40th week of 2017 patent applcation highlights part 96 |
Patent application number | Title | Published |
20170290134 | DISCHARGE METHOD AND CIRCUIT FOR USB CONNECTOR - This document discusses, among other things, a discharge circuit for a USB connector configured to discharge a voltage of a pin (e.g., a VBUS pin) of the USB connector. The discharge circuit can include a discharge load to discharge the voltage of the pin; a first control circuit to adjust the magnitude of the discharge load during discharging, such that power consumption generated by the discharge load meets a first preset condition and a discharge time is within a first preset range, the first preset condition indicating that the generated power consumption does not trigger Over Temperature Protection (OTP); and a second control circuit to detect whether the voltage of the pin is changed based on a reference voltage during discharging and adjust the magnitude of the discharge load in response to the change, such that a slew rate of the voltage of the first pin is within a second preset range. | 2017-10-05 |
20170290135 | X-RAY TUBE ASSEMBLY - According to one embodiment, an X-ray tube assembly includes a cathode, an anode target, a joint including an inflow part into which a coolant flows, a first cylindrical pipe to which the joint is connected at one end, and the anode target is joined at an outer bottom part of the other end, a second cylindrical pipe whose first end part is fitted into the inflow part, and whose second end part is arranged to eject the coolant toward the bottom part of the first cylindrical pipe, the second cylindrical pipe being placed inside the first cylindrical pipe and an elastic member provided between the first end part and the first cylindrical pipe. | 2017-10-05 |
20170290136 | X-RAY SYSTEMS HAVING INDIVIDUALLY MEASURABLE EMITTERS - An x-ray system for simultaneously or concurrently measuring currents of multiple emitters is provided. The x-ray system includes a high voltage direct current (DC) supply configured to supply tube current to the multiple emitters and plural emitter circuits. Each of these circuits includes each comprising an alternating current (AC) voltage supply, at least one of the multiple emitters operatively coupled to the AC voltage supply and the high voltage DC supply, and a circuit coupling the AC voltage supply and the high voltage DC voltage supply to the at least one of the multiple filaments. At least one of the emitter circuits has a current measurement device between the high voltage DC supply and the emitter. | 2017-10-05 |
20170290137 | SUPPRESSION OF SELF PULSING DC DRIVEN NONTHERMAL MICROPLASMA DISCHARGE TO OPERATE IN A STEADY DC MODE - The current disclosure relates to a suppressor circuit configuration for extending the stable region of operation of a DC driven micro plasma discharge at atmospheric and higher pressures. | 2017-10-05 |
20170290138 | PRINTED CIRCUIT BOARD - A printed circuit board has a copper clad laminate and a plurality of holes. The copper clad laminate for dissipating heats generated from a chip when the chip operates has a plurality of solder paste disposed areas. The plurality of holes situate on the copper clad laminate and each of the holes does not communicate with others, wherein the plurality of holes are nonconductors. Each of the solder paste disposed areas is surrounded by the plurality of holes and each solder paste disposed areas is surrounded by at least two holes. | 2017-10-05 |
20170290139 | CIRCUIT STRUCTURE, ELECTRICAL JUNCTION BOX, AND SPACER - A circuit structure includes a circuit board mounted with electronic components, a heat release member overlaid by the circuit board and releasing heat of the circuit board, a screw screwing the circuit board to the heat release member, and a spacer on which an insertion hole is formed to insert a shaft portion of the screw and the spacer is arranged between the circuit board and the screw to receive the screw. The spacer includes a board presser pressing the circuit board and a heat release member presser pressing the heat release member when the circuit board is screwed to the heat release member. | 2017-10-05 |
20170290140 | ELECTROMAGNETIC SHIELD FOR AN ELECTRONIC DEVICE - An electronic device including a substrate having opposing top and bottom surfaces is provided. A ground layer is disposed in the substrate. An electrically conductive chassis has a mounting surface to receive the bottom surface of the substrate and is in electrical contact with the ground layer by a ground stitch via. An electromagnetic shield is defined by the ground layer, the ground stitch via and the chassis to enclose the bottom surface of the substrate and protect the bottom surface from electromagnetic interference. A non-conductive cover is assembled to the substrate in tension so that an interior surface of the cover applies a force to the top surface of the substrate thereby ensuring the chassis maintains in electrical contact with the ground layer. | 2017-10-05 |
20170290141 | CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD - The present invention provides a conductive-layer-integrated flexible printed circuit board that has excellent electrical insulation reliability and that prevents the electrically conductive layer from being detached during a reflow process. The conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film, (A) the electromagnetic-shielding conductive layer, (B) the insulator film, and (C) the wiring-pattern-equipped film being laminated in this order, (B) the insulator film containing at least (a) a binder polymer and (b) a black coloring agent having a reflective range within the infrared range. | 2017-10-05 |
20170290142 | ELECTRONIC PARTS - Electronic parts for improving an isolation distance are provided. The electronic part includes: at least one plate; and first and second terminals each connected to the plate, wherein the electronic part is mounted in a PCB through the first and second terminals and a creepage distance between the first terminal and the second terminal is greater than a clearance distance between the first terminal and the second terminal. | 2017-10-05 |
20170290143 | HIGH-FREQUENCY MODULE - A high-frequency module includes a multilayer substrate that includes an insulator layer and a wiring electrode, a component on one main surface of the multilayer substrate, a resin layer on the one main surface so as to cover the component, and a shield electrode covering at least a portion of a surface of the resin layer and at least a portion of a side surface of the multilayer substrate. The wiring electrode includes a capacitor via electrode that is spaced away from the shield electrode inside the multilayer substrate, and a first capacitor is defined by the shield electrode and the capacitor via electrode. | 2017-10-05 |
20170290144 | WIRING BOARD MANUFACTURING METHOD - A wiring board manufacturing method includes forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands. | 2017-10-05 |
20170290145 | REINFORCING MEMBER FOR FLEXIBLE PRINTED WIRING BOARD, AND FLEXIBLE PRINTED WIRING BOARD PROVIDED WITH SAME - A reinforcing member for a flexible printed wiring board allows a ground wiring pattern of the flexible printed wiring board to conduct with an external ground potential. The reinforcing member includes a metal base and a nickel layer formed on a surface of the metal base. The nickel layer includes phosphorus in a range from 5.0 percent by mass to 20.0 percent by mass, the rest of the nickel layer is nickel and inevitable impurities, and the nickel layer is 0.2 μm to 0.9 μm thick. | 2017-10-05 |
20170290146 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist. | 2017-10-05 |
20170290147 | CIRCUIT-AND-HEAT-DISSIPATION ASSEMBLY AND METHOD OF MAKING THE SAME - Disclosed herein is a circuit-and-heat-dissipation assembly which includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer and having an electroless plating layer which has a patterned catalyst seed layer comprising an active metal and formed on the insulator layer, and a reduced metal layer formed on the catalyst seed layer. Also disclosed herein is a method of making the circuit-and-heat-dissipation assembly. | 2017-10-05 |
20170290148 | METHOD FOR PRODUCING PRINTED WIRING BOARD - Printed wiring boards with reduced curing unevenness and the like may be produced by (A) preparing an adhesive sheet having a support and a resin composition layer provided on the support, (B) laminating the adhesive sheet on an internal layer substrate so that the resin composition layer is in contact with the internal layer substrate, and (C) thermally curing the adhesive sheet by heating from T | 2017-10-05 |
20170290149 | RESIN SHEET - Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties. | 2017-10-05 |
20170290150 | SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PRINTED CIRCUIT BOARD - The substrate for a printed circuit board according to an embodiment of the present invention includes a base film having insulating properties, and a metal layer stacked on at least one surface of the base film, in which the base film includes a portion where a transition metal in group 10 of the periodic table is present. The transition metal in group 10 is preferably nickel or palladium. The portion where the transition metal in group 10 is present preferably includes a region having an average thickness of 500 nm and extending from an interface with the metal layer. | 2017-10-05 |
20170290151 | ARCHIMEDEAN SPIRAL DESIGN FOR DEFORMABLE ELECTRONICS - The invention provides an electronic device that includes a first functional body, a second functional body, and at least one connection member connecting the first functional body to the second functional body. The at least one connection member has a spiral pattern, and is suspended in air to allow tor stretching, flexing or compressing. | 2017-10-05 |
20170290152 | ELECTRONIC COMPONENT MOUNTING BOARD - An electronic component mounting board includes: a circuit board having a wiring layer; a pocket part provided on a main surface of one side of the circuit board; a passive component housed in the pocket part; an active component arranged above the passive component and the main surface of the one side of the circuit board and connected to the passive component; and a shield layer formed of a material containing a magnetic material and provided between a bottom surface of the pocket part and a lower surface of the passive component. | 2017-10-05 |
20170290153 | CONNECTING STRUCTURE FOR PRINTED CIRCUIT BOARDS - A connecting structure for printed circuit boards has two printed circuit boards. At least one of the two printed circuit boards is a flexible printed circuit board, and each one of the two printed circuit boards has at least one connecting portion. The at least one connecting portion protrudes from an end of the printed circuit board, and is soldered on a top surface of the other printed circuit board. Each of the printed circuit boards is attached to the other printed circuit board only by a part (connecting portion), such that the solders on the connecting portion can extend forward and in two transverse directions beyond the connecting portion, thereby increasing the contact area between the solder and the top surface of the other printed circuit board. Therefore, the connecting structure can firmly connect two printed circuit boards and can enhance the resistance to pull. | 2017-10-05 |
20170290154 | FLEXIBLE PRINTED CIRCUIT EMI ENCLOSURE - Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height. | 2017-10-05 |
20170290155 | ELECTRO-MAGNETIC INTERFERENCE (EMI) SHIELDING TECHNIQUES AND CONFIGURATIONS - Embodiments of the present disclosure are directed towards electro-magnetic interference (EMI) shielding techniques and configurations. In one embodiment, an apparatus includes a first substrate, a die having interconnect structures coupled with the first substrate to route input/output (I/O) signals between the die and the first substrate and a second substrate coupled with the first substrate, wherein the die is disposed between the first substrate and the second substrate and at least one of the first substrate and the second substrate include traces configured to provide electro-magnetic interference (EMI) shielding for the die. Other embodiments may be described and/or claimed. | 2017-10-05 |
20170290156 | Integrated Passive Devices and Assemblies Including Same - An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. | 2017-10-05 |
20170290157 | MAGNETICALLY-COUPLED INDUCTORS ON INTEGRATED PASSIVE DEVICES AND ASSEMBLIES INCLUDING SAME - An integrated passive device and assemblies containing the same are disclosed. The integrated passive device can include a thin-film magnetic inductor. Various configurations of electrically connecting an integrated passive device to a processor and/or an interposer such as a chip-scale package are also disclosed. An inductor on an integrated passive device can configured and arranged such that it is magnetically coupled to an inductor on a structure such as a processor chip or a system on a chip. | 2017-10-05 |
20170290158 | SURFACE-MOUNTABLE POWER DELIVERY BUS BOARD - IC device assemblies including a power delivery bus board that is mounted to a primary PCB (i.e., motherboard) that further hosts a power-sink device and a power-source device. The bus board, as a secondary PCB, may be surface-mounted on a back side of the primary PCB opposite the power source and sink devices, which are mounted on the front side of the primary PCB. The bus board need only be dimensioned so as to bridge a length between first and second back-side regions of the primary PCB that are further coupled to a portion of the front-side pads employed by the power-sink device. The secondary PCB may be purpose-built for conveying power between the source and sink devices, and include, for example, short, wide traces, that may be formed from multiple heavyweight metallization layers. | 2017-10-05 |
20170290159 | VARIABLE WIDTH PRINTED CIRCUIT BOARD USING SURFACE MOUNT TECHNOLOGY JUMPERS - Provided is a master printed circuit board (PCB). The master PCB includes panels defined by grooves cut in the master PCB, the grooves separating one panel from another. A final PCB is formable via use of one or more jumpers, wherein the jumpers are configured to extend across at least one of the grooves to electrically connect one panel to another panel. The electrically connected panels form the final PCB. | 2017-10-05 |
20170290160 | ELECTRONIC PACKAGE INCLUDING CAVITY DEFINED BY RESIN AND METHOD OF FORMING SAME - An electronic component may include a substrate having a functional unit formed on a main surface of the substrate and a first resin layer formed on the main surface, the first resin layer having a first surface facing the main surface and a second surface opposed to the first surface, the first resin layer defining a cavity on the first surface enclosing the functional unit, the first resin layer defining a recess on the second surface, and a solder layer being formed in the recess so as not to exceed the second surface in a thickness direction. The functional unit may include a surface acoustic wave (SAW) element or a film bulk acoustic resonator (FBAR) having a mechanically movable portion. The substrate may be formed of dielectric material. | 2017-10-05 |
20170290161 | ELECTRONIC COMPONENT WITH INTERPOSER - In an embodiment, a multilayer ceramic capacitor with interposer CWI | 2017-10-05 |
20170290162 | CIRCUIT BOARD HAVING A PASSIVE DEVICE INSIDE A VIA - A circuit board is provided that includes a plurality of insulating layers provided in a stack to have a first surface and a second surface. A via may extend from the first surface of the stack to the second surface of the stack. A passive device may be provided in the via. | 2017-10-05 |
20170290163 | ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT BUILT-IN BOARD - An electronic component includes an inner electrode inside of a main body and exposed at a surface of the main body, and an outer electrode on a surface of the main body and electrically connected to the inner electrode, wherein a plurality of recesses are provided in a surface of the outer electrode, and each of the plurality of recesses includes a portion in which a diameter of an opening of the recess gradually decreases toward an opening side of the recess. | 2017-10-05 |
20170290164 | ELECTRICAL COMPONENT, COMPONENT ARRANGEMENT, AND A METHOD FOR PRODUCING AN ELECTRICAL COMPONENT AND COMPONENT ARRANGEMENT - An electrical component for embedding into a carrier comprises a ceramic main body, an electrically insulating passivation layer which is applied to the main body, and at least one inner electrode. In addition, the electrical component comprises an outer electrode which is connected to the inner electrode, wherein the outer electrode comprises a first electrode layer comprising a metal and a second electrode layer which is arranged on the latter and comprises copper. | 2017-10-05 |
20170290165 | THIN FILM COMPONENT SHEET, BOARD WITH BUILT-IN ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE THIN FILM COMPONENT SHEET - A thin film component sheet includes: a conducting interconnection layer formed of a conductor; an insulating layer that is laminated on the conducting interconnection layer and is formed of an insulating material; and a plurality of thin film electronic components, each of which has a pair of first and second electrode layers and a dielectric layer provided between the first and second electrode layers, and which are arranged to be separated on the insulating layer. In a state in which a main surface of the first electrode layer in each of the plurality of thin film electronic components is exposed to an outside on a main surface of one side of the thin film component sheet, a flat surface of the main surface of the thin film component sheet is formed, | 2017-10-05 |
20170290166 | MIXED-PLATFORM APPARATUS, SYSTEMS, AND METHODS FOR SUBSTRATE PROCESSING - An electronic device manufacturing system may include a mainframe to which one or more process chambers of different size may be coupled. A different number of process chambers may be coupled to each facet (i.e., side wall) of the mainframe. The process chambers coupled to one facet may be of a different size than process chambers coupled to other facets. For example, one process chamber of a first size may be coupled to a first facet, two process chambers each of a second size different than the first size may be coupled to a second facet, and three process chambers each of a third size different than the first and second sizes may be coupled to a third facet. Other configurations are possible. The mainframe may have a square or rectangular shape. Methods of assembling an electronic device manufacturing system are also provided, as are other aspects. | 2017-10-05 |
20170290167 | Patterning of Graphene Circuits on Flexible Substrates - A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left therebetween. | 2017-10-05 |
20170290168 | METHOD AND APPARATUS FOR AUTOMATICALLY ADJUSTING DISPENSING UNITS OF A DISPENSER - A dispensing apparatus includes a frame having a gantry configured to provide movement in the X axis and Y axis directions, and first and second dispensing units coupled to the gantry and configured to dispense material onto a substrate. The second dispensing unit is coupled to the gantry by an automatic adjustment mechanism. The dispensing apparatus further includes a controller configured to control the operation of the gantry, the first dispenser, the second dispenser, and the automatic adjustment mechanism. The automatic adjustment mechanism is configured to move the second dispenser in the X axis and Y axis directions to manipulate a spacing between the first dispensing unit and the second dispensing. Methods of dispensing material on the substrate are further disclosed. | 2017-10-05 |
20170290169 | MULTI-LEVEL METALIZATION ON A CERAMIC SUBSTRATE - A method for producing a copper multi-level metallization on a ceramic substrate consisting of AlN or Al | 2017-10-05 |
20170290170 | Method Of Making A Camera For Use On A Vehicle - An illustrative example method of making a camera includes assembling a plurality of lens elements, a sensor, and a housing to establish an assembly with each of the lens elements and the sensor at least partially in the housing. The assembly is then situated adjacent a circuit board substrate. At least the sensor is secured to the circuit board substrate using surface mount technology (SMT) and the assembly becomes fixed relative to the circuit board substrate. | 2017-10-05 |
20170290171 | Method for Making a Biocompatible Hermetic Housing Including Hermetic Electrical Feedthroughs - A method for fabricating a biocompatible hermetic housing including electrical feedthroughs, the method comprises providing a ceramic sheet having an upper surface and a lower surface, forming at least one via hole in said ceramic sheet extending from said upper surface to said lower surface, inserting a conductive thick film paste into said via hole, laminating the ceramic sheet with paste filled via hole between an upper ceramic sheet and a lower ceramic sheet to form a laminated ceramic substrate, firing the laminated ceramic substrate to a temperature to sinter the laminated ceramic substrate and cause the paste filled via hole to form metalized via and cause the laminated ceramic substrate to form a hermetic seal around said metalized via, and removing the upper ceramic sheet and the lower ceramic sheet material from the fired laminated ceramic substrate to expose an upper and a lower surface of the metalized via. | 2017-10-05 |
20170290172 | ULTRASONIC LAMINATION OF DIELECTRIC CIRCUIT MATERIALS - A method of lamination of dielectric circuit materials is provided. The method includes preparing first and second circuit layers of dielectric materials, stacking the first and second circuit layers with circuit trace elements interposed between the first and second circuit layers and ultrasonically welding the second circuit layer onto the first circuit layer around the circuit trace elements. | 2017-10-05 |
20170290173 | ELECTRONIC APPARATUS - An electronic apparatus includes a housing that houses an electronic component, and a first cover and a second cover that cover the housing, wherein the electronic component is oriented along and on an inner side of a first sidewall of the first cover, wherein a side surface of the electronic component that faces the first sidewall has a cut, wherein the first cover has a recess that is depressed from the first sidewall toward the inner side in such a manner as to conform to the cut, and wherein the first cover is fastened at the recess to the second cover with a fastening member. | 2017-10-05 |
20170290174 | CUSTOMIZABLE MARKETING APPARATUS - Embodiments are directed to systems, apparatuses and methods for personalizing marketing materials such as video brochures. In one scenario, an electronic marketing apparatus is provided which includes a battery, an electronic display device powered by the battery, and a housing. One window is cut into the housing which allows the electronic display to be seen through at least a portion of the housing. A second window provides a view of an insert in the housing that is printed using a commodity printer. A method is also provided for personalizing marketing materials. The method includes printing a custom design on an insert using a commodity printer, cutting out at least a portion of the insert, arranging the cut out portion of the insert to show through a die cut window of the video brochure, and adhering the cut out portion of the insert to the video brochure in the arranged position. | 2017-10-05 |
20170290175 | Modular Deployable Display Unit And System Thereof - This invention covers a display system which includes modular deployable display units, a stand, a power source, a data input device and a display support. Each unit includes a housing, a spool assembly, a flexible electronic display member, an electrical cable and a connecting system for connecting the units to the stand and to one another, in an end to end arrangement. The assembly is mounted within the housing and includes a spool having opposite ends, to which the spool is rotatably mounted. The flexible member includes LEDs for displaying a programmable message. The flexible member has an end coupled to the spool and is displaceable between a wound configuration where the member is wound onto the spool and an unwound configuration where the member is unwound from the spool. A free end of the member is coupled to the support for displaying the message. | 2017-10-05 |
20170290176 | MONITOR DEVICE - A monitor device according to the present disclosure includes: a display section having a display surface; an operation section disposed at a bottom of the display section and having an operation surface substantially parallel to the display surface; a connecting section disposed at a lateral side of the operation section and having a connecting surface tilted downward relative to the display surface; and a surface switching section that connects the operation surface and the connecting surface to each other, and a normal of the display surface and a normal of the connecting surface form an acute angle. | 2017-10-05 |
20170290177 | FOLDABLE DISPLAY DEVICE - An embodiment of the present invention provides a foldable display device comprising a foldable housing and a flexible display screen, the flexible display screen having a first end and a second end disposed opposite to each other in a first direction, wherein the first end of the flexible display screen is secured to the foldable housing, the second end of the flexible display screen is removable relative to the foldable housing; and when the foldable display device is in a folded state, the flexible display screen is located on a side of the foldable opposite to the folded surface of the foldable housing. The present invention can solve the problem that the radius of curvature of the folded portion of the flexible display screen is too small when the display device is folded, so that the flexible display screen can be prevented from being damaged. | 2017-10-05 |
20170290178 | Control Unit Device For A Motor Vehicle And Method For Manufacturing Such A Device - A control unit device for a motor vehicle includes a circuit board, on which a plurality of electronic components are disposed. The electronic components are electrically coupled to one another by conductor tracks on the circuit board. A substantially gas-impermeable cover is materially joined or bonded to the circuit board in such a way that the cover, together with the circuit board, forms a closed cavity in which the electronic components and the associated conductor tracks are located. A method for producing the control unit device is also provided. | 2017-10-05 |
20170290179 | DEFORMABLE SURFACE APPARATUS, ELECTRONIC DEVICE, AND METHOD - An apparatus is disclosed. The apparatus may include at least two rotation shafts arranged substantially parallel to one another. The apparatus may include at least two fixing members. At least one fixing member of the at least two fixing members may be disposed at each side of the at least two rotating shafts. The apparatus may include at least two sliding members. A least one sliding member of the at least two sliding members may connect at least one rotating shaft to at least one fixing member. Each of the at least two sliding members may be disposed on opposite sides of the at least two rotating shafts. In response to the at least two rotation shafts rotating, a distance between the two or more rotating shafts and the at least two fixing members changes in a lengthwise direction. An electronic device and method are disclosed. | 2017-10-05 |
20170290180 | FLUORORESIN CABLE AND ELECTRONIC DEVICE - A fluororesin cable can include an electric wire having a central conductor covered with an insulator, an inclusion, a tape made of a resin, and a sheath made of a fluororesin. The inclusion is arranged along the electric wire. The tape is wound around an outer periphery of an aggregate of the electric wire and the inclusion. The sheath entirely covers the aggregate and the tape. Here, a material for the inclusion is harder than a fluororesin material constituting the sheath. | 2017-10-05 |
20170290181 | RAIL SEAL FOR ELECTRONIC EQUIPMENT ENCLOSURE - An electronic equipment enclosure includes a frame structure, one or more panels attached to the frame structure, at least one vertical mounting rail fastened to the frame structure, and a rail seal attached to the at least one vertical mounting rail. The rail seal includes a generally flat panel portion and a seal along an edge thereof. The seal is adapted to engage at least one of the one or more panels to provide an air dam between the one or more panels and the at least one vertical mounting rail. | 2017-10-05 |
20170290182 | SCREEN PROTECTOR FOR A MOBILE ELECTRONIC DEVICE WITH A TOUCH SCREEN - A screen protector ( | 2017-10-05 |
20170290183 | ELECTRONIC APPARATUS AND METHOD FOR ASSEMBLING THEREOF - An electronic apparatus includes a case, an integrated circuit module, a cable and a fastener component. The case includes an opening and an accommodating space for the integrated circuit module and the fastener component installed therein. The cable is passed through the opening to be electrically connected with the integrated circuit module. The fastener component is adjacent to the opening and includes a first fastening portion and a second fastening portion for fastening the conducting cable and the circuit module respectively. Thereby, the cable and the integrated circuit module will be fastened simultaneously through the fastener component, and a one-time ultrasonic welding process is applied for assembly, thus the process will be simplified as to improve the yield rate. | 2017-10-05 |
20170290184 | PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE INCLUDING THE SAME - An electronic device is provided. The electronic device includes a housing, a first printed circuit board seated inside the housing, and a second printed circuit board seated inside the housing such that a height of the second printed circuit board from the second surface is different from that of the first printed circuit board, wherein the first printed circuit board includes a mounting part on which at least one component is mounted, a first connector which extends from a first part of the mounting part. A portion of the first connector being substantially perpendicular to the mounting part and configured to be connected to the second printed circuit board, and a second connector which extends from a second part of the mounting part and configured to be connected to the second printed circuit board. | 2017-10-05 |
20170290185 | HOUSING STRUCTURE OF ELECTRONIC DEVICE - A housing structure of an electronic device according to an embodiment includes a housing and a protruding part. The housing houses a board on which an electronic part is mounted. The protruding part protrudes toward the board from an upper side of the housing positioned above the board. An inner wall of the housing has a groove that is formed around the protruding part. | 2017-10-05 |
20170290186 | HOUSING FOR ELECTRONIC SPRINKLER CONTROLLER - A housing for an electronic sprinkler controller and the electronic sprinkler controller are disclosed. The electronic sprinkler controller has a first circuit board and a terminal block electrically connected with the first circuit board. The housing includes a back cover, a first front cover attached to the back cover to cover the first circuit board, a terminal block cover, a first seal and a second seal. The first circuit board is disposed on the back cover. The first front cover has an opening to expose the terminal block. The terminal block cover is rotatable between a closed position covering the opening and the terminal block and an open position not covering the opening and the terminal block. The first seal is disposed between the back cover and the front cover, and the second seal is disposed between the front cover and the terminal block cover. | 2017-10-05 |
20170290187 | ELECTRONIC DEVICE, AND ELECTRONIC STRUCTURE PROVIDED WITH ELECTRONIC DEVICE - An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring. | 2017-10-05 |
20170290188 | MAINFRAME COMPUTER WITH SUPPORTING RACK - A mainframe computer with a supporting rack includes: a rack chassis and a supporting rack. The rack chassis has a first rack, and the first rack has a plurality of first positioning members. The supporting rack is arranged on the rack chassis, and the supporting rack has at least one first corresponding positioning member positioned corresponding to any one of at least one first positioning member. Therefore, the rack chassis and the support rack allow various types of objects (such as: solid state disk, cooling liquid tanks for cooling, hard drive or optical drive and so on) to be easily and conveniently installed onto the mainframe computer. | 2017-10-05 |
20170290189 | MAINFRAME COMPUTER WITH SUPPORTING RACK - A mainframe computer with a supporting rack includes: a rack chassis and a supporting rack. The rack chassis has a first rack, and the first rack has a plurality of first positioning members. The supporting rack is arranged on the rack chassis, and the supporting rack has at least one first corresponding positioning member positioned corresponding to any one of at least one first positioning member. Therefore, the rack chassis and the support rack allow various types of objects (such as: solid state disk, cooling liquid tanks for cooling, hard drive or optical drive and so on) to be easily and conveniently installed onto the mainframe computer. | 2017-10-05 |
20170290190 | SYSTEM FOR ELECTRICAL CONNECTION OF PRINTED CIRCUIT BOARDS AND BACKPLANES IN SERVER ENCLOSURE - Utilities (e.g., apparatuses, systems, methods, etc.) for reducing or eliminating gaps between the tips of male pins and the bottoms of corresponding female sockets of interfaced connectors (e.g., daughtercard and backplane connectors) of a computing module and a backplane of a server enclosure under a variety of differing mechanical tolerances in the lengths of the server enclosure and the computing module (e.g., along a dimension that is parallel to the longitudinal axes of the male pins and female sockets). The disclosed utilities allow for increased signal quality and data rates through interfaced connectors while reducing strain on the PCB, solder joints, and the like during the interfacing of the connectors. | 2017-10-05 |
20170290191 | SERVER SYSTEM - A system includes a rack and one or more server systems mounted in the rack. A server system includes at least one sever node and each server node includes an array of devices including mass storage devices and at least one server device. Segments of the array of devices of a particular server node are mounted in sub-node chassis that include intra node connectors. Multiple sub-node chassis that each include devices such as mass storage devices or server devices of the sever node couple together via the intra node connectors when installed in a server system chassis to form a server node. Each server node of a server system may be a separate logical node. Also, the sub-node chassis of a server node may be configured for vertical airflow through the sub-node chassis in addition to cross airflow. | 2017-10-05 |
20170290192 | ADJUSTABLE CABLE MANAGEMENT FOR FIBER AND CABLE - In one embodiment, an adjustable cable management system is disclosed. The system includes a tray base having a first end. The system also includes a tray door coupled to the tray base and substantially opposite the first end of the tray base when in a closed position. The system further includes a plurality of cable guides coupled to the first end of the tray base and located between the first end of the tray base and the tray door. A particular cable guide is coupled to the first end of the tray base at a selected angle from among a plurality of selectable angles. | 2017-10-05 |
20170290193 | INTEGRATION CELL FOR SEISMIC ELECTRONIC EQUIPMENT RACK - Described herein is an integration cell that can be pre-installed with plural electronic equipment units at a location remote from a datacenter. One or more pre-installed integration cells can be shipped on a single standard shipping palette to the datacenter location and moved into the datacenter through standard doorways and using standard elevators. Inside the datacenter, the integration cell can be inserted into a seismic electronic equipment storage rack to allow for bulk installation or removal of plural electronic equipment units. | 2017-10-05 |
20170290194 | THERMAL MODULATION OF AN ELECTRONIC DEVICE - An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit. | 2017-10-05 |
20170290195 | WIRING DEVICE WITH HEAT REMOVAL SYSTEM - A wiring device includes a housing that encloses a line voltage port and/or a low voltage port for providing power to at least one removable load. The housing has an intake opening and an exhaust opening for drawing cooling air into the housing and for exhausting heated air. A fan is disposed within the housing and operates to move the air through the housing. A thermal load such as a heat sink or a transformer is positioned within the housing and receives cooling air to reduce the temperature of the load. The fan is energized when a sensed temperature in the housing exceeds a first predetermined threshold. Power to the line and/or low voltage port is reduced or shut off if the sensed temperature in the housing exceeds a predetermined value that is greater than the first predetermined threshold. | 2017-10-05 |
20170290196 | FLOW PLATE - A system includes a cabinet having a first wall, a second wall opposite the first wall, and a back wall extending from the first wall to the second wall. The system also includes a flow plate disposed at least partially within the cabinet and partitioning the inner space into a first portion and a second portion. The system also includes a shelf disposed at least partially within the first portion of the inner space, and a flow device fluidly connected to the cabinet. The flow device is configured to remove air from the first portion of the inner space, and the flow plate is configured to substantially prohibit removal of air by the flow device from the second portion, via the first portion, when the cabinet is in a closed condition. | 2017-10-05 |
20170290197 | ELECTRONIC PRODUCT - An electronic product, including: a housing, where an air vent is disposed on the housing; a PCB board that is located inside the housing, where a positive electrode and a negative electrode of a power supply are disposed on the PCB board; a fan that is located between the PCB board and the housing; and a switch bar that is located between the fan and the housing and is connected to the housing in a sliding manner, where the switch bar has a first state and a second state, where the switch bar includes a conductive area, when the switch bar is set to the first state, the conductive area is electrically connected to the positive electrode and the negative electrode of the power supply on the PCB board, the fan starts to run. | 2017-10-05 |
20170290198 | IMMERSION COOLING SYSTEMS AND METHODS - An immersion cooled electronic arrangement includes a sealed housing, a coolant contained within the housing, and an electronic device submerged within the coolant. An agitator is disposed within the housing to control passive heat transfer between the electronic device and the coolant. An immersion cooling system and related method are also described. | 2017-10-05 |
20170290199 | HEAT SINK - A heat sink includes a bottom surface, a top surface, plural first fins and plural second fins. The plural first fins and the plural second fins are alternately and separately arranged between the top surface and the bottom surface along a specified axis direction. Moreover, plural airflow channels are defined by the plural first fins, the plural second fins, the top surface and the bottom surface collaboratively. The first fin has a first non-overlapped zone and a second non-overlapped zone with respect to a projection area of the second fin along the specified axis direction. The first non-overlapped zone is located at an airflow inlet. In the first non-overlapped zone, the lower portion is wider than the upper portion. The second non-overlapped zone is located at an airflow outlet. In the second non-overlapped zone, the upper portion is wider than the lower portion. | 2017-10-05 |
20170290200 | ASSISTANCE APPARATUS, ASSISTANCE METHOD, AND PROGRAM - An assistance apparatus according to the disclosure generates monitor area data on the basis of dimension data of rack rows that are each constituted by a plurality of racks and that are arranged in a first direction in a three-dimensional space, the dimension data including the length of each rack row in the first direction and the height thereof in a second direction perpendicular to the first direction, interval data that includes an interval, in a third direction, between the rack rows adjacent to each other in the third direction, the third direction being perpendicular to the first and second directions, field-of-view angle data that includes the field-of-view angle of each temperature sensor, and temperature sensor position data that indicates certain temperature sensor positions; and includes a display control unit that displays monitor coverage information on a display device on the basis of the monitor area data. | 2017-10-05 |
20170290201 | COMPUTER ROOM, DATA CENTER, AND DATA CENTER SYSTEM - A data center system includes an infrastructure unit including a public area and a bridge area and at least one computer room. The computer room is disposed along an extending direction of the bridge area, and a length of the bridge area is matched with a length of computer rooms arranged along the bridge area, so that a number of computer rooms may be increased according to the needs. The computer room includes a plurality of layers of data centers stacked on each other. Cold passage areas and hot passage areas of two neighboring layers of data centers form a cold air passage and a hot air passage so that cold air produced by a cooling module may be directed to each data center, and hot air in each data center may be directed to the cooling module to enable devices in each data center to operate under appropriate temperature. | 2017-10-05 |
20170290202 | MULTIPLE SERVER ARCHITECTURE, SERVER MODULE, AND COOLER MODULE SYSTEMS AND ARCHITECTURE - Embodiments of multiple server architecture with server modules and cooler modules wherein the server modules may be slide from the server architecture back to front to enable servers to be seated or removed transversely from a server module relative to server architecture front. Other embodiments may be described and claimed. | 2017-10-05 |
20170290203 | EVAPORATION HEAT EXCHANGE DEVICE FOR AIR COOLING FOR CONDITIONING AND CLIMATE CONTROL SYSTEMS FOR SERVER ROOMS AND THE LIKE - A heat exchange device for air cooling for conditioning and climate control systems for server rooms and the like, which comprises:
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20170290204 | ENERGY SOURCE ENCLOSURE SYSTEMS AND METHODS WITH THROUGH-AIR THERMAL MANAGEMENT - Provided are systems and methods for enclosing an energy source of a material handling vehicle. The systems and methods include an enclosure having a front wall, a rear wall, and an interior compartment, an inlet channel integrally formed with the front wall and in fluid communication with the interior compartment, the air inlet channel defined by an inlet louver and an inlet flange, an outlet channel integrally formed with the rear wall and in fluid communication with the interior compartment, the air outlet channel defined by an outlet louver and an outlet flange, one or more energy source cells positioned within the interior compartment; and a cooling fan in fluid communication with the inlet channel and the interior compartment. The cooling fan operates to draw air through the inlet channel to the interior compartment such that air within the interior compartment is expelled out of the outlet channel. | 2017-10-05 |
20170290205 | IMMERSION COOLING SYSTEMS AND METHODS - An electronics cooling arrangement includes a housing, an electronic device disposed within the housing, and a solid-liquid phase change material disposed within the housing and is in thermal communication with the electronic device to absorb heat generated by the electronic device. A method of cooling an electronic device and a vehicular electronics cooling system are also described. | 2017-10-05 |
20170290206 | ELECTRONIC DEVICE - An electronic device including an electronic module, a casing, and at least one air port is provided. The casing accommodates the electronic module. The air port is disposed on the casing to communicate the inside of the box to the outside. The air port includes an inclined blocking element. The inclined blocking element has a plurality of inclined openings, and the inclined openings are inclined relative to a horizontal direction. | 2017-10-05 |
20170290207 | Component Shielding Structures With Magnetic Shielding - Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures. | 2017-10-05 |
20170290208 | SHIELDING STRUCTURE OF ELECTRO CONTROL UNIT - Disclosed herein is an electronic control unit (ECU). The ECU according to one aspect of the present disclosure includes a housing in which a printed circuit board (PCB), on which electronic devices configured to control electrically operated components are mounted, is installed, and a cover installed to block one side of the housing, wherein a slot having both ends disconnected to each other is formed around one electronic device among the electronic devices mounted on the PCB, and a part of a shield member is provided to pass through the slot and to surround the electronic device. | 2017-10-05 |
20170290209 | SYSTEMS AND METHODS FOR THERMAL MANAGEMENT FOR HIGH POWER DENSITY EMI SHIELDED ELECTRONIC DEVICES - Systems and methods for thermal management for high power density EMI shielded electronic devices. In one embodiment, an electronic module comprises: a circuit board; at least one integrated circuit mounted to the circuit board; at least one electro-magnetic interference (EMI) shield fence mounted to the circuit board, wherein the at least one integrated circuit is mounted within a perimeter defined by the EMI shield fence; a heatsink EMI shield lid secured onto the at least one EMI shield fence, wherein the heatsink EMI shield lid seals the at least one integrated circuit within the at least one EMI shield fence; wherein the heatsink EMI shield lid comprises a spring loaded thermal interface in conductive thermal contact with the at least one integrated circuit. | 2017-10-05 |
20170290210 | DISPLAY DEVICE - A display device includes a TFT substrate including an overlap portion overlapping the color filter substrate and a non-overlap portion which does not overlap the color filter substrate; a color filter substrate; a source driver; and a height adjusting body. A color filter surface of the color filter substrate is opposite a surface facing a first major surface of the TFT substrate at a first distance. The source driver is disposed on the non-overlap portion and has a source driver surface that is opposite a surface facing the first major surface and disposed a second distance from the first major surface, which is less than the first distance. The height adjusting body is disposed on the non-overlap portion and has a height adjusting body surface opposite a surface facing the first major surface disposed a third distance from the first major surface, which is greater than the second distance. | 2017-10-05 |
20170290211 | BATCH COMPONENT PLACEMENT TEMPLATE - Templates to arrange and/or align components for batch placement on a substrate are described. A batch placement template can include a number of detents physically arranged relative to each other corresponding to a physical arrangement of components to be placed on a substrate. The detents can be sized to allow components to be manipulated into the detents and subsequently picked and placed on the substrate in a batch process. | 2017-10-05 |
20170290212 | FLEXIBLE LIGHT EMITTING SEMICONDUCTOR DEVICE - A flexible polymeric dielectric layer has first and second major surfaces. The first major surface has a conductive layer thereon. The dielectric layer has at least one cavity extending from the second major surface toward the first major surface. The conductive layer includes electrically separated first and second portions configured to support and electrically connect a light emitting semiconductor device to the conductive layer. | 2017-10-05 |
20170290213 | SOLAR CELL MODULES WITH IMPROVED BACKSHEET - Disclosed is a polyamide-ionomer composition suitable for use in a backsheet in a photovoltaic module comprising a polymer component a polyamide and an anhydride ionomer comprising a copolymer of ethylene, an alpha, beta-unsaturated C | 2017-10-05 |
20170290214 | AERODYNAMICALLY EFFICIENT LIGHTWEIGHT VERTICAL TAKE-OFF AND LANDING AIRCRAFT WITH MULTI-CONFIGURATION WING TIP MOUNTED ROTORS - An aerial vehicle adapted for vertical takeoff and landing using a set of wing tip mounted thrust producing elements for takeoff and landing. An aerial vehicle which is adapted to vertical takeoff with the wings in a horizontal flight attitude then transitions to a horizontal flight path. An aerial vehicle which uses different configurations of its wing tip mounted, VTOL enabling rotors to reduce drag in all flight modes. | 2017-10-05 |
20170290215 | Electronic Assemblies without Solder and Methods for their manufacture | 2017-10-05 |
20170290216 | CONNECTOR FOR TRANSFERRING FLUID AND METHOD OF USE - A connector for transferring fluid and method therefor. The connector may have a first port and a second port which may be coupled together at a main channel with a valve element therein controlling fluid flow through the first port. The first port joins the main channel to provide a fluid path around the valve element and through the second port. | 2017-10-05 |
20170290217 | ADHESIVE COMPOSITION, ADHESIVE SHEET, AND BACK GRINDING METHOD FOR SEMICONDUCTOR WAFER - The present invention relates to a pressure-sensitive adhesive composition including a polymer of a monomer mixture containing isobornyl (meth)acrylate, a pressure-sensitive adhesive sheet, and a semiconductor wafer backgrinding method. In the present invention, by using isobornyl (meth)acrylate which is a hard-type monomer and has a low hydrophilic property, a pressure-sensitive adhesive composition having superior releasing and re-releasing properties and wettability with respect to the wafer, and having an excellent wafer-proofing property; a pressure-sensitive adhesive sheet prepared by using the pressure-sensitive adhesive composition; and a backgrinding method using the pressure-sensitive adhesive sheet can be provided. | 2017-10-05 |
20170290218 | Hybrid tea rose plant named 'KORvuebell' - ‘KORvuebell’ is a new and distinct variety of | 2017-10-05 |
20170290219 | Peach tree named 'Burpeachthirtyeight' - A new and distinct variety of peach tree ( | 2017-10-05 |
20170290220 | Red Raspberry Plant Named 'KOKANEE' - A new and distinct red raspberry cultivar distinguished by its moderate to high yields of large, bright-red-colored, firm, conic, sweet, flavorful fruit with excellent fresh fruit quality borne on primocanes in late summer | 2017-10-05 |
20170290221 | Magnolia plant named 'NCMX1' - ‘NCMX1’ is a new cultivar of | 2017-10-05 |
20170290222 | Hydrangea plant named 'HMUPSI' - A new and distinct | 2017-10-05 |
20170290223 | Hydrangea plant named 'BCHY-11.068' - A new and distinct cultivar of | 2017-10-05 |
20170290224 | Hydrangea plant named 'BCHY-11.028' - A new and distinct cultivar of | 2017-10-05 |
20170290225 | Stevia plant named 'SW 227' - A new and distinct | 2017-10-05 |
20170290226 | Artichoke plant named 'SJ 857' - A new cultivar of artichoke named ‘SJ 857’ that is the most vigorous and productive yielding variety of all French Lyon type | 2017-10-05 |
20170290227 | ISOTOMA PLANT NAMED 'TMLU 1301' - A new and distinct cultivar of | 2017-10-05 |
20170290228 | Dianthus plant named 'KLEDP15179' | 2017-10-05 |
20170290229 | Verbena plant named 'KLEVP15622' | 2017-10-05 |
20170290230 | Verbena plant named 'KLEVP15481' | 2017-10-05 |
20170290231 | New Guinea Impatiens Plant Named 'SAKIMP042' | 2017-10-05 |
20170290232 | New Guinea Impatiens Plant Named 'SAKIMP040' | 2017-10-05 |
20170290233 | New Guinea Impatiens Plant Named 'SAKIMP038' | 2017-10-05 |