 |
20190304811 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM | 2019-10-03 |
20190304812 | Semiconductor Fabrication System Embedded with Effective Baking Module | 2019-10-03 |
20190304813 | COMPONENT FOR SEMICONDUCTOR PRODUCTION DEVICE | 2019-10-03 |
20190304814 | PLASMA PROCESSING APPARATUS | 2019-10-03 |
20190304815 | PLASMA PROCESSING APPARATUS | 2019-10-03 |
20190304816 | CHIP TRANSFER DEVICE AND CHIP TRANSFERING METHOD USING THE SAME | 2019-10-03 |
20190304817 | TRANSFER HEAD FOR MICRO LED | 2019-10-03 |
20190304818 | SYSTEM FOR TRANSFERRING MICRO LED | 2019-10-03 |
20190304819 | EFEM, EQUIPMENT FRONT END MODULE | 2019-10-03 |
20190304820 | IN-SITU WAFER TEMPERATURE MEASUREMENT AND CONTROL | 2019-10-03 |
20190304821 | SUBSTRATE RACK AND A SUBSTRATE PROCESSING SYSTEM AND METHOD | 2019-10-03 |
20190304822 | CONTAINER STORAGE AND CONTAINER STORAGE METHOD | 2019-10-03 |
20190304823 | SUBSTRATE PROCESSING APPARATUS | 2019-10-03 |
20190304824 | PLASMA PROCESSING APPARATUS AND METHOD OF TRANSFERRING WORKPIECE | 2019-10-03 |
20190304825 | DUAL TEMPERATURE HEATER | 2019-10-03 |
20190304826 | SYSTEMS AND METHODS FOR ORIENTATOR BASED WAFER DEFECT SENSING | 2019-10-03 |
20190304827 | BOND PROTECTION AROUND POROUS PLUGS | 2019-10-03 |
20190304828 | WAFER DEBONDING AND CLEANING APPARATUS | 2019-10-03 |
20190304829 | COMPOSITE SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-10-03 |
20190304830 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2019-10-03 |
20190304831 | EPITAXY SUBSTRATE AND METHOD OF MANUFACTURING THE SAME | 2019-10-03 |
20190304832 | Methods of Forming Integrated Circuitry | 2019-10-03 |
20190304833 | Conductive Feature Formation and Structure | 2019-10-03 |
20190304834 | Wet Cleaning with Tunable Metal Recess for VIA Plugs | 2019-10-03 |
20190304835 | Organometallic Precursors, Methods Of Forming A Layer Using The Same And Methods Of Manufacturing Semiconductor Devices Using The Same | 2019-10-03 |
20190304836 | SUBTRACTIVE INTERCONNECT FORMATION USING A FULLY SELF-ALIGNED SCHEME | 2019-10-03 |
20190304837 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | 2019-10-03 |
20190304838 | MANUFACTURING PROCESS OF ELEMENT CHIP | 2019-10-03 |
20190304839 | LASER PROCESSING METHOD | 2019-10-03 |
20190304840 | MULTI VOLTAGE THRESHOLD TRANSISTORS THROUGH PROCESS AND DESIGN-INDUCED MULTIPLE WORK FUNCTIONS | 2019-10-03 |
20190304841 | STRUCTURE AND METHOD OF FORMING FIN DEVICE HAVING IMPROVED FIN LINER | 2019-10-03 |
20190304842 | FINFET DEVICES AND METHOD OF FORMING THE SAME | 2019-10-03 |
20190304843 | MULTI-STEP INSULATOR FORMATION IN TRENCHES TO AVOID SEAMS IN INSULATORS | 2019-10-03 |
20190304844 | SEMICONDUCTOR STRUCTURES, STATIC RANDOM ACCESS MOMORIES, AND FABRICATION METHODS THEREOF | 2019-10-03 |
20190304845 | CO-INTEGRATION OF TENSILE SILICON AND COMPRESSIVE SILICON GERMANIUM | 2019-10-03 |
20190304846 | METHOD FOR PATTERNING A LANTHANUM CONTAINING LAYER | 2019-10-03 |
20190304847 | Apparatuses Having an Interconnect Extending from an Upper Conductive Structure, Through a Hole in Another Conductive Structure, and to an Underlying Structure | 2019-10-03 |
20190304848 | NANOSHEET DEVICES WITH DIFFERENT TYPES OF WORK FUNCTION METALS | 2019-10-03 |
20190304849 | SELECTIVE INCLUSION/EXCLUSION OF SEMICONDUCTOR CHIPS IN ACCELERATED FAILURE TESTS | 2019-10-03 |
20190304850 | APPARATUS FOR USE IN FORMING AN ADAPTIVE LAYER AND A METHOD OF USING THE SAME | 2019-10-03 |
20190304851 | SAMPLE INSPECTION USING TOPOGRAPHY | 2019-10-03 |
20190304852 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MOUNTING DEVICE | 2019-10-03 |
20190304853 | INSPECTION METHOD FOR MICRO LED | 2019-10-03 |
20190304854 | INSPECTION AND REPLACEMENT METHOD FOR MICRO LED | 2019-10-03 |
20190304855 | APPARATUSES AND METHODS FOR COUPLING CONTACT PADS TO A CIRCUIT IN A SEMICONDUCTOR DEVICE | 2019-10-03 |
20190304856 | TEST ELEMENT GROUP AND SEMICONDUCTOR WAFER INCLUDING THE SAME | 2019-10-03 |
20190304857 | Power Semiconductor Device Module Having Mechanical Corner Press-Fit Anchors | 2019-10-03 |
20190304858 | SEMICONDUCTOR PACKAGE SYSTEM | 2019-10-03 |
20190304859 | SEMICONDUCTOR PACKAGE | 2019-10-03 |
20190304860 | Stress Tuned Stiffeners for Micro Electronics Package Warpage Control | 2019-10-03 |
20190304861 | METHOD AND CURABLE COMPOUND FOR CASTING ELECTRONIC COMPONENTS OR COMPONENT GROUPS | 2019-10-03 |
20190304862 | SEMICONDUCTOR PACKAGE | 2019-10-03 |
20190304863 | FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS | 2019-10-03 |
20190304864 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2019-10-03 |
20190304865 | STACKED CIRCUIT PACKAGE WITH MOLDED BASE HAVING LASER DRILLED OPENINGS FOR UPPER PACKAGE | 2019-10-03 |
20190304866 | SEMICONDUCTOR APPARATUS, METHOD FOR MANUFACTURING THE SAME AND ELECTRIC POWER CONVERSION DEVICE | 2019-10-03 |
20190304867 | SEMICONDUCTOR APPARATUS | 2019-10-03 |
20190304868 | ENERGY SUPPLY | 2019-10-03 |
20190304869 | SCALABLE DEBRIS-FREE SOCKET LOADING MECHANISM | 2019-10-03 |
20190304870 | MECHANISM COMBINING FASTENER CAPTIVATION AND ASSEMBLY TILT CONTROL FOR MICROPROCESSOR THERMAL SOLUTIONS | 2019-10-03 |
20190304871 | METHOD AND APPARATUS FOR DETACHING A MICROPROCESSOR FROM A HEAT SINK | 2019-10-03 |
20190304872 | POWER CONVERSION APPARATUS | 2019-10-03 |
20190304873 | HEATSINK FOR ELECTRICAL CIRCUITRY | 2019-10-03 |
20190304874 | COOLING APPARATUS, SEMICONDUCTOR MODULE, AND VEHICLE | 2019-10-03 |
20190304875 | SEMICONDUCTOR DEVICE | 2019-10-03 |
20190304876 | FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS WITH REDISTRIBUTION LAYER PACKAGING AND METHODS OF ASSEMBLING SAME | 2019-10-03 |
20190304877 | FILLING MATERIALS AND METHODS OF FILLING THROUGH HOLES OF A SUBSTRATE | 2019-10-03 |
20190304878 | ELECTRONIC DEVICE, SUBSTRATE, AND ELECTRONIC COMPONENT | 2019-10-03 |
20190304879 | SEMICONDUCTOR DEVICE AND METHOD FORMANUFACTURING THE SAME | 2019-10-03 |
20190304880 | SEMICONDUCTOR MODULE | 2019-10-03 |
20190304881 | Methods and Apparatus for a Semiconductor Device Having Bi-Material Die Attach Layer | 2019-10-03 |
20190304882 | POWER MODULE AND MANUFACTURING METHOD THEREOF | 2019-10-03 |