40th week of 2012 patent applcation highlights part 19 |
Patent application number | Title | Published |
20120248592 | LEAD COMPONENT AND METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE - To provide an inexpensive lead component which can be easily connected to a semiconductor chip and which has satisfactory connectability. There is provided a lead component including a base material having a connection part for connecting to a semiconductor chip, comprising: a solder part having a Zn layer made of a Zn-bonding material rolled and clad-bonded on the base material, and an Al layer made of an Al-bonding material rolled and clad-bonded on the Zn layer, in a prescribed region including the connection part on the base material; and the solder part further comprising a metal thin film composed of one kind or two kinds or more of Au, Ag, Cu, Ni, Pd, and Pt covering a surface of the Al layer. | 2012-10-04 |
20120248593 | PACKAGE STRUCTURE FOR DC-DC CONVERTER - A package structure for DC-DC converter disclosed herein can reduce the number of encapsulated elements as a low-side MOSFET chip can be stacked above the high-side MOSFET chip of a first die pad, through die pads of different thicknesses or interposers with joint parts of different thicknesses; moreover, it further reduces the size of the entire semiconductor package as a number of bond wires are contained in the space between the controller and the low-side MOSFET chip. Moreover, electrical connection between the top source electrode pin and the bottom source electrode pin of the low-side MOSFET chip is realized with a metal joint plate, such that when the DC-DC converter is sealed with plastic, the metal joint plate can be exposed outside to improve the thermal performance and effectively reduce the thickness of the semiconductor package. | 2012-10-04 |
20120248594 | JUNCTION BOX AND MANUFACTURING METHOD THEREOF - The present disclosure relates to a junction box and a manufacturing method thereof. The junction box includes terminal member to which electric energy is supplied, a diode provided to the terminal member, and a heat sink brought into close contact with the diode by molding. The junction box may prevent malfunction and failure while achieving size reduction thereof. | 2012-10-04 |
20120248595 | SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A method of manufacturing a semiconductor device, the method including, providing a first monocrystalline layer including semiconductor regions, overlaying the first monocrystalline layer with an isolation layer, transferring a second monocrystalline layer comprising semiconductor regions to overlay the isolation layer, wherein the first monocrystalline layer and the second monocrystalline layer are formed from substantially different crystal materials; and subsequently etching the second monocrystalline layer as part of forming at least one transistor in the second monocrystalline layer. | 2012-10-04 |
20120248596 | Semiconductor Device and Method of Forming Thermally Conductive Layer Between Semiconductor Die and Build-Up Interconnect Structure - A semiconductor device has a thermally conductive layer with a plurality of openings formed over a temporary carrier. The thermally conductive layer includes electrically non-conductive material. A semiconductor die has a plurality of bumps formed over contact pads on the die. The semiconductor die is mounted over the thermally conductive layer so that the bumps are disposed at least partially within the openings in the thermally conductive layer. An encapsulant is deposited over the die and thermally conductive layer. The temporary carrier is removed to expose the bumps. A first interconnect structure is formed over the encapsulant, semiconductor die, and bumps. The bumps are electrically connected to the first interconnect structure. A heat sink or shielding layer can be formed over the semiconductor die. A second interconnect structure can be formed over the encapsulant and electrically connected to the first interconnect structure through conductive vias formed in the encapsulant. | 2012-10-04 |
20120248597 | SEMICONDUCTOR DEVICE WITH STOP LAYERS AND FABRICATION METHOD USING CERIA SLURRY - The present invention provides a method of fabricating a semiconductor device including forming stop layers ( | 2012-10-04 |
20120248598 | SEMICONDUCTOR BONDING APPARATUS - An apparatus includes a tool head configured for bonding to establish 100 or more electrical and mechanical connections between a silicon chip having a thickness of about 50 microns (μm) or smaller and a substrate, wherein 100 or more solder bumps set on a plurality of contacts on the silicon chip or a plurality of contacts on the substrate are melted by heating between the plurality of contacts of the silicon chip and the substrate, and wherein the melted solder bumps are solidified by cooling using forced convection of air flowing from around the silicon chip. The tool head includes a pyrolytic graphite sheet configured to be used in direct contact with the silicon chip, and having a thickness between about 75 μm and 125 μm. | 2012-10-04 |
20120248599 | RELIABLE SOLDER BUMP COUPLING WITHIN A CHIP SCALE PACKAGE - In one general aspect, an apparatus can include a semiconductor substrate including at least one semiconductor device, and a metal layer disposed on the semiconductor substrate. The apparatus can include a nonconductive layer defining an opening and having a cross-sectional portion of the nonconductive layer defining a protrusion disposed over a recess in the metal layer, and can include a solder bump having a portion disposed between the metal layer and the protrusion defined by the nonconductive layer. | 2012-10-04 |
20120248600 | SEMICONDUCTOR DEVICE HAVING PLURAL STACKED CHIPS - Disclosed herein is a device including a substrate and first and second chips stacked on the substrate. The first and second chips have penetration electrodes that are penetrating therethrough. Power terminals of the first and second chips are connected to each other and arranged in a first arrangement pitch. Signal terminals of the first and second chips are connected to each other and arranged in a second arrangement pitch that is smaller than the first arrangement pitch. | 2012-10-04 |
20120248601 | Semiconductor Device and Method of Forming a Land Grid Array Flip Chip Bump System - A semiconductor device has a semiconductor wafer with a plurality of semiconductor die including a plurality of contact pads. An insulating layer is formed over the semiconductor wafer and contact pads. An under bump metallization (UBM) is formed over and electrically connected to the plurality of contact pads. A mask is disposed over the semiconductor wafer with a plurality of openings aligned over the plurality of contact pads. A conductive bump material is deposited within the plurality of openings in the mask and onto the UBM. The mask is removed. The conductive bump material is reflowed to form a plurality of bumps with a height less than a width. The plurality of semiconductor die is singulated. A singulated semiconductor die is mounted to a substrate with bumps oriented toward the substrate. Encapsulant is deposited over the substrate and around the singulated semiconductor die. | 2012-10-04 |
20120248602 | SEMICONDUCTOR DEVICE - In this semiconductor device, the through-hole is formed in the substrate, and is located under the conductive pattern. The insulating layer is located at the bottom surface of the through-hole. The conductive pattern is located on one surface side of the substrate. The opening pattern is formed in the insulating layer which is located between the through-hole and the conductive pattern, where the distance r | 2012-10-04 |
20120248603 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - To provide a technique capable of positioning of a semiconductor chip and a mounting substrate with high precision by improving visibility of an alignment mark. In a semiconductor chip constituting an LCD driver, a mark is formed in an alignment mark formation region over a semiconductor substrate. The mark is formed in the same layer as that of an uppermost layer wiring (third layer wiring) in an integrated circuit formation region. Then, in the lower layer of the mark and a background region surrounding the mark, patterns are formed. At this time, the pattern P | 2012-10-04 |
20120248604 | SELECTIVE ELECTROMIGRATION IMPROVEMENT FOR HIGH CURRENT C4S - The invention includes embodiments of a method for designing a flip chip and the resulting structure. The starting point is a flip chip with a semiconductor substrate, one or more wiring levels, and a plurality of I/O contact pads (last metal pads/bond pads) for receiving and sending electrical current. There is also a plurality of C4 bumps for connecting the I/O contact pads to another substrate. Then it is determined which of the C4s of the plurality of C4 bumps have a level of susceptibility to electromigration damage that meets or exceeds a threshold level of susceptibility, and in response, plating a conductive structure with a high electrical current carrying capacity (such as a copper pillar, copper pedestal, or partial copper pedestal) onto the corresponding I/O contact pads and adding a solder ball to a top portion of the conductive structure. The resulting structure is a flip chip wherein only a select few C4 bumps use enhanced C4s (such as copper pedestals) reducing the chance of defects. | 2012-10-04 |
20120248605 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes an electrode (electrode pad), an insulation film (for example, protective resin film) formed over the electrode and having an opening for exposing the electrode. The semiconductor device further includes an under bump metal (UBM layer) formed over the insulation film and connected by way of the opening 5 | 2012-10-04 |
20120248606 | INTEGRATED CIRCUIT DEVICE - An integrated circuit device including a substrate, a first internal bonding pad, a second internal bonding pad, an external bonding pad and a bonding wire is provided. A first circuit, a second circuit, at least one interconnect line and an electrostatic discharge protection circuit are embedded in the substrate. The first internal bonding pad is disposed on a surface of the substrate and electrically connected to the first circuit. The second internal bonding pad is disposed on the surface of the substrate and electrically connected to the second circuit. The first internal bonding pad is electrically connected to the second internal bonding pad via the bonding wire. The first internal bonding pad is electrically connected to the electrostatic discharge protection circuit via the interconnect line. The electrostatic discharge protection circuit is electrically connected to the external bonding pad which is used for electrically connecting an external package lead. | 2012-10-04 |
20120248607 | Semiconductor die having fine pitch electrical interconnects - A die has interconnect pads on an interconnect side near an interconnect edge and has at least a portion of the interconnect side covered by a conformal dielectric coating, in which an interconnect trace over the dielectric coating forms a high interface angle with the surface of the dielectric coating. Because the traces have a high interface angle, a tendency for the interconnect materials to “bleed” laterally is mitigated and contact or overlap of adjacent traces is avoided. The interconnect trace includes a curable electrically conductive interconnect material; that is, it includes a material that can be applied in a flowable form, and thereafter cured or allowed to cure to form the conductive traces. Also, a method includes, prior to forming the traces, subjecting the surface of the conformal dielectric coating with a CF | 2012-10-04 |
20120248608 | SELF-FORMING, SELF-ALIGNED BARRIERS FOR BACK-END INTERCONNECTS AND METHODS OF MAKING SAME - Processes of forming an insulated wire into an interlayer dielectric layer (ILD) of a back-end metallization includes thermally treating a metallic barrier precursor under conditions to cause at least one alloying element in the barrier precursor to form a dielectric barrier between the wire and the ILD. The dielectric barrier is therefore a self-forming, self-aligned barrier. Thermal processing is done under conditions to cause the at least one alloying element to migrate from a zone of higher concentration thereof to a zone of lower concentration thereof to further form the dielectric barrier. Various apparatus are made by the process. | 2012-10-04 |
20120248609 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - An object of the invention is to fully fill a wiring material in via holes formed in a low-hardness interlayer insulating film and a high-hardness interlayer insulating film, respectively, upon forming a Cu wiring in interlayer insulating films by using the dual damascene process. According to the invention, a second interlayer insulating film has therein both a wiring trench and a via hole. The via hole has, at the opening portion thereof, a recess portion having a tapered cross-sectional shape. It is formed by causing the second interlayer insulating film to retreat obliquely downward. The diameter of the opening portion of the via hole therefore becomes greater than the diameter of a region below the opening portion and it becomes possible to fully fill a wiring material in the via hole even if the via hole has a fine diameter. | 2012-10-04 |
20120248610 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - According to one embodiment, a semiconductor memory device comprises: a semiconductor substrate; a first contact plug and a second contact plug on the semiconductor substrate; a first bit line being in contact with the first contact plug; and a second bit line on the second contact plug, wherein the first contact plug is in contact with a top surface of the first bit line and is electrically insulated from the second bit line, and a bottom surface of the second bit line is higher in height than the top surface of the first bit line. | 2012-10-04 |
20120248611 | INTERCONNECTING STRUCTURE PRODUCTION METHOD, AND INTERCONNECTING STRUCTURE - An interconnecting structure production method includes providing a substrate, forming a semiconductor layer on the substrate, forming a doped semiconductor layer on the semiconductor layer, the doped semiconductor layer containing a dopant, forming an oxide layer in a surface of the doped semiconductor layer by heating the surface of the doped semiconductor layer in atmosphere of an oxidizing gas with a water molecule contained therein, forming an alloy layer on the oxide layer, and forming an interconnecting layer on the alloy layer. | 2012-10-04 |
20120248612 | METHOD FOR THE PRODUCTION OF AN ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT PRODUCED ACCORDING TO THIS METHOD - The invention relates to an electronic component having a GaAs semiconductor substrate (HS), semiconductor components (BE) being implemented on the front side thereof, and the back side thereof having a multilayer backside metallization (RM), wherein an advantageous construction of the layer sequence of the backside metallization is proposed, the backside metallization in particular comprising an Au layer as a bonding layer. | 2012-10-04 |
20120248613 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - For simplifying the dual-damascene formation steps of a multilevel Cu interconnect, a formation step of an antireflective film below a photoresist film is omitted. Described specifically, an interlayer insulating film is dry etched with a photoresist film formed thereover as a mask, and interconnect trenches are formed by terminating etching at the surface of a stopper film formed in the interlayer insulating film. The stopper film is made of an SiCN film having a low optical reflectance, thereby causing it to serve as an antireflective film when the photoresist film is exposed. | 2012-10-04 |
20120248614 | METHODS FOR FORMING A SEMICONDUCTOR STRUCTURE AND RELATED STRUCTURES - Methods of forming a Ni material on a bond pad are disclosed. The methods include forming a dielectric material over a bond pad, forming an opening within the dielectric material to expose the bond pad, curing the dielectric material to form a surface of the dielectric material having a steep curvilinear profile, and forming a nickel material over the at least one bond pad. The dielectric material having a steep curvilinear profile may be formed by altering at least one of a curing process of the dielectric material and a thickness of the dielectric material. The dielectric material may be used to form a relatively thick Ni material on bond pads smaller than about 50 μm. Semiconductor structures formed by such methods are also disclosed. | 2012-10-04 |
20120248615 | MEMS DEVICE AND MANUFACTURING PROCESS THEREOF - A manufacturing process of a MEMS device divides a substrate for fabricating a MEMS component into two electrically isolated regions, so that the MEMS component and the circuit disposed on its surface could connect electrically with another substrate below respectively through the corresponding conducing regions, whereby the configuration of the electrical conducting paths and the manufacturing process are simplified. A MEMS device manufactured by using the aforementioned process is also disclosed herein. | 2012-10-04 |
20120248616 | ELECTRONIC COMPONENT, ELECTRONIC EQUIPMENT, AND SOLDERING PASTE - To provide an electronic component, containing: a wiring board containing electrode pads; a component including a plurality of electrodes, the component being mounted on the wiring board; a sealing resin covering the component; and a plurality of terminals configured to connect a wiring provided within the wiring board to an external substrate, wherein the plurality of electrodes and the electrode pads are connected with solder, and wherein a first resin layer and a second resin layer are provided between the solder and the sealing resin in this order from the side of the solder, where the first resin layer has a first Young's modulus and the second resin layer has a second Young's modulus larger than the first Young's modulus. | 2012-10-04 |
20120248617 | MULTILAYERED LOW k CAP WITH CONFORMAL GAP FILL AND UV STABLE COMPRESSIVE STRESS PROPERTIES - The present disclosure provides a multilayered cap (i.e., migration barrier) that conforms to the substrate (i.e., interconnect structure) below. The multilayered cap, which can be located atop at least one interconnect level of an interconnect structure, includes, from bottom to top, a first layer comprising silicon nitride and a second layer comprising at least one of boron nitride and carbon boron nitride. | 2012-10-04 |
20120248618 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The semiconductor device includes: a semiconductor substrate; an insulating film provided on a surface of the semiconductor substrate; a porous metal film provided on the insulating film; a protective film provided on the porous metal film, and having an opening portion for defining a pad region; and a wire wire-bonded to the porous metal film in the pad region. The stress generated by the impact of wire-bonding is mostly absorbed in the porous metal film owing to the distortion of the porous metal film, preventing generation of cracks in the insulating film. | 2012-10-04 |
20120248619 | CHIP PACKAGING STRUCTURE - A chip packaging structure includes a flexible plate, a chip, and a plurality of leads. The chip is disposed on the flexible plate. A first boundary and a second boundary are defined on the flexible plate. The first boundary is located between the chip and the second boundary. A first area is formed between the first boundary and the chip. A second area is formed between the first boundary and the second boundary. The chip includes a plurality of signal conducting points and a plurality of non-signal conducting points. The plurality of leads are disposed on the flexible plate and include a plurality of signal leads and a plurality of non-signal leads. The width of the non-signal lead is smaller than the width of the signal lead extending out of the second boundary. | 2012-10-04 |
20120248620 | SEMICONDUCTOR DEVICE - The semiconductor device | 2012-10-04 |
20120248621 | METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS - Methods of forming bonded semiconductor structures include providing a first semiconductor structure including a device structure, bonding a second semiconductor structure to the first semiconductor structure below about 400° C., forming a through wafer interconnect through the second semiconductor structure and into the first semiconductor structure, and bonding a third semiconductor structure to the second semiconductor structure on a side thereof opposite the first semiconductor structure. In additional embodiments, a first semiconductor structure is provided. Ions are implanted into a second semiconductor structure. The second semiconductor structure is bonded to the first semiconductor structure. The second semiconductor structure is fractured along an ion implant plane, a through wafer interconnect is formed at least partially through the first and second semiconductor structures, and a third semiconductor structure is bonded to the second semiconductor structure on a side thereof opposite the first semiconductor structure. Bonded semiconductor structures are formed using such methods. | 2012-10-04 |
20120248622 | METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES INCLUDING TWO OR MORE PROCESSED SEMICONDUCTOR STRUCTURES CARRIED BY A COMMON SUBSTRATE, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS - Methods of forming semiconductor devices include providing a substrate including a layer of semiconductor material on a layer of electrically insulating material. A first metallization layer is formed over a first side of the layer of semiconductor material. Through wafer interconnects are formed at least partially through the substrate. A second metallization layer is formed over a second side of the layer of semiconductor material opposite the first side thereof. An electrical pathway is provided that extends through the first metallization layer, the substrate, and the second metallization layer between a first processed semiconductor structure carried by the substrate on the first side of the layer of semiconductor material and a second processed semiconductor structure carried by the substrate on the first side of the layer of semiconductor material. Semiconductor structures are fabricated using such methods. | 2012-10-04 |
20120248623 | VIA NETWORK STRUCTURES AND METHOD THEREFOR - A circuit device is configured with robust circuit connectors. In connection with various example embodiments, an integrated circuit device includes one or more via network layers below a bond pad contact, connecting the bond pad contact with one or more underlying metal layers. Each via network layer includes a plurality of via strips extending about parallel to the bond pad contact and in different directions to structurally support the bond pad contact. | 2012-10-04 |
20120248624 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - According to one embodiment, a first back surface of a first substrate and a second front surface of a second substrate are jointed together so as to connect a first conductor with a second conductor. The first conductor includes a portion having a diameter equal to that of a first gap formed above a first metal layer in a range between the first metal layer and a first front surface, and a portion having a diameter greater than that of the first gap and smaller than an outer diameter of the first metal layer in a range between the first metal layer and the first back surface. A first insulating layer has a gap formed above the first metal layer, the gap being greater than the first gap and smaller than the outer diameter of the first metal layer. | 2012-10-04 |
20120248625 | SEMICONDUCTOR PACKAGE COMPRISING AN OPTICAL SEMICONDUCTOR DEVICE - A semiconductor package includes a transmissive support plate and includes at least one elongate hole. An integrated circuit semiconductor device is mounted on a rear face of the support plate. The semiconductor device includes first and second optical elements oriented towards the rear face of the support plate, where the first and second optical elements are placed on either side of the elongate hole. An encapsulation material made of an opaque material encapsulates the semiconductor device and fills the elongate hole so as to form an optical insulation partition between the first and second optical elements. A cavity is left, however, between each optical element and a rear face of the support plate. | 2012-10-04 |
20120248626 | METHODS FOR PACKAGING MICROELECTRONIC DEVICES AND MICROELECTRONIC DEVICES FORMED USING SUCH METHODS - Methods for packaging microelectronic devices and microelectronic devices formed using such methods are disclosed herein. One aspect of the invention is directed toward a method for packaging a microelectronic device that includes coupling an active side of a microelectronic die to a surface of a support member. The microelectronic die can have a backside opposite the active side, a peripheral side extending at least part way between the active side and the backside, and at least one through-wafer interconnect. The method can further include applying an encapsulant to cover a portion of the surface of the support member so that a portion of the encapsulant is laterally adjacent to the peripheral side, removing material from a backside of the microelectronic die to expose a portion of at least one through-wafer interconnect, and applying a redistribution structure to the backside of the microelectronic die. | 2012-10-04 |
20120248627 | HEAT CONDUCTION FOR CHIP STACKS AND 3-D CIRCUITS - A semiconductor device assembly and method can include a single semiconductor layer or stacked semiconductor layers, for example semiconductor wafers or wafer sections (semiconductor dice). On each semiconductor layer, a diamond layer formed therethrough can aid in the routing and dissipation of heat. The diamond layer can include a first portion on the back of the semiconductor layer, and one or more second portions which extend vertically into the semiconductor layer, for example completely through the semiconductor layer. Thermal contact can then be made to the diamond layer to conduct heat away from the one or more semiconductor layers. A conductive via can be formed through the diamond layers to provide signal routing and heat dissipation capabilities. | 2012-10-04 |
20120248628 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - According to one embodiment, a semiconductor device includes a control element provided above a main surface of a substrate through a first adhesion layer, a second adhesion layer provided to cover the control element a first semiconductor chip provided on the second adhesion layer, a bottom surface area of the first semiconductor chip being larger than a top surface area of the control element, and at least one side of an outer edge of the control element projecting to an outside of an outer edge of the first semiconductor chip. | 2012-10-04 |
20120248629 | SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device including forming a micro-chip comprising a thinned-wafer having one or more components fabricated thereon disposed between a carrier and a semiconductor chip, the micro-chip being electrically connected to the semiconductor chip under a higher consumption macro of the semiconductor chip and including a thickness which is less than a thickness of the semiconductor chip, forming an interconnect between the semiconductor chip and the carrier, forming an interconnect between the micro-chip and the semiconductor chip, and forming an interconnect between the micro-chip and the carrier. The micro-chip includes a thinned micro-chip having a thickness of less than 20 microns and the semiconductor chip includes plural semiconductor chips formed as a chip stack. The micro-chip includes a plurality of micro-chips formed on the plural semiconductor chips, such that the semiconductor device is a three-dimensional integrated circuit. | 2012-10-04 |
20120248630 | HYBRID INTEGRATED CIRCUIT DEVICE, AND METHOD FOR FABRICATING THE SAME, AND ELECTRONIC DEVICE - A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include ones which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals. | 2012-10-04 |
20120248631 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES HAVING A GLASS SUBSTRATE - A method for manufacturing semiconductor devices is disclosed. A semiconductor wafer is provided having a first surface and a second surface opposite to the first surface. A first glass substrate is provided which has at least one of cavities and openings at the bonding surface. The first glass substrate is bonded to the first surface of the semiconductor wafer such that the metal pads are arranged within respective cavities or openings of the first glass substrate. The second surface of the semiconductor wafer is machined. At least one metallisation region is formed on the machined second surface of the semiconductor wafer. | 2012-10-04 |
20120248632 | PHOTOSENSITIVE ADHESIVE COMPOSITION, FILM-LIKE ADHESIVE, ADHESIVE SHEET, ADHESIVE PATTERN, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE - The present invention relates to a photosensitive adhesive composition that has thermal press bondability to an adherent after being patterned by exposure and development and enables alkali development, wherein a storage elastic modulus at 110° C. after exposure and further heat curing is not less than 10 MPa. | 2012-10-04 |
20120248633 | THIN-FILM DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING IMAGE DISPLAY APPARATUS - There is provided a method of manufacturing a thin-film device, the method including forming a first substrate on a supporting base by a coating method, the first substrate being formed by using a resin material; forming a second substrate on the first substrate by using any one of a thermosetting resin and energy ray-curable resin; forming an active element on the second substrate; and removing the supporting base from the first substrate. The resin material used to form the first substrate has a glass transition temperature of at least 180° C. | 2012-10-04 |
20120248634 | METHOD FOR MANUFACTURING FILM-LIKE ADHESIVE, ADHESIVE SHEET, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - The method for manufacturing a film-like adhesive according to the present invention includes: applying an adhesive composition comprising (A) a radiation-polymerizable compound, (B) a photoinitiator and (C) a thermosetting resin, and having a solvent content of 5% by mass or lower and being liquid at 25° C., on a base material to thereby form an adhesive composition layer; and irradiating the adhesive composition layer with light to thereby form the film-like adhesive. | 2012-10-04 |
20120248635 | CORRUGATED PACKING GRID AND STRUCTURED PACKING ASSEMBLED FROM SEVERAL PACKING GRIDS - The invention relates to a corrugated packing grid with consecutively arranged wave crests and wave troughs for a structured packing, which is assembled from several packing grids, for gas-liquid contacting apparatuses, and to a packing assembled from said packing grids. The aim of the invention is to provide a packing grid and a packing which have a large mass transfer area and a low pressure drop at the same time and which offer a high mechanical strength. According to the invention, this is achieved in that elements lie in the region of the wave troughs of the packing grid, said elements extending into the wave troughs. | 2012-10-04 |
20120248636 | HEATER UNIT HUMIDIFICATION CHAMBER MONITOR - A heater unit is adapted to determine if a humidification chamber thermally coupled to a hot plate of the heater unit is effectively dry based on determining a thermal response of a hot plate of the heater unit. Also, the activation period during which the hot plate is being heated is adjusted toward an optimum period by adjusting the energization or power level to the heater element thereof in relation to the duration of a prior activation period. Further, the air flow rate of gas through the humidification chamber may be estimated based on a temperature of the hot plate determined in predetermined relationship to the beginning of an activation period. | 2012-10-04 |
20120248637 | METHODS AND DEVICES FOR MANUFACTURING AN ARRAY OF LENSES - The present technology relates generally to the manufacturing of optical lenses used in the fabrication of optical modules, such as for miniature camera, as the camera used in mobile phones. More particularly, the present technology relates to devices and methods for manufacturing arrays of lenses. | 2012-10-04 |
20120248638 | MOLDING DIES AND METHOD FOR MANUFACTURING SAID MOLDING DIES - The material of core supporting members ( | 2012-10-04 |
20120248639 | MICROENCAPSULATED CURING AGENT - A curing agent for unsaturated polyester resins is made by microencapsulating an organic peroxide curing agent in a polyurethane protective coating or shell. | 2012-10-04 |
20120248640 | METHOD FOR PRODUCING ETHYLENE-VINYL ALCOHOL COPOLYMER RESIN, ETHYLENE-VINYL ALCOHOL COPOLYMER RESIN, AND MULTILAYER STRUCTURE - Provided is by the present invention is a method for producing an EVOH resin having sufficient long-run workability in melt molding and enabling prevention of coloring such as yellowing, an EVOH resin obtained by this method for production, and a laminate obtained from this resin. | 2012-10-04 |
20120248641 | ACRYLONITRILE-SILAZANE COPOLYMERS, ESPECIALLY IN FIBER FORM, PROCESS FOR PREPARATION THEREOF AND USE THEREOF - The present invention pertains to a copolymer obtained by reacting a mixture of acrylonitrile or of a mixture of acrylonitrile and an organic molecule that can be copolymerized with acrylonitrile, with which a monomeric, oligomeric and/or polymeric silazane can be obtained, said silazane containing at least one vinylic double bond. The copolymer can be brought into fiber form and/or made infusible. The production of ceramic fibers by pyrolysis is possible with fiber-like copolymers. | 2012-10-04 |
20120248642 | Lithium silicate glass ceramic and glass with ZrO2 content - Lithium silicate glass ceramics and glasses are described which can advantageously be applied to zirconium oxide ceramics in particular by pressing-on in the viscous state and form a solid bond with these. | 2012-10-04 |
20120248643 | APPARATUS FOR PLUGGING HONEYCOMB BODIES AND METHODS - An apparatus for plugging honeycomb bodies includes a controller configured to signal a plugging actuator to move a plugging piston from the predetermined start position to an extended position while a shutter plate is in an open orientation, wherein at least about 50% of the predetermined volume of plugging material is discharged from a dispensing area during a single plugging cycle. The controller is still further configured to signal a control actuator of a plugging material control module to adjust a position of a control piston within a control chamber to maintain a pressure of the plugging material within the dispensing area from between greater than 0 psi to about 200 psi when the shutter plate is moved between a closed orientation and the open orientation at the beginning of the plugging cycle. Further examples include methods of plugging a honeycomb body with a plugging material control module. | 2012-10-04 |
20120248644 | INJECTION MOLDING FLOW CONTROL APPARATUS AND METHOD - An apparatus for controlling the rate of flow to a mold cavity including a controller instructing a valve system to drive an actuator and a valve pin and including instructions that instruct the valve system to drive an actuator and a valve pin and including instructions that instruct the valve system to move from a start position to one or more intermediate drive rate positions and subsequently from the one or more intermediate drive rate positions to a high drive rate position on receipt by the controller of a signal from a position sensor that is indicative of the valve pin having reached a second position. | 2012-10-04 |
20120248645 | PRODUCTION OF EXTRUDED FOAM - A method of producing a laminated body of structural thermoplastic foam, the method comprising the step of successively extruding a plurality of foam layers from an extrusion die, each next layer being extruded onto a previously extruded layer to form a stack of mutually bonded layers. | 2012-10-04 |
20120248646 | Method for Making A Soft Thin Mat - A method for making a mat includes preparing a primary material and a secondary material, mixing the primary material and the secondary material, binding the primary material and the secondary material, thermosetting the primary material and the secondary material to form a molding material of a soft thin substrate layer, combining a cloth surface layer and a waterproof film to form a combination, placing the combination of the cloth surface layer and the waterproof film in a mold, filling the molding material of the soft thin substrate layer into the mold, and injection molding the molding material in the mold to combine the molding material with the combination of the cloth surface layer and the waterproof film so as to form a mat which comprises the soft thin substrate layer, the cloth surface layer and the waterproof film. | 2012-10-04 |
20120248647 | METHOD FOR PRODUCING POLYETHYLENE TEREPHTHALATE - A method for producing polyethylene terephthalate (PETG) includes the steps of mixing PETG particles and at least one additive raw material to form a mixed raw material; kneading the mixed raw material to form a gelatinized raw material; fluxing the gelatinized raw material; filtering the gelatinized raw material thus fluxed; secondarily fluxing the gelatinized raw material thus filtered to form a plastic dough; calendering the plastic dough to form a plastic fabric; embossing the plastic fabric; cooling the plastic fabric; and cutting the plastic fabric. Therefore, the aforesaid production method can produce PETG for use as an environmentally friendly material, in a manner that meets environmental protection needs, is suitable for the use in different locations, and reduces consumption of resources. | 2012-10-04 |
20120248648 | SELF-RETAINERS WITH SUPPORTING STRUCTURES ON A SUTURE - In embodiments of the invention, a manufacturing process produces and an. Article produced has a self-retaining suture wherein a force is used to squeeze the suture causing retainers to form out of material from the suture body. In an embodiment of the invention, fins are formed between the retainers and the suture body, wherein said fins support the retainers. In another embodiment, retainer stops are provided in order to prevent the retainer from settling back in the body of the suture. | 2012-10-04 |
20120248649 | PROCESS FOR MAKING AN EMBOSSED WEB - A process for making an embossed web. A precursor web is provided between a forming structure and a compliant substrate. The forming structure has a plurality of discrete protruded elements and lands completely surrounding them. Pressure is provided between the compliant substrate and the forming structure to conform the precursor web to the forming structure to form the embossed web. The resulting embossed web has a plurality of discrete extended elements completely surrounded by land areas. | 2012-10-04 |
20120248650 | APPARATUS AND METHOD FOR DEGRADING A WEB IN THE MACHINE DIRECTION WHILE PRESERVING CROSS-MACHINE DIRECTION STRENGTH - An embossing system for embossing at least a portion of a web is provided comprising a first embossing roll having male embossing elements, a second embossing roll having male embossing elements, wherein the first and second embossing rolls define a first nip for receiving the web, and a third embossing roll having male embossing elements, wherein the second and third embossing rolls define a second nip for receiving the web, and wherein at least a substantial portion of the embossing elements of at least one of the first, second, and third embossing rolls are substantially oriented in the cross-machine direction. | 2012-10-04 |
20120248651 | METHOD AND APPARATUS FOR CONTROLLING THE WINDING OF AN ELONGATED ELEMENT ONTO A COLLECTION REEL WITH THE INTERPOSITION OF A SERVICE FABRIC - A method for controlling the winding of an elongated element onto a collection reel with the interposition of a service fabric, includes rotating the collection reel and simultaneously winding the elongated element and the service fabric onto the collection reel, wherein the simultaneous winding includes determining the actual winding diameter of the collection reel and preferably, the actual unwinding diameter of a storage reel of the service fabric. The rotation speed of the collection reel is adjusted according to the actual winding diameter and preferably, also to the variation in length of the portion of elongated clement about to be deposited onto the collection reel. | 2012-10-04 |
20120248652 | INJECTION MOLDING FLOW CONTROL APPARATUS AND METHOD - An apparatus for controlling the rate of flow of mold material to a mold cavity, including a valve system in fluid communication with an actuator to drive the actuator at one or more rates of travel, the valve system having a start position, one or more intermediate drive rate positions and a high drive rate position, the start position holding the valve pin in a gate closed position; a controller that instructs the valve system to move from the start position to the one or more intermediate drive rate positions and to remain in the one or more intermediate drive rate positions for one or more corresponding predetermined amounts of time and further drives the valve system to move from the one or more intermediate drive rate positions to the high drive rate position on expiration of the one or more predetermined amounts of time. | 2012-10-04 |
20120248653 | METHOD OF OPERATING A MOLDING SYSTEM - According to embodiments of the present invention, there is provided a method of operating a molding system. More specifically the method of operating a melt distribution network within a molding system, the melt distribution network including a first melt flow control device at an upstream location and a second melt flow control device at a downstream location, is provided. The method comprises actuating the first melt flow control device to its open configuration and actuating the second melt flow control device to its open configuration to connect a source of molding material with a molding cavity via the melt distribution network; actuating the second melt flow control device to its blocked configuration; actuating the first melt flow control device to its blocked configuration; said actuating the second melt flow control device and said actuating the first melt flow control device to their respective blocked configurations resulting in molding material being trapped therebetween at a trapped pressure that substantially equals to a last pressurized portion of a molding cycle pressure, said trapped pressure being maintained until a beginning of a next injection cycle. | 2012-10-04 |
20120248654 | INJECTION MOLDING SYSTEM WITH MULTIPLE ACCUMULATOR ASSEMBLIES - An injection molding system ( | 2012-10-04 |
20120248655 | Non-Cement Fire Door Core - The present invention describes a fire resistant building material composition, useful for example as a fire door core and to a method of making this composition. The building material of the present invention is prepared from an aqueous mixture of predominately expanded perlite, a small amount of a binder component consisting essentially of calcined gypsum and an organic binder, and optionally a fibrous reinforcement. | 2012-10-04 |
20120248656 | METHOD OF MANUFACTURING THERMOSETTING SOLUTION AND METHOD OF MANUFACTURING TUBULAR MEMBER - A method of manufacturing a thermosetting solution includes a process for preparing a solution having a conductive material having an acid group dispersed in the solution, preparing a polyimide precursor solution, and mixing the solution having the conductive material dispersed therein and the polyimide precursor solution, and stirring the mixed solution using a stirring tank in which a stirring blade is disposed and the minimum gap between the inner surface of the stirring tank and the stirring blade is from about 1 mm to about 15 mm. | 2012-10-04 |
20120248657 | METHOD FOR THE LAYERED CONSTRUCTION OF A SHAPED BODY MADE OF HIGHLY VISCOUS PHOTOPOLYMERIZABLE MATERIAL - The invention relates to a method for the layered construction of a shaped body made of highly viscous photopolymerizable material. | 2012-10-04 |
20120248658 | System and Method for Formation of Biodegradable Ultra-Porous Hollow Fibers and Use Thereof - A system and method for forming biodegradable ultra-porous hollow fibers are disclosed. The fibers are formed by electrospinning a liquid polymer composition (e.g., solution) of a high molecular weight aliphatic polyester in a controlled environment. | 2012-10-04 |
20120248659 | BLOW MOULDING MACHINE WITH A STERILE CHAMBER AND HEATING - An apparatus for shaping preforms of plastic includes a plurality of shaping stations arranged on a movable carrier. The shaping stations each have blowing moulds which are arranged in blowing mould carriers and serve to accommodate the preforms of plastic. The shaping stations are conveyed within a clean chamber which is separated from its surroundings by of at least one wall. A sterilization device charges regions lying within the clean chamber with a flowable sterilization agent for sterilization thereof. | 2012-10-04 |
20120248660 | METHOD OF FORMING A CONTAINER - An apparatus and method for forming a plastic container is provided. The method includes disposing a preform into a primary mold cavity and applying pressurized air to urge the preform to conform to the shape of the primary mold cavity to form a primary article. The primary article is then permitted to shrink to a predetermined volume. The method can further include exposing the primary article to an internal vacuum to facilitate shrinking to a predetermined volume. The method further includes disposing the primary article into a second mold cavity and applying pressurized air to urge the primary article to conform to the second mold cavity to form an intermediate article. Finally, at least a portion of the intermediate article is trimmed off to form a final container. | 2012-10-04 |
20120248661 | HEAVY PLASTIC - A polymeric composition composed of a polymeric material and at least one additive. The polymeric material is at least one of a polymeric precursor material or a melt processible polymeric material. The additive is complexed with the polymeric material and is an inorganic or organo-inorganic complex that is integrated into at least a portion of the polymeric chains in the polymeric composition. The additive may be at least one of oxide glass compounds or halogenated post-transition metal compounds and is present in an amount sufficient to increase the material weight without unduly compromising optical qualities such as transparency to visible light. The polymeric composition can be provided in melt processible form to be used to produce articles such as drinking glasses and the like. The composition can be produced by processes such as dispersion by polymerization of the monomers producing the desired polymeric material in the presence of the additive. | 2012-10-04 |
20120248662 | MULTI-SHEET THERMOFORMING PROCESS - Disclosed is a thermoforming mold that defines a surface of a thermoformed part, a cavity recess that defines part of the interior space of the thermoformed part, a bond flange ridge, a vent recess and a chamber recess in an offal region outside of the surface of the thermoformed part, where the chamber recess, the vent recess and the cavity recess collectively define a continuous recess and where the part does not extend substantially beyond the bond flange ridge. Also disclosed is a manufacturing method including molding a first and second plastic sheet to thermoforming molds, impressing the first and second plastic sheets together between the thermoforming molds to define the part, a seam, a vent and a chamber then inserting a blow needle into the chamber and using that blow needle to move a fluid through the interior space of the part through the vent and then removing the offal and the chamber from the part. Also disclosed is a thermoformed part manufactured using the mold and method described above. | 2012-10-04 |
20120248663 | Forming a Polycrystalline Cermanic in Multiple Sintering Phases - In one aspect of the invention, a method of forming polycrystalline diamond comprises providing a can assembly comprising a preform of diamond powder with a first catalyst, the preform being adjacent a solid substrate with a second catalyst. The pressure and/or temperature on the can assembly increases until the first catalyst and carbon from the diamond powder begin to form a melting composition within the preform. The pressure and temperature may be held substantially constant on the can assembly until the melting composition has catalyzed crystalline growth in at least a portion of the preform. The pressure and/or temperature are then increased on the assembly until the second catalyst within the substrate is released into the preform. | 2012-10-04 |
20120248664 | ARRANGEMENT FOR EVENING OUT POWDERY SOLID MATTER FEED OF A CONCENTRATE BURNER OF A SUSPENSION SMELTING OR SUSPENSION CONVERTING FURNACE - The object of the invention is an arrangement for feeding powdery solid matter into a concentrate burner ( | 2012-10-04 |
20120248665 | Spring, assembly of springs, assembly of a spring and a damper, as well as a vehicle comprising a spring - Spring comprising a first part ( | 2012-10-04 |
20120248666 | GAS SPRING AND DAMPER ASSEMBLY AND SUSPENSION SYSTEM INCLUDING SAME - A gas spring and damper assembly includes a damper assembly and a gas spring assembly that are operatively connected to one another. The damper assembly includes a damper housing and a damper rod assembly. The gas spring assembly includes a first end member, a second end member and a flexible wall secured between the first and second end members to at least partially define a spring chamber. The assembly is displaceable between a collapsed condition and an extended condition. During use under load, the assembly can undergo displacement from the extended condition toward the collapsed condition upon transferring pressurized gas into the spring chamber, and can undergo displacement from the collapsed condition toward the extended condition upon transferring pressurized gas out of the spring chamber. A suspension system is also included. | 2012-10-04 |
20120248667 | AIR SPRING MODULAR PISTON - A modular piston assembly is associated with an air spring assembly that has a bellows roiling over a surface of the piston assembly. The modular piston assembly includes a first piston portion adapted to fasten to an associated air spring bellows. A second piston portion separate from the first portion, is adapted to fasten to an associated mounting component. Interlocking members are provided to secure the first and second piston portions together, and/or any desired intermediate piston portions. Discrete air reservoirs may also be included in the modular piston assembly to increase the volume of the air spring. | 2012-10-04 |
20120248668 | FLUID-FILLED VIBRATION-DAMPING DEVICE OF MULTIDIRECTIONAL VIBRATION-DAMPING TYPE - A fluid-filled vibration-damping device of multidirectional vibration-damping type including: a first mounting member; a second mounting member; a main rubber elastic body connecting the two mounting members; a pressure-receiving fluid chamber; an equilibrium fluid chamber; a first orifice passage interconnecting the two fluid chambers; a plurality of outer peripheral fluid chambers situated on an outer peripheral side of the main rubber elastic body; a second orifice passage interconnecting the outer peripheral fluid chambers; and an intermediate sleeve affixed to the main rubber elastic body. The intermediate sleeve and the second mounting member each include a step portion at an axially medial section thereof, and are mated and fixed to each other at opposite sides of the corresponding step portion. The two step portions are opposed to each other in an axial direction so that the second orifice passage is formed between axially opposed faces of the step portions. | 2012-10-04 |
20120248669 | LIQUID-SEALED ANTIVIBRATION DEVICE - A partition element partitions a liquid-sealed chamber into a main liquid chamber and a first sub liquid chamber. A first orifice flow passage for connecting both liquid chambers is provided. A second diaphragm is formed in the partition element. The partition element includes a second sub liquid chamber partitioned from the main liquid chamber by the second diaphragm and a second orifice flow passage for connecting the first and second sub liquid chambers to each other. A valve portion brought into contact with a periphery around an opening of the second orifice flow passage is formed on a flexible membrane portion of the second diaphragm into a surrounding wall shape. A through hole is formed outside the valve portion, and a projection compressed by a counter wall is formed on a membrane surface of the flexible membrane portion on a main liquid chamber side. | 2012-10-04 |
20120248670 | SHOCK ABSORBER - A shock absorber includes first passages configured to communicate two chambers to flow a working fluid therebetween by movement of a piston, and a second passage configured to communicate with one chamber of the two chambers. The first passages have damping valves configured to suppress a flow of the working fluid generated by movement of the piston to generate a damping force. The second passage has a variable orifice having an area adjusted by an elastic member when a piston rod moves in an extension direction, a pressure chamber installed in series with the variable orifice, and a free piston configured to vary a volume of the pressure chamber by movement of the piston. | 2012-10-04 |
20120248671 | Method and Apparatus for Making Article Having Side Seams - A method for forming an undergarment comprises cutting a web to form a pre-form comprising transverse edges and two longitudinal edges, each longitudinal edge having two waist sections and a crotch section located intermediate the waist sections, a sealing area located adjacent and inboard of each waist section, and transferring the pre-form to a processing wheel. The method further comprises gripping the pre-form adjacent each waist section with grippers in four gripping areas, each gripping area located near a respective sealing area, jointly rotating the grippers that hold the gripping areas in the region of one of the transverse edges around at least one hinging axis to place the transverse edge generally parallel and opposite to the second transverse edge, superimposing the sealing areas in a contacting relationship, joining the superimposed sealing areas, thus forming the undergarment, and releasing the undergarment from the grippers. | 2012-10-04 |
20120248672 | POINT-WELDING CLAMP STRUCTURE - A point-welding clamp structure for side by side tightly clamping and locating different plate-shaped metal pieces in their true relative positions so as to facilitate the point-welding operation. The point-welding clamp structure includes a body section and a base section for clamping the different metal pieces. A second adjustment section is disposed on the body section and a third adjustment section is disposed on the base section. By means of operating the second and third adjustment sections, the metal pieces with different thickness can be securely clamped and located by the point-welding clamp structure. | 2012-10-04 |
20120248673 | POINT-WELDING CLAMP - A point-welding clamp for tightly clamping and locating different plate-shaped metal pieces to be welded together. The point-welding clamp includes a clamp section for clamping the plate-shaped metal pieces to be welded together, a drive section for controlling the clamping force applied to the plate-shaped metal pieces by the clamp section, and an abutment section including two abutment bodies. The abutment bodies are pivotally connected with the clamp section in abutment with the plate-shaped metal pieces. Each abutment body has an engagement face. The engagement faces of the abutment bodies serve to attach to the surfaces of the plate-shaped metal pieces to keep the force applied to the plate-shaped metal pieces by the clamp section normal to the surfaces of the plate-shaped metal pieces. Accordingly, it is ensured that the plate-shaped metal pieces are securely clamped by means of the point-welding clamp. | 2012-10-04 |
20120248674 | Non-Slip Bench Support Block - A work piece support device that includes a body and at least two portions of high-grip material on opposite sides of the body is provided. The body may have a flowable media stored therein to provide a lowered center of gravity depending on the orientation of the work piece support device. The work piece support device may include mating projections and recesses for coupling a plurality of work piece support devices together. Further, the projection can be in the form of a cone such that the work piece support device may function as a support cone. | 2012-10-04 |
20120248675 | Automatic Stop Gauge for Positioning a Workpiece Relative to the Working Member of a Tool - An automatic stop gauge used in woodworking to facilitate the cutting of multiple workpieces to the same length, or working of the pieces at equal positions along each, quickly and accurately has a plurality of stops, moveably mounted on a beam-like fence, which is in turn aligned with and connected to the existing top fence of a cutting or drilling tool when present “Pin” type stops deploy in succession by means of gravity from holes drilled in the beam at incremental spacings of one or more inter-hole distances. An operator presses a work piece against the beam which retracts one or more of the pins from its stop-defining position projecting from the beam, and with lateral movement of the work piece toward the working member of the tool, as guided by the beam, pins redeploy one at a time, to each provide a new stop position for the workpiece. | 2012-10-04 |
20120248676 | DEVICE AND METHOD FOR DELIVERING PRINTED PRODUCTS FROM A SADDLE-SHAPED SUPPORT - A device for delivering a printed product from a saddle-shaped support includes at least two discs that are configured to pass through a gap that extends in a conveying direction and that is disposed, at least in a delivery region, between two support parts of the saddle-shaped support. The at least two discs are rotatable about respective fixed rotation axles that are mutually spaced from one another in the conveying direction. Each of the discs is configured to project intermittently, during the rotation about the respective fixed rotation axles, above a ridge line of the ridge in the delivery region of the saddle-shaped support so as to continuously lift the printed product from the saddle-shaped support in the delivery region. | 2012-10-04 |
20120248677 | IMAGE FORMING APPARATUS AND SHEET SIZE DETECTION METHOD - An image forming apparatus includes an image forming unit, a sheet feeding unit for feeding a sheet, a registration roller for transporting the sheet toward the image forming unit, a rotational member for transporting the sheet toward the registration roller, at least one detection member provided on an upstream side of the registration roller, and a sheet size detection unit configured to receive an output from the detection member. The rotational member is configured to continue rotation until transportation of the sheet is completed. The registration roller is configured to rotate when a predetermined waiting time period has elapsed since the detection member detects sheet arrival. The sheet size detection unit is configured to detect a size of the sheet using a time period from a time when the detection member detects the sheet arrival to a time when the detection member detects sheet passage. | 2012-10-04 |
20120248678 | SHEET CONVEYING DEVICE THAT SEPARATES MULTI-FED SHEETS, AND IMAGE READING APPARATUS - A sheet conveying device which makes it possible to facilitate separation of multi-fed sheets. A separation pad and a separation roller separate sheets from a sheet bundle placed on a sheet tray, on a one-by-one basis. A pull-off roller section formed by a pair of conveying rollers nips and conveys a fed sheet. The two conveying rollers of the pull-off roller section have rotational axes extending in respective different directions. A registration roller further conveys the sheet conveyed by the pull-off roller section. One roller of the pull-off roller section is disposed such that the roller conveys a sheet in a direction in which the sheet is to be conveyed by the registration roller, and the other roller of the pull-off roller section is disposed such that the roller conveys a sheet obliquely with respect to the sheet conveying direction of the registration roller. | 2012-10-04 |
20120248679 | SHEET TRANSPORT DEVICE AND IMAGE FORMING APPARATUS - A sheet transport device includes an abutment member that moves downstream in a sheet transport direction and against which a leading end of a sheet that has been transported from upstream in the sheet transport direction abuts; and a transport unit that transports the sheet whose leading end has abutted against the abutment member further downstream. The abutment member moves at least to the transport unit in a state in which the leading end of the sheet abuts against the abutment member, and the abutment member is separated from the leading end of the sheet after the transport unit has started to transport the sheet. | 2012-10-04 |
20120248680 | REVERSING TRANSPORTING DEVICE, IMAGE FORMING APPARATUS, AND TRANSPORTING DEVICE - A reversing transporting device includes a transport-in path, a first transporting section provided at the transport-in path, a second transporting section provided at the transport-in path, a reversing path connected to the transport-in path, a third transporting section provided at the reversing path, a transport-out path connected to the reversing path, a fourth transporting section provided at the transport-out path, and a fifth transporting section provided at the transport-out path. | 2012-10-04 |
20120248681 | SHEET CONVEYING DEVICE - A sheet conveying device includes a cover member made of resin and partially defining a conveying path, a roller member rotatably disposed on the cover member and configured to convey a sheet along the conveying path, an urging member disposed between the cover member and a rotary shaft of the roller member and urging the roller member toward the conveying path while one end of the urging member contacts the rotary shaft, and a plate member made of metal and disposed between the cover member and the urging member. The plate member includes a first segment extending along the cover member and contacting the other end of the urging member, a second segment extending from an edge of the first segment in a direction toward the conveying path, and a third segment extending from an edge of the second segment in a direction different from the second segment extending direction. | 2012-10-04 |
20120248682 | PAPER TRANSPORT DEVICE AND IMAGE FORMING APPARATUS - A paper transport device includes a transport section that transports paper on a first transport path, and reverses a transport direction to transport the paper onto a second transport path, and a detecting section that detects that the paper has arrived at the reversal position, wherein the detecting section includes a first member that is arranged on the first transport path, and changes posture thereof among a first posture, a second posture, and a third posture, a second member that changes posture thereof between a fourth posture and a fifth posture, a detector that detects whether the second member is in the fourth posture or in the fifth posture, and a joint member that couples the first member and the second member together, allows the second member to be in the fourth posture, rotates the second member to the fifth posture, and keeps the second member in the fourth posture. | 2012-10-04 |
20120248683 | LETTERBOX MEDIA DIVERTER - A 3-way letterbox media diverter directs and controls media in 2 forward directions and 1 reverse direction within a printer's paper path. The letterbox design enables actuation of the diverter from a first position to a second position just as the trail edge of a sheet passes a post fuser nip. Once the diverter reaches the second position, an invert nip now controlling the sheet is reversed to thereby invert the sheet. Thus, inversion of the sheet is accomplished in a small space envelope, time to reverse direction is reduced, process speed can be reduced and additional paper guides are eliminated. | 2012-10-04 |
20120248684 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus includes a conveying roller which conveys a sheet, a cylindrical motor which drives the conveying roller, an outer diameter of the motor being approximately equal to or smaller than an outer diameter of the conveying roller, and a supporting portion which supports the motor such that a rotational center of the motor is arranged coaxially with a rotational center of a rotational shaft of the conveying roller the motor is positioned within a maximum sheet that can be conveyed by the conveying roller in a width direction perpendicular to the sheet conveying direction. | 2012-10-04 |
20120248685 | PAPER ADJUSTING DEVICE - A paper adjusting device comprises a first and a second limiting plates; the second limiting plate substantially parallel to the first limiting plate; a first driving plate comprising a rotating end and a sliding end, the rotating end of the first driving plate is rotatably attached to the first limiting plate, and the sliding end of the first driving plate is slidably engaged with the second limiting plate; a second driving plate comprising a rotating end and a sliding end, wherein the rotating end is rotatably attached to the second limiting plate, and the sliding end is slidably engaged with the first limiting plate; and an operating member comprising a positioning plate and slidably connected to the first and the second driving plates; wherein the first and the second limiting plates, the second limiting plate are slidable to form a space to align a stack of paper. | 2012-10-04 |
20120248686 | SHEET FEEDING DEVICES, IMAGE READING DEVICES AND IMAGE FORMING DEVICES - A sheet feeding device configured to feed sheets, the sheet feeding device including a tray configured to receive the sheets; a separation portion configured to separate the sheets one by one; a guide portion configured to guide feeding of the sheets while regulating a position of the sheets in a width direction that is orthogonal to a feed direction of the sheets, the guide portion comprising an upstream side end portion, in the feed direction of the sheets, which is disposed above the tray and a downstream side end portion, in the feed direction, which extends further to the downstream side, in the feed direction, than the separation portion. | 2012-10-04 |
20120248687 | SHEET FEEDING DEVICES, IMAGE READING DEVICES AND IMAGE FORMING DEVICES - A sheet feeding device includes a sheet placement portion, a regulating portion, and an output portion. The regulating portion includes a first regulating portion and a second regulating portion. At least one of the first regulating portion and the second regulating portion can move in the width direction. The output portion includes a first output portion that extends from the first regulating portion toward the second regulating portion, and a second output portion that extends from the second regulating portion toward the first regulating portion. The first output portion includes a first end portion. The second output portion includes a second end portion. In a proximity state, the first end portion is located closer to the second regulating portion than the second end portion. The proximity state is a state in which a distance between the first regulating portion and the second regulating portion is at a minimum. | 2012-10-04 |
20120248688 | DEPINCHING MECHANISM FOR PAPER JAM REMOVAL IN PRINTER - A depinching mechanism including a frame, a star wheel assembly, a limiter arm, a rocker arm and a sensor is provided in present invention. Through the depinching mechanism the star wheel assembly is lifted from the first position to the second position when paper jam occurs, and thus depinched the media the user can clear the paper jam. And after that the star wheel assembly is lowered from the second position to the first position. The star wheel assembly remains in the first position in the normal printing process. Since when paper jam occurs the star wheel assembly is lifted by the depinching mechanism, the user can easily and conveniently remove the jammed paper. And thus, the depinching mechanism can facilitate the user to remove jammed paper when paper jam occurs in printer. Thus, the depinching mechanism can be used in printers to solve the paper jamming problems. | 2012-10-04 |
20120248689 | IMAGE FORMING APPARATUS WITH ACCURATE SHEET CONVEYANCE - An image forming apparatus, including: a conveyor mechanism; a motor driver; and a controller for implementing a sheet-conveyance related control by execution of motor control processing in which a control input for a motor is calculated, wherein the controller implements the motor control processing in each sheet conveyance operation such that the control input is repeatedly calculated for conveying the sheet to a target stop position and for keeping the sheet located at the position, and wherein, in the motor control processing, the controller calculates the control input such that, after the sheet has reached the target stop position, the control input is equal to a hold control input required for keeping the sheet located at the position and such that, at a start point of the processing, the control input is not smaller than the hold control input in the processing in a previous sheet conveyance operation. | 2012-10-04 |
20120248690 | DEPINCHING MECHANISM FOR PAPER JAM REMOVAL IN PRINTER - A depinching mechanism including a frame, a star wheel assembly, a transmitting device and a sensor is provided in present invention. Through the transmitting device rotating reversely, the star wheel assembly is lifted to the second position when paper jam occurs, thus depinched the media so that user can clear the paper jam. After that the star wheel assembly is lowered to the first position again. The star wheel assembly remains in the first position in normal printing process. Using a one-way clutch and a cam with an outer predetermined profile, the transmitting device rotates forwardly without transmitting any torque during normal printing process, and rotates inversely with transmitting a torque to lift the star wheel assembly up and lower the star wheel assembly down when paper jam occurs. Thus, the depinching mechanism can be used in printers to auto fix the paper jamming problems. | 2012-10-04 |
20120248691 | LEAD EDGE FEEDER WHEEL FOR CARTON MAKING MACHINE - A lead edge feeder wheel used in a carton making machine, having a tread for friction contact with a cardboard during rotation to feed the cardboard into the carton making machine cycle by cycle in conjunction with the operation of wheel grids and a vacuum system, and one or multiple grooves extending along the tread for rendering a visual indication when the tread is worn off, avoiding biasing of the cardboard during feeding. | 2012-10-04 |